Abstract

The present disclosure provides a cationically polymerizable composition having a high degree of flame retardancy in the cured state. The cationically polymerizable composition is liquid at room temperature and includes: (A) at least one cationically polymerizable component in a proportion of 15 to 80% by weight; (B) at least one initiator for cationic polymerization; (C) at least one flame retardant, with the flame retardant comprising at least 10% by weight of an organophosphinate, based on the total weight of the composition; and (D) 0 to 60% by weight of a filler, wherein the solids content from components (C) and (D) is at most 70% by weight, each based on the total weight of the composition.

IPC Classes  ?

• C08G 59/22 - Di-epoxy compounds
• C08G 59/24 - Di-epoxy compounds carbocyclic
• C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
• C08K 5/523 - Esters of phosphoric acids, e.g. of H3PO4 with hydroxyaryl compounds
• C08K 5/5313 - Phosphinic compounds, e.g. R2=P(:O)OR'
• C09D 7/63 - Additives non-macromolecular organic
• C09D 163/00 - Coating compositions based on epoxy resinsCoating compositions based on derivatives of epoxy resins
• C09J 5/06 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
• C09J 11/06 - Non-macromolecular additives organic
• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins

Abstract

A device (10) for preactivating and dosing an actinically curable compound, in particular a polymerizable compound, is specified, comprising a dosing unit (12) for adjusting a volume flow of the curable compound, a channel (14) for guiding the curable compound to an outlet nozzle (16), and an irradiation unit (22) which emits actinic radiation for preactivating the actinically curable compound, wherein the channel (14) is radiotransparent to the actinic radiation of the irradiation unit (22) at least in a window section (15), wherein the irradiation unit (22) is assigned to the radiotransparent window section (15) of the channel (14), and wherein the device (10) has a sleeve (20) which is also at least partially made of a radiotransparent material to the actinic radiation and surrounds the channel (14) at least in the area to which the irradiation unit (22) is assigned, and wherein the device (10) has a thermally conductive holder (18) in which the channel (14) and the sleeve (20) are held, wherein the thermally conductive holder (18) circumferentially surrounds the channel (14) and the sleeve (20) and has at least one radiotransparent window (38) which is assigned to the irradiation unit (22). Furthermore, a use of the device (10) with a curable compound is specified.

IPC Classes  ?

• B01J 4/02 - Feed devicesFeed or outlet control devices for feeding measured quantities of reagents
• B01J 4/00 - Feed devicesFeed or outlet control devices
• B01J 19/12 - Processes employing the direct application of electric or wave energy, or particle radiationApparatus therefor employing electromagnetic waves

Abstract

A luminaire assembly includes a first electronic assembly on which at least one light-emitting unit and an electrical contact point are arranged. A cooling element is in contact with the first electronic assembly by an intermaterial bond and/or in a positive manner. The luminaire assembly further includes at least one second electronic assembly having an electrical contacting, wherein an electrical connection is provided between the electrical contact point of the first electronic assembly and the electrical contacting of the second electronic assembly for actuating the at least one light-emitting unit. The electrical contacting is arranged on an end face of the second electronic assembly, wherein the surface of the end face and a radiating face of the at least one light-emitting unit of the first electronic assembly-enclose an angle (β) from 90° to 270°. Furthermore, a method of manufacturing a luminaire assembly is disclosed.

IPC Classes  ?

• F21V 23/00 - Arrangement of electric circuit elements in or on lighting devices
• F21V 29/56 - Cooling arrangements using liquid coolants
• F21V 29/60 - Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
• F21V 29/76 - Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
• F21Y 105/16 - Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the overall shape of the two-dimensional array square or rectangular, e.g. for light panels

Abstract

Example embodiments relate to a thermosetting composition, wherein the composition comprises the following components: (A) at least one radically curable compound, with the radically curable compound comprising at least one (meth)acrylate, (B) at least one radical initiator based on a peroxo compound, with the peroxo compound comprising at least one peroxodicarbonate, (C) at least one stabilizer comprising at least one sterically hindered phenol, and (D) at least one synergist based on a carbon modification having unsaturated carbon-carbon bonds.

IPC Classes  ?

• C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
• C08K 3/04 - Carbon
• C08K 5/13 - PhenolsPhenolates
• C08L 33/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
• C08L 67/06 - Unsaturated polyesters
• C08L 75/14 - Polyurethanes having carbon-to-carbon unsaturated bonds
• C09D 4/06 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups
• C09D 7/61 - Additives non-macromolecular inorganic
• C09D 7/63 - Additives non-macromolecular organic
• C09D 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
• C09D 167/06 - Unsaturated polyesters having carbon-to-carbon unsaturation
• C09D 175/14 - Polyurethanes having carbon-to-carbon unsaturated bonds
• C09J 4/06 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups
• C09J 5/06 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
• C09J 11/04 - Non-macromolecular additives inorganic
• C09J 11/06 - Non-macromolecular additives organic
• C09J 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
• C09J 167/06 - Unsaturated polyesters having carbon-to-carbon unsaturation
• C09J 175/14 - Polyurethanes having carbon-to-carbon unsaturated bonds

Abstract

The invention relates to a curable composition comprising at least one curable resin component and at least one curing agent and/or one initiator for the polymerization of the curable resin compound. Moreover, the composition comprises at least one non-linear polyacetal-bridged resin component having a large number of acetal functions and functional groups of resin component (A).

IPC Classes  ?

• C08G 59/24 - Di-epoxy compounds carbocyclic
• B29C 64/40 - Structures for supporting 3D objects during manufacture and intended to be sacrificed after completion thereof
• B33Y 10/00 - Processes of additive manufacturing
• B33Y 70/00 - Materials specially adapted for additive manufacturing
• C08F 220/06 - Acrylic acidMethacrylic acidMetal salts or ammonium salts thereof
• C08F 220/28 - Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
• C08F 220/54 - Amides
• C08G 2/30 - Chemical modification by after-treatment
• C08G 59/42 - Polycarboxylic acidsAnhydrides, halides, or low-molecular-weight esters thereof
• C08G 59/50 - Amines
• C08G 65/18 - Oxetanes
• C09J 5/06 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
• C09J 5/08 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers using foamed adhesives

Abstract

The invention relates to isocyanate-based, storage-stable, one-part compositions that are fixable by irradiation with actinic radiation and curable by heat. The composition comprises (A) an at least bifunctional, solid isocyanate having a passivated surface and a melting point of at least 40° C.; (B) an isocyanate-reactive component selected from the group of alcohols, amines and thiols, and mixtures thereof; (C) a radiation-curable compound; and (D) a photoinitiator. Optionally, further additives (E) can be contained in the composition according to the present invention. The compositions, by fixation with actinic radiation, can be transferred into a state that ensures dimensional stability of the compositions during heat curing.

IPC Classes  ?

• C08G 18/69 - Polymers of conjugated dienes
• C08G 18/24 - Catalysts containing metal compounds of tin
• C08G 18/48 - Polyethers
• C08G 18/50 - Polyethers having hetero atoms other than oxygen
• C08G 18/62 - Polymers of compounds having carbon-to-carbon double bonds
• C08G 18/79 - Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates
• C08G 18/80 - Masked polyisocyanates
• C09D 4/00 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
• C09J 4/00 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
• C09J 5/06 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive

Abstract

2 in the composition that is sufficient to activate the second photoinitiator and fix the composition. Furthermore, a method is described for the joining, casting, molding, sealing and/or coating of substrates using the cationically curable composition.

IPC Classes  ?

• C08G 59/24 - Di-epoxy compounds carbocyclic
• B29C 35/08 - Heating or curing, e.g. crosslinking or vulcanising by wave energy or particle radiation
• B32B 38/00 - Ancillary operations in connection with laminating processes
• C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
• C08G 59/62 - Alcohols or phenols
• C09D 4/00 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
• C09D 163/00 - Coating compositions based on epoxy resinsCoating compositions based on derivatives of epoxy resins
• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
• C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers

Abstract

A composition that can be activated by irradiation and cured by moisture comprises (A) one or more moisture-curable compounds from the group of alkoxy silanes, (B) at least one acid generator releasing an acid when exposed to actinic radiation, and (C) at least one carbonyl compound and/or carbonyl derivative selected from the group of aldehydes, ketones, hemiacetals and hemiketals. Moreover, the compositions according to the present invention can additionally contain an alcohol and/or thiol (D), a catalyst for moisture-curing (E), a radiation-curable compound (F), a photoinitiator for radical polymerization (G), and further additives (H). After activation of the acid generator the composition cures even in high layer thicknesses independently of the ingress of external moisture. Furthermore, a method for the bonding, molding, sealing and coating of substrates using the composition is described.

IPC Classes  ?

• C08F 2/46 - Polymerisation initiated by wave energy or particle radiation
• C08F 2/50 - Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
• C08G 61/04 - Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
• C08G 65/336 - Polymers modified by chemical after-treatment with organic compounds containing silicon
• C08G 77/08 - Preparatory processes characterised by the catalysts used
• C08G 77/18 - Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
• C08K 5/053 - Polyhydroxylic alcohols
• C08K 5/07 - AldehydesKetones
• C08K 5/09 - Carboxylic acidsMetal salts thereofAnhydrides thereof
• C08K 5/5397 - Phosphine oxides
• C09J 183/06 - Polysiloxanes containing silicon bound to oxygen-containing groups

Abstract

The invention relates to a curable two- or multi-part composition with (a) optionally an at least bifunctional epoxy-containing compound; (b) an at least bifunctional nitrogen-based curing agent suitable for epoxy curing; (c) a radiation-curable hybrid compound having both one or more radiation-curable methacrylate groups and one or more epoxy groups; (d) a radical photoinitiator; (e) optionally an accelerator for epoxy curing, and (f) optionally further additives. In addition, the invention relates to a method for the bonding, casting, molding or coating of substrates using the composition.

IPC Classes  ?

• C08F 290/06 - Polymers provided for in subclass
• C08F 2/50 - Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
• C08G 18/58 - Epoxy resins
• C08G 18/81 - Unsaturated isocyanates or isothiocyanates
• C08G 59/24 - Di-epoxy compounds carbocyclic
• C08G 59/50 - Amines
• C09J 151/08 - Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsAdhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
• C08G 18/00 - Polymeric products of isocyanates or isothiocyanates

Abstract

The invention relates to a composition that is liquid at room temperature, can be fixed by radiation and cured by heat, comprising the following components: (A) an at least bifunctional epoxy-containing compound; (B) an at least bifunctional thiol; (C) a radiation-curable compound; (D) a photoinitiator; (E) a stabilizer blend that contains at least one sulfonyl isocyanate and at least one acid; and (F) a nitrogen compound as an accelerator. The compositions are processable at room temperature over a period of at least 24 h and can be completely cured even at low temperatures.

IPC Classes  ?

• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
• C09D 163/00 - Coating compositions based on epoxy resinsCoating compositions based on derivatives of epoxy resins
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08G 59/66 - Mercaptans
• C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
• C09D 7/61 - Additives non-macromolecular inorganic
• C09D 7/63 - Additives non-macromolecular organic
• C08G 59/18 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
• C08G 59/24 - Di-epoxy compounds carbocyclic
• C08K 3/36 - Silica
• C08K 5/13 - PhenolsPhenolates
• C08K 5/43 - Compounds containing sulfur bound to nitrogen
• C08K 13/02 - Organic and inorganic ingredients
• C09J 11/04 - Non-macromolecular additives inorganic
• C09J 11/06 - Non-macromolecular additives organic
• C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers
• C08F 222/10 - Esters

Abstract

A composition curing upon exposure to moisture comprises (A) one or more at least bifunctional silane compounds with at least two alkoxysilane groups, (B) at least one monofunctional silane compound with only one alkoxysilane group, and/or a partially condensed or bridged derivative thereof, and (C) at least one acid generator which, upon exposure to actinic radiation or heat, releases an acid. In addition, further additives (D) may be contained in the compositions according to the present invention. The composition is liquid at room temperature and, apart from the latent acid generator, does not contain any further catalysts for moisture-curing of alkoxysilanes. After activation of the acid generator the composition cures in the presence of moisture, while remaining liquid at room temperature in the presence of humidity over a period of at least 24 hours prior to activation of the acid generator. Furthermore, a method of joining or casting structural elements using the composition is described.

IPC Classes  ?

• C09J 183/06 - Polysiloxanes containing silicon bound to oxygen-containing groups
• C09D 183/12 - Block or graft copolymers containing polysiloxane sequences containing polyether sequences
• C09J 183/12 - Block or graft copolymers containing polysiloxane sequences containing polyether sequences
• C08G 77/06 - Preparatory processes
• C08G 77/18 - Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
• C09D 183/06 - Polysiloxanes containing silicon bound to oxygen-containing groups
• C09J 5/06 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
• C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers
• C08G 77/46 - Block- or graft-polymers containing polysiloxane sequences containing polyether sequences
• C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon

Abstract

The invention relates to a dual-curing solvent-free single-component mass for the bonding, molding, sealing and coating of substrates, in particular of electronic components. The mass comprises an at least bifunctional epoxy-containing compound; a hybrid compound carrying at least one isocyanate group and, at the same time, at least one radically polymerizable group; a latent curing agent based on nitrogen compounds suitable for crosslinking the epoxy-containing compound by addition reaction; a photoinitiator capable of forming radicals when irradiated with light, and optionally other additives. The mass is characterized in that it is surface dry after light curing by means of radical photopolymerization.

IPC Classes  ?

• C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
• C08G 59/18 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
• C08G 59/50 - Amines
• C08G 18/58 - Epoxy resins
• C09D 163/00 - Coating compositions based on epoxy resinsCoating compositions based on derivatives of epoxy resins
• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08G 18/78 - Nitrogen
• C08G 18/81 - Unsaturated isocyanates or isothiocyanates
• C08G 18/00 - Polymeric products of isocyanates or isothiocyanates
• C09D 175/14 - Polyurethanes having carbon-to-carbon unsaturated bonds
• C09J 175/14 - Polyurethanes having carbon-to-carbon unsaturated bonds
• C08G 59/14 - Polycondensates modified by chemical after-treatment

Abstract

The invention relates to combined radiation- and moisture-curing compounds, which are characterized in particular by rapid curing by means of moisture. The compounds can be used as adhesives, coatings or potting materials. The use of the compounds according to the invention is particularly preferred for filling electro-optical components.

IPC Classes  ?

• C09J 175/16 - Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
• C08L 101/10 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups containing hydrolysable silane groups

Abstract

A container for flowable substances includes a rigid, concave lower part having an outlet and an upper part including of a convex flexible film that is mirror-inverted with respect to the inner contour of the lower part. The upper and lower parts may be in the shape of hemispheres. The upper part is surrounded by a housing body which is tightly connected with the lower part and may be connected to a pressure source for emptying the container. In the emptied condition of the container, the film lies flush at the inner contour of the lower part of the container. For emptying, air pressure is applied to the upper part of the container. The outlet is provided with a closure in the shape of a disc which is rotatable about an axis offset from the opening of the outlet and has a passage for inserting a dispensing nipple.

IPC Classes  ?

• G01F 11/00 - Apparatus requiring external operation adapted at each repeated and identical operation to measure and separate a predetermined volume of fluid or fluent solid material from a supply or container, without regard to weight, and to deliver it
• B65D 47/26 - Closures with discharging devices other than pumps comprising hand-operated members for controlling discharge with slide valves, e.g. formed with slidable spouts
• B65D 83/00 - Containers or packages with special means for dispensing contents
• G01F 23/26 - Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of capacity or inductance of capacitors or inductors arising from the presence of liquid or fluent solid material in the electric or electromagnetic fields
• A61M 39/22 - Valves or arrangement of valves

Abstract

with the sum of all parts by weight being 100, and its use for bonding, casting, sealing and coating of substrates, in particular electronic parts. The composition is cured at 120° C. to 150° C. within seconds.

IPC Classes  ?

• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
• B05D 3/02 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
• C08G 18/08 - Processes

Goods & Services

Adhesives for use as bonding, sealing and potting materials in the electronics, communications, glassware, optics, furniture, medical apparatus, appliance and light engineering industries

Goods & Services

Adhesives for use as bonding, sealing and potting materials in the electronics, communications, glassware, optics, furniture, medical apparatus, appliance and light engineering industries