The present utility model discloses an apparatus for supplying a precursor medium. The apparatus comprises a liquid replenishing bottle. The interior of the liquid replenishing bottle is provided with a first liquid cavity. The top of the liquid replenishing bottle is penetratingly provided with a first pressurizing tube and a first liquid discharge tube. A first valve is connected to the first pressurizing tube, and a second valve and a pneumatic three-way reversing valve are sequentially connected to the first liquid discharge tube. A first end of the pneumatic three-way reversing valve is connected to the first liquid discharge tube, a second end perpendicular to the first end is connected to a second pressurizing tube, and a third end opposite to the second end is connected to a connecting tube that is connected to a stock solution bottle. The top of the stock solution bottle is penetratingly provided with an air discharge tube. A third valve is connected to the air discharge tube. A liquid level sensor is provided inside the stock solution bottle. The stock solution bottle further comprises a controller. All the valves and the liquid level sensor are connected to the controller. The volume of the liquid replenishing bottle is greater than the volume of the stock solution bottle. In the present utility model, by means of automatic redistribution by the liquid replenishing bottle, multiple replacements of the stock solution bottle by a maintenance person are reduced to a single replacement of the liquid replenishing bottle, thereby greatly improving working efficiency.
Provided in the present invention are a conveying system and method for cleaning of both edge-polished and double-side-polished wafers. A wafer unloading subsystem comprises a double-side-polished wafer unloading device and an edge-polished wafer loading and pushing device; a tank cleaning subsystem comprises a second manipulator and a wafer cleaning tank; a double-side-polished wafer transfer subsystem is configured to transfer a first container box containing a double-side-polished wafer to the double-side-polished wafer unloading device, the double-side-polished wafer unloading device is configured to push out the double-side-polished wafer in the first container box, and the second manipulator is configured to grip the double-side-polished wafer pushed out by the double-side-polished wafer unloading device and transfer same to a cleaning tank area; an edge-polished wafer transfer subsystem is configured to take out an edge-polished wafer from a second container box and position same at a first designated position, the edge-polished wafer loading and pushing device is configured to load the edge-polished wafer from the first designated position and return to a first standby position, and the second manipulator is configured to grip the edge-polished wafer from the edge-polished wafer loading and pushing device at the first standby position and transfer same to the cleaning tank area. The shared apparatus for a wet-in process of double-side-polished wafer cleaning and for a dry-in process of edge-polished wafer cleaning can reduce production costs.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
The present invention relates to a wafer flipping loading and unloading device, comprising two wafer clamping and flipping mechanisms respectively used for loading and unloading. Each wafer clamping and flipping mechanism comprises: a flipping frame; a driving unit used for driving the flipping frame to flip upside down by 180 degrees; two wafer supporting units disposed on the flipping frame; a wafer clamping unit disposed on the flipping frame; and a lifting driving module used for aligning a first supporting surface with a clamping opening before flipping or aligning a second supporting surface with the clamping opening after flipping. The device can flip each of a wafer to be cleaned and a cleaned wafer, thereby meeting the requirements of a wafer backside cleaning process.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
A chemical delivery system, comprising a liquid inlet pipe, a liquid discharge pipe, a first gas inlet pipe, a first gas discharge pipe, a second gas inlet pipe, a second gas discharge pipe, and a chemical delivery pump. The chemical delivery pump comprises a chamber and a sealing cover covering the opening of the chamber; two independent cavities are provided inside the chamber; each cavity is further divided into a gas cavity and a liquid cavity; the gas cavity and the liquid cavity are communicated with each other at the top; a liquid inlet pipe, a liquid discharge pipe, and two gas pipes are provided on the sealing cover; the lower ends of the gas pipes are respectively communicated with the two gas cavities, and the upper ends of the two gas pipes each are split into a gas inlet and a gas outlet; the liquid inlet pipe is provided with two branch liquid inlet pipes respectively inserted into the two liquid cavities; and the liquid discharge pipe is provided with two branch liquid discharge pipes respectively inserted into the two liquid cavities. A pump device used by the chemical delivery system does not contain a wear-prone component, and has a long service life. Moreover, the system has the advantage of smooth chemical delivery, thereby preventing water hammer.
F04F 1/14 - Pumps using positively or negatively pressurised fluid medium acting directly on the liquid to be pumped the fluid medium acting on the surface of the liquid to be pumped adapted to pump specific liquids, e.g. corrosive or hot liquids
F04F 1/10 - Pumps using positively or negatively pressurised fluid medium acting directly on the liquid to be pumped the fluid medium acting on the surface of the liquid to be pumped of multiple type, e.g. with two or more units in parallel
F04F 1/02 - Pumps using positively or negatively pressurised fluid medium acting directly on the liquid to be pumped using both positively and negatively pressurised fluid medium, e.g. alternating
The present invention provides a self-starting bellows pump, comprising: a first reversing assembly, a second reversing assembly, a third reversing assembly, and a bellows pump reversing assembly. According to the self-starting bellows pump of the present invention, the entire pump drive relies on compressed air to provide power, and no electric drive is required. The start and stop of the pump are jointly controlled by the opening or closing of a valve at a liquid receiving end in a delivery pipe and the pressure of a driving air source, without the need for a complex superordinate control system, thereby reducing control costs. Additionally, the unique structure simplifies the control structure of the entire liquid supply system, reduces the failure rate, and improves the reliability of the liquid supply system.
F04B 49/00 - Control of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for in, or of interest apart from, groups
F04B 49/03 - Stopping, starting, unloading or idling control by means of valves
7.
CLAMPING AND OVERTURNING DEVICE AND METHOD FOR REDUCING WAFER TRANSMISSION CONTAMINATION
The present invention relates to the technical field of wafer transmission, and in particular to a clamping and overturning device and method for reducing wafer transmission contamination. The device comprises: a plurality of wafer clamping teeth, which are arranged on the opposite surfaces of two left-right symmetrical clamping tooth fixing plates, and include first wafer clamping teeth used for clamping a wafer before cleaning and second wafer clamping teeth used for clamping a cleaned wafer; a clamping device, which is connected to the clamping tooth fixing plates and is used for driving the wafer clamping teeth to move close to or away from each other in an axis direction of a rotating shaft; and an overturning device, which is connected to the clamping tooth fixing plates and is used for driving the wafer clamping teeth to rotate along the rotating shaft. According to the present invention, the wafer before cleaning and the cleaned wafer are separately clamped and overturned, thereby preventing contaminants left on the clamping teeth of the dirty wafer before cleaning from contaminating the cleaned wafer.
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
B08B 3/10 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
8.
WAFER FORK UNIT STRUCTURE ALLOWING FOR SEPARATE PICKUP AND PLACEMENT OF WAFERS, AND WAFER TRANSFER MECHANISM AND METHOD
The present invention relates to the technical field of wafer transfer, and in particular, to a wafer fork unit structure allowing for separate pickup and placement of wafers, and a wafer transfer mechanism and method. The structure comprises: a fixing frame, and a wafer support tooth mechanism and a wafer fork which are fixed onto the fixing frame, wherein the wafer fork is provided with first wafer pins located at a first horizontal height and second wafer pins located at a second horizontal height, and wafer support teeth capable of moving back and forth in the direction of the wafer fork are provided on the wafer support tooth mechanism. When the wafer support teeth are located at an initial position, the first wafer pins support a wafer before cleaning; and when the wafer support teeth extend to a support position, the wafer support teeth and the second wafer pins support the wafer after cleaning. According to the present invention, during wafer pickup and placement, a dirty wafer before cleaning and the clean wafer after cleaning are picked and placed separately, so that the dirty wafer is prevented from affecting the clean wafer, thereby ensuring the wafer cleaning effect.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
Provided in the present invention is a rotary chuck with a wafer lifting function, comprising a chuck body which is penetrated by several lifting mechanisms and is provided with first gas passages therein. The lower end of each lifting mechanism corresponds to a first gas passage; by introducing gas into the first gas passages, the lifting mechanisms are lifted upwards, during which the upper end of each lifting mechanism protrudes beyond the upper end face of the chuck body; when no gas is introduced into the first gas passages, the lifting mechanisms return to the original positions. A transfer gripping mechanism in a process chamber is removed, and the lifting mechanisms capable of wafer lifting are added, such that, during handling of a wafer by existing transfer mechanisms, the generation of particulate matter due to the friction between parts, which may fall onto the surface of the wafer and contaminate the surface of the wafer, is prevented; in addition, the lifting mechanisms are mounted inside the rotary chuck, occupying less space while also reducing the cost.
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
A wafer cleaning method based on droplet impact. The method comprises: during the rotation of a wafer, spraying a first cleaning solution onto the surface of the wafer to form a continuous liquid film, such that contaminants are desorbed from the surface of the wafer into the liquid film; and continuously dripping, onto the surface of the wafer, droplets formed from a second cleaning solution, such that the contaminants within the liquid film are dislodged by the continuous impact of the droplets, and leave the wafer as the liquid film flows, wherein the diameters of the droplets range from 14 microns to 30 microns. In the method, during cleaning, droplets, which have diameters ranging from 14 microns to 30 microns and are formed from a second cleaning solution, are continuously dripped onto the surface of a wafer, such that contaminants within a liquid film, especially small-diameter contaminants at the bottom of the liquid film, are dislodged by the impact of the droplets, thereby leaving the wafer as the liquid film flows. By means of the method, damage to micro-patterns on the surface of a wafer caused by the way in which a cleaning solution is sprayed by using a large amount of high-pressure nitrogen in the prior art is prevented. The method is applicable to the cleaning of wafers with a size of 14 nm or below.
B08B 3/02 - Cleaning by the force of jets or sprays
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A liquid delivering system for wafer cleaning equipment includes an acid scouring tank, a sulfuric acid supplying source, a hydrogen peroxide supplying source, a first mixing device, a second mixing device and a feedback-control panel. The first mixing device and the second mixing device both includes a mixing duct, a multi-section mixing screw rod arranged inside the mixing duct and a heater wrapped around the mixing duct. By ways of adopting the above-mentioned technical solution, it is possible to realize fully mixing sulfuric acid with hydrogen peroxide in a mode of mixing in multi-stages, achieve precise control to temperature, and enable mixed liquid to fully react, thereby ensuring that the mixed liquid coming into the acid scouring tank meets cleaning requirements, and improving quality and efficiency of cleaning wafers.
B01F 35/92 - Heating or cooling systems for heating the outside of the receptacle, e.g. heated jackets or burners
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A method of controlling mixed liquid to be delivered for SPM solution includes: before the SPM solution comes into an acid scouring tank, mixing the sulfuric acid with the hydrogen peroxide in a delivering pipe in a first stage and a second stage in turn, so as to make a mixed liquid after mixing in the first stage to further get mixed in the second stage; heating the mixed liquid in the first stage; monitoring an oxygen concentration value of the mixed liquid flowing out after mixing in the first stage; and if the oxygen concentration value is smaller than an oxygen concentration value at full reaction, adding supplementary sulfuric acid and hydrogen peroxide during mixing in the second stage, so as to enable the oxygen concentration value of the mixed liquid flowing out after mixing in the second stage monitored in real time to reach an oxygen concentration value.
G05D 11/13 - Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means
G05D 16/20 - Control of fluid pressure characterised by the use of electric means
G05D 23/13 - Control of temperature without auxiliary power by varying the mixing ratio of two fluids having different temperatures
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A wafer transfer method, apparatus and system, comprising: acquiring a wafer pick-and-place requirement of a wafer processing position B; executing the wafer pick-and-place requirement of a wafer processing position Bx, and acquiring the times Ty, Tz respectively required for completing processing of the first two wafer processing positions By, Bz, wherein Ty
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B65G 49/07 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers
14.
WAFER NON-CONTACT TRANSFER SYSTEM FOR WAFER BACK CLEANING
A wafer non-contact transfer system for wafer back cleaning, comprising: a wafer transfer apparatus, comprising a first manipulator capable of moving axially along a first horizontal direction, a clamp of the first manipulator being provided with a first air outlet oriented in a set direction, and a wafer sheet being provided on the clamp of the first manipulator in a suspended mode on the basis of an air flow ejected from the first air outlet; and a wafer cleaning apparatus, comprising a wafer cleaning platform and a reversible second manipulator disposed on one side of the wafer cleaning platform, the second manipulator transferring the wafer sheet on the first manipulator to the wafer cleaning platform. According to the present invention, by providing an aerodynamics-based non-contact wafer transfer apparatus to transfer the wafer sheet from one device to another device for cleaning and providing a non-contact wafer carrying table for connection, the efficiency and accuracy of wafer transfer are improved.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
A non-contact wafer clamp suitable for a thin wafer, comprising a clamp base, a first arm, a second arm and a third arm. A thin pneumatic component is provided on the first arm; an extended pneumatic component is provided on the third arm; by means of airflow, the thin pneumatic component and the extended pneumatic component form a high-pressure area in an enclosed area of the thin pneumatic component and the extended pneumatic component, the high-pressure area being used for supporting wafers. The beneficial effects are: for the problem in the prior art that the method of using grippers to clamp is prone to wafer damage, the present solution respectively provides on a wafer clamp a thin pneumatic component and an extended pneumatic component, under the cooperation of the thin pneumatic component and the extended pneumatic component, forms a high-pressure area below wafers by means of airflow, and uses a cushioning component to limit wafer movement in the horizontal direction, thus implementing effective wafer gripping processes and avoiding the problem of wafer damage caused by the clamp gripping wafers.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
16.
NON-CONTACT WAFER EDGE CLEANING DEVICE WITH SECTIONAL FLOW FIELD CONTROL
A non-contact wafer edge cleaning device with sectional flow field control. A plurality of air power assemblies are distributed on an edge circumference of a wafer bearing platform so as to put a wafer into a suspended state. The wafer bearing platform is provided with a flow guide groove, a jet flow and a fixing groove, a flow jetting pipe assembly is fixed in the fixing groove, the flow guide groove surrounds the fixing groove, and a press-down flow guide cover and a gap between the flow guide groove and the flow jetting pipe assembly form a first airflow channel, such that an airflow jetted from the flow jetting pipe assembly is jetted out towards an edge portion of the wafer along the first airflow channel; and a plurality of airflow holes are provided in the bottom of the flow guide groove, such that the airflow jetted from the airflow holes enhance the airflow jetted out from the flow jetting pipe assembly. The wafer is not easily damaged by virtue of non-contact clamping, which is beneficial for maintaining the performance and quality of the wafer. After the airflow is enhanced, cleaned dirt is prevented from entering a lower surface of the wafer, the dirt such as particles on the edge of the wafer and the edge of the bearing platform is reduced, and the enhanced airflow can also help the air power assemblies maintain the stability of the non-contact state of the wafer.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
B08B 3/02 - Cleaning by the force of jets or sprays
The present utility model relates to the field of semiconductor processing. Specifically disclosed is a wafer transfer device, comprising: a transfer platform; a support arm fixedly connected to the transfer platform; and a plurality of support lifting and lowering mechanisms arranged on the support arm and used for holding up and supporting a transferred wafer, wherein the support lifting and lowering mechanisms can be independently lifted, lowered and adjusted on the support arm, such that when the support lifting and lowering mechanisms hold up the transferred wafer, the support vertexes of the support lifting and lowering mechanisms are synchronously in contact with corresponding different support position points on the transferred wafer. In the wafer transfer device of the present application, each support lifting and lowering mechanism can be independently lifted, lowered and adjusted on the support arm, so that the support vertexes of the support lifting and lowering mechanisms can be adjusted in such a way that the support vertexes are synchronously in contact with the support position points on the wafer, thereby avoiding collisions between the wafer and the support lifting and lowering mechanisms, ensuring the uniformity of acting forces applied to the wafer by the support lifting and lowering mechanisms, and avoiding the problem of wafer breakage due to stress imbalance.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
18.
MULTI-GAS EMISSION INTEGRATED MODULE APPLICABLE TO WAFER DRYING SYSTEM AND WAFER DRYING SYSTEM
The present invention relates to a multi-gas emission integrated module applicable to a wafer drying system, comprising: a tank body ventilation port, a main body ventilation port, and a bubbler ventilation port. The tank body ventilation port, the main body ventilation port and the bubbler ventilation port are respectively arranged on a housing; an air cylinder is provided in the housing; the air cylinder is connected to a ventilation on-off baffle; one end of a front connecting pipeline is connected to the housing, and the other end of the front connecting pipeline is connected to a middle air adjusting pipeline; a main loop pressure adjusting baffle is provided in the front connecting pipeline; an air inlet end of the middle air adjusting pipeline is connected to the front connecting pipeline, an air outlet end of the middle air adjusting pipeline is connected to an exhaust pipeline, and a rotary air cylinder module is provided on the middle air adjusting pipeline; the rotary air cylinder module is connected to a main loop on-off baffle arranged in the middle air adjusting pipeline; and an air outlet end of the exhaust pipeline extends out of the wafer drying system. According to the integrated module of the present invention, the gas emission problem in the drying process based on a Marangoni drying technique is improved by means of an integrated gas emission control method.
F26B 21/14 - Arrangements for supplying or controlling air or gases for drying solid materials or objects using gases or vapours other than air or steam
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
F26B 21/00 - Arrangements for supplying or controlling air or gases for drying solid materials or objects
F26B 25/00 - Details of general application not covered by group or
19.
DRYING CHAMBER STRUCTURE HAVING OPTIMIZED OSCILLATING MARANGONI DRYING FLOW FIELD
The present invention relates to a drying chamber structure having an optimized oscillating Marangoni drying flow field. The drying chamber structure comprises a main body chamber, which is a funnel-shaped main body structure having a gentle slope and used for liquid discharge; a sunken channel, located in the center of the bottom of the main body chamber, wherein a discharge hole is formed at the lowest end of a slope of the sunken channel; overflow grooves, respectively arranged on two sides of the main body chamber and used for discharging overflow ultrapure water and isopropyl alcohol (IPA); negative pressure cavities, arranged in the overflow grooves and forming negative pressure exhaust cavities; and a water injection pipeline, arranged in the sunken channel and provided with an injection pipe discharge hole. The drying chamber structure of the present invention can achieve uniform ultrapure water infiltration of the front and back surfaces of batch wafers, achieve vertical smooth flow traction, avoid turbulent flow, and by using the negative pressure exhaust cavities, ensure uniform distribution of IPA spray in a chamber and ensure that external air will not enter the chamber and contaminate a wafer.
F26B 25/02 - Applications of driving mechanisms, not covered by another subclass
F26B 25/00 - Details of general application not covered by group or
F26B 21/14 - Arrangements for supplying or controlling air or gases for drying solid materials or objects using gases or vapours other than air or steam
F26B 25/18 - Chambers, containers, receptacles of simple construction mainly open, e.g. dish, tray, pan
Disclosed in the present invention is a wafer detection module, comprising: a wafer cassette bearing platform, which is provided with several wafer cassette bearing positions hollowed out in the middle and is used for bearing wafer cassettes; and a wafer detection apparatus, which comprises a reception integrated component and a light source integrated component, the reception integrated component and the light source integrated component being located at the bottom of the wafer cassette bearing platform and respectively on two sides of a corresponding hollowed-out position, wherein the reception integrated component performs a lifting movement and/or rotary swing as a whole, so as to receive, redirect and transmit light, and the light source integrated component performs a lifting movement and/or rotary swing as a whole, so as to integrate the light transmitted by the reception integrated component and perform optical scanning on a wafer in a wafer cassette by means of the hollowed-out position. Further provided in the present invention is a wafer detection method. By means of the wafer detection module and method provided in the present invention, whether the three-dimensional positions or movements of a wafer cassette and a wafer have been shifted and whether the wafer has been damaged can be detected.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
G01B 11/02 - Measuring arrangements characterised by the use of optical techniques for measuring length, width, or thickness
H01L 21/66 - Testing or measuring during manufacture or treatment
Disclosed in the present invention is a wafer inspection system. Omnidirectional optical and millimeter wave noise scanning imaging is established by means of a combination of optical and waveband spectrum waves. The system comprises: an optical inspection unit, which is arranged at a first position relative to a movement path of a wafer, and is used for performing optical imaging on the wafer; a waveband inspection unit, which is arranged at a second position relative to the movement path of the wafer, and is used for performing wave spectrum imaging on the wafer; and an inspection and analysis unit, which is in signal connection with the optical inspection unit and the waveband inspection unit, and is used for performing inspection and operation analysis on optical imaging information and wave spectrum imaging information, so as to implement the inspection of the wafer and obtain the real-time state of the wafer. Further provided in the present invention is a wafer inspection method. The wafer inspection system provided in the present invention can effectively perform real-time inspection on the position, movement speed and movement process of a wafer cassette, and can also inspect in real time whether the three-dimensional position or movement of the wafer cassette and a wafer is shifted and whether the wafer is damaged.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/66 - Testing or measuring during manufacture or treatment
G01B 11/02 - Measuring arrangements characterised by the use of optical techniques for measuring length, width, or thickness
The present invention provides a process chuck for wafer cleaning, comprising a chuck body provided with a plurality of sleeves arranged in a circumferential direction of the chuck body. Each sleeve is provided with a gripper finger extending therethrough. Upper ends of gripper fingers extend out of the upper surface of the chuck body, such that a space for clamping a wafer is formed above the chuck body. A moving mechanism is rotatably mounted below the chuck body. Lower ends of the gripper fingers extend out of the lower surface of the chuck body and are connected to the moving mechanism. The moving mechanism is used for driving, according to a control instruction, the gripper fingers to rotate in a first direction so as to open the gripper fingers; and the moving mechanism rotates back in a second direction opposite to the first direction to drive the gripper fingers to close. The sleeves limit the true position of the gripper fingers, so that the gripper fingers grip the wafer by aligning with the centerline of the wafer. Operation is smooth, thereby satisfying the dynamic balancing requirements of wafer cleaning, improving the wafer cleaning effect, and ensuring the wafer quality.
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
Disclosed in the present invention is an SPM solution mixed acid output control method. Before an SPM solution enters a pickling tank, sulfuric acid and hydrogen peroxide are sequentially subjected to first-stage mixing and second-stage mixing on a conveying pipeline according to a given volume ratio; a mixed solution outputted after the first-stage mixing is subjected to the second-stage mixing, heating is carried out during the first-stage mixing, an oxygen concentration value of the mixed solution flowing out after the first-stage mixing is monitored in real time, and if the oxygen concentration value is lower than an oxygen concentration value of a full reaction, sulfuric acid and hydrogen peroxide are supplemented and added in the given volume ratio during the second-stage mixing such that an oxygen concentration value, monitored in real time, of a mixed solution flowing out after the second-stage mixing reaches the oxygen concentration value of the full reaction. According to the present invention, full mixing of sulfuric acid and hydrogen peroxide is achieved in a segmented mixing manner, accurate control over the temperature is achieved, and a full reaction of a mixed solution is guaranteed, thereby guaranteeing that the mixed solution entering the pickling tank meets the cleaning requirement, and improving the quality and efficiency of wafer cleaning.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
G05D 11/13 - Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means
25.
LIQUID CONVEYING SYSTEM OF WAFER CLEANING APPARATUS
Disclosed in the present invention is a liquid conveying system of a wafer cleaning apparatus. The liquid conveying system comprises a pickling tank, a sulfuric acid supply source, a hydrogen peroxide supply source, a first mixing device, a second mixing device and a feedback control panel, wherein the first mixing device and the second mixing device each comprise a mixing pipeline, a multi-section mixing screw rod arranged in the mixing pipeline, and a heater wrapping the mixing pipeline. The present invention fully mixes sulfuric acid with hydrogen peroxide by means of segmented mixing, achieves accurate control over the temperature, and guarantees sufficient reaction of a mixed liquid, thereby ensuring that the mixed liquid entering the pickling tank meets cleaning requirements, and improving the quality and efficiency of wafer cleaning.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
26.
DISTRIBUTED ONLINE HEATING SYSTEM AND ONLINE HEATING METHOD
Provided are a distributed online heating system and an online heating method. The online heating system comprises a liquid supply pump (2), a process tank body (4), and at least two heating units (1) connected between the liquid supply pump (2) and the process tank body (4). Each heating unit (1) comprises a heating pipe (1-6), a connecting pipeline (1-1), and a first control valve (1-2), a second control valve (1-3)/third control valve (1-4) and a fourth control valve (1-5) arranged on the connecting pipeline (1-1), wherein the first control valve (1-2) is connected to an output end of the liquid supply pump (2) and an input end of the heating pipe (1-6); the second control valve (1-3) is connected to an output end of the heating pipe (1-6) and an input end of the heating pipe (1-6) in the next heating unit (1); the third control valve (1-4) is connected to the input end of the heating pipe (1-6) and the input end of the heating pipe (1-6) in the next heating unit (1); and the fourth control valve (1-5) is connected to the output end of the heating pipe (1-6) and an input end of the process tank body (4), and the fourth control valve (1-5) and the second control valve (1-3) are connected in parallel. The present invention can realize the supply of various heating processes in the same heating system, thereby greatly improving the process coverage capability of an online heating system.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
27.
LIQUID TENSION CONTROL METHOD CAPABLE OF IMPROVING WAFER DRYING EFFICIENCY
The present invention relates to a liquid tension control method capable of improving wafer drying efficiency. The method comprises: Step 1, putting a wafer cassette connected to a swinging mechanism in a drying tank body, loading wafers in the wafer cassette, combining the drying tank body and an upper cover dome and keeping same airtight, and evacuating trace gas; Step 2, injecting normal-temperature nitrogen from the upper cover dome, and injecting ultrapure water into the drying tank body to perform surface wetting of the wafers; Step 3, completing the surface wetting of the wafers, and then performing the following operations: S1, injecting a mixture of isopropanol and heated nitrogen into the drying tank body by using a special integrated module, and discharging the ultrapure water from the bottom of the drying tank body at a controlled speed; and S2, in the ultrapure water discharging process, operating the swinging mechanism to carry the wafers to form planetary swinging, such that water molecules on the wafers are rapidly separated; and Step 4, repeating to complete wafer drying. According to the present invention, residual water on the surfaces of the wafers is rapidly taken away by means of the planetary arc swing drying technology, and rapid drying of the wafers is achieved by effectively controlling the liquid tension.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
F26B 21/14 - Arrangements for supplying or controlling air or gases for drying solid materials or objects using gases or vapours other than air or steam
F26B 11/18 - Machines or apparatus for drying solid materials or objects with movement which is non-progressive on or in moving dishes, trays, pans, or other mainly-open receptacles
28.
INTEGRATED WAFER DRYING METHOD AND SYSTEM, TERMINAL AND STORAGE MEDIUM
Disclosed is an integrated wafer drying system, comprising: a wafer swinging module which is externally hung on one side of a process tank and is used for performing a swinging motion on a wafer in the drying process; a pipeline conveying module which is connected to the process tank and is used for conveying a drying medium to the process tank; and a drying control module which is electrically connected to the wafer swinging module and the pipeline conveying module and is used for process control of the drying process. The pipeline conveying module comprises: a first nitrogen conveying pipeline, a second nitrogen conveying pipeline, and an isopropanol conveying pipeline which is connected to mixing tanks and is used for conveying isopropanol. The present invention further relates to an integrated wafer drying method, a terminal and a computer readable storage medium. According to the present invention, two-phase staggered movement of isopropanol and water molecules is adopted, so that the surface of a wafer is effectively dried by means of the diffusion of tension and the pulling and lifting effect in a vertical direction.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
29.
ISOPROPANOL AND NITROGEN MIXING TANK APPLIED TO WAFER DRYING DEVICES
An isopropanol and nitrogen mixing tank applied to wafer drying devices. The interior of a mixing tank (207) is of a three-layer structure comprising a vortex mixing channel (216), a buffer backflow tank (217) and a hot water bath area (218). A tank body inlet (222) is formed at the bottom of the mixing tank (207), and a tank body outlet (223) is formed at the top of the mixing tank (207); the tank body inlet (222) is communicated with the vortex mixing channel (216); the buffer backflow tank (217) is communicated with a heated nitrogen input port (214); the hot water bath area (218) is communicated with an ultrapure water input port (212) and an ultrapure water output port (213); the tank body outlet (223) is communicated with a mixed gas-liquid coexistence body output port (215); the mixing tank (207) is clamped by means of an upper mounting block (220) and a lower mounting block (221), so as to be fixed in a housing. The isopropanol and nitrogen mixing tank stably and controllably provides a mixed liquid formed by liquid isopropanol and heated nitrogen to provide gas and liquid atmospheres for rapid drying of wafers.
B01F 33/81 - Combinations of similar mixers, e.g. with rotary stirring devices in two or more receptacles
B01F 35/00 - Accessories for mixersAuxiliary operations or auxiliary devicesParts or details of general application
B01F 35/40 - Mounting or supporting mixing devices or receptaclesClamping or holding arrangements therefor
F26B 9/06 - Machines or apparatus for drying solid materials or objects at rest or with only local agitationDomestic airing cupboards in stationary drums or chambers
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
