The invention relates to a metal-ceramic substrate and to a method for the production thereof, comprising at least one ceramic layer (2), which is provided on a first surface side (2a) with at least one first metallization (3) and on a second surface side (2b), opposite from the first surface side (2a), with a second metallization (4), wherein the first metallization (3) is formed by a film or layer of copper or a copper alloy and is connected to the first surface side (2a) of the ceramic layer (2) with the aid of a "direct copper bonding" process. Particularly advantageously, the second metallization (4) is formed by a layer of aluminium or an aluminium alloy.
C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
2.
THERMOELECTRIC GENERATOR MODULE, METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SUCH A METAL-CERAMIC SUBSTRATE
The invention relates to a thermoelectric generator module with a hot zone (1a) and a cold zone (1b) comprising at least a first metal-ceramic substrate (2), which has a first ceramic layer (6) and at least one structured first metallization (4) applied to the first ceramic layer (6) and is assigned to the hot zone, and at least a second metal-ceramic substrate (4), which has a second ceramic layer (7) and at least one structured second metallization (5) applied to the second ceramic layer and is assigned to the cold zone (1b), and also a number of thermoelectric generator components (N, P) located between the first and second structured metallizations (4, 5) of the metal-ceramic substrates (2, 3). Particularly advantageously, the first metal-ceramic substrate (2), assigned to the hot zone (1a), has at least one layer of steel or high-grade steel (8), wherein the first ceramic layer (6) is arranged between the first structured metallization (4) and the at least one layer of steel or high-grade steel (8). The invention also relates to an associated metal-ceramic substrate and to a method for producing it.
H01L 35/32 - SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR - Details thereof operating with Peltier or Seebeck effect only characterised by the structure or configuration of the cell or thermocouple forming the device
Process for producing DCB substrates having in each case at least one ceramic layer which consists essentially of aluminium nitride (AlN) and is provided on at least one surface side with an intermediate layer consisting essentially of aluminium oxide and also has at least one metallization formed by a metal layer or metal foil on the intermediate layer.
Packaging for substrates, particularly for metal/ceramic substrates, having a tray-like packaging portion, produced from a flat material, for example from a plastic flat material, by deep-drawing, having at least one receptacle, formed by a depression in an upper base section of the packaging portion, for a plurality of substrates that are combined to form at least one substrate stack (5).
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
5.
PACKAGE FOR METAL-CERAMIC SUBSTRATE, AND METHOD FOR PACKAGING SUCH SUBSTRATES
The invention relates to a package for metal-ceramic substrates composed of a ceramic layer, multiple individual metallizations formed on at least one surface of the ceramic layer, and predetermined breaking lines extending therebetween.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 23/10 - ContainersSeals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
6.
METHOD FOR PRODUCING METAL-CERAMIC COMPOSITE MATERIALS, IN PARTICULAR METAL-CERAMIC SUBSTRATES, AND CERAMIC COMPOSITE MATERIAL, IN PARTICULAR METAL-CERAMIC SUBSTRATE, PRODUCED ACCORDING TO SAID METHOD
The invention relates to a method for producing metal-ceramic substrates, wherein at least one ceramic substrate, for example at least one plate-shaped ceramic substrate, is connected to an oxidized metal film by direct bonding, specifically by heating under protective gas to a process or bonding temperature that is below the melting temperature of the metal of the metal film but is at least equal to the melting temperature of the eutectic formed by the oxide layer and the metal, wherein the at least one ceramic substrate and the at least one metal film to be connected thereto are accommodated in a reaction chamber formed by an interior of a saggar during the method.
The invention relates to an electronic device, in particular an electronic circuit or electronic module, comprising at least one metal insulating layer substrate consisting of at least one insulating layer and at least one first metallization on a surface side of the insulating layer, wherein the first metallization of the metal insulating layer substrate is structured for forming metallization regions, and further comprising at least one electrical or electronic component on a first metallization region of the first metallization and producing lost heat, wherein the first metallization region comprises on a partial region, with which the component is at least thermally connected, a layer thickness that is substantially greater than the layer thickness of the first metallization region outside said first partial region.
01 - Chemical and biological materials for industrial, scientific and agricultural use
06 - Common metals and ores; objects made of metal
09 - Scientific and electric apparatus and instruments
17 - Rubber and plastic; packing and insulating materials
Goods & Services
Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; Unprocessed artificial resins, unprocessed plastics; Manures; Fire extinguishing compositions; Tempering and soldering preparations; Chemical substances for preserving foodstuffs; Tanning substances; Adhesives used in industry. Common metals and their alloys; Metal building materials; Transportable buildings of metal; Materials of metal for railway tracks; Non-electric cables and wires of common metal; Ironmongery, small items of metal hardware; Pipes and tubes of metal; Safes; Goods of common metal not included in other classes; Ores; Gold solder; Silver solder. Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; Apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; Apparatus for recording, transmission or reproduction of sound or images; Magnetic data carriers, recording discs; Automatic vending machines and mechanisms for coin-operated apparatus; Cash registers, calculating machines, data processing equipment and computers; Fire-extinguishing apparatus; Peripherals adapted for use with computers; Recorded computer programs; Computer programs [downloadable software]; Recorded computer software; Electronic publications, downloadable. Rubber, gutta percha, gum, asbestos, mica and goods made from these materials and not included in other classes; Plastics in extruded form for use in manufacture; Packing, stopping and insulating materials; Flexible pipes, not of metal.
01 - Chemical and biological materials for industrial, scientific and agricultural use
06 - Common metals and ores; objects made of metal
09 - Scientific and electric apparatus and instruments
17 - Rubber and plastic; packing and insulating materials
Goods & Services
Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; Unprocessed artificial resins, unprocessed plastics; Manures; Fire extinguishing compositions; Tempering and soldering preparations; Chemical substances for preserving foodstuffs; Tanning substances; Adhesives used in industry. Common metals and their alloys; Metal building materials; Transportable buildings of metal; Materials of metal for railway tracks; Non-electric cables and wires of common metal; Ironmongery, small items of metal hardware; Pipes and tubes of metal; Safes; Goods of common metal not included in other classes; Ores; Gold solder; Silver solder. Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; Apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; Apparatus for recording, transmission or reproduction of sound or images; Magnetic data carriers, recording discs; Automatic vending machines and mechanisms for coin-operated apparatus; Cash registers, calculating machines, data processing equipment and computers; Fire-extinguishing apparatus; Peripherals adapted for use with computers; Recorded computer programs; Computer programs [downloadable software]; Recorded computer software; Electronic publications, downloadable. Rubber, gutta percha, gum, asbestos, mica and goods made from these materials and not included in other classes; Plastics in extruded form for use in manufacture; Packing, stopping and insulating materials; Flexible pipes, not of metal.
01 - Chemical and biological materials for industrial, scientific and agricultural use
06 - Common metals and ores; objects made of metal
09 - Scientific and electric apparatus and instruments
17 - Rubber and plastic; packing and insulating materials
Goods & Services
Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry; Unprocessed artificial resins, unprocessed plastics; Manures; Fire extinguishing compositions; Tempering and soldering preparations; Chemical substances for preserving foodstuffs; Tanning substances; Adhesives used in industry. Common metals and their alloys; Metal building materials; Transportable buildings of metal; Materials of metal for railway tracks; Non-electric cables and wires of common metal; Ironmongery, small items of metal hardware; Pipes and tubes of metal; Safes; Goods of common metal not included in other classes; Ores; Gold solder; Silver solder. Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; Apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; Apparatus for recording, transmission or reproduction of sound or images; Magnetic data carriers, recording discs; Automatic vending machines and mechanisms for coin-operated apparatus; Cash registers, calculating machines, data processing equipment and computers; Fire-extinguishing apparatus; Peripherals adapted for use with computers; Recorded computer programs; Computer programs [downloadable software]; Recorded computer software; Electronic publications, downloadable. Rubber, gutta percha, gum, asbestos, mica and goods made from these materials and not included in other classes; Plastics in extruded form for use in manufacture; Packing, stopping and insulating materials; Flexible pipes, not of metal.
Electric unit, having at least one cooler structure and at least one electric module comprising at least one electric element on a metal-ceramic substrate.
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
The invention relates to a metal/ceramic substrate, comprising a multilayer, plate-shaped ceramic material and at least one metallization which is provided on a surface side of the ceramic material and joined to the ceramic material by direct bonding (DCB method) or reactive brazing, wherein the ceramic material comprises at least one inner layer or base layer made of a silicon nitride ceramic, and wherein the surface side of the ceramic material provided with the at least one metallization is formed on an intermediate layer which is applied onto the at least one base layer and made of an oxidic ceramic.
The invention relates to a composite material consisting of at least one ceramic layer or at least one ceramic substrate and at least one metallisation formed by a metallic layer on a surface side of the at least one ceramic substrate.
The invention relates to a method for producing Peltier modules, each of which comprises several Peltier elements that are arranged between at least two substrates. The substrates are made of an electrically insulating material at least on the sides facing the Peltier elements while being provided with contact areas on said surfaces. The contact areas, to which the Peltier elements are connected by means of terminal surfaces during the production process, are formed by metallic areas.
In the case of a metal-ceramic substrate with at least one metallization, patterned by etching, on at least one surface side of a laminar ceramic material which comprises a base substrate made of an aluminium-nitride or silicon-nitride ceramic and to which the metallization is applied by active soldering before patterning, an intermediate layer made of an oxidic ceramic is provided between the at least one metallization and the base substrate.
The invention relates to a module with a number electrical or electronic components or switching circuits provided on a common cooler structure flowed through by a cooling medium. The entire cooler structure is comprised of at least to plate-shaped coolers, which are arranged parallel to one another in an interspaced manner and which are flowed through by the cooling medium.
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
In the case of a metal-ceramic substrate with a multilayered ceramic material in sheet form, and with at least one metallization that is provided on one surface side of the ceramic material and is joined to the ceramic material by direct bonding or active soldering, the ceramic material comprises at least one inner layer or base layer of a silicon nitride ceramic. The surface side of the ceramic material that is provided with the at least one metallization is formed by an intermediate layer of an oxidic ceramic applied to the base layer.
