Abstract

Provided are flexible interconnect circuits comprising signal circuit elements. For example, a signal circuit element can be formed from the same metal sheet as a signal trace, thereby being monolithic with the signal circuit element. This integration of signal circuit elements into a flexible interconnect circuit reduces the number of additional operations and components (e.g., attaching external circuit elements). In some examples, a flexible interconnect circuit is used in a battery pack for interconnecting batteries while providing external terminals on the same side of the pack. Specifically, a flexible interconnect circuit comprises an interconnecting conductive layer (for connecting to batteries) and a return conductive layer, both extending between the first and second circuit edges. Each of these conductive layers comprises a corresponding external terminal at the first edge, while these layers are interconnected at the second edge. Otherwise, these layers are isolated from each other between the circuit edges.

IPC Classes  ?

• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

Provided are multilayered flexible interconnect circuits comprising multiple conductive layers. Also provided are methods of fabricating such circuits and also methods of fabricating battery assemblies with such circuits. A multilayered flexible interconnect circuit comprises at least two conductive layers and at least one inner insulator, which extends between these conductive layers in some circuit portions and allows for conductive layers to directly interface in other circuit portions (e.g., busbar portions). Outer insulators can be provided to insulate these conductive layers from the environment while allowing some access to these layers as needed. Each conductive layer and insulator can be individually patterned to achieve these functions. One or more insulators support conductive layers relative to each other as well as different portions (e.g., disjoined portions) of the same conductive layer. The same multilayered flexible interconnect circuit can provide battery interconnect, voltage/temperature sense, and/or other functions.

IPC Classes  ?

• H01M 50/526 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the material having a layered structure
• H01M 50/524 - Organic material
• H01M 50/503 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the shape of the interconnectors
• H01M 50/505 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing comprising a single busbar

Abstract

Provided are multilayered flexible interconnect circuits comprising multiple conductive layers. Also provided are methods of fabricating such circuits and also methods of fabricating battery assemblies with such circuits. A multilayered flexible interconnect circuit comprises at least two conductive layers and at least one inner insulator, which extends between these conductive layers in some circuit portions and allows for conductive layers to directly interface in other circuit portions (e.g., busbar portions). Outer insulators can be provided to insulate these conductive layers from the environment while allowing some access to these layers as needed. Each conductive layer and insulator can be individually patterned to achieve these functions. One or more insulators support conductive layers relative to each other as well as different portions (e.g., disjoined portions) of the same conductive layer. The same multilayered flexible interconnect circuit can provide battery interconnect, voltage/temperature sense, and/or other functions.

IPC Classes  ?

• H02G 5/00 - Installations of bus-bars
• H01M 10/613 - Cooling or keeping cold
• H01M 10/6551 - Surfaces specially adapted for heat dissipation or radiation, e.g. fins or coatings
• H01M 50/507 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing comprising an arrangement of two or more busbars within a container structure, e.g. busbar modules
• H01M 50/524 - Organic material
• H01M 50/526 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the material having a layered structure

Abstract

Described herein are flexible interconnect circuits comprising spring contacts, methods of fabricating such circuits, as well as methods of using such circuits to form electrical connections to various components. A flexible interconnect circuit comprises two insulators and one or more conductive traces, at least partially protruding between the insulators. The circuit also comprises one or more spring contacts, each comprising a base portion and a spring portion, which is monolithic with the base portion. The base portion directly interfaces, is mechanically attached, and is electrically connected to one of the protruding portions of the conductive traces forming a trace-contact interface. The spring portion is configured to flex relative to the base portion at least in a direction substantially perpendicular to the trace-contact interface. In some examples, multiple spring contacts are attached to the same protruding portion and are offset along the width of this portion.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

Abstract

Described herein are flexible interconnect circuits comprising spring contacts, methods of fabricating such circuits, as well as methods of using such circuits to form electrical connections to various components. A flexible interconnect circuit comprises two insulators and one or more conductive traces, at least partially protruding between the insulators. The circuit also comprises one or more spring contacts, each comprising a base portion and a spring portion, which is monolithic with the base portion. The base portion directly interfaces, is mechanically attached, and is electrically connected to one of the protruding portions of the conductive traces forming a trace-contact interface. The spring portion is configured to flex relative to the base portion at least in a direction substantially perpendicular to the trace-contact interface. In some examples, multiple spring contacts are attached to the same protruding portion and are offset along the width of this portion.

IPC Classes  ?

• H01R 12/77 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures

Abstract

Described herein are circuit assemblies comprising flexible interconnect circuits and/or other components connected to these circuits. In some examples, conductive elements of different circuits are connected with support structures, such as rivets. Furthermore, conductive elements of the same circuit can be interconnected. In some examples, a conductive element of a circuit is connected to a printed circuit board (or other devices) using a conductor joining structure. Interconnecting different circuits involves stacking these circuits such that the conductive element in one circuit overlaps with the conductive element in another circuit. A support structure protrudes through both conductive elements and any other components positioned in between, such as dielectric and/or adhesive layers. This structure electrically connects the conductive elements and also compresses the conductive elements toward each other. For example, a rivet is used with the rivet heads contacting one or two conductive elements, e.g., directly interfacing their outer-facing sides.

IPC Classes  ?

• H01R 12/70 - Coupling devices
• H01R 12/71 - Coupling devices for rigid printing circuits or like structures

Abstract

Provided are terminal-free connectors for flexible interconnect circuits. A connector for connecting to a flexible interconnect circuit comprises a base comprising a housing chamber defined by at least a first side wall and a second side wall that are oppositely positioned about the base. A circuit clamp is coupled to the base via a first hinge, and is configured to move between a released position and a clamped position. A cover piece is coupled to the base via a second hinge, and is configured to move between an open position and a closed position. The circuit clamp is configured to secure the flexible interconnect circuit between the base and the circuit clamp in the clamped position. One or more protrusions on the circuit clamp are each configured to interface with a socket within the first or second side wall to secure the circuit clamp in the clamped position.

IPC Classes  ?

• H01R 12/77 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
• H01R 12/59 - Fixed connections for flexible printed circuits, flat or ribbon cables or like structures

Abstract

Described herein are methods for forming welded and soldered connections to flexible interconnect circuits and assemblies comprising such connections. An assembly can include a weldable transition unit having a transition pad and a solderable pad. The transition pad may comprise aluminum and can be welded to the aluminum conductive trace of a flexible interconnect circuit. The solderable pad can be soldered to the electrical contact of a device (e.g., a resistor, capacitor). In some examples, the weldable transition unit may comprise a stiffener mechanically connected to the transition pad to provide mechanical support of the transition pad and devices soldered to the transition pad. In some examples, the device soldered to the weldable transition unit may include one or more individual electronic components. In some examples, the device soldered to the weldable transition unit may be a printed circuit board (PCB) having solderable traces.

IPC Classes  ?

• H01L 23/528 - Layout of the interconnection structure
• H01L 23/532 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
• H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
• H01L 23/367 - Cooling facilitated by shape of device
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/498 - Leads on insulating substrates

Abstract

Described herein are methods for forming welded and soldered connections to flexible interconnect circuits and assemblies comprising such connections. An assembly can include a weldable transition unit having a transition pad and a solderable pad. The transition pad may comprise aluminum and can be welded to the aluminum conductive trace of a flexible interconnect circuit. The solderable pad can be soldered to the electrical contact of a device (e.g., a resistor, capacitor). In some examples, the weldable transition unit may comprise a stiffener mechanically connected to the transition pad to provide mechanical support of the transition pad and devices soldered to the transition pad. In some examples, the device soldered to the weldable transition unit may include one or more individual electronic components. In some examples, the device soldered to the weldable transition unit may be a printed circuit board (PCB) having solderable traces.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H01B 11/00 - Communication cables or conductors
• H05K 1/03 - Use of materials for the substrate

Abstract

Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Abstract

A method of forming a flexible interconnect circuit is described. A method may involve laminating a substrate to a conductive layer followed by patterning the conductive layer. This patterning operation forms individual conductive portions, which may be also referred to as traces or conductive islands. The substrate supports these portions relative to each other during and after patterning. After patterning, an insulator may be laminated to the exposed surface of the patterned conductive layer. At this point, the conductive layer portions are also supported by the insulator, and the substrate may optionally be removed, e.g., together with undesirable portions of the conductive layer. Alternatively, the substrate may be retained as a component of the circuit and the undesirable portions of the patterned conductive layer may be removed separately. These approaches allow using new patterning techniques as well as new materials for substrates and/or insulators.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H01M 50/519 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing comprising printed circuit boards [PCB]
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
• H05K 3/20 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 3/44 - Manufacturing insulated metal core circuits
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

Provided are flexible interconnect circuits comprising signal circuit elements. For example, a signal circuit element can be formed from the same metal sheet as a signal trace, thereby being monolithic with the signal circuit element. This integration of signal circuit elements into a flexible interconnect circuit reduces the number of additional operations and components (e.g., attaching external circuit elements). In some examples, a flexible interconnect circuit is used in a battery pack for interconnecting batteries while providing external terminals on the same side of the pack. Specifically, a flexible interconnect circuit comprises an interconnecting conductive layer (for connecting to batteries) and a return conductive layer, both extending between the first and second circuit edges. Each of these conductive layers comprises a corresponding external terminal at the first edge, while these layers are interconnected at the second edge. Otherwise, these layers are isolated from each other between the circuit edges.

IPC Classes  ?

• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

Provided are interconnects for interconnecting a set of battery cells, assemblies comprising these interconnects, methods of forming such interconnects, and methods of forming such assemblies. An interconnect includes a conductor comprising two portions electrically isolated from each other. At least one portion may include two contacts for connecting to battery cells and a fuse forming an electrical connection between these two contacts. The interconnect may also include an insulator adhered to the conductor and mechanically supporting the two portions of the conductor. The insulator may include an opening such that the fuse overlaps with this opening, and the opening does not interfere with the operation of the fuse. In some embodiments, the fuse may not directly interface with any other structures. Furthermore, the interconnect may include a temporary substrate adhered to the insulator such that the insulator is disposed between the temporary substrate and the conductor.

IPC Classes  ?

• H01M 50/581 - Devices or arrangements for the interruption of current in response to temperature
• H01M 10/48 - Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
• H01M 50/503 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the shape of the interconnectors
• H01M 50/522 - Inorganic material
• H01M 50/526 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the material having a layered structure
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H01M 10/42 - Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
• H05K 1/02 - Printed circuits Details

Abstract

Provided are flexible interconnect circuits comprising signal circuit elements. For example, a signal circuit element can be formed from the same metal sheet as a signal trace, thereby being monolithic with the signal circuit element. This integration of signal circuit elements into a flexible interconnect circuit reduces the number of additional operations and components (e.g., attaching external circuit elements). In some examples, a flexible interconnect circuit is used in a battery pack for interconnecting batteries while providing external terminals on the same side of the pack. Specifically, a flexible interconnect circuit comprises an interconnecting conductive layer (for connecting to batteries) and a return conductive layer, both extending between the first and second circuit edges. Each of these conductive layers comprises a corresponding external terminal at the first edge, while these layers are interconnected at the second edge. Otherwise, these layers are isolated from each other between the circuit edges.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A method of forming a flexible interconnect circuit is described. The method may comprise laminating a substrate to a conductive layer and patterning the conductive layer using a laser while the conductive layer remains laminated to the substrate thereby forming a first conductive portion and a second conductive portion of the conductive layer. The substrate maintains the orientation of the first conductive portion relative to the second conductive portion during and after patterning. The method may also comprise laminating a first insulator to the conductive layer and removing the substrate from the conductive layer such that the first insulator maintains the orientation of the first conductive portion relative to the second conductive portion while and after the substrate is removed. The method may also comprise laminating a second insulator to the second side of the conductive layer while the first insulator remains laminated to the substrate.

IPC Classes  ?

• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H01M 50/519 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing comprising printed circuit boards [PCB]
• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
• H05K 3/20 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A connector for connecting a flexible interconnect circuit includes a base, having a first set of protrusions and a second set of protrusions. The first set of protrusions and the second set of protrusions are configured to secure the flexible interconnect circuit at a first set of apertures and a second set of apertures of the flexible interconnect circuit, respectively. The first set of protrusions may be positioned at a first distance from the second set of protrusions on the base. The first set of apertures may be positioned on the flexible interconnect circuit at a second distance, greater than the first distance, from the second set of apertures. The base causes the flexible interconnect circuit into an arched configuration when the apertures are secured to the respective protrusions. The connector further includes a cover piece configured to secure the flexible interconnect circuit in the arched configuration.

IPC Classes  ?

• H01R 12/61 - Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
• H01R 12/77 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

Described herein are circuit assemblies comprising flexible interconnect circuits and/or other components connected to these circuits. In some examples, conductive elements of different circuits are connected with support structures, such as rivets. Furthermore, conductive elements of the same circuit can be interconnected. In some examples, a conductive element of a circuit is connected to a printed circuit board (or other devices) using a conductor joining structure. Interconnecting different circuits involves stacking these circuits such that the conductive element in one circuit overlaps with the conductive element in another circuit. A support structure protrudes through both conductive elements and any other components positioned in between, such as dielectric and/or adhesive layers. This structure electrically connects the conductive elements and also compresses the conductive elements toward each other. For example, a rivet is used with the rivet heads contacting one or two conductive elements, e.g., directly interfacing their outer-facing sides.

IPC Classes  ?

• H01R 12/71 - Coupling devices for rigid printing circuits or like structures
• H01R 12/70 - Coupling devices

Abstract

Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Abstract

Provided are interconnects for interconnecting a set of battery cells, assemblies comprising these interconnects, methods of forming such interconnects, and methods of forming such assemblies. An interconnect includes a conductor comprising two portions electrically isolated from each other. At least one portion may include two contacts for connecting to battery cells and a fuse forming an electrical connection between these two contacts. The interconnect may also include an insulator adhered to the conductor and mechanically supporting the two portions of the conductor. The insulator may include an opening such that the fuse overlaps with this opening, and the opening does not interfere with the operation of the fuse. In some embodiments, the fuse may not directly interface with any other structures. Furthermore, the interconnect may include a temporary substrate adhered to the insulator such that the insulator is disposed between the temporary substrate and the conductor.

IPC Classes  ?

• H01M 50/581 - Devices or arrangements for the interruption of current in response to temperature
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H01M 10/48 - Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
• H01M 50/526 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the material having a layered structure
• H01M 50/522 - Inorganic material
• H01M 50/503 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the shape of the interconnectors
• H01M 10/42 - Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
• H05K 1/02 - Printed circuits Details

Abstract

Provided are multilayered flexible battery interconnects for interconnecting batteries in battery packs and methods of fabricating thereof. A multilayered flexible battery interconnect comprises insulating layers and two conductive layers, stacked together and positioned between the insulating layers. One conductive layer is thicker than the other. The thinner conductive layer comprises flexible tabs for connecting to batteries and, in some examples, comprises voltage sense traces. The smaller thickness of these flexible tabs ensures welding quality and allows using less energy during welding. The battery cell contacts, to which these flexible tabs are welded, can be significantly thicker. Furthermore, the smaller thickness enables fusible link integration into flexible tabs. At the same time, the two conductive layers collectively conduct current within the interconnect, with the thicker layer enhancing the overall current-carrying capacity. The two conductive layers can be welded together to ensure electric connections and mechanical support.

IPC Classes  ?

• H01M 50/526 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the material having a layered structure
• H01M 50/533 - Electrode connections inside a battery casing characterised by the shape of the leads or tabs
• H01M 50/50 - Current conducting connections for cells or batteries
• H01M 50/503 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the shape of the interconnectors
• H01M 50/555 - Window-shaped terminals
• H01M 50/522 - Inorganic material
• H01M 50/516 - Methods for interconnecting adjacent batteries or cells by welding, soldering or brazing
• H01M 50/502 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing
• H01M 50/569 - Constructional details of current conducting connections for detecting conditions inside cells or batteries, e.g. details of voltage sensing terminals

Abstract

Provided are flexible interconnect circuits comprising signal circuit elements. For example, a signal circuit element can be formed from the same metal sheet as a signal trace, thereby being monolithic with the signal circuit element. This integration of signal circuit elements into a flexible interconnect circuit reduces the number of additional operations and components (e.g., attaching external circuit elements). In some examples, a flexible interconnect circuit is used in a battery pack for interconnecting batteries while providing external terminals on the same side of the pack. Specifically, a flexible interconnect circuit comprises an interconnecting conductive layer (for connecting to batteries) and a return conductive layer, both extending between the first and second circuit edges. Each of these conductive layers comprises a corresponding external terminal at the first edge, while these layers are interconnected at the second edge. Otherwise, these layers are isolated from each other between the circuit edges.

IPC Classes  ?

• H01M 50/516 - Methods for interconnecting adjacent batteries or cells by welding, soldering or brazing
• H01M 50/213 - Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for cells having curved cross-section, e.g. round or elliptic
• H01M 50/526 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the material having a layered structure
• H01M 50/533 - Electrode connections inside a battery casing characterised by the shape of the leads or tabs
• H05K 1/14 - Structural association of two or more printed circuits

Abstract

Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/36 - Assembling printed circuits with other printed circuits

Abstract

Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Abstract

Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H01B 7/08 - Flat or ribbon cables
• H01B 11/00 - Communication cables or conductors
• H05K 1/03 - Use of materials for the substrate

Abstract

Provided are terminal-free connectors for flexible interconnect circuits. A connector for connecting to a flexible interconnect circuit comprises a base comprising a housing chamber defined by at least a first side wall and a second side wall that are oppositely positioned about the base. A circuit clamp is coupled to the base via a first hinge, and is configured to move between a released position and a clamped position. A cover piece is coupled to the base via a second hinge, and is configured to move between an open position and a closed position. The circuit clamp is configured to secure the flexible interconnect circuit between the base and the circuit clamp in the clamped position. One or more protrusions on the circuit clamp are each configured to interface with a socket within the first or second side wall to secure the circuit clamp in the clamped position.

IPC Classes  ?

• H01R 12/77 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
• H01R 12/59 - Fixed connections for flexible printed circuits, flat or ribbon cables or like structures

Abstract

Provided are multilayered flexible battery interconnects for interconnecting batteries in battery packs and methods of fabricating thereof. A multilayered flexible battery interconnect comprises insulating layers and two conductive layers, stacked together and positioned between the insulating layers. One conductive layer is thicker than the other. The thinner conductive layer comprises flexible tabs for connecting to batteries and, in some examples, comprises voltage sense traces. The smaller thickness of these flexible tabs ensures welding quality and allows using less energy during welding. The battery cell contacts, to which these flexible tabs are welded, can be significantly thicker. Furthermore, the smaller thickness enables fusible link integration into flexible tabs. At the same time, the two conductive layers collectively conduct current within the interconnect, with the thicker layer enhancing the overall current-carrying capacity. The two conductive layers can be welded together to ensure electric connections and mechanical support.

IPC Classes  ?

• H01M 50/526 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the material having a layered structure
• H01M 50/516 - Methods for interconnecting adjacent batteries or cells by welding, soldering or brazing
• H01M 50/522 - Inorganic material
• H01M 50/533 - Electrode connections inside a battery casing characterised by the shape of the leads or tabs

Abstract

Provided are multilayered flexible battery interconnects for interconnecting batteries in battery packs and methods of fabricating thereof. A multilayered flexible battery interconnect comprises two insulating layers and two conductive layers, stacked together and positioned between the insulating layers. One conductive layer is thicker than the other. The thinner conductive layer comprises flexible tabs for connecting to batteries and, in some examples, comprises voltage sense traces. The smaller thickness of these flexible tabs ensures higher welding quality and allows using less energy during welding. The battery cell contacts, to which these flexible tabs ensures are welded, can be significantly thicker. Furthermore, the smaller thickness enables fusible link integration into flexible tabs. At the same time, the two conductive layers collectively conduct current within the interconnect, with the thicker layer enhancing the overall current-carrying capacity. The two conductive layers can be welded together to ensure the electrical connections and mechanical support.

IPC Classes  ?

• H01M 50/526 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the material having a layered structure
• H01M 50/503 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the shape of the interconnectors
• H01M 50/521 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the material
• H01M 50/522 - Inorganic material
• H01M 50/516 - Methods for interconnecting adjacent batteries or cells by welding, soldering or brazing
• H01M 50/531 - Electrode connections inside a battery casing

Abstract

A connector for connecting a flexible interconnect circuit includes a base, having a first set of protrusions and a second set of protrusions. The first set of protrusions and the second set of protrusions are configured to secure the flexible interconnect circuit at a first set of apertures and a second set of apertures of the flexible interconnect circuit, respectively. The first set of protrusions may be positioned at a first distance from the second set of protrusions on the base. The first set of apertures may be positioned on the flexible interconnect circuit at a second distance, greater than the first distance, from the second set of apertures. The base causes the flexible interconnect circuit into an arched configuration when the apertures are secured to the respective protrusions. The connector further includes a cover piece configured to secure the flexible interconnect circuit in the arched configuration.

IPC Classes  ?

• H01R 12/77 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
• H01R 12/61 - Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

Described herein are circuit assemblies comprising flexible interconnect circuits and/or other components connected to these circuits. In some examples, conductive elements of different circuits are connected with support structures, such as rivets. Furthermore, conductive elements of the same circuit can be interconnected. In some examples, a conductive element of a circuit is connected to a printed circuit board (or other devices) using a conductor-joining structure. Interconnecting different circuits involves stacking these circuits such that the conductive element in one circuit overlaps with the conductive element in another circuit. A support structure protrudes through both conductive elements and any other components positioned in between, such as dielectric and/or adhesive layers. This structure electrically connects the conductive elements and also compresses the conductive elements toward each other. For example, a rivet is used with the rivet heads contacting one or two conductive elements, e.g., directly interfacing their outer-facing sides.

IPC Classes  ?

• H01R 13/24 - Contacts for co-operating by abutting resilientContacts for co-operating by abutting resiliently mounted
• H01R 12/70 - Coupling devices
• H01R 12/71 - Coupling devices for rigid printing circuits or like structures

Abstract

A connector for connecting a flexible interconnect circuit comprises a base comprising a first set of protrusions and a second set of protrusions. The first set of protrusions and second set of protrusions are configured to secure the flexible interconnect circuit at a first set of apertures and a second set of apertures of the flexible interconnect circuit, respectively. The first set of protrusions may be positioned at a first distance from the second set of protrusions on the base. The first set of apertures may be positioned on the flexible interconnect circuit at a second distance, greater than the first distance, from the second set of apertures. The base causes the flexible interconnect circuit into an arched configuration when the apertures are secured to the respective protrusions. The connector further comprises a cover piece configured to secure the flexible interconnect circuit in the arched configuration.

IPC Classes  ?

• H01R 12/79 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
• H01R 13/46 - BasesCases
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

Described herein are circuit assemblies comprising flexible interconnect circuits and/or other components connected to these circuits. In some examples, conductive elements of different circuits are connected with support structures, such as rivets. Furthermore, conductive elements of the same circuit can be interconnected. In some examples, a conductive element of a circuit is connected to a printed circuit board (or other devices) using a conductor-joining structure. Interconnecting different circuits involves stacking these circuits such that the conductive element in one circuit overlaps with the conductive element in another circuit. A support structure protrudes through both conductive elements and any other components positioned in between, such as dielectric and/or adhesive layers. This structure electrically connects the conductive elements and also compresses the conductive elements toward each other. For example, a rivet is used with the rivet heads contacting one or two conductive elements, e.g., directly interfacing their outer-facing sides.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/36 - Assembling printed circuits with other printed circuits

Abstract

Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/02 - Printed circuits Details
• H01B 11/00 - Communication cables or conductors
• H05K 1/03 - Use of materials for the substrate

Abstract

Provided are terminal-free connectors for flexible interconnect circuits. A connector comprises a housing chamber defined by at least a first side wall and a second side wall oppositely positioned about the base. An edge support is positioned at each of the first side wall and the second side wall. The edge supports allow for precise placement of the flexible interconnect circuit inside the housing chamber. A cover piece is coupled to the base via a first hinge, and is configured to move between a released position and a clamped position. The cover piece includes a clamp portion securing the flexible interconnect circuit against the edge supports in the clamped position. A slider may be configured to move between an extended position and an inserted position within the housing chamber, and may include a convex upper surface configured to urge the flexible interconnect circuit upwards in the inserted position.

IPC Classes  ?

• H01R 3/00 - Electrically-conductive connections not otherwise provided for
• H01R 12/61 - Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
• H01R 13/24 - Contacts for co-operating by abutting resilientContacts for co-operating by abutting resiliently mounted
• H01R 13/50 - BasesCases formed as an integral body
• H01R 12/77 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures

Abstract

Provided are interconnect circuits and methods of forming thereof. A method may involve laminating a substrate to a conductive layer followed by patterning the conductive layer. This patterning operation forms individual conductive portions, which may be also referred to as traces or conductive islands. The substrate supports these portions relative to each other during and after patterning. After patterning, an insulator may be laminated to the exposed surface of the patterned conductive layer. At this point, the conductive layer portions are also supported by the insulator, and the substrate may optionally be removed, e.g., together with undesirable portions of the conductive layer. Alternatively, the substrate may be retained as a component of the circuit and the undesirable portions of the patterned conductive layer may be removed separately. These approaches allow using new patterning techniques as well as new materials for substrates and/or insulators.

IPC Classes  ?

• H05K 3/20 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
• H01M 50/519 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing comprising printed circuit boards [PCB]
• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
• H05K 3/44 - Manufacturing insulated metal core circuits

Abstract

Provided are interconnects for interconnecting a set of battery cells, assemblies comprising these interconnects, methods of forming such interconnects, and methods of forming such assemblies. An interconnect includes a conductor comprising two portions electrically isolated from each other. At least one portion may include two contacts for connecting to battery cells and a fuse forming an electrical connection between these two contacts. The interconnect may also include an insulator adhered to the conductor and mechanically supporting the two portions of the conductor. The insulator may include an opening such that the fuse overlaps with this opening, and the opening does not interfere with operation of the fuse. In some embodiments, the fuse may not directly interface with any other structures. Furthermore, the interconnect may include a temporary substrate adhered to the insulator such that the insulator is disposed between the temporary substrate and the conductor.

IPC Classes  ?

• H01M 50/581 - Devices or arrangements for the interruption of current in response to temperature
• H01M 10/48 - Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
• H01M 50/503 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the shape of the interconnectors
• H01M 50/522 - Inorganic material
• H01M 50/526 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing characterised by the material having a layered structure
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H01M 10/42 - Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
• H05K 1/02 - Printed circuits Details

Goods & Services

Electrical interconnect cables; flexible electrical circuits; flexible circuit boards; flexible electric circuits for power signal transmission in solar batteries, LEDs, and batteries; high-conductance circuits integrating wiring for busing, fusing, voltage monitoring, and temperature monitoring; battery cables; battery modules; automotive battery packs; wire harnesses for vehicle electrical wiring and batteries; electrical circuit boards; electronic control circuits for lighting fixtures

Abstract

Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H01B 11/00 - Communication cables or conductors
• H05K 1/03 - Use of materials for the substrate

Abstract

Provided are terminal-free connectors for flexible interconnect circuits. A connector for connecting to a flexible interconnect circuit comprises a base comprising a housing chamber defined by at least a first side wall and a second side wall that are oppositely positioned about the base. A circuit clamp is coupled to the base via a first hinge, and is configured to move between a released position and a clamped position. A cover piece is coupled to the base via a second hinge, and is configured to move between an open position and a closed position. The circuit clamp is configured to secure the flexible interconnect circuit between the base and the circuit clamp in the clamped position. One or more protrusions on the circuit clamp are each configured to interface with a socket within the first or second side wall to secure the circuit clamp in the clamped position.

IPC Classes  ?

• H01R 12/77 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
• H01R 12/59 - Fixed connections for flexible printed circuits, flat or ribbon cables or like structures

Abstract

Provided are terminal-free connectors for flexible interconnect circuits. A connector comprises a housing chamber defined by at least a first side wall and a second side wall oppositely positioned about the base. An edge support is positioned at each of the first side wall and the second side wall. The edge supports allow for precise placement of the flexible interconnect circuit inside the housing chamber. A cover piece is coupled to the base via a first hinge, and is configured to move between a released position and a clamped position. The cover piece includes a clamp portion securing the flexible interconnect circuit against the edge supports in the clamped position. A slider may be configured to move between an extended position and an inserted position within the housing chamber, and may include a convex upper surface configured to urge the flexible interconnect circuit upwards in the inserted position.

IPC Classes  ?

• H01R 3/00 - Electrically-conductive connections not otherwise provided for
• H01R 12/61 - Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
• H01R 13/24 - Contacts for co-operating by abutting resilientContacts for co-operating by abutting resiliently mounted
• H01R 13/50 - BasesCases formed as an integral body
• H01R 12/77 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures

Abstract

Provided are terminal-free connectors for flexible interconnect circuits. A connector comprises a housing chamber defined by at least a first side wall and a second side wall oppositely positioned about the base. An edge support is positioned at each of the first side wall and the second side wall. The edge supports allow for precise placement of the flexible interconnect circuit inside the housing chamber. A cover piece is coupled to the base via a first hinge, and is configured to move between a released position and a clamped position. The cover piece includes a clamp portion securing the flexible interconnect circuit against the edge supports in the clamped position. A slider may be configured to move between an extended position and an inserted position within the housing chamber, and may include a convex upper surface configured to urge the flexible interconnect circuit upwards in the inserted position.

IPC Classes  ?

• H01R 12/61 - Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
• H01R 13/46 - BasesCases

Abstract

Provided are terminal-free connectors for flexible interconnect circuits. A connector for connecting to a flexible interconnect circuit comprises a base comprising a housing chamber defined by at least a first side wall and a second side wall that are oppositely positioned about the base. A circuit clamp is coupled to the base via a first hinge, and is configured to move between a released position and a clamped position. A cover piece is coupled to the base via a second hinge, and is configured to move between an open position and a closed position. The circuit clamp is configured to secure the flexible interconnect circuit between the base and the circuit clamp in the clamped position. One or more protrusions on the circuit clamp are each configured to interface with a socket within the first or second side wall to secure the circuit clamp in the clamped position.

IPC Classes  ?

• H01R 12/79 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
• H01R 13/46 - BasesCases

Abstract

Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H01B 11/00 - Communication cables or conductors
• H05K 1/03 - Use of materials for the substrate

Abstract

Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a HF signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H01P 3/08 - MicrostripsStrip lines

Abstract

Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H01B 11/00 - Communication cables or conductors
• H05K 1/03 - Use of materials for the substrate

Abstract

Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead with a width-to-thickness ratio of at least 2. This ratio provides for a lower thickness profile and enhances heat transfer from the harness to the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The same sheet may be used to form other components of the harness. The conductor trace also comprises a connecting end, monolithic with the conductor lead. The width-to-thickness ratio of the connecting end may be less than that of the conductor trace, allowing for the connecting end to be directly mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width-to-thickness ratio, which may be close to 1.

IPC Classes  ?

• H01B 7/04 - Flexible cables, conductors, or cords, e.g. trailing cables
• H01R 12/59 - Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
• H01B 7/08 - Flat or ribbon cables
• H05K 1/02 - Printed circuits Details
• B60J 5/04 - Doors arranged at the vehicle sides
• B60R 16/02 - Electric or fluid circuits specially adapted for vehicles and not otherwise provided forArrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric
• H01B 7/00 - Insulated conductors or cables characterised by their form
• H01R 43/20 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
• H01R 12/69 - Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal deformable terminals e.g. crimping terminals
• H01B 7/42 - Insulated conductors or cables characterised by their form with arrangements for heat dissipation or conduction
• H01B 13/012 - Apparatus or processes specially adapted for manufacturing conductors or cables for manufacturing wire harnesses

Abstract

Provided are interconnects for interconnecting a set of battery cells, assemblies comprising these interconnects, methods of forming such interconnects, and methods of forming such assemblies. An interconnect includes a conductor comprising two portions electrically isolated from each other. At least one portion may include two contacts for connecting to battery cells and a fuse forming an electrical connection between these two contacts. The interconnect may also include an insulator adhered to the conductor and mechanically supporting the two portions of the conductor. The insulator may include an opening such that the fuse overlaps with this opening, and the opening does not interfere with operation of the fuse. In some embodiments, the fuse may not directly interface with any other structures. Furthermore, the interconnect may include a temporary substrate adhered to the insulator such that the insulator is disposed between the temporary substrate and the conductor.

IPC Classes  ?

• H01M 2/34 - Current-conducting connections for cells with provision for preventing undesired use or discharge
• H01M 2/20 - Current-conducting connections for cells
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H01M 10/48 - Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
• H01M 10/42 - Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
• H05K 1/02 - Printed circuits Details

Abstract

Provided are interconnect circuits for combined electrical and thermal energy transfer to devices connected to these circuits. Also provided are methods of fabricating such interconnect circuits. An interconnect circuit may include an electro-thermal conductor and at least one insulator providing support to different portions of the conductor with respect to each other. The insulator may include one or more openings for electrical connections and/or heat exchange with the electro-thermal conductor. The portions of the conductor may be electrically isolated from each other in the final circuit. Initially, these portions may be formed from the same conductive sheet, such as a metal foil having a thickness of at least about 50 micrometers. This thickness ensures sufficient thermal transfer in addition to providing excellent electrical conductance. In some embodiments, the conductor may include a surface coating to protect its base material from oxidation, enhancing electrical connections, and/or other purposes.

IPC Classes  ?

• H01L 33/64 - Heat extraction or cooling elements
• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead with a width-to-thickness ratio of at least 2. This ratio provides for a lower thickness profile and enhances heat transfer from the harness to the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The same sheet may be used to form other components of the harness. The conductor trace also comprises a connecting end, monolithic with the conductor lead. The width-to-thickness ratio of the connecting end may be less than that of the conductor trace, allowing for the connecting end to be directly mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width-to-thickness ratio, which may be close to 1.

IPC Classes  ?

• H01R 12/59 - Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
• H05K 1/02 - Printed circuits Details
• B60J 5/04 - Doors arranged at the vehicle sides
• B60R 16/02 - Electric or fluid circuits specially adapted for vehicles and not otherwise provided forArrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric
• H01B 7/00 - Insulated conductors or cables characterised by their form
• H01R 43/20 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
• H01B 7/04 - Flexible cables, conductors, or cords, e.g. trailing cables
• H01B 7/08 - Flat or ribbon cables
• H01R 12/69 - Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal deformable terminals e.g. crimping terminals
• H01B 7/42 - Insulated conductors or cables characterised by their form with arrangements for heat dissipation or conduction

Abstract

Provided are interconnect circuits and methods of forming thereof. A method may involve laminating a substrate to a conductive layer followed by patterning the conductive layer. This patterning operation forms individual conductive portions, which may be also referred to as traces or conductive islands. The substrate supports these portions relative to each other during and after patterning. After patterning, an insulator may be laminated to the exposed surface of the patterned conductive layer. At this point, the conductive layer portions are also supported by the insulator, and the substrate may optionally be removed, e.g., together with undesirable portions of the conductive layer. Alternatively, the substrate may be retained as a component of the circuit and the undesirable portions of the patterned conductive layer may be removed separately. These approaches allow using new patterning techniques as well as new materials for substrates and/or insulators.

IPC Classes  ?

• H05K 3/20 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Abstract

Provided are interconnect circuits and methods of forming thereof. A method may involve laminating a substrate to a conductive layer followed by patterning the conductive layer. This patterning operation forms individual conductive portions, which may be also referred to as traces or conductive islands. The substrate supports these portions relative to each other during and after patterning. After patterning, an insulator may be laminated to the exposed surface of the patterned conductive layer. At this point, the conductive layer portions are also supported by the insulator, and the substrate may be removed, e.g., together with undesirable portions of the conductive layer. If the substrate is removed and is not a part of the interconnect circuit, it may be damaged during patterning. Alternatively, the substrate is retained as a component of the circuit. These approaches allow using new patterning techniques as well as new materials for substrates and/or insulators.

IPC Classes  ?

• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead with a width-to-thickness ratio of at least 2. This ratio provides for a lower thickness profile and enhances heat transfer from the harness to the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The same sheet may be used to form other components of the harness. The conductor trace also comprises a connecting end, monolithic with the conductor lead. The width-to-thickness ratio of the connecting end may be less than that of the conductor trace, allowing for the connecting end to be directly mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width-to-thickness ratio, which may be close to 1.

IPC Classes  ?

• B60R 16/02 - Electric or fluid circuits specially adapted for vehicles and not otherwise provided forArrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric
• H01R 12/59 - Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
• H01R 12/65 - Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal
• H01R 12/69 - Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal deformable terminals e.g. crimping terminals
• H01B 7/08 - Flat or ribbon cables

Abstract

Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead with a width-to-thickness ratio of at least 2. This ratio provides for a lower thickness profile and enhances heat transfer from the harness to the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The same sheet may be used to form other components of the harness. The conductor trace also comprises a connecting end, monolithic with the conductor lead. The width-to-thickness ratio of the connecting end may be less than that of the conductor trace, allowing for the connecting end to be directly mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width-to-thickness ratio, which may be close to 1.

IPC Classes  ?

• H01R 12/59 - Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
• H01R 12/69 - Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal deformable terminals e.g. crimping terminals
• H01B 7/08 - Flat or ribbon cables
• H01B 7/04 - Flexible cables, conductors, or cords, e.g. trailing cables
• H01R 43/20 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
• H01B 7/00 - Insulated conductors or cables characterised by their form
• H05K 1/02 - Printed circuits Details
• B60R 16/02 - Electric or fluid circuits specially adapted for vehicles and not otherwise provided forArrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric
• B60J 5/04 - Doors arranged at the vehicle sides
• H01B 7/42 - Insulated conductors or cables characterised by their form with arrangements for heat dissipation or conduction

Abstract

Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead a width to thickness ratio of at least 2, which provides for a lower thickness profile and enhances thermal conductivity with the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The conductor trace also comprises connecting end, monolithic with the conductor lead. The width to thickness ratio of the connecting end is less than that of conductor trace, allowing for direct mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width to thickness ratio, which in some examples may be close to 1.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/00 - Printed circuits
• H05K 7/02 - Arrangements of circuit components or wiring on supporting structure
• B60R 16/023 - Electric or fluid circuits specially adapted for vehicles and not otherwise provided forArrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric for transmission of signals between vehicle parts or subsystems
• B60R 16/03 - Electric or fluid circuits specially adapted for vehicles and not otherwise provided forArrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric for supply of electrical power to vehicle subsystems
• F01D 25/00 - Component parts, details, or accessories, not provided for in, or of interest apart from, other groups

Abstract

Provided are interconnect circuits for combined electrical and thermal energy transfer to devices connected to these circuits. Also provided are methods of fabricating such interconnect circuits. An interconnect circuit may include an electro-thermal conductor and at least one insulator providing support to different portions of the conductor with respect to each other. The insulator may include one or more openings for electrical connections and/or heat exchange with the electro-thermal conductor. The portions of the conductor may be electrically isolated from each other in the final circuit. Initially, these portions may be formed from the same conductive sheet, such as a metal foil having a thickness of at least about 50 micrometers. This thickness ensures sufficient thermal transfer in addition to providing excellent electrical conductance. In some embodiments, the conductor may include a surface coating to protect its base material from oxidation, enhancing electrical connections, and/or other purposes.

IPC Classes  ?

• H01L 33/64 - Heat extraction or cooling elements
• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

Provided are interconnects for interconnecting a set of battery cells, assemblies comprising these interconnects, methods of forming such interconnects, and methods of forming such assemblies. An interconnect includes a conductor comprising two portions electrically isolated from each other. At least one portion may include two contacts for connecting to battery cells and a fuse forming an electrical connection between these two contacts. The interconnect may also include an insulator adhered to the conductor and mechanically supporting the two portions of the conductor. The insulator may include an opening such that the fuse overlaps with this opening, and the opening does not interfere with operation of the fuse. In some embodiments, the fuse may not directly interface with any other structures. Furthermore, the interconnect may include a temporary substrate adhered to the insulator such that the insulator is disposed between the temporary substrate and the conductor.

IPC Classes  ?

• H01R 9/16 - Fastening of connecting parts to base or caseInsulating connecting parts from base or case
• H01R 4/58 - Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one anotherMeans for effecting or maintaining such contactElectrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
• H01R 13/68 - Structural association with built-in electrical component with built-in fuse
• H01M 2/20 - Current-conducting connections for cells

Abstract

Provided are interconnect circuits for interconnecting arrays of devices and methods of forming these interconnect circuits as well as connecting these circuits to the devices. An interconnect circuit may include a conductive layer and one or more insulating layers. The conductive layer may be patterned with openings defining contact pads, such that each pad is used for connecting to a different electrical terminal of the interconnected devices. In some embodiments, each contact pad is attached to the rest of the conductive layer by a fusible link formed from the same conductive layer as the contact pad. The fusible link controls the current flow to and from this contact pad. The insulating layer is laminated to the conductive layer and provides support to the contacts pads. The insulating layer may also be patterned with openings, which allow forming electrical connections between the contact pads and cell terminals through the insulating layer.

IPC Classes  ?

• H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
• H01M 2/34 - Current-conducting connections for cells with provision for preventing undesired use or discharge
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H01M 2/20 - Current-conducting connections for cells
• H01M 10/48 - Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
• H05K 1/02 - Printed circuits Details
• H01M 10/42 - Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells

Abstract

Provided are interconnects for interconnecting a set of battery cells, assemblies comprising these interconnects, methods of forming such interconnects, and methods of forming such assemblies. An interconnect includes a conductor comprising two portions electrically isolated from each other. At least one portion may include two contacts for connecting to battery cells and a fuse forming an electrical connection between these two contacts. The interconnect may also include an insulator adhered to the conductor and mechanically supporting the two portions of the conductor. The insulator may include an opening such that the fuse overlaps with this opening, and the opening does not interfere with operation of the fuse. In some embodiments, the fuse may not directly interface with any other structures. Furthermore, the interconnect may include a temporary substrate adhered to the insulator such that the insulator is disposed between the temporary substrate and the conductor.

IPC Classes  ?

• H01M 2/20 - Current-conducting connections for cells
• H01M 2/34 - Current-conducting connections for cells with provision for preventing undesired use or discharge
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H01M 10/48 - Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte
• H01M 10/42 - Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
• H05K 1/02 - Printed circuits Details

Abstract

Provided are interconnect circuits for combined electrical and thermal energy transfer to devices connected to these circuits. Also provided are methods of fabricating such interconnect circuits. An interconnect circuit may include an electro-thermal conductor and at least one insulator providing support to different portions of the conductor with respect to each other. The insulator may include one or more openings for electrical connections and/or heat exchange with the electro-thermal conductor. The portions of the conductor may be electrically isolated from each other in the final circuit. Initially, these portions may be formed from the same conductive sheet, such as a metal foil having a thickness of at least about 50 micrometers. This thickness ensures sufficient thermal transfer in addition to providing excellent electrical conductance. In some embodiments, the conductor may include a surface coating to protect its base material from oxidation, enhancing electrical connections, and/or other purposes.

IPC Classes  ?

• H01L 29/40 - Electrodes
• H05K 1/02 - Printed circuits Details
• H01L 33/64 - Heat extraction or cooling elements
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

Provided are interconnect circuits for combined electrical and thermal energy transfer to devices connected to these circuits. Also provided are methods of fabricating such interconnect circuits. An interconnect circuit may include an electro-thermal conductor and at least one insulator providing support to different portions of the conductor with respect to each other. The insulator may include one or more openings for electrical connections and/or heat exchange with the electro-thermal conductor. The portions of the conductor may be electrically isolated from each other in the final circuit. Initially, these portions may be formed from the same conductive sheet, such as a metal foil having a thickness of at least about 50 micrometers. This thickness ensures sufficient thermal transfer in addition to providing excellent electrical conductance. In some embodiments, the conductor may include a surface coating to protect its base material from oxidation, enhancing electrical connections, and/or other purposes.

IPC Classes  ?

• H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
• H01L 23/12 - Mountings, e.g. non-detachable insulating substrates

Abstract

Provided are interconnect circuits for combined electrical and thermal energy transfer to devices connected to these circuits. Also provided are methods of fabricating such interconnect circuits. An interconnect circuit may include an electro-thermal conductor and at least one insulator providing support to different portions of the conductor with respect to each other. The insulator may include one or more openings for electrical connections and/or heat exchange with the electro-thermal conductor. The portions of the conductor may be electrically isolated from each other in the final circuit. Initially, these portions may be formed from the same conductive sheet, such as a metal foil having a thickness of at least about 50 micrometers. This thickness ensures sufficient thermal transfer in addition to providing excellent electrical conductance. In some embodiments, the conductor may include a surface coating to protect its base material from oxidation, enhancing electrical connections, and/or other purposes.

IPC Classes  ?

• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H01L 33/64 - Heat extraction or cooling elements
• H05K 1/02 - Printed circuits Details

Abstract

Provided are interconnect circuits for interconnecting arrays of battery cells and methods of forming these interconnect circuits as well as connecting these circuits to the battery cells. An interconnect circuit may include a conductive layer and one or more insulating layers. The conductive layer may be patterned with openings defining contact pads, such that each pad is used for connecting to a different battery cell terminal. In some embodiments, each contact pad is attached to the rest of the conductive layer by a fusible link formed from the same conductive layer as the contact pad. The fusible link controls the current flow to and from this contact pad. The insulating layer is laminated to the conductive layer and provides support to the contacts pads. The insulating layer may also be patterned with openings, which allow forming electrical connections between the contact pads and cell terminals through the insulating layer.

IPC Classes  ?

• H01M 2/20 - Current-conducting connections for cells
• H01M 2/26 - Electrode connections
• H01M 2/10 - Mountings; Suspension devices; Shock absorbers; Transport or carrying devices; Holders

Abstract

Provided are interconnect circuits for interconnecting arrays of battery cells and methods of forming these interconnect circuits as well as connecting these circuits to the battery cells. An interconnect circuit may include a conductive layer and one or more insulating layers. The conductive layer may be patterned with openings defining contact pads, such that each pad is used for connecting to a different battery cell terminal. In some embodiments, each contact pad is attached to the rest of the conductive layer by a fusible link formed from the same conductive layer as the contact pad. The fusible link controls the current flow to and from this contact pad. The insulating layer is laminated to the conductive layer and provides support to the contacts pads. The insulating layer may also be patterned with openings, which allow forming electrical connections between the contact pads and cell terminals through the insulating layer.

IPC Classes  ?

• H01L 23/00 - Details of semiconductor or other solid state devices
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H01M 2/20 - Current-conducting connections for cells
• H01M 10/42 - Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells

Abstract

Provided are interconnect circuits for interconnecting arrays of battery cells and methods of forming these interconnect circuits as well as connecting these circuits to the battery cells. An interconnect circuit may include a conductive layer and one or more insulating layers. The conductive layer may be patterned with openings defining contact pads, such that each pad is used for connecting to a different battery cell terminal. In some embodiments, each contact pad is attached to the rest of the conductive layer by a fusible link formed from the same conductive layer as the contact pad. The fusible link controls the current flow to and from this contact pad. The insulating layer is laminated to the conductive layer and provides support to the contacts pads. The insulating layer may also be patterned with openings, which allow forming electrical connections between the contact pads and cell terminals through the insulating layer.

IPC Classes  ?

• B29C 65/48 - Joining of preformed partsApparatus therefor using adhesives
• B32B 37/26 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the laminating process, e.g. release layers or pressure equalising layers
• B32B 38/04 - Punching, slitting or perforating
• B32B 38/10 - Removing layers, or parts of layers, mechanically or chemically
• H01M 4/139 - Processes of manufacture
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
• H01M 4/04 - Processes of manufacture in general

Abstract

Layers of conductive foil and insulating material are configured to interconnect an array of rear-contact solar cells. An embodiment provides that the layer of conductive foil may be patterned to form repeating sets of electrically isolated, interdigitated fingers. Each set of interdigitated fingers may be used to connect the positive polarity contacts of a first rear-contact solar cell to the negative polarity contacts of a second, adjacent rear-contact cell. The insulating layer is attached to the patterned conductive foil and provides mechanical support and/or electrical isolation. In some embodiments, a protective backsheet may be disposed beneath the conductive foil and/or insulating layer to provide further mechanical support and environmental protection. In some embodiments, the layers of conductive foil and insulating material may be incorporated as an interconnect circuit in a rear-contact PV module.

IPC Classes  ?

• H05K 3/36 - Assembling printed circuits with other printed circuits
• H05K 1/02 - Printed circuits Details
• H01L 31/05 - Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/20 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
• H01L 31/049 - Protective back sheets
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

A rear-contact solar cell interconnect is disclosed. The rear-contact solar cell interconnect includes a first conductive foil with an opening and a second conductive foil. The first conductive foil is arranged to be electrically connected to a first polarity contact of a solar cell. The second conductive foil is arranged to be electrically connected to a second polarity contact of the solar cell through the opening of the first conductive foil. The solar cell includes a first surface arranged to receive solar irradiation and a second surface substantially opposite the first surface. The first polarity contact and the second polarity contact are provided on the second surface of the solar cell.

IPC Classes  ?

• H01L 31/0224 - Electrodes
• H01L 31/05 - Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
• H01L 31/02 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof - Details