Thin Film Electronics ASA

Norway

Back to Profile

1-40 of 40 for Thin Film Electronics ASA Sort by
Query
Patent
Aggregations Reset Report
Jurisdiction
        World 39
        United States 1
Date
2020 1
Before 2020 39
IPC Class
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips 9
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier 5
C01B 33/04 - Hydrides of silicon 4
C08G 77/60 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon in which all the silicon atoms are connected by linkages other than oxygen atoms 4
G08B 13/24 - Electrical actuation by interference with electromagnetic field distribution 4
See more
Found results for  patents

1.

BARRIER STACKS FOR PRINTED AND/OR THIN FILM ELECTRONICS METHODS OF MANUFACTURING THE SAME, AND METHOD OF CONTROLLING A THRESHOLD VOLTAGE OF A THIN FILM TRANSISTOR

      
Application Number US2019057359
Publication Number 2020/086532
Status In Force
Filing Date 2019-10-22
Publication Date 2020-04-30
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor
  • Sreenivasan, Raghav
  • Chandra, Aditi
  • Jeon, Yoocharn

Abstract

The present disclosure pertains to a barrier stack for thin film and/or printed electronics on substrates having a diffusible element and/or species, methods of manufacturing the same, and methods of inhibiting or preventing diffusion of a diffusible element or species in a substrate using the same. The barrier stack includes a first barrier layer on the substrate, an insulator layer on the first barrier layer, a second barrier layer on the insulator layer in a first region of the substrate, and a third barrier layer on the insulator layer in a second region of the substrate and on the second barrier layer in the first region. Each of the second and third barrier layers has a thickness less than that of the first barrier layer.

IPC Classes  ?

  • H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
  • H01L 23/532 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
  • H01L 29/786 - Thin-film transistors

2.

SYSTEM AND METHOD FOR PROVIDING AUGMENTED REALITY EXPERIENCE TO OBJECTS USING WIRELESS TAGS

      
Application Number US2019019392
Publication Number 2019/168780
Status In Force
Filing Date 2019-02-25
Publication Date 2019-09-06
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor
  • Delay, Christian
  • Ramkunar, Karthik

Abstract

Wireless tags are associated with and used to provide augmented reality (AR) experiences to users of mobile computing devices. The AR can be included with common articles and objects to enhance a user's interaction and enjoyment of such items. The tag information can be used to readily identify objects and articles without requiring significant object recognition tools and related latencies.

IPC Classes  ?

  • G06F 16/58 - Retrieval characterised by using metadata, e.g. metadata not derived from the content or metadata generated manually
  • G06Q 30/02 - MarketingPrice estimation or determinationFundraising

3.

SYSTEM AND METHOD FOR AUTOMATICALLY CODING WIRELESS TAGS

      
Application Number US2019019407
Publication Number 2019/168785
Status In Force
Filing Date 2019-02-25
Publication Date 2019-09-06
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor
  • Ashkenazi, Zvika
  • Ramkunar, Karthik

Abstract

Wireless tag identification codes can be requested through a mobile application coordinating with a cloud service based tag management system. The codes are used to encode new tags to include readily accessible web content (such as URLs) associated with commercial product literature including marketing.

IPC Classes  ?

  • G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips

4.

SYSTEM AND METHOD FOR MANAGING WIRELESS TAG FUNCTIONALITY

      
Application Number US2019019397
Publication Number 2019/168782
Status In Force
Filing Date 2019-02-25
Publication Date 2019-09-06
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor Ashkenazi, Zvika

Abstract

Wireless tags and related mobile applications include a combination of both public and hidden functionality. Tag hidden features can be unlocked with a customized mobile application coordinating with a server through two separate channels. Conversely hidden features of a mobile application are made accessible through reading coded wireless tags. The combination of tag and mobile application afford a simplified and convenient form of two factor authentication.

IPC Classes  ?

  • G07G 1/14 - Systems including one or more distant stations co-operating with a central processing unit
  • H04W 4/06 - Selective distribution of broadcast services, e.g. multimedia broadcast multicast service [MBMS]Services to user groupsOne-way selective calling services
  • H04W 4/18 - Information format or content conversion, e.g. adaptation by the network of the transmitted or received information for the purpose of wireless delivery to users or terminals

5.

SYSTEM AND METHOD FOR SECURELY TRANSFERRING OWNERSHIP OF WIRELESS TAGS

      
Application Number US2019019402
Publication Number 2019/168783
Status In Force
Filing Date 2019-02-25
Publication Date 2019-09-06
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor Ashkenazi, Zvika

Abstract

Ownership of wireless tags can be managed through a mobile application coordinating with a cloud service-based transaction management system. Tag ownership can be transferred and recorded between two users using mobile devices with different levels of security and context restrictions to accommodate different applications.

IPC Classes  ?

  • G06K 7/10 - Methods or arrangements for sensing record carriers by electromagnetic radiation, e.g. optical sensingMethods or arrangements for sensing record carriers by corpuscular radiation
  • G06Q 20/40 - Authorisation, e.g. identification of payer or payee, verification of customer or shop credentialsReview and approval of payers, e.g. check of credit lines or negative lists

6.

PRINTED AND/OR THIN FILM INTEGRATED CIRCUIT WITH INTEGRATED ANTENNA, AND METHODS OF MAKING AND USING THE SAME

      
Application Number US2019019860
Publication Number 2019/169003
Status In Force
Filing Date 2019-02-27
Publication Date 2019-09-06
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor
  • Mukherjee, Somnath
  • Chandra, Aditi
  • Ito, Mao
  • Kamath, Arvind
  • Bruner, Scott
  • Kundu, Sambhu
  • Deshpande, Anand

Abstract

A wireless communication device having an integrated antenna, and methods for making and using the same are disclosed. The device generally includes (a) a substrate; (b) an integrated circuit (IC) comprising a plurality of printed and/or thin film layers and/or structures on the substrate, (c) a dielectric or insulator layer in at least one area of the substrate other than the IC; and (d) an antenna on the dielectric or insulator layer, comprising one or more metal traces. The plurality of printed and/or thin film layers and/or structures include an uppermost layer of metal. The antenna has (i) an inner terminal continuous with the uppermost layer of metal or connected to the uppermost layer of metal through one or more contacts, and (ii) an outer terminal connected to the uppermost layer of metal through one or more contacts and optionally a metal bridge or strap

IPC Classes  ?

  • H01Q 1/22 - SupportsMounting means by structural association with other equipment or articles
  • H01Q 1/24 - SupportsMounting means by structural association with other equipment or articles with receiving set
  • H01Q 1/52 - Means for reducing coupling between antennas Means for reducing coupling between an antenna and another structure
  • H01Q 5/364 - Creating multiple current paths

7.

COMMUNICATION DEVICES WITH DIFFERENTIABLE OPERATING PATHS OR STATES AND METHODS OF MAKING AND USING THE SAME

      
Application Number US2019014820
Publication Number 2019/147721
Status In Force
Filing Date 2019-01-23
Publication Date 2019-08-01
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor
  • Ashkenazi, Zvika
  • Farrell, Lewis

Abstract

An apparatus and a method of using the apparatus are disclosed. The apparatus comprises one or more manipulable or foldable substrates, a wireless communication device comprising one or more antennas, and one or more signal blocking structures. The one or more antennas are inoperable when the one or more substrates are in the closed, sealed, or packaged state, and the one or more antennas are operable when the one or more substrates are in the open state. The method comprises using the apparatus by opening the substrate and transmitting and receiving signals to and from the antenna(s). An apparatus comprising a package or container comprising a substrate, the wireless communication device, and a ferrite layer is also disclosed. In such an apparatus, the wireless communication device has first and second major surfaces opposed to each other, and the ferrite layer overlaps with the antenna. The ferrite layer shields the wireless communication device on the package or container such that the wireless communication device receives and transmits or broadcasts wireless signals when a reader accesses the wireless communication device from one of the first and second major surfaces, and the wireless communication device cannot receive, transmit or broadcast wireless signals when the reader accesses the wireless communication device from the other of the first and second major surfaces.

IPC Classes  ?

  • G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
  • G06K 19/00 - Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine

8.

Wireless mechanism for detecting an open or closed container, and methods of making and using the same

      
Application Number 16309673
Grant Number 11119158
Status In Force
Filing Date 2017-06-19
First Publication Date 2019-05-02
Grant Date 2021-09-14
Owner
  • Thin Film Electronics ASA (Norway)
  • GlaxoSmithKline Intellectual Property Development Limited (United Kingdom)
Inventor
  • Mukherjee, Somnath
  • Godfrey, James

Abstract

An electronic device including a continuity sensor and electrical circuitry configured to detect and report the continuity state of an article, container or product packaging is disclosed. The continuity sensor includes a first substrate with first and second coils thereon, and a second substrate with a third coil thereon. The first coil has an integrated circuit electrically connected thereto. The first substrate is part of, or is attached or secured to a part of the article, container or packaging. The second substrate is another part of, or is attached or secured to another part of the article, container or packaging. One of the article, container or packaging parts is (re)movable with respect to the other part. The first and second coils have one coupling when the article, container or packaging is closed or sealed, and a different coupling when the article, container or packaging is open or unsealed.

IPC Classes  ?

  • G01R 31/50 - Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
  • G01D 5/20 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying inductance, e.g. by a movable armature
  • G08B 13/12 - Mechanical actuation by the breaking or disturbance of stretched cords or wires
  • G08B 13/24 - Electrical actuation by interference with electromagnetic field distribution
  • G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
  • B65D 79/02 - Arrangements or devices for indicating incorrect storage or transport
  • G01N 27/02 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
  • A61M 15/00 - Inhalators
  • H04B 5/00 - Near-field transmission systems, e.g. inductive or capacitive transmission systems
  • H04Q 9/00 - Arrangements in telecontrol or telemetry systems for selectively calling a substation from a main station, in which substation desired apparatus is selected for applying a control signal thereto or for obtaining measured values therefrom

9.

SHRINKABLE PACKAGING MATERIALS WITH INTEGRATED TRANSPONDER, AND METHODS OF MAKING AND USING THE SAME

      
Application Number US2018056291
Publication Number 2019/079453
Status In Force
Filing Date 2018-10-17
Publication Date 2019-04-25
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor Chander, Alex

Abstract

A device including a heat shrink material, a transponder substrate thereon, and a transponder on the transponder substrate is disclosed. The transponder is configured to wirelessly communicate with a reader. Methods of manufacturing the device, placing a heat shrink material with an integrated transponder onto a container, and communicating information about the container, a product in the container, and/or a purchaser or user of the container are also disclosed.

IPC Classes  ?

  • B65D 55/06 - Deformable or tearable wires, strings or strips (caps or cap-like closures with tear-strips )Use of seals
  • G06K 19/04 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
  • G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K 19/067 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
  • G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
  • G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
  • G06F 3/03 - Arrangements for converting the position or the displacement of a member into a coded form

10.

SPRAY COATED SENSE LINES, SECURITY AND/OR IDENTIFICATION TAGS AND DEVICES INCLUDING THE SAME, AND METHODS OF MANUFACTURING

      
Application Number US2018046302
Publication Number 2019/036304
Status In Force
Filing Date 2018-08-10
Publication Date 2019-02-21
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor Fischer, Peter

Abstract

A security device, and methods of manufacturing the same, are disclosed. The security device comprises a first substrate having an integrated circuit thereon, the integrated circuit including (i) a continuity sensor configured to determine a continuity state of a container or package to which the first substrate is affixed, attached or adhered, and (ii) a first set of connection pads electrically connected to the continuity sensor, and one or more spray- coated sensing lines on the container, the package, or a second substrate to be affixed, attached or adhered to the container or package, the one or more spray-coated sensing lines being electrically connected to the first set of connection pads.

IPC Classes  ?

  • B65D 55/02 - Locking devicesMeans for discouraging or indicating unauthorised opening or removal of closure
  • G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
  • G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
  • G09F 3/03 - Forms or constructions of security seals

11.

LOW-TEMPERATURE DOPANT ACTIVATION PROCESS USING A CAP LAYER, AND MOS DEVICES INCLUDING THE CAP LAYER

      
Application Number US2018041270
Publication Number 2019/010488
Status In Force
Filing Date 2018-07-09
Publication Date 2019-01-10
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor
  • Sreenivasan, Raghav
  • Chandra, Aditi
  • Kamath, Arvind

Abstract

A method of making a MOS device, a MOS device containing an aluminum nitride layer, and a CMOS circuit are disclosed. The method includes depositing an aluminum nitride layer on a structure including a silicon layer, depositing a dopant ink on the structure, and diffusing the dopant through the aluminum nitride layer into the silicon layer. The structure also includes a gate oxide layer on the silicon layer and a gate on the gate oxide layer. The dopant ink includes a dopant and a solvent. The MOS device includes a silicon layer, a gate oxide layer on the silicon layer, a gate on the gate oxide layer, and an aluminum nitride layer on the gate. The silicon layer includes a dopant on opposite sides of the gate.

IPC Classes  ?

  • H01L 21/22 - Diffusion of impurity materials, e.g. doping materials, electrode materials, into, or out of, a semiconductor body, or between semiconductor regionsRedistribution of impurity materials, e.g. without introduction or removal of further dopant
  • H01L 21/228 - Diffusion of impurity materials, e.g. doping materials, electrode materials, into, or out of, a semiconductor body, or between semiconductor regionsRedistribution of impurity materials, e.g. without introduction or removal of further dopant using diffusion into, or out of, a solid from or into a liquid phase, e.g. alloy diffusion processes
  • H01L 21/318 - Inorganic layers composed of nitrides

12.

ELECTRONIC DEVICE HAVING ATTACH PADS, AN ANTENNA AND/OR AN INDUCTOR WITH PRINTED PALLADIUM THEREON, AND METHODS OF MAKING THE SAME

      
Application Number US2018031350
Publication Number 2018/208656
Status In Force
Filing Date 2018-05-07
Publication Date 2018-11-15
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor
  • Takashima, Mao
  • Chandra, Aditi

Abstract

An electronic device and methods of manufacturing the same are disclosed. One method of manufacturing the electronic device includes forming an electrical device on a first substrate, depositing a passivation layer on the electrical device, printing a palladium- containing ink on exposed aluminum pads in or on the electrical device, converting the palladium-containing ink to a palladium-containing layer, and forming a conductive pad or bump on the palladium-containing layer. The passivation layer exposes the aluminum pads.

IPC Classes  ?

  • B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
  • C09D 11/02 - Printing inks
  • C23C 18/30 - Activating
  • H01L 21/28 - Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups
  • H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
  • H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

13.

SECURITY DEVICE FOR A PACKAGE OR CONTAINER AND METHODS OF MANUFACTURING AND USING THE SAME

      
Application Number IB2018051910
Publication Number 2018/172964
Status In Force
Filing Date 2018-03-22
Publication Date 2018-09-27
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor
  • Broms, Per
  • Karlsson, Christer

Abstract

A security and/or identification device including a sensor configured to detect an opened or tampered state of a package or container to which the device is attached. In one embodiment, the security device communicates wirelessly (e.g., with an NFC or RF reader). In other embodiments, the security device includes a display and a battery. The security device generally includes a continuity sensor on a substrate and an antenna or display on the same or a different substrate. The continuity sensor is configured to be electrically connected to one or more capacitor(s). The antenna is configured to receive a first wireless signal (e.g., from the reader) and, in the absence of the battery, transmit or broadcast a second wireless signal. The display is configured to display an indicator indicating a continuity state of a package or container on which the security device is placed or to which the security device is fixed or adhered. The continuity sensor is configured to determine a continuity state of the package or container.

IPC Classes  ?

  • G08B 13/08 - Mechanical actuation by opening, e.g. of door, of window, of drawer, of shutter, of curtain, of blind
  • G08B 13/24 - Electrical actuation by interference with electromagnetic field distribution
  • G09F 3/03 - Forms or constructions of security seals

14.

CONNECTABLE SMART LABEL OR TAG, AND METHODS OF MAKING AND CONNECTING THE SAME

      
Application Number US2018020309
Publication Number 2018/160755
Status In Force
Filing Date 2018-02-28
Publication Date 2018-09-07
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor
  • Uland, David
  • Britton, Patricia
  • Fisher, Peter
  • Chandra, Aditi

Abstract

A security and/or identification device including an integrated circuit and an antenna or a battery, and methods of manufacturing and using the same, are disclosed. The integrated circuit is on a substrate to be applied, affixed or attached to a package or container, and includes a set of connection pads electrically connectable to an external component, and a memory storing a unique identification number. The antenna or battery may be on the same or a different substrate. The antenna receives a first wireless signal, transmits a second wireless signal, and enables the integrated circuit to extract power from the first wireless signal. The battery provides power to the integrated circuit. The connection pads may be electrically connectable to one or more sensing lines, and the integrated circuit may further include a continuity sensor configured to determine a continuity state of the package / container.

IPC Classes  ?

  • G08B 13/06 - Mechanical actuation by tampering with fastening
  • G08B 13/12 - Mechanical actuation by the breaking or disturbance of stretched cords or wires

15.

ASSOCIATING TAGS WITH A USER AND ASSIGNING SUCH TAGS TO PRODUCTS

      
Application Number US2018019573
Publication Number 2018/156994
Status In Force
Filing Date 2018-02-23
Publication Date 2018-08-30
Owner THIN FILM ELECTRONICS, ASA (Norway)
Inventor
  • Ashkenazi, Zvika
  • Delay, Christian

Abstract

A computer-implemented method and system for associating one or more wireless tags with one or more products is disclosed. The method comprises communicating wirelessly with the wireless tag(s) using a mobile device, associating the wireless tag(s) with a user account, and assigning at least one of the wireless tag(s) to a current product or a new product. The system comprises one or more wireless tags, a mobile device configured to communicate wirelessly with the wireless tag(s), and a storage server or cloud computer configured to (i) send, receive and store the information regarding the wireless tag(s) and the associated product and (ii) store and execute an analytics program or web application configured to track the information regarding the wireless tag(s). A computer-readable storage medium enabling the method on the mobile device and a system for managing one or more wireless tags associated with one or more products are also disclosed.

IPC Classes  ?

  • G08B 13/22 - Electrical actuation
  • H04W 4/30 - Services specially adapted for particular environments, situations or purposes
  • H04W 4/04 - in a dedicated environment, e.g. buildings or vehicles
  • G06Q 10/08 - Logistics, e.g. warehousing, loading or distributionInventory or stock management

16.

PRINTED ELECTRICAL DEVICE HAVING A POWER SWITCH WITH A HIGH OHMIC "OFF" STATE, AND METHODS OF MAKING AND USING THE SAME

      
Application Number IB2017055921
Publication Number 2018/065855
Status In Force
Filing Date 2017-09-27
Publication Date 2018-04-12
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor
  • Hagel, Olle
  • Andersson, Niklas
  • Broms, Per
  • Xie, Li
  • Danestig, Magnus

Abstract

A printed electronic display device and methods of manufacturing and using the same are disclosed. The device includes a substrate (200) having a plurality of traces (230, 232) thereon, a printed integrated circuit (210), a battery (220), a switch (240, 242), and a display. A first one of the traces (230) has a first end and a second one of the traces (232) has a second end in proximity to the first end. The printed integrated circuit is electrically connected to the first trace. The battery is electrically connected to the second trace. The switch has an ON state and an OFF state. The ON state electrically connects the first and second ends of the first and second traces, and the OFF state imparts a high ohmic resistance between the first and second ends of the first and second traces. The display receives at least one output from the printed integrated circuit.

IPC Classes  ?

  • H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
  • H05K 1/02 - Printed circuits Details
  • H01M 6/40 - Printed batteries
  • G09F 3/20 - Casings, frames, or enclosures for labels for adjustable, removable, or interchangeable labels
  • H05K 1/18 - Printed circuits structurally associated with non-printed electric components
  • H05K 1/14 - Structural association of two or more printed circuits
  • H05K 1/03 - Use of materials for the substrate
  • H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material

17.

WIRELESS MECHANISM FOR DETECTING AN OPEN OR CLOSED CONTAINER, AND METHODS OF MAKING AND USING THE SAME

      
Application Number IB2017000872
Publication Number 2017/216632
Status In Force
Filing Date 2017-06-19
Publication Date 2017-12-21
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor
  • Mukherjee, Somnath
  • Godfrey, James

Abstract

An electronic device including a continuity sensor and electrical circuitry configured to detect and report the continuity state of an article, container or product packaging is disclosed. The continuity sensor includes a first substrate with first and second coils thereon, and a second substrate with a third coil thereon. The first coil has an integrated circuit electrically connected thereto. The first substrate is part of, or is attached or secured to a part of the article, container or packaging. The second substrate is another part of, or is attached or secured to another part of the article, container or packaging. One of the article, container or packaging parts is (re)movable with respect to the other part. The first and second coils have one coupling when the article, container or packaging is closed or sealed, and a different coupling when the article, container or packaging is open or unsealed.

IPC Classes  ?

  • G01D 5/20 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying inductance, e.g. by a movable armature
  • A61M 16/00 - Devices for influencing the respiratory system of patients by gas treatment, e.g. ventilators Tracheal tubes
  • G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips

18.

WIRELESS MECHANISM FOR DETECTING AN OPEN OR CLOSED CONTAINER, AND METHODS OF MAKING AND USING THE SAME

      
Application Number IB2017000909
Publication Number 2017/216634
Status In Force
Filing Date 2017-06-19
Publication Date 2017-12-21
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor Mukherjee, Somnath

Abstract

An electronic device including a continuity sensor and electrical circuitry configured to detect and report the continuity state of an article, container or product packaging is disclosed. The continuity sensor includes a first substrate with first and second coils thereon, and a second substrate with a third coil thereon. The first coil has an integrated circuit electrically connected thereto. The first substrate is part of, or is attached or secured to a part of the article, container or packaging. The second substrate is another part of, or is attached or secured to another part of the article, container or packaging. One of the article, container or packaging parts is (re)movable with respect to the other part. The first and second coils have one coupling when the article, container or packaging is closed or sealed, and a different coupling when the article, container or packaging is open or unsealed.

IPC Classes  ?

  • G01D 5/20 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying inductance, e.g. by a movable armature
  • A61M 16/00 - Devices for influencing the respiratory system of patients by gas treatment, e.g. ventilators Tracheal tubes
  • G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
  • G08B 13/24 - Electrical actuation by interference with electromagnetic field distribution

19.

BOTTLES WITH SMART LABELS, AND METHODS OF MAKING AND USING SMART LABELS FOR BOTTLES

      
Application Number US2017028135
Publication Number 2017/184603
Status In Force
Filing Date 2017-04-18
Publication Date 2017-10-26
Owner
  • THIN FILM ELECTRONICS ASA (Norway)
  • CHANDLER, Alex (USA)
Inventor
  • Chandra, Aditi
  • Uland, David

Abstract

A bottle having a sealing device and a substrate attached thereto, and methods of attaching the substrate to the bottle are disclosed. Methods include placing the substrate on the bottle, the bottle having a break line, and the substrate having a wireless communication device having an antenna, an integrated circuit, and a sensing line thereon. Methods further include adhering a first part of the substrate including the antenna to a first portion of the bottle that does not include the break line, and a second part of the substrate including the sensing line to a second portion of the bottle and on/over a break line. The bottle includes an interface between the sealing device and defines a break line. The substrate including the wireless communication device is on/over the bottle, at least a part of the sealing device and the break line.

IPC Classes  ?

  • B65D 55/06 - Deformable or tearable wires, strings or strips (caps or cap-like closures with tear-strips )Use of seals
  • G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
  • G08B 13/22 - Electrical actuation

20.

SMART LABEL OR TAG HAVING A CONTINUITY SENSOR ON A SUBSTRATE HAVING A PREFERENTIAL TEARING DIRECTION

      
Application Number US2017028128
Publication Number 2017/184596
Status In Force
Filing Date 2017-04-18
Publication Date 2017-10-26
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor
  • Reyland, Paul
  • Chandler, Alex

Abstract

Smart label including communication device and continuity sensor, and methods of manufacturing and using the same. Smart label includes substrate having a preferential tearing direction, antenna or display, integrated circuit, and sensing line configured to sense-determine a continuity state of a container on which the communication device is placed, fixed or adhered. Sensing line has at least one section oriented perpendicularly or substantially perpendicularly to the preferential tearing direction of the substrate. Antenna is configured to receive a first wireless signal and/or transmit or broadcast a second wireless signal. Communication device or integrated circuit includes a receiver and/or transmitter, the integrated circuit may be configured to process the first wireless signal and/or information therefrom and/or generate the second wireless signal and/or information therefor. Smart label may include a display and battery instead of the antenna. The display may be configured to display the continuity state of the container.

IPC Classes  ?

  • G06K 19/04 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
  • G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
  • G09F 3/02 - Forms or constructions
  • G09F 3/03 - Forms or constructions of security seals

21.

ELECTRONIC DEVICE AND METHOD OF MAKING THE SAME USING SURFACE MOUNT TECHNOLOGY AND AN ANISOTROPIC CONDUCTIVE ADHESIVE USEFUL IN THE METHOD

      
Application Number IB2017051112
Publication Number 2017/149426
Status In Force
Filing Date 2017-02-27
Publication Date 2017-09-08
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor Hagel, Olle

Abstract

A method of and system (200) for manufacturing an electronic device (300, 300'), a curable conductive adhesive for use in the same, and an electronic device (300, 300') are disclosed. The method includes printing a conductive adhesive onto pads at ends of traces on a substrate (310, 360), placing one or more components (320, 340, 340', 350, 355) having a non-standard size and/or shape (e.g. circular, oval or rectangular with rounded corners) onto the pads with the conductive adhesive thereon, and after the component(s) (320, 340, 340', 350, 355) have been placed onto the pads, curing the conductive adhesive at a predetermined temperature or with light having a predetermined wavelength (band). The one or more components (320, 340, 340', 350, 355) having a non-standard size and/or shape may be an antenna (320), a sensor (340, 340') and/or a display (350, 355). The electronic device (300, 300') may further comprise one or more additional components (330, 335, 370) having a standard size and/or shape on a second subset of the pads. The additional components (330, 335, 370) may be an integrated circuit (330, 335) and/or a battery (370). The system (200) comprises a printer (220) configured to print a conductive adhesive onto pads at ends of traces on a substrate, a surface mounting (SMT) machine (230) configured to place one or more components (320, 340, 340', 350, 355) having a non-standard size and/or shape onto the pads with the conductive adhesive thereon, and a curing station configured to cure the conductive adhesive after the component(s) (320, 340, 340', 350, 355) have been placed onto the pads. The SMT machine (230) may include a nozzle head having a surface with a shape identical to or configured to match a shape of the component (320, 340, 340', 350, 355) it picks up.

IPC Classes  ?

  • H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
  • H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
  • C09J 9/02 - Electrically-conducting adhesives
  • H05K 13/04 - Mounting of components
  • H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
  • H05K 1/18 - Printed circuits structurally associated with non-printed electric components
  • H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
  • H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
  • H01L 21/66 - Testing or measuring during manufacture or treatment
  • H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components

22.

ENCAPSULATED ELECTROCHROMIC DISPLAY, AND METHOD OF MAKING THE SAME

      
Application Number IB2017050930
Publication Number 2017/145032
Status In Force
Filing Date 2017-02-18
Publication Date 2017-08-31
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor
  • Eveborn, Annelie
  • Hagel, Olle
  • Nilsson, Jakob
  • Norlen, Susanne
  • Paakkolanvaara, Mikko

Abstract

The present disclosure concerns an encapsulated electrochromic display and a method for encapsulating the same. The method includes forming the electrochromic display on a first encapsulation layer (10), conditioning the electrochromic display in an environment having a predetermined minimum water vapor therein, and applying a second encapsulation layer (20) on the electrochromic display. The electrochromic display includes at least a first electrode (11), a second electrode (13), and an electrochromic layer (12) between the first and second electrodes (11, 13). At least one of the first and second electrodes (11, 13) is formed by a roll-to-roll printing process and comprises a material having an air or water vapor permeability sufficient to allow water vapor to permeate the electrochromic layer (12) during the roll-to-roll printing process, and at least one of the first and second encapsulation layers (10, 20) is optically transparent. In the encapsulated electrochromic display, the electrochromic layer (12) includes a predetermined minimum amount of water or moisture therein.

IPC Classes  ?

  • G02F 1/161 - GasketsSpacersSealing of cellsFilling or closing of cells

23.

ELECTRONIC DEVICE HAVING A PLATED ANTENNA AND/OR TRACE, AND METHODS OF MAKING AND USING THE SAME

      
Application Number US2016066137
Publication Number 2017/100752
Status In Force
Filing Date 2016-12-12
Publication Date 2017-06-15
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor Takashima, Mao

Abstract

An electronic device, and methods of manufacturing the same are disclosed. The method of manufacturing the electronic device includes forming a first metal layer on a first substrate, forming an integrated circuit or a discrete electrical component on a second substrate, forming electrical connectors on input and/or output terminals of the integrated circuit or discrete electrical component, forming a second metal layer on the first metal layer, the second metal layer improving adhesion and/or electrical connectivity of the first metal layer to the electrical connectors on the integrated circuit or discrete electrical component, and electrically connecting the electrical connectors to the second metal layer.

IPC Classes  ?

  • H01L 23/488 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions
  • H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates

24.

ELECTRONIC DEVICE HAVING AN ANTENNA, METAL TRACE (S) AND/OR INDUCTOR WITH A PRINTED ADHESION PROMOTER THEREON

      
Application Number US2016055817
Publication Number 2017/062662
Status In Force
Filing Date 2016-10-06
Publication Date 2017-04-13
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor
  • Takashima, Mao
  • Boyd, Jacob
  • Chandra, Aditi

Abstract

An electronic device and methods of manufacturing the same are disclosed. One method of manufacturing the electronic device includes forming a first metal layer on a first substrate, forming an electrical device on a second substrate, forming electrical connectors on input and/or output terminals of the electrical device, selectively depositing a second metal on at least part of the first metal layer, and electrically connecting the electrical connectors to the first metal layer by contacting the electrical connectors to the second metal. The second metal is different from the first metal. The second metal improves adhesion and/or electrical connectivity of the first metal layer to the electrical connectors on the electrical device.

IPC Classes  ?

  • H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
  • H05K 3/36 - Assembling printed circuits with other printed circuits
  • H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
  • G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
  • H01Q 1/27 - Adaptation for use in or on movable bodies
  • H01Q 23/00 - Antennas with active circuits or circuit elements integrated within them or attached to them
  • G08B 13/24 - Electrical actuation by interference with electromagnetic field distribution

25.

WIRELESS TAGS WITH PRINTED STUD BUMPS, AND METHODS OF MAKING AND USING THE SAME

      
Application Number US2016045900
Publication Number 2017/024278
Status In Force
Filing Date 2016-08-05
Publication Date 2017-02-09
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor
  • Takashima, Mao
  • Mei, Junfeng
  • Li, Joey

Abstract

A wireless (e.g., near field or RF) communication device, and methods of manufacturing the same are disclosed. The method of manufacturing the wireless communication device includes forming an integrated circuit on a first substrate, printing stud bumps on input and/or output terminals of the integrated circuit, forming an antenna on a second substrate, and electrically connecting ends of the antenna to the stud bumps. The antenna is configured to (i) receive and (ii) transmit or broadcast wireless signals.

IPC Classes  ?

  • G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
  • H01Q 1/22 - SupportsMounting means by structural association with other equipment or articles
  • H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support

26.

HUMIDITY SENSOR, WIRELESS DEVICE INCLUDING THE SAME, AND METHODS OF MAKING AND USING THE SAME

      
Application Number US2016045906
Publication Number 2017/024281
Status In Force
Filing Date 2016-08-05
Publication Date 2017-02-09
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor
  • Takashima, Mao
  • Chandra, Aditi

Abstract

A tag or smart label including a humidity sensor, and methods of manufacturing and using the same, are disclosed. The tag or smart label includes a substrate or backplane with a battery or antenna, a humidity sensor, and an integrated circuit thereon. The integrated circuit is in electrical communication with the humidity sensor and the antenna or battery, and is configured to process a signal from the humidity sensor corresponding to the humidity level or value in the environment to be monitored, and provide or generate a signal that represents the humidity level/value. The humidity sensor includes first and second electrodes that are a predetermined distance apart, a humidity-sensitive material having one or more electrical, mechanical or chemical properties that vary as a function of the humidity level / value, and a water- and/or humidity-permeable membrane covering the humidity-sensitive material.

IPC Classes  ?

  • H04W 74/08 - Non-scheduled access, e.g. ALOHA
  • H04W 84/22 - Self-organising networks, e.g. ad hoc networks or sensor networks with access to wired networks

27.

WIRELESS COMMUNICATION DEVICE WITH INTEGRATED FERRITE SHIELD AND ANTENNA, AND METHODS OF MANUFACTURING THE SAME

      
Application Number US2016045909
Publication Number 2017/024283
Status In Force
Filing Date 2016-08-05
Publication Date 2017-02-09
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor
  • Chandra, Aditi
  • Kamath, Arvind
  • Mukherjee, Somnath
  • Takashima, Mao
  • Wong, Gloria
  • Van Tu, Khanh
  • Li, Joey
  • Popiolek, Anton

Abstract

A wireless communication device and methods of manufacturing and using the same are disclosed. The wireless communication device includes a substrate with an antenna and/or inductor thereon, a patterned ferrite layer overlapping the antenna and/or inductor, and a capacitor electrically connected to the antenna and/or inductor. The wireless communication device may further include an integrated circuit including a receiver configured to convert a first wireless signal to an electric signal and a transmitter configured to generate a second wireless signal, the antenna being configured to receive the first wireless signal and transmit or broadcast the second wireless signal. The patterned ferrite layer advantageously mitigates the deleterious effect of metal objects in proximity to a reader and/or transponder magnetically coupled to the antenna.

IPC Classes  ?

  • H01Q 1/52 - Means for reducing coupling between antennas Means for reducing coupling between an antenna and another structure

28.

MOSCAP-BASED CIRCUITRY FOR WIRELESS COMMUNICATION DEVICES, AND METHODS OF MAKING AND USING THE SAME

      
Application Number US2016030842
Publication Number 2016/179324
Status In Force
Filing Date 2016-05-04
Publication Date 2016-11-10
Owner
  • THIN FILM ELECTRONICS ASA (Norway)
  • MUKHERJEE, Somnath (USA)

Abstract

A wireless (e.g., near field or RF) communication device, and methods of manufacturing and using the same are disclosed. The wireless communication device includes a receiver and/or transmitter, a substrate with an antenna thereon, an integrated circuit, and one or more continuity sensors. The antenna receives and/or backscatters a wireless signal. The integrated circuit processes the wireless signal and/or information therefrom, and/or generates the wireless signal and/or information therefor. The continuity sensor(s) are configured to sense or determine the presence of a chemical or substance in the package or container, and thus a continuity state of a package or container on which the communication device is placed or to which the communication device is fixed or adhered. The continuity sensor(s) are electrically connected to a set of terminals of the integrated circuit different from the set of terminals to which the antenna is electrically connected.

IPC Classes  ?

  • H01L 29/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor bodies or of electrodes thereof
  • H01L 31/02 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof - Details
  • H01L 31/115 - Devices sensitive to very short wavelength, e.g. X-rays, gamma-rays or corpuscular radiation
  • H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
  • H01L 33/14 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
  • H01L 51/05 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier; Capacitors or resistors with at least one potential-jump barrier or surface barrier

29.

SENSOR-BASED NFC/RF MECHANISM WITH MULTIPLE VALID STATES FOR DETECTING AN OPEN OR COMPROMISED CONTAINER

      
Application Number US2016026812
Publication Number 2016/168089
Status In Force
Filing Date 2016-04-08
Publication Date 2016-10-20
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor
  • Bright, Matthew, A.
  • Ernst, Jennifer
  • Karlsson, Christer
  • Herlogsson, Lars

Abstract

A wireless (e.g., near field or RF) communication device, and methods of manufacturing and using the same are disclosed. The wireless communication device includes a receiver and/or transmitter, a substrate with an antenna thereon, an integrated circuit, and one or more continuity sensors. The antenna receives and/or transmits or broadcasts a wireless signal. The integrated circuit processes the wireless signal and/or information therefrom, and/or generates the wireless signal and/or information therefor. The continuity sensor(s) are configured to sense or determine the presence of a chemical or substance in the package or container, and thus a continuity state of a package or container on which the communication device is placed or to which the communication device is fixed or adhered. The continuity sensor(s) are electrically connected to a set of terminals of the integrated circuit different from the set of terminals to which the antenna is electrically connected.

IPC Classes  ?

  • G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
  • B65D 5/43 - Containers characterised by means discouraging or indicating unauthorised opening of the container
  • B65D 27/30 - Closures with special means for indicating unauthorised opening

30.

SILANE POLYMERIZATION INHIBITOR

      
Application Number JP2015080244
Publication Number 2016/072320
Status In Force
Filing Date 2015-10-27
Publication Date 2016-05-12
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor
  • Goto, Yuichi
  • Endo, Masahisa
  • Son, Gun

Abstract

[Problem] To provide a silane polymerization inhibitor in order to enable a cyclic silane to be present in a monomer state without a polymer being formed, even if heating by way of distillation is performed, said silane polymerization inhibitor enabling the cyclic silane to be purified further than when heated and distilled. To use the polymerization inhibitor to obtain a highly pure cyclic silane, particularly a highly pure cyclopentasilane. To apply, to a substrate, as a coating-type polysilane composition, a composition including polysilane obtained by polymerizing the cyclic silane, and bake the composition to subsequently provide an excellent silicon thin film exhibiting high electrical conductivity. [Solution] This silane polymerization inhibitor includes a secondary or tertiary aromatic amine. The silane is a cyclic silane. The silane is a cyclopentasilane. The aromatic amine is a secondary aromatic amine. The aromatic group is a phenyl group or a naphthyl group. 0.01-10 mol% of the polymerization inhibitor is included per mole of the silane. In the polymerization inhibitor, the boiling point of the aromatic amine is at least 196˚C.

IPC Classes  ?

  • C01B 33/04 - Hydrides of silicon
  • C08G 77/60 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon in which all the silicon atoms are connected by linkages other than oxygen atoms

31.

METHOD FOR PRODUCING ORGANIC SOLVENT INCLUDING OXIDE OF SILICON HYDRIDE

      
Application Number JP2015078922
Publication Number 2016/072226
Status In Force
Filing Date 2015-10-13
Publication Date 2016-05-12
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor
  • Goto, Yuichi
  • Endo, Masahisa
  • Son, Gun
  • Nagai, Kentaro

Abstract

[Problem] To provide a method for producing an organic solvent (a coating solution) including an oxide of a silicon hydride, wherein the oxide of the silicon hydride is formed in the coating solution before coating a substrate, and a film of the oxide of the silicon hydride can be formed on the substrate without the need for placement under a non-oxidizing atmosphere during coating, and without the need for heat treatment on the substrate after coating. [Solution] This method for producing an organic solvent including an oxide of a silicon hydride is characterized in that an oxygen-containing gas is blown into an organic solvent including the silicon hydride or a polymer thereof. The silicon hydride is a cyclic silane. The silicon hydride is a cyclopentasilane. The oxide of the silicon hydride or the polymer thereof is included in a proportion which satisfies (remaining Si-H groups)/(Si-H groups before oxidation)=1-40 mol%. The cyclic silane can be obtained by inducing a reaction with a hydrogen halide in cyclohexane in the presence of aluminium halide, dissolving the resultant cyclic silane in an organic solvent, and reducing the resultant solution.

IPC Classes  ?

  • C01B 33/145 - Preparation of hydroorganosols, organosols or dispersions in an organic medium
  • C01B 33/12 - SilicaHydrates thereof, e.g. lepidoic silicic acid
  • C08G 77/60 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon in which all the silicon atoms are connected by linkages other than oxygen atoms

32.

NFC/RF MECHANISM WITH MULTIPLE VALID STATES FOR DETECTING AN OPEN CONTAINER

      
Application Number US2015056087
Publication Number 2016/064687
Status In Force
Filing Date 2015-10-16
Publication Date 2016-04-28
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor Bright, Matthew, A.

Abstract

A wireless (e.g., near field or RF) communication device, and methods of manufacturing and using the same are disclosed. The wireless communication device includes a receiver and/or transmitter, a substrate with an antenna thereon, an integrated circuit, and one or more protection lines. The antenna receives and/or transmits or broadcasts a wireless signal. The integrated circuit processes the wireless signal and/or information therefrom, and/or generates the wireless signal and/or information therefor. The integrated circuit has a first set of terminals electrically connected to the antenna. The protection line(s) are on a common or different substrate as the antenna. The protection line(s) sense or determine a continuity state of a package or container on which the communication device is placed or to which the communication device is fixed or adhered, and are electrically connected to a second set of terminals of the integrated circuit different from the first set of terminals.

IPC Classes  ?

  • H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries

33.

METHOD FOR PRODUCING CYCLIC SILANE USING CONCENTRATION METHOD

      
Application Number JP2015070164
Publication Number 2016/010038
Status In Force
Filing Date 2015-07-14
Publication Date 2016-01-21
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor
  • Goto, Yuichi
  • Nagai, Kentaro
  • Endo, Masahisa
  • Son, Gun

Abstract

A method for producing cyclic silane represented by formula (3) which includes: a step (A) of reacting a cyclic silane compound represented by formula (1) with hydrogen halide in cyclohexane under the presence of aluminum halide to obtain a solution including a cyclic silane compound represented by formula (2), and then obtaining the cyclic silane compound represented by formula (2) by distilling the solution; and a step (B) of dissolving the cyclic silane compound represented by formula (2) in an organic solvent to reduce the cyclic silane compound represented by formula (2) with hydrogen or lithium aluminum hydride.

IPC Classes  ?

34.

HIGH-MOLECULAR-WEIGHT POLYSILANE AND METHOD FOR PRODUCING SAME

      
Application Number JP2015068819
Publication Number 2016/009827
Status In Force
Filing Date 2015-06-30
Publication Date 2016-01-21
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor
  • Endo, Masahisa
  • Son, Gun
  • Goto, Yuichi
  • Nagai, Kentaro

Abstract

[Problem] To produce an application-type polysilane composition using polysilane having a high weight-average molecular weight, and provide an excellent silicon thin film having high conductivity after applying the polysilane composition to a substrate and firing the substrate. [Solution] Polysilane having a weight-average molecular weight of from 5,000 to 8,000. The polysilane is a polymer of cyclopentasilane. A silicon film obtained by applying a polysilane composition of polysilane dissolved in a solvent to a substrate, and firing at from 100°C to 425°C. Polymerization of cyclopentasilane is carried out in the presence of a polymer-supported palladium catalyst. In the polymer-supported palladium catalyst, the palladium of the catalyst component is immobilized by functionalized polystyrene. The palladium comprises a palladium compound or a palladium complex. Immobilization of the palladium involves the microencapsulation of a zero-valent palladium complex or divalent palladium compound using functionalized polystyrene. The zero-valent palladium complex comprises a tetrakis(triphenylphosphine)palladium(0) complex.

IPC Classes  ?

  • C01B 33/04 - Hydrides of silicon
  • C01B 33/02 - Silicon
  • C03C 17/22 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with other inorganic material
  • C08G 77/60 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon in which all the silicon atoms are connected by linkages other than oxygen atoms

35.

METHOD FOR PRODUCING POLYSILANE BY THERMAL POLYMERIZATION

      
Application Number JP2015069522
Publication Number 2016/009897
Status In Force
Filing Date 2015-07-07
Publication Date 2016-01-21
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor
  • Endo, Masahisa
  • Son, Gun
  • Goto, Yuichi
  • Nagai, Kentaro

Abstract

[Problem] To produce polysilane having a high weight-average molecular weight by heating cyclopentasilane, obtain an application-type polysilane composition, and provide an excellent silicon thin film having high conductivity after applying these to a substrate and firing the substrate. [Solution] A method for producing polysilane characterized in that cyclopentasilane is heated to a temperature of from 50°C to 120°C. A polymer having a narrow molecular weight distribution and high weight-average molecular weight is obtained in particular by heating to from 80°C to 100°C. Heating can be carried out for from 0.5 to 6 hours. The resulting polysilane is a polymer of cyclopentasilane, and a weight-average molecular weight of from 600 to 3,000 can be obtained. The Mw/Mn ratio of the weight-average molecular weight Mw and the number-average molecular weight Mn of the resulting polysilane can be from 1.03 to 1.55. The cyclopentasilane is included in an amount of 80 mol% or more of the total cyclic silanes.

IPC Classes  ?

  • C01B 33/04 - Hydrides of silicon
  • C08G 77/60 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon in which all the silicon atoms are connected by linkages other than oxygen atoms

36.

SHORT CIRCUIT REDUCTION IN A FERROELECTRIC MEMORY CELL COMPRISING A STACK OF LAYERS ARRANGED ON A FLEXIBLE SUBSTRATE

      
Application Number EP2011060740
Publication Number 2013/000501
Status In Force
Filing Date 2011-06-27
Publication Date 2013-01-03
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor
  • Karlsson, Christer
  • Hagel, Olle Jonny
  • Nilsson, Jakob
  • Bröms, Per

Abstract

A ferroelectric memory cell (1) and a memory device (100) comprising one or more such cells (1). The ferroelectric memory cell comprises a stack (4) of layers arranged on a flexible substrate (3). Said stack comprises an electrically active part (4a) and a protective layer (11) for protecting the electrically active part against scratches and abrasion. Said electrically active part comprises a bottom electrode layer (5) and a top electrode layer (9) and at least one ferroelectric memory material layer (7) between said electrodes. The stack further comprises a buffer layer (13) arranged between the top electrode layer (9) and the protective layer (11). The buffer layer (13) is adapted for at least partially absorbing a lateral dimensional change (ΔL) occurring in the protective layer (11) and thus preventing said dimensional change (ΔL) from being transferred to the electrically active part (4a), thereby reducing the risk of short circuit to occur between the electrodes.

IPC Classes  ?

  • G11B 9/02 - Recording or reproducing using a method or means not covered by one of the main groups Record carriers therefor using ferroelectric record carriersRecord carriers therefor
  • H01L 27/28 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
  • H01L 27/115 - Electrically programmable read-only memories; Multistep manufacturing processes therefor
  • G11C 13/00 - Digital stores characterised by the use of storage elements not covered by groups , , or
  • G11C 11/56 - Digital stores characterised by the use of particular electric or magnetic storage elementsStorage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency

37.

SHORT CIRCUIT REDUCTION IN AN ELECTRONIC COMPONENT COMPRISING A STACK OF LAYERS ARRANGED ON A FLEXIBLE SUBSTRATE

      
Application Number EP2012062025
Publication Number 2013/000825
Status In Force
Filing Date 2012-06-21
Publication Date 2013-01-03
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor
  • Karlsson, Christer
  • Hagel, Olle, Jonny
  • Nilsson, Jakob
  • Bröms, Per

Abstract

An electronic component (1) and an electronic device (100) comprising one or more such components (1). The electronic component (1) comprises a stack (4) of layers arranged on a flexible substrate (3). Said stack comprises an electrically active part (4a) and a protective layer (11) for protecting the electrically active part against scratches and abrasion. Said electrically active part comprises a bottom electrode layer (5) and a top electrode layer (9) and at least one insulating or semi-insulating layer (7) between said electrodes. The stack further comprises a buffer layer (13), arranged between the top electrode layer (9) and the protective layer (11). The buffer layer (13) is adapted for at least partially absorbing a lateral dimensional change (ΔL) occurring in the protective layer (11) and thus preventing said dimensional change (ΔL) from being transferred to the electrically active part (4a), thereby reducing the risk of short circuit to occur between the electrodes.

IPC Classes  ?

  • G11B 9/02 - Recording or reproducing using a method or means not covered by one of the main groups Record carriers therefor using ferroelectric record carriersRecord carriers therefor
  • H01L 27/28 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
  • H01L 27/115 - Electrically programmable read-only memories; Multistep manufacturing processes therefor
  • G11C 13/00 - Digital stores characterised by the use of storage elements not covered by groups , , or
  • G11C 11/56 - Digital stores characterised by the use of particular electric or magnetic storage elementsStorage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency

38.

A DATA STORAGE DEVICE

      
Application Number NO2006000214
Publication Number 2006/135245
Status In Force
Filing Date 2006-06-08
Publication Date 2006-12-21
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor
  • Leistad, Geirr, I.
  • Bröms, Per
  • Karlsson, Christer

Abstract

In a non- volatile electric memory system a card-like memory unit (10) and a read/write unit (11) are provided as physically separate units. The memory unit (10) is based on a memory material (4) that can be set to at least two distinct physical states by applying an electric field across the memory material. The read/write unit (10) comprises contact means (9) provided in a determined geometrical pattern enabling a definition of memory cells in memory unit (10) in an initial write operation, the memory cells being located in a geometrical pattern corresponding to that of the contact means (9). Establishing a physical contact between the memory unit (10) and the read/write unit (11) closes an electrical circuit over an addressed memory cell such that read, write or erase operations can be effected. The memory material (4) of the memory unit (10) can be a ferroelectric or electret material that can be polarized into two discernible polarization states, or it can be a material with a resistive impedance characteristic such that a memory cell of the material can be set to a specific stable resistance value by the application of an electric field.

IPC Classes  ?

  • G06K 19/067 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
  • G06K 1/12 - Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching
  • G06K 7/06 - Methods or arrangements for sensing record carriers by means which conduct current when a mark is sensed or absent, e.g. contact brush for a conductive mark
  • G06K 7/08 - Methods or arrangements for sensing record carriers by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes

39.

A METHOD IN THE FABRICATION OF A FERROELECTRIC MEMORY DEVICE

      
Application Number NO2006000215
Publication Number 2006/135246
Status In Force
Filing Date 2006-06-08
Publication Date 2006-12-21
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor
  • Dyreklev, Peter
  • Leistad, Geirr, I.
  • Gustafsson, Göran

Abstract

In a method in the fabrication of a ferroelectric memory device comprising a memory layer sandwiched between first and second electrode sets, the memory layer as well as both electrode sets are each realized in the memory device by a suitable printing process.

IPC Classes  ?

  • G11C 11/22 - Digital stores characterised by the use of particular electric or magnetic storage elementsStorage elements therefor using electric elements using ferroelectric elements
  • H01L 51/40 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
  • H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material

40.

A DATA STORAGE DEVICE

      
Application Number NO2006000216
Publication Number 2006/135247
Status In Force
Filing Date 2006-06-08
Publication Date 2006-12-21
Owner THIN FILM ELECTRONICS ASA (Norway)
Inventor
  • Bröms, Per
  • Karlsson, Christer
  • Leistad, Geirr, I.
  • Hamberg, Per
  • Björklid, Staffan
  • Carlsson, Johan
  • Gustafsson, Göran
  • Gudesen, Hans Gude

Abstract

In a non-volatile electric memory system a memory unit and a read/write unit are provided as physically separate units. The memory unit is based on a memory material that can be set to at least two distinct physical states by applying an electric field across the memory material. Electrode means and/or contact means are either provided in the memory unit or in the read/write unit and contact means are at least always provided in the read/write unit. Electrodes and contacts are provided in a geometrical arrangement, which defines geometrically one or more memory cells in the memory layer. Contact means in the read/write unit are provided connectable to driving, sensing and control means located in the read/write unit or in an external device connected with the latter. Establishing a physical contact between the memory unit and the read/write unit closes an electrical circuit over the addressed memory cell such that read, write or erase operations can be effected. The memory material of the memory unit can be a ferroelectric or electret material that can be polarized into two discernible polarization states, or it can be a material with a resistive impedance characteristic such that a memory cell of the material can be set to a specific stable resistance value by the application of an electric field.

IPC Classes  ?

  • G06K 19/067 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
  • G06K 1/12 - Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching
  • G06K 7/06 - Methods or arrangements for sensing record carriers by means which conduct current when a mark is sensed or absent, e.g. contact brush for a conductive mark
  • G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K 7/08 - Methods or arrangements for sensing record carriers by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes