BARRIER STACKS FOR PRINTED AND/OR THIN FILM ELECTRONICS METHODS OF MANUFACTURING THE SAME, AND METHOD OF CONTROLLING A THRESHOLD VOLTAGE OF A THIN FILM TRANSISTOR
The present disclosure pertains to a barrier stack for thin film and/or printed electronics on substrates having a diffusible element and/or species, methods of manufacturing the same, and methods of inhibiting or preventing diffusion of a diffusible element or species in a substrate using the same. The barrier stack includes a first barrier layer on the substrate, an insulator layer on the first barrier layer, a second barrier layer on the insulator layer in a first region of the substrate, and a third barrier layer on the insulator layer in a second region of the substrate and on the second barrier layer in the first region. Each of the second and third barrier layers has a thickness less than that of the first barrier layer.
H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
H01L 23/532 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
Wireless tags are associated with and used to provide augmented reality (AR) experiences to users of mobile computing devices. The AR can be included with common articles and objects to enhance a user's interaction and enjoyment of such items. The tag information can be used to readily identify objects and articles without requiring significant object recognition tools and related latencies.
Wireless tag identification codes can be requested through a mobile application coordinating with a cloud service based tag management system. The codes are used to encode new tags to include readily accessible web content (such as URLs) associated with commercial product literature including marketing.
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
4.
SYSTEM AND METHOD FOR MANAGING WIRELESS TAG FUNCTIONALITY
Wireless tags and related mobile applications include a combination of both public and hidden functionality. Tag hidden features can be unlocked with a customized mobile application coordinating with a server through two separate channels. Conversely hidden features of a mobile application are made accessible through reading coded wireless tags. The combination of tag and mobile application afford a simplified and convenient form of two factor authentication.
G07G 1/14 - Systems including one or more distant stations co-operating with a central processing unit
H04W 4/06 - Selective distribution of broadcast services, e.g. multimedia broadcast multicast service [MBMS]Services to user groupsOne-way selective calling services
H04W 4/18 - Information format or content conversion, e.g. adaptation by the network of the transmitted or received information for the purpose of wireless delivery to users or terminals
5.
SYSTEM AND METHOD FOR SECURELY TRANSFERRING OWNERSHIP OF WIRELESS TAGS
Ownership of wireless tags can be managed through a mobile application coordinating with a cloud service-based transaction management system. Tag ownership can be transferred and recorded between two users using mobile devices with different levels of security and context restrictions to accommodate different applications.
G06K 7/10 - Methods or arrangements for sensing record carriers by electromagnetic radiation, e.g. optical sensingMethods or arrangements for sensing record carriers by corpuscular radiation
G06Q 20/40 - Authorisation, e.g. identification of payer or payee, verification of customer or shop credentialsReview and approval of payers, e.g. check of credit lines or negative lists
6.
PRINTED AND/OR THIN FILM INTEGRATED CIRCUIT WITH INTEGRATED ANTENNA, AND METHODS OF MAKING AND USING THE SAME
A wireless communication device having an integrated antenna, and methods for making and using the same are disclosed. The device generally includes (a) a substrate; (b) an integrated circuit (IC) comprising a plurality of printed and/or thin film layers and/or structures on the substrate, (c) a dielectric or insulator layer in at least one area of the substrate other than the IC; and (d) an antenna on the dielectric or insulator layer, comprising one or more metal traces. The plurality of printed and/or thin film layers and/or structures include an uppermost layer of metal. The antenna has (i) an inner terminal continuous with the uppermost layer of metal or connected to the uppermost layer of metal through one or more contacts, and (ii) an outer terminal connected to the uppermost layer of metal through one or more contacts and optionally a metal bridge or strap
An apparatus and a method of using the apparatus are disclosed. The apparatus comprises one or more manipulable or foldable substrates, a wireless communication device comprising one or more antennas, and one or more signal blocking structures. The one or more antennas are inoperable when the one or more substrates are in the closed, sealed, or packaged state, and the one or more antennas are operable when the one or more substrates are in the open state. The method comprises using the apparatus by opening the substrate and transmitting and receiving signals to and from the antenna(s). An apparatus comprising a package or container comprising a substrate, the wireless communication device, and a ferrite layer is also disclosed. In such an apparatus, the wireless communication device has first and second major surfaces opposed to each other, and the ferrite layer overlaps with the antenna. The ferrite layer shields the wireless communication device on the package or container such that the wireless communication device receives and transmits or broadcasts wireless signals when a reader accesses the wireless communication device from one of the first and second major surfaces, and the wireless communication device cannot receive, transmit or broadcast wireless signals when the reader accesses the wireless communication device from the other of the first and second major surfaces.
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
G06K 19/00 - Record carriers for use with machines and with at least a part designed to carry digital markings
G06K 19/02 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
8.
Wireless mechanism for detecting an open or closed container, and methods of making and using the same
GlaxoSmithKline Intellectual Property Development Limited (United Kingdom)
Inventor
Mukherjee, Somnath
Godfrey, James
Abstract
An electronic device including a continuity sensor and electrical circuitry configured to detect and report the continuity state of an article, container or product packaging is disclosed. The continuity sensor includes a first substrate with first and second coils thereon, and a second substrate with a third coil thereon. The first coil has an integrated circuit electrically connected thereto. The first substrate is part of, or is attached or secured to a part of the article, container or packaging. The second substrate is another part of, or is attached or secured to another part of the article, container or packaging. One of the article, container or packaging parts is (re)movable with respect to the other part. The first and second coils have one coupling when the article, container or packaging is closed or sealed, and a different coupling when the article, container or packaging is open or unsealed.
G01R 31/50 - Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
G01D 5/20 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying inductance, e.g. by a movable armature
G08B 13/12 - Mechanical actuation by the breaking or disturbance of stretched cords or wires
G08B 13/24 - Electrical actuation by interference with electromagnetic field distribution
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
B65D 79/02 - Arrangements or devices for indicating incorrect storage or transport
G01N 27/02 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
H04B 5/00 - Near-field transmission systems, e.g. inductive or capacitive transmission systems
H04Q 9/00 - Arrangements in telecontrol or telemetry systems for selectively calling a substation from a main station, in which substation desired apparatus is selected for applying a control signal thereto or for obtaining measured values therefrom
9.
SHRINKABLE PACKAGING MATERIALS WITH INTEGRATED TRANSPONDER, AND METHODS OF MAKING AND USING THE SAME
A device including a heat shrink material, a transponder substrate thereon, and a transponder on the transponder substrate is disclosed. The transponder is configured to wirelessly communicate with a reader. Methods of manufacturing the device, placing a heat shrink material with an integrated transponder onto a container, and communicating information about the container, a product in the container, and/or a purchaser or user of the container are also disclosed.
B65D 55/06 - Deformable or tearable wires, strings or strips (caps or cap-like closures with tear-strips )Use of seals
G06K 19/04 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
G06K 19/067 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G06F 3/03 - Arrangements for converting the position or the displacement of a member into a coded form
10.
SPRAY COATED SENSE LINES, SECURITY AND/OR IDENTIFICATION TAGS AND DEVICES INCLUDING THE SAME, AND METHODS OF MANUFACTURING
A security device, and methods of manufacturing the same, are disclosed. The security device comprises a first substrate having an integrated circuit thereon, the integrated circuit including (i) a continuity sensor configured to determine a continuity state of a container or package to which the first substrate is affixed, attached or adhered, and (ii) a first set of connection pads electrically connected to the continuity sensor, and one or more spray- coated sensing lines on the container, the package, or a second substrate to be affixed, attached or adhered to the container or package, the one or more spray-coated sensing lines being electrically connected to the first set of connection pads.
B65D 55/02 - Locking devicesMeans for discouraging or indicating unauthorised opening or removal of closure
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G09F 3/03 - Forms or constructions of security seals
11.
LOW-TEMPERATURE DOPANT ACTIVATION PROCESS USING A CAP LAYER, AND MOS DEVICES INCLUDING THE CAP LAYER
A method of making a MOS device, a MOS device containing an aluminum nitride layer, and a CMOS circuit are disclosed. The method includes depositing an aluminum nitride layer on a structure including a silicon layer, depositing a dopant ink on the structure, and diffusing the dopant through the aluminum nitride layer into the silicon layer. The structure also includes a gate oxide layer on the silicon layer and a gate on the gate oxide layer. The dopant ink includes a dopant and a solvent. The MOS device includes a silicon layer, a gate oxide layer on the silicon layer, a gate on the gate oxide layer, and an aluminum nitride layer on the gate. The silicon layer includes a dopant on opposite sides of the gate.
H01L 21/22 - Diffusion of impurity materials, e.g. doping materials, electrode materials, into, or out of, a semiconductor body, or between semiconductor regionsRedistribution of impurity materials, e.g. without introduction or removal of further dopant
H01L 21/228 - Diffusion of impurity materials, e.g. doping materials, electrode materials, into, or out of, a semiconductor body, or between semiconductor regionsRedistribution of impurity materials, e.g. without introduction or removal of further dopant using diffusion into, or out of, a solid from or into a liquid phase, e.g. alloy diffusion processes
H01L 21/318 - Inorganic layers composed of nitrides
12.
ELECTRONIC DEVICE HAVING ATTACH PADS, AN ANTENNA AND/OR AN INDUCTOR WITH PRINTED PALLADIUM THEREON, AND METHODS OF MAKING THE SAME
An electronic device and methods of manufacturing the same are disclosed. One method of manufacturing the electronic device includes forming an electrical device on a first substrate, depositing a passivation layer on the electrical device, printing a palladium- containing ink on exposed aluminum pads in or on the electrical device, converting the palladium-containing ink to a palladium-containing layer, and forming a conductive pad or bump on the palladium-containing layer. The passivation layer exposes the aluminum pads.
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
H01L 21/28 - Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
13.
SECURITY DEVICE FOR A PACKAGE OR CONTAINER AND METHODS OF MANUFACTURING AND USING THE SAME
A security and/or identification device including a sensor configured to detect an opened or tampered state of a package or container to which the device is attached. In one embodiment, the security device communicates wirelessly (e.g., with an NFC or RF reader). In other embodiments, the security device includes a display and a battery. The security device generally includes a continuity sensor on a substrate and an antenna or display on the same or a different substrate. The continuity sensor is configured to be electrically connected to one or more capacitor(s). The antenna is configured to receive a first wireless signal (e.g., from the reader) and, in the absence of the battery, transmit or broadcast a second wireless signal. The display is configured to display an indicator indicating a continuity state of a package or container on which the security device is placed or to which the security device is fixed or adhered. The continuity sensor is configured to determine a continuity state of the package or container.
A security and/or identification device including an integrated circuit and an antenna or a battery, and methods of manufacturing and using the same, are disclosed. The integrated circuit is on a substrate to be applied, affixed or attached to a package or container, and includes a set of connection pads electrically connectable to an external component, and a memory storing a unique identification number. The antenna or battery may be on the same or a different substrate. The antenna receives a first wireless signal, transmits a second wireless signal, and enables the integrated circuit to extract power from the first wireless signal. The battery provides power to the integrated circuit. The connection pads may be electrically connectable to one or more sensing lines, and the integrated circuit may further include a continuity sensor configured to determine a continuity state of the package / container.
A computer-implemented method and system for associating one or more wireless tags with one or more products is disclosed. The method comprises communicating wirelessly with the wireless tag(s) using a mobile device, associating the wireless tag(s) with a user account, and assigning at least one of the wireless tag(s) to a current product or a new product. The system comprises one or more wireless tags, a mobile device configured to communicate wirelessly with the wireless tag(s), and a storage server or cloud computer configured to (i) send, receive and store the information regarding the wireless tag(s) and the associated product and (ii) store and execute an analytics program or web application configured to track the information regarding the wireless tag(s). A computer-readable storage medium enabling the method on the mobile device and a system for managing one or more wireless tags associated with one or more products are also disclosed.
A printed electronic display device and methods of manufacturing and using the same are disclosed. The device includes a substrate (200) having a plurality of traces (230, 232) thereon, a printed integrated circuit (210), a battery (220), a switch (240, 242), and a display. A first one of the traces (230) has a first end and a second one of the traces (232) has a second end in proximity to the first end. The printed integrated circuit is electrically connected to the first trace. The battery is electrically connected to the second trace. The switch has an ON state and an OFF state. The ON state electrically connects the first and second ends of the first and second traces, and the OFF state imparts a high ohmic resistance between the first and second ends of the first and second traces. The display receives at least one output from the printed integrated circuit.
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
17.
WIRELESS MECHANISM FOR DETECTING AN OPEN OR CLOSED CONTAINER, AND METHODS OF MAKING AND USING THE SAME
An electronic device including a continuity sensor and electrical circuitry configured to detect and report the continuity state of an article, container or product packaging is disclosed. The continuity sensor includes a first substrate with first and second coils thereon, and a second substrate with a third coil thereon. The first coil has an integrated circuit electrically connected thereto. The first substrate is part of, or is attached or secured to a part of the article, container or packaging. The second substrate is another part of, or is attached or secured to another part of the article, container or packaging. One of the article, container or packaging parts is (re)movable with respect to the other part. The first and second coils have one coupling when the article, container or packaging is closed or sealed, and a different coupling when the article, container or packaging is open or unsealed.
G01D 5/20 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying inductance, e.g. by a movable armature
A61M 16/00 - Devices for influencing the respiratory system of patients by gas treatment, e.g. ventilators Tracheal tubes
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
18.
WIRELESS MECHANISM FOR DETECTING AN OPEN OR CLOSED CONTAINER, AND METHODS OF MAKING AND USING THE SAME
An electronic device including a continuity sensor and electrical circuitry configured to detect and report the continuity state of an article, container or product packaging is disclosed. The continuity sensor includes a first substrate with first and second coils thereon, and a second substrate with a third coil thereon. The first coil has an integrated circuit electrically connected thereto. The first substrate is part of, or is attached or secured to a part of the article, container or packaging. The second substrate is another part of, or is attached or secured to another part of the article, container or packaging. One of the article, container or packaging parts is (re)movable with respect to the other part. The first and second coils have one coupling when the article, container or packaging is closed or sealed, and a different coupling when the article, container or packaging is open or unsealed.
G01D 5/20 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying inductance, e.g. by a movable armature
A61M 16/00 - Devices for influencing the respiratory system of patients by gas treatment, e.g. ventilators Tracheal tubes
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
G08B 13/24 - Electrical actuation by interference with electromagnetic field distribution
19.
BOTTLES WITH SMART LABELS, AND METHODS OF MAKING AND USING SMART LABELS FOR BOTTLES
A bottle having a sealing device and a substrate attached thereto, and methods of attaching the substrate to the bottle are disclosed. Methods include placing the substrate on the bottle, the bottle having a break line, and the substrate having a wireless communication device having an antenna, an integrated circuit, and a sensing line thereon. Methods further include adhering a first part of the substrate including the antenna to a first portion of the bottle that does not include the break line, and a second part of the substrate including the sensing line to a second portion of the bottle and on/over a break line. The bottle includes an interface between the sealing device and defines a break line. The substrate including the wireless communication device is on/over the bottle, at least a part of the sealing device and the break line.
Smart label including communication device and continuity sensor, and methods of manufacturing and using the same. Smart label includes substrate having a preferential tearing direction, antenna or display, integrated circuit, and sensing line configured to sense-determine a continuity state of a container on which the communication device is placed, fixed or adhered. Sensing line has at least one section oriented perpendicularly or substantially perpendicularly to the preferential tearing direction of the substrate. Antenna is configured to receive a first wireless signal and/or transmit or broadcast a second wireless signal. Communication device or integrated circuit includes a receiver and/or transmitter, the integrated circuit may be configured to process the first wireless signal and/or information therefrom and/or generate the second wireless signal and/or information therefor. Smart label may include a display and battery instead of the antenna. The display may be configured to display the continuity state of the container.
G06K 19/04 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
A method of and system (200) for manufacturing an electronic device (300, 300'), a curable conductive adhesive for use in the same, and an electronic device (300, 300') are disclosed. The method includes printing a conductive adhesive onto pads at ends of traces on a substrate (310, 360), placing one or more components (320, 340, 340', 350, 355) having a non-standard size and/or shape (e.g. circular, oval or rectangular with rounded corners) onto the pads with the conductive adhesive thereon, and after the component(s) (320, 340, 340', 350, 355) have been placed onto the pads, curing the conductive adhesive at a predetermined temperature or with light having a predetermined wavelength (band). The one or more components (320, 340, 340', 350, 355) having a non-standard size and/or shape may be an antenna (320), a sensor (340, 340') and/or a display (350, 355). The electronic device (300, 300') may further comprise one or more additional components (330, 335, 370) having a standard size and/or shape on a second subset of the pads. The additional components (330, 335, 370) may be an integrated circuit (330, 335) and/or a battery (370). The system (200) comprises a printer (220) configured to print a conductive adhesive onto pads at ends of traces on a substrate, a surface mounting (SMT) machine (230) configured to place one or more components (320, 340, 340', 350, 355) having a non-standard size and/or shape onto the pads with the conductive adhesive thereon, and a curing station configured to cure the conductive adhesive after the component(s) (320, 340, 340', 350, 355) have been placed onto the pads. The SMT machine (230) may include a nozzle head having a surface with a shape identical to or configured to match a shape of the component (320, 340, 340', 350, 355) it picks up.
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01L 21/66 - Testing or measuring during manufacture or treatment
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
22.
ENCAPSULATED ELECTROCHROMIC DISPLAY, AND METHOD OF MAKING THE SAME
The present disclosure concerns an encapsulated electrochromic display and a method for encapsulating the same. The method includes forming the electrochromic display on a first encapsulation layer (10), conditioning the electrochromic display in an environment having a predetermined minimum water vapor therein, and applying a second encapsulation layer (20) on the electrochromic display. The electrochromic display includes at least a first electrode (11), a second electrode (13), and an electrochromic layer (12) between the first and second electrodes (11, 13). At least one of the first and second electrodes (11, 13) is formed by a roll-to-roll printing process and comprises a material having an air or water vapor permeability sufficient to allow water vapor to permeate the electrochromic layer (12) during the roll-to-roll printing process, and at least one of the first and second encapsulation layers (10, 20) is optically transparent. In the encapsulated electrochromic display, the electrochromic layer (12) includes a predetermined minimum amount of water or moisture therein.
An electronic device, and methods of manufacturing the same are disclosed. The method of manufacturing the electronic device includes forming a first metal layer on a first substrate, forming an integrated circuit or a discrete electrical component on a second substrate, forming electrical connectors on input and/or output terminals of the integrated circuit or discrete electrical component, forming a second metal layer on the first metal layer, the second metal layer improving adhesion and/or electrical connectivity of the first metal layer to the electrical connectors on the integrated circuit or discrete electrical component, and electrically connecting the electrical connectors to the second metal layer.
H01L 23/488 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
24.
ELECTRONIC DEVICE HAVING AN ANTENNA, METAL TRACE (S) AND/OR INDUCTOR WITH A PRINTED ADHESION PROMOTER THEREON
An electronic device and methods of manufacturing the same are disclosed. One method of manufacturing the electronic device includes forming a first metal layer on a first substrate, forming an electrical device on a second substrate, forming electrical connectors on input and/or output terminals of the electrical device, selectively depositing a second metal on at least part of the first metal layer, and electrically connecting the electrical connectors to the first metal layer by contacting the electrical connectors to the second metal. The second metal is different from the first metal. The second metal improves adhesion and/or electrical connectivity of the first metal layer to the electrical connectors on the electrical device.
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
H05K 3/36 - Assembling printed circuits with other printed circuits
H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
H01Q 1/27 - Adaptation for use in or on movable bodies
H01Q 23/00 - Antennas with active circuits or circuit elements integrated within them or attached to them
G08B 13/24 - Electrical actuation by interference with electromagnetic field distribution
25.
WIRELESS TAGS WITH PRINTED STUD BUMPS, AND METHODS OF MAKING AND USING THE SAME
A wireless (e.g., near field or RF) communication device, and methods of manufacturing the same are disclosed. The method of manufacturing the wireless communication device includes forming an integrated circuit on a first substrate, printing stud bumps on input and/or output terminals of the integrated circuit, forming an antenna on a second substrate, and electrically connecting ends of the antenna to the stud bumps. The antenna is configured to (i) receive and (ii) transmit or broadcast wireless signals.
A tag or smart label including a humidity sensor, and methods of manufacturing and using the same, are disclosed. The tag or smart label includes a substrate or backplane with a battery or antenna, a humidity sensor, and an integrated circuit thereon. The integrated circuit is in electrical communication with the humidity sensor and the antenna or battery, and is configured to process a signal from the humidity sensor corresponding to the humidity level or value in the environment to be monitored, and provide or generate a signal that represents the humidity level/value. The humidity sensor includes first and second electrodes that are a predetermined distance apart, a humidity-sensitive material having one or more electrical, mechanical or chemical properties that vary as a function of the humidity level / value, and a water- and/or humidity-permeable membrane covering the humidity-sensitive material.
A wireless communication device and methods of manufacturing and using the same are disclosed. The wireless communication device includes a substrate with an antenna and/or inductor thereon, a patterned ferrite layer overlapping the antenna and/or inductor, and a capacitor electrically connected to the antenna and/or inductor. The wireless communication device may further include an integrated circuit including a receiver configured to convert a first wireless signal to an electric signal and a transmitter configured to generate a second wireless signal, the antenna being configured to receive the first wireless signal and transmit or broadcast the second wireless signal. The patterned ferrite layer advantageously mitigates the deleterious effect of metal objects in proximity to a reader and/or transponder magnetically coupled to the antenna.
A wireless (e.g., near field or RF) communication device, and methods of manufacturing and using the same are disclosed. The wireless communication device includes a receiver and/or transmitter, a substrate with an antenna thereon, an integrated circuit, and one or more continuity sensors. The antenna receives and/or backscatters a wireless signal. The integrated circuit processes the wireless signal and/or information therefrom, and/or generates the wireless signal and/or information therefor. The continuity sensor(s) are configured to sense or determine the presence of a chemical or substance in the package or container, and thus a continuity state of a package or container on which the communication device is placed or to which the communication device is fixed or adhered. The continuity sensor(s) are electrically connected to a set of terminals of the integrated circuit different from the set of terminals to which the antenna is electrically connected.
H01L 29/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details of semiconductor bodies or of electrodes thereof
H01L 31/02 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof - Details
H01L 31/115 - Devices sensitive to very short wavelength, e.g. X-rays, gamma-rays or corpuscular radiation
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
H01L 33/14 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
H01L 51/05 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier; Capacitors or resistors with at least one potential-jump barrier or surface barrier
29.
SENSOR-BASED NFC/RF MECHANISM WITH MULTIPLE VALID STATES FOR DETECTING AN OPEN OR COMPROMISED CONTAINER
A wireless (e.g., near field or RF) communication device, and methods of manufacturing and using the same are disclosed. The wireless communication device includes a receiver and/or transmitter, a substrate with an antenna thereon, an integrated circuit, and one or more continuity sensors. The antenna receives and/or transmits or broadcasts a wireless signal. The integrated circuit processes the wireless signal and/or information therefrom, and/or generates the wireless signal and/or information therefor. The continuity sensor(s) are configured to sense or determine the presence of a chemical or substance in the package or container, and thus a continuity state of a package or container on which the communication device is placed or to which the communication device is fixed or adhered. The continuity sensor(s) are electrically connected to a set of terminals of the integrated circuit different from the set of terminals to which the antenna is electrically connected.
[Problem] To provide a silane polymerization inhibitor in order to enable a cyclic silane to be present in a monomer state without a polymer being formed, even if heating by way of distillation is performed, said silane polymerization inhibitor enabling the cyclic silane to be purified further than when heated and distilled. To use the polymerization inhibitor to obtain a highly pure cyclic silane, particularly a highly pure cyclopentasilane. To apply, to a substrate, as a coating-type polysilane composition, a composition including polysilane obtained by polymerizing the cyclic silane, and bake the composition to subsequently provide an excellent silicon thin film exhibiting high electrical conductivity. [Solution] This silane polymerization inhibitor includes a secondary or tertiary aromatic amine. The silane is a cyclic silane. The silane is a cyclopentasilane. The aromatic amine is a secondary aromatic amine. The aromatic group is a phenyl group or a naphthyl group. 0.01-10 mol% of the polymerization inhibitor is included per mole of the silane. In the polymerization inhibitor, the boiling point of the aromatic amine is at least 196˚C.
C08G 77/60 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon in which all the silicon atoms are connected by linkages other than oxygen atoms
31.
METHOD FOR PRODUCING ORGANIC SOLVENT INCLUDING OXIDE OF SILICON HYDRIDE
[Problem] To provide a method for producing an organic solvent (a coating solution) including an oxide of a silicon hydride, wherein the oxide of the silicon hydride is formed in the coating solution before coating a substrate, and a film of the oxide of the silicon hydride can be formed on the substrate without the need for placement under a non-oxidizing atmosphere during coating, and without the need for heat treatment on the substrate after coating. [Solution] This method for producing an organic solvent including an oxide of a silicon hydride is characterized in that an oxygen-containing gas is blown into an organic solvent including the silicon hydride or a polymer thereof. The silicon hydride is a cyclic silane. The silicon hydride is a cyclopentasilane. The oxide of the silicon hydride or the polymer thereof is included in a proportion which satisfies (remaining Si-H groups)/(Si-H groups before oxidation)=1-40 mol%. The cyclic silane can be obtained by inducing a reaction with a hydrogen halide in cyclohexane in the presence of aluminium halide, dissolving the resultant cyclic silane in an organic solvent, and reducing the resultant solution.
C01B 33/145 - Preparation of hydroorganosols, organosols or dispersions in an organic medium
C01B 33/12 - SilicaHydrates thereof, e.g. lepidoic silicic acid
C08G 77/60 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon in which all the silicon atoms are connected by linkages other than oxygen atoms
32.
NFC/RF MECHANISM WITH MULTIPLE VALID STATES FOR DETECTING AN OPEN CONTAINER
A wireless (e.g., near field or RF) communication device, and methods of manufacturing and using the same are disclosed. The wireless communication device includes a receiver and/or transmitter, a substrate with an antenna thereon, an integrated circuit, and one or more protection lines. The antenna receives and/or transmits or broadcasts a wireless signal. The integrated circuit processes the wireless signal and/or information therefrom, and/or generates the wireless signal and/or information therefor. The integrated circuit has a first set of terminals electrically connected to the antenna. The protection line(s) are on a common or different substrate as the antenna. The protection line(s) sense or determine a continuity state of a package or container on which the communication device is placed or to which the communication device is fixed or adhered, and are electrically connected to a second set of terminals of the integrated circuit different from the first set of terminals.
A method for producing cyclic silane represented by formula (3) which includes: a step (A) of reacting a cyclic silane compound represented by formula (1) with hydrogen halide in cyclohexane under the presence of aluminum halide to obtain a solution including a cyclic silane compound represented by formula (2), and then obtaining the cyclic silane compound represented by formula (2) by distilling the solution; and a step (B) of dissolving the cyclic silane compound represented by formula (2) in an organic solvent to reduce the cyclic silane compound represented by formula (2) with hydrogen or lithium aluminum hydride.
[Problem] To produce an application-type polysilane composition using polysilane having a high weight-average molecular weight, and provide an excellent silicon thin film having high conductivity after applying the polysilane composition to a substrate and firing the substrate. [Solution] Polysilane having a weight-average molecular weight of from 5,000 to 8,000. The polysilane is a polymer of cyclopentasilane. A silicon film obtained by applying a polysilane composition of polysilane dissolved in a solvent to a substrate, and firing at from 100°C to 425°C. Polymerization of cyclopentasilane is carried out in the presence of a polymer-supported palladium catalyst. In the polymer-supported palladium catalyst, the palladium of the catalyst component is immobilized by functionalized polystyrene. The palladium comprises a palladium compound or a palladium complex. Immobilization of the palladium involves the microencapsulation of a zero-valent palladium complex or divalent palladium compound using functionalized polystyrene. The zero-valent palladium complex comprises a tetrakis(triphenylphosphine)palladium(0) complex.
C03C 17/22 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with other inorganic material
C08G 77/60 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon in which all the silicon atoms are connected by linkages other than oxygen atoms
35.
METHOD FOR PRODUCING POLYSILANE BY THERMAL POLYMERIZATION
[Problem] To produce polysilane having a high weight-average molecular weight by heating cyclopentasilane, obtain an application-type polysilane composition, and provide an excellent silicon thin film having high conductivity after applying these to a substrate and firing the substrate. [Solution] A method for producing polysilane characterized in that cyclopentasilane is heated to a temperature of from 50°C to 120°C. A polymer having a narrow molecular weight distribution and high weight-average molecular weight is obtained in particular by heating to from 80°C to 100°C. Heating can be carried out for from 0.5 to 6 hours. The resulting polysilane is a polymer of cyclopentasilane, and a weight-average molecular weight of from 600 to 3,000 can be obtained. The Mw/Mn ratio of the weight-average molecular weight Mw and the number-average molecular weight Mn of the resulting polysilane can be from 1.03 to 1.55. The cyclopentasilane is included in an amount of 80 mol% or more of the total cyclic silanes.
C08G 77/60 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon in which all the silicon atoms are connected by linkages other than oxygen atoms
36.
SHORT CIRCUIT REDUCTION IN A FERROELECTRIC MEMORY CELL COMPRISING A STACK OF LAYERS ARRANGED ON A FLEXIBLE SUBSTRATE
A ferroelectric memory cell (1) and a memory device (100) comprising one or more such cells (1). The ferroelectric memory cell comprises a stack (4) of layers arranged on a flexible substrate (3). Said stack comprises an electrically active part (4a) and a protective layer (11) for protecting the electrically active part against scratches and abrasion. Said electrically active part comprises a bottom electrode layer (5) and a top electrode layer (9) and at least one ferroelectric memory material layer (7) between said electrodes. The stack further comprises a buffer layer (13) arranged between the top electrode layer (9) and the protective layer (11). The buffer layer (13) is adapted for at least partially absorbing a lateral dimensional change (ΔL) occurring in the protective layer (11) and thus preventing said dimensional change (ΔL) from being transferred to the electrically active part (4a), thereby reducing the risk of short circuit to occur between the electrodes.
G11B 9/02 - Recording or reproducing using a method or means not covered by one of the main groups Record carriers therefor using ferroelectric record carriersRecord carriers therefor
H01L 27/28 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
G11C 13/00 - Digital stores characterised by the use of storage elements not covered by groups , , or
G11C 11/56 - Digital stores characterised by the use of particular electric or magnetic storage elementsStorage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
37.
SHORT CIRCUIT REDUCTION IN AN ELECTRONIC COMPONENT COMPRISING A STACK OF LAYERS ARRANGED ON A FLEXIBLE SUBSTRATE
An electronic component (1) and an electronic device (100) comprising one or more such components (1). The electronic component (1) comprises a stack (4) of layers arranged on a flexible substrate (3). Said stack comprises an electrically active part (4a) and a protective layer (11) for protecting the electrically active part against scratches and abrasion. Said electrically active part comprises a bottom electrode layer (5) and a top electrode layer (9) and at least one insulating or semi-insulating layer (7) between said electrodes. The stack further comprises a buffer layer (13), arranged between the top electrode layer (9) and the protective layer (11). The buffer layer (13) is adapted for at least partially absorbing a lateral dimensional change (ΔL) occurring in the protective layer (11) and thus preventing said dimensional change (ΔL) from being transferred to the electrically active part (4a), thereby reducing the risk of short circuit to occur between the electrodes.
G11B 9/02 - Recording or reproducing using a method or means not covered by one of the main groups Record carriers therefor using ferroelectric record carriersRecord carriers therefor
H01L 27/28 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
G11C 13/00 - Digital stores characterised by the use of storage elements not covered by groups , , or
G11C 11/56 - Digital stores characterised by the use of particular electric or magnetic storage elementsStorage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
In a non- volatile electric memory system a card-like memory unit (10) and a read/write unit (11) are provided as physically separate units. The memory unit (10) is based on a memory material (4) that can be set to at least two distinct physical states by applying an electric field across the memory material. The read/write unit (10) comprises contact means (9) provided in a determined geometrical pattern enabling a definition of memory cells in memory unit (10) in an initial write operation, the memory cells being located in a geometrical pattern corresponding to that of the contact means (9). Establishing a physical contact between the memory unit (10) and the read/write unit (11) closes an electrical circuit over an addressed memory cell such that read, write or erase operations can be effected. The memory material (4) of the memory unit (10) can be a ferroelectric or electret material that can be polarized into two discernible polarization states, or it can be a material with a resistive impedance characteristic such that a memory cell of the material can be set to a specific stable resistance value by the application of an electric field.
G06K 19/067 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
G06K 1/12 - Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching
G06K 7/06 - Methods or arrangements for sensing record carriers by means which conduct current when a mark is sensed or absent, e.g. contact brush for a conductive mark
G06K 7/08 - Methods or arrangements for sensing record carriers by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes
39.
A METHOD IN THE FABRICATION OF A FERROELECTRIC MEMORY DEVICE
In a method in the fabrication of a ferroelectric memory device comprising a memory layer sandwiched between first and second electrode sets, the memory layer as well as both electrode sets are each realized in the memory device by a suitable printing process.
G11C 11/22 - Digital stores characterised by the use of particular electric or magnetic storage elementsStorage elements therefor using electric elements using ferroelectric elements
H01L 51/40 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
In a non-volatile electric memory system a memory unit and a read/write unit are provided as physically separate units. The memory unit is based on a memory material that can be set to at least two distinct physical states by applying an electric field across the memory material. Electrode means and/or contact means are either provided in the memory unit or in the read/write unit and contact means are at least always provided in the read/write unit. Electrodes and contacts are provided in a geometrical arrangement, which defines geometrically one or more memory cells in the memory layer. Contact means in the read/write unit are provided connectable to driving, sensing and control means located in the read/write unit or in an external device connected with the latter. Establishing a physical contact between the memory unit and the read/write unit closes an electrical circuit over the addressed memory cell such that read, write or erase operations can be effected. The memory material of the memory unit can be a ferroelectric or electret material that can be polarized into two discernible polarization states, or it can be a material with a resistive impedance characteristic such that a memory cell of the material can be set to a specific stable resistance value by the application of an electric field.
G06K 19/067 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
G06K 1/12 - Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching
G06K 7/06 - Methods or arrangements for sensing record carriers by means which conduct current when a mark is sensed or absent, e.g. contact brush for a conductive mark
G06K 19/06 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
G06K 7/08 - Methods or arrangements for sensing record carriers by means detecting the change of an electrostatic or magnetic field, e.g. by detecting change of capacitance between electrodes
patents
