A workpiece holding jig for holding a plate-shaped workpiece that is an object to be electroplated, includes a frame and a back panel. The frame includes an annular body, a conductive member, a contact member, an inner seal member, and an outer seal member. The frame forms a sealed space between the inner seal member and the outer seal member, that accommodates the peripheral edge, the conductive member, and the contact member. The inner seal member has a column and a lip in order from outside to inside, the column protrudes toward the back panel so as to come into pressure contact with the peripheral edge of the workpiece when holding the workpiece, and the lip protrudes toward the back panel to the same extent as that of the column, with at least a tip portion of the lip inclined outward.
A workpiece holding jig for holding a plate-shaped workpiece that is an object to be electroplated, includes a frame and a back panel. The frame includes an annular body, a conductive member, a contact member, an inner seal member, and an outer seal member. The frame forms a sealed space between the inner seal member and the outer seal member, that accommodates the peripheral edge, the conductive member, and the contact member. The frame further includes a cooling mechanism that causes liquid to continuously flow into the sealed space to thereby cool the contact member.
A method for regenerating an electrolytic copper plating solution containing a copper ion and at least one additive selected from the group consisting of a brightener, a carrier, and a leveler at least includes: ultraviolet-ozone treatment of oxidizing the electrolytic copper plating solution to decompose an organic impurity in the electrolytic copper plating solution; and activated carbon treatment of bringing activated carbon into contact with the electrolytic copper plating solution which has been subjected to the ultraviolet-ozone treatment to remove the organic impurity in the electrolytic copper plating solution.
Provided is a method of producing a plating deposit which enables the production of a plating deposit with good adhesion to a glass substrate. Included is a method of producing a plating deposit, which includes: (1) forming a metal oxide layer on a surface of a glass substrate; (2) performing a first heat treatment after the step (1); (3) forming an electroless copper plating deposit on the metal oxide layer after the step (2); (4) performing a second heat treatment after the step (3); and (5) forming an electrolytic copper plating deposit on the electroless copper plating deposit after the step (4).
C03C 17/36 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
C25D 3/38 - ElectroplatingBaths therefor from solutions of copper
C25D 5/54 - Electroplating of non-metallic surfaces
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
The present invention provides an apparatus capable of measuring a deposition status, such as a plating deposition rate, even during a plating process in a plating tank. A controller 20 controls a plating solution introduction mechanism 6 to introduce a plating solution in a plating tank 2 into a reaction container 4. By the introduced plating solution, a metal film is deposited on a deposition member 12 provided in the reaction container 4. Next, metal film dissolution control means 24 of the controller 20 controls an etching solution introduction mechanism 8 to introduce an etching solution into the reaction container 4 instead of the plating solution. The introduced etching solution dissolves the metal film deposited on the deposition member 12. A measurement equipment 10 measures a metal concentration-related value (metal concentration or a metal concentration-related value) of the post-processing etching solution in which the metal film is dissolved. Estimation means 26 of the controller 20 estimates the deposition status, such as the plating deposition rate, in the plating tank 2 on the basis of the metal concentration-related value measured by the measurement equipment 10.
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 18/32 - Coating with one of iron, cobalt or nickelCoating with mixtures of phosphorus or boron with one of these metals
G01K 3/14 - Thermometers giving results other than momentary value of temperature giving differences of valuesThermometers giving results other than momentary value of temperature giving differentiated values in respect of space
G01N 21/31 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry
An electroless ruthenium plating bath at least contains: a ruthenium compound; a reducing agent; and a stabilizer. The reducing agent is at least one of an amine borane compound or sodium hypophosphite. The stabilizer is made of a hydroxylamine compound and an amine compound. The hydroxylamine compound is at least one of hydroxylamine sulfate or hydroxylamine chloride.
C23C 18/44 - Coating with noble metals using reducing agents
7.
CATALYST APPLICATION BATH FOR ELECTROLESS PLATING, METHOD OF PRODUCING CATALYTIC NUCLEUS-CONTAINING MATERIAL TO BE ELECTROLESS PLATED, METHOD OF PRODUCING MATERIAL WITH ELECTROLESS PLATING DEPOSIT, AND MATERIAL WITH ELECTROLESS PLATING DEPOSIT
Provided are a catalyst application bath for electroless plating, a method of producing a catalytic nucleus-containing material to be electroless plated using the catalyst application bath for electroless plating, a method of producing a material with an electroless plating deposit, and a material with an electroless plating deposit, each of which may provide good patternability even without a post-dip step which can cause non-deposition in electroless plating, and thus may achieve both patternability and electroless plating deposition. Included is a catalyst application bath for electroless plating, containing a palladium compound and an aminocarboxylic acid.
09 - Scientific and electric apparatus and instruments
Goods & Services
Scientific apparatus and instruments; computer hardware; laboratory apparatus and instruments; measuring apparatus and instruments; testing apparatus not for medical purposes; fluid flow meters; phase modifiers; monitoring apparatus, other than for medical purposes; magnetic cores; resistance wires; electrodes for laboratory research; electronic publications, downloadable; automatic measuring instruments; computer software; automatic control apparatus; electrolysers; regulating apparatus, electric; printing plate scanners; computer hard disk drives; computer programs, recorded; detecting apparatus and instruments; automatic measuring apparatus for measuring concentration and pH levels of plating solutions; automatic measuring apparatus for measuring concentration and pH levels of chemical treatment solutions, automatic liquid level and concentration and pH level adjustment control apparatus for plating solutions; automatic liquid level and concentration and pH level adjustment control apparatus for chemical treatment solutions; electric and electroless plating apparatus, namely, pressure sensors, timing sensors, instruments in the nature of gauges for measuring plating thickness; concentration management apparatus, namely, liquid analyzers and electronic controllers to manage concentration of plating solutions; concentration management apparatus, namely, liquid analyzers and electronic controllers to manage concentration of chemical treatment solutions; computer programs recorded on data media (software) designed for use in analyzing current distribution of electrochemical cells; computer programs recorded on data media (software) designed for managing concentration of plating solutions automatically.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; plating solutions; electroless plating solutions; electroplating solutions; metal plating compositions; auxiliary agents for plating; chemicals for use in metal plating; surface-active chemical agents; detergents for use in manufacturing processes; chemicals for use with electroless plating baths and electroplating baths; additives for plating bath; pretreatment agents for plating; etching agents; chemical preparations for surface treatment; agents for stripping of plated layers; chemicals used in the manufacture and fabrication of printed circuit boards, namely, metallization chemicals including desmear treatment, sensitizers, conditioners, activators, and neutralizers.
11.
ETCHANT AND METHOD OF SURFACE TREATMENT OF ALUMINUM OR ALUMINUM ALLOY
The present invention aims to provide an etchant that can provide good deposition of a metal plating such as a nickel plating, despite its acidity, and a method of surface treatment of aluminum or an aluminum alloy using the etchant. Included is an etchant containing a zinc compound and a fluorine compound and having a pH of 4.5 to 6.5.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; Plating solutions; Electroless plating solutions; Electroplating solutions; Metal plating compositions; Auxiliary agents for plating; Chemicals for use in metal plating; Chemical activators in the nature of industrial chemicals; Chemical activators for use in industrial surface finishing; Chemicals for use with electroless plating baths and electroplating baths; Additives for plating bath; Pretreatment agent for plating; Etching agents; Chemical preparations for surface treatment; Agents for stripping of plated layers; Chemicals used in the manufacture and fabrication of printed circuit boards, namely, metallization chemicals including desmear treatment, sensitizers, conditioners, activators, and neutralizers.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; Plating solutions; Electroless plating solutions; Electroplating solutions; Metal plating compositions; Auxiliary agents for plating; Chemicals for use in metal plating; Chemical activators in the nature of industrial chemicals; Chemical activators for use in industrial surface finishing; Chemicals for use with electroless plating baths and electroplating baths; Additives for plating bath; Pretreatment agent for plating; Etching agents; Chemical preparations for surface treatment; Agents for stripping of plated layers; Chemicals used in the manufacture and fabrication of printed circuit boards, namely, metallization chemicals including desmear treatment, sensitizers, conditioners, activators, and neutralizers.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; electroplating chemicals, namely, electro copper plating chemicals; chemicals for use with electroplating baths and electroless plating baths
A gold plating solution containing a gold cyanide salt, a reducing agent that is formaldehyde or its precursor, and an iron cyanide compound, and not containing a chelate compound having two or more iminodiacetic acid groups or aminomethylenephosphonic acid groups, is brought into contact with a chelating resin having an iminodiacetic acid group or an aminomethylenephosphonic acid group, thereby removing iron ions from the gold plating solution.
The present invention aims to provide a metal displacement solution that can provide good adhesion to a plating film (metal film), and a method for surface treatment of aluminum or an aluminum alloy using the metal displacement solution. Included is a metal displacement solution which contains a zinc compound, a nickel compound, a germanium compound, and a fluorine compound.
C23C 18/18 - Pretreatment of the material to be coated
C23C 18/08 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by thermal decomposition characterised by the deposition of metallic material
C23C 18/32 - Coating with one of iron, cobalt or nickelCoating with mixtures of phosphorus or boron with one of these metals
The electroless gold plating bath includes a gold sulfate, a thiosulfate, ascorbic acid compounds, and hydrazine compounds, the hydrazine compounds being at least one selected from the group consisting of adipic dihydrazide, propionic hydrazide, hydrazine sulfate, hydrazine monohydrochloride, hydrazine dihydrochloride, hydrazine carbonate, hydrazine monohydrate, sebacic dihydrazide, dodecanediohydrazide, isophthalic dihydrazide, hydrazide, 3-hydro-2-naphtboic hydrazide benzophenone hydrazone, phenylhydrazine, benzylhydrazine monohydrochloride, methylhydrazine sulfate, and isopropylhydrazine hydrochloride.
A copper etching solution contains an oxidizing agent and an amine compound. The oxidizing agent is one or more selected from the group consisting of a perchlorate, a chlorate, a chlorite, a hypochlorite, hydrogen peroxide, and a perborate, and the amine compound has one or more primary amino groups or secondary amino groups.
An object of the present invention is to provide a new electroless plating film which can prevent the diffusion of molten solder to a metal material constituting a conductor. The present invention is an electroless Co—W plating film, wherein content of W is in an amount of 35 to 58 mass % and a thickness of the film is 0.05 μm or more.
C23C 18/32 - Coating with one of iron, cobalt or nickelCoating with mixtures of phosphorus or boron with one of these metals
C23C 18/00 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating
C23C 30/00 - Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
C22C 19/07 - Alloys based on nickel or cobalt based on cobalt
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
C23C 18/36 - Coating with one of iron, cobalt or nickelCoating with mixtures of phosphorus or boron with one of these metals using reducing agents using hypophosphites
C23C 18/34 - Coating with one of iron, cobalt or nickelCoating with mixtures of phosphorus or boron with one of these metals using reducing agents
C23C 18/54 - Contact plating, i.e. electroless electrochemical plating
C23C 18/50 - Coating with alloys with alloys based on iron, cobalt or nickel
The purpose of the present invention is to provide a pretreatment method for electroless plating and a pretreatment solution for electroless plating capable of increasing an adsorption amount of a catalyst. A pretreatment method for electroless plating for performing an electroless plating on a substrate, the pretreatment method at least comprises: a cleaner process S10; a soft etching process S20 and/or an acid treatment process S30; a catalyst imparting process S40; and a catalyst reducing process S50, wherein an anionic surfactant for ionizing a part of a hydrophilic group to an anion is added to a treatment solution used in the soft etching process S20 and/or the acid treatment process S30, an ionic catalyst is imparted on the substrate in the catalyst imparting process S40, and the ionic catalyst is reduced in the catalyst reducing process S50 to increase an adsorption amount of the catalyst on the substrate.
The workpiece holding jig includes a first frame body and a second frame body, both frame bodies each have a body, a conductive member, a contact member provided so as to be able to come into electrical contact with a periphery of a workpiece, and an inner circumferential seal member provided over an entire circumference of the body. Both frame bodies are configured to constitute a seal space for accommodating the periphery of the workpiece, the conductive member of both frame bodies, and the contact member of both frame bodies, in a state where each of the inner circumferential seal members and the contact member abut against the periphery of the workpiece from both sides. The inner circumferential seal member has a contact projection, and an inner surface of the contact projection is slanted outward.
The workpiece holding jig includes a first frame body and a second frame body, both frame bodies each have a body, a conductive member, a contact member provided so as to be able to come into electrical contact with a periphery of a workpiece, and an inner circumferential seal member provided over an entire circumference of the body. Both frame bodies are configured to constitute a seal space for accommodating the periphery of the workpiece, the conductive member of both frame bodies, and the contact member of both frame bodies, in a state where each of the inner circumferential seal members and the contact member abut against the periphery of the workpiece from both sides. The conductive member of each of both frame bodies has a wide and thick shape so as to exhibit a substantially equal resistance value at a discretionary point in an entire circumference.
The purpose of the present invention is to provide a palladium plating solution and a plating method for improving a bath stability of a palladium plating, without decreasing a deposition property of the palladium plating. A palladium plating solution for improving a bath stability, without decreasing a deposition property, comprising: an aqueous palladium compound: one or more complexing agent containing a compound having at least an ethylenediamine or a propylenediamine skeleton; a formic acid or a formate; and a sulfur compound, wherein the palladium plating solution is having two or more sulfide groups in a molecule of the sulfur compound.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Chemicals for industrial purpose, namely, chemicals for electroless copper plating, pretreatment agents for electroless copper plating, and activators for electroless copper plating
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; Plating solutions; Electroless plating solutions; Electroplating solutions; Metal plating compositions; Auxiliary agents for plating; Chemicals for use in metal plating; Surface-active chemical agents; Detergents for use in manufacturing processes; Chemicals for use with electroless plating baths and electroplating baths; Additives for plating bath; Pretreatment agent for plating; Etching agents; Chemical preparations for surface treatment; Agents for stripping of plated layers; Chemicals used in the manufacture and fabrication of printed circuit boards, namely, metallization chemicals including desmear treatment, sensitizers, conditioners, activators, and neutralizers.
The purpose of the present invention is to provide a measurement method and a measurement device capable of accurately measuring various metal concentrations of metals included in a solution to be measured containing a plurality of additives and metals. An X-ray fluorescence analysis measurement method for measuring various metal concentrations of metals to be measured included in a solution to be measured containing one or more types of additives and metals based on measured values of X-ray fluorescence intensity, comprising: a calibration curve polynomial determination step S11 for determining polynomial approximations of calibration curves for the metals to be measured; a solution type correction polynomial determination step S12 for determining polynomial approximations for correcting error in the measured values of X-ray fluorescence intensity of the metals to be measured resulting from containing additives; a specific gravity correction polynomial determination step S13 for determining polynomial approximations for correcting error in the measured values of X-ray fluorescence intensity of the metals to be measured resulting from differences in specific gravity of the solution to be measured; and a metal concentration measurement step S14 for measuring various metal concentrations of the metals to be measured by using the polynomial approximations determined in the calibration curve polynomial determination step, the solution type correction polynomial determination step, and the specific gravity correction polynomial determination step.
G01N 23/223 - Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups , or by measuring secondary emission from the material by irradiating the sample with X-rays or gamma-rays and by measuring X-ray fluorescence
A holding apparatus for applying an electrolytic plating treatment to a planar workpiece, and the holding apparatus can reduce an amount of plating that is deposited on an edge part of the planar workpiece. The holding apparatus for applying the electrolytic plating treatment to the planar workpiece has a rear member and a front member facing the rear member and having an opening part. The planar workpiece is disposed between the rear member and the front member. The front member has a plurality of electrodes and a plurality of first insulating parts. The plurality of electrodes and the plurality of first insulating parts cover the edge part of the planar workpiece in a width direction of the planar workpiece.
A surface treatment device includes at least one paddle in a plate shape, in a surface treatment tank, for stirring a surface treatment solution near a substrate by reciprocally moving the paddle with respect to the substrate. The paddle is configured by integrally forming multiple square bars provided in a depth direction or a horizontal direction of the surface treatment solution at regular intervals along the substrate. A liquid draining member for draining a liquid is arranged in at least one side of an end of the paddle.
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
B05C 3/04 - Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material with special provision for agitating the work or the liquid or other fluent material
B01F 31/44 - Mixers with shaking, oscillating, or vibrating mechanisms with stirrers performing an oscillatory, vibratory or shaking movement
C25D 21/10 - Agitating of electrolytesMoving of racks
B05C 3/02 - Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material
C25D 17/00 - Constructional parts, or assemblies thereof, of cells for electrolytic coating
C23C 18/44 - Coating with noble metals using reducing agents
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
B32B 9/04 - Layered products essentially comprising a particular substance not covered by groups comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance
30.
PRETREATMENT METHOD FOR ELECTROLESS PLATING, AND PRETREATMENT SOLUTION FOR ELECTROLESS PLATING
The present invention provides a pretreatment method for electroless plating and a pretreatment solution for electroless plating, both of which make it possible to increase the amount of a catalyst adsorbed. A pretreatment method for electroless plating, comprising at least a cleaner step S10, a soft etching step S20 and/or an acid treatment step S30, a catalyst application step S40 and a catalyst reduction step S50, and enabling electroless plating on a substrate, the pretreatment method being characterized in that an anionic surfactant of which a hydrophilic group moiety can be ionized into an anion is added to a treatment solution to be used in the soft etching step S20 and/or the acid treatment step S30, an ionic catalyst is applied onto the substrate in the catalyst application step S40, and the ionic catalyst is reduced to increase the amount of the catalyst adsorbed onto the substrate in the catalyst reduction step S50.
A shaft member of an embodiment includes: a base material having a shaft shape and made of steel; a low phosphorus plating layer that is laminated on the base material, that includes phosphorus, and in which the phosphorus content is 4.5 mass % or less; and a base plating layer that is formed as an electrolytic nickel phosphorus plating layer or a high phosphorus plating layer laminated between the base material and the low phosphorus plating layer. It is thus possible to increase the strength of the shaft member and decrease the size of the shaft member.
Provided is an electroless copper plating bath which contains a hydrazine compound as a reductant, does not contain formaldehyde, and has a pH of 5-10, said bath containing at least an amine-based complexing agent or an amine compound, and an aminocarboxylic acid-based complexing agent.
C23C 18/40 - Coating with copper using reducing agents
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
A present invention provides a method for manufacturing a printed wiring board having excellent plating adhesion to a resin substrate having low surface roughness such as having surface roughness Ra of 0.2 μm or less, having excellent treating solution stability, and having high penetrability into the resin substrate. The method for manufacturing a resin substrate includes a step 1A or a step 1B; and a step 2 after the step 1A or the step 1B; and the steps are conducted before conducting electroless plating.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; metal strippers in the nature of chemicals for the treatment of dissolving metals by oxidizing; strippers of metal deposit in the nature of chemicals for the treatment of dissolving metals by oxidizing; metal removers in the nature of chemicals for the treatment of removing metals
An object of the present invention is to provide an electroless Pd plating solution which enables formation of a Pd plating film forming a plating film having excellent wire bondability even after a high-temperature thermal history. An electroless Pd plating solution of the present invention includes: a Palladium compound, a reducing agent, a complexing agent, and at least one selected from a group consisting of Ge and rare earth element.
The present invention provides an electroless gold plating bath having excellent plating bath stability without containing a cyanide compound under long term plating bath heating time. An electroless gold plating bath of the present invention solving above problems includes: a water-soluble gold salt; a reducing agent; and a phosphine compound represented by a following formula (1)
3 represent identically or differently either a phenyl group, or an alkyl group having 1 to 5 carbons, and at least one of the phenyl group or the alkyl group is substituted by a sulfonate group or its salt, a cyano group, or a carboxy group or its salt.
A surface treatment apparatus for subjecting a workpiece immersed at least partly in a solution to a surface treatment has: a spray nozzle facing the workpiece for spraying a treatment solution towards a working surface of the workpiece. The surface treatment apparatus has at least one of: a spray nozzle rotator to rotate the spray nozzle in a plane parallel to the working surface of the workpiece; or a workpiece rotator to rotate the workpiece in a plane perpendicular to a spraying direction of the treatment solution sprayed from the spray nozzle.
B05C 3/04 - Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material with special provision for agitating the work or the liquid or other fluent material
B05B 3/02 - Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements
C25D 5/08 - Electroplating with moving electrolyte, e.g. jet electroplating
It is configured that a frame body is locked to a back panel by: inserting a number of first pins of the frame body into a number of first holes of the back panel; moving a fastening body outward by a moving mechanism of a lock mechanism; and fitting a notch into a concave portion at the tip of the first pin.
This workpiece holding jig (1A) is provided with a first frame body (11) and a second frame body (12), wherein: both frame bodies (11, 12) each have a main body (13), a conductive member (15), a contact member (16) provided so as to able to electrically come into contact with a peripheral edge section (101) of a workpiece, and an inner peripheral seal member (17) provided over the entire periphery of the main body (13); both the frame bodies (11, 12) are configured to form a sealing space (5) that accommodates the peripheral edge section (101) of the workpiece, the conductive member (15) of the frame bodies (11, 12), and the contact member (16) of the frame bodies (11, 12) in a state in which inner peripheral seal members (17) and the contact members (16) come into contact with the peripheral edge section (101) of the workpiece from opposite sides; and the conductive members (15) of the frame bodies (11, 12) each have a shape with a large width and great thickness so as to exhibit a substantially uniform resistance value at arbitrary points over the entire periphery.
C25D 17/06 - Suspending or supporting devices for articles to be coated
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
This workpiece holding jig (1A) is provided with a first frame body (11) and a second frame body (12), wherein: both frame bodies (11, 12) each have a main body (13), a conductive member (15), a contact member (16) provided so as to be able to electrically come into contact with a peripheral edge section of a workpiece (10), and an inner peripheral seal member (17) provided over the entire periphery of the main body (13); both the frame bodies (11, 12) are configured to form a sealing space that accommodates the peripheral edge section of the workpiece (10), the conductive members (15) of the frame bodies (11, 12), and the contact members (16) of the frame bodies (11, 12) in a state in which inner peripheral seal members (17) and the contact members (16) come into contact with the peripheral edge section of the workpiece (10) from opposite sides; and the first frame body (11) and/or the second frame body (12) have/has a liquid injection port for filling the sealing space with a liquid and also have/has a discharge port for discharging air inside the sealing space.
C25D 17/06 - Suspending or supporting devices for articles to be coated
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
This workpiece holding jig (1A) is provided with a first frame body (11) and a second frame body (12), wherein: both frame bodies (11, 12) each have a main body (13), a conductive member (15), a contact member (16) provided so as to be able to electrically come into contact with a peripheral edge section of a workpiece (10), and an inner peripheral seal member (17) provided over the entire periphery of the main body (13); both the frame bodies (11, 12) are configured to form a sealing space that accommodates the peripheral edge section of the workpiece (10), the conductive members (15) of the frame bodies (11, 12), and the contact members (16) of the frame bodies (11, 12) in a state in which inner peripheral seal members (17) and the contact members (16) come into contact with the peripheral edge section of the workpiece (10) from opposite sides; and the inner peripheral seal member (17) has a contact protrusion section (171), and the inner side surface (1711) of the contact protrusion section (171) is inclined outward.
C25D 17/06 - Suspending or supporting devices for articles to be coated
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
42.
Surface treating apparatus and surface treatment method
In a flow down type surface treating apparatus, a scattering amount of a processing solution Q is reduced.
A honeycomb member 60 is provided vertically below a transport hanger 16. The honeycomb member 60 consists of a plurality of tubular members with hexagonal holes connected together. When the processing solution Q falls in a vertical direction (in the direction of an arrow α), the processing solution Q passes through through-holes of the honeycomb member 60. When the processing solution Q hits liquid level H, a part of it is reflected. Since a part of the reflected processing solution Q is reflected obliquely, it collides with an inner wall of the through-hole of the honeycomb member 60. As a result, the amount of the treatment liquid Q that emerges again on an upper surface of the through-holes is reduced. Thereby, the honeycomb member 60 exhibits a scattering prevention function.
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 18/18 - Pretreatment of the material to be coated
B05C 5/00 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
In a flow down type surface treating apparatus, a scattering amount of a processing solution is reduced.
A film forming mechanism 110 is provided on an inlet side and an outlet side of each treatment chamber.
The film forming mechanism 110 ejects a continuous laminar liquid under pressure of about 0.01 MPa at a flow rate of 5 to 10 L/min. Such a liquid film prevents droplets reflected on a surface of an antiscattering member 60 from splashing and entering the adjacent treatment chamber. When a plate-like work 10 is shaken to collide with the liquid film, the film flows down along the plate-like work 10 since the film formed by the film forming mechanism 110 is liquid. Thereby, a shake of the plate-like work 10 is converged. An amount of air flowing in toward a transport direction in each treatment chamber is reduced.
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 18/18 - Pretreatment of the material to be coated
C23C 18/44 - Coating with noble metals using reducing agents
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
An object of the present invention is to provide a holding jig that is used for applying a liquid bath treatment to a planar workpiece, has good cleaning capabilities, and avoids intimate contact of the planar workpiece with a rear member of the holding jig so that the planar workpiece can be easily detached from the holding jig after cleaning. A holding jig is used for applying a liquid bath treatment to a planar workpiece. The holding jig comprises a rear member, and a front member that faces the rear member and has an opening portion. The planar workpiece is disposed between the rear member and the front member, and the rear member has a plurality of projections formed on the surface of the rear member facing the front member.
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B05C 13/02 - Means for manipulating or holding work, e.g. for separate articles for particular articles
To provide surface treatment that can reduce occurrence of defects caused by incorporation of dust. Rollers 40 are rotatably fixed to rotating shafts 72 provided to protrude from lateral protective walls 49. The lateral protective walls 49 are fixed perpendicularly to lower protective walls 47 fixed to outer walls 39. Hanging plates 64 of a hanger 50 extend through a space 43 between both lower protective walls 47 and support clips 52. A liquid 41, such as water, is filled in spaces defined by the lateral protective walls 49, the lower protective walls 47, and the outer walls 39. The liquid 41 is filled to cover about half of each rotating shaft 72. Thus, fine dust generated by a transferring mechanism is captured by the liquid 41 and prevented from drifting from the space 34 toward the substrate 54.
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
B05C 5/00 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
A film formation method is provided with a catalyst film formation step for forming a catalyst film on the surface of a substrate by displacement reduction plating, an intermediate film formation step for forming a palladium plating film on the catalyst film, and a surface film formation step for forming a gold plating film on the palladium plating film.
C23C 18/44 - Coating with noble metals using reducing agents
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 18/18 - Pretreatment of the material to be coated
C23C 18/54 - Contact plating, i.e. electroless electrochemical plating
H01L 21/288 - Deposition of conductive or insulating materials for electrodes from a liquid, e.g. electrolytic deposition
An electroless platinum plating solution includes a soluble platinum compound, a complexing agent, a reducing agent, and a halide ion supplying agent, the reducing agent being formic acid.
C23C 18/44 - Coating with noble metals using reducing agents
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
51.
Surface treatment device comprising a paddle for stirring a surface treatment solution, paddle for stirring a surface treatment solution and method thereof
The purpose of the present invention is to provide a surface treatment device and a paddle with improved strength and uniform plating thickness by uniformly stirring surface treatment solution near an object to be plated. Also, the purpose of the present invention is to provide a surface treatment method capable of stirring for a long period of time, by uniformizing plating thickness, and by improving a strength of a paddle. A surface treatment device comprising at least one plateshaped paddle, in a surface treatment tank, for stirring surface treatment solution near an object to be plated by reciprocally moving the paddle with respect to the object to be plated, wherein the paddle is configured by integrally forming a plurality of square bars provided in depth direction of the surface treatment solution in the surface treatment tank along the object to be plated at regular intervals, and a square bar of the plurality of square bars is provided with a curved surface with respect to the object to be plated in a cross section in thickness direction of the square bar.
B05C 3/04 - Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material with special provision for agitating the work or the liquid or other fluent material
B05C 3/09 - Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material for treating separate articles
B01F 11/00 - Mixers with shaking, oscillating, or vibrating mechanisms
C25D 21/10 - Agitating of electrolytesMoving of racks
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C25D 17/00 - Constructional parts, or assemblies thereof, of cells for electrolytic coating
A rotational surface treating device with a high treatment efficiency that allows a treatment liquid to be discharged in a short time is provided. When a treatment bath 2 is rotated, parts 20 contact an electrode 50 to be electroplated. In this event, a plating liquid 16 is used as circulated by a pump P. The plating liquid 16 is discharged to the outside through a gap in a side wall 80 for replacement of the plating liquid 16 or the like. During discharge, the plating liquid 16 is not circulated by the pump P. The gap 8 which is formed in the side wall 80 is formed to be smaller than the minimum dimension of the parts 20 on the inner side. The gap 8 is formed to be wider toward the outer side. Thus, water is discharged immediately.
A shaft member according to an embodiment is provided with a shaft-like base material made of a steel material, a low-phosphorus plating layer layered on the base material and having a phosphorus content of 4.5 mass% or less, and an electrolytic nickel-phosphorus plating layer layered between the base material and the low-phosphorus plating layer or an undercoat plating layer formed as a high-phosphorus plating layer. This allows for improved shaft member strength and size reduction of the shaft member.
C23C 18/36 - Coating with one of iron, cobalt or nickelCoating with mixtures of phosphorus or boron with one of these metals using reducing agents using hypophosphites
C22C 19/03 - Alloys based on nickel or cobalt based on nickel
C22C 38/04 - Ferrous alloys, e.g. steel alloys containing manganese
C23C 28/02 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and only coatings of metallic material
C23C 18/26 - Roughening, e.g. by etching using organic liquids
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 18/18 - Pretreatment of the material to be coated
A semiconductor device includes: a semiconductor element; a support as a metallic member that includes a metallized layer having a first component as an iron group element and a second component as a periodic table group five or group six transition metal element other than chromium provided at an outermost surface of the support, and is arranged such that the outermost surface faces the semiconductor element; a joint material that is arranged between the outermost surface of the support and the semiconductor element, and is joined with the outermost surface to fix the semiconductor element to the support; and a molding resin that is arranged to cover a joint body having the support, the joint material and the semiconductor element.
An electroless nickel-phosphorus-cobalt plating bath contains a water-soluble nickel salt, a hypophosphorous acid salt, a cobalt-containing compound and a heavy metal compound, and additionally contains at least one component selected from the group consisting of an acetylene compound, an iodide ion source or an iodic acid ion source, and a nitro-group-containing aromatic compound that contains at least one nitro group. The concentration of the acetylene compound is 10 to 120 mg/L, the concentration of the iodide ion source or the iodic acid ion source is 10 to 4000 mg/L, and the concentration of the nitro-group-containing aromatic compound is 0.1 to 5000 mg/L.
C23C 18/50 - Coating with alloys with alloys based on iron, cobalt or nickel
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
In the present invention, a plurality of first pins (31) of a frame (2) pass through a plurality of first holes in a back panel (1). A fastening body (33) is caused to move outwardly by a moving mechanism (34) of a locking mechanism (3). Notches (335) fit into recesses in the ends of the first pins (33). Due to this configuration, the frame (2) is locked onto the back panel (1).
The present invention addresses the problem of providing an electroless palladium plating solution that yields a Pd plated coating constituting a plated coating having excellent wire bonding properties even with a heat history. This electroless palladium plating solution contains: a palladium compound; at least one selected from the group consisting of hypophosphite compounds and phosphite compounds; at least one selected from the group consisting of amine borane compounds and hydroboron compounds; and a complexing agent.
The present invention addresses the problem of providing an electroless palladium plating solution that yields a Pd plating film that constitutes a plated film that exhibits an excellent wire bondability even after a thermal history. The electroless palladium plating solution according to the present invention comprises a palladium compound, a reducing agent, a complexing agent, and at least one type selected from the group consisting of Ge and rare earth elements.
Provided are a surface-treatment device and a surface-treatment method capable of improving surface-treatment quality when an object undergoes surface-treatment. The surface-treatment device is used to treat the surface of an object at least partially immersed in a liquid, and includes: a jetting part that is disposed so as to face the object and jets a treatment liquid toward the treatment surface of the object; and a jetting part rotation means for causing the jetting part to rotate in a plane parallel to the treatment surface of the object and/or an object rotation means for causing the object to rotate in a plane perpendicular to the jetting direction of the treatment liquid jetted from the jetting part.
C25D 17/00 - Constructional parts, or assemblies thereof, of cells for electrolytic coating
B05C 3/04 - Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material with special provision for agitating the work or the liquid or other fluent material
B05D 1/18 - Processes for applying liquids or other fluent materials performed by dipping
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
The purpose of the present invention is to provide an Sn or Sn alloy plating solution which is able to have a lower Pb concentration. An electrolytic Sn or Sn alloy plating solution for forming a plated article that is subjected to solder bonding. This electrolytic Sn or Sn alloy plating solution is characterized by containing at least a sulfur-based compound, an Sn salt, one or more acids or water-soluble salts thereof selected from among inorganic acids, organic acids and water-soluble salts thereof, and a surfactant. This electrolytic Sn or Sn alloy plating solution is also characterized in that the sulfur-based compound is a thiol compound (formula A) represented by general formula AA, a salt of the thiol compound (formula A) or a disulfide compound (formula B).
The purpose of the present invention is to provide a measurement method and measurement device that make it possible to accurately measure the concentrations of various metals included in a liquid to be measured that includes a plurality of additives and metals. This X-ray fluorescence analysis measurement method employs measured X-ray fluorescence intensity values to measure the metal concentration of each metal to be measured included in a liquid to be measured that includes one or more types of additives and metals. This X-ray fluorescence analysis measurement method comprises: a calibration-curve-polynomial determination step S11 for determining polynomial approximations of calibration curves for the metals to be measured, a liquid-type-correction-polynomial determination step S12 for determining polynomial approximations for correcting error in the measured X-ray fluorescence intensity values for the metals to be measured resulting from additive inclusion, a specific-gravity-correction-polynomial determination step S13 for determining polynomial approximations for correcting error in the measured X-ray fluorescence intensity values for the metals to be measured resulting from differences in specific gravity of the liquid to be measured, and a metal concentration measurement step S14 for using the polynomial approximations determined in the calibration-curve-polynomial determination step, liquid-type-correction-polynomial determination step, and specific-gravity-correction-polynomial determination step to measure the metal concentrations of the metals to be measured.
G01N 23/223 - Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups , or by measuring secondary emission from the material by irradiating the sample with X-rays or gamma-rays and by measuring X-ray fluorescence
This work holding jig (1A) is provided with a back panel (11) and a frame body (12). The frame body (12) comprises: an annular main body (13); a conductive member (15) which is provided on the entire circumference of the main body (13); a contact member (16) which is provided along the conductive member (15) and is electrically connected to the conductive member (15) so as to be able to come into electrical contact with a peripheral part (101) of a work; and a sealing member (17) which is provided on the entire circumference of the main body (13) so as to be positioned inside the contact member (16). The frame body (12) is configured to form a hermetically sealed space (5) which contains the peripheral part (101), the conductive member (15) and the contact member (16), while having the sealing member (17) and the contact member (16) in contact with the peripheral part (101) of the work; and the frame body (12) has a liquid injection port for injecting a liquid into the hermetically sealed space 5.
Plating machines; Plating machines, in particular electroless plating machines and electrolytic plating machines; Plating baths; Plating tank; Semiconductor manufacturing machines; Printed circuit board manufacturing machines; Machining (Apparatus for -); Chemical processing machines; Semiconductor wafer processing machines; Printed circuit board forming machines; Electrolysis apparatus for electroplating; Chemical processing tank; Plating machines and apparatus for use in semiconductor manufacturing; Plating machines and apparatus for use in printed circuit board production; Surface treatment equipment for use in printed circuit board production; Surface treatment equipment for wafer; Machines for use in the manufacture of electrical and electronic circuitry.
67.
Copper electrolytic plating bath and copper electrolytic plating film
The present invention provides a technology for, in copper electrolytic plating containing silver ions as an alloy component, obtaining a copper electrolytic plating film in which co-deposition of sulfur can be significantly suppressed and which is excellent in physical properties such as strength and hardness even after a high-temperature heat treatment at about 200° C. or higher. The present invention is a copper electrolytic plating bath comprising copper ions, an acid, chloride ions, and a complexing agent, wherein the copper electrolytic plating bath further comprises silver ions as an alloy component, and wherein methionine or a derivative thereof is contained as the complexing agent.
The purpose of the present invention is to provide a filling plating system and a filling plating method capable of filling plating sufficiently even if the plating is interrupted between electrolytic plating cells. A filling plating system for forming filling plating in a via hole and/or a through hole of a work to be plated, comprising: a plurality of electrolytic plating cells; and an additive adhesion region arranged between each of the plurality of electrolytic plating cells, wherein solution containing one or more kinds of additive selected from at least a leveler comprising nitrogen-containing organic compound, a brightener comprising sulfur-containing organic compound, and a carrier comprising polyether compound, is directly adhered to the work to be plated at the additive adhesion region.
Provided is a method for producing a novel printed wiring board that achieves higher adhesion between a filler-containing insulating resin substrate and a plating film. A production method according to the present invention is a method for producing a printed wiring board by subjecting an insulating resin substrate that contains a filler to a swelling treatment, a roughening treatment, a reduction treatment and electroless plating, wherein the insulating resin substrate is treated with a first treatment liquid which contains an ethylene-based glycol ether represented by CmH(2m + 1)-(OC2H4)n-OH (wherein m is an integer of 1-4 and n is an integer of 1-4) and at least one propylene-based glycol ether selected from the group consisting of propylene-based glycol ethers represented by CxH(2x + 1)-(OC3H6)y-OH (wherein x is an integer of 1-4 and y is an integer of 1-3), while having a pH of 7 or more, and is subsequently treated with a second treatment liquid which contains an amine-based silane coupling agent, while having a pH of 7.0 or more after the reduction treatment but before the electroless plating.
C23C 18/20 - Pretreatment of the material to be coated of organic surfaces, e.g. resins
C23C 18/40 - Coating with copper using reducing agents
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
An ultrasonic treatment apparatus including: an ultrasonic bath for performing an ultrasonic treatment on a treatment target object; a first ultrasonic vibrator provided on the front surface side of the treatment target object; and a second ultrasonic vibrator provided on the back surface side of the treatment target object; wherein the first ultrasonic vibrator does not face the second ultrasonic vibrator.
B08B 3/12 - Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
A surface treating apparatus that suppresses occurrence of defects is provided. A treatment solution is accumulated in a tank 15 through a treatment solution collecting port/air discharging port 13 in a lower portion of a body 4. An air heated by the treatment solution flows toward an upper portion (portion without the treatment solution) of the tank 15 via the treatment solution collecting port/air discharging port 13 in the lower portion of the body 4, and is discharged via an exhaust duct 17. In this way, the air that is heated and tends to flow upward in the body 4 is discharged from the lower portion thereof and is replaced with an external air from the upper portion thereof. Accordingly, the air in the body 4 can be maintained at a uniform temperature. Thus, the treatment solution that reaches a lower portion of a substrate 54 from an upper portion thereof can be maintained at a uniform temperature. The air is caused to flow toward the lower portion from the upper portion in the body 4, so that the substrate 54 is pulled downward, and swinging of the substrate 54 can thus be reduced. Therefore, the substrate 54 can be less likely to contact an inlet 44 and an outlet 46.
B05C 5/00 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
B05C 11/11 - Vats or other containers for liquids or other fluent materials
B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
B08B 3/04 - Cleaning involving contact with liquid
B08B 11/02 - Devices for holding articles during cleaning
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
B05C 3/09 - Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material for treating separate articles
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; Plating solutions; Electroless plating solutions; Electroplating solutions; Metal plating compositions; Auxiliary agents for plating; Chemicals for use in metal plating; Surface-active chemical agents; Detergents for use in manufacturing processes; Chemicals for use with electroless plating baths and electroplating baths; Additives for plating bath; Pretreatment agents for plating; Etching agents; Chemical preparations for surface treatment; Agents for stripping of plated layers; Chemicals used in the manufacture and fabrication of printed circuit boards, namely, metallization chemicals including desmear treatment, sensitizers, conditioners, activators, and neutralizers.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; Plating solutions; Electroless plating solutions; Electroplating solutions; Metal plating compositions; Auxiliary agents for plating; Chemicals for use in metal plating; Surface-active chemical agents; Detergents for use in manufacturing processes; Chemicals for use with electroless plating baths and electroplating baths; Additives for plating bath; Pretreatment agents for plating; Etching agents; Chemical preparations for surface treatment; Agents for stripping of plated layers; Chemicals used in the manufacture and fabrication of printed circuit boards, namely, metallization chemicals including desmear treatment, sensitizers, conditioners, activators, and neutralizers.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; Plating solutions; Electroless plating solutions; Electroplating solutions; Metal plating compositions; Auxiliary agents for plating; Chemicals for use in metal plating; Surface-active chemical agents; Detergents for use in manufacturing processes; Chemicals for use with electroless plating baths and electroplating baths; Additives for plating bath; Pretreatment agents for plating; Etching agents; Chemical preparations for surface treatment; Agents for stripping of plated layers; Chemicals used in the manufacture and fabrication of printed circuit boards, namely, metallization chemicals including desmear treatment, sensitizers, conditioners, activators, and neutralizers.
01 - Chemical and biological materials for industrial, scientific and agricultural use
07 - Machines and machine tools
09 - Scientific and electric apparatus and instruments
Goods & Services
Industrial chemicals; Plating solutions; Electroless plating solutions; Electroplating solutions; Metal plating compositions; Auxiliary agents for plating; Chemicals for use in metal plating; Surface-active chemical agents; Detergents for use in manufacturing processes; Chemicals for use with electroless plating baths and electroplating baths; Additives for plating bath; Pretreatment agent for plating; Etching agents; Chemical preparations for surface treatment; Agents for stripping of plated layers; Chemicals used in the manufacture and fabrication of printed circuit boards, namely, metallization chemicals including desmear treatment, sensitizers, conditioners, activators, and neutralizers. Plating machines; Plating machines, in particular electroless plating machines and electrolytic plating machines; Plating baths; Plating tank; Semiconductor manufacturing machines; Printed circuit board manufacturing machines; Machines and apparatus for polishing [electric]; Metalworking machines; Machining (Apparatus for -); Machines and apparatus for desmear treatment; Chemical processing machines; Semiconductor wafer processing machines; Printed circuit board forming machines; Grinding machines; Desmear treatment device; Electrolysis apparatus for electroplating; Chemical processing tanks; Plating machines and apparatus for use in semiconductor manufacturing; Plating machines and apparatus for use in printed circuit board production; Surface treatment equipment for use in printed circuit board production; Surface treatment equipment for wafer; Chemical handling machines, in particular electrolytic regeneration apparatus; Machines for use in the manufacture of electrical and electronic circuitry. Computer software; Measuring apparatus; Control devices (Automatic -); Automatic plating solution control machines; Electrodes; Electrolysers; Regulating apparatus, electric; Printing plate scanners.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; Plating solutions; Electroless plating solutions; Electroplating solutions; Metal plating compositions; Auxiliary agents for plating; Chemicals for use in metal plating; Surface-active chemical agents; Detergents for use in manufacturing processes; Chemicals for use with electroless plating baths and electroplating baths; Additives for plating bath; Pretreatment agents for plating; Etching agents; Chemical preparations for surface treatment; Agents for stripping of plated layers; Chemicals used in the manufacture and fabrication of printed circuit boards, namely, metallization chemicals including desmear treatment, sensitizers, conditioners, activators, and neutralizers.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; Plating solutions; Electroless plating solutions; Electroplating solutions; Metal plating compositions; Auxiliary agents for plating; Chemicals for use in metal plating; Chemical activators in the nature of industrial chemicals; Chemical activators for use in industrial surface finishing; Chemicals for use with electroless plating baths and electroplating baths; Additives for plating bath; Pretreatment agent for plating; Etching agents; Chemical preparations for surface treatment; Agents for stripping of plated layers; Chemicals used in the manufacture and fabrication of printed circuit boards, namely, metallization chemicals including desmear treatment, sensitizers, conditioners, activators, and neutralizers.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; Plating solutions; Electroless plating solutions; Electroplating solutions; Metal plating compositions; Auxiliary agents for plating; Chemicals for use in metal plating; Surface-active chemical agents; Detergents for use in manufacturing processes; Chemicals for use with electroless plating baths and electroplating baths; Additives for plating bath; Pretreatment agents for plating; Etching agents; Chemical preparations for surface treatment; Agents for stripping of plated layers; Chemicals used in the manufacture and fabrication of printed circuit boards, namely, metallization chemicals including desmear treatment, sensitizers, conditioners, activators, and neutralizers.
01 - Chemical and biological materials for industrial, scientific and agricultural use
07 - Machines and machine tools
09 - Scientific and electric apparatus and instruments
Goods & Services
Industrial chemicals; Plating solutions; Electroless plating solutions; Electroplating solutions; Metal plating compositions; Auxiliary agents for plating; Chemicals for use in metal plating; Surface-active chemical agents; Detergents for use in manufacturing processes; Chemicals for use with electroless plating baths and electroplating baths; Additives for plating bath; Pretreatment agent for plating; Etching agents; Chemical preparations for surface treatment; Agents for stripping of plated layers; Chemicals used in the manufacture and fabrication of printed circuit boards, namely, metallization chemicals including desmear treatment, sensitizers, conditioners, activators, and neutralizers. Plating machines; Plating machines, in particular electroless plating machines and electrolytic plating machines; Plating baths; Plating tank; Semiconductor manufacturing machines; Printed circuit board manufacturing machines; Machines and apparatus for polishing [electric]; Metalworking machines; Machining (Apparatus for -); Machines and apparatus for desmear treatment; Chemical processing machines; Semiconductor wafer processing machines; Printed circuit board forming machines; Grinding machines; Desmear treatment device; Electrolysis apparatus for electroplating; Chemical processing tanks; Plating machines and apparatus for use in semiconductor manufacturing; Plating machines and apparatus for use in printed circuit board production; Surface treatment equipment for use in printed circuit board production; Surface treatment equipment for wafer; Chemical handling machines, in particular electrolytic regeneration apparatus; Machines for use in the manufacture of electrical and electronic circuitry. Computer software; Measuring apparatus; Control devices (Automatic -); Automatic plating solution control machines; Electrodes; Electrolysers; Regulating apparatus, electric; Printing plate scanners.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; Plating solutions; Electroless plating solutions; Electroplating solutions; Metal plating compositions; Auxiliary agents for plating; Chemicals for use in metal plating; Surface-active chemical agents; Detergents for use in manufacturing processes; Chemicals for use with electroless plating baths and electroplating baths; Additives for plating bath; Pretreatment agents for plating; Etching agents; Chemical preparations for surface treatment; Agents for stripping of plated layers; Chemicals used in the manufacture and fabrication of printed circuit boards, namely, metallization chemicals including desmear treatment, sensitizers, conditioners, activators, and neutralizers.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; Plating solutions; Electroless plating solutions; Electroplating solutions; Metal plating compositions; Auxiliary agents for plating; Chemicals for use in metal plating; Surface-active chemical agents; Detergents for use in manufacturing processes; Chemicals for use with electroless plating baths and electroplating baths; Additives for plating bath; Pretreatment agents for plating; Etching agents; Chemical preparations for surface treatment; Agents for stripping of plated layers; Chemicals used in the manufacture and fabrication of printed circuit boards, namely, metallization chemicals including desmear treatment, sensitizers, conditioners, activators, and neutralizers.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Industrial chemicals; Plating solutions; Electroless plating solutions; Electroplating solutions; Metal plating compositions; Auxiliary agents for plating; Chemicals for use in metal plating; Surface-active chemical agents; Detergents for use in manufacturing processes; Chemicals for use with electroless plating baths and electroplating baths; Additives for plating bath; Pretreatment agents for plating; Etching agents; Chemical preparations for surface treatment; Agents for stripping of plated layers; Chemicals used in the manufacture and fabrication of printed circuit boards, namely, metallization chemicals including desmear treatment, sensitizers, conditioners, activators, and neutralizers.
A drying apparatus of the present invention includes a drying tank for performing drying processing of a workpiece, a fixture for the workpiece, heating means opposed to a front surface of the workpiece, and heating means opposed to a back surface of the workpiece, wherein each heating means is inclined from a horizontal line in its longitudinal direction.
H05K 3/22 - Secondary treatment of printed circuits
F26B 3/30 - Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun from infrared-emitting elements
F26B 15/14 - Machines or apparatus for drying objects with progressive movementMachines or apparatus with progressive movement for drying batches of material in compact form with movement in a path composed of one or more straight lines, e.g. compound the lines being all horizontal or slightly inclined the objects or batches of materials being carried by trays or racks
F26B 21/00 - Arrangements for supplying or controlling air or gases for drying solid materials or objects
To provide surface treatment that can reduce occurrence of defects caused by incorporation of dust. Rollers 40 are rotatably fixed to rotating shafts 72 provided to protrude from lateral protective walls 49. The lateral protective walls 49 are fixed perpendicularly to lower protective walls 47 fixed to outer walls 39. Hanging plates 64 of a hanger 50 extend through a space 43 between both lower protective walls 47 and support clips 52. A liquid 41, such as water, is filled in spaces defined by the lateral protective walls 49, the lower protective walls 47, and the outer walls 39. The liquid 41 is filled to cover about half of each rotating shaft 72. Thus, fine dust generated by a transferring mechanism is captured by the liquid 41 and prevented from drifting from the space 34 toward the substrate 54.
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
85.
NICKEL PLATING SOLUTION AND NICKEL PLATING SOLUTION PRODUCTION METHOD
The purpose of the present invention is to provide a satin nickel plating solution that enables satin nickel plating without resulting in poor appearance and does not require an activated carbon treatment for a long time. This nickel-plating solution is to be used for satin nickel-plating and characterized by containing at least a saccharinate, a primary amine compound and a cationic surfactant.
A device capable of performing surface treatment evenly to an upper portion of a substrate is provided. An upper end of a substrate 54 is sandwiched and held by a clip 52 of a hanger 50. A pipe 56 as a treatment solution releasing section is provided on each side of the substrate 54 that is held by the hanger 50. This pipe 56 is provided with a hole 58 from which the treatment solution is released obliquely upward. The released treatment solution flows down on a surface of the substrate 54, reaches a lower portion thereof, is circulated by a pump 60, and is released from the pipe 56 again.
C23C 4/12 - Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
B05C 3/09 - Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material for treating separate articles
B05B 12/16 - Arrangements for controlling deliveryArrangements for controlling the spray area for controlling the spray area
C23C 4/02 - Pretreatment of the material to be coated, e.g. for coating on selected surface areas
C23C 4/04 - Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
B05B 13/02 - Means for supporting workArrangement or mounting of spray headsAdaptation or arrangement of means for feeding work
B05B 1/04 - Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops in flat form, e.g. fan-like, sheet-like
B05B 15/58 - Arrangements for cleaningArrangements for preventing deposits, drying-out or blockageArrangements for detecting improper discharge caused by the presence of foreign matter preventing deposits, drying-out or blockage by recirculating the fluid to be sprayed from upstream of the discharge opening back to the supplying means
A semiconductor device (1) is provided with: a semiconductor element (2); a support body (3) that is a metal member having as an outermost surface (35) a metallized layer (34) containing a first component that is an iron-group element, and a second component that is a periodic table group 5 or group 6 transition metal element other than chromium, the support body (3) being disposed so that the outermost surface faces the semiconductor element; a joining member (4) that is provided so as to be disposed between the outermost surface of the support body and the semiconductor element, the joining member (4) being joined to the outermost surface, whereby the semiconductor element is secured to the support body; and a molding resin (6) provided so as to cover the joined body (S) made from the support body, the joining member, and the semiconductor element.
Provided is a novel pretreating liquid for electroless plating which is to be used during a reduction treatment after roughening a filler-containing insulating resin base. The pretreating liquid for electroless plating of the present invention is to be used during a treatment for reducing residues formed on a filler-containing insulating resin base which has undergone roughening. The pretreating liquid comprises a reducing agent and at least one compound selected from the group consisting of ethylene glycol ethers represented by CmH(2m+1)-(OC2H4)n-OH (where m is an integer of 1-4 and n is an integer of 1-4) and propylene glycol ethers represented by CxH(2x+1)-(OC3H6)y-OH (where x is an integer of 1-4 and y is an integer of 1-3).
C23C 18/18 - Pretreatment of the material to be coated
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
The ampholytic surfactants show the nature of anionic surfactants in an alkaline region and the nature of cationic surfactants in an acidic region. As described below, the pretreatment solution of the present invention may preferably indicate alkalinity of pH 8.5 or higher, and therefore, it exhibits the nature of cationic surfactants by the use of ampholytic surfactants. As the ampholytic surfactants, those disclosed in JP 2011-228517 A can be used.
C23C 18/20 - Pretreatment of the material to be coated of organic surfaces, e.g. resins
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
A clamper includes: a first clamping member having a first base portion and a first contact portion that is to be in contact with one surface of the workpiece; a second clamping member having a second contact portion that is to be in contact with the other surface of the workpiece; and a clamping member biasing member configured to bias at least one of the first clamping member and the second clamping member in a direction of bringing the first contact portion and the second contact portion closer to each other. The first contact portion has a plurality of plate spring portions extending from the first base portion, the plurality of plate spring portions configured to elastically deform independently from each other to come into contact with the workpiece.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
B25B 5/06 - Arrangements for positively actuating jaws
This electroless platinum plating bath contains a water-soluble platinum compound, a complexing agent, a reducing agent and a halide ion donating agent; and the reducing agent is composed of formic acid.
A film formation method is provided with a catalyst film formation step for forming a catalyst film on the surface of a substrate by displacement reduction plating, an intermediate film formation step for forming a palladium plating film on the catalyst film, and a surface film formation step for forming a gold plating film on the palladium plating film.
A copper plating solution includes: water-soluble copper salt; ethylenediamine; at least one of EDTA, a substituted derivative of EDTA, an ethylenediamine derivative, or glycine; and at least one of hydantoin or a substituted derivative thereof. The copper plating solution allows an aluminum or aluminum alloy base to be displacement-plated with copper.
A solution comprising a palladium compound and a polyaminocarboxylic compound has been found to be suitable as a bath for electroless plating of palladium onto copper. Use of such a solution produces a plated component comprising a copper surface and a palladium plated coating having a thickness of between 0.01 micrometers (μm) and 5 μm. A method for electroless plating of palladium onto a copper surface of a component includes preparing a bath having a palladium compound and a polyaminocarboxylic compound. The copper component is submerged in the bath to plate a palladium layer on the copper surface of the component. The component resulting from the plating method has a palladium layer plated on the copper surface.
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 18/44 - Coating with noble metals using reducing agents
H05K 1/09 - Use of materials for the metallic pattern
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
96.
COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM PHOSPHORUS ON COPPER, AND A COATED COMPONENT THEREFROM
A solution comprising a palladium compound and a polyaminocarboxylic compound has been found to be suitable as a bath for electroless plating of palladium onto copper. Use of such a solution produces a plated component comprising a copper surface and a palladium plated coating having a thickness of between 0.01 micrometers (µm) and 5 µm. A method for electroless plating of palladium onto a copper surface of a component includes preparing a bath having a palladium compound and a polyaminocarboxylic compound. The copper component is submerged in the bath to plate a palladium layer on the copper surface of the component. The component resulting from the plating method has a palladium layer plated on the copper surface.
C23C 18/44 - Coating with noble metals using reducing agents
B01J 13/00 - Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided forMaking microcapsules or microballoons
97.
Composition and method for electroless plating of palladium phosphorus on copper, and a coated component therefrom
A solution comprising a palladium compound and a polyaminocarboxylic compound has been found to be suitable as a bath for electroless plating of palladium onto copper. Use of such a solution produces a plated component comprising a copper surface and a palladium plated coating having a thickness of between 0.01 micrometers (μm) and 5 μm. A method for electroless plating of palladium onto a copper surface of a component includes preparing a bath having a palladium compound and a polyaminocarboxylic compound. The copper component is submerged in the bath to plate a palladium layer on the copper surface of the component. The component resulting from the plating method has a palladium layer plated on the copper surface.
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 18/44 - Coating with noble metals using reducing agents
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
98.
PRETREATMENT AGENT FOR ELECTROLESS PLATING, AND PRETREATMENT METHOD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD IN WHICH PRETREATMENT AGENT FOR ELECTROLESS PLATING IS USED
Provided is a novel pretreatment agent for electroless plating, not only having excellent adsorption of a catalyst used prior to electroless plating, but also having excellent anti-foaming properties whereby bubble formation is suppressed in a short time, and excellent permeability to a substrate. This pretreatment agent for electroless plating contains a silane coupling agent, a surfactant, an ethylene glycol butyl ether represented by the formula C4H9-(OC2H4)n-OH (n = an integer of 1-4), and/or a propylene glycol butyl ether represented by the formula C4H9-(OC3H6)n-OH (n = an integer of 1-4).
C23C 18/20 - Pretreatment of the material to be coated of organic surfaces, e.g. resins
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
99.
METHOD FOR MANUFACTURING WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTURED THEREBY
A method for manufacturing a wiring substrate which includes performing electroless plating on a substrate to be treated which has a via hole and/or trench while the substrate is immersed in an electroless plating solution, thereby embedding a plating metal in the via hole and/or trench, the method comprising at least the steps of: supplying the electroless plating solution below the substrate; diffusing an oxygen-containing gas into the electroless plating solution supplied below the substrate; and causing the plating solution to overflow from above the substrate.
C23C 18/40 - Coating with copper using reducing agents
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
Provided is a tin electroplating bath for obtaining a tin plating film for which the occurrence of tin whiskers when an external stress is applied on the tin plating film is limited. The tin electroplating bath is characterized in comprising at least one kind of compound selected from a group consisting of flavonoid compounds and glycosides thereof, compounds with a xanthene backbone and glycosides thereof, and compounds with an acridine backbone and glycosides thereof.
