A connector includes a plurality of contacts each including first and second contact pieces provided with first and second contact portions at distal end sides, respectively, that come into contact with conductor portions of two insertable/removable connection objects when the connection objects are inserted, and a connection portion to be connected and secured to a board. The connector further includes a housing that holds the contacts in an array and includes an insertion opening of a shape that allows insertion of the connection objects and a battery from a same direction, and a terminal is arranged in the housing and spaced apart from the contacts in a width direction of the housing, the terminal including third and fourth contact pieces provided with third and fourth contact portions on distal end sides, respectively, configured to come into contact with the conductor portion of one of the connection objects and the battery.
H01R 24/00 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
H01R 27/02 - Coupling parts adapted for co-operation with two or more dissimilar counterparts for simultaneous co-operation with two or more counterparts
H01R 12/73 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
A printed wiring board includes one or more substrates, the one or more substrates including at least a first substrate, the first substrate being formed with a pad and a ground layer at any one of main surfaces of the first substrate, the pad being to be electrically connected to a connector as another component, the ground layer being formed to surround the pad from a circumference of the pad and have an inner edge at a location separated from an outer edge of the pad with a predetermined distance, the ground layer being to be grounded to a ground contact.
A printed wiring board including: a first substrate on which a plurality of pads to be connected to a connector is arranged to form a front array and a rear array in two rows; a second substrate that is laminated on the first substrate and formed with first wirings connected to first pads of the front array and second wirings connected through vias to second pads of the rear array; engageable parts that are to be engaged with engagement parts of the connector; and one or more reinforcement layers that are provided at the frontward side in the connecting direction than the engageable parts of the first substrate and/or the second substrate. The wirings each have a part formed to have a constant width along the inserting direction to the connector and an expanded-width part expanded to have a wider width than the constant width in the inserting direction of the connector.
a); and engageable parts (28, 29) that are formed at side edge parts of the connection end portion (13) and are to be engaged with engagement parts (58) of the other electronic component (50) in the direction of disconnection. The flexible printed wiring board (1) further includes reinforcement layers (31, 32) that are disposed at the other surface side of the base substrate (3) and at a frontward side with respect to the engageable parts (28, 29) when viewed in the direction of connection with the other electronic component, and that are formed separately from the wirings (9, 11).
H01R 13/62 - Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
H01R 12/73 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
H01R 12/88 - Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
H01R 12/77 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
H01R 12/00 - Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocksCoupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structuresTerminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
H01R 12/73 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
H01R 12/88 - Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
a); and engageable parts (28, 29) that are formed at side edge parts of the connection end portion (13) and are to be engaged with engagement parts (58) of the other electronic component (50) in the direction of disconnection. The flexible printed wiring board (1) further includes reinforcement layers (31, 32) that are disposed at the other surface side of the base substrate (3) and at a frontward side with respect to the engageable parts (28, 29) when viewed in the direction of connection with the other electronic component, and that are formed integrally with the wirings (9).
H01R 12/78 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to other flexible printed circuits, flat or ribbon cables or like structures
H01R 12/88 - Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
H01R 12/73 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H01R 12/77 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
H01R 12/88 - Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
8.
Printed wiring board and connector connecting the wiring board
a); and engageable parts (28, 29) that are formed at side edge parts of the connection end portion (13) and are to be engaged with engagement parts (58) of the other electronic component (50) in the direction of disconnection. The flexible printed wiring board (1) further includes reinforcement layers (31, 32) that are disposed at the other surface side of the base substrate (3) and at a frontward side with respect to the engageable parts (28, 29) when viewed in the direction of connection with the other electronic component, and that are formed integrally with the wirings (9).
H01R 12/77 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H01R 12/88 - Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
H01R 12/72 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
The present invention addresses the problem of providing a solder alloy for plating and an electronic component, which are capable of suppressing the formation of external stress-type whiskers. This solder alloy for plating contains Sn and Ni, with the Ni content being 0.06-5.0 mass% inclusive and the remainder comprising Sn, and is used in electrical contacts that are electrically connected through mechanical joining.
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
The present invention provides a connector that has a simple and inexpensive structure and is structured to not only connect two objects to be connected, but also to connect to a battery. This connector (20) comprises: a plurality of contacts (22) which have a first and a second contact piece (221, 223) provided with a first and a second contact part (222, 224) that come into contact with conductor parts (301, 321) of two objects to be connected (30, 32), and which have a connecting part (226) that is connected and fixed to a substrate; a housing (24) that holds the plurality of contacts (22) and has three insertion openings (15-17) that have a shape such that the two objects to be connected (30, 32) and a battery (34) can be respectively inserted from the same direction; and a terminal (26) that is disposed in a position in the housing (24) spaced apart from the plurality of contacts (22) in the width direction W of the housing (24), and that has a third and a fourth contact piece (261, 263) which are respectively provided, to the front end sides thereof, with a third and a fourth contact part (262, 264) that come into contact with the battery (34) and the conductor part (301) of one of the objects to be connected (30) of the two objects to be connected (30, 32).
H01R 12/73 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
A connector includes a housing and a plurality of signal contacts and a plurality of ground contacts. Each contact includes a contact portion that contacts an object, a connection portion mounted on a substrate, and a fixing portion located between the contact portion and the connection portion in the vicinity of the connection portion. The signal contact and the ground contact are aligned and held in the housing, and the fixing portion is fixed to the housing. When the plurality of signal contacts are arranged between the ground contacts, at least two of the ground contacts are coupled and connected integrally or by a separate component, the coupling and connection being made in a section of each ground contact between one end (leading end) of the contact portion and the fixing portion, so that high-frequency transmission characteristics are improved.
Provided is a printed wiring board (1) including at least a first substrate (11) in which pads (2), which are electrically connected to other connectors, and ground layers (3), which enclose the pads (2) from around the pads (2), are formed on any one of the main surfaces; the ground layers (3) being connected to a ground contact and being formed so as to have an inner edge set apart from the outer edge of the pads (2) by a predetermined distance. Trenches (4) are formed between the pads (2) and the ground layers (3).
A contact configured to be retained and arranged in an insulating object includes a contact portion that is configured to come into contact with a counterpart object, a connecting portion connectable to an object to be connected, a main body portion having two side walls and a joining wall that joins the side walls, the main body portion having a substantially U-shaped cross section, first and second contact pieces protruding from the two side walls and extending along a direction of mating with a counterpart object, and first and second contact portions disposed at free end parts of the first and second contact pieces, respectively. The first and second contact portions each has a curved shape and configured to come into contact with the same surface of the counterpart object. The first and second contact portions are spaced apart along the direction of mating, the first and second contact portions being configured to come into roll-face contact with the counterpart object.
Provided is a printed wiring board comprising: a first substrate (31) on which multiple pads (15, 17) to be connected to other connectors are arranged in two front and rear rows; a second substrate (32) which is laminated on the first substrate (31) and in which there are formed first wires (9), which are connected to the first pads (15) in the front row, and second wires (11) which are connected through vias to the second pads (17) in the rear row; engaged parts (28, 29) which are to be engaged with and fixed to the engaging parts of a connector; and reinforcing layers (R1, R2) which are of the first substrate (31) and/or second substrate (32) and which are located in front of the engaged parts (28, 29) in the connection direction (I), wherein the wires (9, 11) have parts which are so formed as to have the same width along the direction of insertion into the connector and wherein the wires (9, 11) further have width-expanded parts which are located at positions corresponding to the respective pads (15, 17) and the widths of which are expanded wider than the aforementioned same width in the direction of insertion of the connector and which include first width-expanded parts having approximately the same shape as the first pads (15) and second width-expanded parts having approximately the same shape as the second pads (17).
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H01R 12/77 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
H01R 12/88 - Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
This printed wiring board (1) is provided with: a base substrate (3); a plurality of pads (15a, 17a) for electrical connection that are disposed at one surface side of the base substrate (3) and are of a connection terminal section (13) connecting to another electronic component (50); wiring (9, 11) connected to the pads (15a, 17a); and engaged sections (28, 29) that are formed at the lateral edge portion of the connection terminal section (13) and that are locked in the direction of disengagement to an engagement section (58) of the other electronic component (50). Also, the printed wiring board (1) is provided with reinforcing layers (31, 32) that are formed separately from the wiring (9, 11) and are disposed at the other surface side of the base substrate (3) and to the front side of the engaged sections (28, 29) with respect to the direction of connection to the other electronic component.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H01R 12/77 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
H01R 12/88 - Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
This printed wiring board (1) is provided with: a base substrate (3); a plurality of pads (15a, 17a) for electrical connection that are disposed at one surface side of the base substrate (3) and are of a connection terminal section (13) connecting to another electronic component (50); wiring (9, 11) connected to the pads (15a, 17a); and engaged sections (28, 29) that are formed at the lateral edge portion of the connection terminal section (13) and that are locked in the direction of disengagement to an engagement section (58) of the other electronic component (50). The wiring (9, 11) is disposed at the other surface side of the base substrate (3). The printed wiring board (1) is provided with reinforcing layers (31, 32) that are formed integrally with pad (15a) and are disposed at the one surface side of the base substrate (3) and to the front side of the engaged sections (28, 29) with respect to the direction of connection to the other electronic component.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H01R 12/77 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
H01R 12/88 - Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
This printed wiring board (1) is provided with: a base substrate (3); a plurality of pads (15a, 17a) for electrical connection disposed at one surface side of the base substrate (3) and for a connection terminal section (13) connecting to another electronic component (50); wiring (9, 11) connecting to the pads (15a, 17a); and engaged sections (28, 29) that are formed at the lateral edge section of the connection terminal section (13) and that are locked in the direction of disengagement to an engagement section (58) of the other electronic component (50). Also, the printed wiring board (1) is provided: with reinforcing layers (31, 32) formed integrally with pad (15a) and disposed at the one surface side of the base substrate (3) and at the front side of the engaged sections (28, 29) with respect to the connection direction to the other electronic component; and insulating layers (34, 35) covering the reinforcing layers (31, 32).
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H01R 12/77 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
H01R 12/88 - Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
This printed wiring board (1) is provided with: a base substrate (3); a plurality of pads (15a, 17a) for electrical connection disposed at one surface side of the base substrate (3) and for a connection terminal section (13) connecting to another electronic component (50); wiring (9, 11) connecting to the pads (15a, 17a); and engaged sections (28, 29) that are formed at the lateral edge section of the connection terminal section (13) and that are locked in the direction of disengagement to an engagement section (58) of the other electronic component (50). Also, the printed wiring board (1) is provided with reinforcing layers (31, 32) formed integrally with the wiring (9) and disposed at the front side of the engaged sections (28, 29) and at the other surface side of the base substrate (3) with respect to the connection direction to the other electronic component.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H01R 12/77 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
H01R 12/88 - Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
This printed wiring board (1) is provided with: a base substrate (3); a plurality of pads (15a, 17a) for electrical connection disposed at one surface side of the base substrate (3) and for a connection terminal section (13) connecting to another electronic component (50); wiring (9, 11) connecting to the pads (15a, 17a); and engaged sections (28, 29) that are formed at the lateral edge section of the connection terminal section (13) and that are locked in the direction of disengagement to an engagement section (58) of the other electronic component (50). Also, the printed wiring board (1) is provided with reinforcing layers (31, 32) formed integrally with the wiring (9) and disposed at the other surface side of the base substrate (3) and at the front side of the engaged sections (28, 29) with respect to the connection direction to the other electronic component.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H01R 12/77 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
H01R 12/88 - Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
Provided is an electronic component that has an inexpensive structure and exhibits superior corrosion resistance even when exposed to a current of a four-gas mixture. An electronic component (10) is provided with at least a contact member (14), which has at least an undercoat plating layer (147) and a main plating layer (149) formed upon the undercoat plating layer (147), on the surface of a contact section that contacts another contact member. The electronic component (10) is further provided with a coating film (16), which contains a fluorinated oil, on the main plating layer (149). The coating film (16) has a dry coating mass per unit area of the main plating layer (149) of 0.011 mg/cm2 or higher.
C23F 17/00 - Multi-step processes for surface treatment of metallic material involving at least one process provided for in class and at least one process covered by subclass or or class
C23F 11/00 - Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
C25D 5/10 - Electroplating with more than one layer of the same or of different metals
C25D 5/48 - After-treatment of electroplated surfaces
C25D 7/00 - Electroplating characterised by the article coated
The purpose of the present invention is to provide an electric connector, which has a reduced size without using a complicated structure, and which makes it possible to fit in and remove the electric connector, including a safety apparatus, by means of a series of operations. An electric connector (10) of the present invention is provided with a plug connector (20) and a receptacle connector (30). The plug connector (20) has a plug contact (241), plug housings (21, 23), and a contact for first detection (261). The receptacle connector (30) has a receptacle contact (331), a receptacle housing (31), and a contact for second detection (322). Furthermore, an operation lever (25) is rotatably attached to the plug housing (21). After the connectors are fitted in, electricity is carried in a detection circuit, and a safety apparatus is operated by bringing into contact with each other the contact for first detection (261), which is provided on the operation lever (25), and the contact for second detection (322).
A connector includes a housing and a plurality of signal contacts and a plurality of ground contacts. Each contact includes a contact portion that contacts an object, a connection portion mounted on a substrate, and a fixing portion located between the contact portion and the connection portion in the vicinity of the connection portion. The signal contact and the ground contact are aligned and held in the housing, and the fixing portion is fixed to the housing. When the plurality of signal contacts are arranged between the ground contacts, at least two of the ground contacts are coupled and connected integrally or by a separate component, the coupling and connection being made in a section of each ground contact between one end (leading end) of the contact portion and the fixing portion, so that high-frequency transmission characteristics are improved.
The present invention provides a coaxial connector and the like which can be adjusted such that the VSWR is improved and the characteristic impedance of a coaxial cable is maintained, and effectively achieves a great reduction in height. This coaxial connector (1) is characterized by being provided with a signal conductor (3), a ground conductor (5), and an insulator (7), and in that in a both-conductor-opposed region (13) in which the ground conductor (5) and the signal conductor (3) are disposed opposing each other, a distance enlargement part (15) in which the vertical distance (X) between the inner surface (5a) of the ground conductor (5) and the back surface (3a) of the signal conductor (3), which is the surface facing the inner surface (5a), becomes larger without increasing the thickness dimension (t) of the coaxial connector (1) is formed.
H01R 24/44 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency comprising impedance matching means or electrical components, e.g. filters or switches comprising impedance matching means
H01R 9/05 - Connectors arranged to contact a plurality of the conductors of a multiconductor cable for coaxial cables
H01R 13/04 - Pins or blades for co-operation with sockets
H01R 24/38 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
An electrical connector is miniaturized and reduced in profile height, yet maintains strength and connection stability, uses elastic fixtures as a power source and provides stable fitting. When connectors are fitted with each other, a first contact of an elastic first fixture is brought to contact a second contact of a second fixture to be used as a power source. An inclined portion of a receptacle contact and an inclined portion of an insertion hole of a housing are formed roughly in the same shape to adjust support of the receptacle contact and provide stable connection. A first chamfered portion of the receptacle contact engages a recess of a plug contact to produce a clicking feeling. The first chamfered portions are positioned and brought to contact the recesses so the plug contact is held between a contact portion and an elastic portion of the receptacle contact.
H01R 12/00 - Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocksCoupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structuresTerminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
27.
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
Disclosed is an electronic component comprising at least a conductive member, wherein corrosion is prevented or suppressed and high connection reliability is achieved by providing an adequate layer between the conductive member and a main plating layer formed on top of the conductive member. A method for manufacturing the electronic component is also disclosed. The electronic component comprising at least a conductive member is provided, on the surface of the conductive member, with a base plating layer and a main plating layer formed on the base plating layer, and is characterized in that the base plating layer is an electrolytic Ni-P plating layer.
A microcontact according to the invention is less than 10 mm in length and composed of a conductive basis material, a base surface treatment layer formed thereon, and an upper surface treatment layer, and includes a contact portion, a terminal portion, and an intermediate portion formed over its entire circumference with exposed oxide surfaces of the base surface treatment layer. The exposed oxide surfaces are formed by irradiating the front and rear surfaces of the contact with laser beams at respective predetermined inclined angles to remove the upper surface treatment layer and simultaneously to oxidize the narrow base surface treatment layer exposed by the removal of the upper surface treatment layer. In this manner, the exposed oxide surfaces can be formed with a high accuracy in a simple manner for stopping solder rise at a predetermined position when the terminal portion of the microcontact is jointed to a substrate by soldering.
B23K 26/38 - Removing material by boring or cutting
H01R 43/16 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
H01R 13/03 - Contact members characterised by the material, e.g. plating or coating materials
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
29.
PROCESS FOR PRODUCING ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT PRODUCED BY THE PROCESS
This invention provides a process for producing an electronic component, which can suppress an external force-type whisker without diffusion of component atoms constituting a material (70) and a substrate layer (72) into a tin-containing material layer (74), and an electronic component produced by the process. In the production process, the material (70) is subjected to surface treatment. The production process comprises the step of providing the substrate layer (72) on the surface of the material (70) to surface treat the material (70), and the step of providing a tin-containing material layer (74) above the substrate layer (72) to surface treat the substrate layer (72). The production process further comprises the step of, before the provision of the tin-containing material layer (74), providing a barrier intermediate layer (76) for preventing the component atoms constituting the material (70) and the substrate layer (72) from being diffused into the tin-containing material layer (74) to suppress the occurrence of external force-type whiskers upon the application of external force to the surface of the tin-containing material layer (74).
C25D 7/00 - Electroplating characterised by the article coated
C25D 5/12 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices
patents
