Embodiments of the present application provide a power supply device and a terminal. The device comprises a battery module and optical engine modules. The battery module is electrically connected to the optical engine modules. The battery module is used for providing electric signals to the optical engine modules, so that the battery module directly supplies power to the optical engine modules, reducing the length of the power supply line, and also reducing the width of the power supply line.
A diopter adjusting apparatus and a VR device. The diopter adjusting apparatus comprises: a lens mounting part for mounting a lens module; a guide adjusting part connected to the lens mounting part, wherein the guide adjusting part can move along a preset path such that the lens mounting part moves in a first direction; and a driving part used for driving the guide adjusting part to move along the preset path. Compared with the prior art, by means of the arranged lens mounting part, guide adjusting part, and driving part, the driving part drives the guide adjusting part to move along the preset path, such that the lens mounting part is driven to move in a reciprocating manner, thereby achieving automatic adjustment of the diopter.
A loudspeaker module and an intelligent head-mounted device. The loudspeaker module comprises: a loudspeaker housing (1), an accommodating cavity (2) being provided within the loudspeaker housing (1), and the accommodating cavity (2) having a first space and a second space; a first sound-producing unit, which divides the first space into a first rear sound cavity (22) and a first front sound cavity (21), a first speaker hole (3) being provided in a first surface (11) of the loudspeaker housing (1), and the first front sound cavity (21) being in communication with the outside of the loudspeaker housing (1) via the first speaker hole (3); and a second sound-producing unit, which divides the first space into a second rear sound cavity (24) and a second front sound cavity (23), a second speaker hole (4) being provided in the first surface (11), and the second front sound cavity (23) being in communication with the outside of the loudspeaker housing (1) via the second speaker hole (4). Compared with the prior art, by means of providing two speaker holes which are located in the same surface of the loudspeaker housing (1), the sound of the loudspeaker module is supplemented and superposed, and the overall frequency range and loudness are also increased.
The present application provides a microphone and a method for manufacturing same. The microphone comprises a housing in which a cavity is formed, and a photonic crystal assembly and a photoelectric module respectively fixed in the cavity. The housing is provided with a sound inlet communicating the cavity with the outside. The photonic crystal assembly comprises a diaphragm provided in the cavity and a photonic crystal back plate fixed to the side of the diaphragm facing the photoelectric module; a gap is formed between the diaphragm and the photonic crystal back plate; and an array of through holes are provided on the photonic crystal back plate. The photoelectric module is used for emitting laser light to the diaphragm, and is further used for receiving laser light reflected back from the photonic crystal back plate and the diaphragm and performing photoelectric signal conversion processing on the received laser light. The present application provides a photonic crystal-based optical microphone, and by means of the arrangement of the photonic crystal back plate structure, the sensitivity and the signal-to-noise ratio of the microphone can be effectively improved.
Provided in the present invention is a rotation limiting structure, which is used for limiting the rotation of a first rotating member, wherein the first rotating member is provided with a protrusion. The rotation limiting structure comprises a body and a first limiting portion, wherein the body is provided with a second limiting portion; the first limiting portion is movably mounted on the body, and has a first state and a second state, in which same is limited by the second limiting portion; when the first rotating member rotates clockwise, the first limiting portion can be pushed to be in the first state by the protrusion in a first direction, and the first rotating member then reaches a first limit position; when the first rotating member rotates anticlockwise, the first limiting portion can be pushed to be in the second state by the protrusion in a second direction, and the first rotating member then reaches a second limit position; and the second direction is opposite to the first direction. As the protrusion can push the first limiting portion in opposite directions, the rotation angle of the first rotating member when same rotates from the first limit position to the second limit position is increased, thereby reducing the influence of the width of the protrusion on the rotation angle of the first rotating member.
Disclosed in the present invention are an acoustic sensor and a preparation method therefor. The acoustic sensor comprises: a substrate unit, wherein the substrate unit comprises a first silicon layer, a first oxide layer, and a second silicon layer sequentially stacked from bottom to top, and a back cavity is formed in the substrate unit; a second oxide layer formed on the substrate unit; a piezoelectric unit formed on the second oxide layer, wherein the piezoelectric unit comprises a first electrode layer, a piezoelectric layer, and a second electrode layer sequentially stacked from bottom to top; a first slit, wherein the first slit is formed in the middle of the second electrode layer, and the first slit sequentially passes through the second electrode layer, the piezoelectric layer, and the first electrode layer; a second slit, wherein the second slit is formed in the middle of the second silicon layer, and the second slit sequentially passes through the second silicon layer and the second oxide layer; and an additional film layer filled in the first slit, wherein the additional film layer is not filled in the second slit. Compared with the prior art, the present invention can effectively improve the SPL and the structural reliability, and the material type is not limited by a dry film type material any more.
G01H 11/08 - Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
A microphone module and a defrosting method. The microphone module comprises a housing having an accommodating space and a microphone mounted within the accommodating space. The microphone module further comprises a thermally conductive ring (3) embedded inside of the housing (1) and a heating unit (4) connected to the thermally conductive ring (3). A sound hole (31) corresponding to the position of the microphone (2) is formed at the interior of the thermally conductive ring (3). The heating unit (4) is used for providing heat to the thermally conductive ring (3). The defrosting method comprises the steps of: in response to a heating instruction, activating a heating action of a heating unit (4) (S1); and checking the current performance of a microphone (2), and if the current performance of the microphone (2) is normal, deactivating the heating action of the heating unit (4) (S2). According to the present solution, water, frost, or ice inside of the sound hole (31) may be removed, preventing the sound hole (31) from being blocked and ensuring normal performance of the microphone (2).
An MEMS microphone, comprising: a substrate provided with a back cavity (11) and a capacitance system arranged on the substrate. The capacitance system comprises a back plate (2) and a diaphragm (3) arranged opposite and spaced apart from the back plate (2), wherein the surface of the back plate (2) facing the diaphragm (3) or the surface of the diaphragm (3) facing the back plate (2) is provided with dimples (4), characterized in that when the diaphragm (3) moves to enable the dimples (4) to simultaneously come into contact with the diaphragm (3) and the back plate (2), the dimples (4) can elastically deform in the vibration direction of the diaphragm (3). The dimples (4) of the MEMS microphone have elasticity, which can provide a buffer for the movement of the diaphragm (3), and thus avoids rapid concentration of stress on the position where the diaphragm (3) is in contact with the dimples (4), thereby preventing pits from forming on the diaphragm (3) and preventing the diaphragm (3) from breaking under the repeated impact of the dimples (4).
A MEMS element and an electro-acoustic conversion apparatus, relating to the technical field of microphones. The MEMS element comprises spacers, counter electrodes, a first diaphragm, and a second diaphragm. The spacers and the counter electrodes are located on the same horizontal plane and are alternately arranged in a cross section of the MEMS element; the first diaphragm and the second diaphragm are respectively disposed on opposite sides of the spacers and are in airtight connection with one another; the first diaphragm comprises a plurality of first protrusions disposed at intervals along a first direction, and the second diaphragm comprises a plurality of second protrusions disposed at intervals along the first direction, wherein the first protrusions and the second protrusions are in one-to-one correspondence and align with one another to form cavities, and the counter electrodes are suspended within the cavities; each first protrusion comprises a first front wall and a first rear wall, each second protrusion comprises a second front wall and a second rear wall, and at least part of the first front walls, the first rear walls, the second front walls, or the second rear walls are sub-corrugated structures. The MEMS element effectively reduces the maximum stress applied to the diaphragms under high-pressure impact, thus ultimately enhancing the mechanical robustness of the apparatus.
Provided in the present application are a lens surface defect detection method and apparatus, and a device and a readable storage medium. The specific implementation solution comprises: acquiring a RAW image captured by an imaging module that carries a lens to be tested; separating the RAW image into four single-channel images, and performing mean filtering processing on each single-channel image; performing a subtraction operation on each filtered image and a corresponding single-channel image, so as to obtain a difference image, and performing binarization processing on each difference image; acquiring a corresponding image connected component on the basis of each binarized difference image, and mapping the image connected components of all channels to the RAW image for merging; and if the total number of pixel points of a merged connected component is greater than or equal to a preset threshold value, outputting a lens surface defect detection result on the basis of image position information of the merged connected component. In the present application, lens surface defect detection is performed by means of computer vision without the need for a complex detection instrument and without the need for relying on manual labor to identify a lens surface defect, thereby effectively reducing the detection cost and the detection workload, and improving the detection accuracy.
The present application provides a camera calibration method, a device, and a readable storage medium. The specific implementation solution comprises: acquiring spectral response sensitivity of a camera, spectral power distribution data of different light sources, and spectral reflectivity of multiple color samples; for each light source, on the basis of the spectral response sensitivity, the spectral reflectivity and the corresponding spectral power distribution data, calculating a response parameter of the camera with respect to each color sample; on the basis of a current color correction matrix (CCM), correcting the response parameter to obtain a corrected response parameter; if it is determined on the basis of the corrected response parameters corresponding to all the color samples that the CCM does not satisfy an effective correction condition, adjusting an element value of the current CCM until the CCM satisfies the effective correction condition; and calibrating an adjusted CCM corresponding to each light source to the camera. In the present application, by means of mathematical modeling, the response of a camera to a color sample in a real light source environment is simulated to calibrate a CCM, thereby effectively reducing the calibration complexity and efficiency.
A directional MIC assembly (100) with double-sided sound intake and an electronic device (10). The electronic device (10) comprises the directional MIC assembly (100) with double-sided sound intake, wherein the MIC assembly (100) comprises a front housing (1) having a pair of sound intake holes (13) and an MIC device (2) provided on the inner side of the front housing (1); the MIC device (2) is provided with two receiving holes (21); and the MIC assembly (100) further comprises a fixing member (3) assembled on the inner side of the front housing (1). The fixing member (3) is provided with an assembly cavity (31), and two sound intake channels (32) which are in communication with the assembly cavity (31). The MIC device (2) is mounted in the assembly cavity (31), the two receiving holes (21) of the MIC device (2) are respectively in communication with the two sound intake channels (32), and the two sound intake channels (32) are respectively in communication with the two sound intake holes (13) of the same pair. Both the front housing (1) and the fixing member (3) can be separately processed, the arrangement of the sound intake holes (13) can meet the requirements of appearance design, external ports of the sound intake channels (32) on the fixing member (3) are not limited by appearance, can be processed by multiple methods such as molding and CNC, and can particularly be manufactured on a large scale at a low cost and a high yield by means of a mold, and the mold is simpler in design and lower in cost.
A capacitive sensing circuit and method. The capacitive sensing circuit comprises a charge pump, an MEMS chip, an analog signal modulator and a digital signal modulator, wherein the analog signal modulator is configured to perform analog signal modulation according to an output signal from the MEMS chip and an output signal from the analog signal modulator; and the digital signal modulator is configured to perform digital signal modulation on the output signal from the analog signal modulator, and outputs a modulated signal by using a digital interface. By directly using an input signal from an MEMS chip and an output signal from an analog signal modulator as input signals for analog modulation, harmonic distortion is reduced.
G01D 5/24 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
The present invention provides an inertial sensor and a manufacturing method. The manufactured inertial sensor comprises a base body structure and a movable inertial structure arranged at one side of the base body structure and spaced apart from same; the base body structure comprises a base layer, a circuit layer attached to the side of the base layer close to the movable inertial structure, and a blocking structure arranged on the circuit layer; the blocking structure is made of an insulating material; a plurality of slots running through in the thickness direction are formed in the circuit layer; the blocking structure comprises a plurality of protruding blocks which are connected to the circuit layer and protrude from the surface of the circuit layer facing away from the base layer; and the slots are blocked by insertion of the protruding blocks in a one-to-one manner. The inertial sensor has the advantages of reducing likeliness of viscosity, having a stable structure, and having a small limitation on the minimum size of the base body structure and the movable inertial structure, thereby facilitating improvement of the final performance of the inertial sensor.
G01C 21/16 - NavigationNavigational instruments not provided for in groups by using measurement of speed or acceleration executed aboard the object being navigatedDead reckoning by integrating acceleration or speed, i.e. inertial navigation
G01C 19/00 - GyroscopesTurn-sensitive devices using vibrating massesTurn-sensitive devices without moving massesMeasuring angular rate using gyroscopic effects
A MEMS microphone, comprising a base (1), a housing (2) defining an accommodating space with the base (1), a MEMS chip (3) defining a back cavity with the base (1), and an ASIC chip (4) fixed to the base (1). The base (1) is provided with a sound inlet channel (10) communicating the accommodating space with the outside; the MEMS chip (3) is provided with a diaphragm (31) located on a sound inlet path of the sound inlet channel (10); the sound inlet channel (10) comprises a buffer cavity (101) located in the base (1), a first sound inlet hole (102) formed in the base (1) and communicating the buffer cavity (101) with the outside, and a second sound inlet hole (103) formed in the base (1) and communicating the buffer cavity (101) with the back cavity; the second sound inlet hole (103) faces the diaphragm (31); and the second sound inlet hole (103) comprises at least two sub-holes (1031) spaced apart from each other. When external air pressure enters the sound inlet channel (10) from the first sound inlet hole (102), the air pressure will not directly pass through the second sound inlet hole (103) to act on the diaphragm (31), and the sub-holes (1031) can further block airflow, so that the impact of the air pressure on the diaphragm (31) can be effectively buffered, thereby reducing rupture of the diaphragm, and improving the reliability and performance of the MEMS microphone.
A MEMS microphone (100), comprising a housing (10), a substrate (20) covering the housing (10) to form an accommodating space (101), and an ASIC chip (40) and a MEMS chip (30) disposed in the accommodating space (101); the substrate (20) is also provided with a first sound hole (21) extending from an upper surface (201) to a lower surface (202) and not passing through the lower surface, a second sound hole (22) extending from the lower surface (202) to the upper surface (201) and not passing through the upper surface (201), a connecting channel (23) provided between the upper surface (201) and the lower surface (202) of the substrate (20) and placing the first sound hole (21) and the second sound hole (22) in communication, and an air hole (24) extending from the upper surface (201) to the lower surface (202) and not passing through the lower surface (202), the air hole (24) and the second sound hole (22) being disposed to be transversely spaced apart from one another. The MEMS microphone (100) is also provided with an elastic member (50) covering the air hole (24), the elastic member (50) being able to open or close the air hole (24). The MEMS microphone (100) has strong anti-wind capability.
Disclosed in the present invention are an inertial sensor and a manufacturing method therefor. The inertial sensor comprises a first substrate; a dielectric layer; a first conductive layer, the first conductive layer being provided therein with a plurality of first openings; a plurality of second conductive layers, the plurality of second conductive layers being bonded to the first conductive layer by means of bonding structures, gaps being formed between the adjacent second conductive layers from the bottom to the top, the adjacent second conductive layers being connected by means of connection parts, and each second conductive layer being provided with a plurality of second openings; a second substrate, the second substrate covering the first substrate, and the second substrate and the first substrate defining a closed space therebetween. Compared with the prior art, the present invention is provided with a plurality of second conductive layers. Therefore, compared with those for traditional single-layer structures, a mold is reduced to a lower size, thereby reducing manufacturing costs and improving the integration between a device and a portable consumer application. In addition, a relatively large movable conductive structure has a larger surface area, thereby improving XY-axis sensitivity.
A diaphragm and a MEMS microphone. The diaphragm comprises a vibrating portion (1) and supporting structures (2) connected to the vibrating portion (1). Each supporting structure (2) comprises a cantilever portion (21) extending outwards from the periphery of the vibrating portion (1), and a first anchoring portion (22) and a second anchoring portion (23), both of which are connected to the end of the cantilever portion (21) away from the vibrating portion (1). The lengths of both the first anchoring portion (22) and the second anchoring portion (23) extend along the circumference of the vibrating portion (1), and the length of the first anchoring portion (22) and the length of the second anchoring portion (23) extend in opposite directions. As the lengths of both the first anchoring portion (22) and the cantilever portion (21) extend along the circumference of the vibrating portion (1), and the length of the first anchoring portions (22) and the length of the second anchoring portion (23) extend in opposite directions, the first anchoring portion (22), the cantilever portion (21), and the second anchoring portion (23) are connected to form a T shape, that is, each supporting structure is a T-shaped beam, enabling the diaphragm to have a wider range of vibration displacement, and thereby improving the sensitivity and adaptability of the MEMS microphone.
The present invention provides a counter electrode structure and a dual-membrane MEMS microphone. The dual-membrane MEMS microphone comprises a substrate and a capacitor system. The capacitor system comprises a first electrode membrane and a second electrode membrane which are arranged at an interval to form an accommodating cavity, and the two electrode membranes have corrugated cross-sectional shapes in the radial direction. The wave crest of one electrode membrane is connected to the wave trough of the other electrode membrane to form a supporting body. The capacitor system further comprises a counter electrode structure suspended in the accommodating cavity. The counter electrode structure comprises a plurality of circumferential beams arranged at intervals from inside to outside and a plurality of radial beams connected to the circumferential beams and extending from inside to outside, a via hole extending around the center of the counter electrode structure is formed between every two adjacent circumferential beams inside and outside, and the supporting body passes through the via holes and is spaced apart from the edges of the via holes. The arrangement of a counter electrode structure enables two electrode membranes to achieve a dual-corrugated membrane structure, which is more sensitive to sound pressure and can significantly improve the sensitivity performance.
Provided are an MEMS sensor and a preparation method therefor. The MEMS sensor comprises: a bottom electrode layer (1) and a top electrode layer (2) forming a cavity (3), and a device layer (4) accommodated in the cavity (3). The device layer (4) comprises a plurality of movable mass blocks (41) arranged at intervals. Preset gaps are formed between the movable mass blocks (41) and the top electrode layer (2), and the preset gaps formed by different movable mass blocks (41) are different from each other. The preparation method for the MEMS sensor comprises: S1, sequentially forming a bottom electrode layer (1), a sacrificial layer (5), a device layer (4), and a top electrode layer (2) from bottom to top; S2, etching the device layer (4) to form a plurality of movable mass blocks (41) arranged at intervals; and S3, releasing the sacrificial layer (5). A differential output electrical signal is formed by means of the difference of the preset gaps, thereby achieving the high sensitivity and volume miniaturization of the MEMS sensor.
H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
G01L 9/12 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance
G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
G01P 15/125 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
H01G 5/16 - Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaftProcesses of their manufacture using variation of distance between electrodes
H01G 5/00 - Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaftProcesses of their manufacture
21.
FILM BULK ACOUSTIC RESONATOR MANUFACTURING METHOD, FILM BULK ACOUSTIC RESONATOR AND FILTER
A film bulk acoustic resonator manufacturing method provided in the present invention comprises: providing a substrate having a top surface; forming a dielectric material layer on the top surface of the substrate; forming a bottom electrode on the surface of the dielectric material layer away from the substrate; forming a piezoelectric material layer on the surface of the bottom electrode away from the substrate; forming an intermediate metal layer on the surface of the piezoelectric material layer away from the substrate; forming a mass load layer on the surface of the intermediate metal layer away from the substrate; and forming a top electrode on the surface of the mass load layer away from the substrate. This mode increases process options, and increases the flexibility of forming multi-mass loads of film bulk acoustic resonators below top electrodes and in filters having the film bulk acoustic resonators, thereby improving the sensitivity of the filters.
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
22.
ACOUSTIC WAVE RESONATOR AND PREPARATION METHOD THEREFOR
An acoustic wave resonator and a preparation method therefor. The acoustic wave resonator comprises: a substrate (1), provided with a plurality of cavities (2); a plurality of piezoelectric units, the plurality of piezoelectric units being in one-to-one correspondence with the plurality of cavities (2), the piezoelectric units covering the cavities (2), and each piezoelectric unit comprising a first electrode layer (4), a piezoelectric layer (5) and a second electrode layer (8) which are sequentially stacked from bottom to top; a protective layer (9), stacked on the piezoelectric units; and a series unit, having one end electrically connected to the first electrode layer (4) of one piezoelectric unit and the other end electrically connected to the second electrode layer (8) of another piezoelectric unit, so as to connect the two piezoelectric units in series. The protective layer (9) is provided on the piezoelectric units, such that the piezoelectric units are protected from being further damaged by downstream processing, and the acoustic wave resonator has a better Q value and a better coupling coefficient.
Provided in the present invention are an MEMS device and a method for manufacturing the MEMS device. The MEMS device comprises a cap piece and a device piece, wherein the device piece comprises a silicon substrate, at least two device structure layers and at least one electrically conductive structure layer, every two adjacent device structure layers being coupled to each other by means of the corresponding electrically conductive structure layer; the device piece has a functional cavity, which comprises a first area, a second area and a third area; the at least two device structure layers and the at least one electrically conductive structure layer each stretch across the first area, the second area and the third area; and the at least two device structure layers and the at least one electrically conductive structure layer collaboratively form a first movable structure in the first area, collaboratively form an anchor point in the second area, and collaboratively form a second movable structure in the third area.
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
G01P 15/14 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of gyroscopes
G01C 19/56 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
Provided in the present invention are a capturing control method and a related apparatus. A capturing module and a communication module are provided on a Bluetooth earphone box. The method comprises: first, establishing a target communication connection with a terminal device on the basis of a communication module; then, on the basis of the target communication connection, receiving a capturing control instruction sent by the terminal device; next, according to the capturing control instruction, controlling a capturing module to trigger a corresponding image capturing state; and finally, on the basis of the target communication connection, sending a target captured image to the terminal device. By means of the implementation of the present invention, a terminal device can control a capturing module on a Bluetooth earphone box to implement a capturing function. That is, the capturing function of the Bluetooth earphone box is expanded to provide a capturing function and capturing performance support to the terminal device, such that capturing requirements of a terminal user are met, and the miniaturization of the terminal device can also be ensured.
H04N 23/661 - Transmitting camera control signals through networks, e.g. control via the Internet
H04W 4/80 - Services using short range communication, e.g. near-field communication [NFC], radio-frequency identification [RFID] or low energy communication
An electronic cigarette (200), comprising a cigarette body housing (201) and an MEMS airflow sensor (100) accommodated in the cigarette body housing (201). The MEMS airflow sensor (100) comprises a circuit board (1), an upper cover (2) covering the circuit board (1) and forming an accommodating space (10) together with the circuit board (1), an ASIC chip (3), and an MEMS chip (4) having a back cavity (41), the ASIC chip (3) and the MEMS chip being fixed to the circuit board (1) and electrically connected to each other. The upper cover (2) is provided with a first sound hole (21) running through the upper cover (2); an upper metal layer (5) and a lower metal layer (6) which are exposed on surfaces of the circuit board (1) and are electrically connected to each other are respectively provided on the side of the circuit board (1) close to the upper cover (2) and the side of the circuit board (1) away from the upper cover (2); the projection of the ASIC chip (3) on the circuit board (1) is at least partially located within the range of the upper metal layer (5). According to the electronic cigarette (200), the overall heat dissipation performance of the circuit board (1) can be improved by means of the upper metal layer (5) and the lower metal layer (6) which are additionally provided, so as to transfer heat generated during operation of the ASIC chip (3) to the outside of the accommodating space (10) in time, thereby avoiding trigger of overheating protection and shutdown of the ASIC chip (3).
An electronic cigarette (200), comprising a cigarette body casing (201) and a MEMS sensor (100) accommodated in the cigarette body casing (201); the MEMS sensor (100) comprises a housing (1) having an accommodating space (10), and, accommodated in the accommodating space (10) and electrically connected to each other, an AISC chip (2) and an MEMS chip (3) having a back chamber (31); the housing (1) is provided with a first sound hole (11) and a second sound hole (12) penetrating therethrough and communicating the accommodating space (10) with the outside; the MEMS sensor (100) further comprises a first waterproof and breathable film (4) fixed to the housing (1) and completely covering the first sound hole (11), and a second waterproof and breathable film (5) fixed to the housing (1) and completely covering the second sound hole (12). The MEMS sensor (100) of the electronic cigarette can intercept impurities such as water, liquid, dust and aerosol by means of the first waterproof and breathable film (4) and the second waterproof and breathable film (5), thereby avoiding performance decline or damage of the MEMS chip (3) due to impurities entering the MEMS chip (3) via the first sound hole (11) and the second sound hole (12).
The present invention provides a gas sensor, comprising a housing provided with an accommodating cavity, and a sound sensor and an infrared transmitter which are arranged in the accommodating cavity. The housing comprises a cover plate, a substrate spaced apart from the cover plate, and a side wall located between the cover plate and the substrate. The housing is provided with a vent hole used for communicating the outside with the accommodating cavity. The gas sensor further comprises a flexible film connected to the side wall. The flexible film separates the accommodating cavity into a first cavity and a second cavity. The infrared transmitter is located in the first cavity. The sound sensor is located in the second cavity. The flexible film, the first cavity and the second cavity constitute a resonator system. An inherent frequency of the resonant system is the same as a modulation frequency of the infrared transmitter. The vent hole is communicated with the first cavity. Compared with the related art, the gas sensor provided by the present invention has improved sensitivity.
G01N 21/35 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
Provided in the present invention is an onboard microphone system, comprising a microphone module and a vehicle body where the microphone module is mounted; the vehicle body comprises an outer surface facing the outside of the vehicle and an inner surface opposite to the outer surface, the microphone module being mounted on the inner surface; the vehicle body is provided with a sound inlet channel of the microphone module, the sound inlet channel comprising an arched channel and a sound hole leading to the arched channel; a first end opening and a second end opening of the arched channel are formed in the outer surface and are spaced apart from each other; the sound hole leads to the arched channel at the top of the arched channel and forms a sound hole opening located in the inner surface, sound entering the microphone module via the sound hole opening. The water resistance of the onboard microphone system of the present invention is optimized and the effect of wind noise thereon is reduced.
B60R 11/02 - Arrangements for holding or mounting articles, not otherwise provided for for radio sets, television sets, telephones, or the likeArrangement of controls thereof
The present invention provides a MEMS microphone, comprising a substrate having a back cavity and a capacitor system arranged on the substrate. The capacitor system comprises a back plate and a diaphragm arranged opposite to the back plate. The diaphragm is located between the substrate and the back plate. The diaphragm is provided with a through hole. The back plate comprises a body part, an extending column extending from the body part to the substrate and passing through the through hole, and a gasket connected to the extending column. The gasket is located between the diaphragm and the substrate. One end of the extending column is connected to the body part of the back plate, and the other end of the extending column is connected to the gasket. Compared with the prior art, the MEMS microphone provided by the present invention can enhance the reliability of the product.
Provided in the present utility model is an electronic cigarette. The electronic cigarette of the present utility model comprises an atomizer, an e-liquid cavity, and an airflow sensing apparatus, which mainly comprises a first circuit board, an MEMS airflow sensor and a main control IC. A second circuit board of the present solution is provided with a first pad and a second pad, wherein the second pad is arranged around the first pad, a first pin is provided in the first pad, and a second pin is provided in the second pad. Since the first pad is surrounded and sealed by the second pad, the first pin is electrically connected to a capacitance measurement port of the main control IC, and the second pin is grounded, the present solution can prevent condensate from coming into contact with the first pin of the MEMS airflow sensor, which first pin is electrically connected to the main control IC, such that condensate flowing through a capacitance measurement line of the electronic cigarette can be effectively avoided, and the main control IC does not detect an increase in a capacitance value. Therefore, self-starting of the electronic cigarette can be prevented, and the electronic cigarette is safe and reliable and has a low cost.
Disclosed in the present invention are a MEMS diaphragm and a MEMS sensor. The MEMS diaphragm comprises: a main diaphragm, the main diaphragm comprising a main body sensing part and fixing parts, and the plurality of fixing parts being annularly connected to the outer edge of the main body sensing part at intervals; and an additional material layer, the additional material layer being arranged on the fixing parts, or the additional material layer being arranged on the edge of the main body sensing part and the fixing parts, wherein the internal stress of the additional material layer is greater than the internal stress of the main body sensing part. Compared with the prior art, in the present invention, the additional material layer is arranged on the main diaphragm, the additional material layer is mechanically reinforced in a diaphragm area subjected to a high stress during pressure pulses, and the internal stress of the additional material layer is greater than the internal stress of the main body sensing part, so that the flexibility of the main diaphragm can be guaranteed.
The present utility model provides a microphone module, comprising a housing having an accommodating cavity, a first supporting member accommodated in the accommodating cavity and fixed to the housing, and a first microphone and a second microphone that are fixed on the first supporting member. The housing is provided with a first sound inlet channel penetrating through the housing; the first supporting member is provided with a first sound inlet hole and a second sound inlet hole that penetrate through the first supporting member and are spaced from each other; the first sound inlet hole is arranged corresponding to the first microphone, and the second sound inlet hole is arranged corresponding to the second microphone; an external sound wave enters the first sound inlet channel and is then transmitted to the first microphone through the first sound inlet hole and to the second microphone through the second sound inlet hole; the first microphone picks up full-band sound signals, and the second microphone picks up sound signals having a frequency of 700-1,500 Hz. The microphone module of the present utility model achieves both an out-of-vehicle voice control function and a siren detection and penetration function.
Disclosed in the present invention are an acoustic sensor and a manufacturing method therefor. The acoustic sensor comprises: a substrate unit, the substrate unit comprising a first silicon layer, a first oxide layer and a second silicon layer which are successively stacked from bottom to top, and the substrate unit being internally provided with a back chamber; a second oxide layer; a piezoelectric unit, the piezoelectric unit comprising a first electrode layer, a piezoelectric layer and a second electrode layer which are successively stacked from bottom to top, and the piezoelectric unit being internally provided with a slit and an opening; a metal pad; and an additional film layer, comprising a first portion, a second portion and a third portion, the first portion being formed in the slit, the side wall of the first portion being attached to the inner wall surface of the slit, the bottom wall of the first portion covering an opening of the bottom portion of the slit, and the side wall and the bottom wall defining a recess having an opening in the top portion. Compared with the prior art, the present invention can effectively improve the SPL and structural reliability, and the thickness of the additional film layer is uniformly distributed on the surface of the piezoelectric unit, thus being suitable for acoustic sensors having large areas.
G01H 11/08 - Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
Disclosed in the present invention are an acoustic sensor and a preparation method therefor. The acoustic sensor comprises: a substrate unit, the substrate unit comprising a first silicon layer, a first oxide layer and a second silicon layer, which are sequentially stacked from bottom to top, and a back cavity being formed in the substrate unit; a second oxide layer; a piezoelectric unit formed on the second oxide layer, the piezoelectric unit comprising a first electrode layer, a piezoelectric layer and a second electrode layer, which are sequentially stacked from bottom to top, and a slit and an opening being formed in the piezoelectric unit; a metal gasket, which is stacked on the first electrode layer at the opening; and an additional film layer, which comprises a first part and a second part, the first part being laid flat on the second electrode layer and covering the slit, and the second part being laid flat on the metal gasket. Compared with the prior art, the piezoelectric unit of the present invention can move at the maximum displacement and vibrate with the minimum restriction, thereby effectively improving the SPL and structural reliability; and the thickness of the additional film layer is uniformly distributed on the top surface of the piezoelectric unit, thus adapting to an acoustic sensor with a large area.
A loudspeaker assembly and a handheld device. The loudspeaker assembly comprises at least one loudspeaker driver and at least two output ports (403, 404). The at least one loudspeaker driver and the at least two output ports (403, 404) are configured such that the loudspeaker assembly has a directional polar pattern within a desired frequency range.
Provided in the present invention is a MEMS microphone, comprising a substrate having a back cavity and a capacitance system arranged on the substrate, wherein the capacitance system comprises a back plate and a diaphragm arranged opposite the back plate; the diaphragm is located between the substrate and the back plate; a reinforcing portion connected to the diaphragm is disposed between the diaphragm and the substrate; a projection of an inner surface of the reinforcing portion in the direction of vibration of the diaphragm is flush with an inner surface of the back cavity or is located in the back cavity; and the reinforcing portion comprises an etch stop wall and a sacrificial layer located in the etch stop wall. Compared with related techniques, the MEMS microphone provided in the present invention can enhance product reliability.
An MEMS optical microphone (100), comprising: a casing (1), the casing (1) comprising an inner cavity (10) and a sound port (14) that connects the inner cavity (10) to the outside; a light source (2), the light source (2) being configured to emit a light beam; an MEMS module (3), the MEMS module (3) comprising: a diaphragm (31), the diaphragm (31) being suspended above the sound port (14), and a first reflective coating (32), the first reflective coating (32) coating the surface of the diaphragm (31) facing the light source (2) and configured to reflect the light beam; and an optical detection unit (4), the optical detection unit (4) being configured to detect light reflected from the first reflective coating (32), and comprising: a photodetector (41), the photodetector (41) being configured to convert the light intensity into a photocurrent, and a light filter (42), the light filter (42) having a variable transmissivity and being lifted above the photodetector (41). The MEMS optical microphone (100) has a wider dynamic range and higher sensitivity.
A gas sensor (100), comprising: a housing (1) with an accommodating cavity (10), and an acoustic sensor (20) and an infrared emitter (30), which are arranged in the accommodating cavity (10), wherein the housing (1) comprises a cover plate (11), a base plate (12) and side walls (13); and a vent (110) in communication with the outside and the accommodating cavity (10) is provided in the housing (1). The gas sensor (100) is further provided with a partition plate (14) located in the accommodating cavity (10), wherein the partition plate (14) partitions the accommodating cavity (10) into a first accommodating cavity (101) and a second accommodating cavity (102); the acoustic sensor (20) is located in the first accommodating cavity (101); the infrared emitter (30) is located in the second accommodating cavity (102); the vent (110) is in communication with the second accommodating cavity (102); a through hole (140) in communication with the first accommodating cavity (101) and the second accommodating cavity (102) is provided in the partition plate (14); the first accommodating cavity (101), the through hole (140) and the second accommodating cavity (102) form a Helmholtz resonator; and the natural frequency of the Helmholtz resonator is the same as the modulation frequency of the infrared emitter (30).
G01N 21/3504 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing gases, e.g. multi-gas analysis
G01N 21/17 - Systems in which incident light is modified in accordance with the properties of the material investigated
The present invention provides a MEMS microphone. The MEMS microphone comprises: a substrate having a back cavity, and a capacitance system arranged on the substrate; the capacitance system comprises a backplate and a diaphragm arranged opposite to the backplate, and the backplate and the diaphragm have a gap formed between same; the backplate is provided with a body portion and a first protrusion extending out from the body portion in a direction away from the base; the diaphragm is provided with a main body portion and a second protrusion extending out from the main body portion in a direction away from the base; the first protrusion and the second protrusion are arranged corresponding to one another; the substrate comprises an upper end adjacent to the capacitance system and a lower end away from the capacitance system; and an opening of the back cavity at the upper end of the substrate is larger than an opening at the lower end of the substrate. Compared with the prior art, the MEMS microphone provided in the present invention can improve resonance frequency.
The present application provides an MEMS sensor, and an MEMS microphone and electronic cigarette using the MEMS sensor. The MEMS sensor comprises a substrate having a back cavity and a capacitance system arranged on the substrate, wherein the capacitance system comprises a first backplate assembly and a diaphragm arranged opposite to the first backplate assembly; the first backplate assembly comprises a first backplate and a second backplate which are arranged at an interval; a plurality of first backplate holes are formed in the first backplate; a plurality of second backplate holes are formed in the second backplate; and the first backplate holes and the second backplate holes are mutually staggered in the vibration direction of the diaphragm. The MEMS sensor can achieve a good dustproof effect.
Provided in the present invention is a gas sensor, comprising a housing with an accommodating cavity, and an acoustic sensor and an infrared emitter, which are arranged in the accommodating cavity, wherein the housing comprises a cover plate, a base plate spaced apart from the cover plate, and side walls located between the cover plate and the base plate; and a vent in communication with the outside and the accommodating cavity is provided in the housing. The gas sensor is further provided with a partition plate and a flexible film, which are located in the accommodating cavity, wherein the partition plate and the flexible film jointly partition the accommodating cavity into a first cavity and a second cavity; the acoustic sensor is located in the first cavity; the infrared emitter is located in the second cavity; the flexible film, the first cavity and the second cavity form a resonance system; the natural frequency of the resonance system is the same as the modulation frequency of the infrared emitter; and the vent is in communication with the second cavity. Compared with the related art, the gas sensor provided in the present invention can improve the sensitivity thereof.
G01N 21/3504 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing gases, e.g. multi-gas analysis
Smart wearable glasses (100) having good acoustic performance, comprising a glasses frame (1), glasses legs (2), a vibration unit (3), and a sound production unit (4). The vibration unit (3) comprises a bone conduction contact portion (31) at least partially exposed out of a glasses leg (2). The sound production unit (4) comprises a housing (41) that is provided with an accommodation space (401) and a phase inversion channel (402), a sound production cell (42) that is fixed to the housing (41), and a phase inversion tube (43) that is mounted in the phase inversion channel (402). The housing (41) is provided with a first sound discharge hole (403), a first phase inversion hole (404), and a first leakage hole (405) that run through same. The sound production cell (42) divides the accommodation space (401) into a front cavity (406) and a coupling rear cavity (407), the front cavity (406) is in communication with the outside by means of the first sound discharge hole (403), the phase inversion tube (43) sequentially passes through the phase inversion channel (402) and the first phase inversion hole (404) and then communicates with the outside, and the coupling rear cavity (407) communicates with the outside by means of the first leakage hole (405) and the phase inversion tube (43), respectively. The phase of sound waves emitted by the sound production unit (4) by means of the first sound discharge hole (403) is opposite to the phase of sound waves emitted by the sound production unit (4) by means of the first leakage hole (405).
The present invention relates to the technical field of automobiles. Disclosed are a vehicle-mounted virtual multi-channel audio signal processing method and system, and an electronic device. The processing method comprises the steps of: acquiring an audio input signal of a single audio channel; identifying different frequency components in the audio input signal; allocating audio data of different frequency bands in the audio input signal to different signal links according to the different frequency components; performing digital signal processing of corresponding frequency bands on the audio data in the different signal links to obtain a plurality of single-channel signals of different frequency bands; and superposing the plurality of single-channel signals into a single-channel audio output signal and outputting the single-channel audio output signal. According to the present invention, a plurality of different loudspeakers connected in parallel on a single audio channel can carry out different digital signal processing, respectively, so that the tone quality of the whole vehicle is improved, and the cost of the whole vehicle is reduced.
H04S 5/00 - Pseudo-stereo systems, e.g. in which additional channel signals are derived from monophonic signals by means of phase shifting, time delay or reverberation
A somatosensory in-vehicle prompt method and system, and a related device, which are applied to a vehicle. The in-vehicle prompt method comprises the following steps: acquiring an audio signal from a vehicle-mounted audio bus (5) by means of a controller (4) (S1); performing acoustic characteristic analysis on the audio signal, and extracting an acoustic waveform of the audio signal on a time-domain waveform (S2); performing amplitude debugging on a sinusoidal signal of the acoustic waveform, so as to obtain a modulated sinusoidal signal after amplitude modulation (S3); and by means of the controller (4), acquiring from a vehicle-mounted control bus (6) a control signal, which represents operation behavior information, matching the control signal with the modulated sinusoidal signal according to a preset rule, so as to generate a vibration signal, and feeding the vibration signal back to excitation vibrators (1, 2), thereby realizing vibration prompting (S4). In the somatosensory in-vehicle prompt method, safety is improved by means of a vibration prompt combined with an auditory prompt, and when there are a plurality of excitation vibrators (1, 2), a vibration prompt that better conforms to a user operation behavior can be provided on the basis of the control signal on the vehicle-mounted control bus (6), thereby providing a better user experience.
B60N 2/90 - Details or parts not otherwise provided for
G10L 25/03 - Speech or voice analysis techniques not restricted to a single one of groups characterised by the type of extracted parameters
G10L 25/51 - Speech or voice analysis techniques not restricted to a single one of groups specially adapted for particular use for comparison or discrimination
G08B 6/00 - Tactile signalling systems, e.g. personal calling systems
G08B 21/24 - Reminder alarms, e.g. anti-loss alarms
The present invention provides a sealed dual-membrane (SDM) structure and a device comprising the structure. The SDM structure of the present invention comprises: a substrate; a first vibrating membrane and a second vibrating membrane which are disposed on the substrate, the first vibrating membrane and the second vibrating membrane forming a sealed cavity together with the substrate; first rear electrode plates and second rear electrode plates which are disposed between the first vibrating membrane and the second vibrating membrane; and conductor plate units disposed between the first rear electrode plates and the second rear electrode plates. The first vibrating membrane and the second vibrating membrane are mechanically coupled to the conductor plate units, and each conductor plate unit forms a capacitor structure with each of the first rear electrode plates and each of the second rear electrode plates. The present invention reduces the number of support columns required in the SDM structure, and improves the sensitivity of the device comprising the SDM.
Provided in the present invention is an optical microphone, comprising: a housing, which comprises an inner cavity and a sound intake hole that enables communication between the inner cavity and the outside; a micro-electro-mechanical module, which is located in the inner cavity and comprises a flexible film and a grating; a photoelectric module, which is located in a rear cavity and comprises a light source and a light beam detector; and an integrated circuit module, which is located in the rear cavity and is electrically connected to the micro-electro-mechanical module and the photoelectric module. The photoelectric module and the integrated circuit module are arranged on the same chip. A reflection layer is provided on the side of the flexible film that faces the light source, and another reflection layer is provided on the side of the grating that faces the light source. The microphone has the following beneficial effects: less connection lines are used, and crosstalk noise between the lines is reduced, thereby achieving easier package fabrication and better package miniaturization.
Provided in the present utility model are a microphone and a vehicle-mounted entertainment system. The microphone comprises a shell having an accommodating cavity, a circuit board fixed in the accommodating cavity, an interface assembly fixed to an outer side of the shell and electrically connected to the circuit board, and a microphone unit fixed to the circuit board, the shell comprising a housing having the accommodating cavity, and a cover plate fixed to the housing and covering the accommodating cavity, characterized in that the interface assembly is fixed to the side of the housing away from the cover plate, and the plugging direction of the interface assembly is perpendicular to a board face of the circuit board; and the housing is provided with a sound pickup channel for providing sound signals for the microphone unit. The present solution omits a weak connecting plate, such that the connection strength between the interface assembly and the shell can be enhanced, the microphone can be miniaturized and can flexibly adapt to different installation modes; in addition, the extending direction of the board face of the circuit board is perpendicular to the plugging direction of the interface assembly, such that dragging, which causes loosening or even brakages between the interface assembly and the shell, can not occur during plugging, thereby preventing the microphone from being damaged.
Provided in the present utility model is an MEMS microphone, comprising: a base, a support plate arranged on one side of the base, and a capacitor system arranged on the support plate. The capacitor system comprises: a back plate, which is fixed to the support plate; a fixing member, which is fixed to the side of the back plate close to the base; and a diaphragm, which is fixed to the side of the fixing member away from the back plate, the fixing member being located in the central region of the diaphragm, and the diaphragm and the back plate being arranged opposite each other. The MEMS microphone further comprises: a first pad, which is fixed to the side of the supporting plate away from the base; and a first electrode, which is fixedly connected to the central region of the diaphragm and electrically connected to the first pad, the first electrode being only connected to the central region of the diaphragm. In the present utility model, the diaphragm forms a cantilever beam structure fixed in the middle, and the first electrode is only connected to the central region of the diaphragm, so as to prevent the first electrode from interfering with the deformation of an edge region of the diaphragm, such that the sensitivity of the microphone can be improved by way of fully releasing residual stress of the diaphragm.
Disclosed in the present application is an MEMS optical microphone. The MEMS optical microphone comprises: a shell, which has an inner cavity and a sound inlet, which allows the inner cavity to be in communication with the outside; a micro-electro-mechanical module, which comprises a vibrating diaphragm, the vibrating diaphragm being suspended in the inner cavity, wherein when a pressure is applied to the vibrating diaphragm, a light-passing gap is opened in the vibrating diaphragm, and the size of the light-passing gap is increased or reduced with the pressure applied to the vibrating diaphragm; a photoelectric module, which comprises an electromagnetic radiation source and a sensor, wherein a light beam, which is emitted by the electromagnetic radiation source, passes through the light-passing gap and then reaches the sensor; and an integrated circuit module, which is electrically connected to the photoelectric module. In the present application, a vibrating diaphragm is provided with a light-passing gap, which is opened or closed in response to a pressure or sound signal applied to the vibrating diaphragm, and the amount of light, which is transmitted through the light-passing gap, is controlled such that a transmitted light beam is converted into an electrical signal, which corresponds to an applied pressure level for the sound signal and has the advantages of a high sensitivity, a flat frequency response, etc., thereby providing potential for further improving the device performance.
Disclosed in the present invention is an MEMS optical microphone, comprising: a housing, which is provided with an inner cavity and a sound inlet for making the inner cavity be in communication with the outside; a micro-electro-mechanical module, which comprises a vibrating diaphragm, wherein the vibrating diaphragm is suspended in the inner cavity and is provided with a light passage gap in a penetrating manner, and the size of the light passage gap is increased or reduced along with the magnitude of sound pressure; a photoelectric module, which comprises an electromagnetic radiation source and a sensor that are respectively arranged on two opposite sides of the vibrating diaphragm, wherein the sensor is configured to receive a light beam emitted by the electromagnetic radiation source, the light beam covers the light passage gap, and the size of the light beam is greater than the maximum size of the light passage gap; and an integrated circuit module, which is electrically connected to the photoelectric module. Comparing the present invention with the prior art, the size of the light beam emitted by the electromagnetic radiation source is set to be greater than the maximum size of the light passage gap, so that the dynamic range of the MEMS optical microphone is widened, sound signals in a larger range can be sensed, and there is relatively high sensitivity to a linear change in radiation or light intensity caused by the sound signals.
A MEMS optical microphone, comprising: a housing (10), which has an inner cavity (15) and a sound inlet (11) that places the inner cavity (15) in communication with the outside; a diaphragm (20), which is suspended inside of the inner cavity (15) and seals the sound inlet (11); a waveguide piece (30), a through-hole (31) being penetratingly provided therein, an input waveguide (32) and an output waveguide (33) being provided on the waveguide piece (30) on two opposite sides of the through-hole (31); a variable optical wave member (40), a second end of the variable optical wave member (40) extending into the through-hole (31), and the variable optical wave member (40) being able to move back and forth in a first direction as the diaphragm (20) vibrates and deforms; a photoelectric module, which comprises an electromagnetic radiation source (50) and a sensing member, the variable optical wave member (40) being used for converting an input polarization state of a first light path into an output polarization state, and the output polarization state presenting different forms as the distance of movement of the variable optical wave member (40) in the first direction varies; and an integrated circuit module (60), which is electrically connected to the diaphragm (20) and the photoelectric module. Such a MEMS optical microphone has advantages such as high sensitivity and flat frequency response, providing potential for further improvements in device performance.
Disclosed is a MEMS optical microphone, comprising: a housing, which has an inner cavity and a sound inlet that places the inner cavity in communication with the outside; a micro-electromechanical module, which comprises a diaphragm that is suspended inside of the inner cavity, a light lobe being formed on the diaphragm, and when sound pressure is applied, a light passing gap being formed in an opening of the light lobe, the size of the light passing gap increasing or decreasing as the sound pressure varies; a photoelectric module, which comprises an electromagnetic radiation source and a sensor, the electromagnetic radiation source and the sensor being arranged on two opposite sides of the diaphragm, and a light beam emitted by the electromagnetic radiation source traversing the light passing gap and then reaching the sensor; and an integrated circuit module, which is electrically connected to the photoelectric module. Compared with the prior art, the present invention has advantages such as high sensitivity and flat frequency response, providing potential for further improvements in device performance.
A sound-absorbing material block, a preparation method therefor, and a use thereof. The sound-absorbing material block comprises three-dimensional open-cell foam, sound-absorbing material powder, a binder, a gelling agent, and a cross-linking agent. The gelling agent, the cross-linking agent, and the binder enable the sound-absorbing material powder to be bonded to itself and connected to the three-dimensional open-cell foam. Based on the mass of the sound-absorbing material powder, the gelling agent accounts for 1-5 wt% of the sound-absorbing material powder and the binder accounts for 1-8 wt% of the sound-absorbing material powder, and based on the mass of the gelling agent, the cross-linking agent accounts for 1-10 wt% of the gelling agent. In the sound-absorbing material block, the amount of the binder that is added is reduced, and the sound absorption performance and strength of the material block are significantly improved.
The present application relates to the field of terminal devices, and in particular to a sound leakage elimination method and apparatus. The sound leakage elimination method comprises: when it is detected that a receiver outputs a call voice, controlling a collection device to determine a first frequency response curve of a first sound wave, which is generated by the call voice, at a first position outside a terminal device; controlling a speaker to generate a second sound wave; controlling the collection device to determine a second frequency response curve of the second sound wave at the first position; and according to the first frequency response curve, adjusting, to a third frequency response curve, the second frequency response curve generated by the second sound wave at the first position, wherein the frequency response of the third frequency response curve is used for being superimposed with and canceling the frequency response of the first frequency response curve at a corresponding frequency. By means of the solution, a speaker actively emits a second sound wave, and the second sound wave is modulated according to parameters of a first sound wave, so as to ensure that the second sound wave can more effectively eliminate the problem of call content leakage caused by the first sound wave.
The present application relates to the field of terminal devices, and in particular to a sound leakage elimination method and apparatus. A sound leakage elimination method, comprising: when it is detected that a receiver outputs a call voice, controlling a collection device to determine a first frequency response curve, at a first position outside a terminal device, of a first sound wave generated by the call voice; controlling a vibration motor to drive a rear housing of the terminal device to vibrate to generate a second sound wave; determining, by means of the collection device, a second frequency response curve of the second sound wave at the first position; and according to the first frequency response curve, adjusting, to a third frequency response curve, the second frequency response curve generated by the second sound wave at the first position, wherein the frequency response of the third frequency response curve is used for superimposing and eliminating the frequency response of the first frequency response curve on a corresponding frequency. By means of the embodiments of the present invention, a vibration motor drives a rear housing of a terminal device to vibrate, so as to actively send a second sound wave, and the second sound wave superimposes and eliminates a first sound wave generated by leaked call sound, so as to eliminate the problem of leakage of call content.
Provided in the present invention is a MEMS microphone, comprising a base having a back chamber, and a capacitance system arranged on the base, wherein the capacitance system comprises a back plate, and a diaphragm arranged opposite to the back plate; the back plate comprises a body portion and a fixing portion connected to the body portion and the base; and the back plate is further provided with several strip-shaped reinforcing ribs protruding from the body portion. Compared with the prior art, in the MEMS microphone provided by the present invention, the strength of the back plate can be improved.
The present utility model provides a vibration sensor, comprising a circuit board having an accommodating cavity, and a first vibration assembly having a first vibration cavity and a second vibration assembly having a second vibration cavity which are respectively arranged on two opposite sides of the circuit board. The circuit board is provided with a first through hole for communicating the first vibration cavity with the accommodating cavity and a second through hole for communicating the second vibration cavity with the accommodating cavity; the first vibration assembly vibrates so that the air pressure in the first vibration cavity changes and the vibration is transferred to a MEMS chip through the first through hole, and the second vibration assembly vibrates so that the air pressure in the second vibration cavity changes and the vibration is transferred to the MEMS chip through the second through hole. The MEMS chip in the vibration sensor provided by the present utility model can better sense vibrations generated by the two vibration assemblies, and convert sensed vibration signals into electric signals, thereby effectively improving the sensitivity and greatly improving the signal-to-noise ratio at the same time.
The present application relates to the technical field of condenser microphones, in particular to a microphone chip and a microphone. The microphone chip comprises: a substrate with a front cavity; and a capacitance system, which is arranged on the substrate, and comprises a diaphragm located at an upper part of the substrate and a back plate spaced apart from the diaphragm, wherein an air gap is formed between the diaphragm and the back plate, and the diaphragm and the back plate are connected to the substrate by means of a fixing portion. The diaphragm comprises an inner diaphragm portion, an outer diaphragm portion and a supporting portion, wherein the inner diaphragm portion and the outer diaphragm portion are spaced apart, and the supporting portion is connected to the fixing portion and the inner diaphragm portion or connected to the fixing portion and the outer diaphragm portion. The microphone chip further comprises a supporting piece, which is connected to the back plate and located between the back plate and the inner diaphragm portion. In an operating state, the inner diaphragm portion can be attracted onto the supporting piece, and the supporting piece can divide the inner diaphragm portion into at least two areas. The diaphragm in the operating state is divided into a plurality of isolated floating areas by means of the supporting piece, so that the rigidity of the diaphragm is effectively adjusted and enhanced according to requirements.
The present application relates to a microphone chip, comprising: a substrate with a front cavity, and a capacitance system, which is arranged on and connected to the substrate. The capacitance system comprises a diaphragm located at an upper part of the substrate and a back plate spaced apart from the diaphragm, wherein an air gap is formed between the diaphragm and the back plate, and the diaphragm and the back plate are connected to the substrate by means of a fixing portion. The diaphragm comprises an inner diaphragm portion, an outer diaphragm portion and a supporting portion, wherein the inner diaphragm portion and the outer diaphragm portion are spaced apart by a slit, and the supporting portion is connected to the fixing portion. The microphone chip further comprises a sealing piece, which is connected to the back plate, located between the back plate and the diaphragm, and arranged near the periphery of the inner diaphragm portion. In the microphone chip, the inner diaphragm portion and the outer diaphragm portion are spaced apart by the slit, and the supporting portion is connected to the fixing portion to fix the diaphragm, so that the diaphragm is cantilevered; and by arranging the sealing piece between the back plate and the diaphragm, the inner diaphragm portion is attracted onto the sealing piece by means of an electrostatic force, the sealing piece supports the inner diaphragm portion to achieve an operating state, and low attenuation of a microphone is reduced.
The present application relates to a microphone chip and a microphone. The microphone chip comprises: a diaphragm and a backplane, wherein the diaphragm is provided with a plurality of corrugations, the side of the backplane close to the diaphragm is provided with protrusions, and in the direction perpendicular to the backplane, the outer contours of the projections of the protrusions on the diaphragm do not intersect the outer contours of the corrugations. The side of the backplane close to the diaphragm is provided with an electrode sheet, and the side of the diaphragm close to the backplane is also provided with an electrode, so that the electrode sheet and the diaphragm form a capacitor system. The backplane is provided with sound outlet holes, and when acoustic waves pass through the sound outlet holes and drive the diaphragm to vibrate, the distance between the electrode sheet and the diaphragm changes, and the capacitance value of the capacitor system changes, so as to convert an acoustic wave signal into an electrical signal. In the direction perpendicular to the backplane, the outer contours of the projections of the protrusions on the diaphragm do not intersect the outer contours of the corrugations, thereby preventing the normal operation of the microphone chip from being affected by the adhesion between the diaphragm and the backplane due to the fact that the protrusions are in contact with and get stuck in the side walls of the corrugations during external vibration or excessive blowing.
An MEMS device manufacturing method and an MEMS device. The method comprises: depositing a thin film (2) on at least part of the surface of a sacrificial layer (1); machining through holes (21) in the thin film (2); removing at least part of a material covered by the thin film (2) in the sacrificial layer (1), and discharging from the through holes (21) the material removed from the sacrificial layer (1), so as to form a cavity (11) in the sacrificial layer (1); and depositing a sealing layer (4) on the surface of the thin film (2) facing away from the sacrificial layer (1), so as to seal the through holes (21). According to the present invention, only a layer of thin film (2) needs to be deposited, such that the production period can be shortened, and a reliable field sealing capability is achieved.
Provided in the present invention is a cantilever microphone, comprising: a base plate; a cantilever, which comprises a rotor frame, a cover plate that covers the rotor frame, and a plurality of rotor comb fingers, the cantilever being provided with a first edge fixed to the base plate and a second edge opposite to the first edge, the plurality of rotor comb fingers being fixed to an edge of the end of the cover plate close to the second edge, and the rotor comb fingers being spaced apart from the rotor frame; and a stator, which is fixed to the base plate and comprises a plurality of stator comb fingers, wherein the stator comb fingers and the rotor comb fingers are alternately arranged and spaced apart from each other; and the rotor frame is made of at least one of polycrystalline silicon, silicon nitride, silicon oxide and silicon carbide. The cantilever microphone of the present invention can achieve both high mechanical sensitivity of the cantilever and high electrostatic sensitivity of the comb structure, thereby improving the performance or signal-to-noise ratio of the cantilever microphone.
A vibration sensor (100), comprising a circuit board (1), and a vibration pickup structure (2) and a signal pickup assembly (3) which are respectively fixed to two opposite sides of the circuit board (1). The vibration pickup structure (2) comprises a first vibration pickup structure (23) accommodated in a first vibration cavity (26), a second vibration pickup structure (24) accommodated in a second vibration cavity (27), and a third vibration pickup structure (25) accommodated in a third vibration cavity (28), wherein the first vibration pickup structure (23), the second vibration pickup structure (24), and the third vibration pickup structure (25) are mutually independent pairwise. The signal pickup assembly (3) comprises a first MEMS microphone (31), a second MEMS microphone (32), and a third MEMS microphone (33). The first vibration pickup structure (23) comprises a first diaphragm (231) vibrating along a first axis (X), the second vibration pickup structure (24) comprises a second diaphragm (241) vibrating along a second axis (Y), and the third vibration pickup structure (25) comprises a third diaphragm (251) vibrating along a third axis (Z). The first axis (X), the second axis (Y) and the third axis (Z) are perpendicular to each other. According to the vibration sensor (100), vibration signals in three directions can be picked up at the same time, and the induced vibration signals are converted into electrical signals, thereby effectively improving the sensitivity and bandwidth of the vibration sensor (100).
H04R 1/40 - Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers
G01H 11/06 - Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
A thin-film bulk acoustic resonator, comprising a substrate (1), an acoustic reflection structure (2) arranged on one side of the substrate (1), a bottom electrode (3) stacked on one side of the acoustic reflection structure (2), a piezoelectric thin film (4) covering the bottom electrode (3), and a top electrode (5) stacked on the side of the piezoelectric thin film (4) away from the bottom electrode (3), wherein an interdigitated protruding frame (6) is provided on the side of the top electrode (5) away from the piezoelectric thin film (4); the interdigitated protruding frame (6) comprises a first protruding frame (61) and a second protruding frame (62) which are arranged opposite each other; at least one pair of interdigitated structures which respectively extend towards each other from the first protruding frame (61) and the second protruding frame (62) and are spaced apart by a preset distance is formed in an overlapping manner; and each interdigitated structure comprises two interdigital fingers spaced by a preset distance in an overlap direction. Two or more transverse Rayleigh-Lamb waves can be reflected to achieve high reflection efficiency, and a Q value corresponding to the anti-resonance frequency of the resonator is improved. The problem of stripping residue caused by a closed loop of an existing protruding frame can be solved.
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
The present invention provides a MEMS microphone, comprising a substrate having a back cavity and a capacitor system provided on the substrate. The capacitor system comprises a back plate and a vibrating diaphragm provided opposite to the back plate; the vibrating diaphragm comprises a vibrating portion and a fixed portion surrounding the vibrating portion and fixed to the substrate; the vibrating portion and the fixed portion are spaced apart by a slit; the fixed portion is provided with a plurality of release portions; and the release portions penetrate through the fixed portion. Compared with the related technologies, the MEMS microphone provided by the present invention can improve the reliability of the back plate.
An electrostatic clutch (100). The electrostatic clutch (100) comprises: a plurality of grounded high-impedance node electrode arrays (101), which form a rigid movable body; and a plurality of bias electrode arrays (102), which form another rigid movable body, such that an electrostatic force is generated between the plurality of bias electrode arrays (102) and the plurality of high-impedance node electrode arrays (101) when relative displacement occurs between same. Compared with the prior art, a microphone is allowed to operate under a large-range atmospheric pressure possibly expected by a customer. The electrostatic clutch is electrostatically implemented in a purely passive manner, and has advantages over other designs that require complicated electronic and active control; and since only minor alternating-current disturbances of a rotor need to be taken into account when a direct-current change at the position of the rotor is not taken into account, a film is physically decoupled from a sensing structure, such that the design of the sensing structure is simplified.
The present invention provides a loudspeaker module, comprising a housing having an accommodating space, a vibration system accommodated inside the accommodating space, and a magnetic circuit system accommodated inside the accommodating space and configured for driving the vibration system, wherein the housing comprises a supporting frame having a through cavity, a front cover covering one side of the supporting frame, and a rear cover covering a side of the supporting frame facing away from the front cover; a positioning structure is provided on an inner side of the supporting frame and the inner side of the supporting frame extends towards the interior of the through cavity to form clamping plates; an edge of the vibration system is connected to a side of the positioning structure close to the front cover; the magnetic circuit system is fixed to a side of the positioning structure close to the rear cover and is fixed to the clamping plates; the vibration system and the front cover define a front cavity; and the vibration system, the supporting frame and the rear cover define a rear cavity. The vibration system and the magnetic circuit system of the present invention are directly assembled with the housing to obtain the loudspeaker module, and the two assembly procedures of a loudspeaker and a module that are separate in the prior art can be simplified into one assembly procedure for a loudspeaker, thereby reducing the cost.
Provided in the present invention are a loudspeaker module and an assembly method therefor. The loudspeaker module comprises a housing having an accommodating space, and a vibration system and a magnetic circuit system which are accommodated in the accommodating space. The housing comprises a basket, and an upper cover plate and a lower cover plate which cover opposite sides of the basket. The basket has a side wall extending in a vibration direction of a diaphragm; the basket and the side wall enclose the accommodating space; and the diaphragm, a circuit board and a magnetic bowl are disposed on the side wall. The upper cover plate, the vibration system and the basket enclose a front sound cavity; and the lower cover plate, the vibration system, the magnetic circuit system and the basket enclose a rear sound cavity. According to the present invention, the basket has the side wall, and when the upper cover plate and the lower cover plate are assembled on the basket, the basket, the upper cover plate and the lower cover plate form the housing of the loudspeaker module, that is, the assembly process is simplified from the original two separate assembly processes for a loudspeaker unit and a loudspeaker module into one assembly process for the loudspeaker module, thereby reducing the machining difficulty and cost.
Provided in the present invention is a loudspeaker. The loudspeaker comprises a cavity filled with a sound absorption material, wherein the cavity is further filled with expandable foam which expands after being triggered, so as to limit the movement of the sound absorption material in the cavity. By means of the loudspeaker provided by the present invention, the reliability of the filled sound absorption material is improved.
A diaphragm (2) and an MEMS sensor (100) using the diaphragm. The diaphragm (2) is a rectangular diaphragm; the diaphragm comprises a diaphragm main body portion (21) as well as fixing portions (22) which are provided on the outside of the diaphragm main body portion (21) and are located at four corners of the diaphragm (2); the four corners of the diaphragm (2) are recessed towards the direction of the diaphragm main body portion (21) to form recessed portions (23); and each fixing portion (22) comprises at least two fixing anchor points (220) provided along the edge, where the corresponding recessed portion (23) is formed, of the diaphragm (2). According to the design of the diaphragm (2), the effective sensing area of the diaphragm (2) and the acoustic performance of the MEMS sensor (100) are improved.
Provided is a MEMS microphone chip, comprising a substrate, a first diaphragm fixed to the substrate, a supporting member fixed to the first diaphragm, and a second diaphragm fixed to the supporting member and spaced apart from the first diaphragm; the second diaphragm comprises a supporting portion supported on the supporting member and a free end surrounding the supporting portion; the projection of the free end in a vibration direction falls into a back cavity. The second diaphragm is configured to be a cantilever beam structure having a free end, and the middle part of the first diaphragm having a maximum displacement is used for driving the second diaphragm having the free end in connection with the middle part by means of the supporting member, so that the limitation of stress and thickness on the vibration performance of the second diaphragm is remarkably reduced, and the sensitivity of the second diaphragm is effectively improved, thereby improving the signal-to-noise ratio of the MEMS microphone chip.
A gas sensor, comprising: a substrate (1); a first housing (21), which is fixed to the substrate (1) and forms a first chamber (32) with the substrate (1) by means of enclosure; and a first infrared transmitter (35) and a first sound sensor (31), which are connected to the substrate (1), wherein the first sound sensor (31) and the first infrared transmitter (35) are both accommodated in the first chamber (32), and the first housing (21) is provided with a first vent hole (33). The gas sensor further comprises: an environment detection assembly (4), which is connected to the substrate (1) and is located outside the first housing (21); and a differential processor, which is connected to the substrate (1), wherein a second detection signal, which is generated by the environment detection assembly (4), includes an ambient sound signal and a vibration signal, and the differential processor is electrically connected to the first sound sensor (31) and the environment detection assembly (4). The differential processor may cancel an ambient sound signal and a vibration signal in a first detection signal according to the second detection signal, and eliminate the strong interference of noise and vibration in an external environment, thereby improving the precision of gas concentration measurement performed by the gas sensor.
Provided in the present invention is an MEMS microphone. The MEMS microphone comprises a base having a back cavity and a capacitive system arranged on the base; the capacitive system comprises a back plate and a diaphragm arranged opposite to the back plate, the diaphragm being located on the side of the back plate close to the base, and the diaphragm comprising a vibration part and a fixed part surrounding the vibration part and fixed to the base. The MEMS microphone is further provided with a supporting member located between the diaphragm and the back plate, the vibration part of the diaphragm being fixedly connected to the back plate by means of the supporting member. A blocking part is arranged on the side of the back plate facing the diaphragm, the projection of the blocking part in the vibration direction of the diaphragm being located at the vibration part of the diaphragm. Compared with the related art, the MEMS microphone provided by the present invention can improve the signal-to-noise ratio thereof.
A core-shell structure molecular sieve, taking a ZSM-5 molecular sieve with a mesoporous structure as a core phase, the silicon-aluminum mass ratio of silicon to aluminum of the core phase being 50-150. The core-shell structure molecular sieve takes a rare earth metal-modified ZSM-5 molecular sieve with a microporous structure as a shell layer, the mass ratio of silicon to aluminum of the shell layer being 300-800, and the shell layer containing 1-5 wt% of a rare earth metal. The shell layer of the core-shell structure molecular sieve has a high silicon-to-aluminum ratio, and after being modified with the rare earth metal, has a greatly improved water resistance. Meanwhile, the microporous structure of the shell layer can effectively limit the entry of VOCs into the core phase of the core-shell structure molecular sieve, so that the molecular sieve in the core phase can maintain a good activity, improving the water resistance and VOCs performance of a sound-absorbing material prepared from the molecular sieve with the core-shell structure, and thus endowing a loudspeaker filled with the sound-absorbing material with stable acoustic performance.
C01B 39/40 - Type ZSM-5 using at least one organic template directing agent
C01B 39/02 - Crystalline aluminosilicate zeolitesIsomorphous compounds thereofDirect preparation thereofPreparation thereof starting from a reaction mixture containing a crystalline zeolite of another type, or from preformed reactantsAfter-treatment thereof
C04B 26/04 - Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
HCMMEMSACFB1FB1FB2FB2MEMSACAC) is connected to an input end of the second primary amplifier (Amp2); and the signal processing module (10) is used for adjusting output signals of the first primary amplifier (Amp1) and the second primary amplifier (Amp2) to target differential signals that have equal amplitudes and opposite phases, and outputting the target differentials signal to the current sharing amplifier (CR-Amp). In the single-ended-to-differential microphone circuit, the current sharing amplifier (CR-Amp), which has a small range of input common-mode voltages and low noise, is used to realize single-ended-to-differential conversion of a signal, thereby facilitating the improvement of a signal-to-noise ratio of a circuit.
ACFB1FB1FB1FB2FB2FB1BBB enables an alternating-current electrical signal to be input at the positive input end and the negative input end of the amplifier at the same time. The circuit in the present invention can use a microphone structure having a smaller capacitor, and also achieves a better system signal-to-noise ratio.
The present utility model provides a MEMS microphone, comprising a housing provided with an accommodating space, a sound hole that penetrates through the housing, MEMS microphone chips and an ASIC chip that are accommodated in the accommodating space, and a subtractor. The MEMS microphone chips comprise at least a first MEMS microphone chip and a second MEMS microphone chip, and the frequency response drop-off characteristic of the first MEMS microphone chip is different from the frequency response drop-off characteristic of the second MEMS microphone chip; both output signals of the first MEMS microphone chip and output signals of the second MEMS microphone chip are outputted to the subtracter, and after undergoing subtraction by the subtracter, said signals are outputted to the ASIC chip. Compared with related technologies, the MEMS microphone of the present utility model has good anti-interference performance and good sensitivity.
H04R 1/28 - Transducer mountings or enclosures designed for specific frequency responseTransducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
The present utility model provides a microphone, comprising a protection structure provided with an accommodating space, and an ASIC chip and a MEMS microphone chip accommodated in the accommodating space. The microphone further comprises a low-pass filter circuit. The low-pass filter circuit is connected between the ASIC chip and the MEMS microphone chip, or the low-pass filter circuit is integrated in the ASIC chip, and the high cut-off frequency of the low-pass filter circuit is greater than 20 KHz. Therefore, by providing the low-pass filter circuit, ultrasonic band interference can be filtered out, noise can be reduced, and the audio quality can be improved.
A vibration control method and device, and a computer-readable storage medium. The method comprises: acquiring target effect parameters in a preset vibration effect design model with reference to a haptic effect requirement indicator (101), wherein the effect parameters in the vibration effect design model comprise: a granularity perception parameter, a sharpness perception parameter and a hardness perception parameter; generating a vibration control signal corresponding to the target effect parameters (10); and controlling, on the basis of the vibration control signal, an actuator to vibrate(103). According to the method, the vibration control mode of the actuator can be adaptively designed according to different haptic effect needs, thereby ensuring the diversity of the haptic effects and the adaptability to scenarios. Moreover, the vibration effect of the actuator account for the perception factors of multiple aspects, thereby providing a user with a more sophisticated haptic feedback.
A force feedback trigger module, comprising a housing having a mounting slot, a trigger swing rod rotatably connected to the housing, and a transmission device connected to the trigger swing rod. The transmission device comprises a one-way transmission module engaged with the trigger swing rod, a driving module connected to the one-way transmission module, and a driving member for driving the driving module; the driving member is connected to the driving module, and the driving member is mounted in the housing; the driving module is mounted in the mounting slot; one end of the one-way transmission module is connected to the driving module, and the other end of the one-way transmission module is engaged with the trigger swing rod. Detachable engaging connection at the position where the one-way transmission module and the trigger swing rod are engaged and at the joint between the one-way transmission module and the driving module can be used to temporarily disengage the trigger swing rod from the driving module when the trigger swing rod is reset, so that when being reset, the trigger swing rod does not drive the driving member to reversely rotate, or drag the driving member; in this way, the trigger swing rod can be quickly reset, thereby providing good game experience for users.
A loudspeaker box, comprising: a housing provided with an accommodation cavity; and a sound production unit fixed in the accommodation cavity, the sound production unit partitioning the accommodation cavity into a closed rear sound cavity and a front sound cavity communicated with the outside of the housing; a heat exchange cavity being formed in the wall body of the accommodation cavity and filled with a heat exchange medium. The heat exchange cavity filled with the heat exchange medium is formed in the housing, and when the loudspeaker box is in a working state, the sound production unit vibrates to generate heat, the heat is conducted to the heat exchange medium via the wall body of the accommodation cavity, and the heat exchange medium is in contact with outside air for heat exchange to release the heat, so that the heat dissipation efficiency of the loudspeaker box is improved.
A loudspeaker box, comprising: a housing, provided with an accommodating cavity; and a sound production unit, fixed in the accommodating cavity, wherein the sound production unit partitions the accommodating cavity into a closed rear sound cavity, and a front sound cavity communicated with the outside of the housing. A heat exchange member is further provided in the sound production unit; a heat exchange cavity is formed in the heat exchange member; the heat exchange cavity is filled with a heat exchange medium; and a part of the heat exchange member is exposed to the sound production unit. Compared with the prior art, according to the loudspeaker box, by providing the heat exchange member in the sound production unit, the loudspeaker box is in a working state, the sound production unit vibrates to generate heat, the heat is conducted to the heat exchange medium in the heat exchange member by means of the wall body of the heat exchange member, and the heat exchange medium is in contact with air outside the sound production unit for heat exchange to release heat, thereby improving the heat dissipation efficiency of the loudspeaker box.
Provided in the present application is a loudspeaker module, which comprises: a housing; a loudspeaker unit, which is mounted in an accommodating cavity of the housing; a heat dissipation support; and a heat dissipation tube, which is mounted on the heat dissipation support and located outside the housing and abuts against a heat dissipation part outside the loudspeaker module. The heat dissipation support is provided with a first cooling channel arranged around the loudspeaker unit, and the heat dissipation tube is provided with a second cooling channel in communication with the first cooling channel, and both the first cooling channel and the second cooling channel are filled with a coolant. In the present application, heat generated by the vibration of the loudspeaker unit can be transferred to the heat dissipation support and then transferred to the outside by means of the coolant in the first cooling channel and the second cooling channel, and the high-temperature coolant in the first cooling channel flows to the second cooling channel under the action of a difference in pressure, thereby achieving circulating flow of the coolant, so that the heat dissipation support has a relatively high heat dissipation efficiency.
The present invention provides a loudspeaker module. The loudspeaker module of the present invention comprises a housing having an accommodation space, a vibration system accommodated in the accommodation space, and a magnetic circuit system accommodated in the accommodation space to drive the vibration system to vibrate and produce sound. The housing comprises a supporting frame having a through cavity, a front cover installed on the opening side of the through cavity of the supporting frame and a rear cover installed on the side of the supporting frame deviating from the front cover. A positioning structure is arranged on the inner side of the supporting frame, the vibration system is fixed to the side of the positioning structure close to the front cover, and the magnetic circuit system is fixed to the side of the positioning structure close to the rear cover. A front cavity is formed between the vibration system and the front cover, and the vibration system, the supporting frame and the rear cover enclose a rear cavity. The supporting frame comprises a conductive member integrally injection molded therein, one end of the conductive member is exposed in the through cavity and electrically connected to the vibration system, and the other end of the conductive member is exposed outside the supporting frame. The solution can simplify a manufacturing process and an assembly process of the loudspeaker module, and reduce the application cost.
A sound production device, comprising a shell having an accommodating cavity and a sound production driver arranged in the accommodating cavity, wherein the sound production driver comprises a vibration system located in the accommodating cavity, and a magnetic circuit system for driving the vibration system to vibrate and produce sound in a first direction. The sound production device further comprises: a box body located in the accommodating cavity; a coil, which is arranged on the side of the magnetic circuit system away from the vibration system and is spaced apart from the magnetic circuit system; a circuit board arranged on the side of the shell that faces the coil and is electrically connected to the coil; and an elastic assembly having one end connected to the shell and the other end connected to the box body, wherein the vibration system and the magnetic circuit system are arranged in the box body, the coil is fixed to the shell so as to drive the sound production driver to vibrate in a second direction, the second direction is configured to be perpendicular to the first direction, and the elastic assembly is configured to suspend the box body in the accommodating cavity. The coil and the vibration system share one magnetic circuit system, and the sound production driver directly serves as a quality unit of the coil, so that components are shared to the maximum possible extent, thereby simplifying an assembly process and saving on costs.
Provided in the present application is a loudspeaker module, comprising a housing, a single loudspeaker mounted in an accommodation chamber of the housing, and a heat dissipation support. The heat dissipation support comprises a body part, one part of the body part being mounted in the accommodation chamber, the other part of the body part extending to the outer side of the housing, an extension part bent and extending upwards in the thickness direction of the loudspeaker module being arranged at the end of the body part located on the outer side of the housing, and the extension part abutting against a heat dissipation part outside the loudspeaker module. The body part is provided with a first cooling channel, the first cooling channel surrounding the periphery of the single loudspeaker, and the extension part being provided with a second cooling channel communicating with the first cooling channel. Heat generated by the vibration of the single loudspeaker can be transferred to the heat dissipation support, and transferred to the outside via a cooling liquid in the first cooling channel and the second cooling channel, and under the action of a pressure difference, the high-temperature cooling liquid in the first cooling channel flows to the second cooling channel, so that the circulation flow of the cooling liquid is realized, and the heat dissipation support has relatively high heat dissipation efficiency.
The present invention provides a microphone amplification circuit design method. The method comprises the following steps: placing a layer of underlying metal between a substrate and a bonding pad of an integrated circuit, forming a first parasitic capacitor between the bonding pad and the underlying metal, and forming a second parasitic capacitor between the underlying metal and the substrate; locating a circuit node in the amplification circuit, and enabling the circuit node to meet preset conditions; connecting the underlying metal to the circuit node, and connecting the bonding pad to an input terminal; welding the microphone to the bonding pad of the integrated circuit to serve as a microphone capacitor, connecting one terminal of the microphone capacitor to a high-voltage bias voltage, and connecting the other terminal of the microphone capacitor to the input terminal; connecting one terminal of the first parasitic capacitor to the input terminal, and connecting the other terminal of the first parasitic capacitor to an output terminal; and connecting one terminal of the second parasitic capacitor to the output terminal, and grounding the other terminal of the second parasitic capacitor. The present invention further provides a microphone amplification circuit. Compared with the prior art, the microphone amplification circuit design method and the microphone amplification circuit have a high signal-to-noise ratio and better performance.
A microphone circuit. The microphone circuit comprises an amplifier, a bias resistor, and a bias network module, which is connected to an input end of the microphone circuit, wherein the amplifier is used for receiving a signal, which is output by an external microphone, amplifying the signal, and then outputting same; a first end of the bias resistor is used for accessing a preset bias voltage, and a second end of the bias resistor is used for connecting to an output end of the microphone; and the bias network module is used for performing determination regarding the voltage value of the signal, and if the voltage value of the signal exceeds a voltage value range of preset threshold voltage groups, the input end of the microphone circuit accesses impedances corresponding to the bias network module, such that the amplitude of the signal is reduced, which impedances correspond to the threshold voltage groups on a one-to-one basis. Further provided are a microphone module and a method for raising an acoustic overload point of a microphone. Compared with the prior art, the technical solution raises an acoustic overload point of a microphone, and has a good electrical performance.
Provided is an acoustic transducer, comprising a base, a fixed member, a movable member, a first electrode and a second electrode, wherein the base is provided with a cavity and comprises a first surface arranged towards the cavity; the fixed member extends towards the cavity from the first surface and comprises a fixed end fixed on the first surface and a free end arranged opposite the fixed end; the movable member is fixed on the base and located above the cavity, at least partially covers the cavity and comprises a second surface arranged towards the cavity; and the first electrode is fixed on the free end, the second electrode is fixed on the second surface, and the first electrode and the second electrode are transversely adjacent. The acoustic transducer provided by the present invention has higher sensitivity, and the first electrode has higher stability, thereby improving the performance of the acoustic transducer.
The present utility model relates to a vibration motor, comprising a housing having an accommodating space, a vibration member and a fixed member accommodated in the accommodating space, and an elastic support member suspending and supporting the vibration member in the accommodating space and providing an elastic restoring force for the vibration member. The elastic support member comprises a first fixed portion fixed on the vibration member, an elastic arm having one end connected to the first fixed portion, and a second fixed portion formed by bending the other end of the elastic arm and fixed on the housing; and an extension direction of the first fixed portion is perpendicular to a vibration direction of the vibration member, and an extension direction of the second fixed portion is parallel to the vibration direction. In the vibration motor of the present utility model, by means of configurations of the elastic arm of the elastic support member and a bent structure of the second fixed portion, the accommodating space inside the housing is effectively utilized, a strain area length of the elastic support member is increased, and an elastic stress of the elastic support member is effectively improved, thereby prolonging the service life of the elastic support member, and effectively improving the assembling efficiency and increasing the product utilization rate.
H02K 33/18 - Motors with reciprocating, oscillating or vibrating magnet, armature or coil system with coil systems moving upon intermittent or reversed energisation thereof by interaction with a fixed field system, e.g. permanent magnets
H02K 33/02 - Motors with reciprocating, oscillating or vibrating magnet, armature or coil system with armatures moved one way by energisation of a single coil system and returned by mechanical force, e.g. by springs
Provided by the present utility model is a linear motor, which comprises a cover plate, a stator assembly and a vibrator assembly fixed on the cover plate, and a housing the inner part of which covers the stator assembly and the vibrator assembly. The stator assembly comprises an FPC board fixed on the cover plate, and a coil bonded on the FPC board. The FPC board is provided with a glue injection hole, and the coil is bonded to the FPC board and the cover plate by means of the glue injection hole, so that the coil, the FPC board and the cover plate may be fixed at the same time, which helps to enhance the bonding strength of the coil, the FPC board and the cover plate.
H02K 33/02 - Motors with reciprocating, oscillating or vibrating magnet, armature or coil system with armatures moved one way by energisation of a single coil system and returned by mechanical force, e.g. by springs
H02K 33/18 - Motors with reciprocating, oscillating or vibrating magnet, armature or coil system with coil systems moving upon intermittent or reversed energisation thereof by interaction with a fixed field system, e.g. permanent magnets
92.
VIBRATION-FREQUENCY DESIGNING METHOD BASED ON MUSIC FREQUENCY
Provided is a vibration-frequency designing method based on music frequency. The method comprises the following steps: S1: presetting a set of quantization modules which comprises a personalized input quantization module, a music feature quantization module and a vibration effect quantization module; S2: inputting a user personalization parameter, and obtaining a specific quantization value of personalized input through the personalized input quantization module; S3: extracting a music feature of a music signal, and obtaining a specific quantization value of the music feature through the music feature quantization module; S4: carrying out quantization calculation, calculating same according to a formula, and obtaining a relative value of a vibration effect frequency; S5: mapping the relative value of the vibration effect frequency through the vibration effect quantization module to obtain an absolute value of the vibration effect frequency; and S6: broadcasting the vibration by a motor on the basis of the absolute value of the vibration effect frequency. The vibration-frequency designing method realizes perfect conversion from an audio music frequency to a tactile vibration frequency, and provides designers or users with an efficient and rich tactile experience.
G10L 21/06 - Transformation of speech into a non-audible representation, e.g. speech visualisation or speech processing for tactile aids
G10L 19/02 - Speech or audio signal analysis-synthesis techniques for redundancy reduction, e.g. in vocodersCoding or decoding of speech or audio signals, using source filter models or psychoacoustic analysis using spectral analysis, e.g. transform vocoders or subband vocoders
G10L 19/032 - Quantisation or dequantisation of spectral components
Provided are a button battery casing (100) and a button battery (300) having same. The button battery casing comprises a main casing body (1) and a cover plate (2), the main casing body is an electrically insulating casing having an accommodating cavity (01), the accommodating cavity is provided with an opening (001), and the cover plate covers an end part of the opening and covers the accommodating cavity; the cover plate comprises a first conductor part (21), a second conductor part (22), and an insulating part (23) which is disposed between the two conductor parts and which is used for preventing the two conductor parts from mutually conducting, the insulating part has a first end surface (231) and a second end surface (232) that are oppositely arranged, the first end surface and the second end surface both face a side wall (12) of the accommodating cavity, the first conductor part extends in the direction from the first end surface towards the side wall opposite to the first end surface, and the second conductor part extends in the direction from the second end surface towards the side wall opposite to the second end surface. A winding core (4) accommodated in the accommodating cavity comprises a positive electrode piece (41), a negative electrode piece (42), and a separator (43), and the first conductor part and the second conductor part on the cover plate may be respectively used as the positive electrode lead-out end of the positive electrode piece and the negative electrode lead-out end of the negative electrode piece. The described battery casing is beneficial for improving the effective volume and capacity of a button battery, and at the same time, shortens the duration of a welding process for positive and negative electrode lead-outs of a winding core, and production efficiency is improved.
Disclosed in the present application are a dynamic tactile effect generation method and apparatus, a device, and a storage medium. In the present application, by detecting a triggering condition of an event, an event which needs to realize tactile occurrence is identified, such that a non-tactile event can be avoided, and false triggering can be reduced; by performing feature identification on a triggered event, a required event feature can be extracted; matching between the event feature and a tactile feature is performed according to a preset rule to generate a standardized tactile effect file, such that the matching efficiency is improved; moreover, because the standardized tactile effect file is applicable to electronic products, the transformed corresponding standardized tactile effect files of different trigger events can also be applicable to electronic products, thereby facilitating popularization; moreover, by calling a basic tactile effect and combining the transformed standardized tactile effect files, a dynamic tactile effect is generated, without additional storage of tactile effects, and corresponding different dynamic tactile effects are generated according to different events, thereby improving user experience.
The present application provides a vibration motor, comprising a mounting housing, a vibrator accommodated in the mounting housing, an elastic member suspending the vibrator in the mounting housing, and a stator fixed to the mounting housing; one of the stator and the vibrator has magnetic steel, and the other has a coil; the vibration motor further comprises a flexible circuit board, the mounting housing has a port corresponding to the flexible circuit board; the flexible circuit board comprises a first conductive portion arranged in the mounting housing, a second conductive portion arranged outside the mounting housing, and a bending portion connected between the first conductive portion and the second conductive portion, the bending portion extends from the first conductive portion and passes through the port to be connected to the second conductive portion; and the flexible circuit board further comprises a limiting portion extending from the bending portion and accommodated in the mounting housing, and the limiting portion is used for abutting against an inner wall surface of the mounting housing near the port. The present technical solution solves the technical problem in the prior art that the assembly precision cannot be ensured as the size of the flexible circuit board pulled out of the mounting housing easily goes beyond the pulling range due to being unbounded.
H02K 33/02 - Motors with reciprocating, oscillating or vibrating magnet, armature or coil system with armatures moved one way by energisation of a single coil system and returned by mechanical force, e.g. by springs
H02K 33/18 - Motors with reciprocating, oscillating or vibrating magnet, armature or coil system with coil systems moving upon intermittent or reversed energisation thereof by interaction with a fixed field system, e.g. permanent magnets
96.
MOTOR VIBRATION SIGNAL GENERATION METHOD AND APPARATUS, COMPUTER DEVICE, AND STORAGE MEDIUM
Disclosed in embodiments of the present invention is a motor vibration signal generation method, comprising: acquiring initial data of a motor, the initial data comprising target center frequency, boundary condition values and nonlinear parameters of a motor vibrator; calculating a target displacement signal of the motor by using a motor nonlinear positive model according to the target center frequency, an initial displacement starting point, an initial displacement end point, and the nonlinear parameters; and performing, on the basis of the target displacement signal and the nonlinear parameters, calculation by using a motor nonlinear inverse model, to obtain a target excitation voltage signal of the motor. Since the target excitation voltage signal is obtained by calculation by means of the motor nonlinear inverse model on the basis of the target center frequency, the calculation accuracy of the target excitation voltage signal is ensured, and the motor is driven using the target excitation voltage signal so that the motor vibrates at the target center frequency. Therefore, the motor vibration signal is short, the vibration sense is strong, the frequency is diversified, the tactile effect of the motor is improved, and the precise control of motor vibration is achieved.
A method and apparatus for measuring parameters of a motor model, an electronic device, and a medium. The method comprises: obtaining a voltage signal and a current signal of a motor in a working state, a vibrator of the motor vibrating in two directions (101); obtaining a preset frequency spectrum impedance expression of a motor model, the frequency spectrum impedance expression being determined according to the mapping relationship between kinetic parameters of the motor in the two directions and the mapping relationship between the voltage and current of the motor (102); respectively substituting the voltage signal and the current signal into the frequency spectrum impedance expression to calculate and obtain a plurality of frequency spectrum impedance values of the motor (103); and according to the plurality of frequency spectrum impedance values of the motor, performing fitting calculation on the frequency spectrum impedance values of the motor by using a method of least squares to obtain target frequency spectrum impedance parameters of the motor model (104).
The present application relates to the technical field of electromagnetic motion, and provides a vibration motor. According to the vibration motor, respectively providing two stator assemblies at the two sides of a vibrator assembly prevents the vibrator assembly from being arranged around the stator assembles, reduces the complexity of arranging and designing coils on the vibration motor, and can reduce the size of the vibration motor; moreover, the coils, a circuit board, and a first magnetic conduction sheet are sequentially stacked on a housing, and therefore, the present application is simple to assemble, and can improve the assembling efficiency and reduce the manufacturing cost.
H02K 33/02 - Motors with reciprocating, oscillating or vibrating magnet, armature or coil system with armatures moved one way by energisation of a single coil system and returned by mechanical force, e.g. by springs
H02K 33/18 - Motors with reciprocating, oscillating or vibrating magnet, armature or coil system with coil systems moving upon intermittent or reversed energisation thereof by interaction with a fixed field system, e.g. permanent magnets
99.
LOUDSPEAKER CABINET AND ASSEMBLING PROCESS THEREFOR
Provided is a loudspeaker cabinet. The loudspeaker cabinet comprises: a sound production unit provided with a vibration system, a magnetic circuit system and a basket; a front cover provided with an accommodating recess; and a rear cover fixed to the front cover. The sound production unit is accommodated in the accommodating recess; the vibration system vibrates in a vibration direction and comprises a diaphragm fixed to the basket; the front cover comprises a base wall supporting the sound production unit, and a plurality of side walls which extend from the edge of the base wall and form the accommodating recess together jointly with the base wall; and one of the plurality of side walls is provided with a window communicating with the accommodating recess. The loudspeaker cabinet further comprises a supporting member fixed to the vibration system, the supporting member comprising a body clamped between a first diaphragm and the base wall, and a frame connected to the body and fixed to the side wall having the window. The body, the sound production unit and the base wall jointly form a first channel; the frame, the base wall and the side wall having the window jointly form a second channel; the second channel and the first channel jointly form a front cavity communicating with the window; and the supporting member, the sound production unit, the front cover and the rear cover jointly form a closed rear cavity. According to the loudspeaker cabinet, the space of the rear cavity is enlarged by the arrangement of the body and the frame, the rear cavity is maximized, and the acoustic performance is improved.
H04R 1/28 - Transducer mountings or enclosures designed for specific frequency responseTransducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
Provided is a loudspeaker cabinet. The loudspeaker cabinet comprises a shell with an accommodating space, and a sound production unit. The shell comprises a plastic member and a reinforcing rigid body injected to the plastic member. The plastic member comprises a bottom wall connected to the reinforcing rigid body, and a retaining wall connected to the bottom wall. The loudspeaker cabinet further comprises a soldering lug for electrically connecting the sound production unit to an external circuit. The soldering lug comprises a main body portion, a first electric connection portion extending out of the accommodating space from the main body portion, and a second electric connection portion extending from the main body portion and electrically connected to the sound production unit. The plastic member further comprises an enclosure wall extending from the bottom wall and far away from the reinforcing rigid body; the enclosure wall is spaced from the retaining wall by a certain distance and surrounds the main body portion; and the enclosure wall is bonded to the reinforcing rigid body by means of glue. The loudspeaker cabinet provided in the present invention is low in cost, simple to assemble and high in terms of assembling stability.
patents
