AAC Acoustic Technologies (Shenzhen) Co., Ltd.

China

Back to Profile

1-100 of 1,921 for AAC Acoustic Technologies (Shenzhen) Co., Ltd. Sort by
Query
Aggregations
IP Type
        Patent 1,920
        Trademark 1
Jurisdiction
        World 1,693
        United States 227
        Europe 1
Date
New (last 4 weeks) 18
2025 June (MTD) 5
2025 May 13
2025 April 7
2025 March 7
See more
IPC Class
H04R 9/06 - Loudspeakers 479
H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details 371
H04R 1/02 - CasingsCabinetsMountings therein 166
H04R 19/04 - Microphones 136
G06F 3/01 - Input arrangements or combined input and output arrangements for interaction between user and computer 70
See more
NICE Class
07 - Machines and machine tools 1
09 - Scientific and electric apparatus and instruments 1
Status
Pending 53
Registered / In Force 1,868
  1     2     3     ...     20        Next Page

1.

WEARABLE APPARATUS

      
Application Number 18640018
Status Pending
Filing Date 2024-04-19
First Publication Date 2025-06-05
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Lin, Meng

Abstract

A wearable apparatus is provided. The wearable apparatus includes a support, at least one first speaker, and the at least one second speaker. The at least one first speaker and the at least one second speaker are disposed in the support. When a user wears the wearable apparatus for using, the at least one second speaker respectively adjusts a waveform and a phase of a second sound wave signal according to sound wave features, such as waveform and phase, of a first sound wave signal. The second sound wave signal cancels at least a part of the first sound wave signal propagating in a second direction. Sound attenuation of the first sound wave signal in the second direction is increased, that is, the far-field isolation degree of the wearable device is improved through a cancellation effect of the at least one second speaker, a privacy effect thereof is better.

IPC Classes  ?

2.

WEARABLE DEVICE

      
Application Number CN2023135282
Publication Number 2025/111898
Status In Force
Filing Date 2023-11-30
Publication Date 2025-06-05
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Lin, Meng

Abstract

A wearable device, comprising a support, wherein the following components are arranged inside the support: a first loudspeaker (3), which can output a first sound wave signal, the propagation direction comprising a first direction and a second direction, and an included angle θ meeting 90°<θ≤180°; and a second loudspeaker (4), which can output a second sound wave signal, the propagation direction being the second direction, and the two signals having the same waveform and opposite phases. When the wearable device is used, the first direction is a direction in which sounds propagate towards human ears, the second direction is a direction in which sounds propagate away from human ears, the first loudspeaker (3) is a main sound source, which transmits an audible sound, the second loudspeaker (4) adjusts the phase and waveform of the second sound wave signal, such that the second sound wave signal has the same waveform as the first sound wave signal and has an opposite phase to the first sound wave signal, the second sound wave signal can offset the first sound wave signal propagating in the second direction, and the sound attenuation of the first sound wave signal in the second direction is increased, that is, the degree of far-field isolation of the wearable device is improved, and thus the privacy is better.

IPC Classes  ?

  • H04R 9/06 - Loudspeakers
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details

3.

VOICE WAKE-UP METHOD, ELECTRONIC DEVICE, AND COMPUTER-READABLE STORAGE MEDIUM

      
Application Number 18633349
Status Pending
Filing Date 2024-04-11
First Publication Date 2025-06-05
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Zheng, Zitao
  • Jiang, Min
  • Tao, Hongyan

Abstract

A voice wake-up method, an electronic device, and a computer-readable storage medium are provided. The voice wake-up method comprises collecting an original voice signal input by a user; generating pulse density modulation data according to the original voice signal; decoding the pulse density modulation data to generate decoded data; performing preprocessing and feature extraction processing on the decoded data to generate voice features; performing pattern matching on the voice features according to a hidden Markov model to generate a recognition result; and waking up an external processor of the electronic device according to the recognition result. In the voice wake-up method, a voice wake-up function of the electronic device is realized, which reduce the power consumption of the electronic devices while improving the accuracy of voice wake-up.

IPC Classes  ?

  • G10L 15/14 - Speech classification or search using statistical models, e.g. Hidden Markov Models [HMM]
  • G10L 15/02 - Feature extraction for speech recognitionSelection of recognition unit
  • G10L 15/22 - Procedures used during a speech recognition process, e.g. man-machine dialog
  • G10L 15/30 - Distributed recognition, e.g. in client-server systems, for mobile phones or network applications
  • G10L 19/038 - Vector quantisation, e.g. TwinVQ audio
  • G10L 25/21 - Speech or voice analysis techniques not restricted to a single one of groups characterised by the type of extracted parameters the extracted parameters being power information
  • G10L 25/24 - Speech or voice analysis techniques not restricted to a single one of groups characterised by the type of extracted parameters the extracted parameters being the cepstrum

4.

VOICE WAKE-UP METHOD, ELECTRONIC DEVICE, AND COMPUTER READABLE STORAGE MEDIUM

      
Application Number CN2023135907
Publication Number 2025/112044
Status In Force
Filing Date 2023-12-01
Publication Date 2025-06-05
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Zheng, Zitao
  • Jiang, Min
  • Tao, Hongyan

Abstract

Embodiments of the present invention provide a voice wake-up method, an electronic device, and a computer readable storage medium. The method comprises: collecting an original voice signal inputted by a user; generating pulse density modulation data on the basis of the original voice signal; decoding the pulse density modulation data to generate decoded data; performing preprocessing and feature extraction processing on the decoded data to generate a voice feature; on the basis of an obtained hidden Markov model, performing mode matching on the voice feature to generate an identification result; and on the basis of the identification result, waking up an external processor of an electronic device. In the technical solution provided in the embodiments of the present invention, preprocessing and feature extraction processing are performed on the decoded data to obtain a voice feature; on the basis of an obtained hidden Markov model, mode matching is performed on the voice feature to generate an identification result; and on the basis of the identification result, an external processor of an electronic device is woken up. Thus, a voice wake-up function is realized, and the accuracy of voice wake-up is improved while power consumption of the electronic device is reduced.

IPC Classes  ?

  • G10L 15/22 - Procedures used during a speech recognition process, e.g. man-machine dialog
  • G10L 15/14 - Speech classification or search using statistical models, e.g. Hidden Markov Models [HMM]
  • G10L 15/02 - Feature extraction for speech recognitionSelection of recognition unit
  • G10L 25/87 - Detection of discrete points within a voice signal

5.

DIAPHRAGM UNIT AND LOUDSPEAKER SAID DIAPHRAGM UNIT

      
Application Number CN2023137861
Publication Number 2025/112105
Status In Force
Filing Date 2023-12-11
Publication Date 2025-06-05
Owner
  • AAC TECHNOLOGIES PTE. LTD. (Singapore)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Backman, Juha

Abstract

A diaphragm unit and a loudspeaker having said diaphragm unit. The diaphragm unit comprises: a diaphragm body (10), which is capable of vibrating in a first direction, and the diaphragm body (10) being provided with mounting portions (11); a shake prevention mechanism, which comprises a plurality of shake prevention assemblies, the plurality of shake prevention assemblies all being connected to the mounting portions (11), and the shake prevention assemblies (20) comprising first movable portions (21) and second movable portions (22); one end of each first movable portion (21) is pivotally connected to a mounting portion (11), the other end of said first movable portion (21) is pivotally connected to a second movable portion (22), and said second movable portion (22) can move back and forth in a direction normal to a first direction (D1). Compared to the prior art, by the provision of the plurality of shake prevention assemblies (20), the diaphragm body (10) can be stably supported, which effectively prevents shaking and swinging motions of the diaphragm body (10); the stability and reliability of the diaphragm body (10) are improved, the occurrence of unwanted noise is prevented, and the acoustic performance of a loudspeaker is effectively improved.

IPC Classes  ?

6.

GIMBAL DEVICE

      
Application Number CN2023133309
Publication Number 2025/107182
Status In Force
Filing Date 2023-11-22
Publication Date 2025-05-30
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Li, Songtao
  • Yuan, Junhao
  • Tao, Hongyan

Abstract

The present invention relates to the technical field of gimbals. Disclosed is a gimbal device, comprising: a lifting module (100), which comprises a first driving member (11), a worm (12), and a rack (13) in transmission connection with the worm (12); a horizontal rotating module (200), which is connected to the rack (13) and comprises a second driving member (21), a first synchronous pulley (22) and a bearing assembly, the first synchronous pulley (22) driving the bearing assembly to rotate horizontally; a rotating shaft (300) connected to the bearing assembly, a pitch module (400) and a yaw module (500) being provided at an end of the rotating shaft (300); the pitch module (400) comprising a third driving member (31), a first transmission gear (32) and a fixed gear (33), the third driving member (31) being rotatable around the axial direction of the fixed gear (33); and the yaw module (500) comprising a fourth driving member (41), a second transmission gear (42), a yaw gear (43) and a yaw shell (44), the yaw shell (44) being rotatable around the axial direction of the yaw gear (43). In the device, the lifting module (100) can achieve vertical lifting, the horizontal rotating module (200) can achieve horizontal rotation, the pitch module (400) can achieve front-rear rotation, and the yaw module (500) can achieve left-right rotation, that is, four-axis movement is achieved, which provides a rich variety of movement modes; moreover, a compact layout is achieved between the modules, so that the four-axis movement can be realized in a small space.

IPC Classes  ?

  • F16M 11/24 - Undercarriages with or without wheels changeable in height or length of legs, also for transport only
  • F16M 11/12 - Means for attachment of apparatusMeans allowing adjustment of the apparatus relatively to the stand allowing pivoting in more than one direction

7.

SMART WEARABLE DEVICE

      
Application Number CN2023133828
Publication Number 2025/107269
Status In Force
Filing Date 2023-11-24
Publication Date 2025-05-30
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Yuan, Junhao
  • Lai, Zhongping
  • Tao, Hongyan

Abstract

Provided in the present utility model is a smart wearable device, comprising a spectacles frame and a pair of temples extending backward from two sides of the spectacles frame. Each temple comprises a frame, a cover plate that covers the frame to form a accommodating space, and a speaker unit accommodated in the accommodating space, wherein the speaker unit comprises a first sound-generating surface and a second sound-generating surface opposite the first sound-generating surface; the frame comprises an upper wall, a lower wall opposite the upper wall, and an outer wall connecting the upper wall and the lower wall; the cover plate is arranged opposite the outer wall; and a first sound output hole is provided in the upper wall, a second sound output hole is provided in the lower wall, and a third sound output hole is provided in the outer wall, the first sound output hole being in communication with an inner cavity of the speaker unit, the second sound output hole being in communication with the first sound-generating surface of the speaker unit, and the third sound output hole being in communication with the second sound-generating surface of the speaker unit. In the smart wearable device of the present utility model, two front cavities are independent of each other and each have an independent sound outlet, so as to achieve independent sound output of the two front cavities, and a rear cavity has the effect of preventing sound leakage.

IPC Classes  ?

  • G02B 27/01 - Head-up displays
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details
  • H04R 9/06 - Loudspeakers
  • G02C 11/00 - Non-optical adjunctsAttachment thereof

8.

INTELLIGENT WEARABLE DEVICE

      
Application Number CN2023133829
Publication Number 2025/107270
Status In Force
Filing Date 2023-11-24
Publication Date 2025-05-30
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Yuan, Junhao
  • Xie, Xiuliang
  • Tao, Hongyan

Abstract

The present invention provides an intelligent wearable device, comprising a glasses frame and a pair of temples extending backwards from two sides of the glasses frame, wherein the glasses frame comprises connecting parts connected to the temples; each temple comprises a frame, a cover plate covering the frame to form an accommodating space, and a rotating shaft assembly accommodated in the accommodating space and fitted with the corresponding connecting part of the glasses frame; the frame comprises an upper wall and a lower wall opposite to the upper wall; the rotating shaft assembly comprises a first rotating shaft support fixed to the upper wall, a second rotating shaft support fixed to the lower wall, a screw connected between the first rotating shaft support and the second rotating shaft support, and locating ball plunger assemblies fixed to the corresponding connecting part; the locating ball plunger assemblies are movably connected between the first rotating shaft support and the second rotating shaft support so as to implement stored and unfolded states of the intelligent wearable device. According to the intelligent wearable device of the present invention, storage and unfolding of the intelligent wearable device are implemented by means of rotating shaft assemblies, the structure is simple, the requirements for part machining precision and assembling precision are low, and the development cost is low.

IPC Classes  ?

9.

Smart Wearable Device

      
Application Number 18628839
Status Pending
Filing Date 2024-04-08
First Publication Date 2025-05-29
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Yuan, Junhao
  • Lai, Zhongping
  • Tao, Hongyan

Abstract

The present invention provides a smart wearable device includes a glass frame and two temples. Each temple includes a shelf, a cover plate, and a speaker. The speaker includes a first and a second sounding surface. The shelf includes an upper wall, a lower wall, and an outer wall. The upper wall has a first sound hole, the lower wall has a second sound hole, the outer wall has a third sound hole. The speaker has an inner cavity communicated with the first sound hole. The first sounding surface is communicated with the second sound hole. The second sounding surface is communicated with the third sound hole. Two front cavities of the smart wearable device of present invention are independent of each other, and each has an independent sound hole, so that the two cavities can independently produce sound, the back cavity plays a role in preventing sound leakage.

IPC Classes  ?

10.

POWER SUPPLY DEVICE AND TERMINAL

      
Application Number 18633568
Status Pending
Filing Date 2024-04-12
First Publication Date 2025-05-22
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • You, Changyuan
  • Tao, Hongyan

Abstract

A power supply device and a terminal are provided. The power supply device includes a battery module and at least one optical display module, the battery module is electrically connected to the at least one optical display module, the battery module is configured to supply electrical signals to the at least one optical display module, so that the battery module directly supplies power to the at least one optical display module, which reduces a length of a power supply circuit and further reduces a width of the power supply circuit.

IPC Classes  ?

  • H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
  • G02B 27/01 - Head-up displays

11.

DIOPTER ADJUSTING APPARATUS AND VR DEVICE

      
Application Number CN2023131240
Publication Number 2025/102201
Status In Force
Filing Date 2023-11-13
Publication Date 2025-05-22
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Lin, Qinghua
  • Li, Songtao
  • Tao, Hongyan
  • Yuan, Junhao

Abstract

A diopter adjusting apparatus and a VR device. The diopter adjusting apparatus comprises: a lens mounting part for mounting a lens module; a guide adjusting part connected to the lens mounting part, wherein the guide adjusting part can move along a preset path such that the lens mounting part moves in a first direction; and a driving part used for driving the guide adjusting part to move along the preset path. Compared with the prior art, by means of the arranged lens mounting part, guide adjusting part, and driving part, the driving part drives the guide adjusting part to move along the preset path, such that the lens mounting part is driven to move in a reciprocating manner, thereby achieving automatic adjustment of the diopter.

IPC Classes  ?

12.

POWER SUPPLY DEVICE AND TERMINAL

      
Application Number CN2023132223
Publication Number 2025/102333
Status In Force
Filing Date 2023-11-17
Publication Date 2025-05-22
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • You, Changyuan
  • Tao, Hongyan

Abstract

Embodiments of the present application provide a power supply device and a terminal. The device comprises a battery module and optical engine modules. The battery module is electrically connected to the optical engine modules. The battery module is used for providing electric signals to the optical engine modules, so that the battery module directly supplies power to the optical engine modules, reducing the length of the power supply line, and also reducing the width of the power supply line.

IPC Classes  ?

  • H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
  • G02B 27/01 - Head-up displays
  • G02C 5/14 - Side-members

13.

GIMBAL DEVICE

      
Application Number 18637441
Status Pending
Filing Date 2024-04-16
First Publication Date 2025-05-22
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Li, Songtao
  • Yuan, Junhao
  • Tao, Hongyan

Abstract

A gimbal device includes a lifting module, a horizontal rotating module, a rotating shaft, a pitch module, and a swing module, the lifting module includes a driving piece, a transmission worm, and a gear rack, the horizontal rotating module includes a driving piece, a first synchronous pulley, and a bearing assembly, the first synchronous pulley drives the bearing assembly to rotate, the rotating shaft is connected with the bearing assembly, the pitch module includes a driving piece, a first transmission gear, and a fixed gear, the third driving piece rotates around the fixed gear, the swing module includes a driving piece, a second transmission gear, a swing gear, and a swing housing, the swing housing rotates around the swing gear. The gimbal device is capable of performing four-axis motion, and modules of the gimbal device are disposed compactly, the four-axis motion is realized in a small space.

IPC Classes  ?

  • F16M 11/12 - Means for attachment of apparatusMeans allowing adjustment of the apparatus relatively to the stand allowing pivoting in more than one direction
  • F16M 11/18 - Heads with mechanism for moving the apparatus relatively to the stand
  • F16M 11/20 - Undercarriages with or without wheels
  • F16M 11/24 - Undercarriages with or without wheels changeable in height or length of legs, also for transport only

14.

LOUDSPEAKER MODULE AND INTELLIGENT HEAD-MOUNTED DEVICE

      
Application Number CN2023131268
Publication Number 2025/102208
Status In Force
Filing Date 2023-11-13
Publication Date 2025-05-22
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Lin, Meng

Abstract

A loudspeaker module and an intelligent head-mounted device. The loudspeaker module comprises: a loudspeaker housing (1), an accommodating cavity (2) being provided within the loudspeaker housing (1), and the accommodating cavity (2) having a first space and a second space; a first sound-producing unit, which divides the first space into a first rear sound cavity (22) and a first front sound cavity (21), a first speaker hole (3) being provided in a first surface (11) of the loudspeaker housing (1), and the first front sound cavity (21) being in communication with the outside of the loudspeaker housing (1) via the first speaker hole (3); and a second sound-producing unit, which divides the first space into a second rear sound cavity (24) and a second front sound cavity (23), a second speaker hole (4) being provided in the first surface (11), and the second front sound cavity (23) being in communication with the outside of the loudspeaker housing (1) via the second speaker hole (4). Compared with the prior art, by means of providing two speaker holes which are located in the same surface of the loudspeaker housing (1), the sound of the loudspeaker module is supplemented and superposed, and the overall frequency range and loudness are also increased.

IPC Classes  ?

15.

DIOPTER ADJUSTMENT DEVICE AND VIRTUAL REALITY APPARATUS

      
Application Number 18637379
Status Pending
Filing Date 2024-04-16
First Publication Date 2025-05-15
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Lin, Qinghua
  • Li, Songtao
  • Tao, Hongyan
  • Yuan, Junhao

Abstract

A diopter adjustment device and a virtual reality (VR) apparatus are provided. The diopter adjustment device includes a lens mounting part, a guide adjustment part, and a driving part. The lens mounting part is configured to mount a lens module. The guide adjustment part is connected to the lens mounting part, the guide adjustment part moves along a preset path to drive the lens mounting part to move along a first direction, and the driving part is configured to drive the guide adjustment part to move along the preset path. Compared with the prior art, the diopter adjustment device includes the lens mounting part, the guide adjustment part, and the driving part, the driving part drives the guide adjustment part to move along the preset path, so as to drive the lens mounting part to reciprocate to automatically adjust the diopters.

IPC Classes  ?

  • G02B 7/10 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification by relative axial movement of several lenses, e.g. of varifocal objective lens

16.

SPEAKER MODULE AND SMART HEADSET

      
Application Number 18637361
Status Pending
Filing Date 2024-04-16
First Publication Date 2025-05-15
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Lin, Meng

Abstract

A speaker module and a smart headset are provided. The speaker module includes a speaker housing, a first sounding unit, and a second sounding unit. An accommodating cavity is defined in the speaker housing, the accommodating cavity includes a first space and a second space. The first sounding unit is fixed in the accommodating cavity, the first sounding unit divides the first space into a first rear sound cavity and a first front sound cavity. The second sounding unit is fixed in the accommodating cavity, the second sounding unit divides the second space into a second rear sound cavity and a second front sound cavity. The speaker provides a first speaker hole and a second speaker hole defined on the same surface of the speaker housing, which supplements and superposes sound of the speaker module and further improves an overall frequency range and loudness of the speaker.

IPC Classes  ?

  • H04R 1/24 - Structural combinations of separate transducers or of parts of the same transducer and responsive respectively to two or more frequency ranges
  • H04R 1/02 - CasingsCabinetsMountings therein
  • H04R 1/26 - Spatial arrangement of separate transducers responsive to two or more frequency ranges

17.

MICROPHONE AND METHOD FOR MANUFACTURING SAME

      
Application Number CN2023127721
Publication Number 2025/091159
Status In Force
Filing Date 2023-10-30
Publication Date 2025-05-08
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Li, Bo
  • Zhao, Zhuanzhuan
  • Wang, Kaijie
  • Zhang, Rui
  • Li, Yang

Abstract

The present application provides a microphone and a method for manufacturing same. The microphone comprises a housing in which a cavity is formed, and a photonic crystal assembly and a photoelectric module respectively fixed in the cavity. The housing is provided with a sound inlet communicating the cavity with the outside. The photonic crystal assembly comprises a diaphragm provided in the cavity and a photonic crystal back plate fixed to the side of the diaphragm facing the photoelectric module; a gap is formed between the diaphragm and the photonic crystal back plate; and an array of through holes are provided on the photonic crystal back plate. The photoelectric module is used for emitting laser light to the diaphragm, and is further used for receiving laser light reflected back from the photonic crystal back plate and the diaphragm and performing photoelectric signal conversion processing on the received laser light. The present application provides a photonic crystal-based optical microphone, and by means of the arrangement of the photonic crystal back plate structure, the sensitivity and the signal-to-noise ratio of the microphone can be effectively improved.

IPC Classes  ?

  • H04R 1/08 - MouthpiecesAttachments therefor

18.

ROTATION LIMITING STRUCTURE

      
Application Number CN2023128337
Publication Number 2025/091217
Status In Force
Filing Date 2023-10-31
Publication Date 2025-05-08
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Li, Songtao
  • Yuan, Junhao
  • Tao, Hongyan

Abstract

Provided in the present invention is a rotation limiting structure, which is used for limiting the rotation of a first rotating member, wherein the first rotating member is provided with a protrusion. The rotation limiting structure comprises a body and a first limiting portion, wherein the body is provided with a second limiting portion; the first limiting portion is movably mounted on the body, and has a first state and a second state, in which same is limited by the second limiting portion; when the first rotating member rotates clockwise, the first limiting portion can be pushed to be in the first state by the protrusion in a first direction, and the first rotating member then reaches a first limit position; when the first rotating member rotates anticlockwise, the first limiting portion can be pushed to be in the second state by the protrusion in a second direction, and the first rotating member then reaches a second limit position; and the second direction is opposite to the first direction. As the protrusion can push the first limiting portion in opposite directions, the rotation angle of the first rotating member when same rotates from the first limit position to the second limit position is increased, thereby reducing the influence of the width of the protrusion on the rotation angle of the first rotating member.

IPC Classes  ?

19.

ACOUSTIC SENSOR AND PREPARATION METHOD THEREFOR

      
Application Number CN2023125725
Publication Number 2025/081473
Status In Force
Filing Date 2023-10-20
Publication Date 2025-04-24
Owner
  • AAC TECHNOLOGIES PTE. LTD. (Singapore)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Li, Chung Min
  • Goh, Kian Heng
  • Dan, Qiang
  • Lai, Kah Keen

Abstract

Disclosed in the present invention are an acoustic sensor and a preparation method therefor. The acoustic sensor comprises: a substrate unit, wherein the substrate unit comprises a first silicon layer, a first oxide layer, and a second silicon layer sequentially stacked from bottom to top, and a back cavity is formed in the substrate unit; a second oxide layer formed on the substrate unit; a piezoelectric unit formed on the second oxide layer, wherein the piezoelectric unit comprises a first electrode layer, a piezoelectric layer, and a second electrode layer sequentially stacked from bottom to top; a first slit, wherein the first slit is formed in the middle of the second electrode layer, and the first slit sequentially passes through the second electrode layer, the piezoelectric layer, and the first electrode layer; a second slit, wherein the second slit is formed in the middle of the second silicon layer, and the second slit sequentially passes through the second silicon layer and the second oxide layer; and an additional film layer filled in the first slit, wherein the additional film layer is not filled in the second slit. Compared with the prior art, the present invention can effectively improve the SPL and the structural reliability, and the material type is not limited by a dry film type material any more.

IPC Classes  ?

  • H04R 17/00 - Piezoelectric transducersElectrostrictive transducers
  • G01H 11/08 - Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices

20.

Smart wearable device

      
Application Number 18628846
Grant Number 12282172
Status In Force
Filing Date 2024-04-08
First Publication Date 2025-04-22
Grant Date 2025-04-22
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Yuan, Junhao
  • Xie, Xiuliang
  • Tao, Hongyan

Abstract

The present invention provides a smart wearable device includes a glass frame and a pair of temples. The glass frame includes a connecting portion. Each temple includes a shelf, a cover plate, and a rotating shaft assembly matched with the connecting portion. The shelf includes an upper wall and a lower wall. The rotating shaft assembly includes a first rotating shaft bracket, a second rotating shaft bracket, a screw, and a positioning bead assembly. The positioning bead assembly is movably connected between the first and the second rotating shaft bracket to realize a folded and an unfolded state of the smart wearable device. The smart wearable device of the present invention uses a rotating shaft assembly to realize the folded and unfolded states. The smart wearable device has a simple structure, requirements of the processing accuracy and assembly accuracy of components are low, and the development cost is low.

IPC Classes  ?

21.

MEMS microphone

      
Application Number 17923608
Grant Number 12284473
Status In Force
Filing Date 2022-08-25
First Publication Date 2025-04-17
Grant Date 2025-04-22
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Zhao, Zhuanzhuan
  • Wang, Kaijie
  • Wang, Linlin
  • Zhang, Rui

Abstract

The present disclosure discloses a MEMS microphone, including: a substrate including a back cavity; a capacitive system arranged on the substrate, the capacitive system including a back plate and a diaphragm opposite to the back plate; wherein the diaphragm includes a vibration portion and a fixing portion surrounding the vibration portion and fixed to the substrate, the vibration portion and the fixing portion are spaced apart from each other by a slit, the fixing portion includes a plurality of releasing portions, and the releasing portions pass through the fixing portion. Compared with the related art, MEMS microphone disclosed by the present disclosure has a high reliability of the back plate.

IPC Classes  ?

  • H04R 1/08 - MouthpiecesAttachments therefor

22.

MICROPHONE MODULE AND DEFROSTING METHOD

      
Application Number CN2023124123
Publication Number 2025/076751
Status In Force
Filing Date 2023-10-12
Publication Date 2025-04-17
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD (China)
Inventor Zhang, Jinyu

Abstract

A microphone module and a defrosting method. The microphone module comprises a housing having an accommodating space and a microphone mounted within the accommodating space. The microphone module further comprises a thermally conductive ring (3) embedded inside of the housing (1) and a heating unit (4) connected to the thermally conductive ring (3). A sound hole (31) corresponding to the position of the microphone (2) is formed at the interior of the thermally conductive ring (3). The heating unit (4) is used for providing heat to the thermally conductive ring (3). The defrosting method comprises the steps of: in response to a heating instruction, activating a heating action of a heating unit (4) (S1); and checking the current performance of a microphone (2), and if the current performance of the microphone (2) is normal, deactivating the heating action of the heating unit (4) (S2). According to the present solution, water, frost, or ice inside of the sound hole (31) may be removed, preventing the sound hole (31) from being blocked and ensuring normal performance of the microphone (2).

IPC Classes  ?

  • H04R 1/08 - MouthpiecesAttachments therefor

23.

FILM BULK ACOUSTIC RESONATOR

      
Application Number 17919533
Status Pending
Filing Date 2022-08-04
First Publication Date 2025-04-17
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Yang, Shuai
  • Wu, Ke
  • Wang, Chao
  • Zhang, Lirong
  • Zhuang, Zhiqiang

Abstract

The present application provides a film bulk acoustic resonator, including a substrate, an acoustic reflection structure arranged on one side of the substrate, a bottom electrode stacked on one side of the acoustic reflection structure, a piezoelectric film covered on the bottom electrode and a top electrode stacked on a side of the piezoelectric film away from the bottom electrode. An interdigital protrusion frame is provided on a side of the top electrode away from the piezoelectric film, and the interdigital protrusion frame includes a first protrusion frame and a second protrusion frame arranged at intervals. The first protrusion frame and the second protrusion frame respectively extend toward each other and overlap each other to form at least a pair of interdigital structures, and each of the interdigital structures includes two forks spaced apart by a preset distance along an overlapping direction.

IPC Classes  ?

  • H03H 9/17 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elementsElectromechanical resonators Details

24.

MICROPHONE MODULE AND DEFROSTING METHOD

      
Application Number 18398087
Status Pending
Filing Date 2023-12-27
First Publication Date 2025-04-17
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Zhang, Jinyu

Abstract

A microphone module includes a housing with a receiving space and a microphone mounted in the receiving space. The microphone module further includes a heat-conducting ring embedded in the housing and a heating unit connected to the heat-conducting ring. A sound hole corresponding to a position of the microphone is formed inside the heat-conducting ring. The heating unit is configured to provide heat for the heat-conducting ring. The defrosting method includes the following steps: enabling a heating action of the heating unit in response to a heating instruction; and detecting current performance of the microphone, and disabling the heating action of the heating unit if the current performance of the microphone is normal. According to the solution, water, frost or ice can be removed from the sound hole to prevent clogging of the sound hole, thereby ensuring normal performance of the microphone.

IPC Classes  ?

  • H04R 1/08 - MouthpiecesAttachments therefor
  • H05B 1/02 - Automatic switching arrangements specially adapted to heating apparatus

25.

MEMS MICROPHONE

      
Application Number CN2023122032
Publication Number 2025/065337
Status In Force
Filing Date 2023-09-27
Publication Date 2025-04-03
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD (China)
Inventor
  • Zhao, Zhuanzhuan
  • Wang, Kaijie
  • Zhang, Rui

Abstract

An MEMS microphone, comprising: a substrate provided with a back cavity (11) and a capacitance system arranged on the substrate. The capacitance system comprises a back plate (2) and a diaphragm (3) arranged opposite and spaced apart from the back plate (2), wherein the surface of the back plate (2) facing the diaphragm (3) or the surface of the diaphragm (3) facing the back plate (2) is provided with dimples (4), characterized in that when the diaphragm (3) moves to enable the dimples (4) to simultaneously come into contact with the diaphragm (3) and the back plate (2), the dimples (4) can elastically deform in the vibration direction of the diaphragm (3). The dimples (4) of the MEMS microphone have elasticity, which can provide a buffer for the movement of the diaphragm (3), and thus avoids rapid concentration of stress on the position where the diaphragm (3) is in contact with the dimples (4), thereby preventing pits from forming on the diaphragm (3) and preventing the diaphragm (3) from breaking under the repeated impact of the dimples (4).

IPC Classes  ?

26.

MEMS MICROPHONE

      
Application Number 18393754
Status Pending
Filing Date 2023-12-22
First Publication Date 2025-03-27
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Zhao, Zhuanzhuan
  • Wang, Kaijie
  • Zhang, Rui

Abstract

An MEMS microphone includes a substrate with a back cavity and a capacitor system arranged on the substrate. The capacitor system includes a back plate and a diaphragm opposite to and spaced apart from the back plate. Surface of the back plate facing diaphragm or surface of diaphragm facing the back plate being provided with an anti-adhesion member. When the diaphragm moves until the anti-adhesion member is in contact with the diaphragm and the back plate at the same time, the anti-adhesion member is elastically deformable along a vibrating direction of the diaphragm. The anti-adhesion member of the present disclosure is elastic and may provide cushioning for movement of the diaphragm, which prevents rapid concentration of stress at a position of the diaphragm in contact with the anti-adhesion member, thereby preventing formation of pits in the diaphragm and preventing breakage of the diaphragm under repeated impact of the anti-adhesion member.

IPC Classes  ?

  • H04R 7/02 - Diaphragms for electromechanical transducersCones characterised by the construction

27.

MEMS ELEMENT AND ELECTRO-ACOUSTIC CONVERSION APPARATUS

      
Application Number CN2023123899
Publication Number 2025/060150
Status In Force
Filing Date 2023-10-11
Publication Date 2025-03-27
Owner
  • AAC TECHNOLOGIES PTE. LTD. (Singapore)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Kervran, Yannick Pierre
  • Scott, Lyall Cargill

Abstract

A MEMS element and an electro-acoustic conversion apparatus, relating to the technical field of microphones. The MEMS element comprises spacers, counter electrodes, a first diaphragm, and a second diaphragm. The spacers and the counter electrodes are located on the same horizontal plane and are alternately arranged in a cross section of the MEMS element; the first diaphragm and the second diaphragm are respectively disposed on opposite sides of the spacers and are in airtight connection with one another; the first diaphragm comprises a plurality of first protrusions disposed at intervals along a first direction, and the second diaphragm comprises a plurality of second protrusions disposed at intervals along the first direction, wherein the first protrusions and the second protrusions are in one-to-one correspondence and align with one another to form cavities, and the counter electrodes are suspended within the cavities; each first protrusion comprises a first front wall and a first rear wall, each second protrusion comprises a second front wall and a second rear wall, and at least part of the first front walls, the first rear walls, the second front walls, or the second rear walls are sub-corrugated structures. The MEMS element effectively reduces the maximum stress applied to the diaphragms under high-pressure impact, thus ultimately enhancing the mechanical robustness of the apparatus.

IPC Classes  ?

28.

LENS SURFACE DEFECT DETECTION METHOD AND APPARATUS, AND DEVICE AND READABLE STORAGE MEDIUM

      
Application Number CN2023119182
Publication Number 2025/054982
Status In Force
Filing Date 2023-09-15
Publication Date 2025-03-20
Owner
  • AAC TECHNOLOGIES PTE. LTD. (Singapore)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD (China)
Inventor
  • Zhang, Yan
  • Zhang, Chao
  • Jiang, Liang

Abstract

Provided in the present application are a lens surface defect detection method and apparatus, and a device and a readable storage medium. The specific implementation solution comprises: acquiring a RAW image captured by an imaging module that carries a lens to be tested; separating the RAW image into four single-channel images, and performing mean filtering processing on each single-channel image; performing a subtraction operation on each filtered image and a corresponding single-channel image, so as to obtain a difference image, and performing binarization processing on each difference image; acquiring a corresponding image connected component on the basis of each binarized difference image, and mapping the image connected components of all channels to the RAW image for merging; and if the total number of pixel points of a merged connected component is greater than or equal to a preset threshold value, outputting a lens surface defect detection result on the basis of image position information of the merged connected component. In the present application, lens surface defect detection is performed by means of computer vision without the need for a complex detection instrument and without the need for relying on manual labor to identify a lens surface defect, thereby effectively reducing the detection cost and the detection workload, and improving the detection accuracy.

IPC Classes  ?

29.

CAMERA CALIBRATION METHOD, DEVICE, AND READABLE STORAGE MEDIUM

      
Application Number CN2023119191
Publication Number 2025/054986
Status In Force
Filing Date 2023-09-15
Publication Date 2025-03-20
Owner
  • AAC TECHNOLOGIES PTE. LTD. (Singapore)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD (China)
Inventor
  • Zhang, Chao
  • Yin, Xueke
  • Zhang, Yan
  • Zhang, Chenliang
  • Gao, Yafang
  • Luan, Yating
  • Song, Hanbai
  • Jiang, Liang
  • Wu, Zhijiang

Abstract

The present application provides a camera calibration method, a device, and a readable storage medium. The specific implementation solution comprises: acquiring spectral response sensitivity of a camera, spectral power distribution data of different light sources, and spectral reflectivity of multiple color samples; for each light source, on the basis of the spectral response sensitivity, the spectral reflectivity and the corresponding spectral power distribution data, calculating a response parameter of the camera with respect to each color sample; on the basis of a current color correction matrix (CCM), correcting the response parameter to obtain a corrected response parameter; if it is determined on the basis of the corrected response parameters corresponding to all the color samples that the CCM does not satisfy an effective correction condition, adjusting an element value of the current CCM until the CCM satisfies the effective correction condition; and calibrating an adjusted CCM corresponding to each light source to the camera. In the present application, by means of mathematical modeling, the response of a camera to a color sample in a real light source environment is simulated to calibrate a CCM, thereby effectively reducing the calibration complexity and efficiency.

IPC Classes  ?

  • G06T 7/80 - Analysis of captured images to determine intrinsic or extrinsic camera parameters, i.e. camera calibration

30.

SPEAKER MODULE AND ASSEMBLING METHOD THEREOF

      
Application Number 17918902
Status Pending
Filing Date 2022-06-10
First Publication Date 2025-03-06
Owner
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
  • AAC Microtech (Changzhou) Co., Ltd. (China)
Inventor
  • Yang, Haijuan
  • Wang, Lei
  • Wu, Shuwen

Abstract

A speaker module and an assembling method of the speaker module includes a housing, a vibration system, and a magnetic circuit system. An accommodation space is defined in the housing, and the vibration system and the magnetic circuit system are accommodated in the accommodation space. The housing includes a frame, an upper cover plate, and a lower cover plate. The frame includes a side wall. When the upper cover plate and the lower cover plate are assembled on the frame, the frame, the upper cover plate, and the lower cover plate form an outer housing. An assembling process of the speaker module is simplified from two separate assembly processes of the speaker monomer and the speaker module into single assemble process of the speaker module, which reduces processing difficulty and cost.

IPC Classes  ?

  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details
  • H04R 7/04 - Plane diaphragms
  • H04R 9/06 - Loudspeakers
  • H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor

31.

MEMS microphone chip

      
Application Number 17913453
Status Pending
Filing Date 2022-05-18
First Publication Date 2025-03-06
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Zhao, Zhuanzhuan
  • Zhang, Rui

Abstract

The present disclosure discloses a MEMS microphone chip having a substrate with a back cavity, a back plate fixed to the substrate, and a diaphragm unit opposite to the back plate. The diaphragm unit includes a first diaphragm spaced apart from the back plate, a support member fixed on a side of the first diaphragm away from the back cavity, and a second diaphragm spaced apart from the first diaphragm. The second diaphragm includes a support portion fixed to the support member and a free end. The first diaphragm is utilized to drive the second diaphragm having the free end so that the vibration of the second diaphragm from is no longer subject to its thickness and stress, thus significantly improving the sensitivity of the MEMS microphone chip and accordingly improving the SNR.

IPC Classes  ?

  • H04R 7/24 - Tensioning by means acting directly on free portion of diaphragm or cone
  • H04R 1/22 - Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
  • H04R 19/04 - Microphones

32.

Speaker module and assembling method thereof

      
Application Number 17918900
Grant Number 12267661
Status In Force
Filing Date 2022-06-10
First Publication Date 2025-03-06
Grant Date 2025-04-01
Owner
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
  • AAC Microtech (Changzhou) Co., Ltd. (China)
Inventor
  • Yang, Haijuan
  • Wang, Lei
  • Wu, Shuwen

Abstract

A speaker module includes a housing, a vibration system, and a magnetic circuit system. An accommodation space is defined in the housing, the vibration system is accommodated in the accommodation space, and the magnetic circuit system is accommodated in the accommodation space and is configured to drive the vibration system. The housing includes a supporting frame, a front cover, and a rear cover. The vibration system and the magnetic circuit system are directly assembled with the housing to obtain the loudspeaker module. Compared with the related art, an assembling process of the speaker module is simplified from two separate assembly processes of a speaker and a module into single assemble process of the speaker, which provides a simple assembling process and further reduces the cost.

IPC Classes  ?

  • H04R 9/06 - Loudspeakers
  • H04R 7/04 - Plane diaphragms
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details
  • H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor

33.

Sounding Device

      
Application Number 17921644
Status Pending
Filing Date 2022-05-05
First Publication Date 2025-02-13
Owner
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
  • AAC Microtech (Changzhou) Co., Ltd. (China)
Inventor
  • Song, Wei
  • Jin, Xin
  • Zhang, Fan
  • Linghu, Ronglin
  • Xiao, Bo

Abstract

The present invention provides a sounding device including a housing body having a containment cavity and a sounding unit placed in the containment cavity. The sounding unit includes a vibration system and a magnetic circuit system. The sounding device includes a box, a coil, a circuit board, and an elastic assembly. The elastic assembly is used to suspend the box in the containment cavity. The present invention coil shares a magnetic circuit system with the vibration system and the sounding unit is directly used as the weight unit of the coil. The parts are shared to the greatest extent, the assembly process is simplified, and the cost is reduced.

IPC Classes  ?

  • H04R 9/06 - Loudspeakers
  • H04R 1/02 - CasingsCabinetsMountings therein
  • H04R 7/04 - Plane diaphragms
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details
  • H04R 9/04 - Construction, mounting, or centering of coil

34.

Speaker

      
Application Number 17918924
Status Pending
Filing Date 2022-06-06
First Publication Date 2025-02-06
Owner
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
  • AAC Microtech (Changzhou) Co., Ltd. (China)
Inventor
  • Wang, Hezhi
  • Zhang, Jie
  • Wang, Zhongyang

Abstract

The present invention provides a speaker including a chamber filled with the sound absorbing material. The chamber is also filled with expandable foam that is triggered to expand in volume to limit the movement of the sound absorbing material in the chamber. The speaker provided by the present invention improves the reliability of the filled sound absorbing material.

IPC Classes  ?

35.

MEMS microphone

      
Application Number 17923607
Status Pending
Filing Date 2022-06-07
First Publication Date 2025-02-06
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Zhao, Zhuanzhuan
  • Shi, Zhengyu
  • Wang, Kaijie
  • Wang, Linlin
  • Zhang, Rui

Abstract

The present disclosure discloses a MEMS microphone including a substrate including a back cavity; a capacitive system arranged on the substrate, the capacitive system including a back plate and a diaphragm opposite to the back plate, the diaphragm located on a side of the back plate close to the substrate; a support member located between the diaphragm and the back plate; a blocking portion arranged on a side of the back plate facing the diaphragm; wherein the diaphragm includes a vibration portion and a fixing portion surrounding the vibration portion and fixed to the substrate, the vibration portion and the back plate are fixedly connected by the support member, a projection of the blocking portion along a vibration direction of the diaphragm is located within the vibration portion of the diaphragm. Compared with the related art, MEMS microphone disclosed by the present disclosure has a high signal-to-noise ratio.

IPC Classes  ?

  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • H04R 7/18 - Mounting or tensioning of diaphragms or cones at the periphery
  • H04R 19/04 - Microphones

36.

DIRECTIONAL MIC ASSEMBLY WITH DOUBLE-SIDED SOUND INTAKE AND ELECTRONIC DEVICE

      
Application Number CN2023109892
Publication Number 2025/024977
Status In Force
Filing Date 2023-07-28
Publication Date 2025-02-06
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD (China)
Inventor Yuan, Junhao

Abstract

A directional MIC assembly (100) with double-sided sound intake and an electronic device (10). The electronic device (10) comprises the directional MIC assembly (100) with double-sided sound intake, wherein the MIC assembly (100) comprises a front housing (1) having a pair of sound intake holes (13) and an MIC device (2) provided on the inner side of the front housing (1); the MIC device (2) is provided with two receiving holes (21); and the MIC assembly (100) further comprises a fixing member (3) assembled on the inner side of the front housing (1). The fixing member (3) is provided with an assembly cavity (31), and two sound intake channels (32) which are in communication with the assembly cavity (31). The MIC device (2) is mounted in the assembly cavity (31), the two receiving holes (21) of the MIC device (2) are respectively in communication with the two sound intake channels (32), and the two sound intake channels (32) are respectively in communication with the two sound intake holes (13) of the same pair. Both the front housing (1) and the fixing member (3) can be separately processed, the arrangement of the sound intake holes (13) can meet the requirements of appearance design, external ports of the sound intake channels (32) on the fixing member (3) are not limited by appearance, can be processed by multiple methods such as molding and CNC, and can particularly be manufactured on a large scale at a low cost and a high yield by means of a mold, and the mold is simpler in design and lower in cost.

IPC Classes  ?

  • H04R 1/08 - MouthpiecesAttachments therefor

37.

CAPACITIVE SENSING CIRCUIT AND METHOD

      
Application Number CN2023112468
Publication Number 2025/025261
Status In Force
Filing Date 2023-08-11
Publication Date 2025-02-06
Owner
  • AAC TECHNOLOGIES PTE. LTD. (Singapore)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Tan, Siew Seong
  • Anand, Awinash
  • Chua, Tiong Kee

Abstract

A capacitive sensing circuit and method. The capacitive sensing circuit comprises a charge pump, an MEMS chip, an analog signal modulator and a digital signal modulator, wherein the analog signal modulator is configured to perform analog signal modulation according to an output signal from the MEMS chip and an output signal from the analog signal modulator; and the digital signal modulator is configured to perform digital signal modulation on the output signal from the analog signal modulator, and outputs a modulated signal by using a digital interface. By directly using an input signal from an MEMS chip and an output signal from an analog signal modulator as input signals for analog modulation, harmonic distortion is reduced.

IPC Classes  ?

  • G01D 5/24 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance

38.

Single-end-to-differential microphone circuit

      
Application Number 17918894
Grant Number 12289082
Status In Force
Filing Date 2022-05-19
First Publication Date 2025-01-30
Grant Date 2025-04-29
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Han, Dong
  • Kee, Chuationg

Abstract

The present invention provides a single-end-to-differential microphone circuit, including a power supply end for inputting a first bias voltage, a microphone capacitor, a coupling capacitor, a first primary amplifier, a second primary amplifier, a signal processing module, current sharing amplifier, a feedback resistor at positive end, a feedback capacitor at positive end, a feedback resistor at negative end, a feedback capacitor at negative end. Compared with the prior art, the single-end-to-differential microphone circuit of the present invention can utilize the current sharing amplifier with a small input common mode voltage range and low noise to realize the single-end-to-differential of the signal, which is beneficial to improve the signal to noise ratio of the circuit.

IPC Classes  ?

  • H03F 3/183 - Low-frequency amplifiers, e.g. audio preamplifiers with semiconductor devices only
  • H04R 3/00 - Circuits for transducers
  • H04R 19/04 - Microphones

39.

SINGLE-END-TO-DIFFERENTIAL MICROPHONE CIRCUIT AND ELECTRONIC EQUIPMENT

      
Application Number 17918895
Status Pending
Filing Date 2022-05-20
First Publication Date 2025-01-30
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Han, Dong
  • Kee, Chuationg

Abstract

The present invention provides a single-end-to-differential microphone circuit and an electronic equipment, including: an amplifier, a microphone connected to the positive input end of the amplifier, a coupling capacitor CAC connected to the negative input end of the amplifier, a first feedback capacitor CFB1 connected to the negative output end of the amplifier, a first feedback resistor RFB1 connected in parallel with the first feedback capacitor CFB1, a second feedback capacitor connected to the positive output end of the amplifier CFB2, and a second feedback resistor RFB2 connected in parallel with the second feedback capacitor CFB1. The circuit of the present invention can adopt a microphone structure with smaller capacity, and at the same time has a better system signal to noise ratio.

IPC Classes  ?

  • H04R 3/00 - Circuits for transducers
  • H03F 1/26 - Modifications of amplifiers to reduce influence of noise generated by amplifying elements
  • H03F 3/45 - Differential amplifiers

40.

MICROPHONE CIRCUIT, MICROPHONE MODULE, AND METHOD FOR RAISING SOUND PRESSURE OVERLOAD POINT OF MICROPHONE

      
Application Number 17918898
Status Pending
Filing Date 2022-04-28
First Publication Date 2025-01-30
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Han, Dong
  • Kee, Chuationg

Abstract

The invention provides a microphone circuit, which includes an amplifier, a bias resistor and a bias network module. The first terminal of bias resistor connects to the preset bias voltage. The second end of the bias resistor connects the output end of the microphone. The bias network module is used to judge level of the voltage value of the signal. If the voltage value of the signal exceeds the preset voltage value of the threshold voltage group range, connect the impeder corresponding to the bias network module to the input end of the microphone circuit. The invention provides a microphone module and a method for raising sound pressure overload point of microphone. Compared with the related art, the technical scheme of the invention improves the sound pressure overload point of microphone and has good electrical performance.

IPC Classes  ?

41.

DIRECTIONAL BILATERAL SOUND INTAKE-BASED MIC ASSEMBLY AND ELECTRONIC DEVICE

      
Application Number 18401292
Status Pending
Filing Date 2023-12-29
First Publication Date 2025-01-30
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Yuan, Junhao

Abstract

Disclosed are a directional bilateral sound intake-based MIC assembly and an electronic device. The electronic device includes the directional bilateral sound intake-based MIC assembly. The MIC assembly includes a front shell with paired sound inlet holes and a microphone arranged on an inner side of the front shell. The microphone has two receiving holes. The MIC assembly further includes a fixture assembled within the inner side of the front shell. An assembling chamber and two sound inlet channels in communication with the assembling chamber are defined in the fixture. The microphone is mounted within the assembling chamber. The two receiving holes of the microphone are in communication with the two sound inlet channels respectively. The two sound inlet channels are in communication with a same pair of two sound inlet holes respectively.

IPC Classes  ?

  • H04R 1/02 - CasingsCabinetsMountings therein
  • H04R 1/40 - Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers

42.

INERTIAL SENSOR AND MANUFACTURING METHOD

      
Application Number CN2024099270
Publication Number 2025/020752
Status In Force
Filing Date 2024-06-14
Publication Date 2025-01-30
Owner
  • AAC TECHNOLOGIES PTE. LTD. (Singapore)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Tan, Qiu Yu
  • Zhan, Zhan
  • Pua, Zai Xiang
  • Chong, Hou Ming
  • Lai, Kahkeen

Abstract

The present invention provides an inertial sensor and a manufacturing method. The manufactured inertial sensor comprises a base body structure and a movable inertial structure arranged at one side of the base body structure and spaced apart from same; the base body structure comprises a base layer, a circuit layer attached to the side of the base layer close to the movable inertial structure, and a blocking structure arranged on the circuit layer; the blocking structure is made of an insulating material; a plurality of slots running through in the thickness direction are formed in the circuit layer; the blocking structure comprises a plurality of protruding blocks which are connected to the circuit layer and protrude from the surface of the circuit layer facing away from the base layer; and the slots are blocked by insertion of the protruding blocks in a one-to-one manner. The inertial sensor has the advantages of reducing likeliness of viscosity, having a stable structure, and having a small limitation on the minimum size of the base body structure and the movable inertial structure, thereby facilitating improvement of the final performance of the inertial sensor.

IPC Classes  ?

  • G01C 21/16 - NavigationNavigational instruments not provided for in groups by using measurement of speed or acceleration executed aboard the object being navigatedDead reckoning by integrating acceleration or speed, i.e. inertial navigation
  • G01C 19/00 - GyroscopesTurn-sensitive devices using vibrating massesTurn-sensitive devices without moving massesMeasuring angular rate using gyroscopic effects
  • B81B 7/00 - Microstructural systems
  • B81B 1/00 - Devices without movable or flexible elements, e.g. microcapillary devices

43.

Microphone amplifying circuit design method and microphone amplifying circuit

      
Application Number 17918899
Grant Number 12294840
Status In Force
Filing Date 2022-04-21
First Publication Date 2025-01-16
Grant Date 2025-05-06
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Han, Dong
  • Kee, Chuationg

Abstract

The present invention provides a microphone amplifying circuit including an amplifier, a bias resistor, an input end, an output end, a microphone capacitor, a first parasitic capacitor and a second parasitic capacitor. The first parasitic capacitor is connected to the input end, and the other end of the first parasitic capacitor is connected to the output end. The second parasitic capacitor is connected to the output end, and the other end of the second parasitic capacitor is grounded. The first parasitic capacitor and the second parasitic capacitor are formed after adding a layer of underlying metal between the substrate of the integrated circuit and the welding plate. Compared with the related art, the microphone amplifying circuit design method and the microphone amplifying circuit of the present invention have higher signal to noise ratio and better performance.

IPC Classes  ?

  • H04R 3/00 - Circuits for transducers
  • H03F 3/187 - Low-frequency amplifiers, e.g. audio preamplifiers with semiconductor devices only in integrated circuits

44.

MEMS MICROPHONE

      
Application Number CN2023106763
Publication Number 2025/010620
Status In Force
Filing Date 2023-07-11
Publication Date 2025-01-16
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Chen, Xingfu
  • Zhang, Tangyu

Abstract

A MEMS microphone, comprising a base (1), a housing (2) defining an accommodating space with the base (1), a MEMS chip (3) defining a back cavity with the base (1), and an ASIC chip (4) fixed to the base (1). The base (1) is provided with a sound inlet channel (10) communicating the accommodating space with the outside; the MEMS chip (3) is provided with a diaphragm (31) located on a sound inlet path of the sound inlet channel (10); the sound inlet channel (10) comprises a buffer cavity (101) located in the base (1), a first sound inlet hole (102) formed in the base (1) and communicating the buffer cavity (101) with the outside, and a second sound inlet hole (103) formed in the base (1) and communicating the buffer cavity (101) with the back cavity; the second sound inlet hole (103) faces the diaphragm (31); and the second sound inlet hole (103) comprises at least two sub-holes (1031) spaced apart from each other. When external air pressure enters the sound inlet channel (10) from the first sound inlet hole (102), the air pressure will not directly pass through the second sound inlet hole (103) to act on the diaphragm (31), and the sub-holes (1031) can further block airflow, so that the impact of the air pressure on the diaphragm (31) can be effectively buffered, thereby reducing rupture of the diaphragm, and improving the reliability and performance of the MEMS microphone.

IPC Classes  ?

45.

MEMS Microphone

      
Application Number 18399742
Status Pending
Filing Date 2023-12-29
First Publication Date 2025-01-09
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Chen, Xingfu
  • Chen, Zhiyuan
  • Zhang, Tangyu

Abstract

The present disclosure discloses a MEMS microphone including a shell, a substrate assembled with the shell for forming a receiving space, an ASIC Die, a MEMS Die including a diaphragm and a back plate, and an elastic member. The diaphragm divides the receiving space into a front chamber and a rear chamber, the substrate comprises a first acoustic hole, a second acoustic hole, a connecting channel, and a ventilation hole, the MEMS Die covers the first acoustic hole which is communicating with the front chamber, the ventilation hole is communicating with the connecting channel and the rear chamber, the elastic member covering the ventilation hole is used for opening or closing the ventilation hole. Compared with the related art, a MEMS microphone disclosed by the present disclosure could have with high blowout resistance.

IPC Classes  ?

  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

46.

MEMS MICROPHONE

      
Application Number CN2023105942
Publication Number 2025/007306
Status In Force
Filing Date 2023-07-05
Publication Date 2025-01-09
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Chen, Xingfu
  • Chen, Zhiyuan
  • Zhang, Tangyu

Abstract

A MEMS microphone (100), comprising a housing (10), a substrate (20) covering the housing (10) to form an accommodating space (101), and an ASIC chip (40) and a MEMS chip (30) disposed in the accommodating space (101); the substrate (20) is also provided with a first sound hole (21) extending from an upper surface (201) to a lower surface (202) and not passing through the lower surface, a second sound hole (22) extending from the lower surface (202) to the upper surface (201) and not passing through the upper surface (201), a connecting channel (23) provided between the upper surface (201) and the lower surface (202) of the substrate (20) and placing the first sound hole (21) and the second sound hole (22) in communication, and an air hole (24) extending from the upper surface (201) to the lower surface (202) and not passing through the lower surface (202), the air hole (24) and the second sound hole (22) being disposed to be transversely spaced apart from one another. The MEMS microphone (100) is also provided with an elastic member (50) covering the air hole (24), the elastic member (50) being able to open or close the air hole (24). The MEMS microphone (100) has strong anti-wind capability.

IPC Classes  ?

47.

MEMS MICROPHONE

      
Application Number 18399779
Status Pending
Filing Date 2023-12-29
First Publication Date 2025-01-09
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Chen, Xingfu
  • Zhang, Tangyu

Abstract

A MEMS microphone includes substrate, housing, MEMS chip and ASIC chip. The substrate is provided with sound inlet channel communicating the receiving space with the outside. The MEMS chip includes diaphragm located on sound inlet path of sound inlet channel. The sound inlet channel includes buffering cavity, first sound inlet hole, and second sound inlet hole provided in the substrate and communicating the buffering cavity with the back cavity. The second sound inlet hole includes at least two sub-holes spaced apart from each other. When external air pressure enters the sound inlet channel, the air pressure entering from the first sound inlet hole may not directly act on the diaphragm through the second sound inlet hole, and the sub-holes can further block the airflow, which can effectively buffer the impact of the air pressure on the diaphragm, reduce diaphragm rupture, and improve reliability and performance of the MEMS microphone.

IPC Classes  ?

48.

INERTIAL SENSOR AND MANUFACTURING METHOD THEREFOR

      
Application Number CN2023108541
Publication Number 2024/254943
Status In Force
Filing Date 2023-07-21
Publication Date 2024-12-19
Owner
  • AAC TECHNOLOGIES PTE. LTD. (Singapore)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Chong, Hou Ming
  • Tan, Qiu Yu
  • Pua, Zaixiang
  • Lai, Kah Keen
  • Zhan, Zhan

Abstract

Disclosed in the present invention are an inertial sensor and a manufacturing method therefor. The inertial sensor comprises a first substrate; a dielectric layer; a first conductive layer, the first conductive layer being provided therein with a plurality of first openings; a plurality of second conductive layers, the plurality of second conductive layers being bonded to the first conductive layer by means of bonding structures, gaps being formed between the adjacent second conductive layers from the bottom to the top, the adjacent second conductive layers being connected by means of connection parts, and each second conductive layer being provided with a plurality of second openings; a second substrate, the second substrate covering the first substrate, and the second substrate and the first substrate defining a closed space therebetween. Compared with the prior art, the present invention is provided with a plurality of second conductive layers. Therefore, compared with those for traditional single-layer structures, a mold is reduced to a lower size, thereby reducing manufacturing costs and improving the integration between a device and a portable consumer application. In addition, a relatively large movable conductive structure has a larger surface area, thereby improving XY-axis sensitivity.

IPC Classes  ?

  • B81B 5/00 - Devices comprising elements which are movable in relation to each other, e.g. comprising slidable or rotatable elements
  • B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
  • G01P 15/14 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of gyroscopes
  • G01P 15/02 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces
  • G01P 15/00 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration

49.

DIAPHRAGM AND MEMS MICROPHONE

      
Application Number CN2023101344
Publication Number 2024/250333
Status In Force
Filing Date 2023-06-20
Publication Date 2024-12-12
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD (China)
Inventor
  • Nguyen, Minh Ngoc
  • Wang, Linlin
  • Zhang, Rui
  • Wang, Kaijie
  • Shi, Zhengyu
  • Zhao, Zhuanzhuan

Abstract

A diaphragm and a MEMS microphone. The diaphragm comprises a vibrating portion (1) and supporting structures (2) connected to the vibrating portion (1). Each supporting structure (2) comprises a cantilever portion (21) extending outwards from the periphery of the vibrating portion (1), and a first anchoring portion (22) and a second anchoring portion (23), both of which are connected to the end of the cantilever portion (21) away from the vibrating portion (1). The lengths of both the first anchoring portion (22) and the second anchoring portion (23) extend along the circumference of the vibrating portion (1), and the length of the first anchoring portion (22) and the length of the second anchoring portion (23) extend in opposite directions. As the lengths of both the first anchoring portion (22) and the cantilever portion (21) extend along the circumference of the vibrating portion (1), and the length of the first anchoring portions (22) and the length of the second anchoring portion (23) extend in opposite directions, the first anchoring portion (22), the cantilever portion (21), and the second anchoring portion (23) are connected to form a T shape, that is, each supporting structure is a T-shaped beam, enabling the diaphragm to have a wider range of vibration displacement, and thereby improving the sensitivity and adaptability of the MEMS microphone.

IPC Classes  ?

50.

DIAPHRAGM AND MEMS MICROPHONE

      
Application Number 18604440
Status Pending
Filing Date 2024-03-13
First Publication Date 2024-12-12
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Nguyen, Minh Ngoc
  • Wang, Linlin
  • Zhang, Rui
  • Wang, Kaijie
  • Shi, Zhengyu
  • Zhao, Zhuanzhuan

Abstract

Provided is a diaphragm and a micro-electromechanical system (MEMS) microphone. The diaphragm includes a vibrating portion and a support structure. The support structure includes a cantilever portion. Lengths of the first and second anchoring portion both extend along a circumferential direction of the vibrating portion, and a length extension direction of the first anchoring portion is opposite to that of the second one. The lengths of the first and second anchoring portions both extend along the circumferential direction of the vibrating portion, and the length extension direction of the first anchoring portion is opposite to that of the second one, so that the first and second anchoring portions and the cantilever portion are connected in a T shape. A vibration displacement range of the diaphragm is larger, thereby improving sensitivity and compliance of the MEMS microphone.

IPC Classes  ?

51.

COUNTER ELECTRODE STRUCTURE AND DUAL-MEMBRANE MEMS MICROPHONE

      
Application Number CN2023130494
Publication Number 2024/244307
Status In Force
Filing Date 2023-11-08
Publication Date 2024-12-05
Owner
  • AAC TECHNOLOGIES PTE. LTD. (Singapore)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD (China)
Inventor
  • Jenkins, Colin Robert
  • Cargill, Scott Lyall
  • Boyd, Euan James

Abstract

The present invention provides a counter electrode structure and a dual-membrane MEMS microphone. The dual-membrane MEMS microphone comprises a substrate and a capacitor system. The capacitor system comprises a first electrode membrane and a second electrode membrane which are arranged at an interval to form an accommodating cavity, and the two electrode membranes have corrugated cross-sectional shapes in the radial direction. The wave crest of one electrode membrane is connected to the wave trough of the other electrode membrane to form a supporting body. The capacitor system further comprises a counter electrode structure suspended in the accommodating cavity. The counter electrode structure comprises a plurality of circumferential beams arranged at intervals from inside to outside and a plurality of radial beams connected to the circumferential beams and extending from inside to outside, a via hole extending around the center of the counter electrode structure is formed between every two adjacent circumferential beams inside and outside, and the supporting body passes through the via holes and is spaced apart from the edges of the via holes. The arrangement of a counter electrode structure enables two electrode membranes to achieve a dual-corrugated membrane structure, which is more sensitive to sound pressure and can significantly improve the sensitivity performance.

IPC Classes  ?

52.

TRIGGER MODULE WITH FORCE FEEDBACK

      
Application Number 17914782
Status Pending
Filing Date 2022-04-26
First Publication Date 2024-11-28
Owner
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
  • AAC Microtech (Changzhou) Co., Ltd. (China)
Inventor
  • Li, Yuntong
  • Xie, Bing
  • Zhang, Lijin

Abstract

A trigger module with force feedback, including: a housing including an installation groove; a trigger swing bar rotatably connected to the housing; and a transmission device connected to the trigger swing bar. The transmission device includes a one-way transmission module engaged with the trigger swing bar, a driving module connected to the one-way transmission module, and a driving member configured to drive the driving module. The driving member is connected to the driving module and installed in the housing; the driving module is installed in the installation groove; and the one-way transmission module includes an end connected to the driving module, and another end engaged with the trigger swing bar. The one-way transmission module can utilize the detachable engagement connection at the position where the one-way transmission module is engaged with the trigger swing bar and at the position where the one-way transmission module is connected to the driving module, to allow the trigger swing bar to be temporarily disengaged from the driving module when the trigger swing bar is reset. In this way, the trigger swing bar will not drive the driving member to reverse or drag the driving member when the trigger swing bar returns. Therefore, the trigger swing bar can quickly return, thereby providing users with good gaming experiences.

IPC Classes  ?

  • G05G 5/03 - Means for enhancing the operator's awareness of the arrival of the controlling member at a command or datum positionProviding feel, e.g. means for creating a counterforce
  • A63F 13/24 - Constructional details thereof, e.g. game controllers with detachable joystick handles
  • A63F 13/285 - Generating tactile feedback signals via the game input device, e.g. force feedback
  • G05G 1/04 - Controlling members for hand-actuation by pivoting movement, e.g. levers

53.

MEMS SENSOR AND PREPARATION METHOD THEREFOR

      
Application Number CN2023098007
Publication Number 2024/239374
Status In Force
Filing Date 2023-06-02
Publication Date 2024-11-28
Owner
  • AAC TECHNOLOGIES PTE. LTD. (Singapore)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Pua, Zaixiang
  • Tan, Qiu Yu
  • Lai, Kah Keen
  • Chong, Hou Ming
  • Zhan, Zhan

Abstract

Provided are an MEMS sensor and a preparation method therefor. The MEMS sensor comprises: a bottom electrode layer (1) and a top electrode layer (2) forming a cavity (3), and a device layer (4) accommodated in the cavity (3). The device layer (4) comprises a plurality of movable mass blocks (41) arranged at intervals. Preset gaps are formed between the movable mass blocks (41) and the top electrode layer (2), and the preset gaps formed by different movable mass blocks (41) are different from each other. The preparation method for the MEMS sensor comprises: S1, sequentially forming a bottom electrode layer (1), a sacrificial layer (5), a device layer (4), and a top electrode layer (2) from bottom to top; S2, etching the device layer (4) to form a plurality of movable mass blocks (41) arranged at intervals; and S3, releasing the sacrificial layer (5). A differential output electrical signal is formed by means of the difference of the preset gaps, thereby achieving the high sensitivity and volume miniaturization of the MEMS sensor.

IPC Classes  ?

  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
  • H04R 19/04 - Microphones
  • H04R 19/00 - Electrostatic transducers
  • H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
  • G01L 9/12 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance
  • G01L 9/00 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
  • G01P 15/125 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
  • H01G 5/16 - Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaftProcesses of their manufacture using variation of distance between electrodes
  • H01G 5/00 - Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaftProcesses of their manufacture

54.

FILM BULK ACOUSTIC RESONATOR MANUFACTURING METHOD, FILM BULK ACOUSTIC RESONATOR AND FILTER

      
Application Number CN2023098933
Publication Number 2024/229919
Status In Force
Filing Date 2023-06-07
Publication Date 2024-11-14
Owner
  • AAC TECHNOLOGIES PTE. LTD. (Singapore)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Loo, Li Eng
  • Wu, Ke
  • Lai, Kah Keen

Abstract

A film bulk acoustic resonator manufacturing method provided in the present invention comprises: providing a substrate having a top surface; forming a dielectric material layer on the top surface of the substrate; forming a bottom electrode on the surface of the dielectric material layer away from the substrate; forming a piezoelectric material layer on the surface of the bottom electrode away from the substrate; forming an intermediate metal layer on the surface of the piezoelectric material layer away from the substrate; forming a mass load layer on the surface of the intermediate metal layer away from the substrate; and forming a top electrode on the surface of the mass load layer away from the substrate. This mode increases process options, and increases the flexibility of forming multi-mass loads of film bulk acoustic resonators below top electrodes and in filters having the film bulk acoustic resonators, thereby improving the sensitivity of the filters.

IPC Classes  ?

  • H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks

55.

ACOUSTIC WAVE RESONATOR AND PREPARATION METHOD THEREFOR

      
Application Number CN2023112458
Publication Number 2024/230000
Status In Force
Filing Date 2023-08-11
Publication Date 2024-11-14
Owner
  • AAC TECHNOLOGIES PTE. LTD. (Singapore)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Pang, Dong Liang
  • Loo, Li Eng
  • Lai, Kah Keen
  • Wu, Ke
  • Yap, Shirnee

Abstract

An acoustic wave resonator and a preparation method therefor. The acoustic wave resonator comprises: a substrate (1), provided with a plurality of cavities (2); a plurality of piezoelectric units, the plurality of piezoelectric units being in one-to-one correspondence with the plurality of cavities (2), the piezoelectric units covering the cavities (2), and each piezoelectric unit comprising a first electrode layer (4), a piezoelectric layer (5) and a second electrode layer (8) which are sequentially stacked from bottom to top; a protective layer (9), stacked on the piezoelectric units; and a series unit, having one end electrically connected to the first electrode layer (4) of one piezoelectric unit and the other end electrically connected to the second electrode layer (8) of another piezoelectric unit, so as to connect the two piezoelectric units in series. The protective layer (9) is provided on the piezoelectric units, such that the piezoelectric units are protected from being further damaged by downstream processing, and the acoustic wave resonator has a better Q value and a better coupling coefficient.

IPC Classes  ?

  • H03H 9/02 - Networks comprising electromechanical or electro-acoustic elementsElectromechanical resonators Details

56.

MEMS DEVICE AND MANUFACTURING METHOD THEREFOR

      
Application Number CN2023107890
Publication Number 2024/212393
Status In Force
Filing Date 2023-07-18
Publication Date 2024-10-17
Owner
  • AAC TECHNOLOGIES PTE. LTD. (Singapore)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Chong, Houming
  • Tan, Qiuyu
  • Pua, Zaixiang
  • Lai, Kah Keen
  • Zhan, Zhan

Abstract

Provided in the present invention are an MEMS device and a method for manufacturing the MEMS device. The MEMS device comprises a cap piece and a device piece, wherein the device piece comprises a silicon substrate, at least two device structure layers and at least one electrically conductive structure layer, every two adjacent device structure layers being coupled to each other by means of the corresponding electrically conductive structure layer; the device piece has a functional cavity, which comprises a first area, a second area and a third area; the at least two device structure layers and the at least one electrically conductive structure layer each stretch across the first area, the second area and the third area; and the at least two device structure layers and the at least one electrically conductive structure layer collaboratively form a first movable structure in the first area, collaboratively form an anchor point in the second area, and collaboratively form a second movable structure in the third area.

IPC Classes  ?

  • B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
  • B81B 7/00 - Microstructural systems
  • B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
  • G01P 15/14 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of gyroscopes
  • G01C 19/56 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces

57.

METHOD FOR CAPTURING CONTROL AND RELATED APPARATUS

      
Application Number 18650105
Status Pending
Filing Date 2024-04-30
First Publication Date 2024-10-17
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Wu, Zhijiang

Abstract

Provided is a method for capturing control and a related apparatus. A Bluetooth earphone case is provided with a capturing module and a communication module. Firstly, a target communication connection is established with a terminal device based on the communication module. Then, a capturing control instruction sent by the terminal device is received based on the target communication connection. Next, the capturing module is controlled to trigger a corresponding image capturing state. Finally, a target captured image is sent to the terminal device based on the target communication connection. The terminal device may control the capturing module on the Bluetooth earphone case to realize a capturing function, that is, the terminal device is provided with the capturing function and capturing performance support by expanding the capturing function of the Bluetooth earphone case, which satisfies a capturing requirement of a terminal user and ensure miniaturization of the terminal device.

IPC Classes  ?

  • H04W 76/14 - Direct-mode setup
  • H04N 23/66 - Remote control of cameras or camera parts, e.g. by remote control devices
  • H04W 72/40 - Resource management for direct mode communication, e.g. D2D or sidelink

58.

CAPTURING CONTROL METHOD AND RELATED APPARATUS

      
Application Number CN2023106142
Publication Number 2024/212378
Status In Force
Filing Date 2023-07-06
Publication Date 2024-10-17
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD (China)
Inventor Wu, Zhijiang

Abstract

Provided in the present invention are a capturing control method and a related apparatus. A capturing module and a communication module are provided on a Bluetooth earphone box. The method comprises: first, establishing a target communication connection with a terminal device on the basis of a communication module; then, on the basis of the target communication connection, receiving a capturing control instruction sent by the terminal device; next, according to the capturing control instruction, controlling a capturing module to trigger a corresponding image capturing state; and finally, on the basis of the target communication connection, sending a target captured image to the terminal device. By means of the implementation of the present invention, a terminal device can control a capturing module on a Bluetooth earphone box to implement a capturing function. That is, the capturing function of the Bluetooth earphone box is expanded to provide a capturing function and capturing performance support to the terminal device, such that capturing requirements of a terminal user are met, and the miniaturization of the terminal device can also be ensured.

IPC Classes  ?

  • H04R 1/10 - EarpiecesAttachments therefor
  • H04N 23/661 - Transmitting camera control signals through networks, e.g. control via the Internet
  • H04W 4/80 - Services using short range communication, e.g. near-field communication [NFC], radio-frequency identification [RFID] or low energy communication
  • H04W 76/14 - Direct-mode setup

59.

Gas Sensor

      
Application Number 18399718
Status Pending
Filing Date 2023-12-29
First Publication Date 2024-10-10
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Zhang, Jinyu

Abstract

The present disclosure provides a shell with a receiving cavity, an infrared transmitter and an acoustic sensor accommodated in the receiving cavity, and a flexible film connected with the side wall, the shell includes a cover, a substrate, and a side wall, the flexible film divides the receiving cavity into a first cavity and a second cavity, the infrared transmitter is located in the first cavity, the acoustic sensor is located in the second cavity, the shell comprises a vent hole communicating with an outside and the first cavity, the flexible film, the first cavity and the second cavity form a resonant system, an intrinsic frequency of the resonant system is the same as a modulation frequency of the infrared transmitter. Compared with the related art, the gas sensor disclosed by the present disclosure could improve the sensitivity of the product.

IPC Classes  ?

  • G01N 21/17 - Systems in which incident light is modified in accordance with the properties of the material investigated
  • G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups

60.

ELECTRONIC CIGARETTE

      
Application Number CN2023085982
Publication Number 2024/207150
Status In Force
Filing Date 2023-04-03
Publication Date 2024-10-10
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Li, Jinyang
  • Fang, Tao
  • Zhang, Rui

Abstract

An electronic cigarette (200), comprising a cigarette body housing (201) and an MEMS airflow sensor (100) accommodated in the cigarette body housing (201). The MEMS airflow sensor (100) comprises a circuit board (1), an upper cover (2) covering the circuit board (1) and forming an accommodating space (10) together with the circuit board (1), an ASIC chip (3), and an MEMS chip (4) having a back cavity (41), the ASIC chip (3) and the MEMS chip being fixed to the circuit board (1) and electrically connected to each other. The upper cover (2) is provided with a first sound hole (21) running through the upper cover (2); an upper metal layer (5) and a lower metal layer (6) which are exposed on surfaces of the circuit board (1) and are electrically connected to each other are respectively provided on the side of the circuit board (1) close to the upper cover (2) and the side of the circuit board (1) away from the upper cover (2); the projection of the ASIC chip (3) on the circuit board (1) is at least partially located within the range of the upper metal layer (5). According to the electronic cigarette (200), the overall heat dissipation performance of the circuit board (1) can be improved by means of the upper metal layer (5) and the lower metal layer (6) which are additionally provided, so as to transfer heat generated during operation of the ASIC chip (3) to the outside of the accommodating space (10) in time, thereby avoiding trigger of overheating protection and shutdown of the ASIC chip (3).

IPC Classes  ?

  • A24F 40/40 - Constructional details, e.g. connection of cartridges and battery parts
  • A24F 40/50 - Control or monitoring
  • H01L 23/00 - Details of semiconductor or other solid state devices

61.

ELECTRONIC CIGARETTE

      
Application Number CN2023085987
Publication Number 2024/207151
Status In Force
Filing Date 2023-04-03
Publication Date 2024-10-10
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Li, Jinyang
  • Fang, Tao
  • Zhang, Rui

Abstract

An electronic cigarette (200), comprising a cigarette body casing (201) and a MEMS sensor (100) accommodated in the cigarette body casing (201); the MEMS sensor (100) comprises a housing (1) having an accommodating space (10), and, accommodated in the accommodating space (10) and electrically connected to each other, an AISC chip (2) and an MEMS chip (3) having a back chamber (31); the housing (1) is provided with a first sound hole (11) and a second sound hole (12) penetrating therethrough and communicating the accommodating space (10) with the outside; the MEMS sensor (100) further comprises a first waterproof and breathable film (4) fixed to the housing (1) and completely covering the first sound hole (11), and a second waterproof and breathable film (5) fixed to the housing (1) and completely covering the second sound hole (12). The MEMS sensor (100) of the electronic cigarette can intercept impurities such as water, liquid, dust and aerosol by means of the first waterproof and breathable film (4) and the second waterproof and breathable film (5), thereby avoiding performance decline or damage of the MEMS chip (3) due to impurities entering the MEMS chip (3) via the first sound hole (11) and the second sound hole (12).

IPC Classes  ?

62.

GAS SENSOR

      
Application Number CN2023086222
Publication Number 2024/207206
Status In Force
Filing Date 2023-04-04
Publication Date 2024-10-10
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Zhang, Jinyu

Abstract

The present invention provides a gas sensor, comprising a housing provided with an accommodating cavity, and a sound sensor and an infrared transmitter which are arranged in the accommodating cavity. The housing comprises a cover plate, a substrate spaced apart from the cover plate, and a side wall located between the cover plate and the substrate. The housing is provided with a vent hole used for communicating the outside with the accommodating cavity. The gas sensor further comprises a flexible film connected to the side wall. The flexible film separates the accommodating cavity into a first cavity and a second cavity. The infrared transmitter is located in the first cavity. The sound sensor is located in the second cavity. The flexible film, the first cavity and the second cavity constitute a resonator system. An inherent frequency of the resonant system is the same as a modulation frequency of the infrared transmitter. The vent hole is communicated with the first cavity. Compared with the related art, the gas sensor provided by the present invention has improved sensitivity.

IPC Classes  ?

  • G01N 21/35 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
  • G01N 29/02 - Analysing fluids

63.

MEMS microphone

      
Application Number 18399736
Status Pending
Filing Date 2023-12-29
First Publication Date 2024-10-10
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Liu, Yuwei
  • Zhang, Rui

Abstract

The present disclosure discloses a MEMS microphone including a substrate with a back cavity and a capacitive system arranged on the substrate, the capacitive system includes a back plate and a diaphragm opposite to the back plate, the diaphragm is located between the substrate and the back plate, the diaphragm is provided with a through hole, the back plate includes a body portion, an extension post extending from the body portion towards the substrate and penetrating the through hole, and a spacer connected to the extension post, the spacer is located between the diaphragm and the substrate, one end of the extension post is connected to the body portion of the back plate, the other end of the extension post is connected to the spacer. Compared with the related art, MEMS microphone disclosed by the present disclosure has a high reliability.

IPC Classes  ?

64.

VEHICLE-MOUNTED MICROPHONE SYSTEM

      
Application Number 18399746
Status Pending
Filing Date 2023-12-29
First Publication Date 2024-10-10
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Zhang, Jinyu

Abstract

A vehicle-mounted microphone system, including a microphone module and a vehicle body on which the microphone module is mounted. The vehicle body includes an outer surface facing the outside of a vehicle and an inner surface arranged opposite to the outer surface. The microphone module is mounted on the inner surface. The vehicle body is provided with a sound inlet channel of the microphone module. The sound inlet channel includes an arched channel and a sound hole communicated with the arched channel. A first-end opening and a second-end opening of the arched channel are formed on the outer surface and are spaced apart from each other. The sound hole is communicated with the arched channel at the top of the arched channel and forms a sound hole opening on the inner surface. The microphone module receives sound through the sound hole opening.

IPC Classes  ?

  • H04R 1/08 - MouthpiecesAttachments therefor
  • B60R 11/02 - Arrangements for holding or mounting articles, not otherwise provided for for radio sets, television sets, telephones, or the likeArrangement of controls thereof

65.

ONBOARD MICROPHONE SYSTEM

      
Application Number CN2023086229
Publication Number 2024/207208
Status In Force
Filing Date 2023-04-04
Publication Date 2024-10-10
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Zhang, Jinyu

Abstract

Provided in the present invention is an onboard microphone system, comprising a microphone module and a vehicle body where the microphone module is mounted; the vehicle body comprises an outer surface facing the outside of the vehicle and an inner surface opposite to the outer surface, the microphone module being mounted on the inner surface; the vehicle body is provided with a sound inlet channel of the microphone module, the sound inlet channel comprising an arched channel and a sound hole leading to the arched channel; a first end opening and a second end opening of the arched channel are formed in the outer surface and are spaced apart from each other; the sound hole leads to the arched channel at the top of the arched channel and forms a sound hole opening located in the inner surface, sound entering the microphone module via the sound hole opening. The water resistance of the onboard microphone system of the present invention is optimized and the effect of wind noise thereon is reduced.

IPC Classes  ?

  • B60R 11/02 - Arrangements for holding or mounting articles, not otherwise provided for for radio sets, television sets, telephones, or the likeArrangement of controls thereof
  • H04R 1/08 - MouthpiecesAttachments therefor

66.

MEMS MICROPHONE

      
Application Number CN2023086242
Publication Number 2024/207210
Status In Force
Filing Date 2023-04-04
Publication Date 2024-10-10
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Liu, Yuwei
  • Zhang, Rui

Abstract

The present invention provides a MEMS microphone, comprising a substrate having a back cavity and a capacitor system arranged on the substrate. The capacitor system comprises a back plate and a diaphragm arranged opposite to the back plate. The diaphragm is located between the substrate and the back plate. The diaphragm is provided with a through hole. The back plate comprises a body part, an extending column extending from the body part to the substrate and passing through the through hole, and a gasket connected to the extending column. The gasket is located between the diaphragm and the substrate. One end of the extending column is connected to the body part of the back plate, and the other end of the extending column is connected to the gasket. Compared with the prior art, the MEMS microphone provided by the present invention can enhance the reliability of the product.

IPC Classes  ?

67.

ELECTRONIC CIGARETTE

      
Application Number 18399722
Status Pending
Filing Date 2023-12-29
First Publication Date 2024-10-03
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Li, Jinyang
  • Fang, Tao
  • Zhang, Rui

Abstract

An electronic cigarette includes a cigarette body housing and a MEMS sensor located in the cigarette body housing. The MEMS sensor includes a shell with a receiving cavity, a MEMS Die with a back cavity received in the receiving cavity, an ASIC Die located in the receiving cavity and electrically connected to the MEMS Die, a first waterproof breathable membrane fixed to the shell and completely covering the first acoustic hole, and a second waterproof breathable membrane fixed to the shell and completely covering the second acoustic hole. The shell includes a first acoustic hole and a second acoustic hole penetrating the shell and communicating with the receiving cavity and an outside. Compared with the related art, the MEMS sensor disclosed by the present disclosure provides a MEMS Die with good performance.

IPC Classes  ?

  • B81B 7/00 - Microstructural systems
  • A24F 40/40 - Constructional details, e.g. connection of cartridges and battery parts
  • A24F 40/51 - Arrangement of sensors
  • H05K 7/14 - Mounting supporting structure in casing or on frame or rack

68.

ELECTRONIC CIGARETTE

      
Application Number 18399756
Status Pending
Filing Date 2023-12-29
First Publication Date 2024-10-03
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Li, Jinyang
  • Fang, Tao
  • Zhang, Rui

Abstract

An electronic cigarette, including cigarette housing and micro-electromechanical system (MEMS) airflow sensor received in the cigarette housing. The MEMS airflow sensor includes a printed circuit board (PCB), an upper cover that covers PCB and encloses a receiving space together with PCB, and application specific integrated circuit (ASIC) chip and an MEMS chip with back cavity that are fixed to PCB and electrically connected to each other. The upper cover is provided with first sound hole passing therethrough. A side of PCB close to the upper cover and a side of PCB away from the upper cover are respectively provided with an upper metal layer and a lower metal layer that are exposed to a surface of PCB and are electrically connected to each other. A projection of ASIC chip on PCB at least partially falls within a range of the upper metal layer.

IPC Classes  ?

  • A24F 40/51 - Arrangement of sensors
  • A24F 40/40 - Constructional details, e.g. connection of cartridges and battery parts
  • G01F 1/20 - Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects by detection of dynamic effects of the flow
  • H05K 1/02 - Printed circuits Details
  • H05K 1/18 - Printed circuits structurally associated with non-printed electric components

69.

ELECTRONIC CIGARETTE

      
Application Number CN2023090148
Publication Number 2024/183140
Status In Force
Filing Date 2023-04-23
Publication Date 2024-09-12
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Li, Jinyang
  • Fang, Tao

Abstract

Provided in the present utility model is an electronic cigarette. The electronic cigarette of the present utility model comprises an atomizer, an e-liquid cavity, and an airflow sensing apparatus, which mainly comprises a first circuit board, an MEMS airflow sensor and a main control IC. A second circuit board of the present solution is provided with a first pad and a second pad, wherein the second pad is arranged around the first pad, a first pin is provided in the first pad, and a second pin is provided in the second pad. Since the first pad is surrounded and sealed by the second pad, the first pin is electrically connected to a capacitance measurement port of the main control IC, and the second pin is grounded, the present solution can prevent condensate from coming into contact with the first pin of the MEMS airflow sensor, which first pin is electrically connected to the main control IC, such that condensate flowing through a capacitance measurement line of the electronic cigarette can be effectively avoided, and the main control IC does not detect an increase in a capacitance value. Therefore, self-starting of the electronic cigarette can be prevented, and the electronic cigarette is safe and reliable and has a low cost.

IPC Classes  ?

70.

MEMS DIAPHRAGM AND MEMS SENSOR

      
Application Number CN2023095457
Publication Number 2024/183157
Status In Force
Filing Date 2023-05-22
Publication Date 2024-09-12
Owner
  • AAC TECHNOLOGIES PTE. LTD. (Singapore)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Patel, Anup
  • Cargill, Scott Lyall
  • Boyd, Euan James

Abstract

Disclosed in the present invention are a MEMS diaphragm and a MEMS sensor. The MEMS diaphragm comprises: a main diaphragm, the main diaphragm comprising a main body sensing part and fixing parts, and the plurality of fixing parts being annularly connected to the outer edge of the main body sensing part at intervals; and an additional material layer, the additional material layer being arranged on the fixing parts, or the additional material layer being arranged on the edge of the main body sensing part and the fixing parts, wherein the internal stress of the additional material layer is greater than the internal stress of the main body sensing part. Compared with the prior art, in the present invention, the additional material layer is arranged on the main diaphragm, the additional material layer is mechanically reinforced in a diaphragm area subjected to a high stress during pressure pulses, and the internal stress of the additional material layer is greater than the internal stress of the main body sensing part, so that the flexibility of the main diaphragm can be guaranteed.

IPC Classes  ?

71.

ELECTRONIC CIGARETTE

      
Application Number 18325078
Status Pending
Filing Date 2023-05-29
First Publication Date 2024-09-05
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Li, Jinyang
  • Fang, Tao

Abstract

An electronic cigarette includes an atomizer, an e-liquid cavity, and an airflow sensing device. The airflow sensing device includes a first circuit board, a MEMS airflow sensor, and a main control IC. A second control board includes a first bonding pad and a second bonding pad. The second bonding pad is disposed around the first bonding pad. The first bonding pad includes a first pin and the second bonding pad includes a second pin. Since the first bonding pad is surrounded and sealed by the second bonding pad, the first pin is electrically connected to a capacitance detection port of the main control IC, and the second pin is grounded, condensate is prevented from contacting the first pin, thus preventing the condensate from flowing through a capacitance detection circuit. The main control IC does not detect an increase in capacitance value, which prevent the electronic cigarette from self-starting.

IPC Classes  ?

  • A24F 40/10 - Devices using liquid inhalable precursors
  • A24F 40/53 - Monitoring, e.g. fault detection

72.

MICROPHONE MODULE

      
Application Number CN2023077285
Publication Number 2024/174074
Status In Force
Filing Date 2023-02-21
Publication Date 2024-08-29
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Zhang, Jinyu

Abstract

The present utility model provides a microphone module, comprising a housing having an accommodating cavity, a first supporting member accommodated in the accommodating cavity and fixed to the housing, and a first microphone and a second microphone that are fixed on the first supporting member. The housing is provided with a first sound inlet channel penetrating through the housing; the first supporting member is provided with a first sound inlet hole and a second sound inlet hole that penetrate through the first supporting member and are spaced from each other; the first sound inlet hole is arranged corresponding to the first microphone, and the second sound inlet hole is arranged corresponding to the second microphone; an external sound wave enters the first sound inlet channel and is then transmitted to the first microphone through the first sound inlet hole and to the second microphone through the second sound inlet hole; the first microphone picks up full-band sound signals, and the second microphone picks up sound signals having a frequency of 700-1,500 Hz. The microphone module of the present utility model achieves both an out-of-vehicle voice control function and a siren detection and penetration function.

IPC Classes  ?

  • H04R 1/08 - MouthpiecesAttachments therefor

73.

ACOUSTIC SENSOR AND MANUFACTURING METHOD THEREFOR

      
Application Number CN2023086907
Publication Number 2024/169020
Status In Force
Filing Date 2023-04-07
Publication Date 2024-08-22
Owner
  • AAC TECHNOLOGIES PTE. LTD. (Singapore)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Goh, Kian Heng
  • Li, Chung Min
  • Dan, Qiang
  • Lai, Kah Keen

Abstract

Disclosed in the present invention are an acoustic sensor and a manufacturing method therefor. The acoustic sensor comprises: a substrate unit, the substrate unit comprising a first silicon layer, a first oxide layer and a second silicon layer which are successively stacked from bottom to top, and the substrate unit being internally provided with a back chamber; a second oxide layer; a piezoelectric unit, the piezoelectric unit comprising a first electrode layer, a piezoelectric layer and a second electrode layer which are successively stacked from bottom to top, and the piezoelectric unit being internally provided with a slit and an opening; a metal pad; and an additional film layer, comprising a first portion, a second portion and a third portion, the first portion being formed in the slit, the side wall of the first portion being attached to the inner wall surface of the slit, the bottom wall of the first portion covering an opening of the bottom portion of the slit, and the side wall and the bottom wall defining a recess having an opening in the top portion. Compared with the prior art, the present invention can effectively improve the SPL and structural reliability, and the thickness of the additional film layer is uniformly distributed on the surface of the piezoelectric unit, thus being suitable for acoustic sensors having large areas.

IPC Classes  ?

  • G01H 11/08 - Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
  • H04R 17/02 - Microphones
  • B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction

74.

ACOUSTIC SENSOR AND PREPARATION METHOD THEREFOR

      
Application Number CN2023086919
Publication Number 2024/169021
Status In Force
Filing Date 2023-04-07
Publication Date 2024-08-22
Owner
  • AAC TECHNOLOGIES PTE. LTD. (Singapore)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Goh, Kian Heng
  • Li, Chung Min
  • Dan, Qiang
  • Lai, Kah Keen

Abstract

Disclosed in the present invention are an acoustic sensor and a preparation method therefor. The acoustic sensor comprises: a substrate unit, the substrate unit comprising a first silicon layer, a first oxide layer and a second silicon layer, which are sequentially stacked from bottom to top, and a back cavity being formed in the substrate unit; a second oxide layer; a piezoelectric unit formed on the second oxide layer, the piezoelectric unit comprising a first electrode layer, a piezoelectric layer and a second electrode layer, which are sequentially stacked from bottom to top, and a slit and an opening being formed in the piezoelectric unit; a metal gasket, which is stacked on the first electrode layer at the opening; and an additional film layer, which comprises a first part and a second part, the first part being laid flat on the second electrode layer and covering the slit, and the second part being laid flat on the metal gasket. Compared with the prior art, the piezoelectric unit of the present invention can move at the maximum displacement and vibrate with the minimum restriction, thereby effectively improving the SPL and structural reliability; and the thickness of the additional film layer is uniformly distributed on the top surface of the piezoelectric unit, thus adapting to an acoustic sensor with a large area.

IPC Classes  ?

  • H04R 17/00 - Piezoelectric transducersElectrostrictive transducers

75.

Microphone module

      
Application Number 18327032
Status Pending
Filing Date 2023-05-31
First Publication Date 2024-08-22
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Zhang, Jinyu

Abstract

The present disclosure discloses a microphone module including a housing having a first sound channel penetrating thereon, a first support member, a first microphone mounted on the first support member and configured to pick up sound signal in full frequency rage, and a second microphone mounted on the first support member and configured to pick up sound signal in a frequency range of 700-1500 Hz; a first sound hole corresponding to the first microphone and a second sound hole corresponding to the second microphone are provided on the first support member; external sound wave entering the first sound channel is transmitted to the first microphone through the first sound hole; external sound wave entering the first sound channel is transmitted to the second microphone through the second sound hole. The microphone module in the present disclosure can balance the functions of external voice control, and siren detection and penetration.

IPC Classes  ?

  • H04R 1/24 - Structural combinations of separate transducers or of parts of the same transducer and responsive respectively to two or more frequency ranges
  • H04R 1/08 - MouthpiecesAttachments therefor
  • H04R 3/00 - Circuits for transducers

76.

LOUDSPEAKER ASSEMBLY AND HANDHELD DEVICE

      
Application Number CN2023106739
Publication Number 2024/148784
Status In Force
Filing Date 2023-07-11
Publication Date 2024-07-18
Owner
  • AAC TECHNOLOGIES PTE. LTD. (Singapore)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Backman, Juha

Abstract

A loudspeaker assembly and a handheld device. The loudspeaker assembly comprises at least one loudspeaker driver and at least two output ports (403, 404). The at least one loudspeaker driver and the at least two output ports (403, 404) are configured such that the loudspeaker assembly has a directional polar pattern within a desired frequency range.

IPC Classes  ?

  • H04R 9/06 - Loudspeakers
  • H04R 9/02 - Transducers of moving-coil, moving-strip, or moving-wire type Details

77.

MEMS MICROPHONE

      
Application Number 18454038
Status Pending
Filing Date 2023-08-22
First Publication Date 2024-07-04
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Zhao, Zhuanzhuan
  • Wang, Kaijie
  • Zhang, Rui

Abstract

A MEMS microphone, includes a substrate with a back cavity, and a capacitive system including a back plate and a diaphragm located on the substrate, the back plate includes a body portion and a first protrusion, the diaphragm includes a main portion and a second protrusion, the first protrusion is corresponding to the second protrusion, the substrate includes an upper end close to the capacitive system and a lower end away from the capacitive system, an opening of the back cavity at the upper end of the substrate is larger than an opening at the lower end of the substrate. Compared with the related art, the MEMS microphone disclosed by the present disclosure could improve the resonant frequency.

IPC Classes  ?

  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

78.

Gas Sensor

      
Application Number 18454775
Status Pending
Filing Date 2023-08-23
First Publication Date 2024-07-04
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Zhang, Jinyu

Abstract

The present disclosure provides a gas sensor including a shell with a receiving cavity, an acoustic sensor, a partition plate and a flexible film accommodated in the receiving cavity. The partition plate and the flexible film jointly divide the receiving cavity into a first cavity and a second cavity, the first cavity is a sealed cavity formed by the joint enclosure of the flexible film, the partition plate, the side wall and the substrate. The acoustic sensor is located in the first cavity, the infrared transmitter is located in the second cavity. Compared with the related art, the gas sensor disclosed by the present disclosure could improve the sensitivity of the product.

IPC Classes  ?

  • G01N 21/17 - Systems in which incident light is modified in accordance with the properties of the material investigated

79.

MEMS MICROPHONE

      
Application Number CN2023096260
Publication Number 2024/139029
Status In Force
Filing Date 2023-05-25
Publication Date 2024-07-04
Owner
  • AAC TECHNOLOGIES PTE. LTD. (Singapore)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Liu, Yuwei
  • Colin, Jenkins
  • Zhang, Rui

Abstract

Provided in the present invention is a MEMS microphone, comprising a substrate having a back cavity and a capacitance system arranged on the substrate, wherein the capacitance system comprises a back plate and a diaphragm arranged opposite the back plate; the diaphragm is located between the substrate and the back plate; a reinforcing portion connected to the diaphragm is disposed between the diaphragm and the substrate; a projection of an inner surface of the reinforcing portion in the direction of vibration of the diaphragm is flush with an inner surface of the back cavity or is located in the back cavity; and the reinforcing portion comprises an etch stop wall and a sacrificial layer located in the etch stop wall. Compared with related techniques, the MEMS microphone provided in the present invention can enhance product reliability.

IPC Classes  ?

80.

MEMS OPTICAL MICROPHONE

      
Application Number CN2023106141
Publication Number 2024/139161
Status In Force
Filing Date 2023-07-06
Publication Date 2024-07-04
Owner
  • AAC TECHNOLOGIES PTE. LTD. (Singapore)
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Ali, Taimoor

Abstract

An MEMS optical microphone (100), comprising: a casing (1), the casing (1) comprising an inner cavity (10) and a sound port (14) that connects the inner cavity (10) to the outside; a light source (2), the light source (2) being configured to emit a light beam; an MEMS module (3), the MEMS module (3) comprising: a diaphragm (31), the diaphragm (31) being suspended above the sound port (14), and a first reflective coating (32), the first reflective coating (32) coating the surface of the diaphragm (31) facing the light source (2) and configured to reflect the light beam; and an optical detection unit (4), the optical detection unit (4) being configured to detect light reflected from the first reflective coating (32), and comprising: a photodetector (41), the photodetector (41) being configured to convert the light intensity into a photocurrent, and a light filter (42), the light filter (42) having a variable transmissivity and being lifted above the photodetector (41). The MEMS optical microphone (100) has a wider dynamic range and higher sensitivity.

IPC Classes  ?

81.

MEMS SENSOR, MEMS MICROPHONE, ELECTRONIC CIGARETTE

      
Application Number 18454041
Status Pending
Filing Date 2023-08-22
First Publication Date 2024-07-04
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Li, Jinyang
  • Zhang, Rui

Abstract

A MEMS sensor, includes a substrate with a back cavity, and a capacitive system arranged on the substrate, the MEMS sensor includes a first back plate assembly and a diaphragm opposite to the first back plate assembly. The first back plate assembly includes a first back plate and a second back plate, the first back plate includes a plurality of a first back plate holes, the second back plate includes a plurality of a second back plate holes, each first back plate hole and each second back plate hole are staggered with each other in a vibration direction of the diaphragm. Compared with the related art, the MEMS sensor disclosed by the present disclosure could play a good dustproof effect.

IPC Classes  ?

  • A24F 40/51 - Arrangement of sensors
  • A24F 40/10 - Devices using liquid inhalable precursors
  • A24F 40/40 - Constructional details, e.g. connection of cartridges and battery parts
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • H04R 1/02 - CasingsCabinetsMountings therein
  • H04R 7/04 - Plane diaphragms
  • H04R 19/04 - Microphones

82.

Gas Sensor

      
Application Number 18454772
Status Pending
Filing Date 2023-08-23
First Publication Date 2024-07-04
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Zhang, Jinyu

Abstract

The present disclosure provides a gas sensor, including a shell with a receiving cavity, an infrared transmitter, an acoustic sensor and a partition plate accommodated in the receiving cavity. The partition plate is connected with the substrate and the side wall, the partition plate divides the receiving cavity into a first receiving cavity and a second receiving cavity, the acoustic sensor is located in the first receiving cavity, the infrared transmitter is located in the second receiving cavity. Compared with the related art, the gas sensor disclosed by the present disclosure could improve the sensitivity of the product.

IPC Classes  ?

  • G01N 21/17 - Systems in which incident light is modified in accordance with the properties of the material investigated
  • G01N 21/3504 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing gases, e.g. multi-gas analysis

83.

GAS SENSOR

      
Application Number CN2023084807
Publication Number 2024/138922
Status In Force
Filing Date 2023-03-29
Publication Date 2024-07-04
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Zhang, Jinyu

Abstract

A gas sensor (100), comprising: a housing (1) with an accommodating cavity (10), and an acoustic sensor (20) and an infrared emitter (30), which are arranged in the accommodating cavity (10), wherein the housing (1) comprises a cover plate (11), a base plate (12) and side walls (13); and a vent (110) in communication with the outside and the accommodating cavity (10) is provided in the housing (1). The gas sensor (100) is further provided with a partition plate (14) located in the accommodating cavity (10), wherein the partition plate (14) partitions the accommodating cavity (10) into a first accommodating cavity (101) and a second accommodating cavity (102); the acoustic sensor (20) is located in the first accommodating cavity (101); the infrared emitter (30) is located in the second accommodating cavity (102); the vent (110) is in communication with the second accommodating cavity (102); a through hole (140) in communication with the first accommodating cavity (101) and the second accommodating cavity (102) is provided in the partition plate (14); the first accommodating cavity (101), the through hole (140) and the second accommodating cavity (102) form a Helmholtz resonator; and the natural frequency of the Helmholtz resonator is the same as the modulation frequency of the infrared emitter (30).

IPC Classes  ?

  • G01N 21/3504 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing gases, e.g. multi-gas analysis
  • G01N 21/17 - Systems in which incident light is modified in accordance with the properties of the material investigated

84.

MEMS MICROPHONE

      
Application Number CN2023084822
Publication Number 2024/138923
Status In Force
Filing Date 2023-03-29
Publication Date 2024-07-04
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Zhao, Zhuanzhuan
  • Wang, Kaijie
  • Zhang, Rui

Abstract

The present invention provides a MEMS microphone. The MEMS microphone comprises: a substrate having a back cavity, and a capacitance system arranged on the substrate; the capacitance system comprises a backplate and a diaphragm arranged opposite to the backplate, and the backplate and the diaphragm have a gap formed between same; the backplate is provided with a body portion and a first protrusion extending out from the body portion in a direction away from the base; the diaphragm is provided with a main body portion and a second protrusion extending out from the main body portion in a direction away from the base; the first protrusion and the second protrusion are arranged corresponding to one another; the substrate comprises an upper end adjacent to the capacitance system and a lower end away from the capacitance system; and an opening of the back cavity at the upper end of the substrate is larger than an opening at the lower end of the substrate. Compared with the prior art, the MEMS microphone provided in the present invention can improve resonance frequency.

IPC Classes  ?

85.

MEMS SENSOR, MEMS MICROPHONE, AND ELECTRONIC CIGARETTE

      
Application Number CN2023084847
Publication Number 2024/138924
Status In Force
Filing Date 2023-03-29
Publication Date 2024-07-04
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Li, Jinyang
  • Zhang, Rui

Abstract

The present application provides an MEMS sensor, and an MEMS microphone and electronic cigarette using the MEMS sensor. The MEMS sensor comprises a substrate having a back cavity and a capacitance system arranged on the substrate, wherein the capacitance system comprises a first backplate assembly and a diaphragm arranged opposite to the first backplate assembly; the first backplate assembly comprises a first backplate and a second backplate which are arranged at an interval; a plurality of first backplate holes are formed in the first backplate; a plurality of second backplate holes are formed in the second backplate; and the first backplate holes and the second backplate holes are mutually staggered in the vibration direction of the diaphragm. The MEMS sensor can achieve a good dustproof effect.

IPC Classes  ?

  • H04R 1/08 - MouthpiecesAttachments therefor
  • A24F 40/40 - Constructional details, e.g. connection of cartridges and battery parts

86.

GAS SENSOR

      
Application Number CN2023084864
Publication Number 2024/138925
Status In Force
Filing Date 2023-03-29
Publication Date 2024-07-04
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Zhang, Jinyu

Abstract

Provided in the present invention is a gas sensor, comprising a housing with an accommodating cavity, and an acoustic sensor and an infrared emitter, which are arranged in the accommodating cavity, wherein the housing comprises a cover plate, a base plate spaced apart from the cover plate, and side walls located between the cover plate and the base plate; and a vent in communication with the outside and the accommodating cavity is provided in the housing. The gas sensor is further provided with a partition plate and a flexible film, which are located in the accommodating cavity, wherein the partition plate and the flexible film jointly partition the accommodating cavity into a first cavity and a second cavity; the acoustic sensor is located in the first cavity; the infrared emitter is located in the second cavity; the flexible film, the first cavity and the second cavity form a resonance system; the natural frequency of the resonance system is the same as the modulation frequency of the infrared emitter; and the vent is in communication with the second cavity. Compared with the related art, the gas sensor provided in the present invention can improve the sensitivity thereof.

IPC Classes  ?

  • G01N 29/02 - Analysing fluids
  • G01N 21/3504 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing gases, e.g. multi-gas analysis

87.

SMART WEARABLE GLASSES

      
Application Number CN2022144401
Publication Number 2024/130788
Status In Force
Filing Date 2022-12-31
Publication Date 2024-06-27
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Zhang, Xin
  • Meng, Yiming
  • Sun, Shuyuan
  • Huang, Xiang

Abstract

Smart wearable glasses (100) having good acoustic performance, comprising a glasses frame (1), glasses legs (2), a vibration unit (3), and a sound production unit (4). The vibration unit (3) comprises a bone conduction contact portion (31) at least partially exposed out of a glasses leg (2). The sound production unit (4) comprises a housing (41) that is provided with an accommodation space (401) and a phase inversion channel (402), a sound production cell (42) that is fixed to the housing (41), and a phase inversion tube (43) that is mounted in the phase inversion channel (402). The housing (41) is provided with a first sound discharge hole (403), a first phase inversion hole (404), and a first leakage hole (405) that run through same. The sound production cell (42) divides the accommodation space (401) into a front cavity (406) and a coupling rear cavity (407), the front cavity (406) is in communication with the outside by means of the first sound discharge hole (403), the phase inversion tube (43) sequentially passes through the phase inversion channel (402) and the first phase inversion hole (404) and then communicates with the outside, and the coupling rear cavity (407) communicates with the outside by means of the first leakage hole (405) and the phase inversion tube (43), respectively. The phase of sound waves emitted by the sound production unit (4) by means of the first sound discharge hole (403) is opposite to the phase of sound waves emitted by the sound production unit (4) by means of the first leakage hole (405).

IPC Classes  ?

88.

VEHICLE-MOUNTED VIRTUAL MULTI-CHANNEL AUDIO SIGNAL PROCESSING METHOD AND SYSTEM, AND ELECTRONIC DEVICE

      
Application Number CN2023072774
Publication Number 2024/130813
Status In Force
Filing Date 2023-01-18
Publication Date 2024-06-27
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Sun, Shuyuan
  • Meng, Yiming
  • Yin, Hao
  • Zhang, Xin

Abstract

The present invention relates to the technical field of automobiles. Disclosed are a vehicle-mounted virtual multi-channel audio signal processing method and system, and an electronic device. The processing method comprises the steps of: acquiring an audio input signal of a single audio channel; identifying different frequency components in the audio input signal; allocating audio data of different frequency bands in the audio input signal to different signal links according to the different frequency components; performing digital signal processing of corresponding frequency bands on the audio data in the different signal links to obtain a plurality of single-channel signals of different frequency bands; and superposing the plurality of single-channel signals into a single-channel audio output signal and outputting the single-channel audio output signal. According to the present invention, a plurality of different loudspeakers connected in parallel on a single audio channel can carry out different digital signal processing, respectively, so that the tone quality of the whole vehicle is improved, and the cost of the whole vehicle is reduced.

IPC Classes  ?

  • H04S 5/00 - Pseudo-stereo systems, e.g. in which additional channel signals are derived from monophonic signals by means of phase shifting, time delay or reverberation
  • H04R 3/00 - Circuits for transducers

89.

Vibration control method, vibration control device, and non-transitory computer-readable storage medium

      
Application Number 17920399
Grant Number 12288461
Status In Force
Filing Date 2022-04-26
First Publication Date 2024-06-27
Grant Date 2025-04-29
Owner
  • AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
  • AAC Microtech (Changzhou) Co., Ltd. (China)
Inventor
  • Xiang, Zheng
  • Wang, Xiuyue

Abstract

A vibration control method, a vibration control device, and a non-transitory computer-readable storage medium are provided. Target effect parameters are obtained in a preset vibration effect design model with reference to a haptic effect demand index, effect parameters in the vibration effect design model including a granularity parameter, a sharpness parameter and a hardness parameter. A vibration control signal is generated based on the target effect parameter. The actuator is controlled to vibrate based on the vibration control signal. With the implementations of the present disclosure, the vibration control models of the actuator can be adaptively designed based on different haptic effect demand scenarios, thereby ensuring the diversity of haptic effects and the adaptability to the scenarios. A variety of perception factors are considered in the vibration effect of the actuator, thereby providing the user with a more complex haptic feedback experience.

IPC Classes  ?

  • H04B 3/36 - Repeater circuits
  • G08B 6/00 - Tactile signalling systems, e.g. personal calling systems

90.

METHOD AND SYSTEM OF AUDIO SIGNAL PROCESSING FOR IN-VEHICLE VIRTUAL MULTICHANNEL SOUND, AND ELECTRONIC DEVICE

      
Application Number 18327007
Status Pending
Filing Date 2023-05-31
First Publication Date 2024-06-27
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Sun, Shuyuan
  • Meng, Yiming
  • Yin, Hao
  • Zhang, Xin

Abstract

Disclosed are a method and a system of audio signal processing for in-vehicle virtual multichannel sound, and an electronic device. The method includes: obtaining an audio input signal in a single audio channel; identifying different frequency components in the audio input signal; assigning audio data in different frequency bands of the audio input signal to different signal paths according to the different frequency components; performing a digital signal processing on the audio data from different signal paths to obtain a plurality of single-channel signals in different frequency bands; and combining the plurality of single-channel signals into a single-channel audio output signal and outputting it. The present application not only realizes individual digital signal processing of different frequency bands for multiple speakers connected in parallel to a single audio channel, to improve the sound quality of the whole vehicle, but also reduces the cost of the whole vehicle.

IPC Classes  ?

  • H04S 7/00 - Indicating arrangementsControl arrangements, e.g. balance control
  • H04S 3/00 - Systems employing more than two channels, e.g. quadraphonic

91.

SOMATOSENSORY IN-VEHICLE PROMPT METHOD AND SYSTEM, AND RELATED DEVICE

      
Application Number CN2022144186
Publication Number 2024/124644
Status In Force
Filing Date 2022-12-30
Publication Date 2024-06-20
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Sun, Shuyuan
  • Meng, Yiming
  • Yin, Hao
  • Zhang, Xin
  • Zhang, Henglizi
  • Ge, Huan
  • Huang, Xiang

Abstract

A somatosensory in-vehicle prompt method and system, and a related device, which are applied to a vehicle. The in-vehicle prompt method comprises the following steps: acquiring an audio signal from a vehicle-mounted audio bus (5) by means of a controller (4) (S1); performing acoustic characteristic analysis on the audio signal, and extracting an acoustic waveform of the audio signal on a time-domain waveform (S2); performing amplitude debugging on a sinusoidal signal of the acoustic waveform, so as to obtain a modulated sinusoidal signal after amplitude modulation (S3); and by means of the controller (4), acquiring from a vehicle-mounted control bus (6) a control signal, which represents operation behavior information, matching the control signal with the modulated sinusoidal signal according to a preset rule, so as to generate a vibration signal, and feeding the vibration signal back to excitation vibrators (1, 2), thereby realizing vibration prompting (S4). In the somatosensory in-vehicle prompt method, safety is improved by means of a vibration prompt combined with an auditory prompt, and when there are a plurality of excitation vibrators (1, 2), a vibration prompt that better conforms to a user operation behavior can be provided on the basis of the control signal on the vehicle-mounted control bus (6), thereby providing a better user experience.

IPC Classes  ?

  • B60N 2/90 - Details or parts not otherwise provided for
  • G10L 25/03 - Speech or voice analysis techniques not restricted to a single one of groups characterised by the type of extracted parameters
  • G10L 25/51 - Speech or voice analysis techniques not restricted to a single one of groups specially adapted for particular use for comparison or discrimination
  • G08B 6/00 - Tactile signalling systems, e.g. personal calling systems
  • G08B 21/24 - Reminder alarms, e.g. anti-loss alarms

92.

SMART WEARABLE GLASSES

      
Application Number 18330326
Status Pending
Filing Date 2023-06-06
First Publication Date 2024-06-20
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Zhang, Xin
  • Meng, Yiming
  • Sun, Shuyuan
  • Huang, Xiang

Abstract

Smart wearable glasses include a frame, temples, a vibration unit, and a sounding unit including a housing having an accommodation space and an inverted channel, a sounding driver fixed in the accommodation space, and an inverted tube. A first sound outlet hole, a first inverted hole, and a first leakage hole are arranged through the housing. The accommodation space is separated into a front cavity and a coupled rear cavity. The front cavity is connected to the outside world through the first sound outlet hole. The inverted tube is connected to the outside world through the inverted channel and the first inverted hole. The coupled rear cavity is connected to the outside world through the first leakage hole and the inverted tube. A phase of an acoustic wave emitted through the first sound outlet hole is opposite to that of an acoustic wave emitted through the first leakage hole.

IPC Classes  ?

  • G02C 11/00 - Non-optical adjunctsAttachment thereof

93.

Motion-sensing in-vehicle alerting method, system and related device

      
Application Number 18323402
Grant Number 12260744
Status In Force
Filing Date 2023-05-24
First Publication Date 2024-06-13
Grant Date 2025-03-25
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Sun, Shuyuan
  • Meng, Yiming
  • Yin, Hao
  • Zhang, Xin
  • Zhang, Henglizi
  • Ge, Huan
  • Huang, Xiang

Abstract

Disclosed are a motion-sensing in-vehicle alerting method, a system, and a related device, which are applied to vehicles. The method includes steps of: obtaining, by a controller, an audio signal from an in-vehicle audio bus; performing an acoustic characteristics analysis on the audio signal, and extracting an acoustic waveform of the audio signal in a time domain waveform; performing an amplitude modulation on a sinusoidal signal of the acoustic waveform to obtain a modulated sinusoidal signal after amplitude modulation; obtaining, by the controller, a control signal indicating operational behavior information from an in-vehicle control bus, matching the control signal with the modulated sinusoidal signal according to a predetermined rule to generate a vibration signal, and transmitting the vibration signal to the excitation oscillator to achieve a vibration alert. The method of the present application not only enhances safety, but also provides the vibration alert, resulting in an improved user experience.

IPC Classes  ?

  • G08B 21/00 - Alarms responsive to a single specified undesired or abnormal condition and not otherwise provided for
  • B60Q 9/00 - Arrangement or adaptation of signal devices not provided for in one of main groups
  • G06F 3/16 - Sound inputSound output
  • G08B 6/00 - Tactile signalling systems, e.g. personal calling systems

94.

SEALED DUAL-MEMBRANE STRUCTURE AND DEVICE

      
Application Number CN2023087210
Publication Number 2024/108866
Status In Force
Filing Date 2023-04-10
Publication Date 2024-05-30
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Jenkins, Colin Robert

Abstract

The present invention provides a sealed dual-membrane (SDM) structure and a device comprising the structure. The SDM structure of the present invention comprises: a substrate; a first vibrating membrane and a second vibrating membrane which are disposed on the substrate, the first vibrating membrane and the second vibrating membrane forming a sealed cavity together with the substrate; first rear electrode plates and second rear electrode plates which are disposed between the first vibrating membrane and the second vibrating membrane; and conductor plate units disposed between the first rear electrode plates and the second rear electrode plates. The first vibrating membrane and the second vibrating membrane are mechanically coupled to the conductor plate units, and each conductor plate unit forms a capacitor structure with each of the first rear electrode plates and each of the second rear electrode plates. The present invention reduces the number of support columns required in the SDM structure, and improves the sensitivity of the device comprising the SDM.

IPC Classes  ?

  • H04R 19/04 - Microphones
  • H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
  • H04R 9/08 - Microphones

95.

OPTICAL MICROPHONE

      
Application Number CN2023087211
Publication Number 2024/108867
Status In Force
Filing Date 2023-04-10
Publication Date 2024-05-30
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Kervran, Yannick Pierre

Abstract

Provided in the present invention is an optical microphone, comprising: a housing, which comprises an inner cavity and a sound intake hole that enables communication between the inner cavity and the outside; a micro-electro-mechanical module, which is located in the inner cavity and comprises a flexible film and a grating; a photoelectric module, which is located in a rear cavity and comprises a light source and a light beam detector; and an integrated circuit module, which is located in the rear cavity and is electrically connected to the micro-electro-mechanical module and the photoelectric module. The photoelectric module and the integrated circuit module are arranged on the same chip. A reflection layer is provided on the side of the flexible film that faces the light source, and another reflection layer is provided on the side of the grating that faces the light source. The microphone has the following beneficial effects: less connection lines are used, and crosstalk noise between the lines is reduced, thereby achieving easier package fabrication and better package miniaturization.

IPC Classes  ?

96.

Sealed dual membrane structure and device including the same

      
Application Number 17993800
Grant Number 12219336
Status In Force
Filing Date 2022-11-23
First Publication Date 2024-05-23
Grant Date 2025-02-04
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Jenkins, Colin Robert

Abstract

Provided is a sealed dual membrane (SDM) structure and a device including the same. The SDM structure according to the present invention includes a substrate, a first vibrating membrane and a second vibrating membrane disposed on the substrate, which form a sealed cavity together with the substrate, a first back electrode plate and a second back electrode plate disposed between the vibrating membrane and the second vibrating membrane, and a conductor plate unit disposed between the first back electrode plate and the second back electrode plate. The first vibrating membrane and the second vibrating membrane are mechanically coupled to the conductor plate unit, and the conductor plate unit forms a capacitor structure with each of the first back electrode plate and the second back electrode plate. The present invention reduces the number of pillars required in the SDM structure and increases the sensitivity of the device including the SDM.

IPC Classes  ?

  • H04R 7/06 - Plane diaphragms comprising a plurality of sections or layers
  • H04R 1/04 - Structural association of microphone with electric circuitry therefor
  • H04R 7/16 - Mounting or tensioning of diaphragms or cones
  • H04R 19/04 - Microphones

97.

OPTICAL MICROPHONE

      
Application Number 17993804
Status Pending
Filing Date 2022-11-23
First Publication Date 2024-05-23
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor Kervran, Yannick Pierre

Abstract

Provided is an optical microphone, including a case including an inner cavity and a sound inlet aperture that makes the inner cavity communicate with exterior; a micro-electromechanical module in the inner cavity and including a flexible film and a grating; an optoelectronic module in the rear cavity and including a light source and a light beam detector; and an integrated circuit module in the rear cavity and electrically connected to the micro-electromechanical module and the optoelectronic module. The optoelectronic module and the integrated circuit module are provided on a same chip; a reflective layer is provided at a side of the flexible film facing the light source, and another reflective layer is provided at a side of the grating facing the light source. The microphone has following beneficial effects: connection wires are less and crosstalk noise between wires is reduced, thereby achieving easier package manufacturing and better package miniaturization.

IPC Classes  ?

  • H04R 23/00 - Transducers other than those covered by groups

98.

MICROPHONE AND VEHICLE-MOUNTED ENTERTAINMENT SYSTEM

      
Application Number CN2023080307
Publication Number 2024/098599
Status In Force
Filing Date 2023-03-08
Publication Date 2024-05-16
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD (China)
Inventor Zhang, Jinyu

Abstract

Provided in the present utility model are a microphone and a vehicle-mounted entertainment system. The microphone comprises a shell having an accommodating cavity, a circuit board fixed in the accommodating cavity, an interface assembly fixed to an outer side of the shell and electrically connected to the circuit board, and a microphone unit fixed to the circuit board, the shell comprising a housing having the accommodating cavity, and a cover plate fixed to the housing and covering the accommodating cavity, characterized in that the interface assembly is fixed to the side of the housing away from the cover plate, and the plugging direction of the interface assembly is perpendicular to a board face of the circuit board; and the housing is provided with a sound pickup channel for providing sound signals for the microphone unit. The present solution omits a weak connecting plate, such that the connection strength between the interface assembly and the shell can be enhanced, the microphone can be miniaturized and can flexibly adapt to different installation modes; in addition, the extending direction of the board face of the circuit board is perpendicular to the plugging direction of the interface assembly, such that dragging, which causes loosening or even brakages between the interface assembly and the shell, can not occur during plugging, thereby preventing the microphone from being damaged.

IPC Classes  ?

  • H04R 1/08 - MouthpiecesAttachments therefor

99.

MEMS MICROPHONE

      
Application Number CN2022140833
Publication Number 2024/098519
Status In Force
Filing Date 2022-12-21
Publication Date 2024-05-16
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Zhao, Zhuanzhuan
  • Wang, Linlin
  • Wang, Kaijie
  • Zhang, Rui

Abstract

Provided in the present utility model is an MEMS microphone, comprising: a base, a support plate arranged on one side of the base, and a capacitor system arranged on the support plate. The capacitor system comprises: a back plate, which is fixed to the support plate; a fixing member, which is fixed to the side of the back plate close to the base; and a diaphragm, which is fixed to the side of the fixing member away from the back plate, the fixing member being located in the central region of the diaphragm, and the diaphragm and the back plate being arranged opposite each other. The MEMS microphone further comprises: a first pad, which is fixed to the side of the supporting plate away from the base; and a first electrode, which is fixedly connected to the central region of the diaphragm and electrically connected to the first pad, the first electrode being only connected to the central region of the diaphragm. In the present utility model, the diaphragm forms a cantilever beam structure fixed in the middle, and the first electrode is only connected to the central region of the diaphragm, so as to prevent the first electrode from interfering with the deformation of an edge region of the diaphragm, such that the sensitivity of the microphone can be improved by way of fully releasing residual stress of the diaphragm.

IPC Classes  ?

100.

MEMS MICROPHONE

      
Application Number 18454042
Status Pending
Filing Date 2023-08-22
First Publication Date 2024-05-09
Owner AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. (China)
Inventor
  • Zhao, Zhuanzhuan
  • Wang, Linlin
  • Wang, Kaijie
  • Zhang, Rui

Abstract

A MEMS microphone includes a substrate, a supporting plate, a capacitor system, a first pad, and a first electrode. The substrate defines a back cavity, the supporting plate is disposed at one side of the substrate and defines an accommodation cavity, and the capacitor system is disposed at the supporting plate. The capacitor system includes a back plate, a fixing component, and a vibrating diaphragm. The vibrating diaphragm is fixed to one side of the fixing component distal from the back plate. The vibrating diaphragm forms a cantilever structure fixing at the middle, and the first electrode is only connected to a central region of the vibrating diaphragm, the first electrode may not interfere with deformation of an edge region of the vibrating diaphragm, thereby improving sensitivity of the MEMS microphone through fully releasing residual stress of the vibrating diaphragm.

IPC Classes  ?

  1     2     3     ...     20        Next Page