Provided are: a composition for chemical mechanical polishing; and a polishing method using the same. The composition allows rapid polishing of a polishing surface that contains a silver material for wiring, and makes it possible to obtain a polished surface having a high reflective property. This composition for chemical mechanical polishing comprises (A) abrasive grains, (B) a liquid medium, (C) an oxidizing agent, and (D) a nitrogen-containing hetrocyclic compound. The absolute value of the zeta potential of the (A) component of the composition for chemical mechanical polishing is 10 mV or more. When the content of the (C) component is noted as Mc (mass %) and the content of the (D) component is noted as Md (mass %), Mc/Md is 10 to 200.
A radiation sensitive resin composition includes: a resin including a repeating unit A which includes an acid-dissociable group; an onium salt including an organic acid anion moiety and an onium cation moiety; and a solvent. The onium salt includes at least one group selected from the group consisting of a pentafluorosulfanyl group, a pentafluorosulfanyloxy group, and a pentafluorosulfanylthio group.
A radiation-sensitive composition contains: a polymer, solubility of which in a developer solution is capable of being altered by an action of an acid; an anion represented by formula (1); and a radiation-sensitive onium cation containing an aromatic ring and at least one fluorine atom or fluorine atom-containing group bonded to the aromatic ring. Ar1 represents a group obtained by removing one hydrogen atom from a substituted or unsubstituted aromatic ring; n is an integer of 1 to 3; R1 represents a single bond or a substituted or unsubstituted divalent hydrocarbon group; L1 represents —O—, (*)n—R2—O—, or —NR3—, wherein in a case in which n is no less than 2, L1 represents (*)n—R2—O—; * denotes a site bonding to Ar1; R2 represents a substituted or unsubstituted hydrocarbon group having a valency of (n+1); and R3 represents a hydrogen atom or a monovalent hydrocarbon group.
A radiation-sensitive composition contains: a polymer, solubility of which in a developer solution is capable of being altered by an action of an acid; an anion represented by formula (1); and a radiation-sensitive onium cation containing an aromatic ring and at least one fluorine atom or fluorine atom-containing group bonded to the aromatic ring. Ar1 represents a group obtained by removing one hydrogen atom from a substituted or unsubstituted aromatic ring; n is an integer of 1 to 3; R1 represents a single bond or a substituted or unsubstituted divalent hydrocarbon group; L1 represents —O—, (*)n—R2—O—, or —NR3—, wherein in a case in which n is no less than 2, L1 represents (*)n—R2—O—; * denotes a site bonding to Ar1; R2 represents a substituted or unsubstituted hydrocarbon group having a valency of (n+1); and R3 represents a hydrogen atom or a monovalent hydrocarbon group.
A method for producing expanded beads that have excellent in-mold moldability and produce a molded article of polyethylene-based resin expanded beads having a low shrinkage rate while increasing a biomass degree is provided. In the method, the polyethylene-based resin particles is composed of a mixed resin, which is obtained by kneading linear low-density polyethylene and branched low-density polyethylene, wherein the branched low-density polyethylene has a biomass degree of 30% or more and a heat of fusion of 95 J/g or more; a blending amount of the branched low-density polyethylene in the mixed resin is 5% by mass or more and less than 40% by mass, where a total of the linear low-density polyethylene and the branched low-density polyethylene is 100% by mass; and a heat of fusion of the polyethylene-based resin particle is 90 J/g or more.
A radiation-sensitive composition includes: a polymer including a first structural unit including a partial structure obtained by substituting a hydrogen atom of a carboxy group or a hydrogen atom of a phenolic hydroxyl group, with an acid-labile group represented by formula (1); and a compound including an anionic moiety and a radiation-sensitive onium cationic moiety. The anionic moiety includes one anion group and an aromatic ring in which at least one hydrogen atom is substituted with an iodine atom. Ar1 represents a group obtained by removing one hydrogen atom from an aromatic ring in which at least one hydrogen atom is substituted with an iodine atom.
A radiation-sensitive composition includes: a polymer including a first structural unit including a partial structure obtained by substituting a hydrogen atom of a carboxy group or a hydrogen atom of a phenolic hydroxyl group, with an acid-labile group represented by formula (1); and a compound including an anionic moiety and a radiation-sensitive onium cationic moiety. The anionic moiety includes one anion group and an aromatic ring in which at least one hydrogen atom is substituted with an iodine atom. Ar1 represents a group obtained by removing one hydrogen atom from an aromatic ring in which at least one hydrogen atom is substituted with an iodine atom.
Provided are a method for forming a resist pattern that demonstrates excellent performance in sensitivity, resolution, etc. in an exposure step when a next-generation exposure technique is applied, and a radiation-sensitive resin composition. The method for forming a resist pattern includes step (1) of forming a resist film in which a content of a radiation-sensitive acid generator (C) is 0.1% by mass or less, step (2) of exposing the resist film to EUV or an electron beam (EB), and step (3) of developing the resist film exposed in the step (2).
A radiation-sensitive resin composition includes: an onium salt compound represented by formula (1), a resin including a structural unit which includes an acid-dissociable group, and a solvent. R1, R2, and R3 each independently represent a monovalent chain organic group having 1 to 10 carbon atoms; R4, R5, and R6 each independently represent a hydrogen atom, a fluorine atom, a monovalent hydrocarbon group, or a monovalent fluorinated hydrocarbon group; Rf1 represents a fluorine atom or a monovalent fluorinated hydrocarbon group; m1 represents an integer of 0 to 8; m2 represents an integer of 1 to 4; and Z+ represents a monovalent radiation-sensitive onium cation.
A radiation-sensitive resin composition includes: an onium salt compound represented by formula (1), a resin including a structural unit which includes an acid-dissociable group, and a solvent. R1, R2, and R3 each independently represent a monovalent chain organic group having 1 to 10 carbon atoms; R4, R5, and R6 each independently represent a hydrogen atom, a fluorine atom, a monovalent hydrocarbon group, or a monovalent fluorinated hydrocarbon group; Rf1 represents a fluorine atom or a monovalent fluorinated hydrocarbon group; m1 represents an integer of 0 to 8; m2 represents an integer of 1 to 4; and Z+ represents a monovalent radiation-sensitive onium cation.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
A radiation-sensitive resin composition includes: an onium salt compound represented by formula (1); a resin including a structural unit (I) represented by formula (2); and a solvent. R1, R2, and R3 are each independently a monovalent organic group having 1 to 10 carbon atoms, or two or three of R1, R2, and R3 taken together represent a monovalent or divalent group containing a cyclic structure having 3 to 20 carbon atoms together with the carbon atom to which the two or three of R1, R2, and R3 are bonded. R4 and R5 are each independently a hydrogen atom, a fluorine atom, a monovalent hydrocarbon group, or a monovalent fluorinated hydrocarbon group. R10 is a monovalent group including at least one structure selected from the group consisting of a lactone structure, a cyclic carbonate structure, and a sultone structure.
A radiation-sensitive resin composition includes: an onium salt compound represented by formula (1); a resin including a structural unit (I) represented by formula (2); and a solvent. R1, R2, and R3 are each independently a monovalent organic group having 1 to 10 carbon atoms, or two or three of R1, R2, and R3 taken together represent a monovalent or divalent group containing a cyclic structure having 3 to 20 carbon atoms together with the carbon atom to which the two or three of R1, R2, and R3 are bonded. R4 and R5 are each independently a hydrogen atom, a fluorine atom, a monovalent hydrocarbon group, or a monovalent fluorinated hydrocarbon group. R10 is a monovalent group including at least one structure selected from the group consisting of a lactone structure, a cyclic carbonate structure, and a sultone structure.
C08F 224/00 - Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a heterocyclic ring containing oxygen
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
A radiation-sensitive resin composition includes: an onium salt compound (1) represented by formula (1); an onium salt compound (2) different from the onium salt compound (1); a resin including a structural unit which includes an acid-dissociable group; and a solvent. W is a monovalent chain organic group having 1 to 40 carbon atoms, a monovalent cyclic organic group having 5 or less carbon atoms, or a monovalent group obtained by combining a monovalent chain organic group having 1 to 40 carbon atoms and a cyclic structure having 5 or less carbon atoms; R1 and R2 are each independently a hydrogen atom, a fluorine atom, a monovalent hydrocarbon group, or a monovalent fluorinated hydrocarbon group; R3, R4, and R5 are each independently a fluorine atom or a monovalent fluorinated hydrocarbon group; m1 is an integer of 1 to 8; and Z+ is a monovalent radiation-sensitive onium cation.
A radiation-sensitive resin composition includes: an onium salt compound (1) represented by formula (1); an onium salt compound (2) different from the onium salt compound (1); a resin including a structural unit which includes an acid-dissociable group; and a solvent. W is a monovalent chain organic group having 1 to 40 carbon atoms, a monovalent cyclic organic group having 5 or less carbon atoms, or a monovalent group obtained by combining a monovalent chain organic group having 1 to 40 carbon atoms and a cyclic structure having 5 or less carbon atoms; R1 and R2 are each independently a hydrogen atom, a fluorine atom, a monovalent hydrocarbon group, or a monovalent fluorinated hydrocarbon group; R3, R4, and R5 are each independently a fluorine atom or a monovalent fluorinated hydrocarbon group; m1 is an integer of 1 to 8; and Z+ is a monovalent radiation-sensitive onium cation.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
10.
RADIATION-SENSITIVE COMPOSITION, METHOD FOR FORMING RESIST PATTERN, POLYMER, AND COMPOUND
A radiation-sensitive composition contains a polymer having a partial structure represented by formula (1), and a radiation-sensitive acid generating substance. The radiation-sensitive composition satisfies one or more of requirement 1, requirement 2, and requirement 3. requirement 1: the partial structure represented by the formula (1) has two or more iodine atoms. requirement 2: the radiation-sensitive acid generating substance contains an onium salt having two or more iodine atoms. requirement 3: the partial structure represented by the formula (1) has an iodine atom, and the radiation-sensitive acid generating substance contains an onium salt having an iodine atom. In the formula (1), Y1 represents a divalent group represented by formula (2-1) or formula (2-2).
A radiation-sensitive composition contains a polymer having a partial structure represented by formula (1), and a radiation-sensitive acid generating substance. The radiation-sensitive composition satisfies one or more of requirement 1, requirement 2, and requirement 3. requirement 1: the partial structure represented by the formula (1) has two or more iodine atoms. requirement 2: the radiation-sensitive acid generating substance contains an onium salt having two or more iodine atoms. requirement 3: the partial structure represented by the formula (1) has an iodine atom, and the radiation-sensitive acid generating substance contains an onium salt having an iodine atom. In the formula (1), Y1 represents a divalent group represented by formula (2-1) or formula (2-2).
C07C 309/12 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing oxygen atoms bound to the carbon skeleton containing esterified hydroxy groups bound to the carbon skeleton
C07C 323/09 - Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and halogen atoms, or nitro or nitroso groups bound to the same carbon skeleton having sulfur atoms of thio groups bound to carbon atoms of six-membered aromatic rings of the carbon skeleton
C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
An organometallic precursor solution comprising an organic solvent, a radiation sensitive organometallic precursor composition with hydrolysable metal ligands, and a radical scavenger additive is described. The radical scavenger additive or a blend of radical scavenger additives can provide for improvements to the stability of an organometallic precursor solution, such as improvements to storage stability, shelf-life, and/or batch-to-batch reproducibility through mitigation of the effects of reactive compounds in the environment, such as oxygen. A structure having a substrate, a radiation patternable organometallic coating composition, and a radical scavenging additive is also described. The radical scavenger additive or a blend thereof can result in patterning improvements, such as by improving coating quality and reducing patterning variability. Methods of using a radical scavenging additive in the formation of a structure comprising a radiation patternable organometallic film are described. Methods of producing a container of a stabilized organometallic precursor composition are also described.
A composition includes a compound including an iodine atom, and a solvent. The compound including an iodine atom is a polymer including a repeating unit represented by formula (1), an aromatic ring-containing compound including an iodine atom and having a molecular weight of 750 or more and 3,000 or less, or a combination thereof. A content ratio of the compound including an iodine atom to components other than the solvent in the composition for forming an underlayer film is 50% by mass or more. In the formula (1), Ar1 is a divalent group including an aromatic ring having 5 to 40 ring atoms; and R0 is a hydrogen atom or a monovalent organic group having 1 to 40 carbon atoms, R1 is a monovalent organic group having 1 to 40 carbon atoms, and at least one of Ar1, R0 or R1 includes an iodine atom.
A composition includes a compound including an iodine atom, and a solvent. The compound including an iodine atom is a polymer including a repeating unit represented by formula (1), an aromatic ring-containing compound including an iodine atom and having a molecular weight of 750 or more and 3,000 or less, or a combination thereof. A content ratio of the compound including an iodine atom to components other than the solvent in the composition for forming an underlayer film is 50% by mass or more. In the formula (1), Ar1 is a divalent group including an aromatic ring having 5 to 40 ring atoms; and R0 is a hydrogen atom or a monovalent organic group having 1 to 40 carbon atoms, R1 is a monovalent organic group having 1 to 40 carbon atoms, and at least one of Ar1, R0 or R1 includes an iodine atom.
G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
A method for producing expanded beads having a bulk density of 10 to 240 kg/m3, the method including expanding resin particles containing a mixed resin of at least two linear low-density polyethylenes as a base resin, wherein the mixed resin contains polyethylene A having a biomass degree of 50% or more and a melt flow rate (MFR) of 0.1 to 3 g/10 min and polyethylene B; a difference between the MFR of A and the MFR of B is 0 to 2 g/10 min; a mass ratio of A to B is 5/95 to 95/5; the mixed resin has a biomass degree of 5% or more; the expanded bead has a crystal structure where a melting peak intrinsic to the linear low-density polyethylene and a high-temperature peak on a higher temperature side appear on a DSC curve; and a heat of fusion at the high-temperature peak is 10 to 50 J/g.
A radiation-sensitive resin composition includes a solvent and a resin including a structural unit A which includes an acid-dissociable group and a structural unit D which includes an aromatic ring. The aromatic ring has a phenolic hydroxy group and an alkyl group which is adjacent to the phenolic hydroxy group. The radiation-sensitive resin composition satisfies Condition 1 and/or Condition 2. Condition 1: the resin further includes a structural unit B which includes an organic acid anion moiety and an onium cation moiety including an aromatic ring structure having a fluorine atom. Condition 2: the radiation-sensitive resin composition further includes an onium salt which includes an organic acid anion moiety and an onium cation moiety including an aromatic ring structure having a fluorine atom.
G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
C08F 220/28 - Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
A radiation-sensitive composition includes a polymer including: an acid-labile side chain including an acid-labile group; and an iodo group-containing side chain including two or more iodo groups and one or more radiation-sensitive onium cation structure(s). A method of forming a resist pattern includes: applying the radiation-sensitive composition directly or indirectly on a substrate to form a resist film; exposing the resist film; and developing the resist film exposed. A polymer includes: an acid-labile side chain including an acid-labile group; and an iodo group-containing side chain including two or more iodo groups and one or more radiation-sensitive onium cation structure(s). A monomer is a vinyl compound including two or more iodo groups and one or more radiation-sensitive onium cation structure(s).
C07C 309/12 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing oxygen atoms bound to the carbon skeleton containing esterified hydroxy groups bound to the carbon skeleton
C07C 321/30 - Sulfides having the sulfur atom of at least one thio group bound to two carbon atoms of six-membered aromatic rings
C07C 323/09 - Thiols, sulfides, hydropolysulfides or polysulfides substituted by halogen, oxygen or nitrogen atoms, or by sulfur atoms not being part of thio groups containing thio groups and halogen atoms, or nitro or nitroso groups bound to the same carbon skeleton having sulfur atoms of thio groups bound to carbon atoms of six-membered aromatic rings of the carbon skeleton
C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
A method for producing a geopolymer foam, comprising obtaining a reaction slurry containing aluminosilicate, alkali metal silicate, aggregate, and water, adding a foaming agent to the reaction slurry to form a foaming slurry, and heating the foaming slurry, wherein the aggregate used is mica with an average particle size of 50 to 500 μm and a volume fraction (X) of particles with a particle size of 10 μm or less of 3% or less, and wherein the viscosity of the reaction slurry at 23° C. is 3000 to 15000 mPa·s.
C04B 28/00 - Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements
A method for forming a resist pattern, includes: forming a metal-containing resist film directly or indirectly on a substrate; laminating a protective film on the metal-containing resist film by applying a composition for forming a protective film; exposing to light the metal-containing resist film on which the protective film is laminated; and removing a portion of the exposed metal-containing resist film to form a pattern.
G03F 7/09 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
G03F 7/32 - Liquid compositions therefor, e.g. developers
An expanded bead containing a linear low-density polyethylene as a base resin, wherein the linear low-density polyethylene has a biomass degree of 40% or more as measured according to ASTM D 6866; the expanded bead has a crystal structure where a melting peak intrinsic to the linear low-density polyethylene (intrinsic peak) and at least one melting peak on a higher temperature side than the intrinsic peak (high-temperature peak) appear on a DSC curve drawn by heating the expanded bead from 23° C. to 200° C. at a heating rate of 10° C./min; a total heat of fusion of the expanded bead is 70 J/g or more and 100 J/g or less; and a heat of fusion at the high-temperature peak is 10 J/g or more and 50 J/g or less.
A method for producing polypropylene-based resin expanded beads includes dispersion, blowing agent impregnation, and foaming steps. Beads used in the dispersion step include a core layer having a polypropylene-based resin as a base material resin, and a fusion-bonding layer covering core layer; the beads fusion-bonding layer includes carbon black and a NOR-type hindered amine; a carbon black blending ratio is adjusted to 0.5 wt % or more and 5 wt % or less; and an amine blending ratio of the beads is adjusted to 0.03 wt % or more and 0.5 wt % or less; the polypropylene-based resin expanded beads have a surface on which a fusion-bonding layer is located; the fusion-bonding layer includes the carbon black and hindered amine; a carbon black blending ratio is 0.5 wt % or more and 5 wt % or less; and a blending ratio of the hindered amine is 0.03 wt % or more and 0.5 wt % or less.
A method for producing foamable polyamide-based resin particles according to the present invention includes impregnating polyamide-based resin particles with an inorganic physical foaming agent in a gas phase, wherein the polyamide-based resin particles have a water content of at least 2.5 mass % and contain 0.5-10 mass % of carbon black. Foamed polyamide-based resin particles are obtained by heating and foaming the foamable polyamide resin particles.
What is provided is a therapeutic agent that is effective for the treatment of ovarian clear cell carcinoma. A therapeutic agent for ovarian clear cell carcinoma includes, as an active ingredient, a proteasome inhibitor. Furthermore, in the therapeutic agent for ovarian clear cell carcinoma, the proteasome inhibitor is a substance that reversibly or irreversibly binds to a 20s proteasome-β5 subunit and inhibits a chymotrypsin-like activity. Moreover, in the therapeutic agent for ovarian clear cell carcinoma, the proteasome is a 26s proteasome. In addition, in the therapeutic agent for ovarian clear cell carcinoma, a content proportion of the proteasome inhibitor is 80% by mass or more, 90% by mass or more, or 100% by mass.
A method for producing a molded article of thermoplastic resin expanded beads that includes cracking filling and in-mold molding. The expanded beads have a columnar shape and a defective portion that is a through hole and/or a groove. A ratio Ca/A of an average cross-sectional area Ca per defective portion to an average cross-sectional area A of a cut surface of the expanded bead obtained by cutting the expanded bead at a center in an axial direction along a plane perpendicular to the axial direction is 0.01 or more and 0.20 or less, and a ratio Ct/A of a total cross-sectional area Ct of the defective portion to the average cross-sectional area A of the expanded bead is 0.02 or more and 0.20 or less. When the mold is completely closed, a filling rate F of the expanded beads is 125% or more and 220% or less.
B29C 44/34 - Component parts, details or accessoriesAuxiliary operations
B29C 44/02 - Shaping by internal pressure generated in the material, e.g. swelling or foaming for articles of definite length, i.e. discrete articles
B29C 44/44 - Feeding the material to be shaped into a closed space, i.e. to make articles of definite length in the form of expandable particles or beads
A method for producing a molded article of thermoplastic resin expanded beads includes a cracking filling step and an in-mold molding step. Expanded beads to be used in the cracking filling step each have a columnar shape and each have one or more defective portions of one or two kinds, the defective portions being selected from the group consisting of through holes and grooves. A molding cavity of a mold has a first portion having a length in an opening/closing direction of the mold greater than an average length LA and a second portion shorter than the average length LA. In the cracking filling step, a difference P2max−P1min between a minimum value P1min of the compression rate of the first portion and a maximum value P2max of the compression rate of the second portion is 5% or more and 100% or less.
B29C 39/00 - Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressureApparatus therefor
B29C 39/10 - Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressureApparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
A radiation-sensitive composition contains a polymer having an acid-releasable group, and a compound represented by formula (1). In the formula (1), L1 represents a group having a (thio)acetal ring or the like. W1 represents a single bond or a (b+1)-valent organic group having 1 to 40 carbon atoms. R1, R2, and R3 each independently represent a hydrogen atom, a hydrocarbon group having 1 to 10 carbon atoms, a fluorine atom, or a fluoroalkyl group. Rf represents a fluorine atom or a fluoroalkyl group. a represents an integer of 0 to 8. b represents an integer of 1 to 4. d represents 1 or 2. When a represents 2 or more, a plurality of R1 are the same or different, and a plurality of R2 are the same or different. M+ represents a monovalent cation.
A radiation-sensitive composition contains a polymer having an acid-releasable group, and a compound represented by formula (1). In the formula (1), L1 represents a group having a (thio)acetal ring or the like. W1 represents a single bond or a (b+1)-valent organic group having 1 to 40 carbon atoms. R1, R2, and R3 each independently represent a hydrogen atom, a hydrocarbon group having 1 to 10 carbon atoms, a fluorine atom, or a fluoroalkyl group. Rf represents a fluorine atom or a fluoroalkyl group. a represents an integer of 0 to 8. b represents an integer of 1 to 4. d represents 1 or 2. When a represents 2 or more, a plurality of R1 are the same or different, and a plurality of R2 are the same or different. M+ represents a monovalent cation.
A radiation-sensitive composition includes: a first polymer comprising a structural unit (I) having an acid-dissociable group; a second polymer comprising a structural unit (i) represented by formula (f1); and a solvent. The acid-dissociable group has an iodo group. RK1 is a hydrogen atom, a fluorine atom, or the like; LY1 is a divalent hydrocarbon group having 1 to 10 carbon atoms; LY2 is —COO—* or —OCO—*, *is a bond on an Rf1 side; Rf1 is a monovalent hydrocarbon group having 1 to 10 carbon atoms or a monovalent fluorinated hydrocarbon group having 1 to 10 carbon atoms; Rf2 and Rf3 are each independently a fluorine atom or a monovalent fluorinated hydrocarbon group having 1 to 10 carbon atoms; s is an integer of 0 to 3, and when Rf1 is the monovalent hydrocarbon group having 1 to 10 carbon atoms, s is an integer of 1 to 3.
A radiation-sensitive composition includes: a first polymer comprising a structural unit (I) having an acid-dissociable group; a second polymer comprising a structural unit (i) represented by formula (f1); and a solvent. The acid-dissociable group has an iodo group. RK1 is a hydrogen atom, a fluorine atom, or the like; LY1 is a divalent hydrocarbon group having 1 to 10 carbon atoms; LY2 is —COO—* or —OCO—*, *is a bond on an Rf1 side; Rf1 is a monovalent hydrocarbon group having 1 to 10 carbon atoms or a monovalent fluorinated hydrocarbon group having 1 to 10 carbon atoms; Rf2 and Rf3 are each independently a fluorine atom or a monovalent fluorinated hydrocarbon group having 1 to 10 carbon atoms; s is an integer of 0 to 3, and when Rf1 is the monovalent hydrocarbon group having 1 to 10 carbon atoms, s is an integer of 1 to 3.
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
C08L 25/18 - Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
C08L 33/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
C08L 33/16 - Homopolymers or copolymers of esters containing halogen atoms
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
An inorganic foam comprising an inorganic polymer having leucite crystal structure as a base material, the area of the peak derived from leucite crystal in the X-ray diffraction spectrum of the inorganic foam satisfies the following formula (1): D(geo)/D(pur)≥0.5 (1). In formula (1), D(geo) represents the area of the peak located at 2θ=27.3° derived from leucite crystal in the X-ray diffraction spectrum of the inorganic foam, and D(pur) represents the area of the peak located at 2θ=27.3° derived from leucite crystal in the X-ray diffraction spectrum of leucite pure material.
C04B 38/10 - Porous mortars, concrete, artificial stone or ceramic warePreparation thereof by using foaming agents
C04B 35/18 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on silicates other than clay rich in aluminium oxide
27.
Radiation-Sensitive Composition and Method for Forming Resist Pattern
A radiation-sensitive composition contains: (A) a polymer, and (B) a radiation-sensitive acid-generator formed of an onium cation and an organic anion having 4 or more iodine atoms, the onium cation having at least one group Rf1 selected from the group consisting of a fluoroalkyl group and a fluoro group (excluding a fluoro group in the fluoroalkyl group).
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
28.
METHOD FOR PRODUCING ABRASIVE GRAINS, COMPOSITION FOR CHEMICAL MECHANICAL POLISHING, AND POLISHING METHOD
The present invention provides: a composition for chemical mechanical polishing, a polishing method which uses this composition for chemical mechanical polishing, and a method for producing abrasive grains which are used therein. The present invention also provides: a composition for chemical mechanical polishing, the composition being capable of polishing a silicon oxide film at a high polishing rate, while having excellent storage stability; a polishing method which uses this composition for chemical mechanical polishing; and a method for producing abrasive grains which are used therein. A method for producing abrasive grains according to the present invention comprises a step in which particles each having a surface to which a hydroxyl group (—OH) is immobilized via a covalent bond, an alkoxysilane having an epoxy group, and a basic compound are mixed and heated.
A photosensitive resin composition includes a polymer (A), a photoacid generator (B), and an organic solvent (C). The polymer (A) includes: a structural unit having a phenolic hydroxy group; and a (meth)acrylate-derived structural unit having an acid-dissociable group. The organic solvent (C) includes 3-ethoxyethyl propionate. A solid content concentration of the photosensitive resin composition is 30 mass % or more.
C08K 5/45 - Heterocyclic compounds having sulfur in the ring
C09D 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
C09D 161/18 - Condensation polymers of aldehydes or ketones with aromatic hydrocarbons or their halogen derivatives only
C25D 5/02 - Electroplating of selected surface areas
G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
H01L 21/288 - Deposition of conductive or insulating materials for electrodes from a liquid, e.g. electrolytic deposition
30.
RADIATION-SENSITIVE COMPOSITION AND METHOD FOR FORMING RESIST PATTERN
A radiation-sensitive composition contains: (A) a polymer including a structural unit (U) represented by the following formula (1); and (B) a radiation-sensitive acid-generator formed of an onium cation having at least one group Rf1 selected from the group consisting of a fluoroalkyl group and a fluoro group (excepting a fluoro group in the fluoroalkyl group) and an organic anion having an iodine atom. In formula (1), R1 represents a hydrogen atom, a methyl group, or the like. X1 represents a single bond, an ether bond, an ester bond, or the like. Ar1 represents a cyclic group bound to X1 via an aromatic ring. A hydroxy group or group —ORY is bound to an atom adjacent to the atom bound to X1, among the atoms forming the aromatic group in Ar1. RY represents an acid-releasable group.
A radiation-sensitive composition contains: (A) a polymer including a structural unit (U) represented by the following formula (1); and (B) a radiation-sensitive acid-generator formed of an onium cation having at least one group Rf1 selected from the group consisting of a fluoroalkyl group and a fluoro group (excepting a fluoro group in the fluoroalkyl group) and an organic anion having an iodine atom. In formula (1), R1 represents a hydrogen atom, a methyl group, or the like. X1 represents a single bond, an ether bond, an ester bond, or the like. Ar1 represents a cyclic group bound to X1 via an aromatic ring. A hydroxy group or group —ORY is bound to an atom adjacent to the atom bound to X1, among the atoms forming the aromatic group in Ar1. RY represents an acid-releasable group.
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
C08F 220/28 - Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
31.
CRYSTALLINE THERMOPLASTIC RESIN EXPANDED BEAD, MOLDED ARTICLE OF CRYSTALLINE THERMOPLASTIC RESIN EXPANDED BEADS, AND METHOD FOR PRODUCING SAME
A molded article of expanded beads is obtained by mutual fusion-bonding of columnar crystalline thermoplastic resin expanded beads each having no through-hole. The molded article ratio of the molded article of crystalline thermoplastic resin expanded beads is 15 times or more and 90 times or less. The molded article of crystalline thermoplastic resin expanded beads has a closed cell content of 90% or more. The molded article of crystalline thermoplastic resin expanded beads has an open cell content of 2% or more and 12% or less.
Provided is a method of producing a gene-modified T cell population, including mixing a cell population containing T cells with beads each having bound thereto a virus containing a target gene to introduce the target gene into each of the cells of the cell population, wherein the cell population containing the T cells is cultured in a solution containing a CD3 signal activator that is present without being immobilized on a solid phase.
A composition includes a polymer containing a repeating unit represented by Formula (1). —N(R′)—R3—N(R′)— is a structure derived from a dimer diamine that is unsubstituted or substituted by a substituent, R′, R1, and R2 each are independently a hydrogen atom, a halogen atom, a hydrocarbon group that is unsubstituted or substituted by a substituent and has 1 to 20 carbon atoms, a heterocyclic aliphatic group that is unsubstituted or substituted by a substituent and has 3 to 20 carbon atoms, or a heterocyclic aromatic group that is unsubstituted or substituted by a substituent and has 3 to 20 carbon atoms, and —NR1R2 may be a nitrogen-containing heterocyclic group which has 5 to 20 ring-constituting atoms and in which R1 and R2 are bonded to each other.
A composition includes a polymer containing a repeating unit represented by Formula (1). —N(R′)—R3—N(R′)— is a structure derived from a dimer diamine that is unsubstituted or substituted by a substituent, R′, R1, and R2 each are independently a hydrogen atom, a halogen atom, a hydrocarbon group that is unsubstituted or substituted by a substituent and has 1 to 20 carbon atoms, a heterocyclic aliphatic group that is unsubstituted or substituted by a substituent and has 3 to 20 carbon atoms, or a heterocyclic aromatic group that is unsubstituted or substituted by a substituent and has 3 to 20 carbon atoms, and —NR1R2 may be a nitrogen-containing heterocyclic group which has 5 to 20 ring-constituting atoms and in which R1 and R2 are bonded to each other.
C09D 151/08 - Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsCoating compositions based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
C09D 183/10 - Block or graft copolymers containing polysiloxane sequences
34.
RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING RESIST PATTERN
A radiation-sensitive resin composition includes: a first polymer and a compound. A solubility of the first polymer in a developer solution is capable of being altered by an action of an acid. The first polymer includes: a first structural unit containing a partial structure obtained by substituting a hydrogen atom of a carboxy group, a phenolic hydroxy group, or an amide group with a group represented by the following formula (1); and a second structural unit containing a phenolic hydroxy group. The compound includes: a monovalent radiation-sensitive onium cation containing an aromatic ring obtained by substituting at least one hydrogen atom with a fluorine atom or a fluorine atom-containing group; and a monovalent organic acid anion.
A radiation-sensitive resin composition includes: a first polymer and a compound. A solubility of the first polymer in a developer solution is capable of being altered by an action of an acid. The first polymer includes: a first structural unit containing a partial structure obtained by substituting a hydrogen atom of a carboxy group, a phenolic hydroxy group, or an amide group with a group represented by the following formula (1); and a second structural unit containing a phenolic hydroxy group. The compound includes: a monovalent radiation-sensitive onium cation containing an aromatic ring obtained by substituting at least one hydrogen atom with a fluorine atom or a fluorine atom-containing group; and a monovalent organic acid anion.
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
35.
RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING RESIST PATTERN
A radiation-sensitive resin composition includes a polymer, solubility of which in a developer solution is capable of being altered by an action of an acid, and which has a first structural unit represented by the following formula (1); a radiation-sensitive acid generating agent; and an acid diffusion control agent having a monovalent radiation-sensitive onium cation and a monovalent organic acid anion.
A radiation-sensitive resin composition includes a polymer, solubility of which in a developer solution is capable of being altered by an action of an acid, and which has a first structural unit represented by the following formula (1); a radiation-sensitive acid generating agent; and an acid diffusion control agent having a monovalent radiation-sensitive onium cation and a monovalent organic acid anion.
A method for manufacturing a semiconductor substrate includes: applying a composition for forming a resist underlayer film directly or indirectly to a substrate to form a resist underlayer film; applying a composition for forming a resist film to the resist underlayer film to form a resist film; exposing the resist film to radiation; and developing at least the exposed resist film. The composition for forming a resist underlayer film includes a polymer and a solvent. The polymer includes a repeating unit (1) which includes an organic sulfonic acid anion moiety and an onium cation moiety.
C08G 61/12 - Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
A radiation-sensitive resin composition includes: an onium salt compound represented by formula (1), a resin including a structural unit having an acid-dissociable group, and an alcohol-based solvent having a boiling point of 90° C. or higher. R1 is a substituted or unsubstituted monovalent hydrocarbon group or a group including a divalent hetero atom-containing group between two adjacent carbon atoms of the hydrocarbon group; R2 and R3 are each independently a hydrogen atom or a monovalent hydrocarbon group, one of Rf11 and Rf12 is a fluorine atom, and the other is a fluorine atom or a monovalent fluorinated hydrocarbon group, m1 is an integer of 1 to 3; m2 is an integer of 0 to 8; and Z1+ represents a monovalent radiation-sensitive onium cation.
A radiation-sensitive resin composition includes: an onium salt compound represented by formula (1), a resin including a structural unit having an acid-dissociable group, and an alcohol-based solvent having a boiling point of 90° C. or higher. R1 is a substituted or unsubstituted monovalent hydrocarbon group or a group including a divalent hetero atom-containing group between two adjacent carbon atoms of the hydrocarbon group; R2 and R3 are each independently a hydrogen atom or a monovalent hydrocarbon group, one of Rf11 and Rf12 is a fluorine atom, and the other is a fluorine atom or a monovalent fluorinated hydrocarbon group, m1 is an integer of 1 to 3; m2 is an integer of 0 to 8; and Z1+ represents a monovalent radiation-sensitive onium cation.
A radiation-sensitive resin composition includes: a first onium salt compound represented by formula (1); a second onium salt compound represented by formula (2); a resin including a structural unit having an acid-dissociable group; and a solvent. R1 is a substituted or unsubstituted monovalent hydrocarbon group or the like; R2 and R3 are each independently a hydrogen atom or a monovalent hydrocarbon group; one of Rf11 and Rf12 is a fluorine atom, and the other is a fluorine atom or a monovalent fluorinated hydrocarbon group; and Z1+ represents a monovalent radiation-sensitive onium cation. R4 is a monovalent organic group including a cyclic structure; Rf21 and Rf22 each independently represent a fluorine atom or a monovalent fluorinated hydrocarbon group; and Z2+ represents a monovalent radiation-sensitive onium cation.
A radiation-sensitive resin composition includes: a first onium salt compound represented by formula (1); a second onium salt compound represented by formula (2); a resin including a structural unit having an acid-dissociable group; and a solvent. R1 is a substituted or unsubstituted monovalent hydrocarbon group or the like; R2 and R3 are each independently a hydrogen atom or a monovalent hydrocarbon group; one of Rf11 and Rf12 is a fluorine atom, and the other is a fluorine atom or a monovalent fluorinated hydrocarbon group; and Z1+ represents a monovalent radiation-sensitive onium cation. R4 is a monovalent organic group including a cyclic structure; Rf21 and Rf22 each independently represent a fluorine atom or a monovalent fluorinated hydrocarbon group; and Z2+ represents a monovalent radiation-sensitive onium cation.
A radiation-sensitive resin composition includes: a first onium salt compound represented by formula (1); a second onium salt compound represented by formula (2); a resin including an acid-dissociable group; and a solvent. R1 is a substituted or unsubstituted monovalent hydrocarbon group or the like; R2 and R3 are each independently a hydrogen atom, a fluorine atom, or the like; and Z+ represents a monovalent radiation-sensitive onium cation. R4 is a monovalent organic group; one of Rf21 and Rf22 is a fluorine atom, and the other is a fluorine atom or a monovalent fluorinated hydrocarbon group; Ar is a monovalent organic group including an aromatic ring; R5, R6, R7, and R8 each independently represent a hydrogen atom, a hydroxy group, a halogen atom, or a monovalent organic group; and X is a single bond or a divalent hetero atom-containing group.
A radiation-sensitive resin composition includes: a first onium salt compound represented by formula (1); a second onium salt compound represented by formula (2); a resin including an acid-dissociable group; and a solvent. R1 is a substituted or unsubstituted monovalent hydrocarbon group or the like; R2 and R3 are each independently a hydrogen atom, a fluorine atom, or the like; and Z+ represents a monovalent radiation-sensitive onium cation. R4 is a monovalent organic group; one of Rf21 and Rf22 is a fluorine atom, and the other is a fluorine atom or a monovalent fluorinated hydrocarbon group; Ar is a monovalent organic group including an aromatic ring; R5, R6, R7, and R8 each independently represent a hydrogen atom, a hydroxy group, a halogen atom, or a monovalent organic group; and X is a single bond or a divalent hetero atom-containing group.
A radiation-sensitive resin composition includes: a first onium salt compound represented by formula (1); a second onium salt compound represented by formula (2); a resin including a structural unit having an acid-dissociable group; and a solvent. R1 is a substituted or unsubstituted monovalent hydrocarbon group or a group including a divalent hetero atom-containing group between two adjacent carbon atoms of the hydrocarbon group; R2 and R3 are each independently a hydrogen atom, a fluorine atom, or the like; and one of Rf11 and Rf12 is a fluorine atom, and the other is a hydrogen atom, a fluorine atom, or a monovalent fluorinated hydrocarbon group. R4 is a monovalent organic group in which neither a fluorine atom nor a fluorinated hydrocarbon group is bonded to an atom adjacent to the sulfur atom.
A radiation-sensitive resin composition includes: a first onium salt compound represented by formula (1); a second onium salt compound represented by formula (2); a resin including a structural unit having an acid-dissociable group; and a solvent. R1 is a substituted or unsubstituted monovalent hydrocarbon group or a group including a divalent hetero atom-containing group between two adjacent carbon atoms of the hydrocarbon group; R2 and R3 are each independently a hydrogen atom, a fluorine atom, or the like; and one of Rf11 and Rf12 is a fluorine atom, and the other is a hydrogen atom, a fluorine atom, or a monovalent fluorinated hydrocarbon group. R4 is a monovalent organic group in which neither a fluorine atom nor a fluorinated hydrocarbon group is bonded to an atom adjacent to the sulfur atom.
C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
C08F 220/28 - Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
C08F 220/36 - Esters containing nitrogen containing oxygen in addition to the carboxy oxygen
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
41.
METHOD FOR PRODUCING POLYAMIDE-BASED RESIN EXPANDED BEADS AND METHOD FOR PRODUCING POLYAMIDE-BASED RESIN EXPANDED MOLDED ARTICLE
A polyamide-based resin melt obtained by melt-kneading a base resin, an organic compound-based additive (A), and an iodide-based additive (X) is granulated to prepare polyamide-based resin particles. The polyamide-based resin particles are expanded by using a physical blowing agent to produce polyamide-based resin expanded beads. The polyamide-based resin expanded beads are in-mold molded to produce a polyamide-based resin expanded molded article. The organic compound-based additive (A) is made of a hindered phenol-based compound and/or an organophosphorus-based compound. The iodide-based additive (X) is made of copper iodide, or copper iodide and potassium iodide.
C08J 3/20 - Compounding polymers with additives, e.g. colouring
C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof
C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
42.
POLYAMIDE RESIN FOAMED PARTICLES AND METHOD FOR PRODUCING SAME
A polyamide-based resin expanded bead comprising a foam layer formed by expanding a polyamide-based resin, wherein on a first DSC curve and a second DSC curve, the first DSC curve has a melting peak (intrinsic peak) having a peak top temperature on a low temperature side equal to or lower than a peak top temperature of a melting peak of the second DSC curve and a melting peak (high temperature peak) having a peak top temperature on a high temperature side exceeding the peak top temperature of the second DSC curve, and, the peak top temperature of the melting peak of the second DSC curve is 180° C. or higher and 280° C. or lower, and the polyamide-based resin expanded bead has an apparent density of 10 to 300 kg/m3 and a closed cell ratio of 85% or more.
A method for producing a semiconductor substrate includes: applying a silicon-containing composition directly or indirectly to a substrate to form a silicon-containing film; applying a composition for forming a resist film to the silicon-containing film to form a resist film; exposing the resist film to radiation; and developing at least the exposed resist film. The silicon-containing composition includes: a silicon-containing compound; a polymer including a structural unit represented by formula (1); and a solvent. A content of the silicon-containing compound in the silicon-containing composition relative to 100% by mass of components other than the solvent in the silicon-containing composition is from 50% to 99.9% by mass. RA1 is a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; and RA2 is a monovalent organic group having 1 to 20 carbon atoms.
A method for producing a semiconductor substrate includes: applying a silicon-containing composition directly or indirectly to a substrate to form a silicon-containing film; applying a composition for forming a resist film to the silicon-containing film to form a resist film; exposing the resist film to radiation; and developing at least the exposed resist film. The silicon-containing composition includes: a silicon-containing compound; a polymer including a structural unit represented by formula (1); and a solvent. A content of the silicon-containing compound in the silicon-containing composition relative to 100% by mass of components other than the solvent in the silicon-containing composition is from 50% to 99.9% by mass. RA1 is a hydrogen atom or a monovalent organic group having 1 to 20 carbon atoms; and RA2 is a monovalent organic group having 1 to 20 carbon atoms.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
C08K 5/5419 - Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
C09D 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
An enzyme sensor may be configured to measure a measurement target substance included in a secretion of a living body. The enzyme sensor may include a layered structure including, in this order, (a) an absorber layer configured to absorb the secretion, (b) an enzyme layer containing an enzyme, (c) a mediator layer, and (d) an electrode part. The absorber layer may include a polymeric material having a chemically bound crosslinked structure.
A61B 5/1486 - Measuring characteristics of blood in vivo, e.g. gas concentration or pH-value using chemical or electrochemical methods, e.g. by polarographic means using enzyme electrodes, e.g. with immobilised oxidase
A61B 5/145 - Measuring characteristics of blood in vivo, e.g. gas concentration or pH-value
C12Q 1/00 - Measuring or testing processes involving enzymes, nucleic acids or microorganismsCompositions thereforProcesses of preparing such compositions
G06F 9/06 - Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
G06F 15/00 - Digital computers in generalData processing equipment in general
45.
POLYAMIDE RESIN FOAMED PARTICLES AND METHOD FOR PRODUCING SAME
A polyamide-based resin expanded bead comprising a foam layer formed by expanding a polyamide-based resin, wherein on a first DSC curve and a second DSC curve, the first DSC curve has a melting peak (intrinsic peak) having a peak top temperature on a low temperature side equal to or lower than a peak top temperature of a melting peak of the second DSC curve and a melting peak (high temperature peak) having a peak top temperature on a high temperature side exceeding the peak top temperature of the second DSC curve, and, the peak top temperature of the melting peak of the second DSC curve is 180° C. or higher and 280° C. or lower, and the polyamide-based resin expanded bead has an apparent density of 10 to 300 kg/m3 and a closed cell ratio of 85% or more.
A radiation-sensitive composition contains a polymer having an acid-releasable group, and a compound (Q) represented by formula (1). In the formula (1), L1 represents an ester group, —CO—NR3—, a (thio)ether group, or a sulfonyl group. R4 represents a hydrogen atom, a substituted or unsubstituted C1 to C20 monovalent hydrocarbon group, a halogen atom, a hydroxy group, or a nitro group. R5 represents a C1 to C20 monovalent hydrocarbon group, a C1 to C20 monovalent halogenated hydrocarbon group, or a halogen atom, and optionally two R5s taken together represent an alicyclic structure together with the carbon atom(s) between the two R5s. L2 represents a single bond or a divalent linking group.
A radiation-sensitive composition contains a polymer having an acid-releasable group, and a compound (Q) represented by formula (1). In the formula (1), L1 represents an ester group, —CO—NR3—, a (thio)ether group, or a sulfonyl group. R4 represents a hydrogen atom, a substituted or unsubstituted C1 to C20 monovalent hydrocarbon group, a halogen atom, a hydroxy group, or a nitro group. R5 represents a C1 to C20 monovalent hydrocarbon group, a C1 to C20 monovalent halogenated hydrocarbon group, or a halogen atom, and optionally two R5s taken together represent an alicyclic structure together with the carbon atom(s) between the two R5s. L2 represents a single bond or a divalent linking group.
C07C 69/75 - Esters of carboxylic acids having an esterified carboxyl group bound to a carbon atom of a ring other than a six-membered aromatic ring of acids with a six-membered ring
C07C 309/12 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing oxygen atoms bound to the carbon skeleton containing esterified hydroxy groups bound to the carbon skeleton
C07C 309/17 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing carboxyl groups bound to the carbon skeleton
C07C 309/27 - Sulfonic acids having sulfo groups bound to carbon atoms of rings other than six-membered aromatic rings of a carbon skeleton containing carboxyl groups bound to the carbon skeleton
C07D 207/416 - 2,5-Pyrrolidine-diones with hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals, directly attached to other ring carbon atoms
C07D 307/00 - Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom
C07D 307/94 - Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom spiro-condensed with carbocyclic rings or ring systems, e.g. griseofulvins
C07D 311/00 - Heterocyclic compounds containing six-membered rings having one oxygen atom as the only hetero atom, condensed with other rings
C07D 313/06 - Seven-membered rings condensed with carbocyclic rings or ring systems
A radiation-sensitive composition contains a polymer having an acid-releasable group, and a compound represented by formula (1). In the formula (1), A1 represents a (m+n+2)-valent aromatic ring group. Both —OH and —COO− are bound to a common benzene ring in A1. Atom to which —OH is bound is located next to an atom to which —COO31 is bound. R1 represents a monovalent group comprising a cyclic (thio)acetal structure. m is an integer of ≥0. n is an integer of ≥0. M+ represents a monovalent organic cation.
A radiation-sensitive composition contains a polymer having an acid-releasable group, and a compound represented by formula (1). In the formula (1), A1 represents a (m+n+2)-valent aromatic ring group. Both —OH and —COO− are bound to a common benzene ring in A1. Atom to which —OH is bound is located next to an atom to which —COO31 is bound. R1 represents a monovalent group comprising a cyclic (thio)acetal structure. m is an integer of ≥0. n is an integer of ≥0. M+ represents a monovalent organic cation.
A polypropylene-based resin expanded bead, in which the melting point Tma of a polypropylene-based resin (a) constituting a core layer in an expanded state is 135° C. or higher and 155° C. or lower; a polypropylene-based resin (b) constituting a covering layer contains a propylene-based copolymer containing a propylene component, an ethylene component, and a butene component, as a main component; the difference [Tma−Tmb] between the melting point Tma of the polypropylene-based resin (a) and the melting point Tmb of the polypropylene-based resin (b) is 1° C. or more and 30° C. or less; the difference [Tmb−Tcb] between the melting point Tmb of the polypropylene-based resin (b) and the crystallization temperature Tcb of the polypropylene-based resin (b) is 40° C. or less; and the covering layer contains a higher fatty acid amide.
C08J 9/18 - Making expandable particles by impregnating polymer particles with the blowing agent
C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof
C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
A production method for a semiconductor substrate includes: performing a vapor deposition of a metal compound or metal directly or indirectly onto a substrate to form a metal-containing resist film; and exposing the metal-containing resist film to light. The metal compound or metal includes an Au atom, a Cr atom, an Ag atom, an In atom, or a combination thereof. The method preferably further includes developing the metal-containing resist film after exposing. The vapor deposition is preferably performed by PVD or CVD. The metal compound preferably includes a metal complex, a metal halide, or an organometal.
C23C 16/18 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
C23C 16/30 - Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
C23C 16/455 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into the reaction chamber or for modifying gas flows in the reaction chamber
C23C 16/50 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
A method for producing polypropylene-based resin expanded beads each having a through-hole by performing a first expanding step and a second expanding step is provided. In the first expanding step, tubular resin particles containing carbon black and having through-holes are dispersed in a dispersion medium and released to an environment under a low pressure, thereby obtaining first-step expanded beads having a bulk ratio of M1 times. In the second expanding step, the first-step expanded beads are further expanded to obtain polypropylene-based resin expanded beads having a bulk ratio of M2 times. The bulk ratio M1 is 5 times or more and 25 times or less. A ratio M2/M1 of the bulk ratio M2 to the bulk ratio M1 is 1.2 or more and 3.0 or less.
Provided is a method for filling a column with a chromatography carrier, including substituting a slurry with an aqueous solvent not containing a buffer, in which the slurry contains a target substance-capturing chromatography carrier, a buffer having an acid dissociation constant (pKa) within a range of ±1.0 of the isoelectric point of the carrier, and an aqueous solvent and has a pH of a liquid phase adjusted within a range of ±2.0 of the isoelectric point of the carrier, and filling a column with the slurry subjected to solvent substitution. The method may be advantageous for suppressing a decrease in liquid permeability and pressure resistance characteristics during liquid passage of a chromatography carrier when a solvent is substituted with an aqueous solvent not containing a buffer.
A first and/or second alignment film is a photo-alignment film on which alignment division is performed. Each pixel has multiple alignment regions having different alignment directions of liquid crystal molecules of a liquid crystal layer by the alignment division. The number of times of exposure in each alignment region for the alignment division is two or more and the same number among the regions; in each time of exposure for the alignment division, exposure is performed on two or more alignment regions along an arrangement direction, the previous numbers of times of exposure in alignment regions to be exposed in each times of exposure are the same among the regions; and the angle formed by the alignment direction of the liquid crystal molecules of the liquid crystal layer in each region of the alignment regions and a direction where the polarizing axis of a polarizing plate extends is 45°.
G02F 1/1337 - Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
G02F 1/137 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells characterised by the electro-optical or magneto-optical effect, e.g. field-induced phase transition, orientation effect, guest-host interaction or dynamic scattering
53.
RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMATION METHOD
A radiation-sensitive resin composition includes: a polymer comprising a structural unit (I) represented by a formula (1) and a structural unit different from the structural unit (I); a radiation-sensitive acid generator represented by a formula (α); and a solvent. RK1 is a hydrogen atom, a fluorine atom, or the like, L1 is an alkanediyl group, and Rf1 is a fluorinated hydrocarbon group. RW is a monovalent organic group having 3 to 40 carbon atoms that contains a cyclic structure, Rfa and Rfb are each independently a fluorine atom or the like, R11 and R12 are each independently a hydrogen atom, a fluorine atom, or the like, n1 is an integer of 1 to 4, n2 is an integer of 0 to 4, no carbonyl group is present between a sulfur atom of the sulfonic acid ion and the cyclic structure of RW, and Z+ is a monovalent onium cation.
A radiation-sensitive resin composition includes: a polymer comprising a structural unit (I) represented by a formula (1) and a structural unit different from the structural unit (I); a radiation-sensitive acid generator represented by a formula (α); and a solvent. RK1 is a hydrogen atom, a fluorine atom, or the like, L1 is an alkanediyl group, and Rf1 is a fluorinated hydrocarbon group. RW is a monovalent organic group having 3 to 40 carbon atoms that contains a cyclic structure, Rfa and Rfb are each independently a fluorine atom or the like, R11 and R12 are each independently a hydrogen atom, a fluorine atom, or the like, n1 is an integer of 1 to 4, n2 is an integer of 0 to 4, no carbonyl group is present between a sulfur atom of the sulfonic acid ion and the cyclic structure of RW, and Z+ is a monovalent onium cation.
A radiation-sensitive resin composition includes: a polymer comprising a structural unit (I) represented by formula (1) and a structural unit different from the structural unit (I); an onium salt represented by formula (i); and a solvent. In formula (1), RK1 is a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group, L1 is an alkanediyl group having 1 to 5 carbon atoms, and Rf1 is a fluorinated hydrocarbon group having 2 to 10 carbon atoms and 5 to 7 fluorine atoms. In formula (i), Ra1 is a substituted or unsubstituted monovalent organic group having 1 to 40 carbon atoms with no fluorine atom or fluorinated hydrocarbon group attached to an atom adjacent to the sulfur atom, and X+ is a monovalent onium cation.
A radiation-sensitive resin composition includes: a polymer comprising a structural unit (I) represented by formula (1) and a structural unit different from the structural unit (I); an onium salt represented by formula (i); and a solvent. In formula (1), RK1 is a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group, L1 is an alkanediyl group having 1 to 5 carbon atoms, and Rf1 is a fluorinated hydrocarbon group having 2 to 10 carbon atoms and 5 to 7 fluorine atoms. In formula (i), Ra1 is a substituted or unsubstituted monovalent organic group having 1 to 40 carbon atoms with no fluorine atom or fluorinated hydrocarbon group attached to an atom adjacent to the sulfur atom, and X+ is a monovalent onium cation.
Provided is a radiation-sensitive resin composition capable of exhibiting sensitivity and CDU performance at a sufficient level when a next-generation technology is applied, and a method for forming a pattern. A radiation-sensitive resin composition contains: a resin containing a structural unit (I) having an acid-dissociable group represented by the following formula (1) and a structural unit (II) having a phenolic hydroxy group, and contains neither an organic acid anion moiety nor an onium cation moiety; one or more onium salts containing an organic acid anion moiety and an onium cation moiety; and a solvent, wherein at least part of the onium cation moiety in the onium salt contains an aromatic ring structure having a fluorine atom. In the formula (1), RT is a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group, and RX is a monovalent hydrocarbon group having 1 to 20 carbon atoms.
Provided is a radiation-sensitive resin composition capable of exhibiting sensitivity and CDU performance at a sufficient level when a next-generation technology is applied, and a method for forming a pattern. A radiation-sensitive resin composition contains: a resin containing a structural unit (I) having an acid-dissociable group represented by the following formula (1) and a structural unit (II) having a phenolic hydroxy group, and contains neither an organic acid anion moiety nor an onium cation moiety; one or more onium salts containing an organic acid anion moiety and an onium cation moiety; and a solvent, wherein at least part of the onium cation moiety in the onium salt contains an aromatic ring structure having a fluorine atom. In the formula (1), RT is a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group, and RX is a monovalent hydrocarbon group having 1 to 20 carbon atoms.
A radiation-sensitive resin composition includes a resin including a structural unit (I) represented by formula (1). Ra is a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms; Ar1 is a substituted or unsubstituted divalent aromatic hydrocarbon group having 6 to 20 carbon atoms; m is 0 or 1; L1 is a single bond, or —O—, *—COO—, a divalent hydrocarbon group having 1 to 20 carbon atoms, or a combination thereof, and * is a bond on an Ar1 side; Ar2 is a monovalent aromatic hydrocarbon group having 6 to 20 carbon atoms and substituted with X; X is an iodine atom or a bromine atom; and n1 is an integer of 1 to nmax, wherein nmax is the number of Xs when all hydrogen atoms in the monovalent aromatic hydrocarbon group represented by the Ar2 are substituted with X.
A radiation-sensitive resin composition includes a resin including a structural unit (I) represented by formula (1). Ra is a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms; Ar1 is a substituted or unsubstituted divalent aromatic hydrocarbon group having 6 to 20 carbon atoms; m is 0 or 1; L1 is a single bond, or —O—, *—COO—, a divalent hydrocarbon group having 1 to 20 carbon atoms, or a combination thereof, and * is a bond on an Ar1 side; Ar2 is a monovalent aromatic hydrocarbon group having 6 to 20 carbon atoms and substituted with X; X is an iodine atom or a bromine atom; and n1 is an integer of 1 to nmax, wherein nmax is the number of Xs when all hydrogen atoms in the monovalent aromatic hydrocarbon group represented by the Ar2 are substituted with X.
A radiation-sensitive composition for forming an insulation film, includes: at least one polyfunctional compound (A) selected from the group consisting of a polyfunctional maleimide compound (A-1) and a polyfunctional styryl compound (A-2); a polymer (B) having a group Y that reacts with a maleimide group in the polyfunctional maleimide compound (A-1) or a styryl group in the polyfunctional styryl compound (A-2); and a photopolymerization initiator (C). The group Y is represented by Formula (Y1). In Formula (Y1), RY1 represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, LY1 represents a single bond, an alkanediyl group having 1 to 5 carbon atoms, —C(O)O—, —NH—C(O)—NH—, or a group obtained by a combination thereof, and * represents a position bonded to a main chain or a side chain of the polymer (B).
A radiation-sensitive composition for forming an insulation film, includes: at least one polyfunctional compound (A) selected from the group consisting of a polyfunctional maleimide compound (A-1) and a polyfunctional styryl compound (A-2); a polymer (B) having a group Y that reacts with a maleimide group in the polyfunctional maleimide compound (A-1) or a styryl group in the polyfunctional styryl compound (A-2); and a photopolymerization initiator (C). The group Y is represented by Formula (Y1). In Formula (Y1), RY1 represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, LY1 represents a single bond, an alkanediyl group having 1 to 5 carbon atoms, —C(O)O—, —NH—C(O)—NH—, or a group obtained by a combination thereof, and * represents a position bonded to a main chain or a side chain of the polymer (B).
A radiation-sensitive resin composition includes: a polymer including a first structural unit represented by formula (1), solubility of the polymer in a developer solution capable of being altered by an acid; and a compound represented by formula (2). R1 represents a hydrogen atom, or the like; R2 represents a group obtained by removing, from a substituted or unsubstituted aliphatic hydrocarbon ring having 3 to 30 ring atoms, two hydrogen atoms; and Ar1 represents a group obtained by removing one hydrogen atom from a substituted or unsubstituted aromatic hydrocarbon ring having 6 to 30 ring atoms. Z represents an acid-labile group; L1 represents *—O—CO— or —O—; Y represents an organic group having 1 to 30 carbon atoms, the organic group not comprising a cyclic acetal structure; A− represents a monovalent anion group; n is an integer of 1 to 5; and X+ represents a monovalent radiation-sensitive onium cation.
A radiation-sensitive resin composition includes: a polymer including a first structural unit represented by formula (1), solubility of the polymer in a developer solution capable of being altered by an acid; and a compound represented by formula (2). R1 represents a hydrogen atom, or the like; R2 represents a group obtained by removing, from a substituted or unsubstituted aliphatic hydrocarbon ring having 3 to 30 ring atoms, two hydrogen atoms; and Ar1 represents a group obtained by removing one hydrogen atom from a substituted or unsubstituted aromatic hydrocarbon ring having 6 to 30 ring atoms. Z represents an acid-labile group; L1 represents *—O—CO— or —O—; Y represents an organic group having 1 to 30 carbon atoms, the organic group not comprising a cyclic acetal structure; A− represents a monovalent anion group; n is an integer of 1 to 5; and X+ represents a monovalent radiation-sensitive onium cation.
A method for manufacturing a semiconductor substrate, includes: applying a composition for forming a resist underlayer film directly or indirectly to a substrate to form a resist underlayer film; cleaning a periphery of the substrate with a cleaning liquid; and after cleaning the periphery, forming a resist pattern directly or indirectly on the resist underlayer film. The composition for forming a resist underlayer film includes: a metal compound; and a solvent. The cleaning liquid includes an organic acid.
G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
A radiation-sensitive resin composition includes a resin, an acid diffusion controlling agent represented by formula (a), and a solvent. The resin includes: at least one structural unit selected from the group consisting of a structural unit represented by formula (1) and a structural unit represented by formula (2); and a structural unit including a phenolic hydroxy group. Rw is a monovalent organic group having 1 to 20 carbon atoms, a hydroxy group, or an amino group; Lq is a divalent linking group; Z+ is a monovalent radiation-sensitive onium cation; q1 is an integer of 1 to 4; q2 is an integer of 0 to 3; q3 is an integer of 1 to 3; and an upper limit of q1+q2+q3 is 6.
A radiation-sensitive resin composition includes a resin, an acid diffusion controlling agent represented by formula (a), and a solvent. The resin includes: at least one structural unit selected from the group consisting of a structural unit represented by formula (1) and a structural unit represented by formula (2); and a structural unit including a phenolic hydroxy group. Rw is a monovalent organic group having 1 to 20 carbon atoms, a hydroxy group, or an amino group; Lq is a divalent linking group; Z+ is a monovalent radiation-sensitive onium cation; q1 is an integer of 1 to 4; q2 is an integer of 0 to 3; q3 is an integer of 1 to 3; and an upper limit of q1+q2+q3 is 6.
A chromatographic bed insert includes a base having openings and an array of projection members positioned on the base and projecting substantially perpendicular to the base. The chromatographic bed insert has a displacement volume % D which is less than 50% of a volume defined by the chromatographic bed insert and is structured to reduce a hydraulic radius RH of a chromatography bed including the chromatographic bed insert by at least 25% compared to a corresponding chromatography bed which does not include the chromatographic bed insert.
B01D 15/20 - Selective adsorption, e.g. chromatography characterised by constructional or operational features relating to the conditioning of the sorbent material
An organoid production method includes culturing a human stem cell in a culture medium containing a cyclic peptide having an amino acid sequence set forth in Formula (1) or a pharmaceutically acceptable salt of the cyclic peptide [in Formula (1), X1 to X6 each represent a specific modified amino acid, X7 represents any amino acid residue, R is absent or represents a C-terminal modification group, n is an integer of 0 or 1, PeG is N-(2-phenylethyl)-glycine, and Nal1 is β-(1-naphthyl)-L-alanine].
An organoid production method includes culturing a human stem cell in a culture medium containing a cyclic peptide having an amino acid sequence set forth in Formula (1) or a pharmaceutically acceptable salt of the cyclic peptide [in Formula (1), X1 to X6 each represent a specific modified amino acid, X7 represents any amino acid residue, R is absent or represents a C-terminal modification group, n is an integer of 0 or 1, PeG is N-(2-phenylethyl)-glycine, and Nal1 is β-(1-naphthyl)-L-alanine].
A radiation-sensitive composition includes: a polymer comprising a first structural unit represented by formula (1); and a compound comprising an anion and a radiation-sensitive onium cation. At least one of the polymer and the compound has a ring structure having at least one iodine atom bonded to the ring structure. R1 represents a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group; L1 represents a single bond, —COO—, or —CONH—; Ar1 represents a group obtained by removing two hydrogen atoms from a substituted or unsubstituted aromatic hydrocarbon ring; and R2 represents an acid-labile group.
A radiation-sensitive composition includes: a polymer comprising a first structural unit represented by formula (1); and a compound comprising an anion and a radiation-sensitive onium cation. At least one of the polymer and the compound has a ring structure having at least one iodine atom bonded to the ring structure. R1 represents a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group; L1 represents a single bond, —COO—, or —CONH—; Ar1 represents a group obtained by removing two hydrogen atoms from a substituted or unsubstituted aromatic hydrocarbon ring; and R2 represents an acid-labile group.
C08F 212/14 - Monomers containing only one unsaturated aliphatic radical containing one ring substituted by hetero atoms or groups containing hetero atoms
C08F 220/30 - Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
The present inventors have found that the content ratios of isoalloLCA, 3-oxoLCA, alloLCA, and 3-oxoalloLCA in the feces of centenarians are higher than those of younger ones, and have also identified gut microbiomes peculiar to centenarians involved in the production of these bile acids. Furthermore, it has been found that these bile acids, enzymes involved in the production thereof, and bacteria producing the enzymes reduce the risk of infection with pathogens, prostate cancer, and the like, and are involved in longevity.
A polymer containing a structural unit (I) represented by formula (1) is included in a radiation-sensitive composition. In formula (1), R2 is a single bond, a divalent hydrocarbon group, or the like. R3 is a divalent group represented by formula (2) or formula (3). R4 is a divalent organic group. Y− is a monovalent anion which can generate a sulfonic acid group, an imidic acid group, or a methide acid group through exposure to light. Ma+ is an a-valent cation. a is 1 or 2.
A polymer containing a structural unit (I) represented by formula (1) is included in a radiation-sensitive composition. In formula (1), R2 is a single bond, a divalent hydrocarbon group, or the like. R3 is a divalent group represented by formula (2) or formula (3). R4 is a divalent organic group. Y− is a monovalent anion which can generate a sulfonic acid group, an imidic acid group, or a methide acid group through exposure to light. Ma+ is an a-valent cation. a is 1 or 2.
C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
A radiation-sensitive resin composition includes: a compound A represented by formula (I); a resin B including a structural unit having an acid-dissociable group; a radiation-sensitive acid generator other than the compound A; and a solvent. R1 is an (m+m′)-valent organic group and comprises a cyclopropane ring skeleton, a cyclobutane ring skeleton, or both; X1 is a group represented by formula (1-1) or a group represented by formula (1-2); X2 is a group represented by formula (2-1) or a group represented by formula (2-2); Y+ is a monovalent onium cation; m is an integer of 1 to 2, and m′ is an integer of 0 to 1. * represents a bond to another group.
A radiation-sensitive resin composition includes: a compound A represented by formula (I); a resin B including a structural unit having an acid-dissociable group; a radiation-sensitive acid generator other than the compound A; and a solvent. R1 is an (m+m′)-valent organic group and comprises a cyclopropane ring skeleton, a cyclobutane ring skeleton, or both; X1 is a group represented by formula (1-1) or a group represented by formula (1-2); X2 is a group represented by formula (2-1) or a group represented by formula (2-2); Y+ is a monovalent onium cation; m is an integer of 1 to 2, and m′ is an integer of 0 to 1. * represents a bond to another group.
A method for producing polypropylene-based resin expanded beads includes dispersion, blowing agent impregnation, and foaming steps. Beads used in the dispersion step include a core layer having a polypropylene-based resin as a base material resin, and a fusion-bonding layer covering core layer; the beads fusion-bonding layer includes carbon black and a NOR-type hindered amine; a carbon black blending ratio is adjusted to 0.5 wt % or more and 5 wt % or less; and an amine blending ratio of the beads is adjusted to 0.03 wt % or more and 0.5 wt % or less; the polypropylene-based resin expanded beads have a surface on which a fusion-bonding layer is located; the fusion-bonding layer includes the carbon black and hindered amine; a carbon black blending ratio is 0.5 wt % or more and 5 wt % or less; and a blending ratio of the hindered amine is 0.03 wt % or more and 0.5 wt % or less.
C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
C08J 9/232 - Forming foamed products by sintering expandable particles
A method for producing polypropylene-based resin (PPBR) expanded beads may include dispersing, first expanding, and second expanding. In the dispersing, resin particles are dispersed in a dispersion medium, the resin particles each including a core layer, containing carbon black blended into PPBR in a predetermined ratio, based on 100 parts by mass of PPBR, and a covering layer covering the core layer, containing carbon black blended into a polyolefin-based resin (POBR) in a predetermined ratio, based on 100 parts by mass of POBR. The first expanding expands the core layer of the resin particle to obtain a first expanded bead having a bulk ratio of 5 to 25 times. The second expanding expands the first expanded beads further to obtain second expanded beads. An M2/M1 ratio of a bulk ratio M2 of the second expanded beads to a bulk ratio M1 of the first expanded beads is 1.2 to 3.0.
C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof
C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
69.
METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE, AND COMPOSITION
A method includes: applying a composition for forming a resist underlayer film directly or indirectly to a substrate to form a resist underlayer film; applying a composition for forming a resist film to the resist underlayer film to form a resist film; exposing the resist film to radiation; and developing the exposed resist film. The composition for forming a resist underlayer film includes: a polymer including a partial structure represented by formula (i); and a solvent. In the formula (i), Y1 is a sulfonyl group, a carbonyl group, or an alkanediyl group; Y2 is a sulfonyl group, a carbonyl group, or a single bond; when Y1 is an alkanediyl group, Y2 is a sulfonyl group or a carbonyl group, and when Y2 is a single bond, Y1 is a sulfonyl group or a carbonyl group; R1 is a monovalent organic group having 1 to 20 carbon atoms.
A method includes: applying a composition for forming a resist underlayer film directly or indirectly to a substrate to form a resist underlayer film; applying a composition for forming a resist film to the resist underlayer film to form a resist film; exposing the resist film to radiation; and developing the exposed resist film. The composition for forming a resist underlayer film includes: a polymer including a partial structure represented by formula (i); and a solvent. In the formula (i), Y1 is a sulfonyl group, a carbonyl group, or an alkanediyl group; Y2 is a sulfonyl group, a carbonyl group, or a single bond; when Y1 is an alkanediyl group, Y2 is a sulfonyl group or a carbonyl group, and when Y2 is a single bond, Y1 is a sulfonyl group or a carbonyl group; R1 is a monovalent organic group having 1 to 20 carbon atoms.
G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
In a method for manufacturing a molded article of polypropylene-based resin expanded beads, expanded beads compressed by pressurized gas are filled in a mold, and then a heating medium is supplied into the mold to perform in-mold molding on the expanded beads in the mold. The expanded bead has a tubular shape with a through-hole. An average hole diameter d of the through-hole is 0.1 mm or more and less than 1 mm, and a ratio d/D of the average hole diameter d of the through-hole to an average outer diameter D of the expanded bead is 0.4 or less. A compression ratio P of the expanded beads in a state where the expanded beads are filled in the mold is 20% or more and 80% or less.
B29C 44/44 - Feeding the material to be shaped into a closed space, i.e. to make articles of definite length in the form of expandable particles or beads
B29C 44/34 - Component parts, details or accessoriesAuxiliary operations
B29K 23/00 - Use of polyalkenes as moulding material
B29K 105/04 - Condition, form or state of moulded material cellular or porous
71.
Polyethylene resin multilayer foam sheet, interleaving paper for glass plates, and method for manufacturing polyethylene resin multilayer foam sheet
The multilayer foam sheet includes a polyethylene resin foam layer and a resin layer laminated on at least one of the two surfaces of the foam layer. The resin layer has a multilayer structure formed from a surface layer and an intermediate layer. Both the surface layer and the intermediate layer contain a polyethylene resin and a polymeric antistatic agent. The polymeric antistatic agent is contained in the intermediate layer at a proportion of 30-70 wt % (inclusive). The polymeric antistatic agent is contained in the surface layer at a proportion of at least 5 wt % to less than 30 wt %.
B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
B65D 81/02 - Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
B65D 81/03 - Wrappers or envelopes with shock-absorbing properties, e.g. bubble films
B65D 85/48 - Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
B65G 49/06 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
72.
Polypropylene-based resin expanded bead, method for producing same, and molded article of polypropylene-based resin expanded beads
A polypropylene-based resin expanded bead having a tubular shape with a through-hole, containing a foamed core layer constituted by a polypropylene-based resin and a fusion-bonding layer covering the foamed core layer. An average hole diameter d of the through-hole in the expanded bead is less than 1 mm, and a ratio d/D of the average hole diameter d to an average outer diameter D of the expanded bead is 0.4 or less, a mass ratio of the foamed core layer and the fusion-bondable layer is foamed core layer:fusion-bondable layer=99.5:0.5 to 85:15, and the polypropylene-based resin constituting the foamed core layer has a flexural modulus of 800 MPa or more and less than 1200 MPa and a melting point Tmc of 150° C. or lower.
A composition includes: a metal compound; a compound having an oxymethylene structure; and a solvent. The metal compound is a metal salt or a metal complex. The compound having an oxymethylene structure is capable of generating an aldehyde structure when degraded through heating. A metal atom contained in the metal compound preferably belongs to any one of periods 3 to 7 among groups 2 to 14 in a periodic table.
A culture method includes culturing a spheroid of a human neural cell-like cell in the presence of a tau protein aggregate and culturing a culture product in a culture medium containing 5 μg/mL or greater of a lipid, in which the lipid is one or more selected from the group consisting of a glycerolipid, a glycerophospholipid, and a sphingolipid. The culture method includes culturing a spheroid of a human neural cell-like cell in the presence of a tau protein aggregate and culturing a culture product in a culture medium containing a neurotrophic factor.
A chromatographic device, including a housing including an inlet and an outlet of a fluid, an inlet distribution plate positioned inside the housing such that the inlet distribution plate receives a fluid flowing through the inlet and distributes the flow inside the housing, an inlet frit plate positioned on the inlet distribution plate, a chromatography medium placed inside the housing, at least one multi-planar screen positioned inside the housing to receive the fluid to be separated from the inlet distribution plate and the inlet frit plate, the multi-planar screen being structured such that the chromatography medium is held inside thereof, and that the fluid to be separated from the inlet distribution plate and the inlet frit plate passes through the chromatography medium, an outlet distribution plate that receives the fluid separated, and an outlet frit plate positioned on the outlet distribution plate such that the outlet frit plate receives a force created by the flow of the fluid through the chromatography medium.
B01D 15/14 - Selective adsorption, e.g. chromatography characterised by constructional or operational features relating to the introduction of the feed to the apparatus
B01D 15/18 - Selective adsorption, e.g. chromatography characterised by constructional or operational features relating to flow patterns
B01D 15/22 - Selective adsorption, e.g. chromatography characterised by constructional or operational features relating to the construction of the column
76.
METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND COMPOSITION
A method for manufacturing a semiconductor substrate, includes applying a composition for forming a resist underlayer film directly or indirectly to a substrate to form a resist underlayer film. A composition for forming a resist film is applied to the resist underlayer film to form a resist film. The resist film is exposed to radiation. The exposed resist film is developed. The composition for forming a resist underlayer film includes: a polymer having a sulfonic acid ester structure; and a solvent.
G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
C08F 26/06 - Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a heterocyclic ring containing nitrogen
The present invention provides a chemical mechanical polishing composition with which it is possible to suppress ruthenium corrosion and also perform chemical mechanical polishing of a semiconductor substrate containing ruthenium while maintaining a stable polishing speed. The composition for chemical mechanical polishing of the present invention contains: (A) abrasive grains; (B) an acid containing at least one anion selected from the group consisting of periodate ions (IO4−), hypochlorite ions (CIO−), chlorite ions (CIO2−) and hypobromite ions (BrO−) or a salt of said acid; and (C) hydrogen peroxide. MB/MC=0.015 to 11, where MB (mol/L) is the amount of the (B) acid or salt thereof and MC (mol/L) is the amount of hydrogen peroxide (C).
A biomimetic system includes: a container; and a human cholangiocyte-like cell-containing membrane, in which the human cholangiocyte-like cell-containing membrane includes a permeable base plate and a two-dimensional tissue of human cholangiocyte-like cells stacked on one surface of the permeable base plate, the human cholangiocyte-like cell-containing membrane divides the container into a first compartment and a second compartment, a one surface side of the permeable base plate is exposed in the first compartment, the other surface side of the permeable base plate is exposed in the second compartment, the human cholangiocyte-like cells express P-gp, and an efflux ratio calculated by Formula (1) is 1.5 or more, efflux ratio=(permeation rate of rhodamine 123 that permeates from the second compartment to the first compartment)/(permeation rate of rhodamine 123 that permeates the second compartment from the first compartment) . . . (1)
The multilayer foam sheet has a surface resistivity of 1×1013Ω or less and has a foam layer and resin layers that are laminated on both surfaces of the foam layer. The resin layers each have a multilayer structure formed from a surface layer and an intermediate layer that is positioned between the surface layer and the foam layer. The foam layer includes a polyethylene-based resin PE2. The intermediate layers are configured from an antistatic mixture containing a polyethylene-based resin PE3 and a polymeric antistatic agent. The surface layers are configured from a mixed resin containing a polyethylene-based resin PE4 and a polystyrene-based resin, and substantially do not contain the polymeric antistatic agent. The polystyrene-based resin content of the mixed resin is 3-35 wt %.
B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
B29C 48/00 - Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired formApparatus therefor
B29C 48/21 - Articles comprising two or more components, e.g. co-extruded layers the components being layers the layers being joined at their surfaces
B29K 23/00 - Use of polyalkenes as moulding material
B29K 25/00 - Use of polymers of vinyl-aromatic compounds as moulding material
B29K 105/00 - Condition, form or state of moulded material
B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
B32B 37/14 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
B32B 37/15 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
B32B 38/00 - Ancillary operations in connection with laminating processes
80.
METHOD FOR FORMING RESIST UNDERLAYER FILM, METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE, COMPOSITION, AND RESIST UNDERLAYER FILM
A method for forming a resist underlayer film includes applying a composition for forming a resist underlayer film directly or indirectly to a substrate to form a coating film. The coating film is heated at a heating temperature of higher than 450° C. and 600° C. or lower in an atmosphere having an oxygen concentration of less than 0.01% by volume. The composition for forming a resist underlayer film includes: a compound including an aromatic ring; a polymer which thermally decomposes at the heating temperature in heating the coating film, and which is other than the compound; and a solvent. The compound has a molecular weight of 400 or more. A content of the polymer is less than a content of the compound in the composition for forming a resist underlayer film.
G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
C09D 161/06 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
C09D 161/12 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols with polyhydric phenols
H01L 21/308 - Chemical or electrical treatment, e.g. electrolytic etching using masks
An object of the present invention is to provide a photosensitive composition capable of producing a pattern having a precise shape without causing curing defects of a coating film even when the time is required from exposure of the coating film to the next step. A photosensitive composition of the present invention contains a polymer (A), a polymerizable compound (B), a photoacid generator (C), and a solvent (D), in which the polymerizable compound (B) includes an epoxy compound (B-1) containing two or more groups represented by the following Formula (1) and a specific epoxy compound (B-2) other than the epoxy compound (B-1), and an epoxy compound containing an epoxy group fused to an alicyclic group is contained in an amount of 50 mass % or more with respect to a total of 100 mass % of the polymerizable compound (B).
An object of the present invention is to provide a photosensitive composition capable of producing a pattern having a precise shape without causing curing defects of a coating film even when the time is required from exposure of the coating film to the next step. A photosensitive composition of the present invention contains a polymer (A), a polymerizable compound (B), a photoacid generator (C), and a solvent (D), in which the polymerizable compound (B) includes an epoxy compound (B-1) containing two or more groups represented by the following Formula (1) and a specific epoxy compound (B-2) other than the epoxy compound (B-1), and an epoxy compound containing an epoxy group fused to an alicyclic group is contained in an amount of 50 mass % or more with respect to a total of 100 mass % of the polymerizable compound (B).
-
L
-
Ep
(
1
)
G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
G03F 7/033 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
82.
METHOD FOR PRODUCING CELLULAR POLYOLEFIN-BASED PLASTIC PARTICLES
The invention relates to a method for producing cellular plastic particles, including the steps of: —providing a plastic material in the form of pre-expanded plastic material particles, —loading the pre-expanded plastic material particles with a blowing agent under the influence of pressure, —expanding the pre-expanded plastic material particles loaded with blowing agent in order to produce cellular plastic particles, more particularly, cellular plastic particles having lower density, under the influence of temperature, in which the expanding of the plastic material particles loaded with blowing agent is carried out under the influence of temperature by irradiation of the plastic material particles loaded with blowing agent with high-energy thermal radiation, more particularly, infrared radiation.
A fireproof heat insulating board including a foamed resin molded body filled with a slurry, the foamed resin molded body having continuous voids, wherein the filled slurry forms a hydrate containing water of crystallization in an amount of 50 kg/m3 or more through hydration reaction after the filling, and at least a part of the surface of the board is reinforced with one or more inorganic fibers selected from the group consisting of a basalt fiber and a ceramic fiber.
E04B 1/94 - Protection against other undesired influences or dangers against fire
B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
B32B 5/18 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer containing foamed or specifically porous material
B32B 5/24 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer
C04B 28/14 - Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing calcium sulfate cements
C04B 28/16 - Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements containing calcium sulfate cements containing anhydrite
C04B 111/00 - Function, property or use of the mortars, concrete or artificial stone
A porous body including, as a base resin, a crosslinked polymer obtained by crosslinking a polymer of an acrylic monomer and/or a styrene-based monomer. A storage modulus of the porous body is 5 kPa or more and 2000 kPa or less at 23° C., an apparent density of the porous body is 10 kg/m3 or more and 250 kg/m3 or less, and a molecular weight between crosslinking points of the crosslinked polymer is 1.0×104 or more.
C08F 232/06 - Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having no condensed rings having two or more carbon-to-carbon double bonds
C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof
A composition includes a metal compound, a polymer including a first structural unit represented by formula (1) and a second structural unit represented by formula (2), and a solvent. R1 is a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms; and R2 is a substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms. R3 is a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms; L is a single bond or a divalent linking group; Ar is a group obtained by removing (n+1) hydrogen atoms from a substituted or unsubstituted aromatic ring having 6 to 20 ring members; R4 is a monovalent hydroxyalkyl group having 1 to 10 carbon atoms or a hydroxy group; and n is an integer of 0 to 8.
A composition includes a metal compound, a polymer including a first structural unit represented by formula (1) and a second structural unit represented by formula (2), and a solvent. R1 is a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms; and R2 is a substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms. R3 is a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group having 1 to 20 carbon atoms; L is a single bond or a divalent linking group; Ar is a group obtained by removing (n+1) hydrogen atoms from a substituted or unsubstituted aromatic ring having 6 to 20 ring members; R4 is a monovalent hydroxyalkyl group having 1 to 10 carbon atoms or a hydroxy group; and n is an integer of 0 to 8.
G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
A method is provided for evaluating excretion of a substance of interest by a human hepatocyte-like cell, the method including: preparing a sac-like-material-containing solution that contains a sac-like material which is produced in vitro and has a membrane of a human hepatocyte-like cell and 0% to 10% by volume of a suspended extracellular matrix; placing the substance of interest in the sac-like-material-containing solution to bring the substance of interest into contact with the sac-like material; and extracting the sac-like material from the sac-like-material-containing solution and measuring a concentration of the substance of interest or a metabolite thereof excreted into an inner cavity of the sac-like material.
A method for producing a chromatography carrier, including providing a solid phase support, where the solid phase support provided is formed of porous particles on which a ligand has or has not been immobilized, and subjecting the solid phase support to sieve classification. A coefficient of variation of a volume particle size distribution of the porous particles when a ligand has been immobilized is adjusted to 1% to 22%, and a ratio (d1/d50) of volume cumulative 1% particle size d1 to volume cumulative 50% particle size d50 in terms of the porous particles is adjusted to 0.55 to 1.0.
B01J 20/286 - Phases chemically bonded to a substrate, e.g. to silica or to polymers
B01D 15/20 - Selective adsorption, e.g. chromatography characterised by constructional or operational features relating to the conditioning of the sorbent material
B01D 15/38 - Selective adsorption, e.g. chromatography characterised by the separation mechanism involving specific interaction not covered by one or more of groups , e.g. affinity, ligand exchange or chiral chromatography
B01J 20/28 - Solid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof characterised by their form or physical properties
B01J 20/30 - Processes for preparing, regenerating or reactivating
A method for producing a polyamide-based resin expanded bead, the method comprising expanding a polyamide-based resin bead using a physical blowing agent, wherein the polyamide-based resin bead comprises a coloring pigment and a higher fatty acid metal salt having 12 to 24 carbon atoms; a metal in the higher fatty acid metal salt is one or more metals selected from the group consisting of magnesium, aluminum, and zinc; and a content of the higher fatty acid metal salt in the polyamide-based resin bead is 500 to 5000 mass ppm.
A polypropylene-based resin expanded beads configured to include an NOR type hindered amine and has a surface on which a thermoplastic polymer layer is located, in which a blending ratio of the amine in the expanded beads is 0.03 wt % or more and 0.5 wt % or less, and a blending ratio of the amine in the thermoplastic polymer layer is less than the blending ratio of the amine in the expanded beads. Further, the method for producing the expanded beads includes a covering and foaming step, in which in the resin beads to be obtained in the covering step, a blending ratio of the amine in the resin beads is adjusted to be 0.03 wt % or more and 0.5 wt % or less, and a blending ratio of the amine in a thermoplastic polymer layer is adjusted to be lower than the blending ratio of the amine in the resin beads.
A radiation-sensitive resin composition includes: a resin including a structural unit represented by formula (1); at least one onium salt each including an organic acid anion moiety and an onium cation moiety; and a solvent. At least part of the organic acid anion moiety in the at least one onium salt includes an iodine-substituted aromatic ring structure. R is a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms, Y1 is a divalent linking group, and X1 is an acid-dissociable group, and n is 0 or 1. When n is 0, X1 is represented by formula (s1) or (s2).
A radiation-sensitive resin composition includes: a resin including a structural unit represented by formula (1); at least one onium salt each including an organic acid anion moiety and an onium cation moiety; and a solvent. At least part of the organic acid anion moiety in the at least one onium salt includes an iodine-substituted aromatic ring structure. R is a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms, Y1 is a divalent linking group, and X1 is an acid-dissociable group, and n is 0 or 1. When n is 0, X1 is represented by formula (s1) or (s2).
C07C 309/10 - Sulfonic acids having sulfo groups bound to acyclic carbon atoms of an acyclic saturated carbon skeleton containing oxygen atoms bound to the carbon skeleton containing etherified hydroxy groups bound to the carbon skeleton with the oxygen atom of at least one of the etherified hydroxy groups further bound to an acyclic carbon atom
C07C 309/39 - Sulfonic acids having sulfo groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton containing halogen atoms bound to the carbon skeleton
A method for manufacturing a semiconductor substrate, including: applying a composition for forming a resist underlayer film directly or indirectly to a substrate to form a resist underlayer film directly or indirectly on the substrate; forming a resist pattern directly or indirectly on the resist underlayer film; and performing etching using the resist pattern as a mask. The composition for forming a resist underlayer film contains: a polymer having a repeating unit represented by formula (1) and a solvent. Ar1 is a divalent group including an aromatic ring having 5 to 40 ring atoms; and R0 is a monovalent group including an aromatic ring having 5 to 40 ring atoms and includes at least one group selected from the group consisting of groups represented by formula (2-1) and groups represented by formula (2-2).
A method for manufacturing a semiconductor substrate, including: applying a composition for forming a resist underlayer film directly or indirectly to a substrate to form a resist underlayer film directly or indirectly on the substrate; forming a resist pattern directly or indirectly on the resist underlayer film; and performing etching using the resist pattern as a mask. The composition for forming a resist underlayer film contains: a polymer having a repeating unit represented by formula (1) and a solvent. Ar1 is a divalent group including an aromatic ring having 5 to 40 ring atoms; and R0 is a monovalent group including an aromatic ring having 5 to 40 ring atoms and includes at least one group selected from the group consisting of groups represented by formula (2-1) and groups represented by formula (2-2).
G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
A composition for semiconductor processing according to the disclosure contains (A) a compound represented by the following general formula (1), (B) a compound represented by the following general formula (2), (C) a compound having at least one functional group selected from the group consisting of an amino group and a salt thereof (excluding a compound having a carboxyl group and a nitrogen-containing heterocyclic compound) and (D) a liquid medium, and, when the content of the (A) component is indicated by MA [mass %] and the content of the (B) component is indicated by MB [mass %], MA/MB is 1.0×102 to 1.0×106.
A composition for semiconductor processing according to the disclosure contains (A) a compound represented by the following general formula (1), (B) a compound represented by the following general formula (2), (C) a compound having at least one functional group selected from the group consisting of an amino group and a salt thereof (excluding a compound having a carboxyl group and a nitrogen-containing heterocyclic compound) and (D) a liquid medium, and, when the content of the (A) component is indicated by MA [mass %] and the content of the (B) component is indicated by MB [mass %], MA/MB is 1.0×102 to 1.0×106.
RO(CH2)2O(CH2)2OH (1)
A composition for semiconductor processing according to the disclosure contains (A) a compound represented by the following general formula (1), (B) a compound represented by the following general formula (2), (C) a compound having at least one functional group selected from the group consisting of an amino group and a salt thereof (excluding a compound having a carboxyl group and a nitrogen-containing heterocyclic compound) and (D) a liquid medium, and, when the content of the (A) component is indicated by MA [mass %] and the content of the (B) component is indicated by MB [mass %], MA/MB is 1.0×102 to 1.0×106.
RO(CH2)2O(CH2)2OH (1)
ROH (2)
A composition for semiconductor processing according to the disclosure contains (A) a compound represented by the following general formula (1), (B) a compound represented by the following general formula (2), (C) a compound having at least one functional group selected from the group consisting of an amino group and a salt thereof (excluding a compound having a carboxyl group and a nitrogen-containing heterocyclic compound) and (D) a liquid medium, and, when the content of the (A) component is indicated by MA [mass %] and the content of the (B) component is indicated by MB [mass %], MA/MB is 1.0×102 to 1.0×106.
RO(CH2)2O(CH2)2OH (1)
ROH (2)
(In the formula (1) and the formula (2), R's represent the same hydrocarbon group.)
A radiation-sensitive composition includes a polymer including first and second structural units, a first compound that generates a first acid upon irradiation with radioactive ray, and a second compound that generates a second acid upon irradiation with radioactive ray. The first structural unit includes an acid-labile group, the first acid does not substantially dissociate the acid-labile group under 110° C. and a period of 1 min, the second acid dissociates the acid-labile group under 110° C. and a period of 1 min, and the second structural unit includes a monovalent group of formula (X),
A radiation-sensitive composition includes a polymer including first and second structural units, a first compound that generates a first acid upon irradiation with radioactive ray, and a second compound that generates a second acid upon irradiation with radioactive ray. The first structural unit includes an acid-labile group, the first acid does not substantially dissociate the acid-labile group under 110° C. and a period of 1 min, the second acid dissociates the acid-labile group under 110° C. and a period of 1 min, and the second structural unit includes a monovalent group of formula (X),
where Ar1 is a group obtained by removing (a+b) hydrogen atoms from an unsubstituted aryl group, RXA is a monovalent iodine atom, an iodinated alkyl group or an iodinated alkoxy group, RXB is a monovalent organic group, a is an integer of 1 to 10, and b is an integer of 1 to 10.
A composition for semiconductor processing according to the disclosure contains (A) a compound represented by the following general formula (1), (B) a compound represented by the following general formula (2), (C) a compound having at least one functional group selected from the group consisting of an amino group and a salt thereof and a hydroxyl group (excluding the compound represented by the following general formula (1), a compound having a carboxyl group and a nitrogen-containing heterocyclic compound) and (D) a liquid medium, and, when the content of the (A) component is indicated by MA [mass %] and the content of the (B) component is indicated by MB [mass %], MA/MB is 1.0×102 to 1.0×104.
A composition for semiconductor processing according to the disclosure contains (A) a compound represented by the following general formula (1), (B) a compound represented by the following general formula (2), (C) a compound having at least one functional group selected from the group consisting of an amino group and a salt thereof and a hydroxyl group (excluding the compound represented by the following general formula (1), a compound having a carboxyl group and a nitrogen-containing heterocyclic compound) and (D) a liquid medium, and, when the content of the (A) component is indicated by MA [mass %] and the content of the (B) component is indicated by MB [mass %], MA/MB is 1.0×102 to 1.0×104.
R2N(OH) (1)
A composition for semiconductor processing according to the disclosure contains (A) a compound represented by the following general formula (1), (B) a compound represented by the following general formula (2), (C) a compound having at least one functional group selected from the group consisting of an amino group and a salt thereof and a hydroxyl group (excluding the compound represented by the following general formula (1), a compound having a carboxyl group and a nitrogen-containing heterocyclic compound) and (D) a liquid medium, and, when the content of the (A) component is indicated by MA [mass %] and the content of the (B) component is indicated by MB [mass %], MA/MB is 1.0×102 to 1.0×104.
R2N(OH) (1)
R2NH (2)
(In the formula (1) and the formula (2), R's each independently represent an alkyl group having 1 to 4 carbon atoms.)
A method for manufacturing a semiconductor substrate, includes: directly or indirectly applying a composition for forming a resist underlayer film to a substrate to form a resist under film directly or indirectly on the substrate; applying a composition for forming a resist film to the resist underlayer film to form a resist film on the resist underlayer film; exposing the resist film to radiation; and developing the exposed resist film by a developer. The composition for forming a resist underlayer film includes: a polymer; an onium salt that is capable of generating at least one polar group selected from the group consisting of a carboxy group and a hydroxy group by radiation or heat; and a solvent.
G03F 7/11 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
G03F 7/029 - Inorganic compoundsOnium compoundsOrganic compounds having hetero atoms other than oxygen, nitrogen or sulfur
A method for producing a molded article of expanded beads includes filling tubular polypropylene-based resin expanded beads each having a through-hole in a mold, and supplying a heating medium to fusion-bond the expanded beads to each other. The expanded beads have a foamed layer constituted by polypropylene-based resin. A closed cell of the expanded beads is 90% or more. An average hole diameter (d) of through-holes of the expanded beads is less than 1 mm. A ratio [d/D] of the average hole diameter (d) to an average outer diameter (D) of the expanded beads is 0.4 or less. An open cell content of the molded article of expanded beads is 2.5% or more and 12% or less.
A radiation-sensitive composition includes: a polymer (A) including a structural unit represented by formula (i); and an acid-generating compound including a radiation-sensitive onium cation and an organic anion (provided that the polymer (A) is excluded), while satisfying at least one of requirements [K1] and [K2]. In [K1], the polymer (A) includes a radiation-sensitive onium cation [X] including two or more of substituents β each of which is at least one type selected from the group consisting of a fluoroalkyl group and a fluoro group (provided that the fluoro group in the fluoroalkyl group is excluded). In [K2], the acid-generating compound includes a compound including a radiation-sensitive onium cation [X].
A radiation-sensitive composition includes: a polymer (A) including a structural unit represented by formula (i); and an acid-generating compound including a radiation-sensitive onium cation and an organic anion (provided that the polymer (A) is excluded), while satisfying at least one of requirements [K1] and [K2]. In [K1], the polymer (A) includes a radiation-sensitive onium cation [X] including two or more of substituents β each of which is at least one type selected from the group consisting of a fluoroalkyl group and a fluoro group (provided that the fluoro group in the fluoroalkyl group is excluded). In [K2], the acid-generating compound includes a compound including a radiation-sensitive onium cation [X].
A chromatography carrier may exhibit high liquid permeability and an excellent pressure-resistant characteristic during liquid passage. A chromatography carrier production method may include: (1) providing a solid phase support, the solid phase support being formed of porous particles on which a ligand has or has not been immobilized; and (2) subjecting the solid phase support to sieve classification, the coefficient of variation of the volume particle size distribution of the porous particles when a ligand has been immobilized being adjusted to 1% to 22%. The skewness of the volume particle size distribution of the porous particles when a ligand has been immobilized may be adjusted to −0.1 to 5.
B01D 15/20 - Selective adsorption, e.g. chromatography characterised by constructional or operational features relating to the conditioning of the sorbent material
B01D 15/22 - Selective adsorption, e.g. chromatography characterised by constructional or operational features relating to the construction of the column
B01J 20/30 - Processes for preparing, regenerating or reactivating
99.
PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING RESIST PATTERN FILM, AND METHOD FOR MANUFACTURING PLATED SHAPED ARTICLE
An embodiment of the present invention relates to a photosensitive resin composition, a method for manufacturing a resist pattern film, and a method for manufacturing a plated shaped article; the photosensitive resin composition comprises (A) an alkali-soluble resin, (B1) a polymerizable compound having at least two (meth)acryloyl groups and at least two hydroxy groups in one molecule and having a ring structure, (C) a photoradical polymerization initiator, (D) at least one compound selected from the group consisting of a nitrogen-containing heterocyclic compound (d1) containing two or more nitrogen atoms, a thiol compound (d2), and a polymerization inhibitor (d3), and (F) a solvent.
A core member used for a laminate in which polyurethane foam is laminated on the core member made of a thermoplastic resin expanded beads molded article, such that the molded article in which expanded beads having through holes are mutually fused, an average porosity of the expanded beads molded article is between 10% and 25%, and on a surface of the expanded beads molded article, a ratio of a total opening area of the through hole portions of the expanded beads to a surface area of the expanded beads molded article is between 2% and 5%, an average opening area of the through hole portions of the expanded beads is between 5 mm2 and 20 mm2, and the ratio of the number of through hole portions having an opening area of 2 mm2 or more to the number of through hole portions of the expanded beads is 60% or less.
B32B 5/18 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer containing foamed or specifically porous material
B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
patents
