HEFEI HANZHIHE MATERIAL SCIENCE & TECHNOLOGY CO., LTD. (China)
Inventor
Suzuki, Tetsuaki
Kurosawa, Inataro
Teng, Tim
Meng, Tiger
Abstract
The purpose of the present invention is to provide a polyimide resin which, if used in an adhesive film for the production of a semiconductor or an electronic component, is less likely to generate a volatile component even at high temperatures, has good adhesiveness at low temperatures, can be laminated at normal temperature, has proper adhesive force after passing through a high-temperature heat treatment process, can be easily peeled off at normal temperature without leaving an adhesive residue, has little warping in each process, and is capable of preventing a mold flash. The present invention provides a solvent-soluble polyimide resin which has a cyclic imide structure, and which also has a repeating unit that contains a diamine residue of a polysiloxane-based diamine, and a diamine residue having an anilide group and/or a diamine residue having a carboxyl group. The present invention also provides an adhesive film which is obtained by superposing a resin composition that contains the polyimide resin on at least one surface of a heat-resistant film.
The purpose of the present invention is to provide a photosensitive polyimide resin composition which has developer liquid solubility during development and developer liquid insolubility after photo-crosslinking, and which enables the achievement of good film properties and high sensitivity. The present invention provides a photosensitive polyimide resin composition which contains, as essential components, (A) a solvent-soluble polyimide and (B) a diazide compound, wherein: the solvent-soluble polyimide (A) is a block copolymer that comprises, in the main chain, (a) an aromatic tetracarboxylic acid dianhydride residue having a benzophenone structure and (b) a residue of at least one diamine that is selected from the group consisting of an aromatic diamine having an alkyl group at the ortho position of an amino group, an aromatic diamine having an indane structure, and a diamine having a polysiloxane structure; and the content of the diazide compound (B) is from 2.0 to 150 parts by weight relative to 100 parts by weight of the solvent-soluble polyimide (A).
Provided are a binder resin for an electrode of a lithium secondary battery containing a solvent-soluble polyimide having a repeating unit represented by the following Formula [I], and a method of producing the binder resin for an electrode.
(In the formula, Z represents an aromatic or alicyclic tetracarboxylic dianhydride residue, and Ar is an aromatic diamine residue having a carboxyl group and an aromatic diamine residue having an aromatic ether bond, or an aromatic diamine residue having a phenylindan structure).
H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulatorsProcesses of manufacture thereof
H01M 4/485 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of mixed oxides or hydroxides for inserting or intercalating light metals, e.g. LiTi2O4 or LiTi2OxFy
H01M 4/58 - Selection of substances as active materials, active masses, active liquids of inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFySelection of substances as active materials, active masses, active liquids of polyanionic structures, e.g. phosphates, silicates or borates
Provided are a binder resin for a lithium secondary battery electrode, the binder resin containing a solvent-soluble polyimide having a repeating unit represented by general formula [I] below, and a method for preparing the binder resin for an electrode (in the formula, Z represents an aromatic or cycloaliphatic tetracarboxylic acid dianhydride residue, and Ar represents a carboxyl group-containing aromatic diamine residue and an aromatic ether bond-containing aromatic diamine residue, or a phenylindane structure-containing aromatic diamine residue).
H01M 4/485 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of mixed oxides or hydroxides for inserting or intercalating light metals, e.g. LiTi2O4 or LiTi2OxFy
H01M 4/58 - Selection of substances as active materials, active masses, active liquids of inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFySelection of substances as active materials, active masses, active liquids of polyanionic structures, e.g. phosphates, silicates or borates
5.
Conductive agent for battery electrode, electrode containing the same, and battery
Disclosed is a highly reliable secondary battery, as well as an electrode and a conductive agent used therefor, which battery has a long cycle life and is also less likely to be damaged or rupture even when the battery temperature becomes abnormally high. The conductive agent of the battery electrode contains, as the main component, a reaction product between a π-conjugated carbon material and a soluble polyimide, preferably a soluble block copolymerized polyimide. The battery electrode is formed by coating a composition containing this conductive agent and an electrode active substance onto a current collector. The battery comprises this electrode.
Polyimide resin composition for use in forming reverse reflecting layer in photovoltaic cell and method of forming reverse reflecting layer in photovoltaic cell used therewith
Disclosed are a method of forming a back reflection layer in a solar cell, a composition used therefor, and a solar cell having a back reflection layer formed by the method, which layer has superior heat-resistance and various types of durabilities, and can contribute to improving the conversion rate of solar cells and reliability during long-term use, and which method can form a back reflection layer in a solar cell easily and at low cost. The polyimide resin composition for use in forming a back reflection layer in a solar cell includes an organic solvent, a polyimide resin dissolved in the organic solvent, and light-reflecting particles dispersed in the organic solvent.
H01L 31/0232 - Optical elements or arrangements associated with the device
C09D 179/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
H01L 31/056 - Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means the light-reflecting means being of the back surface reflector [BSR] type
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
7.
POLYIMIDE RESIN COMPOSITION FOR USE IN FORMING INSULATION FILM IN PHOTOVOLTAIC CELL AND METHOD OF FORMING INSULATION FILM IN PHOTOVOLTAIC CELL USED THEREWITH
Disclosed are a polyimide resin composition for use in forming an insulation layer in a photovoltaic cell, a method of forming an insulation layer in a photovoltaic cell used therewith, and a photovoltaic cell having an insulating layer formed by the method, that have an optimal rheological property for screen printing and the like, allow wettability of each coated substrate to be improved, are capable of continuous printing 500 or more times, and can coat a predetermined area without solvent boil, cissing or pinholes being produced after printing and coating or when drying and curing. The polyimide resin composition for use in forming an insulation film in a photovoltaic cell is a heat-resistant polyimide resin capable of melting in a mixed solvent of a first organic solvent (A) and a second organic solvent (B), wherein the polyimide resin containing an alkyl group and/or a perfluoroalkyl group in repeating units of the polyimide, and having a thixotropic property, is included in the mixed solvent.
H01L 31/04 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof adapted as photovoltaic [PV] conversion devices
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
8.
POLYIMIDE RESIN COMPOSITION FOR USE IN FORMING REVERSE REFLECTING LAYER IN PHOTOVOLTAIC CELL AND METHOD OF FORMING REVERSE REFLECTING LAYER IN PHOTOVOLTAIC CELL USED THEREWITH
Disclosed are a method of forming a reverse reflecting layer in a photovoltaic cell, a composition used therefor, and a photovoltaic cell having a reverse reflecting layer formed by the method, that have superior heat-resistance and various types of durability, and can contribute to improving the conversion rate of photovoltaic cells and reliability during long-term use, and that can form a reverse reflecting layer in a photovoltaic cell easily and at low cost. The polyimide resin composition for use in forming a reverse reflecting layer in a photovoltaic cell includes an organic solvent, a polyimide resin dissolved in the organic solvent, and light reflective particles dispersed in the organic solvent.
Disclosed is a polyimide composition for semiconductor devices, which has a rheological characteristics suited for screen printing and dispense coating, which has an improved wetting property with various coating bases, by which continuous printing of 500 times or more can be attained, with which blisters, cissing and pinholes are not generated after printing and drying or during drying or curing, which can coat a desired area. A method of forming a film in a semiconductor and semiconductors having the film formed by this method as an insulation film, protective film or the like are also disclosed. The composition for semiconductor devices contains a mixed solvent of a first organic solvent (A) and a second organic solvent (B); and a polyimide resin having at least one group selected from the group consisting of alkyl groups and perfluoroalkyl groups in recurring units, and having thixotropic property, the polyimide resin being dissolved in the mixed solvent.
C08G 69/26 - Polyamides derived from amino carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
C09D 179/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
10.
Conductive agent for battery electrode, electrode containing the same, and battery
Disclosed is a highly reliable secondary battery, as well as an electrode and a conductive agent used therefor, which battery has a long cycle life and is also less likely to be damaged or rupture even when the battery temperature becomes abnormally high. The conductive agent of the battery electrode contains, as the main component, a reaction product between a π-conjugated carbon material and a soluble polyimide, preferably a soluble block copolymerized polyimide. The battery electrode is formed by coating a composition containing this conductive agent and an electrode active substance onto a current collector. The battery comprises this electrode.
H01M 4/583 - Carbonaceous material, e.g. graphite-intercalation compounds or CFx
H01B 1/24 - Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon, or silicon
B82Y 30/00 - Nanotechnology for materials or surface science, e.g. nanocomposites
H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulatorsProcesses of manufacture thereof
Provided is a resin composite electrolytic copper foil having a further increased thermal resistance, and an increased plating adhesion strength when a plating process is performed after a desmear process is performed in additive method processing. A rough surface having a plurality of fine projections, a surface roughness (Rz) in the range of 1.0 μm to 3.0 μm, and a brightness value of 30 or lower, is formed on one surface of an electrolytic copper foil (A), and a layer of a resin composition (B) is formed on the rough surface, wherein the resin composition (B) contains a block copolymer polyimide resin (a) constituted by alternately and repeatedly connecting imide oligomers made of first and second building units.
B32B 15/088 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyamides
C25D 7/00 - Electroplating characterised by the article coated
Provided is a method for producing a modified polyimide containing a polycarbonate, and having excellent electrical characteristics and adhesiveness, and excellent heat resistance, flexibility, flexion, chemical resistance, storage stability, and low warpage. Also disclosed are said modified polyimide, a composition containing said polyimide, and applications therefor. In this method, tetracarboxylic dianhydride oligomer containing a polycarbonate component is synthesized by reacting tetracarboxylic dianhydride with an isocyanate-terminated oligomer containing a polycarbonate component and having excellent flexibility. Subsequently, this oligomer is reacted with an aromatic diamine and an aromatic tetracarboxylic dianhydride to form a polyimide block copolymer. According to this method, a broad range of aromatic diamines can be selected, and by appropriately selecting the aromatic diamine, it is possible to produce an excellent modified polyimide which is capable of simultaneously satisfying the aforementioned characteristics.
Disclosed are: a photosensitive modified polyimide resin composition having excellent electrical properties and adhesion properties, also having excellent heat resistance, flexibility, bending properties, low warpage properties, chemical resistance and storage stability, and having photo-fabrication properties; a resin film formed from the composition; a printed circuit board or a flexible printed circuit board (FPC), each of which has the film as an insulating and protective film or an interlayer insulation film; and others. The photosensitive modified polyimide resin composition comprises a modified polyimide containing a flexible structure (e.g., a polycarbonate) in the main chain and having a specific structure, a photosensitizer, a heat-curing agent, and a solvent.
Disclosed is a copper foil with a resin, which permits the application of a copper foil having an extremely low-roughness matte surface, without impairing the adhesiveness to the resin composition of a copper-clad laminate. Specifically disclosed is a copper foil with a resin, which is provided with both a copper foil and a polyimide resin layer, said polyimide resin layer containing both a specific block copolyimide resin and an inorganic filler.
B32B 15/088 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyamides
H05K 1/09 - Use of materials for the metallic pattern
15.
CONDUCTIVE AGENT FOR BATTERY ELECTRODE, ELECTRODE CONTAINING THE SAME, AND BATTERY
Disclosed is a highly reliable battery having a long cycle life, which is at low risk of breakage or bursting even when the battery temperature becomes extremely high. An electrode and a conductive agent used in the battery are also disclosed. The conductive agent for battery electrodes contains, as a main component, a reaction product between a π-conjugated carbon material and a soluble polyimide, preferably a soluble block copolymerized polyimide. The battery electrode is formed by applying a composition containing the conductive agent and an electrode active material onto a collector. The battery comprises this electrode.
Disclosed is a suspension of an electrodeposition coating composition which contains, as a resin component, a block copolymerized polyimide which has a siloxane bond in the molecular skeleton, while containing an anionic group in a molecule. Preferably, the block copolymerized polyimide contains a diamine having a siloxane bond in the molecular skeleton as one of diamine components. It is also preferable that the anionic group is composed of a carboxylic acid group or a salt thereof and/or a sulfonic acid group or a salt thereof. This electrodeposition coating composition enables to efficiently form a highly insulating electrodeposited film which is excellent in heat resistance and uniformity in film properties, and hardly suffers from cracks or separation from the object on which it is electrodeposited.
C09D 5/44 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects producedFilling pastes for electrophoretic applications
C09D 179/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
C09D 183/10 - Block or graft copolymers containing polysiloxane sequences
C25D 13/06 - Electrophoretic coating characterised by the process with organic material polymers
17.
PHOTOSENSITIVE RESIN COMPOSITION, AND FLEXIBLE PRINT CIRCUIT BOARD USING THE SAME
Disclosed is a photosensitive resin composition comprising components (A), (B) and (C), wherein the component (A) is an alkali-soluble resin, the component (B) is at least one compound selected from the group consisting of a compound having a structure represented by the formula (1), a compound having an isocyanurate ring and an imide compound having one or two imide groups which is different from the compound of the component (A), and the component (C) is a quinonediazide compound. P=X (1) wherein P represents a phosphorus atom, wherein the number of covalent bonds is 5; X represents a nitrogen atom or an oxygen atom, wherein the number of covalent bonds is 3 when X represents a nitrogen atom, the number of covalent bonds is 2 when X represents an oxygen atom, and the phosphorus atom and the nitrogen or oxygen atom are bound to each other via a double bond.
A metal composite film that excels in heat resistance and adhesion, being suitable for use in a flexible printed wiring board capable of minute wiring formation; and a process for producing the same. There is provided a metal composite film obtained by forming a thermoplastic polyimide layer on at least one major surface of an insulating film and further forming a metal layer on the surface of the thermoplastic polyimide layer by electroless plating followed by electrolytic plating. This metal composite film excels in heat resistance and adhesion, and also excels in adhesion even after minute wiring formation, so that the metal composite film finds appropriate application in high-density flexible printed wiring boards having minute circuits.
C25D 5/56 - Electroplating of non-metallic surfaces of plastics
B32B 15/088 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyamides
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C25D 7/00 - Electroplating characterised by the article coated
A photosensitive ink that when used as an ink for screen printing, forms a film excelling in insulation, heat resistance, low warpage, low elasticity and adherence to base material, and that ensures low possibility of defects, such as screen mesh clogging, blur, thin spot and void, despite repeated screen printing, thus excelling in printing work performance. There is provided a photosensitive ink composition for screen printing, comprising an organic solvent and, dissolved therein, 100 parts by weight of organic-solvent-soluble block copolymer polyimide and 1 to 100 parts by weight of photoacid generator. The block copolymer polyimide contains, as at least moiety of the diamine component, a diamine having a siloxane bond in its molecular skeleton and an aromatic diamine having hydroxyl and/or carboxyl in the ortho position to amino.
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
C09D 11/033 - Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
C09D 11/10 - Printing inks based on artificial resins
C09D 11/101 - Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
C09D 11/106 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
A photosensitive resin composition comprising 100 parts by mass of polycondensate (A) having a structure resulting from dehydration condensation between one or two or more tetracarboxylic acid dianhydride and one or two or more aromatic diamines having mutually ortho-positioned amino and phenolic hydroxyl groups and 1 to 100 parts by mass of photosensitive diazonaphthoquinone compound (B), wherein the polycondensate (A) has a weight average molecular weight of 3000 to 70,000.
patents
