Abstract

This adhesive sheet has a pair of adhesive layers and a plurality of linear heat conductors. The pair of adhesive layers are formed using a resin composition and face each other. One end of each of the plurality of heat conductors is covered by one of the pair of adhesive layers, and the other end of each of the plurality of heat conductors is covered by the other of the pair of adhesive layers. The resin composition contains (A) a thermosetting resin, (B) a thermoplastic resin having a glass transition temperature of 50°C or higher, and (C) a thermoplastic resin having a glass transition temperature of less than 50°C.

IPC Classes  ?

• H01L 23/373 - Cooling facilitated by selection of materials for the device
• B82Y 30/00 - Nanotechnology for materials or surface science, e.g. nanocomposites
• H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

This invention provides a method for resist pattern formation, for use in the preparation of a circuit board having landless or narrow-land-width throughholes that realize increased density in a circuit board, a process for producing a circuit board, and a circuit board. The method for resist pattern formation comprises the step of forming a resin layer and a mask layer on a first plane of a board having throughholes and the step of feeding a resin layer removing liquid from a second plane, which is opposite to the first plane of the board, to remove the resin layer on the throughholes and the peripheries of the throughholes in the first plane. There are also provided a process for producing a circuit board using the method for resist pattern formation, and a circuit board.

IPC Classes  ?

• H05K 3/42 - Plated through-holes
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
• H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material