A micro-galvanometer includes a reflecting part, at least two supporting parts surrounding the reflecting part, and a fixing part surrounding the at least two supporting parts. The reflecting part includes a substrate and a metasurface layer on the substrate. The metasurface layer includes a substrate layer and a plurality of nanopillars on the substrate layer. The metasurface layer is configured to receive and reflect first light. The nanopillars are configured to reflect a portion of the first light to emit sub-reflected light. Each supporting part includes a first end and a second end opposite to the first end. The first end is movably connected to the reflecting part. The fixing part is connected to the second end. The reflecting part can swing/rotate relative to the fixing part.
The present disclosure provides a method and a system for assembling microelectronic components. The method includes: a substrate including a first surface is provided, the first surface includes a plurality of first areas and a second area surrounding each first area, the first area has a lyophilic surface, and the second area has a lyophobic surface; a plurality of adhesive liquid droplets automatically form on the first areas; and a plurality of microelectronic components on a carrier plate transferred onto the adhesive liquid droplets, wherein the microelectronic components are automatically aligned with the first areas to obtain an assembled structure.
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
3.
CONTROL METHOD FOR DETECTING SYSTEM, DETECTING SYSTEM AND VEHICLE
A detecting system, a control method therefor and a vehicle are provided, including a transmitting circuit, a receiving circuit, a driving circuit, a positioning circuit, and an inertia detecting circuit; the transmitting circuit and the receiving circuit detect a distance to an object within a target range. The control method includes obtaining positioning information and acceleration information of a current cycle; obtaining a speed and an acceleration of the current cycle according to the positioning information, the acceleration information, and a preset correction algorithm; obtaining a predicted speed and a predicted acceleration of a next cycle according to the speed, the acceleration, and a preset prediction algorithm; and in the next cycle, controlling the driving circuit according to the predicted speed and the predicted acceleration to control the power consumption of the transmitting circuit and the receiving circuit.
A lens module includes a light source, a first silicon photonics chip, an image sensor, and an optical fiber. The image sensor is electrically connected to the first silicon photonics chip. The optical fiber is coupled to the first silicon photonics chip. The first silicon photonics chip can receive light emitted by the light source and form first optical signals, the image sensor can convert an optical image into electrical signals and transmit the electrical signals to the first silicon photonics chip, the first silicon photonics chip can modulate the first optical signals with the electrical signals to form second optical signals, and the optical fiber can transmit the second optical signal. The present disclosure further provides a terminal device.
A substrate packaging structure which can reducing the probability of shape distortion or overflow of the packaging material is disclosed. The substrate packaging structure includes a substrate, an electronic component, and a packaging layer, and a limiting portion is arranged on the substrate. The limiting portion can guide the packaging material into the area enclosed by the limiting portion, reducing the probability of shape distortion or overflow caused by arbitrary diffusion of the packaging material. This allows for the formation of the packaging layer with an appropriate thickness and regular shape, thereby reducing the risk of visual defects. A camera module carrying the substrate packaging structure is also disclosed.
A package structure of an optical emission module and a preparation method thereof are provided. The package structure includes a substrate module and an optical emission module. The substrate module includes a substrate, and multiple channels are defined in the substrate module. The optical emission module is located on the substrate. Two ends of each channel extend to the substrate and the optical emission module, respectively. An inner wall of each channel is provided with a conductive layer to form a hollow conductive channel. The hollow conductive channel is electrically connected to the substrate and the optical emission module.
A packaging structure, a preparation method, and a camera module are provided. The packaging structure includes a substrate module, and a light emitting unit and a light receiving unit located on the substrate of the substrate module. The substrate module defines first channels and second channels. Two ends of each first channel extend to the substrate and the non-photosensitive area of the light receiving unit, respectively. A first conductive layer is formed on an inner wall of each first channel to form a first hollow conductive channel, which is electrically connected to the substrate and the non-photosensitive area. Two ends of each second channel extend to the substrate and the light emitting unit, respectively. A second conductive layer is formed on an inner wall of each second channel to form a second hollow conductive channel, which is electrically connected to the substrate and the light emitting unit.
G01S 7/481 - Constructional features, e.g. arrangements of optical elements
G01S 17/894 - 3D imaging with simultaneous measurement of time-of-flight at a 2D array of receiver pixels, e.g. time-of-flight cameras or flash lidar
H10F 55/25 - Radiation-sensitive semiconductor devices covered by groups , or being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
H10F 77/00 - Constructional details of devices covered by this subclass
8.
AIR PURIFIER AND AIR VENTILATION DEVICE HAVING THE SAME
An air purifier includes a ventilation cover, a filtering component, and a sterilization component. The ventilation cover has an air inlet and an air outlet. The filtering component is fixed at the air outlet. The sterilization component is disposed between the air inlet and the air outlet. An air ventilation device may include the air purifier.
B01D 46/00 - Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
F24F 8/108 - Treatment, e.g. purification, of air supplied to human living or working spaces otherwise than by heating, cooling, humidifying or drying by separation, e.g. by filtering using dry filter elements
F24F 8/20 - Treatment, e.g. purification, of air supplied to human living or working spaces otherwise than by heating, cooling, humidifying or drying by sterilisation
F24F 8/22 - Treatment, e.g. purification, of air supplied to human living or working spaces otherwise than by heating, cooling, humidifying or drying by sterilisation using UV light
9.
METHOD FOR MANUFACTURING CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENT
A method for manufacturing a circuit board that includes a first electronic component and a circuit substrate is provided. The first electrode component includes two electrodes. The circuit substrate includes an inner substrate and an outer substrate formed on the inner substrate. The inner substrate defines a receiving cavity, and the first electronic component received in the receiving cavity. Each electrode faces an inner sidewall of the receiving cavity. The inner substrate includes a first insulating layer and a blocking layer embedded in the first insulating layer, an end of the blocking layer exposed from the inner sidewall. The outer substrate defines two through holes. Each through hole passes through a portion of the first insulating layer connected to the inner sidewall and exposes the blocking layer. A top end of each of the two electrodes facing the outer substrate is partially received in one through hole.
A packaging structure and a preparing method are provided. The structure includes a first packaging body, a second packaging body, a first component embedded in the first packaging body, and a second component embedded in the second packaging body. The first packaging body includes a first surface and a second surface. The first packaging body includes a first conductive structure partially exposed from the second surface, and the first conductive structure is electrically connected to the first component. The second packaging body is formed on the first packaging body and includes a third surface and a fourth surface. The second packaging body includes a second conductive structure partially exposed from the third and fourth surfaces. The second conductive structure exposed from the third surface is electrically connected to the exposed first conductive structure. The second conductive structure exposed from the fourth surface is electrically connected to the second component.
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
11.
PHOTOELECTRIC PACKAGING STRUCTURE, PREPARATION METHOD AND CAMERA MODULE
A photoelectric packaging structure, and a preparation method of the photoelectric packaging structure, and a camera module having the photoelectric packaging structure are provided. The photoelectric packaging structure includes a substrate module and a photosensitive chip. The substrate module includes a substrate, and the substrate module defines a plurality of channels. The photosensitive chip is located on the substrate, and includes a photosensitive area and a non-photosensitive area connected to the photosensitive area. Two ends of each of the channels extend to the substrate and the non-photosensitive area, respectively. A conductive layer is formed on an inner wall of each of the channels to form a hollow conductive channel. The hollow conductive channel is electrically connected to the substrate and the non-photosensitive area.
H10F 39/00 - Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group , e.g. radiation detectors comprising photodiode arrays
H10F 71/00 - Manufacture or treatment of devices covered by this subclass
A circuit board assembly includes a first substrate and at least one first pad. The first substrate includes a first surface, a second surface, and a side surface. The first surface and the second surface are opposite to each other along a first direction, the side surface connects the first surface to the second surface, a groove is defined on the side surface and extending through the first surface and the second surface. Each first pad is accommodated in a corresponding groove of the groove and connects to a groove wall of the groove, each first pad includes a first welding surface, a second welding surface, and a third welding surface, the first welding surface connects the first surface, the second welding surface connects the second surface, the third welding surface connects the first welding surface to the second welding surface. The present disclosure further provides a terminal device.
A lens module with stable back focal length and a device having the lens module are provided. The lens module includes a lens assembly, a holder, a circuit board, and a sensor. The coefficient of thermal expansion of the holder is less than or equal to 0.6 (10−5 cm/cm/° C.), thus, the deformation of the holder can be almost ignored, and the distance between the lens assembly and the sensor (i.e., the back focal length) will remain unchanged, thereby reducing image blurring caused by changes in the back focal length.
A preparation method for a rigid-flexible printed circuit board involves initially providing a flexible board, divided into two regions along its extension direction. A first protective layer is applied to the flexible board, with distinct parts covering the two regions respectively. Subsequently, a rigid board is positioned in the second region, designed with a notch to alleviate height discrepancies introduced by the protective layer. The final step involves laminating the rigid board to the flexible board. This ensures the portion of the rigid board adjacent to the second portion is aligned flush with the rest, resulting in a rigid-flex PCB with improved flatness. This method is particularly significant for applications requiring precise structural integrity and consistency in electronic devices.
A method for manufacturing a metasurface lens assembly, comprising the steps of: providing a substrate including a first region, a second region, and a third region connecting the first and second regions; etching the third region to form micron-sized support structures; etching the first region to form nanoscale metasurface lenses connected to the support structures; and removing the support structures to separate the metasurface lenses from the second region, resulting in a metasurface lens assembly. This method significantly enhances the structural strength of the metasurface microstructures, reducing damage during subsequent processing steps. Additionally, a metasurface lens assembly is provided.
A projection system includes a first lens, a second lens, and a third lens arranged in sequence from a projection surface to an image source surface. The projection system satisfies expressions below:
A projection system includes a first lens, a second lens, and a third lens arranged in sequence from a projection surface to an image source surface. The projection system satisfies expressions below:
10
°
<
DFOV
<
14
°
;
CRA
<
0.52
°
;
4.2
<
TR
<
5.9
;
0.29
<
f
1
/
f
23
<
0.75
;
0.67
<
f
3
/
f
12
<
1.73
;
12
<
OTL
/
IH
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15
;
and
1.1
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CT
3
/
ET
3
<
1.3
.
A projection system includes a first lens, a second lens, and a third lens arranged in sequence from a projection surface to an image source surface. The projection system satisfies expressions below:
10
°
<
DFOV
<
14
°
;
CRA
<
0.52
°
;
4.2
<
TR
<
5.9
;
0.29
<
f
1
/
f
23
<
0.75
;
0.67
<
f
3
/
f
12
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1.73
;
12
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OTL
/
IH
<
15
;
and
1.1
<
CT
3
/
ET
3
<
1.3
.
Wherein: DFOV is a maximal field-of-view angle of the projection system; CRA is a chief ray angle; TR is a throw ratio; f1 is a focal length of the first lens; f23 is a combined focal length of the second lens and the third lens; f3 is a focal length of the third lens; f12 is a combined focal length of the second lens and the first lens; OTL is an optical total length; IH is a maximum image height on the image source surface; CT3 is a center thickness of the third lens; ET3 is an edge thickness of the third lens. An illumination device is further disclosed.
G02B 13/16 - Optical objectives specially designed for the purposes specified below for use in conjunction with image converters or intensifiers
G02B 9/16 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having three components only arranged + – + all the components being simple
G02B 13/18 - Optical objectives specially designed for the purposes specified below with lenses having one or more non-spherical faces, e.g. for reducing geometrical aberration
An imaging module including a lens for emitting signal light, a filter, a driving element, and an image generating component. The filter includes first filtering units and second filtering units. Each first filtering unit is alternately connected with one second filtering unit in a direction perpendicular to an optical axis of the lens. Each first filtering units is used to transmit light in a first wavelength band in the signal light, and each second filtering units is used to transmit light in a second wavelength band in the signal light. The driving element is used to drive the filter to shift. The image generating component is used to generate a first target image based on the light in the first wavelength band, or generate a second target image based on the light in the second wavelength band. An imaging device is also provided.
H04N 23/11 - Cameras or camera modules comprising electronic image sensorsControl thereof for generating image signals from different wavelengths for generating image signals from visible and infrared light wavelengths
18.
METHOD FOR ESTABLISHING ELECTRICAL CONNECTION, CAMERA MODULE AND ELECTRONIC DEVICE HAVING THE CAMERA MODULE
A method for electrical connection is presented, including preparing a pre-bonding assembly with a first and second connection pad and an insulating layer, where the first pad includes two sections, with the second staggered and covered by the insulating layer. An activatable conductive film, filled with isolated conductive particles, is placed between the first pad's section and the second pad. Upon pressing, the film activates, extending into the insulating layer, connecting the first section and second pad electrically, while isolating the second section. This provides a reliable connection, suitable for camera modules and other electronics.
Disclosed in the present application is a three-dimensional (3D) contour measurement system. The 3D contour measurement system includes a light source unit, an image acquisition unit, and a control device. The light source unit emits light beam, the light source modulation unit modulates the light beam into a structured light with a preset frequency. The image acquisition unit acquires a stripe image of the object. The control device processes the stripe image to obtain a spectral image, obtains a first phase corresponding to a first structured light, a second phase corresponding to the second structured light, and an equivalent phase corresponding to the structured light based on the spectral region, and obtains a contour height of the object based on the first phase, the second phase, and the equivalent phase.
The present disclosure provides a lens module and an electronic device with lens module. The lens module includes a lens, a bracket, a connecting board, a circuit board and a first adhesive layer. The lens is connected on the bracket. The connecting board has a first surface facing the bracket. A first groove is formed on the first surface of the connecting board. The circuit board is disposed in the groove and protrudes from the first surface. A photosensitive film is disposed on the circuit board. The bracket is connected on the connecting board through the first adhesive layer.
A dot matrix projector includes an infrared light source used to emit infrared light, a collimating lens, a semi-transparent and semi-reflective plate on an output side of the collimating lens, a diffractive optical element on an output path of the semi-transparent and semi-reflective plate, and an infrared light conversion film on another output path of the semi-transparent and semi-reflective plate. The collimating lens is used to receive the infrared light from the infrared light source and collimate the infrared light to be parallel infrared light. The semi-transparent and semi-reflective plate is used to divide the parallel infrared light into a first part directly transmitting the semi-transparent and a second part being reflected by the semi-transparent and semi-reflective plate. The infrared light conversion film is configured to convert infrared light into visible light. A facial recognition module and an electronic device are also provided.
G06V 10/145 - Illumination specially adapted for pattern recognition, e.g. using gratings
H04N 23/11 - Cameras or camera modules comprising electronic image sensorsControl thereof for generating image signals from different wavelengths for generating image signals from visible and infrared light wavelengths
H04N 23/56 - Cameras or camera modules comprising electronic image sensorsControl thereof provided with illuminating means
A camera includes a light guiding module, an image sensing module, a spectrometer module, and a processor. The light guiding module is configured to receive external incident light and split the incident light into a first light and a second light. The image sensing module is configured to receive the first light and convert the first light into image data. The spectrometer module is configured to receive the second light and obtain spectral information of the second light. The processor is configured for adjusting image data based on the spectral information. The image data includes data of a plurality of pixels, and data of each pixel includes intensities information of three primary colors of light. The processor is configured to adjust the intensity information of each primary color of light in the data of the pixels based on the spectral information.
An imaging device includes a housing, a cover, a supporting plate, a filter assembly, a driving mechanism, and an imaging mechanism. The housing and the cover cooperate to define a mounting cavity. The supporting plate divides the mounting cavity into a first portion and a second portion in a first direction. A second light through hole is defined by the supporting plate. The filter assembly includes a first filter and a second filter in the first portion along a second direction. The driving mechanism extending through the supporting plate includes two driving assemblies respectively connected to the first and second filters, the driving assemblies are configured to drive the first or second filter to cover the second light through hole, or drive the first and second filters to be located on opposite sides of the second light through hole. The imaging mechanism is received in the second portion.
An electronic device includes a camera assembly, a function assembly, and a controller. The camera assembly is configured to capture a first depth image of a first user and a second depth image of the first user. The controller is configured to determine a first spatial position between the first user and the camera assembly according to the first depth image, and control the function assembly to execute a first action according to the first spatial position. The controller further configured to determine a relative displacement between the first user and the camera assembly according to the first depth image and the second depth image, and control the function assembly to execute a second action according to the relative displacement. The second action is an action to adjust a result of the function assembly based on the first action. A method and a non-transitory storage medium are also provided.
G06T 7/55 - Depth or shape recovery from multiple images
G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
H04N 23/66 - Remote control of cameras or camera parts, e.g. by remote control devices
25.
BRACKET, CAMERA MODULE HAVING THE BRACKET, AND ELECTRONIC DEVICE HAVING THE CAMERA MODULE
A bracket includes a bearing plate and multiple supporting plates, the multiple supporting plates being disposed around one side of the bearing plate to form a support space, the bearing plate being penetrated with a first aperture and multiple second apertures, the first aperture is staggered from each of the second apertures, the first aperture and the second apertures communicating with the support space. The bracket provided by the present disclosure is beneficial to reducing the height of the camera module. In addition, the present disclosure also provides a camera module and an electronic device.
An imaging device includes a substrate, a light emitting member, a light receiving member, a cover assembly, and a sealing member. The cover assembly includes a cover plate, a side plate, and a spacer. The side plate cooperates with the cover plate to define a groove, the substrate cooperates with the cover assembly to seal the groove. The spacer is connected to the cover plate and the side plate and separates the groove to form a first space and a second space. A first through hole and a second through hole are defined by the cover plate and respectively communicate with the first space. The light emitting member is received in the first space, the light receiving member is received in the second space. A slot is recessed inwardly from an end surface of the spacer facing away from the cover plate. The sealing member is filled in the slot.
An imaging system for providing high resolution ratio of images under a low cost includes a visible light image module, an infrared image module, and a processor. The visible light image module generates a visible light image. The infrared image module generates an infrared image. The processor executes following processes: acquiring a visible light image and an infrared image; transforming the visible light image and the infrared image into visible light image spectrum information and infrared image spectrum information respectively; acquiring high frequency information from the visible light image spectrum information; merging the high frequency information and the infrared image spectrum information to obtain merged image spectrum information; and transforming the merged image spectrum information into a merged image. An imaging method and a computer readable storage medium are also disclosed.
H04N 23/11 - Cameras or camera modules comprising electronic image sensorsControl thereof for generating image signals from different wavelengths for generating image signals from visible and infrared light wavelengths
G06T 5/10 - Image enhancement or restoration using non-spatial domain filtering
G06T 5/20 - Image enhancement or restoration using local operators
28.
DETECTION DEVICE AND DETECTION METHOD FOR CAMERA MODULE
A detection device and a method for detecting a camera module of a product are provided. The first detection assembly includes a first platform, a turntable, and first detection members. The turntable rotatably is provided with first detection positions. The first detection members are connected to the first platform and surround the turntable. Each first detection position can support the second surface of the product to cause the camera module to face a corresponding first detection member. The turntable rotates the product to cause the camera module to face the next first detection member. The second detection assembly includes a second platform, a fixing table, and a second detection member. The fixing table is provided with a second detection position supporting the first surface of the product to cause the camera module to face the second detection member. The rotation assembly rotates the product detected by the first detection members.
A dynamic vision sensor includes a dispersion lens and a sensor. The dispersion lens is configured to disperse an incident polychromatic light into monochromatic lights with different colors. The incident polychromatic light is reflected from a color subject to be captured. The monochromatic lights with different colors form blur circles, and areas of the blur circles have different sizes on the sensor. The sensor is configured to output a first event signal according to a variation of an energy corresponding to a variation of a kind of a blur circle. The kind of the blur circle is determined according to the sizes of the areas of the blur circles, and different sizes of the areas of the blur circles correspond to different kinds of the blur circles. A dynamic vision camera and a method for sensing dynamic vision are also disclosed.
An optical lens includes a first lens, a second lens, and a third lens sequentially arranged along an optical axis from an object side to an image side. At least part of an object surface of the first lens is a convex surface, an image surface of the first lens is a convex surface. At least part of an object surface of the second lens is a concave surface, an image surface of the second lens is a convex surface. At least part of an object surface of the third lens is a convex surface, an image surface of the third lens is a concave surface. An aperture value of the optical lens satisfies a following condition: 1.0≤Fno≤1.3, wherein Fno represents the aperture value of the optical lens. An electronic device is provided.
G02B 9/14 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having three components only arranged + – +
G02B 13/00 - Optical objectives specially designed for the purposes specified below
A test fixture includes a fixed base for placing a module and probes. The fixed base defines threading needle holes, and the threading needle holes communicate with a surface of the fixed base adjacent to the module. The probes are connected with a tester and extend through the threading needle holes to contact with the module placed on the fixed base. The tester is capable of testing the module. When the module is disposed on the fixed base, the probes are directly connected with the module for testing, a gilded block between the module and the probes is omitted for improving a stability and an accuracy of test results. An early warning system is also disclosed.
An autofocus camera module includes a circuit board with a plurality of driving elements, and a lens mechanism disposed on the circuit board assembly. The lens mechanism includes a first lens assembly, a second lens assembly, and a liquid lens disposed between the first lens assembly and the second lens assembly. The first lens assembly includes a first lens holder, a first lens group housed inside the first lens holder, and a first conductive line disposed on a surface of the lens hold, the first lens holder is connected to one side of the circuit board assembly. The liquid lens includes connecting pads, and each connecting pad is disposed with a solder material, the connecting pads are soldered to the first lens holder through the solder material, the conductive line electrically connects the connecting pads and the plurality of driving elements.
G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
H04N 23/54 - Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
H04N 23/55 - Optical parts specially adapted for electronic image sensorsMounting thereof
A gimbal module includes a first carrier including a receiving chamber, a first bracket accommodated in the receiving chamber, a lens assembly fixed to the first bracket, and a flexible circuit board connected to the lens assembly. The flexible circuit board extends in an S-shape on a plane as viewed in a height direction of the gimbal module. An electronic device including the gimbal module is also disclosed.
Disclosed in the present invention are a particle detection method, an electronic device, and a storage medium. The particle detection method includes obtaining a detection image; identifying an imaging of a particle in the detection image and obtaining a shadow region of the particle; determining a maximum influence degree of the particle based on an influence degree of each pixel point in the shadow region; and obtaining size information of the particle based on the maximum influence degree of the particle. The present disclosure can distinguish the particles of different sizes, thereby accurately calculating the size of the particle and improving the accuracy of the particle detection.
A light-emitting module includes a light source module, a collimating lens module and a deflecting diffraction module. The light source module includes at least two light source arrays. Each light source arrays is configured to emit beams of detection light. The collimating lens module is on an output side of the light source module and includes a plurality of collimating lenses. The deflecting diffraction module is on a side of the collimating lens module facing away the light source module. The deflecting diffraction module is configured to superimpose groups of the detection light.
An anisotropic conductive structure includes a first element, a second element, and an anisotropic conductive film (ACF) arranged between the first element and the second element. The anisotropic conductive structure can balance the height difference caused by the electrical connection portion, which can prevent tilt and open circuit. A lens module and an electronic device carrying the lens module are also provided.
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
H01R 11/01 - Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between their connecting locations
37.
Anti-magnetic interference component and electronic device
An anti-magnetic interference component includes a circuit board, a plurality of electronic components disposed on the circuit board, a flexible board, and at least one first electromagnetic shielding film. The flexible board includes a covering portion and two connecting portions. The covering portion can be bend relative to each of the two connecting portions, the two connecting portions is connected to the circuit board, the covering portion can cover and space apart from the circuit board when the covering portion is bend relative to the two connecting portions, causing the covering portion and the circuit board to cooperatively form an accommodation space for receiving the electronic components. The first electromagnetic shielding film is disposed on the covering portion and the two connecting portions, the first electromagnetic shielding film can face the plurality of electronic components when the covering portion covers the circuit board.
A camera module packaging structure with simplified process, and an electronic device carrying it, includes a FPC, an ACF, an embedded printed circuit board, a no-flow underfill, and a chip-scale package camera module. The present application uses a no-flow underfill, which can omit steps of applying the flux and removing the flux, thus the process is simplified. By setting the ACF in the present application, a stable structure having vertical conduction characteristic and horizontal insulation characteristic is formed between the chip-scale packaged camera module and the flexible circuit board.
H05K 1/14 - Structural association of two or more printed circuits
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
39.
IMAGE ACQUISITION DEVICE, IMAGE ACQUISITION METHOD AND ELECTRONIC DEVICE
An image acquisition device includes an optical sensor and a dimmer. The optical sensor includes a photosensitive area configured to convert optical signal into image signal. The dimmer is on a side of the optical sensor that receives the optical signal. The dimmer completely covers the photosensitive area. The dimmer is configured for modulating intensity of the optical signal projected onto the optical sensor. The dimmer includes dimming blocks. Each dimming block is configured for modulating intensity of light projected onto a portion of the photosensitive area. An electronic device and an image acquisition method are also provided.
A camera module includes a circuit board, a photosensitive chip located on a first surface of the circuit board, an electronic element located on a second surface of the circuit board, and a steel sheet located on the second surface. A surface of the steel sheet facing the circuit board defines a groove for receiving the electronic element. A heat conductive paste is located on the electronic element and in contact with the steel sheet.
G03B 17/55 - Details of cameras or camera bodiesAccessories therefor with provision for heating or cooling, e.g. in aircraft
H04N 23/52 - Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
H04N 23/54 - Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
A substrate with a crack detection function, comprising an installation area for installing hardware, a wiring area, and a detection assembly. The wiring area is set around the installation area. The detection assembly is in the wiring area. The detection assembly includes a plurality of detecting units and a plurality of connecting units. The plurality of detecting units is set around the wiring area. Two ends of each connecting unit are respectively connected to two detecting units, forming a circuit for detecting whether cracks exist in the substrate. Each detecting unit includes at least two detecting endpoints. Each connecting unit includes at least two detecting wires, with each end of one detecting wire connected to one detecting endpoint of two detecting units. The at least two detecting wires between two non-adjacent detecting units are set around outside of the installation area to form a closed loop area.
A packaging module includes a circuit board, a chip, a radiation fin, and a light conducting member. The chip, the radiation fin, and the light conducting member are arranged on a same surface of the circuit board, the light conducting member and the circuit board enclosing a chamber containing the chip. The radiation fin surrounds the chip and is in contact with the light conducting. The circuit board includes a first through hole extending in a thickness direction of the circuit board and corresponding to the chip. In the packaging module, heat is transferred to the outside along two different directions, via the first through hole and via the radiation fin, improving heat dissipation efficiency.
A lens module with reduced height, and an electronic device carrying it, includes a lens assembly, a printed circuit board, a filter, and a photosensitive chip. The first and second opposing surfaces of the printed circuit board are each grooved to respectively hold the filter and the photosensitive chip. The existence of the first and second grooves enables a significant reduction to be made in the total height of the lens module. Moreover, the lens module adopts the FC packaging structure, not requiring a bracket, to further reduce the volume of the lens module.
A fixing assembly of reduced size, with a light-passing aperture for a lens holder and lens, includes a sidewall and an extending portion, the first sidewall is a ring-shaped structure, the extending portion is disposed on inner wall of the first sidewall, and the extending portion extends from an inner surface of the first sidewall. A top surface of the extending portion is recessed relative to a top surface of the first sidewall to form a groove. The lens is received in the groove and connected to the extending portion. The light-passing aperture is disposed on a surface of the lens away from the at least one extending portion, and the aperture is clamped with the lens holder.
A circuit board includes a first electronic component and a circuit substrate. The first electrode component includes two electrodes. The circuit substrate includes an inner substrate and an outer substrate formed on the inner substrate. The inner substrate defines a receiving cavity, and the first electronic component received in the receiving cavity. Each electrode faces an inner sidewall of the receiving cavity. The inner substrate includes a first insulating layer and a blocking layer embedded in the first insulating layer, an end of the blocking layer exposed from the inner sidewall. The outer substrate defines two through holes. Each through hole passes through a portion of the first insulating layer connected to the inner sidewall and exposes the blocking layer. A top end of each of the two electrodes facing the outer substrate is partially received in one through hole.
A camera module compensating for loss of focus caused by heat-deformation of a lens assembly above a photosensitive element includes the lens assembly, the photosensitive element, a circuit board, and a focusing assembly. The photosensitive element receives light through the lens assembly. The focusing assembly is arranged to apply deformation when temperature changes by moving the photosensitive element away from or toward the lens assembly, so correcting a focal length of the lens assembly on the photosensitive element. An electronic device is also disclosed.
A camera module of reduced overall height includes multiple electronic components embedded in a PCB, multiple first holes defined on the PCB, each first hole enables a connection with one electronic component. A sensor chip is attached to the PCB by anisotropic conductive adhesive, multiple conductive balls on the sensor chip enter the multiple first holes and connect with the multiple electronic components. The embedded electronic components and the PCB form an integrated and single structure, avoiding multiple installations of electronic components one by one into the board and simplifying the manufacturing process of the camera module. The multiple conductive balls sinking into the multiple first holes reduce overall size of the camera module. A method for manufacturing the camera is also disclosed.
H04N 23/54 - Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
H04N 23/57 - Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 1/14 - Structural association of two or more printed circuits
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
H05K 3/36 - Assembling printed circuits with other printed circuits
H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
48.
Connecting assembly, camera module, and electronic device
A connecting assembly comprises a substrate, a layer of conductive adhesive with conductive particles, a connection board, and a light transmission component. The connection board and the light transmission component are both glued to the substrate by the layer of conductive adhesive therebetween, and an operator can observe the a degree of deformation of the conductive particles in the layer of conductive adhesive to determine whether a conductive connection between the light transmission component and the substrate is affected. The connecting assembly allows an operator to effectively observe conductivity of every product in a nondestructive manner. A camera module comprising the connecting assembly and an electronic device are also disclosed.
H04N 23/57 - Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
H01R 4/04 - Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one anotherMeans for effecting or maintaining such contactElectrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
A photographing device able to not requiring installation and space in a non-display area of an electronic device includes a base, a prism mechanism, and a photosensitive mechanism. The base includes a receiving groove, and inclined first and second stop surfaces. The prism mechanism is rotatably coupled to the base, accommodated in the receiving groove, and includes incident and light-emitting surfaces at right angles. The first and second stop surfaces are in the rotation path of the light emitting surface. The photosensitive mechanism includes a photosensitive surface parallel to the first stop surface. When the light emitting surface resists against the first stop surface, the light emitting surface faces the photosensitive surface, and at least part of the incident surface is located outside the receiving groove. When the light emitting surface resists against the second stop surface, the incident surface is accommodated in the receiving groove.
A voice coil motor held immobile by magnetic attraction when not in use for photography purposes includes a base, a magnet fixed thereto, a carrier, a magnetic member, and a coil. The magnetic member is fixed to the carrier and is attracted by a permanent magnetic field (first MF) of the magnet on the base. The coil is fixed to the carrier and the magnetic member. When the voice coil motor is powered on, the coil generates a second magnetic field (second MF) opposing the first MF. The second MF reduces or eliminates the attractive force of the first MF of the magnet, to separate the carrier and its fittings and allow them to work freely. A lens module and an electronic device are further provided.
G02B 7/08 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
51.
Photosensitive assembly having a bent shape and method for manufacturing the same, and camera module having the same
A photosensitive assembly includes a circuit board and a photosensitive chip disposed on the circuit board. A first direction is defined as a direction from the circuit board to the photosensitive chip. The circuit board is convex in the first direction or an opposite direction of the first direction. The photosensitive chip is in the first direction or the opposite direction of the first direction. A bending direction of the circuit board is the same as a bending direction of the photosensitive chip.
H10F 39/00 - Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group , e.g. radiation detectors comprising photodiode arrays
52.
Imaging device with switchable filters and electronic device having the imaging device
A simple and integrated imaging device for housing motor-switchable and laterally-moving filters between a camera-lens holder and an imaging chip comprises the switchable filters in a cavity and a switching mechanism, and a driving mechanism are also in the cavity. The imaging chip is carried by a flexible printed circuit board. The driving mechanism connected to the switching mechanism drives the switching mechanism to slide back and forth underneath the camera-lens holder, so that either the first or the second switchable filter covers a through hole allowing light to fall on the imaging chip. An electronic device including the imaging device is also disclosed.
A camera module comprises a supporting member for supporting a sensor chip to move relative to a lens for correcting camera shake, a plurality of bulges is provided between the supporting member and a bottom plate. The bulges provide a reduced resistance to sliding on the supporting member. An electronic device using the module is also disclosed.
H04N 23/54 - Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
G03B 5/00 - Adjustment of optical system relative to image or object surface other than for focusing of general interest for cameras, projectors or printers
H04N 23/68 - Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
54.
Camera module with reduced width and electronic device having the same
A camera module includes a circuit board, a lens assembly, and a first board. The circuit board includes a first surface, a second surface opposite to the first surface, a first sidewall, and a second sidewall opposite to the first sidewall. Each of the first sidewall and the second sidewall connects the first surface to the second surface. The lens assembly is disposed on the first surface. The first board is connected to the first sidewall. The first board is inclined or perpendicular to the first surface. The first board is disposed on a side of the lens assembly.
H04N 23/57 - Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
G02B 7/10 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification by relative axial movement of several lenses, e.g. of varifocal objective lens
H04N 23/54 - Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
H04N 23/55 - Optical parts specially adapted for electronic image sensorsMounting thereof
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
55.
LENS MODULE WITH FINELY-ADJUSTABLE APERTURE AND ELECTRONIC DEVICE
A lens module with light-passing hole which is finely adjustable in size includes a lens and aperture assembly. The aperture assembly includes cover body, driving member, rotating disk, and light-blocking blades. The cover body is outside the lens and defines a first aperture. The rotating disk is on the cover body and defines a second and adjustable aperture. The blades are between the cover body and rotating disk, each blade comprising a side surface and the plurality of blades work together to form a light-passing hole. The rotating disk is driven to rotate by the driving member, the blades thereby moving closer to or away from each other, to adjust an aperture of the lens module. The present disclosure further provides an electronic device.
A carrier of a camera module to receive glue for fixing a lens structure thereon comprises a glue dispensing area, the glue dispensing area comprises a bonding area and a groove extending outwards from the bonding area, the groove is directly adjacent to the bonding area to receive glue overflowing from the glue dispensing area. The groove prevents glue dispensed in the bonding area from overflowing towards, or entering, the center of the carrier and improves the production quality of the camera module. The application also discloses a camera module including the above camera carrier.
A gas sampling mechanism protecting an odor sensor and permeable membrane against direct exposure to the gas molecules of an external environment provides a one-way airflow, and includes an inlet chamber, a pump chamber connected to the inlet chamber, and a pump assembly connected to the pump chamber. The pump chamber can compress or evacuate air inside the pump chamber. An inlet valve is moveably arranged between the inlet chamber and the pump, and an outlet valve is movably arranged between the pump chamber and the ambient.
G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups
G01F 3/22 - Measuring the volume flow of fluids or fluent solid material wherein the fluid passes through the meter in successive and more or less isolated quantities, the meter being driven by the flow with measuring chambers which expand or contract during measurement having flexible movable walls, e.g. diaphragms, bellows for gases
A lens protection structure comprising a main body configured for defining a receiving space by being attached to a lens module, the receiving space is configured for receiving a lens of the lens module, the main body is arranged with an air escape structure for communicating the receiving space and external environment, the air escape structure comprises: an air flow channel, a diversion connected in the air flow channel for diverting the airflow therethrough, and a retention connecting to the diversion for harvesting impurities and dust carried in air flow through the air escape structure. Therefore, the lens protection structure prevents the lens from being damaged in processing and transporting while provides communication between the receiving space and the external environment.
A dust collecting and blocking member with an aperture for a camera module, includes a frame body and an adhesive connected to the frame body. The frame body includes a first surface and a second surface opposites to the first surface, the aperture penetrates the first surface and the second surface, the first surface is recessed inwardly to form an annular groove, the annular groove circles the aperture. The adhesive is disposed inside the annular groove, and the frame body and adhesive function together to block trap and hold any dust present during manufacture of the camera module, to avoid an image quality which is less than optimal.
A circuit board assembly in a camera module for blocking unwanted light when images are captured includes a circuit board, a sensor, and an optical blocking body connecting the circuit board and the sensor. The circuit board includes a base board and a photomask. The photomask is arranged on a surface of the base board, the base board includes conductive circuit layers and dielectric layers, the conductive circuit layers and the dielectric layers are alternately arranged, the sensor being electronically connected to the conductive layers. The optical blocking body, the photomask, and the dielectric layers block ambient light entering the camera module other than through the lens assembly of the camera module.
A carrying frame includes a main body, a first rotating part, a second rotating part, and a driving part. The main body includes a first inner surface which defines a first through hole. The first rotating part is mounted on the first inner surface and comprises a second inner surface which defines a second through hole. The second rotating part is mounted on the second inner surface and comprises a third through hole. The driving part is configured to drive at least one of the first rotating part to rotate in a first direction and the second rotating part to rotate in a second direction. The first direction and the second direction are perpendicular to each other, and both the first direction and the second direction are parallel to a plane where the main body is located. A camera module and an electronic device are also provided.
G03B 5/00 - Adjustment of optical system relative to image or object surface other than for focusing of general interest for cameras, projectors or printers
G03B 17/12 - Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
G03B 41/08 - Special photographic techniques not covered by groups Apparatus therefor using non-intermittently-running film with optical compensator with rotating transmitting member
A dustproof member includes a base plate, a dustproof plate, and a connecting portion. A first through hole is defined by an inner surface of the base plate. A second through hole is defined by an inner surface of the dustproof plate. The connecting portion has a shape of a hollow barrel and defines a hollow cavity. Two opposite ends of the connecting portion are respectively connected to an end of the inner surface of the base plate and an end of the inner surface of the dustproof plate, thereby forming a dust collecting groove between the base plate and the dustproof plate. A camera module having the dustproof member and an electronic device having the camera module are also provided.
A zoom lens assembly for periscope use which is effectively soundless in operation includes a lens barrel defined with a through hole, a plurality of optical lenses disposed within the through hole, and a focusing member disposed between any two of the plurality of optical lenses. The focusing member in a camera module includes a bottom plate, a cover plate, a piezoelectric element, and a variable transparent body. The variable transparent body is between the bottom plate and the cover plate, the piezoelectric element is disposed on a surface of the cover plate that faces away from the variable transparent body. Electricity fed to the piezoelectric element causes movement of the element which deforms the variable transparent body and changes the focal length of the camera module.
H04N 23/69 - Control of means for changing angle of the field of view, e.g. optical zoom objectives or electronic zooming
G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
H04N 23/55 - Optical parts specially adapted for electronic image sensorsMounting thereof
An image capture device includes a sensing component, a filter layer, and a micromotor. The sensing component includes a plurality of sensing units arranged in an array. The filter layer is disposed on one side of the sensing component and includes a plurality of filter units arranged in an array. The micromotor includes a stator and a mover, the sensing component is fixed on the stator, the filter layer is fixed on the mover. The micromotor is used to drive the filter layer to move relative to the sensing component, such that the plurality of sensing units is moved to a one-to-one corresponding position relative to the plurality of filter units.
A dustproof member includes a base plate, a dustproof plate, and a connecting portion. A first through hole is defined by an inner surface of the base plate. A second through hole is defined by an inner surface of the dustproof plate. The connecting portion has a shape of a hollow barrel and defines a hollow cavity. Two opposite ends of the connecting portion are respectively connected to an end of the inner surface of the base plate and an end of the inner surface of the dustproof plate, thereby forming a dust collecting groove between the base plate and the dustproof plate. A camera module having the dustproof member and an electronic device having the camera module are also provided.
A multi-lens camera module making use of a single image sensor comprising first and second lens modules, an image acquisition module, a refracting module, and a shielding module. The refracting module refracts light from either the first lens module and/or the second lens module, the shielding module allowing light to enter only one of the first or second lens modules by masking the other. The first and second lens modules can share one image acquisition module, which saves cost and interior space of the camera module and thus of the electronic device using such camera module. An electronic device comprising the camera module is also provided.
H04N 23/52 - Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
H04N 23/957 - Light-field or plenoptic cameras or camera modules
67.
PACKAGING STRUCTURE, LENS MODULE, AND ELECTRONIC DEVICE
A packaging structure includes a flexible circuit board, an image sensor, a reinforcing plate, and an adhesive layer. The flexible circuit board defines a first opening, a first connecting portion, and a second connecting portion. The image sensor includes a photosensitive area exposed in the first opening and a connection area electrically coupled with the first connecting portion through a conductive body. The reinforcing plate and the image sensor are located on a same side of the flexible circuit board. The adhesive layer covers edges of the image sensor and couples the image sensor to the flexible circuit board. A lens module and an electronic device comprising the packaging structure are also disclosed.
A simplified zoom lens module includes first to third lens units, first and second driving assemblies, and a housing. The lens units are arranged along an optical axis. The first driving assembly moves the second lens unit back and forth relative to the first lens unit, the second driving assembly moves the third lens unit back and forth relative to the second lens unit. The first driving assembly includes a first magnet which interacts with a second magnet, one being a permanent magnet, the other being an electromagnet. The first magnet is fixed inside the housing, the second magnet is fixed on the second lens unit. The first and second magnets are attracted to or repelled from each other by voltage and current fed to the electromagnet, thereby moving the lens and changing the focus of the lens module. A module and image-capturing device are also disclosed.
G02B 15/14 - Optical objectives with means for varying the magnification by axial movement of one or more lenses or groups of lenses relative to the image plane for continuously varying the equivalent focal length of the objective
G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
A fast-focusing zoom camera module with precise and high-speed autofocus function includes a reflecting assembly, a lens assembly, and a light sensing assembly, the lens assembly is arranged between the reflecting assembly and the light sensing assembly. The reflecting assembly comprises a reflecting member and a first actuator, the first actuator driving the reflecting member to rotate around a second direction. The lens assembly comprises a lens member and a second actuator, the second actuator drives the lens member to move along a first direction. The light sensing assembly comprises a first circuit board, a sensor, and a third actuator, the sensor is electrically connected to the first circuit board, the third actuator drives the sensor to move along a third direction. The first direction, the second direction, and the third direction are perpendicular to each other.
G02B 7/28 - Systems for automatic generation of focusing signals
G02B 7/08 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
G03B 30/00 - Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
70.
Lens module with short focal distance and electronic device using the same
A lens module, constructed to include all necessary filters but retaining its wide-angle characteristic and short focal length, is comprised of a housing, a cover plate, and a filter switcher. The housing and the cover plate form a receiving cavity, the cavity containing the filter switcher. The filter switcher includes holder, two mounting frames, two first adhesive layers, and two filters, and is of minimal thickness. The two first adhesive layers fix the filters on the two mounting frames. An enlarged installation space within the lens module is not required. The disclosure also relates to an electronic device using the lens module.
An optical particle detection system includes a light source, a lens group, an absorber, a microscope group, a filter, an image sensor, and a host. Laser is emitted from the light source, the lens group is configured to reflect and expand the laser light. The absorber absorbs a plurality of particles and presents the particles to an optical path of the laser light expanded by the lens group. The microscope group amplifies an image of the particles. The filter filters the laser light from the microscope group. The image sensor converts the laser light filtered by the filter into an electrical signal and the host analyzes the electrical signal and determines quality and components of at least one target particle in the particles.
An easily disassembled lens module in a terminal device includes a lens assembly, a circuit board, and a structural member. The circuit board includes a first portion, a second portion, and a third portion which are connected in sequence. The first portion is connected to the lens assembly, the second portion and the third portion protrude from the lens assembly. The structural member includes a connecting portion fixed on the third portion and at least one pulling portion protruding from the third portion. After installation in the terminal device, the lens assembly can be disassembled by using the at least one pulling portion to pull on the structural member so that the lens assembly can be disassembled without using tools and without causing damage.
A camera assembly able to perform spectral imaging includes a flexible cable, a filter, a bearing block, and a lens module. The flexible cable is electrically connected to the filter. The bearing block includes intercommunicating first and second receiving grooves. The filter is in the first receiving groove and the lens module is in the second receiving groove. The filter and the bearing block are connected by elastic and shock-absorbent glue and the filter is of the MEMS-type and voltage-tunable to adjust the wavelengths of light permitted to go through to the light sensor, to as to achieve spectral imaging.
A lens module includes a lens assembly, a voice coil motor, a bracket, a circuit board, and a solder block. The voice coil motor includes a pin. The lens assembly is received in the voice coil motor. The bracket is disposed on the voice coil motor. The pin is extending into the recessed area. The bracket is sandwiched between the voice coil motor and the circuit board. The circuit board includes conductive supporting blocks facing the voice coil motor. The conductive supporting blocks are disposed in the recessed area. And one pin and one conductive supporting block are electrically connected by the solder block. The present disclosure also provides an electronic device including the lens module.
G02B 7/04 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
75.
LENS MODULE WITH SHOCK-ABSORBENCY INBUILT AND ELECTRONIC DEVICE INCLUDING LENS MODULE
A lens module with inbuilt shock-absorbency includes a carrier, a lens barrel arranged on the carrier, a lens assembly accommodated in the lens barrel, and an optical filter arranged on the carrier. The lens assembly includes a buffer member arranged on a bottom of the lens assembly facing the carrier, and a reinforcing member arranged on a side wall of the lens assembly facing the lens barrel. When the lens module is dropped or otherwise impacted, the buffer member reduces the shock of impact applied to the image sensor. The reinforcing member strengths the lens assembly, reducing a risk of loosening of the lens assembly.
An electronic device includes a camera module comprising a circuit board, a lens, a first IC chip, and at least one metal column. The lens is mounted on the circuit board. The first IC chip and the metal column are arranged on a surface of the circuit board away from the lens. An attachment includes a body and a second IC chip. The first IC chip and the second IC chip can communicate with each other. The circuit board includes a first surface closed to the attachment. The metal column is arranged on the first surface, and the body includes a second surface close to the camera module. The body further includes at least a connecting channel. The metal column is located in the connecting channel to realize the electrical connection between the camera module and the attachment.
A voice coil motor with extended and stabilized travelling distance for lens-focusing includes a housing, a first spring, a carrier, a second spring, and a base. The first and second springs, diametrically apart, are connected between an inner surface of the housing and a side of the carrier. The base includes an insulating base plate on the second spring and coupled to the housing, and a metal connecting member on a side of the insulating base plate and welded to the second spring, providing a reliable connection to the base. The risk of the second spring accidentally falling off is reduced.
G02B 7/04 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
A device with enhanced long-term cleanliness for storing products includes a frame, pairs of supporting structures, and trays. The pairs of supporting structures are connected to opposite walls of the frame, and positioned in a receiving cavity of the frame. Each supporting structure includes a slide rail. The trays are detachably connected to the supporting structure. Each tray includes a mounting plate and two supporting portions, the mounting plate is connected to the two supporting portions, two supporting portions of each tray are positioned on the two slide rails of one supporting structure pair and are movable along two slide rails. The supporting structure in the frame and the supporting portion of the tray reduces connecting areas between the tray and the frame, the slide rails allowing easy movement of the trays, reducing metal and other debris generated over long usage of the facility.
A film-removing apparatus configured to remove a protecting film from a workpiece includes a supporting module configured to support the workpiece, a clamping module configured to clamp the workpiece supported by the supporting module, and a peeling module. The peeling module includes a first peeling member and a second peeling member. The first peeling member includes a bearing surface. The peeling module moves towards the clamping module to bring the bearing surface to below the protecting film, the second peeling member moves towards the protecting film to cooperate with the first peeling member in clamping the protecting member. The peeling module is then moved away from the clamping module to peel off the protecting film.
A lens module includes a circuit board and a photosensitive chip. The first rigid portion includes a first through hole. The lens module further includes a metal board. The metal board includes a metal body and a convex box located on one of the surfaces of the metal body. The circuit board is mounted on a surface of the metal board. The convex box is received in the first through hole. The photosensitive chip is mounted on the convex box. The disclosure also provides an electronic device having the lens module.
A lens module of reduced size includes a base and an adhesive body. The base includes a first base portion and a second base portion located outside the first base portion. The first base portion is made of plastic and the second base portion is made of metal. The base further comprises a slot. The adhesive body is received in the slot and connects the first base portion and the second base portion. The disclosure also provides an electronic device having the lens module.
A hot-pressing member proofed against thinning and shearing forces caused by laterally overflowing during pressing operations includes a base with cavity, a first supporting member in the cavity, a buffer member, and a second supporting member. The first supporting member includes first through hole. The buffer member includes a second through hole. The second supporting member is mounted on the buffer member. The second supporting member with third through hole supports the workpiece. The workpiece or part is in the third, second, and first through holes, and is hot-pressed with the adhesive film in a centered and constrained manner through all the through holes. The disclosure also provides a hot-pressing device having the hot-pressing member.
A dust-excluding carrier for product storage comprises a housing cavity and dust-excluding isolation members. The dust-excluding isolation member comprises a first main body, the first main body is provided with a first opening; the material tray and the dust-excluding isolation member are detachably connected. The material tray comprises a second main body with a second opening. The first main body and the second main body may be snap-fitted together and apart, so the first opening is covered by the second body and the second opening covered by the first body.
A structure to apply flexing to an object to test resilience to being bent has a first portion and a second portion. The structure includes a base, a rotating member, a pressing plate, and an adjusting assembly. The base defines first and second receiving grooves, and the second receiving groove receives the first portion. The rotating member on the base is partially received in the first receiving groove. An abutting surface of the rotating member is recessed to form a third receiving groove which receives the second portion. The pressing plate on the base presses against the first portion. The adjusting assembly controls the rotating member to rotate towards the base about a desired angle, thereby causing the second portion to be bent with respect to the first portion.
A resolution test card for camera module includes a central region and a plurality of corner regions surrounding the central region. Both the central region and each corner region includes color blocks arranged in an array without gap. Each color block includes at least two straight edges. Any adjacent two color blocks sharing one straight edge in both the central region and each corner region have different colors. Any of the at least two straight edges is inclined relative to a first direction and a second direction perpendicular to the first direction; the at least two straight edges includes a first straight edge and a second straight edge perpendicular to each other.
A lens base with improved strength and reduced size includes a bracket and a lens holder connected to the bracket. The bracket includes a cover plate and a side plate, the side plate connects to the cover plate to form a receiving groove, the cover plate defines a first aperture, the first aperture penetrates the cover plate. The lens holder faces away from the receiving groove, the lens holder defines a second aperture, the second aperture faces the first aperture.
H04N 5/335 - Transforming light or analogous information into electric information using solid-state image sensors [SSIS]
G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
G03B 30/00 - Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
H04N 23/55 - Optical parts specially adapted for electronic image sensorsMounting thereof
87.
Driving assembly with reduced size and noise, camera module and electronic devices having the same
A drive assembly with reduced size and reduced noise includes a bottom box, an elastic member, a movable plate, a PCB board, and a plurality of shape memory alloy wires. The bottom box comprises a bottom plate and a plurality of side plates. The plurality of side plates is arranged on a side of the bottom plate to form a receiving groove, the plurality of side plates defines a position groove connects to the receiving groove. The elastic member, the movable plate, the plurality of shape memory alloy wires, and a partial of the rigid printed circuit board are located within the receiving groove, another partial of the rigid printed circuit board is disposed with the position groove. The elastic member connects between the bottom plate and the movable plate, the plurality of shape memory alloy wires connects between the movable plate and the rigid printed circuit board.
A dual-lens camera system includes a first lens, a second lens, an image sensor corresponding to a position of the first lens, and a reflecting assembly. The reflecting assembly includes a first reflecting member and a second reflecting member corresponding to a position of the second lens. The first reflecting member is movable between a first position at which an optical path from the first lens to the image sensor is blocked but an optical path from the second reflecting member to the image sensor is not blocked, and a second position at which the optical path from the first lens to the image sensor is not blocked but the optical path from the second reflective member to the image sensor is blocked. Only one image sensor is used in the dual-lens camera system, which saves cost and takes up less internal space of the electronic device.
H04N 23/55 - Optical parts specially adapted for electronic image sensorsMounting thereof
G02B 13/00 - Optical objectives specially designed for the purposes specified below
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
H04N 13/207 - Image signal generators using stereoscopic image cameras using a single 2D image sensor
H04N 23/58 - Means for changing the camera field of view without moving the camera body, e.g. nutating or panning of optics or image sensors
89.
Driving module and focusing mechanism including driving module
A driving module configured for driving a teleconverter lens assembly to move up and down with precision includes a mounting base, a driving assembly connected with the mounting base, and an optical grating sensor. The driving assembly includes a linear motor adapted to be fixedly connected with the teleconverter lens assembly and configured to drive the teleconverter lens assembly to move, and an air cylinder configured to support the teleconverter lens assembly. The optical grating sensor is electrically connected with the linear motor and configured to detect and feedback a position of the teleconverter lens assembly driven by the linear motor in real time. A focusing mechanism including the driving module is also disclosed.
G02B 7/105 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification by relative axial movement of several lenses, e.g. of varifocal objective lens with movable lens means specially adapted for focusing at close distances
G02B 15/12 - Optical objectives with means for varying the magnification by changing, adding, or subtracting a part of the objective, e.g. convertible objective by adding a part, e.g. close-up attachment by adding telescopic attachments
A firm and stable liquid processing fixture for clamping a liquid container undergoing a centrifuge process includes a mounting plate, a cover plate, and a fixing element. The mounting plate defines a fixing groove for receiving the liquid container. The cover plate is rotatably connected to the mounting plate, and is positioned at a side of the mounting groove. The cover plate is turned over to cover the mounting groove. The fixing element is connected to the mounting plate. The cover plate is detachably connected to the fixing element. The liquid processing fixture further fixes the liquid container in place by setting the cover plate on the mounting groove and fixing it with the fixing portion, and provides firm installation and simple operation. A liquid processing device is also disclosed.
A device providing automatic control of temperature for an environment of a working station includes an air box, a baffle member, and a driving assembly. The air box is coupled to a machine defining a working space which the working station is in. The air box defines an opening. The opening allows cooling air to be introduced into the working space. The baffle member is slidably coupled to the air box at the opening. The driving assembly coupled to the baffle member drives the baffle member to cover the opening completely, to cover the opening partially, or to leave the opening uncovered in accordance with a difference between a current temperature of the working space and a desired target temperature of the working space. A related system and method are also disclosed.
F24F 11/76 - Control systems characterised by their outputsConstructional details thereof for controlling the supply of treated air, e.g. its pressure for controlling air flow rate or air velocity by means responsive to temperature, e.g. bimetal springs
F24F 3/00 - Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatmentApparatus specially designed for such systems
F24F 13/12 - Air-flow control members, e.g. louvres, grilles, flaps or guide plates movable, e.g. dampers built-up of sliding members
92.
Testing electronic products for determining abnormality
A method for testing electronic products implemented in an electronic device includes selecting a serial port connected with a slave device in serial communication with a product under test. An activation instruction is transmitted to the slave device, and the electronic product is started through the slave device. Data stored in at least one register of the electronic product and a state of the electronic product is obtained and a capacitance of at least one capacitor in the electronic product is measured. When the electronic product is found to be in an abnormal state, determining a cause of abnormality according to data of the electronic product and the capacitance of the at least one capacitor.
A checking mechanism for workshop security applying a method for workshop security comprises a transmission device, a recording device, a storage subassembly and a control subassembly. The transmission device comprises a first end (115) and a second end (116). The recording device records personnel and objects in their possession through a security check process, to establish a correspondence. The storage subassembly stores the information comprising personnel and their objects. The control subassembly is used for controlling the recording device to record and store the information to the storage subassembly. The control subassembly can retrieve the information recorded by the recording device to detect a certain person's correspondence to the certain object.
A device to intercept a falling ball and prevent a second impact in a hardness or other test of a product and a falling ball impact tester including the device are disclosed. The device includes a sensor for detecting a position of the falling ball, an interception plate defining a catching groove, and a driving member connected to the interception plate and the sensor and providing motion. The driving member can move the interception plate to a position where the catching groove is in a falling path of the falling ball or is just outside such path, according to detection by the sensor.
G01N 3/303 - Investigating strength properties of solid materials by application of mechanical stress by applying a single impulsive force generated only by free-falling weight
G01N 3/02 - Investigating strength properties of solid materials by application of mechanical stress Details
95.
Camera module and electronic device having the camera module
A camera module includes a filter, a supporting base, a metal sheet, and a fixing member. The supporting base includes a first through hole, a first surface, and a second surface. A receiving groove is recessed from the second surface toward the first surface, an inner wall defining the receiving groove includes a bottom surface. The first through hole penetrates the first surface and the bottom surface. The metal sheet is received in the receiving groove and includes a second through hole. A central axis of the second through hole is collinear with a central axis of the first through hole. The metal sheet further includes a supporting platform exposed from the first through hole, the filter is mounted on the supporting platform and received in the first through hole. The fixing member is arranged on the supporting base to fix the metal sheet to the supporting base.
A rearview mirror system for a vehicle providing a direct reflection of scenes in good light and an enhanced display of scenes in bad lighting includes a housing defining an opening, a display screen arranged at the opening, a camera, a fill light lamp, and a controller. The display screen is light-pervious at only one side. The camera and the fill light lamp are arranged on the housing. An image processing chip and the controller are arranged between the display screen and the housing. When ambient brightness is below a preset brightness value, the camera and the fill light lamp are activated, the camera captures images of side and rear scenes of the vehicle and generates an optical signal, the image processing chip, based on the optical signal, outputs an enhanced image on the display screen for better driving safety. A vehicle including the rearview mirror system is also disclosed.
A camera module includes a mounting frame defining a first through hole, a filter installed in the first through hole, and a circuit board including a first surface and a second surface. The mounting frame is on the first surface. An air escaping channel is recessed from the second surface, an air escaping hole penetrates the first surface and the second surface and communicates with the air escaping channel. The circuit board, the mounting frame, and the filter cooperate with each other to form a first cavity, the first cavity communicates with the air escaping hole. The air escaping channel includes a first channel portion and a second channel portion, an angle is formed between the first channel portion and the second channel portion. The air escaping hole communicates with the first channel portion, the second channel portion extends to an edge of the circuit board to form an opening.
A horizontal correction method for a detection platform implemented in an electronic device includes controlling a laser device to emit laser to a plurality of points on a motion platform and calculates a height value of each of the plurality of points, calculating tilt data of the motion platform according to the height value of each of the plurality of points; determining position compensation data of the motion platform according to the tilt data; and controlling the motion platform to move according to the position compensation data, and adjusting a position of the motion platform to a horizontal position.
A disassembling device for removing fastening components embedded in a workpiece includes a supporting base, a clamping assembly, and a pushing assembly. The pushing assembly includes a sliding assembly, an adjusting rod, and an ejecting pin. The workpiece defines a first through hole which communicates with a positioning hole. The workpiece is clamped by the clamping assembly, the sliding assembly is connected to the supporting base and can slide along a first direction and a second direction perpendicular to the first direction. The adjusting rod passes through the sliding assembly to connect with the ejecting pin, the ejecting pin is driven to extend into the first through hole and to move in a direction perpendicular to the first and second directions, so as to push the fastening component out of the positioning hole.
B23P 19/00 - Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformationTools or devices therefor so far as not provided for in other classes
B23P 19/02 - Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformationTools or devices therefor so far as not provided for in other classes for connecting objects by press fit or for detaching same
A system for measuring impedance which is tolerant of connection errors includes a measuring instrument and a relay plate. The relay plate includes a plurality of relay groups. A relay group comprises a first channel, a second channel, a third channel, and a fourth channel. The first to fourth channels are electrically connected to a conductive pin of the product. The relay board further comprises a first voltage interface, a second voltage interface, a first current interface, and a second current interface, the first voltage interface is electrically connected to the first channel, the first current interface is electrically connected to the second channel, the second voltage interface is electrically connected to the third channel, and the second current interface is electrically connected to the fourth channel, a control unit being able to switch between these when connected to obtain impedance measurements.
patents