Abstract

A pressure sensing flexible circuit board and a method of fabricating the same are provided. The pressure sensing flexible circuit board includes a flexible circuit substrate and a pressure sensing element and a vibrating element disposed on the flexible circuit substrate. The pressure sensing element includes a first piezoelectric layer; plural first interlayer electrical conductor dispersed within the first piezoelectric layer; a first polymer layer adjacent to the first piezoelectric layer; and a first electrode layer disposed on the first piezoelectric layer. The vibrating element includes a multi-layer piezoelectric structure; a second electrode layer disposed on the multi-layer piezoelectric structure; and a second polymer layer adjacent to the multi-layer piezoelectric structure. Each layer of the multi-layer piezoelectric structure includes a second piezoelectric layer and plural second interlayer electrical conductor dispersed within the second piezoelectric layer.

IPC Classes  ?

• G01L 1/16 - Measuring force or stress, in general using properties of piezoelectric devices

Abstract

A chip packaging method, which uses the principle of thermal expansion and cold contraction. The method comprises: firstly, putting a chip assembly at a first temperature, such that a deformation sheet in the chip assembly contracts; then putting the chip assembly in a circuit board provided with a groove, and adjusting the position of the chip assembly in the groove at a second temperature, such that solder pins of a chip correspond to a circuit layer of the circuit board, and the position of the chip assembly in the groove is relatively fixed; and performing reflow soldering at a third temperature, such that a conductive paste is connected to the circuit board and the chip, and the deformation sheet expands in a high-temperature environment and thus presses the chip, thereby improving the connection reliability of the chip and the circuit board. Further provided are a chip packaging structure and a terminal device.

IPC Classes  ?

• H01L 21/52 - Mounting semiconductor bodies in containers
• H01L 23/04 - ContainersSeals characterised by the shape
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or

Abstract

The present application provides a bending-resistant circuit board and a preparation method therefor. The bending-resistant circuit board comprises an inner circuit board and an outer circuit layer. The inner circuit board comprises a first circuit layer, an insulating layer, and a cavity. A bonding layer covers part of the first circuit layer, and the cavity is formed in the insulating layer. The cavity is formed by the enclosure of a first magnetic layer, a second magnetic layer, a third magnetic layer, and a fourth magnetic layer, and the surfaces of the magnetic layers facing the cavity have the same polarity. The outer circuit layer is located on a surface of the insulating layer. According to the present application, by constructing a cavity formed by magnetic materials, the internal circuit of the circuit board is constantly in a suspended state, thus reducing the influence of bending stress, and improving the bending resistance of the circuit board. According to the present application, the cavity formed by magnetic materials internally has a certain repulsive force, which maintains the shape of the cavity, hence solving the problems in the existing technology of dents and unevenness in a circuit board caused by cavities. Further, according to the present application, a circuit layer can be formed on the surface of the cavity, which increases the wiring density.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details

Abstract

A method of packaging a chip includes: forming a groove on a circuit board. Providing a chip assembly, the chip assembly includes the chip, conductive pastes, and a deformable member. Placing the chip assembly at a first temperature to cause the deformable member to contract. Placing the chip assembly in the groove; heating the chip assembly at a second temperature. Subjecting the circuit board and the chip assembly to reflow soldering at a third temperature. The third temperature is greater than the second temperature, and the second temperature is greater than the first temperature. The present disclosure further provides a chip packaging structure and a terminal device.

IPC Classes  ?

• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
• H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H01L 23/498 - Leads on insulating substrates

Abstract

A relay circuit board includes a first external circuit structure, a second external circuit structure, an internal circuit structure, a magnetic induction element, and a switch assembly. The internal circuit structure is disposed between the first external circuit structure and the second external circuit structure. The switch assembly is disposed in a first cavity of the first external circuit structure. The magnetic induction element is disposed in a second cavity of the internal circuit structure. The internal circuit structure includes a plurality of multiple coil loops. The coil loops surround the magnetic induction element and are embedded in an inner wall of the second cavity. When the coil loops are energized, the magnetic induction element generates a magnetic field.

IPC Classes  ?

• H01H 47/22 - Circuit arrangements not adapted to a particular application of the relay and designed to obtain desired operating characteristics or to provide energising current for supplying energising current for relay coil
• H01H 49/00 - Apparatus or processes specially adapted to the manufacture of relays or parts thereof
• H01H 50/02 - BasesCasingsCovers
• H01H 50/44 - Magnetic coils or windings

Abstract

A circuit board assembly includes a first circuit board. The first circuit board includes a first substrate, a first circuit structure, a first magnetic layer and a connecting pillar. The first circuit structure is connected to the first substrate. The first magnetic layer is connected to the first circuit structure and makes the first circuit structure be arranged between the first magnetic layer and the first substrate. The first magnetic layer is not electrically connected to the first circuit structure. The connecting pillar is connected to the first circuit structure. The connecting pillar extends in a direction from the first circuit structure toward the first magnetic layer and through the first magnetic layer, and the connecting pillar is electrically connected to the first circuit structure.

IPC Classes  ?

• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 1/02 - Printed circuits Details
• H05K 1/05 - Insulated metal substrate

Abstract

A sensing module includes a temperature sensing element, a pressure sensing element surrounded by the temperature sensing element, and a thermal conductive film covering the temperature sensing element. The temperature sensing element includes a first temperature sensing part, a second temperature sensing part, a third temperature sensing part and a fourth temperature sensing part. The first temperature sensing part and the second temperature sensing part are arranged in a first direction. The third temperature sensing part and the fourth temperature sensing part are arranged in a second direction. The first direction is different from the second direction. The pressure sensing element includes a pressure sensing upper part and a pressure sensing lower part. The pressure sensing upper part and the pressure sensing lower part are arranged in a third direction, where an acute angle is formed between the third direction and the first direction.

IPC Classes  ?

• G01L 1/22 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
• G01K 7/22 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a non-linear resistance, e.g. thermistor

Abstract

A pressure-sensitive ink includes an adhesive, conductive particles, and inorganic fillers dispersed in the adhesive. The inorganic fillers include hydrophobic groups, and the inorganic fillers can increase the dispersibility of the conductive particles. The conductive particles can be uniformly dispersed in the adhesive by adding inorganic fillers with hydrophobic groups. The sensitivity and structure stability of a flexible pressure sensing structure are improved, and the noise of the flexible pressure sensing structure is reduced. In addition, the stability and the process yield of the flexible pressure sensing structure are also improved A flexible pressure sensing structure and an electronic device are also disclosed.

IPC Classes  ?

• G01L 1/18 - Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
• G01L 1/22 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges

Abstract

A circuit board includes two first circuit substrates, two second circuit substrates, a magnetic assembly, a first component, and a second component. The first circuit substrate includes a first coil. Two second circuit substrates are disposed between the two first circuit substrates and electrically connects the two first circuit substrates. The second circuit substrate includes a second coil. Two grooves are defined on second circuit substrate. The magnetic assembly is disposed between the two first circuit substrates and between the two second circuit substrates. The magnetic assembly includes a magnetic member. The first circuit substrate can be bent by an interaction of a magnetic field generated by the magnetic assembly and a magnetic field generated by the first coil or the second coil. The present disclosure further provides method for manufacturing the circuit board and a terminal device.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/14 - Structural association of two or more printed circuits
• H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
• H05K 3/36 - Assembling printed circuits with other printed circuits
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

Abstract

A circuit board, comprising two first circuit substrates, two second circuit substrates, a magnetic assembly, a first element and a second element. Each first circuit substrate comprises a first coil, and is provided with two recesses; the two second circuit substrates are located between the two first circuit substrates and are spaced apart from each other, each second circuit substrate comprising a second coil; the magnetic assembly is located between the two first circuit substrates and between the two second circuit substrates, the magnetic assembly comprising an elastic member and magnetic members, wherein the magnetic members can be engaged in the recesses; and the first element and the second element are both electrically connected to the first circuit substrates, the first element being used for causing the first coil to generate a magnetic field which repels the magnetic members, thus compressing the elastic member, and the second element being used for causing the second coil to generate a magnetic field which matches or repels the magnetic members, thus enabling the magnetic members to attract or repel the second circuit substrates. Further provided in the present application are a method for manufacturing the circuit board, and a terminal device.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H01F 27/28 - CoilsWindingsConductive connections

Abstract

A dispersant is applied in pressure-sensitive materials and has a chemical structural formula of A dispersant is applied in pressure-sensitive materials and has a chemical structural formula of A dispersant is applied in pressure-sensitive materials and has a chemical structural formula of Ar1 represents a group selected from a group consisting of A dispersant is applied in pressure-sensitive materials and has a chemical structural formula of Ar1 represents a group selected from a group consisting of A dispersant is applied in pressure-sensitive materials and has a chemical structural formula of Ar1 represents a group selected from a group consisting of and any combination thereof. Ar2 represents a group selected from a group consisting of A dispersant is applied in pressure-sensitive materials and has a chemical structural formula of Ar1 represents a group selected from a group consisting of and any combination thereof. Ar2 represents a group selected from a group consisting of A dispersant is applied in pressure-sensitive materials and has a chemical structural formula of Ar1 represents a group selected from a group consisting of and any combination thereof. Ar2 represents a group selected from a group consisting of and any combination thereof. A degree of polymerization x and a degree of polymerization y are respectively greater than zero. A composition having the dispersant and a pressure-sensitive film formed by the composition are also provided.

IPC Classes  ?

• C09D 133/14 - Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
• C08F 220/28 - Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
• C08K 3/04 - Carbon
• C09D 7/61 - Additives non-macromolecular inorganic

Abstract

A provided circuit board includes an embedded capacitor, a substrate, and an insulating layer. The embedded capacitor includes a dielectric layer, a first electrode and a second electrode. The dielectric layer has a first side surface, a second side surface adjacent to the first side surface, a third side surface opposite to the first side surface, and a fourth side surface opposite to the second side surface. The first and second electrodes respectively cover the first and third side surfaces. The substrate surrounds the embedded capacitor and is physically connected to the second and fourth side surfaces. The first electrode is between the first side surface and a sidewall of the substrate. The insulating layer covers the embedded capacitor and the substrate and extends from an upper surface to a lower surface of the substrate along the first electrode and the sidewall of the substrate.

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor

Abstract

A stretchable circuit board assembly and a method for manufacturing the same are provided. The circuit board assembly includes a flexible circuit board and an outer circuit board. The flexible circuit board includes a first base layer and an inner wiring layer. The flexible circuit board is divided into a connecting area and a stretchable area. The inner wiring layer within the connecting area includes an electrical connecting portion exposed from the outer circuit board. The stretchable area is configured to deform into at least one bent portion. The bent portion is used to cause the electrical connecting portion to stretch relative to the outer circuit board. The outer circuit board includes a second base layer and an outer wiring layer. A surface of the second base layer away from the outer wiring layer defines at least one blind groove. The blind groove is configured to receive the bent portion.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Abstract

A transducer wiring board and a method for manufacturing the same are provided. The transducer wiring board includes a movable unit, a fixing unit, plural suspensions, plural X-axial actuators, and plural Y-axial actuators. The movable unit includes a first movable section and plural second movable sections. The second movable sections are disposed on two sides of the first movable section along a Y axial direction. The fixing unit is spaced apart from the movable unit and includes plural fixing sections. The fixing sections are disposed on another two sides of the first movable section along an X axial direction. Each suspension connects the movable unit and the fixing unit. Each X-axial actuator connects one of the fixing sections and the first movable section. Each Y-axial actuator connects the first movable section and one of the second movable section.

IPC Classes  ?

• H02N 1/00 - Electrostatic generators or motors using a solid moving electrostatic charge carrier

Abstract

A circuit board includes a first circuit layer, a second circuit layer, a third circuit layer, a first differential line group, a second differential line group, a third differential line group, and a fourth differential line group. The first differential line group and the third differential line group are disposed between the first circuit layer and the second circuit layer. The second differential line group and the fourth differential line group are disposed between the first circuit layer and the third circuit layer. A first distance between the first differential line group and the first circuit layer is less than a third distance between the third differential line group and the first circuit layer. A second distance between the second differential line group and the first circuit layer is less than a fourth distance between the fourth differential line group and the first circuit layer.

IPC Classes  ?

• H05K 1/03 - Use of materials for the substrate
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A flexible circuit board and a method for fabricating the same are provided. The flexible circuit board includes an insulation substrate with two trenches on its two opposite end surfaces separately. A signal wire is disposed in the insulation substrate, and thus the insulation substrate surrounds the signal wire. Two flexible circuit substrates are separately located on two opposite surfaces of the insulation substrate, and each flexible circuit substrate includes a conductive layer and a power layer. The conductive layer is extended from one surface to end surfaces of the insulation substrate, and then is extended to the trenches along the end surfaces. The power layer is located between the conductive layer and the insulation substrate and is electrically connected to the conductive layer. In each trench, one conductive layer is connected to the other conductive layer, and two conductive layers are electrically connected to each other.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A circuit board with embedded resistors and a method for fabricating the same are provided. The circuit board includes the circuit substrate and the variable resistor region. The variable resistor region includes the first resistor layer, the second resistor layer and the liquid metal material. The first resistor layer is electrically connected to the circuit substrate, and the second resistor layer overlaps the first resistor layer. The liquid metal material is located on and is electrically connected to the first resistor layer. The liquid metal material is spaced from the second resistor layer without any electrical connection under the initial temperature. The liquid metal material is electrically connected to the second resistor layer under the first temperature which is higher than the initial temperature.

IPC Classes  ?

• H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• H05K 3/42 - Plated through-holes

Abstract

A circuit board includes a main board, a thermistor layer, a plurality of n-type semiconductor units and a plurality of p-type semiconductor units. The main board includes a first external structure, a second external structure, and an internal structure disposed between the first external structure and the second external structure. The internal structure includes a first internal circuit layer, a second internal circuit layer, and an insulating layer disposed between the first internal circuit layer and the second internal circuit layer. The thermistor layer is disposed on the insulating layer and the first internal circuit layer. The n-type semiconductor units and the p-type semiconductor units are electrically connected to the second internal circuit layer and the second external structure, in which the n-type semiconductor units and the p-type semiconductor units are alternately arranged in one direction.

IPC Classes  ?

• H01L 23/38 - Cooling arrangements using the Peltier effect
• H01L 23/00 - Details of semiconductor or other solid state devices
• H10N 19/00 - Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups

Abstract

A flexible circuit board and a method of fabricating the same are provided. The flexible circuit board includes a first dielectric layer, a second dielectric layer disposed on the first dielectric layer, a signal layer disposed within the second dielectric layer, a third dielectric layer disposed on the second dielectric layer, and liquid metal composites. The signal layer includes a trace and a pad. The liquid metal composites are disposed to surround the trace, but not enclose the pad, thereby satisfying requirements of the signal layer for great bending numbers and high frequency signal transmission.

IPC Classes  ?

• H05K 1/03 - Use of materials for the substrate
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Abstract

A flexible circuit board and a method of fabricating the same are provided. The flexible circuit board includes a flexible substrate, in which the flexible substrate includes a first portion, two second portions, two third portions, two first bending portion and two second bending portions. The flexible circuit board includes first connecting circuit layers extending from an upper surface of the first portion through the first portions to upper surfaces of the second portions, second connecting circuit layers extending from lower surfaces of the second portions through the third portions to lower surfaces of the third portions, first circuit layers disposed on the upper surface of the first portion and second circuit layers disposed on the lower surfaces of the third portions. Therefore, the flexible circuit board can achieve no-via-hole and high density for circuit board.

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/36 - Assembling printed circuits with other printed circuits

Abstract

A circuit board includes a first multilayered structure, a second multilayered structure, a third multilayered structure, a first adhesive layer, a second adhesive layer and a plurality of hollow portions. The first adhesive layer is disposed between the first multilayered structure and the second multilayered structure. The second adhesive layer is disposed between the second multilayered structure and the third multilayered structure, wherein the second multilayered structure is arranged between the first adhesive layer and the second adhesive layer. The plurality of hollow portions are formed on at least one of the first multilayered structure, the second multilayered structure and the third multilayered structure. When the circuit board is bent, a force is applied on the plurality of hollow portions to make the plurality of hollow portions deform and change a cross-sectional area of each of the plurality of hollow portions.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits

Abstract

A circuit board includes at least one first circuit substrate and at least one second circuit substrate overlapped with the first circuit substrate; each first circuit substrate includes: a first base layer, a first circuit layer, and a plurality of first conductive bodies formed by an electroplating process; the first circuit layer includes a hot pressing area and a non-hot pressing area except the hot pressing area. One end of the first conductive body is electrically connected to the hot pressing area and the other end is exposed to the first base layer; each second circuit substrate includes: a second base layer, a second circuit layer and a plurality of second conductive bodies including a conductive paste; one end of the second conductive body is electrically connected to the second circuit layer, and the other end is exposed on the second base layer.

IPC Classes  ?

• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 1/02 - Printed circuits Details
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

Abstract

A circuit board includes an inner wiring substrate and a first side plate. The inner wiring substrate includes a plurality of first connection pads at a side. The first side plate is disposed on the inner wiring substrate and defines a plurality of first holes exposing the first connection pads. Each first hole includes a first end facing the first connection pad and a second end facing away from the first connection pad. A central distance between two adjacent first connection pads is greater than a center distance between two second ends of two adjacent first holes. The first holes are filled with first conductive bodies, each first conductive body is electrically connected to the first connection pad and extends out of the first hole to form a connection portion. A method for manufacturing the circuit board and a display module are also disclosed.

IPC Classes  ?

• H05K 5/00 - Casings, cabinets or drawers for electric apparatus
• H05K 1/05 - Insulated metal substrate
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

Abstract

Disclosed in the present application is a circuit board, comprising a core board and a first side board, wherein one side of the core board is provided with a plurality of first connecting pads arranged at intervals, the center distance of two adjacent first connecting pads being defined as a first center distance; the first side board covers a plurality of first connecting pads; the first side board is penetrated by a plurality of first openings, each of which comprises a first end and a second end in communication with the first end, each first connecting pad being exposed through one first end, the center distance of two adjacent second ends being defined as a second center distance, and the first center distance being greater than the second center distance; and a plurality of first electrical conductors are disposed in the first openings, one end of each first electrical conductor is electrically connected to the first connecting pad, and the end of the first electrical conductor facing away from the first connecting pad extends out of the first opening to form a first connecting portion. The circuit board provided in the present application can achieve electrical connections of fingers of an electronic component which are staggered with the first connecting pads in the thickness direction. Further provided in the present application are a manufacturing method for the circuit board, and a display module.

IPC Classes  ?

• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 3/42 - Plated through-holes

Abstract

A method for packaging a chip, the chip is packaged by disposing positioning post on the surface of the carrier, and the groove matching the positioning post is formed on the surface of the chip. During melting the first solder pastes and the second solder pastes , due to the interaction between the positioning post and the groove, the chip will not be deflected due to the tension of the first solder pastes and the second solder pastes, so that a chip packaging structure meets the expected requirements. The chip packaging structure is further provided in the present disclosure.

IPC Classes  ?

• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 23/00 - Details of semiconductor or other solid state devices

Abstract

A packaging method for a chip (30), comprising the following steps: providing a substrate (10), the substrate (10) comprising a base (11) and a plurality of first pads (13) provided on the base (11), and forming a first solder paste (15) on each first pad (13); forming positioning posts (20) on the surface of the base (11) provided with the first pads (13); providing the chip (30), the chip (30) comprising a chip body (31) and a plurality of second pads (33) provided on one surface of the chip body (31), and forming a second solder paste (35) on each second pad (33); forming grooves (32) on the surface of the chip body (31) provided with the second pads (33); accommodating the positioning columns (20) in the grooves (32), each first solder paste (15) being connected to a corresponding second solder paste (35), and melting and solidifying the first solder pastes (15) and the second solder pastes (35) to form solder balls (40) to connect the chip (30) and the substrate (10), thereby forming the chip packaging structure (100). The present application further provides the chip packaging structure (100).

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates

Abstract

A method for manufacturing a system-in-package module includes providing a carrier plate; mounting a plurality of electronic components on the carrier plate, wherein the plurality of electronic components are electrically connected to the carrier plate; providing a plastic encapsulation film which comprises a resin and an inorganic filler; providing an electromagnetic shielding film; pressing the electromagnetic shielding film and the plastic encapsulation film into a composite structure; and pressing the composite structure onto the carrier plate, wherein the plastic encapsulation film is in contact with and covers a surface of the carrier plate and encapsulates the plurality of electronic components. A system-in-package module is also disclosed.

IPC Classes  ?

• H01L 23/552 - Protection against radiation, e.g. light
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices
• H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

Abstract

A method for manufacturing a system-in-package module, the method comprising the following steps: providing a carrier plate; arranging a plurality of parts and components on the carrier plate, the plurality of parts and components being electrically connected to the carrier plate; providing a plastic packaging film, which comprises resin and an inorganic filler; providing an electromagnetic shielding film; and pre-pressing the electromagnetic shielding film and the plastic packaging film; and pressing onto the carrier plate the pre-pressed electromagnetic shielding film and plastic packaging film, the plastic packaging film covering the surface of the carrier plate and wrapping the plurality of parts and components. Further provided is a system-in-package module prepared by using the manufacturing method.

IPC Classes  ?

• H01L 23/552 - Protection against radiation, e.g. light
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings

Abstract

A transparent circuit board includes a conductive wiring, a transparent insulating layer, and a cover film stacked on the transparent insulating layer. The conductive wiring penetrates the transparent insulating layer along the stacking direction, and is at least partially embedded in the conductive wiring. A blackened layer is formed on a surface of the conductive wiring combined with the cover film, a carbon black layer is formed on a surface of the conductive wiring without the blackened layer, thereby improving a light transmittance of the transparent circuit board.

IPC Classes  ?

• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A circuit board includes a circuit substrate. The circuit substrate includes an insulating substrate and an electronic component embedded therein. The insulating substrate defines two first slots. A first phase change material fills in the two first slots and thermally connects to the electronic component. A first wiring layer is formed on a surface of the insulating substrate, the first wiring layer covers the two first slots and thermally connects to the first phase change material. A second wiring layer is formed on another surface of the insulating substrate. The second wiring layer includes a plurality of wiring portions and a wiring slot formed between adjacent wiring portions. The electronic component electrically connects to the second wiring portion. A second phase change material fills in at least one wiring slot and thermally connects a portion of the wiring portions together to form a heat dissipation zone.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
• H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor

Abstract

A packaging substrate includes a circuit board defining a through groove. The circuit board includes an insulating body and a first wiring layer formed on the insulating body. A colloid is formed in the through groove. The packaging substrate further includes at least one lead. Each lead includes a lead body and a lead terminal connected to an end of the lead body. The lead terminal protrudes from the colloid. Another end of the lead body away from the lead terminal is electrically connected to the circuit board, and the colloid covering the lead body.

IPC Classes  ?

• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
• H01L 23/498 - Leads on insulating substrates
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Abstract

A method of manufacturing a circuit board assembly, including: providing a circuit substrate, the circuit substrate having a base layer, a wiring layer formed on the base layer, and a conductive casing formed on the wiring layer, the conductive casing defining a cavity for exposing the wiring layer; mounting an electronic component in the cavity, the electronic component electrically connected to the exposed wiring layer; filling a heat conductive medium in the cavity, the electronic component immersed in the heat conductive medium; forming a conductive cover on the conductive casing, the conductive cover enclosing the conductive casing.

IPC Classes  ?

• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Abstract

Provided is a manufacturing method for a circuit board assembly (100), comprising the steps of: providing a packaging substrate (22), the packaging substrate (22) comprising a base material layer (11), a circuit layer, and a hollow electrically-conductive column (21), the circuit layer being provided on the base material layer (11), and one end of the hollow electrically-conductive column (21) being provided on the circuit layer; providing a heating element (30) in the hollow electrically-conductive column (21), the heating element (30) being electrically connected to the circuit layer; filling the hollow electrically-conductive column (21) with a thermally-conductive medium (33), the heating element (30) being immersed in the thermally-conductive medium (33); and providing an electrically-conductive cover body (40) at the other end of the hollow electrically-conductive column (21), the electrically-conductive cover body (40) sealing the hollow electrically-conductive column (21), and obtaining the circuit board assembly (100). In addition, further provided is a packaging structure (200).

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

An embedded circuit board, made without gas bubbles or significant internal gaps according to a manufacturing method which is provided, includes an inner layer assembly, an embedded element, and first and second insulating elements. The inner layer assembly comprises a first main portion with opposing first and second surfaces and a first groove not extending to the second surface is positioned at the first surface. A first opening penetrates the second surface, and the first opening and the first groove are connected. The first groove carries electronic elements for embedment. The first insulating element covers the first surface and a surface of the embedded element away from the second surface. The second insulating element covers the second surface and extends into the first opening to be in contact with the embedded element.

IPC Classes  ?

• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

A preparation method for a circuit board connection structure includes: providing a circuit board module that including a first outer wiring layer, and the first outer wiring layer including solder pads; forming a first pyrolytic adhesive layer and an inner wiring layer on the first outer wiring layer; forming a second pyrolytic adhesive layer and a second copper foil layer on the inner wiring layer; defining a plurality of through holes each configured to expose one of the solder pads; forming a copper plating layer on the second copper foil layer; etching the copper plating layer and the second copper foil layer to form a second outer wiring layer, thereby obtaining an intermediate body; heating and washing the intermediate body to remove the first pyrolytic adhesive layer and the second pyrolytic adhesive layer. The present application also provides a circuit board connection structure.

IPC Classes  ?

• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 1/09 - Use of materials for the metallic pattern

Abstract

A manufacturing method for a circuit board connection structure, comprising the steps: providing a circuit board module, the circuit board module comprising a first outer circuit layer, and the first outer circuit layer comprising a plurality of welding pads; forming a first thermal release adhesive layer and an inner circuit layer on the first outer circuit layer, the first thermal release adhesive layer being located between the first outer circuit layer and the inner circuit layer; forming a second thermal release adhesive layer and a second copper foil layer on the inner circuit layer, the second thermal release adhesive layer being located between the inner circuit layer and the second copper foil layer; providing a plurality of through holes penetrating through the second copper foil layer, the second thermal release adhesive layer, the inner circuit layer and the first thermal release adhesive layer, each through hole being used for exposing a welding pad; forming a copper plating layer on the second copper foil layer, the through holes being filled with the copper plating layer to form conductive pillars; etching the copper plating layer and the second copper foil layer to form a second outer circuit layer so as to obtain an intermediate; and heating the intermediate and cleaning same, so as to remove the first thermal release adhesive layer and the second thermal release adhesive layer. The present application further provides a circuit board connection structure.

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates
• H01Q 1/22 - SupportsMounting means by structural association with other equipment or articles

Abstract

The disclosure provides a circuit board assembly, which includes a core layer, an electronic component, a first shielding ring wall, a second shielding ring wall, a first circuit layer, a second circuit layer, a first insulating layer and a plurality of shielding columns. The core layer has an accommodating space, in which the accommodating space has an inner sidewall. The electronic component is disposed in the accommodating space. The first shielding ring wall is disposed in the accommodating space and covers the inner sidewall, in which the first shielding ring wall surrounds the electronic component and is not in contact with the electronic component. The second shielding ring wall is disposed in the core layer and surrounds the first shielding ring wall. The core layer is disposed between the first circuit layer and the second circuit layer. The shielding columns are disposed in the first insulating layer.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Abstract

The present application provides a circuit board and a manufacturing method thereof. The manufacturing method includes: providing a stacked board; the stacked board includes a third conducting circuit, a second substrate, a first conducting circuit, a first substrate, and a second conducting circuit, which are stacked disposed in that order; defining several through holes on a surface of the stacked board along a stacked direction of the stacked board; and manufacturing antenna conductors in the through holes. The antenna conductors are disposed in the through holes on a surface of the stacked board, the antenna conductors on different layers are connected to corresponding conducting circuits, some of the antenna conductors are directly connected with the conducting circuit. A loss of signals while transmitting is reduced, and the circuit board including the antenna structure is changed from an up-down structure into a left-right structure for reducing a board thickness.

IPC Classes  ?

• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
• H01Q 1/36 - Structural form of radiating elements, e.g. cone, spiral, umbrella
• H05K 3/42 - Plated through-holes
• H05K 1/02 - Printed circuits Details

Abstract

The present application provides a pressure-sensitive circuit board, including a circuit substrate, a number of conductive convex blocks, and a strain member. The circuit substrate includes a dielectric layer and a conductive wiring layer on the dielectric layer. The conductive convex blocks are spaced from each other on the conductive wiring layer. A receiving space is defined between adjacent conductive convex blocks. The strain member is formed on the conductive convex blocks and covers the receiving space. The strain member can be deformed under an external force. The receiving space can receive at least a portion of the strain member. The present application further provides a manufacturing method for the pressure-sensitive circuit board. The present application further provides a pressure sensor.

IPC Classes  ?

• G01L 1/22 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges

Abstract

A method for manufacturing a circuit board includes disposing an electronic component in a recess formed in a first circuit substrate, and bonding a second circuit substrate to the first circuit substrate to form a third circuit substrate with the electronic component embedded. The method includes forming an opening in the third circuit substrate to expose the electronic component and an inner surface of the third circuit substrate. The method includes disposing an insulation case in the opening. The insulation case has a first segment directly contacting the electronic component, a second segment facing the inner surface, an inner wall between the first and second segments, a first chamber surrounded by the first segment and the inner wall, and a second chamber surrounded by the second segment and the inner wall. The method includes adding a heat-exchanging fluid into the first chamber.

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Abstract

A circuit board utilizing thermocouples for improved heat dissipation performance from circuit boards includes a heat dissipation module which itself includes a first circuit substrate, a thermocouple, and a second circuit substrate. The first circuit substrate includes a first wiring layer comprising first and second wiring portions. The thermocouple includes a P-type and an N-type semiconductor. The second circuit substrate includes a second wiring layer with a third wiring portion. Conductive members electrically connect the P-type semiconductor with the first wiring portion, connect the P-type semiconductor with the third wiring portion, connect the N-type semiconductor with the second wiring portion, and connect the N-type semiconductor with the third wiring portion, to transfer away heat generated by working elements mounted on the board.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
• H05K 3/46 - Manufacturing multi-layer circuits
• H10N 10/852 - Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur

Abstract

A buried thermistor includes a lower substrate, an upper substrate, and a number of thermistor stacks. Each thermistor stack includes two resistor subjects. Each resistor subject includes a base layer, a medium layer, a metal layer, a resistor layer, a nanometal layer, and a conductive layer. Applicable material of the resistor layer becomes more diverse by disposing the number of thermistor stacks, and the buried thermistor shows variable thermal sensitivity.

IPC Classes  ?

• H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
• H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
• H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors

Abstract

A camera module having OIS function and its preparation method are provided. The camera module includes a housing and an optical assembly in the housing, and further includes a circuit board in the housing. The circuit board includes a first board and a second board on the first board. The first board is flexible. The first board includes a first portion, a second portion, and a third portion successively connected in an extending direction of the first board. The second portion defines a slot. The second board is on the third portion. The optical assembly is on the second board. The first portion includes a fixed end connecting the second portion and an opposite free end. The housing defines a through hole. The first portion extends through the slot to form a bent portion and extends out of the through hole, such that the free end is outside the housing.

IPC Classes  ?

• H04N 23/54 - Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• G03B 5/00 - Adjustment of optical system relative to image or object surface other than for focusing of general interest for cameras, projectors or printers
• H04N 23/51 - Housings
• H04N 23/68 - Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations

Abstract

A method for manufacturing a photoelectric composite circuit board, includes providing a copper-clad carrier and an intermediate circuit, the copper-clad carrier includes a substrate layer and a bottom copper layer, a first groove is defined on the intermediate circuit. Forming an optical fiber in the first groove. Forming a first accommodating groove and a second accommodating groove at each end the optical fiber. Accommodating a first coupling element in the first accommodating groove. Removing the substrate layer. Removing the bottom copper layer corresponding to the optical fiber, the intermediate circuit on one side of the optical fiber and the bottom copper layer forming a first circuit substrate, the intermediate circuit on another side of the optical fiber and the bottom copper layer forming a second circuit substrate. Electrically connecting a chip to the first circuit substrate, and electrically connecting an electronic component to the second circuit substrate.

IPC Classes  ?

• G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
• G02B 6/13 - Integrated optical circuits characterised by the manufacturing method
• H05K 1/02 - Printed circuits Details
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A method for manufacturing a fan-out chip packaging structure with decreased use of a crack-inducing hot-soldering process includes a first carrier plate with first and a second outer wiring layers. Two first conductive posts are formed on the first outer wiring layer, one end of each post is electrically connected to the first outer wiring layer. A receiving groove is formed between first conductive posts, and a sidewall of each post is surrounded by a first insulating layer. An embedded component is laid in the receiving groove and a second carrier plate is formed on the first insulating layer, wherein the second carrier plate carries third and fourth outer wiring layers. A first outer component is connected to the second outer wiring layer, and a second outer component is connected to the fourth outer wiring layer.

IPC Classes  ?

• H05K 3/42 - Plated through-holes
• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/498 - Leads on insulating substrates
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or

Abstract

A method for manufacturing a multilayer circuit board includes providing an inner circuit substrate defining a through hole, attaching a support plate to the inner circuit substrate to seal an opening of the through hole; placing an electronic module in the through hole; pressing a first substrate onto a surface of the inner circuit substrate; removing the support plate; pressing a second substrate onto another surface of the inner circuit substrate, the first substrate and the second substrate infilling the through hole and jointly encapsulating the electronic module; forming a first conductive wiring layer on a surface of the first substrate facing away from the first surface to obtain a first circuit substrate, and forming a second conductive wiring layer on a surface of the second substrate facing away from the second surface to obtain a second circuit substrate. A multilayer circuit board is also disclosed.

IPC Classes  ?

• H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 3/42 - Plated through-holes

Abstract

A wiring substrate includes a first insulating layer with a first opening, a second insulating layer with a second opening, a high-frequency wiring layer, a first wiring layer, a second wiring layer, and a plurality of conductive pillars. The high-frequency wiring layer including a high-frequency trace is sandwiched between the first insulating layer and the second insulating layer. The first opening and the second opening expose two sides of the high-frequency trace respectively. The high-frequency trace has a smooth surface which is not covered by the first insulating layer and the second insulating layer and has the roughness ranging between 0.1 and 2 μm. The first insulating layer and the second insulating layer are all located between the first wiring layer and the second wiring layer. The conductive pillars are disposed in the second insulating layer and connected to the high-frequency trace.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A heat equalization plate includes a first copper clad laminate including a first copper foil, a second copper clad laminate including a second copper foil, a connecting bump, a plurality of thermally conductive bumps, and a working fluid. The second copper foil faces the first copper foil. The connecting bump is formed on a surface of the first copper foil facing the second copper foil. The thermally conductive bumps are formed on a surface of the first copper foil facing the second copper foil. The connecting bump is an annulus and surrounds the thermally conductive bumps. The connecting bump is connected to the second copper foil to form a sealed chamber. The thermally conductive bumps are received in the sealed chamber. The working fluid is received in the sealed chamber.

IPC Classes  ?

• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure
• B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
• C25D 7/06 - WiresStripsFoils
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A circuit board with embedded components and a method of fabricating the same are provided. The method includes coating an adhesive layer over a substrate, and disposing electronic components on the adhesive layer. Subsequently, after disposing a dielectric layer over the electronic components and the adhesive layer, the substrate and the adhesive layer are removed to form an embedded layer. Then, a wiring layer is formed on the electronic components, and conductive connecting components are formed within the dielectric layer. A cover layer is laminated over the dielectric layer and the wiring layer. Therefore, the electronic components are embedded within the dielectric layer, and the wiring layer electrically connecting to the electronic components are precisely located on a surface of the embedded layer.

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A circuit board includes an inner circuit substrate and an outer circuit substrate electrically connected to the inner circuit substrate. The outer circuit substrate includes an outer dielectric layer and an outer circuit layer facing the inner circuit substrate embedded in the outer dielectric layer. A portion of the outer circuit layer facing away from the inner circuit substrate protruding from the outer dielectric layer. The circuit board can increase contact area between the outer circuit layer and the outer dielectric layer, improving adhesion between the outer circuit layer and the outer dielectric layer, and reducing a thickness of the outer circuit substrate, thereby reducing the overall thickness of the circuit board.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 1/05 - Insulated metal substrate
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
• H05K 3/42 - Plated through-holes

Abstract

A circuit board includes a dielectric substrate, a signal line and a pair of ground wires. The dielectric substrate includes a base and an elevated platform protruding from an upper surface of the base. The signal line is conformally disposed on the dielectric substrate and includes a first segment disposed on an upper surface of the elevated platform, a second segment extending on the upper surface of the base, and a third segment disposed on a sidewall of the elevated platform and connecting the first segment and the second segment. The pair of ground wires are disposed on the dielectric substrate and are spaced apart from the signal line. A projection of the second segment of the signal line on the upper surface of the base partly overlaps projections of the pair of ground wires on the upper surface of the base.

IPC Classes  ?

• H01P 3/00 - WaveguidesTransmission lines of the waveguide type
• H01P 3/02 - WaveguidesTransmission lines of the waveguide type with two longitudinal conductors
• H05K 1/02 - Printed circuits Details
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Abstract

The disclosure provides a circuit board assembly, which includes a core layer, an electronic component, a first shielding ring wall, a second shielding ring wall, a first circuit layer, a second circuit layer, a first insulating layer and first shielding columns. The core layer includes an accommodating space, and the accommodating space has an inner side wall. The first shielding ring wall is disposed in the accommodating space and covers the inner side wall, in which the first shielding ring wall surrounds the electronic component. The second shielding ring wall is disposed in the core layer and surrounds the first shielding ring wall. The core layer is disposed between the first circuit layer and the second circuit layer. The second circuit layer is disposed between the first insulating layer and the core layer. The first shielding columns are disposed in the first insulating layer.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 3/46 - Manufacturing multi-layer circuits
• H01L 23/552 - Protection against radiation, e.g. light

Abstract

A circuit board assembly includes a first circuit board and a second circuit board. The first circuit board includes a first contact pad and defines a stamped protrusion being correspondingly positioned relative to a position of the first contact pad, the first contact pad being outside the stamped protrusion. The second circuit board includes a second contact pad. The first contact pad on the stamping protrusion is in contact with the second contact pad to achieve electronic connections between the first circuit board and the second circuit board. A method for manufacturing the circuit board assembly is further disclosed.

IPC Classes  ?

• H05K 1/14 - Structural association of two or more printed circuits
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/36 - Assembling printed circuits with other printed circuits

Abstract

An anti-shake assembly with reduced size is disclosed which includes a circuit board, a photosensitive chip, and a magnetic component. The circuit board includes a first rigid board, a second rigid board, a plurality of connectors, and a plurality of coils. The first rigid board has a housing space. The second rigid board is movably housed in the housing space. The connectors are flexibly connected between the first rigid board and the second rigid board. The photosensitive chip and the coils are provided on the second rigid board. The magnetic component includes a base and a plurality of magnets. The base includes a central plate and a side plate. The side plate is arranged around a periphery of the central plate to form a housing space. The magnets are provided on the central plate facing the housing space. The magnets are arranged opposite to the coils.

IPC Classes  ?

• H04N 23/68 - Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
• G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
• H02K 41/035 - DC motorsUnipolar motors

Abstract

A pressure sensing circuit board includes a dielectric layer, a wiring layer, a strain layer, and a protective layer. The wiring layer is on the dielectric layer. The strain layer is on the dielectric layer having the line layer. The protective layer is on the wiring layer and the strain layer. The pressure sensing circuit board includes a first copper area, a second copper area, and a copper free area. The wiring layer is located in the first copper area and the second copper area. A thickness of the line layer in the first copper area is greater than that in the second copper area, and the wiring layer in the second copper area is mesh-shaped. The strain layer is in the copper free zone and connected to the line layer. The protective layer is on the wiring layer in the second copper area and covers the strain layer.

IPC Classes  ?

• G01L 1/22 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges

Abstract

A circuit board assembly includes an inner circuit substrate, a first outer circuit substrate, a second outer circuit substrate, a heat conducting block, an electronic component, and a reinforcing plate. The first outer circuit substrate and second outer circuit substrate are disposed on surfaces of the inner circuit substrate. The heat conducting block penetrates through the inner circuit substrate and connects to the first outer circuit substrate and the second outer circuit substrate. The heat conducting block made of aluminum nitride. An electronic component at least partially accommodated in the heat conducting block. The reinforcing plate is disposed on a surface of the second outer circuit substrate corresponding to the electronic component and faces away from the electronic component. The present disclosure further provides a method for manufacturing the circuit board assembly.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Abstract

A method of manufacturing a display module which is able to present a split-screen display without a black line prominent at the boundary includes: providing a first circuit substrate including a plurality of first pads, providing a second circuit substrate including a plurality of second pads; bonding the first circuit substrate and the second circuit sub state onto a surface of a heat dissipation plate through a first heat conductive adhesive; and mounting a plurality of light emitting diodes onto the first conductive wiring layer and the third conductive wiring layer, where one light emitting diodes is electrically connected to two first pad, one light emitting diode is electrically connected to one first pad and one second pad, and one light emitting diode is electrically connected to two second pads. A display module including light emitting diodes is also disclosed.

IPC Classes  ?

• H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
• H10H 20/01 - Manufacture or treatment
• H10H 20/857 - Interconnections, e.g. lead-frames, bond wires or solder balls
• H10H 20/858 - Means for heat extraction or cooling

Abstract

A battery assembly includes a circuit board and a battery cell. The circuit board includes a first dielectric layer, a second dielectric layer, an adhesive film, a bus bar, a first copper block, a fuse, and a second copper block. The adhesive film is located between the first dielectric layer and the second dielectric layer and includes cavities. The first copper block and the bus bar are on the first dielectric layer. The second copper block and the fuse are on the second dielectric layer. The circuit board is divided into heat dissipation areas and bending areas which are connected and alternately arranged, the heat dissipation areas and the bending areas enclose a holding groove. The bus bar and the first block copper are accommodated in the holding groove. The battery cell is accommodated in the holding groove. A battery module and a manufacturing method are also disclosed.

IPC Classes  ?

• H01M 50/519 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing comprising printed circuit boards [PCB]
• H01M 50/505 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing comprising a single busbar
• H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
• H01M 50/583 - Devices or arrangements for the interruption of current in response to current, e.g. fuses
• H01M 10/04 - Construction or manufacture in general
• H01M 10/613 - Cooling or keeping cold
• H01M 10/6551 - Surfaces specially adapted for heat dissipation or radiation, e.g. fins or coatings

Abstract

A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The method includes providing a first metal layer defining a first slot; forming a first adhesive layer in the first slot; electroplating copper on each first pillar to form a first heat conducting portion; forming a first insulating layer on the first adhesive layer having the first heat conducting portion, and defining a first blind hole in the first insulating layer; filling the first blind hole with thermoelectric separation metal to form a second heat conducting portion; forming a first wiring layer on the first insulating layer; forming a second insulating layer on the first wiring layer, defining a second blind hole on the second insulating layer; electroplating copper in the second blind hole to form a third heat conducting portion; mounting an electronic component on the second insulating layer.

IPC Classes  ?

• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/38 - Cooling arrangements using the Peltier effect
• H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices
• H01L 23/528 - Layout of the interconnection structure
• H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
• H01L 33/44 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
• H01L 33/48 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor body packages
• H01L 33/52 - Encapsulations
• H01L 33/54 - Encapsulations having a particular shape
• H01L 33/56 - Materials, e.g. epoxy or silicone resin
• H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
• H01L 33/64 - Heat extraction or cooling elements
• H05K 1/02 - Printed circuits Details
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/24 - Reinforcing of the conductive pattern

Abstract

The present application provides a circuit board and a manufacturing method therefor. The manufacturing method comprises: providing a stack board, the stack board comprising a third conductive line, a second substrate, a first conductive line, a first substrate, and a second conductive line that are stacked in sequence; forming multiple through holes in the surface of the stack board along the stacking direction of the stack board; and manufacturing antenna conductors in the through holes. According to the present application, the through holes are formed in the surface of the stack board; the antenna conductors are provided in the through holes; the antenna conductors located at different layers are connected to corresponding conductive lines; and compared with a blind hole connection mode, some of the antenna conductors are directly connected by means of the conductive lines, thereby reducing loss during signal transmission. Meanwhile, the circuit board comprising an antenna structure is changed from an up-down structure to a left-right structure, such that the thickness of the board is decreased.

IPC Classes  ?

• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
• H05K 3/42 - Plated through-holes
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A wiring substrate includes a first insulating layer with a first opening, a second insulating layer with a second opening, a high-frequency wiring layer, a first wiring layer, a second wiring layer, and a plurality of conductive pillars. The high-frequency wiring layer including a high-frequency trace is sandwiched between the first insulating layer and the second insulating layer. The first opening and the second opening expose two sides of the high-frequency trace respectively. The high-frequency trace has a smooth surface which is not covered by the first insulating layer and the second insulating layer and has the roughness ranging between 0.1 and 2 μm. The first insulating layer and the second insulating layer are all located between the first wiring layer and the second wiring layer. The conductive pillars are disposed in the second insulating layer and connected to the high-frequency trace.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/03 - Use of materials for the substrate
• H05K 3/42 - Plated through-holes
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The circuit board includes a heat dissipation substrate, an insulating layer on the heat dissipation substrate, an electronic component, a base layer on the insulating layer, and a circuit layer on the base layer. The heat dissipation substrate includes a phase change structure and a heat conductive layer wrapping the phase change structure. The heat dissipation substrate defines a first through hole. The insulating layer defines a groove for receiving the electronic component. A second through hole is defined in the circuit layer, the base layer, and the insulating layer. A bottom of the second through hole corresponds to the heat conductive layer. A heat conductive portion is disposed in the second through hole.

IPC Classes  ?

• H05K 1/03 - Use of materials for the substrate
• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 3/42 - Plated through-holes

Abstract

A manufacturing method for an embedded circuit board. The manufacturing method comprises the following steps: providing an inner circuit board, and forming a through groove; attaching a loading plate to the inner circuit board so as to seal one end of the through groove; providing an electronic assembly module, wherein the electronic assembly module comprises a body, at least one electronic assembly, a first adhesive layer and a second adhesive layer, a groove is formed in the body, the at least one electronic assembly is fixed to a bottom wall of the groove by means of the first adhesive layer, and the second adhesive layer is filled in the groove and wraps the at least one electronic assembly together with the first adhesive layer; placing the electronic assembly module in the through groove; pressing a first base layer on one side of the inner circuit board; removing the loading plate; and pressing a second base layer on the other side of the inner circuit board, wherein the first base layer and the second base layer are filled in the through groove and together wrap the electronic assembly module. Further provided in the present application is an embedded circuit board prepared by using the method.

IPC Classes  ?

• H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
• H01L 23/488 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings

Abstract

A method for manufacturing a circuit board including: providing at least one wiring base board, the wiring base board comprising a first conductor layer, an insulation layer, and an alloy layer which are stacked in order, wherein a solder paste layer is formed on a side of the alloy layer, a part of the alloy layer is exposed out of the solder paste layer to form a thermal conductive surface; providing a core layer; and pressing two wiring base boards on two opposite sides of the core layer to form a sealed heat dissipating chamber between the thermal conductive surfaces of the two wiring base boards. The present disclosure further provides a circuit board having a heat dissipation structure.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 3/42 - Plated through-holes
• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/14 - Structural association of two or more printed circuits

Abstract

A method for manufacturing a transparent circuit board includes the following steps. A composite substrate including a conductive layer and a transparent insulating layer on the conductive layer is provided. A wiring groove is formed on the transparent insulating layer by laser ablation and a carbon black layer is formed on an inner wall of the wiring groove. The wiring groove penetrates the transparent insulating layer, the wiring groove extends toward the conductive layer to pass through a part of the conductive layer. A conductive wiring corresponding to the wiring groove is formed and fully fills the wiring groove. A black oxide treatment is performed on a surface of the conductive wiring facing away from the conductive layer to form a blackened layer. A transparent cover film is pressed on a side of the transparent insulating layer facing away from the conductive layer. The conductive layer is removed.

IPC Classes  ?

• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

Abstract

A method for manufacturing a circuit board with narrow conductive traces and narrow spaces between traces includes a base layer and two first wiring layers disposed on opposite surfaces of the base layer. Each first wiring layer includes a first bottom wiring and a first electroplated copper wiring. The first bottom wiring is formed on the base layer. The first bottom wiring includes a first end facing the base layer, a second end opposite to the first end, and a first sidewall connecting the first end and the second end. The first electroplated copper wiring covers the second end and the first sidewall of the first bottom wiring.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/05 - Insulated metal substrate
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
• H05K 3/24 - Reinforcing of the conductive pattern
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A covering film (100) includes a first covering layer (10), a first adhesive layer (20), and a thermal conductive layer (30) sandwiched between the first covering layer (10) and the first adhesive layer (20). A thermal conductivity of the thermal conductive layer (30) is K1, K1 is in a range of 3 W/m.K to 65 W/m.K. A thermal conductivity of the first covering layer (10) is K2, K2 is in a range of 0.02 W/m.K to 3.0 W/m.K. A thermal conductivity of the first adhesive layer (20) is K3, K3 is in a range of 0.02 W/m.K to 1.0 W/m.K. A circuit board and its manufacturing method are also provided.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/03 - Use of materials for the substrate

Abstract

A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The method includes providing a first metal layer defining a first slot; forming a first adhesive layer in the first slot; electroplating copper on each first pillar to form a first heat conducting portion; forming a first insulating layer on the first adhesive layer having the first heat conducting portion, and defining a first blind hole in the first insulating layer; filling the first blind hole with thermoelectric separation metal to form a second heat conducting portion; forming a first wiring layer on the first insulating layer; forming a second insulating layer on the first wiring layer, defining a second blind hole on the second insulating layer; electroplating copper in the second blind hole to form a third heat conducting portion; mounting an electronic component on the second insulating layer.

IPC Classes  ?

• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/38 - Cooling arrangements using the Peltier effect
• H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices
• H01L 23/528 - Layout of the interconnection structure
• H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
• H01L 33/44 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
• H01L 33/48 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the semiconductor body packages
• H01L 33/56 - Materials, e.g. epoxy or silicone resin
• H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 1/02 - Printed circuits Details
• H05K 3/24 - Reinforcing of the conductive pattern

Abstract

A manufacturing method of a circuit board includes: providing a first double-sided copper laminate including a dielectric layer, a first copper foil layer and a copper plating layer, wherein the dielectric layer, wherein the dielectric layer defines a groove, the copper plating layer includes a first copper plating portion in the groove and a second copper plating portion beside the first copper plating portion. A double-sided circuit substrate including base layer and two first wiring layers is provided, wherein each first wiring layer includes a signal line. Conductive paste blocks are disposed in the base layer and on both sides of the signal line; and a first double-sided copper laminate is stacked on each side of the double-sided circuit substrate, disposing the signal line in the groove. The conductive paste blocks are pressed electrically connect same to the second copper plating portions. The present disclosure further provides a circuit board.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Abstract

A camera module having an optical image stabilization function, and a preparation method therefor. The camera module comprises a housing and an optical component arranged in the housing. The camera module further comprises a circuit board arranged in the housing, the circuit board comprising a first board and a second board arranged on the first board, wherein the first board is a flexible circuit board; and the first board comprises, in the extension direction of the first board, a first portion, a second portion and a third portion, which are connected to each other in sequence; the second portion is provided with a slot, the second board is arranged on the third portion, and the optical component is mounted on the second board. The first portion comprises a fixed end connected to the second portion and a free end opposite to the fixed end, the housing is provided with a through hole, the first portion passes through the slot to form a bent portion, and the first portion further extends out of the through hole such that the free end is located outside the housing.

IPC Classes  ?

• H04N 5/225 - Television cameras

Abstract

The present application provides an anti-shake assembly. The anti-shake assembly comprises a circuit board, a photosensitive chip and a magnetic element. The circuit board comprises a first hard board, a second hard board, a plurality of connectors and a plurality of coils. The first hard board is provided with an accommodating space. The second hard board is movably accommodated in the accommodating space. The connectors are flexibly connected between the first hard board and the second hard board. The photosensitive chip and the coils are disposed on the second hard board. The magnetic element comprises a base and a plurality of magnets. The base comprises a main board and side boards. The side boards are arranged around the periphery of the main board so as to form the accommodating space. The magnets are disposed on the side of the main board facing the accommodating space, and the magnets are arranged opposite to the coils. In addition, the present application also provides a fabrication method for the anti-shake assembly and a camera module.

IPC Classes  ?

• H04N 5/225 - Television cameras

Abstract

A multi-layer circuit board with embedded components (100) in multiple layers and miniaturized form, with embedded electronic elements in a higher element density and shorter voltage paths includes a circuit board (10) provided with a mounting groove (101), and a plurality of elements (20). The elements (20) are arranged in the mounting groove (101), and the circuit board (10) includes several vertically-stacked circuit substrates (11, 12, 13, 14) arranged around the mounting groove (101), The multi-layer circuit board with embedded components circuit board (100) includes a conductive member (30) arranged in the mounting groove (101) and electrically connecting the elements (20) and the layers of conductive circuits.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A pressure-sensitive circuit board (100), comprising a dielectric layer (12), a circuit layer (145), a strain layer (30) and a protective layer (40), wherein the circuit layer (145) is located on a surface of the dielectric layer (12); the strain layer (30) is located on the surface of the dielectric layer (12) that is on the same side as the circuit layer (145); and the protective layer (40) is located on surfaces of the circuit layer (145) and the strain layer (30). The pressure-sensitive circuit board (100) comprises a first copper area (I), a second copper area (II) and a copper-free area (III), which are connected in sequence, wherein the circuit layer (145) is located in the first copper area (I) and the second copper area (II); in the direction in which the circuit layer (145) is stacked on the dielectric layer (12), the circuit layer (145) located in the first copper area (I) is thicker than that located in the second copper area (II), and the circuit layer (145) located in the second copper area (II) is in the shape of a grid; the strain layer (30) is located in the copper-free area (III) and is connected to the circuit layer (145); and the protective layer (40) is located on a surface of the circuit layer (145) located in the second copper area (II) and covers the strain layer (30). The present application further provides a manufacturing method for the pressure-sensitive circuit board (100).

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• G01L 9/06 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers of piezo-resistive devices

Abstract

The present application provides a pressure-sensitive circuit board, comprising a circuit substrate, a plurality of conductive bumps and a strain body. The circuit substrate comprises a dielectric layer and a conductive line that is disposed on the dielectric layer; the plurality of conductive bumps are arranged at intervals on the conductive line, and an accommodating space is provided between every two adjacent conductive bumps; the strain body is disposed on the plurality of conductive bumps and covers the accommodating spaces; the strain body is used for generating deformation under the action of an external force; and the accommodating spaces are used for accommodating at least part of the deformed strain body. In addition, the present application further provides a fabrication method for a pressure-sensitive circuit board. Furthermore, the present application also provides a pressure sensor.

IPC Classes  ?

• G01L 1/18 - Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material

Abstract

A circuit board assembly (100), comprising an inner layer circuit substrate (10), a first outer layer circuit substrate (30), a second outer layer circuit substrate (40), a thermal conduction block (20), an electronic component (70), and a reinforcing plate (90); the first outer layer circuit substrate (30) is positioned on a surface of the inner layer circuit substrate (10); the second outer layer circuit substrate (40) is positioned on a surface of the inner layer circuit substrate (10) facing away from the first outer layer circuit substrate (30); the thermal conduction block (20) penetrates through the inner layer circuit substrate (10) and is connected to the first outer layer circuit substrate (30) and the second outer layer circuit substrate (40), the thermal conduction block (20) comprises an accommodating groove (60) with an opening facing the first outer layer circuit substrate (30), and the material of the thermal conduction block (20) is aluminium nitride; at least part of the electronic component (70) is accommodated in the accommodating groove (60) and is electrically connected to the first outer layer circuit substrate (30); and the reinforcing plate (90) is positioned on a surface of the second outer layer circuit substrate (40) corresponding to the electronic component (70) and facing away from the electronic component (70). Also provided in the present application is a manufacturing method for the circuit board assembly (100).

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A battery assembly (100), comprising a circuit board (10) and a cell (70). The circuit board (10) comprises a first dielectric layer (22), a second dielectric layer (32), a film (40), a busbar (242), a first heat dissipation copper block (245), a fuse (342), and a second heat dissipation copper block (345). The film (40) is located between the first dielectric layer (22) and the second dielectric layer (32) and has a plurality of spaced cavities (45a). The first heat dissipation copper block (245) and the busbar (242) are located on the surface of the first dielectric layer (22). The second heat dissipation copper block (345) and the fuse (342) are located on the surface of the second dielectric layer (32). The circuit board (10) comprises successive heat dissipation regions (I) and bending regions (II). The heat dissipation regions (I) and the bending regions (II) define an accommodation slot (60). The busbar (242), the first heat dissipation copper block (245), the fuse (342), and the second heat dissipation copper block (345) are all located in the heat dissipation regions (I). The busbar (242) and the first heat dissipation copper block (245) are arranged facing the accommodation slot (60). The cell (70) is located in the accommodation slot (60) and is electrically connected to the circuit board (10) by means of the busbar (242). The present application further provides a battery module (200) and a method for manufacturing the battery assembly (100).

IPC Classes  ?

• H01M 10/60 - Heating or coolingTemperature control
• H01M 10/613 - Cooling or keeping cold
• H01M 50/284 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders with incorporated circuit boards, e.g. printed circuit boards [PCB]

Abstract

Disclosed in the present application is a circuit board assembly. The circuit board assembly comprises a first circuit board, and a second circuit board arranged on the first circuit board. The first circuit board comprises a first insulating layer, and a first conductive circuit layer arranged on the first insulating layer; the first conductive circuit layer comprises a first contact pad; the position where the first contact pad is located on the first circuit board is provided with a stamping protrusion facing the second circuit board; the second circuit board is arranged on the first circuit board, and comprises a second insulating layer and a second conductive circuit layer arranged on the second insulating layer; the second conductive circuit layer comprises a second contact pad; and the second contact pad comes into contact with the first contact pad located on the stamping protrusion. Further disclosed in the present application is a manufacturing method for the circuit board.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

A method for manufacturing a circuit board comprises steps of providing a single-sided board comprising a first insulating base, a copper layer, and at least one first conductive structure; providing a laminated board comprising a metal layer, a third insulating base, a metal shielding layer, and a second insulating base; forming a wiring layer by the metal layer comprising at least one signal wire and at least one connecting pad; defining at least one second through hole each passing through the second insulating base, the metal shielding layer, and the third insulating base; forming a second conductive structure in each second through hole; providing a double-sided board comprising a wiring layer, a fourth insulating base, a first copper foil; and at least one third conductive structure; pressing the single-sided board, at least one middle structure, and the double-sided board in that sequence to form the circuit board.

IPC Classes  ?

• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 1/02 - Printed circuits Details

Abstract

Provided in the present application is a circuit board, comprising a circuit substrate, magnetizers, a plurality of first conductive lines and a plurality of second conductive lines, wherein the circuit substrate comprises a first circuit layer and a second circuit layer, and the first circuit layer and the second circuit layer are respectively disposed on the upper and lower sides of each magnetizer; and the plurality of first conductive lines and the plurality of second conductive lines are respectively disposed on the left and right sides of each magnetizer. The plurality of first conductive lines, a plurality of first circuits, the plurality of second conductive lines and a plurality of second circuits, which are adjacent to each magnetizer, are spirally and progressively connected in sequence to form an induction coil. At least two magnetizers and at least two induction coils wound around outer sides of the magnetizers form a transformer. According to the circuit board provided by the present application, the transformer is provided inside the circuit board, such that the space of the circuit board itself is fully utilized, and the risk of damage caused by exposure of the transformer is reduced. In addition, further provided in the present application is a manufacturing method for a circuit board.

IPC Classes  ?

• H01F 27/28 - CoilsWindingsConductive connections

Abstract

A method for manufacturing a circuit board including the following steps: providing a flexible double-sided metal-clad laminate including a first metal foil, a flexible dielectric layer, and a second metal foil. A carrier is attached to the second metal foil. A first wiring layer including a first wiring region and a second wiring region is formed by the first metal foil. The first wiring region includes a first connecting pad, and the second wiring region includes a connecting pad. A plurality of rigid dielectric blocks surrounded to form an interval and a first groove exposing the first connecting pad is pressed on the flexible dielectric layer to form a rigid dielectric layer. An electronic component is fixed the first groove. The carrier is removed. The intermediate structure is bent along the interval and pressed. A second wiring layer is formed by the second metal foil.

IPC Classes  ?

• H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Abstract

A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The circuit board includes a heat dissipation substrate, an insulating layer on the heat dissipation substrate, an electronic component, a base layer on the insulating layer, and a circuit layer on the base layer. The heat dissipation substrate includes a phase change structure and a heat conductive layer wrapping the phase change structure. The heat dissipation substrate defines a first through hole. The insulating layer defines a groove for receiving the electronic component. A second through hole is defined in the circuit layer, the base layer, and the insulating layer. A bottom of the second through hole corresponds to the heat conductive layer. A heat conductive portion is disposed in the second through hole.

IPC Classes  ?

• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 1/03 - Use of materials for the substrate
• H05K 3/42 - Plated through-holes

Abstract

A method for manufacturing a circuit board, includes: stacking a first peelable film on a second peelable film, and disposing fluffy carbon nanotubes between the first peelable film and the second peelable film, thereby obtaining a carbon nanotube layer; pressing the first peelable film, the carbon nanotube layer, and the second peelable film to compact the fluffy carbon nanotubes, thereby obtaining a thermal conductive layer; removing the first peelable film, and disposing a first adhesive layer, a first dielectric layer, and a first circuit layer on a side of the thermal conductive layer away from the second peelable film; removing the second peelable film, and disposing a second adhesive layer, a second dielectric layer, and a second circuit layer on a side of the thermal conductive layer away from the first adhesive layer; mounting an electronic component on the first circuit layer.

IPC Classes  ?

• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
• H05K 1/02 - Printed circuits Details
• B82Y 40/00 - Manufacture or treatment of nanostructures

Abstract

A circuit board includes a circuit substrate, a solder, and a surrounding portion. The circuit substrate includes a connecting pad. The solder is formed on a surface of the connecting pad. The surrounding portion is formed on the surface of the connecting pad and cooperates with the connecting pad to form a groove receiving the solder. The surrounding portion surrounds the solder and is spaced from the solder. A method for manufacturing a circuit board is also provided.

IPC Classes  ?

• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 1/02 - Printed circuits Details
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

A circuit board includes a circuit substrate, at least one metal pad, and a tin bar corresponding to each of the at least one metal pad. Each of the at least one metal pad is formed on a side of the circuit substrate and is electrically connected to the circuit substrate. A surface of the metal pad facing away from the circuit substrate is recessed toward the circuit substrate to from a recess. The tin bar is received in the recess. A method for manufacturing a circuit board is also provided.

IPC Classes  ?

• H05K 1/03 - Use of materials for the substrate
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/28 - Applying non-metallic protective coatings

Abstract

A flexible circuit board includes two first wiring boards, a first adhesive, and a first conductive structure. Each of the two first wiring boards includes a first bent portion, and two first bent portions of the two wiring boards is connected to each other. The first adhesive layer is sandwiched between the two first bent portions. The first conductive structure penetrates the two first bent portions and the first adhesive layer and electrically connects the two first bent portions.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
• H05K 3/22 - Secondary treatment of printed circuits
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A circuit board utilizing the better and faster performance of optical signals includes interconnected first, second, and third areas. The first area includes a first circuit substrate, and a first coupling element and a chip connected thereon. The second area includes an optical fiber within an insulating layer. The third area includes a second circuit substrate, and a second coupling element and an electronic element connected thereon. The first coupling element and the second coupling element are optically aligned with the optical fiber for signal reception and transmission. A method for manufacturing such composite circuit board is also disclosed.

IPC Classes  ?

• G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
• G02B 6/13 - Integrated optical circuits characterised by the manufacturing method
• H05K 1/02 - Printed circuits Details
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A circuit board includes a first outer wiring layer, a circuit substrate, and a second outer wiring layer stacked. The circuit substrate includes a first inner wiring layer, an insulating layer, and a second inner wiring layer stacked. A plurality of thermally conductive pillars is arranged at intervals on the first inner wiring layer, a liquid storage space is formed between every two adjacent thermally conductive pillars, and a thermally conductive agent is received in the liquid storage space. The first outer wiring layer is formed on the plurality of thermally conductive pillars. The second outer wiring layer is formed the second inner wiring layer. A first groove penetrates the second outer wiring layer, the second inner wiring layer and the insulating layer, exposes a portion of the first inner wiring layer, and corresponds to the thermally conductive pillars. At least one heating element is installed in the first groove.

IPC Classes  ?

• H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 1/02 - Printed circuits Details
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

A method for manufacturing a fixing belt for a wearable device, includes providing a flexible circuit board including a first area, a second area, and a pad in the first area; disposing an insulating layer on the flexible circuit board, the insulating layer being disposed in the second area; forming an electric conductive portion in the insulating layer; disposing a first protective layer and a second protective layer on opposite surfaces of the flexible circuit board, the electric conductive portion being between the flexible circuit board and the first protective layer; mounting an electronic component on the pad. A portion of the fixing belt containing the second area is a plug-in area, and the plug-in area is configured to be engaged with a device body of the wearable device, the electric conductive portion is disposed in the plug-in area.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A method for manufacturing a circuit board embeds a portion of an outer circuit layer in an outer dielectric layer which increases contact area between the outer circuit layer and the outer dielectric layer, improving adhesion between the outer circuit layer and the outer dielectric layer, and reducing a thickness of the outer circuit substrate, thereby reducing the overall thickness of the finished circuit board.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
• H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
• H05K 3/42 - Plated through-holes
• H05K 3/46 - Manufacturing multi-layer circuits
• H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H01L 23/498 - Leads on insulating substrates
• G02B 6/10 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 1/05 - Insulated metal substrate
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Abstract

The present disclosure provides a method for manufacturing a board-to-board connection structure. The method includes defining a first through hole in a first circuit board, disposing a first connector within the first through hole by a first conductive paste, and connecting the first connector to a second circuit board on which a second connector is installed, thereby realizing a connection of the two circuit boards, and reducing a height of the two circuit boards after the connection. That is, the height of the board-to-board connection structure is reduced. Additionally, since the first connector is received within the first through hole, the first connector is not easy to be damaged and oxidized. The present disclosure further provides a board-to-board connection structure manufactured by the above method.

IPC Classes  ?

• H05K 1/14 - Structural association of two or more printed circuits
• H01R 12/58 - Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
• H05K 3/36 - Assembling printed circuits with other printed circuits
• H05K 3/42 - Plated through-holes

Abstract

An interposer, which is used to connect two circuit boards, includes an inner structure (10), an outer structure (20), and a protective layer (50). The inner structure (10) includes a first base layer (11) and a first wiring layer (131) formed on the first base layer (11). The outer structure (20) includes a second base layer (21) and a second wiring layer (231) formed on the second base layer (21). An end portion of at least wiring line of the first wiring layer (131) and the second wiring layer (231) extends to a sidewall of the interposer (100). An end of another wiring line extends to the other sidewall of the interposer (100). The first wiring layer (131) is electrically connected to the second wiring layer (231) by a conductive blind hole (41).

IPC Classes  ?

• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/498 - Leads on insulating substrates
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/42 - Plated through-holes

Abstract

A circuit board and a manufacturing method therefor. The circuit board includes a substrate and a plurality of traces arranged at intervals on the substrate. Each trace includes a seed layer located on one surface of the substrate, a first copper layer located on the surface of the seed layer away from the substrate, and a second copper layer plated on one surface of the substrate. The second copper layer covers the seed layer and the first copper layer. The ratio of the thickness of each trace to the space between any two adjacent traces is greater than 1. The thickness of the second copper layer in the thickness direction of the substrate is greater than the thickness of the second copper layer in a direction perpendicular to the thickness direction of the substrate.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H03K 3/42 - Generators characterised by the type of circuit or by the means used for producing pulses by the use, as active elements, of opto-electronic devices, i.e. light-emitting and photoelectric devices electrically- or optically-coupled
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
• H05K 3/42 - Plated through-holes

Abstract

A method for manufacturing a circuit board (100) includes: providing a first single-sided circuit substrate (20) including an insulating base layer (11) and a circuit layer (13); forming first conductive posts (111) electrically connected to the circuit layer (13) in the insulating base layer (11) to obtain a second single-sided circuit substrate (13); providing a first adhesive layer (40), forming second conductive posts (401); providing one second single-sided circuit substrate (30), defining a receiving groove (31) to obtain a third single-sided circuit substrate (50); providing another first single-sided circuit substrate (20), mounting an electronic component (14) on the circuit layer (13) to obtain a surface mounted circuit substrate (60); stacking the first single-sided circuit substrate (20), the first adhesive layer (40), the second single-sided circuit substrate (30), at least one of the third single-sided circuit substrate (50), and the surface mounted circuit substrate (60) in that order; pressing the intermediate body (70).

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
• H05K 1/03 - Use of materials for the substrate
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

A system for effectively curing dry film ink throughout its thickness on circuit boards being made applies an exposure system, a circuit board, and a method for making the circuit board. The exposure system includes a plurality of mixed light sources with different wavelengths within a range of 365 nm to 440 nm, the mixed light sources can output at least three different wavelengths of light each of substantially a single wavelength and a fourth source of light able to output light of a spectrum of wavelengths, the ranges of light being between 365 nm and 440 nm.

IPC Classes  ?

• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• G02F 1/13357 - Illuminating devices

Abstract

A virtual reality glove includes a gloved shaped substrate including a palm area and a finger area connected with the palm area, a plurality of conductive circuits disposed on the glove shaped substrate, a plurality of tactile feedback units disposed on and electrically connected with the plurality of conductive circuits respectively, and a data processing unit installed on an end of the palm area away from the finger area and electrically connected with the plurality of conductive circuits. The glove shaped substrate is flexible, and the conductive circuits are curved. A method for manufacturing the virtual reality glove is also disclosed.

IPC Classes  ?

• G06F 3/01 - Input arrangements or combined input and output arrangements for interaction between user and computer

Abstract

A method of manufacturing a base plate includes the following steps: providing a first substrate, the first substrate including a first base layer, a first copper coating and a second copper coating covered on two sides of the first base layer; opening at least one first hole on the first substrate, the first hole penetrating the first base layer and the first copper; forming a first electroplated coating on the first copper coating, the first copper coating filling the first hole to form a first connecting portion; opening at least one second hole on the first connecting portion and the first electroplated coating to form a plurality of second connecting pins.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H01R 12/71 - Coupling devices for rigid printing circuits or like structures
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

Abstract

A circuit board includes a substrate, a first inner circuit layer, a second inner circuit layer, a first insulating layer, a first optical fiber extending along a first direction, an optical component, an electrical component, a transparent insulating layer, a first inclined surface, a first reflective layer, a second inclined surface, a second reflective layer, and a second optical fiber extending along a second direction.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• G02B 6/36 - Mechanical coupling means
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A circuit board, with inbuilt protection against incoming and outgoing electromagnetic interference (EMI), includes an insulating adhesive portion, a first signal line, and a second signal line. The first signal line and the second signal line are surrounded and separated by an electromagnetic shielding film against EMI. The insulating adhesive portion fills a gap between the first signal line and the electromagnetic shielding film and a gap between the second signal line and the electromagnetic shielding film. External interference with signals in the circuit board is reduced, mutual interference between the first signal line and the second signal line is reduced, and electromagnetic radiation of the circuit board is also reduced. A method for manufacturing the circuit board is also disclosed.

IPC Classes  ?

• H05K 1/14 - Structural association of two or more printed circuits
• H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields

Abstract

A packaged antenna circuit structure suitable for 5G use includes a shielding layer, an electronic component, conductive pillars, a first insulation layer, a first stacked structure, an antenna structure, and a second stacked structure. The shielding layer defines a groove to receive the electronic component. The conductive pillars on the shielding layer surround the groove. The first insulation layer covers the shielding layer, the electronic component, and the conductive pillars. The first stacked structure is stacked on a side of the first insulation layer and includes a ground line connecting to the conductive pillars. The antenna structure is stacked on a side of the first stacked structure away from the first insulation layer and connected to the electronic component by the first stacked structure. The second stacked structure is stacked on a side of the first insulation layer away from the first stacked structure.

IPC Classes  ?

• H01L 23/552 - Protection against radiation, e.g. light
• H01L 23/66 - High-frequency adaptations
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or

Abstract

A circuit board includes a wiring board. The wiring board includes a first wiring layer, a dielectric layer and a second wiring layer stacked, and a plurality of spaced conductive pillars. Each conductive pillar connects the first wiring layer and the second wiring layer. A groove is recessed from a side of the dielectric layer facing away from the second wiring layer, and includes first recessed portion and at least two spaced second recessed portions recessed from a sidewall of the first recessed portion. An end surface of each conductive pillar is exposed from the at least two spaced second recessed portions, and a sidewall of each pillar close to the first recessed portion is exposed from the second recessed portion. At least one electronic component is received in the first recessed portion, and is connected to the conductive pillars through electrical connecting portions received in the second recessed portions.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components