H01G 13/00 - Apparatus specially adapted for manufacturing capacitorsProcesses specially adapted for manufacturing capacitors not provided for in groups
B28B 1/30 - Producing shaped articles from the material by applying the material on to a core, or other moulding surface to form a layer thereon
Provided is a method for manufacturing a ceramic green sheet which facilitates the peeling of a green sheet and effectively suppresses the contamination of the green sheet. The problem is solved by a method for manufacturing a ceramic green sheet, the method comprising: a) a step for applying a ceramic slurry onto a release film for manufacturing a ceramic green sheet; b) a step for forming a ceramic green sheet from the ceramic slurry applied in the a) step; c) a step for peeling off the ceramic green sheet formed in the b) step from the release film for manufacturing a ceramic green sheet; and d) a step for laminating a plurality of the ceramic green sheets peeled off in the c) step, wherein the release film for manufacturing a ceramic green sheet has a substrate and a release agent layer provided on at least one side of the substrate, and the sliding-down angle of diiodomethane on the surface on the opposite side of the release agent layer from the substrate is at most 33º.
B28B 1/30 - Producing shaped articles from the material by applying the material on to a core, or other moulding surface to form a layer thereon
B32B 7/06 - Interconnection of layers permitting easy separation
B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
H01G 13/00 - Apparatus specially adapted for manufacturing capacitorsProcesses specially adapted for manufacturing capacitors not provided for in groups
H01G 13/00 - Apparatus specially adapted for manufacturing capacitorsProcesses specially adapted for manufacturing capacitors not provided for in groups
4.
PACKAGING FILM, PACKAGING MATERIAL, AND FOOD PACKAGE
This packaging film (100) comprises: a biaxially stretched film layer (101) containing homopolypropylene; and a surface layer (A) (103) provided on at least one surface of the biaxially stretched film layer (101), wherein, when the total molar number of all monomer-derived constitutional units contained in the packaging film (100) is 100 mol%, the content of constitutional units derived from C2-C10 α-olefins (where the α-olefins exclude propylene) is 1.5-20.0 mol%.
A biaxially oriented polypropylene film (100) is provided with a biaxially oriented film layer (101) containing a propylene polymer, and has a crystal ratio of at least 38% at 165° C or lower, as determined by differential scanning calorimetry.
B65D 65/40 - Applications of laminates for particular packaging purposes
C08L 23/00 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondCompositions of derivatives of such polymers
C08L 23/10 - Homopolymers or copolymers of propene
A biaxially stretched polypropylene film (100) comprising a biaxially stretched film layer (101) containing a propylene-based polymer, wherein the long period of crystals in the TD direction obtained by a small-angle X-ray scattering (SAXS) measurement is 28.0 nm or less.
B65D 65/40 - Applications of laminates for particular packaging purposes
C08L 23/00 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondCompositions of derivatives of such polymers
C08L 23/10 - Homopolymers or copolymers of propene
Disclosed is a biaxially stretched polypropylene film (100) which comprises a biaxially stretched film layer (101) that contains a propylene polymer, and a surface resin layer (103) that is positioned on at least one surface of the biaxially stretched film layer (101) and contains a homopolypropylene (A), wherein the half-life of the saturated charged voltage as determined by the process described below is 1,300 seconds or less. (Process) A voltage is applied to the surface resin layer (103)-side surface of the biaxially stretched polypropylene film (100) for 30 seconds at an application voltage of 10 kV, a temperature of 23°C and a humidity of 50% RH, with the distance between the sample and the electrode being 20 mm, and the saturated charged voltage of the surface of the biaxially stretched polypropylene film (100) and the half-life of the saturated charged voltage are calculated in accordance with JIS L1094 (2014).
Provided is a stretched polyethylene film that contains, in the given order, the following: a high-density polyethylene layer 1 (101); a medium-density polyethylene layer (102); and a high-density polyethylene layer 2 (103). The stretched polyethylene film is configured so that the full-width at half-maximum (FWHM) of a peak is no more than 0.20 degrees, the peak being found on the basis of small-angle x-ray scattering (SAXS) measurement and being in a range in which an MD-direction diffraction angle ２θ is 0.2-0.4 degrees.
A packaging film comprising a biaxially oriented film layer (101) containing a propylene polymer, and a surface layer (A) (103) provided on at least one surface of the biaxially oriented film layer (101), the packaging film having an external haze of at least 2.0% as measured in accordance with JIS K7136(2000).
An oriented polyethylene film (100) comprising a high-density polyethylene layer 1 (101), a medium-density polyethylene layer (102), and a high-density polyethylene layer 2 (103) in this order, wherein the oriented polyethylene film has a crystal thickness of 16 nm or less in the MD direction as determined by small-angle X-ray scattering (SAXS) measurement.
A gas barrier coating material containing a polycarboxylic acid, a polyamine compound, and a Zn compound, wherein the value of (number of mol of Zn compound in the gas barrier coating material)/(number of mol of -COO- groups included in the polycarboxylic acid in the gas barrier coating material) is 0.40-0.70.
A gas barrier laminate comprising a substrate layer, a gas barrier layer provided on at least one surface of the substrate layer, and an inorganic substance layer provided between the substrate layer and the gas barrier layer, a composition ratio of Zn measured by X-ray photoelectron spectroscopy of the gas barrier layer is 1-10 atom%, when mass peak intensity of 6444H-measured through time-of-flight secondary ion mass spectroscopy of the gas barrier layer is denoted by I(6444H-3322 -3322 -), the value of I(6444H-3322 -) is 6×10-4to 5×10-2, a composition ratio of N measured through X-ray photoelectron spectroscopy of the gas barrier layer is higher than 0 atom% and lower than or equal to 12 atom%, and when mass peak intensity of CN-measured by time-of-flight secondary ion spectroscopy of the gas barrier layer is denoted by I(CN-), the value of I(CN-3322 -) is higher than 0 and equal to or lower 2.
21211 between a silicon back surface-grinding support substrate made from borosilicate glass and the adhesive surface A is at least 1.1 as measured while keeping the angle between the separated layers at 10°.
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
Provided is a sealant film for a retort food packaging container in which heat resistance at a retort temperature and shock resistance at a low temperature are balanced at a high level beyond the limit of a conventional technology or a wide processable temperature range and shock resistance at a low temperature are balanced. The problem is solved by the sealant film for a retort food packaging container comprising a seal layer, a core layer, and a laminate layer each containing straight-chain polyethylene, wherein each of the layers has specific density and/or is polymerized by a specific catalyst, or has a specific heat melting ratio at 121℃.
The present invention provides a mold release film for processing, which enables the production of a resin-sealed semiconductor or the like with a high productivity that exceeds the limits of the prior art by having high deaeration properties, while maintaining properties such as excellent mold releasability, excellent appearance of molded articles and excellent followability to a mold, these properties having been required for mold release films for processing in the past, and achieving a good balance among these properties at high levels that exceed the limits of the prior art. The above are achieved by means of a mold release film for processing, which is provided with recesses and projections on at least one of two surfaces, wherein the developed interfacial area ratio (Sdr) of the surface that is provided with the recesses and projections is 4.0% to 50.0% as measured with a laser microscope.
Provided is a method for producing cellulose beads such as porous cellulose beads, the method further facilitating handling, washing, removal, etc., of a dispersion medium and enabling cellulose beads having a minute particle size and a narrow particle size distribution to be easily and inexpensively produced. This problem is solved by a cellulose bead production method comprising: a) a step for preparing a dispersion medium containing a surfactant and an organic solvent; b) a step for causing a cellulose-dissolved solution containing cellulose and an alkaline aqueous solution to contact the dispersion medium; and c) a step for adding an acid to an emulsion containing the cellulose-dissolved solution obtained in step b), wherein the organic solvent has a boiling point of 105°C or lower.
The present invention provides a method for producing cellulose beads wherein the particle size of the cellulose beads can be controlled more finely. The problem is solved by a method for producing cellulose beads that includes a) a step for preparing a dispersion medium including a surfactant and an organic solvent, b) a step for bringing a cellulose dissolved solution including an alkaline aqueous solution and cellulose into contact with the dispersion medium, and c) a step for adding an acid to an emulsion including the cellulose dissolved solution obtained in step b), the HLB value of the surfactant being 4.3-6.5.
Provided is a back grinding adhesive film that is used to protect the surface of a wafer. This adhesive film includes a substrate layer and an adhesive resin layer provided on one side of the substrate layer and composed of a UV-curable adhesive resin material. The UV-curable adhesive resin material satisfies property (A) below, when the viscoelastic properties thereof are measured by following steps (i) and (ii) below. [Step] (i) A film having a thickness of 0.2 mm is formed by using a UV-curable adhesive resin material. The film is irradiated with ultraviolet rays having a dominant wavelength of 365 nm by using a high-pressure mercury lamp, under an environment of 25℃, with an irradiation intensity of 100 W/cm2and an ultraviolet level of 1080 mJ/cm2, so that the film is cured by the ultraviolet rays to obtain a cured film. (ii) The dynamic viscoelasticity of the cured film is measured at a frequency of 1 Hz, in a tensile mode, and in a temperature range of -50 to 200℃. [Property] (A) The loss tangent tan δ at -5℃ is 0.25-0.85.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
A method for producing an electronic device, the method comprising at least: a step (A) for preparing a structure that is provided with a wafer having a circuit formation surface and an adhesive film that is bonded to a circuit formation surface side of an electronic component; a step (B) for back-grinding a surface of the wafer, the surface being on the reverse side from the circuit formation surface; and a step (C) for irradiating the adhesive film with ultraviolet light, and subsequently removing the adhesive film from the wafer. The adhesive film comprises: a base material layer; and an ultraviolet curable adhesive resin layer which is formed on one surface of the base material layer with use of an ultraviolet curable adhesive resin material. With respect to the step (C), the loss tangent tanδ at -5°C of the adhesive resin layer of the adhesive film after irradiation of ultraviolet light is from 0.25 to 0.85 as determined under the conditions described below. (Conditions: The dynamic viscoelasticity is measured at a frequency of 1 Hz in a tensile mode over a temperature range from -50°C to 200°.)
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
This method for producing an electronic device includes at least a step (A) of preparing a structure that is provided with a wafer having a circuit-forming surface and an adhesive film affixed on the circuit-forming surface side of the wafer, a step (B) of backgrinding a surface of the wafer on the opposite side from the circuit-forming surface, and a step (C) of irradiating the adhesive film with UV light and then removing the adhesive film from the wafer, wherein the adhesive film is provided with a base material layer and an adhesive resin layer that is provided on one surface side of the base material layer and is constituted by a UV-curable adhesive resin material, and the UV-curable adhesive resin material, when the viscoelastic properties thereof are measured according to the below procedures (i) and (ii), has a storage modulus E' (100°C) at 100°C of 1.0×106to 3.5×107Pa, and E'(100℃)/E'(-15°C) equals 2.0×10-3to 1.5×10-2. [Procedures] (i) A film having a film thickness of 0.2 mm is formed using the UV-curable adhesive resin material, and the film is irradiated and UV-cured in a 25°C environment, by using a high-pressure mercury lamp to irradiate UV light having a dominant wavelength of 365 nm at an irradiation intensity of 100 W/cm2and a UV dose of 1080 mJ/cm2, whereby a cured film is obtained. (ii) The dynamic viscoelasticity of the cured film is measured in a temperature range of -50 to 200°C at a frequency of 1 Hz in a tensile mode.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
A method for producing an electronic device which is provided with a step for preparing a structure equipped with a wafer having a circuit formation surface, and an adhesive film stuck to the circuit formation surface side of the wafer, a step for backgrinding the surface of the wafer on the side thereof opposite the circuit formation surface, and a step for irradiating the adhesive film with ultraviolet rays, and thereafter, removing the adhesive film from the wafer, wherein: the adhesive film is equipped with a substrate layer, and an adhesive resin layer provided on one surface of the substrate layer and comprising an ultraviolet ray-curable adhesive resin material; the storage elastic modulus E' (5°C) at 5°C after curing by ultraviolet radiation is 2.0×106to 2.0×109Pa; and the storage elastic modulus E' (100°C) at 100°C is 1.0×106to 3.0×107Pa.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
This method for producing an electronic device at least includes: a step (A) for preparing a structure comprising a wafer which has a circuit-forming surface and an adhesive film stuck on the circuit-forming surface side of the wafer; a step (B) for backgrinding the surface on the side opposite to the circuit-forming surface side of the wafer; and a step (C) for irradiating the adhesive film with UV light and thereafter removing the adhesive film from the wafer. The adhesive film comprises: a base layer; and an adhesive resin layer which is provided on one side of the base layer and which is composed of a UV-curable adhesive resin material. In step (C), E'(100°C), which is the storage elastic modulus at 100°C of the adhesive resin layer of the adhesive film after being irradiated with UV light, is 1.0 × 106to 3.5 × 107Pa when measured under the condition shown below, and E'(100°C)/E'(-15°C) is 2.0 × 10-3to 1.5 × 10-2. (Condition) The dynamic viscoelasticity is measured in tensile mode at a frequency of 1 Hz and in the temperature range from -50°C to 200°C.
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
A method for producing an electronic device, the method comprising at least: a step (A) for preparing a structure that is provided with a wafer having a circuit formation surface and an adhesive film that is bonded to the circuit formation surface side of the wafer; a step (B) for back-grinding a surface of the wafer, the surface being on the reverse side from the circuit formation surface; and a step (C) for irradiating the adhesive film with ultraviolet light, and subsequently removing the adhesive film from the wafer. Meanwhile, the adhesive film comprises: a base material layer; and an ultraviolet curable adhesive resin layer which is formed on one surface of the base material layer with use of an ultraviolet curable adhesive resin material. The loss tangent tanδ at -5°C of a cured film of the ultraviolet curable adhesive resin material as determined by the procedure described below is from 0.25 to 0.85. [Procedure]: (i) A film having a film thickness of 0.2 mm is formed with use of an ultraviolet curable adhesive resin material; and the film is irradiated with ultraviolet light having a main wavelength of 365 nm at an irradiation intensity of 100 W/cm2at an ultraviolet dose of 1,080 mJ/cm2 with use of a high pressure mercury lamp in an environment of 25°C, thereby obtaining a cured film by means of ultraviolet curing. (ii) The dynamic viscoelasticity of the cured film is measured at a frequency of 1 Hz in a tensile mode over a temperature range from -50°C to 200°C.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
Provided is an adhesive film for backgrinding, the adhesive film being used to protect the surface of a wafer, and comprising a base material layer and an adhesive resin layer that is provided on one side of the base material layer and constituted from a UV-curable adhesive resin material. Here, in the UV-curable adhesive resin material, E'(100°C) is 1.0×106to 3.5 ×107Pa, and E'(100°C)/E'(-15°C) is 2.0×10-3to 1.5 ×10-2, where E'(-15°C) is the storage modulus at -15°C and E'(100°C) is the storage modulus at 100°C when the elasticity characteristics of the UV-curable adhesive resin material are measured by procedures (i) and (ii). [Procedures] (i) A film having a thickness of 0.2 mm is formed using the UV-curable adhesive resin material, and the film is UV-cured by irradiation with ultraviolet rays having a dominant wavelength of 365 nm at an irradiation intensity of 100 W/cm2and an ultraviolet quantity of 1080 mJ/cm2 using a high-pressure mercury lamp. (ii) The dynamic viscoelasticity of the cured film is measured at a frequency of 1 Hz in tensile mode at a temperate in the range of -50-200°C.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
A method for producing an electronic device, the method comprising at least: a step (A) for preparing a structure that is provided with a wafer having a circuit formation surface and an adhesive film that is bonded to the circuit formation surface side of the wafer; a step (B) for back-grinding a surface of the wafer, the surface being on the reverse side from the circuit formation surface; and a step (C) for irradiating the adhesive film with ultraviolet light, and subsequently removing the adhesive film from the wafer. With respect to this method for producing an electronic device, the adhesive film comprises a base material layer, and an adhesive resin layer which is formed of an ultraviolet curable adhesive resin material on one surface of the base material layer; with respect to the step (C), the storage elastic modulus at 5°C (E'(5°C)) of the adhesive resin layer of the adhesive film after irradiation of ultraviolet light is 2.0 × 106Pa to 2.0 × 109Pa, and the storage elastic modulus at 100°C (E'(100°C)) thereof is 1.0 × 106Pa to 3.0 × 107 Pa, as determined under the conditions described below. (Conditions) The dynamic viscoelasticity is measured at a frequency of 1 Hz in a tensile mode over a temperature range from -50°C to 200°.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
28.
ADHESIVE FILM FOR BACKGRINDING AND PRODUCTION METHOD FOR ELECTRONIC DEVICE
An adhesive film that is for backgrinding and that is used to protect a surface of a wafer, the film comprising: a base layer; and an adhesive resin layer that is provided on one surface of the base layer and that is made of a UV curable adhesive resin material, wherein, when viscoelasticity characteristics of the UV curable adhesive resin material is measured after the UV curable adhesive resin material is cured by irradiation with UV, the storage modulus E' (5°C) is 2.0×106to 2.0×109Pa at 5°C, and the storage modulus E' (100°C) is 1.0×106to 3.0×107 Pa at 100°C.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
29.
ADHESIVE RESIN FILM AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
This adhesive resin film is provided with a base material layer, a concavo-convex absorptive resin layer, and an adhesive resin layer in this order, and is used to protect a circuit forming surface of an electronic component. The concavo-convex absorptive resin layer has a minimum value G'bmin of a storage elastic modulus G'b of 0.001 MPa or more and less than 0.1 MPa at 25°C or more and less than 250°C and has a storage elastic modulus G'b250 of 0.005 MPa to 0.3 MPa, inclusive, at 250°C.
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
21211 between the support (A) and the adhesive layer (B), measured while the angles formed between the mutually separated layers are maintained at 10°, is 1.1 or more.
21122 between the adhesive layer (B)/the workpiece (C) is at least 1.1, the 10° peel strength being measured by maintaining the angle formed between the peeled layers at 10°.
The purpose of the present invention is to provide a component manufacturing method of high assessment efficiency, and a component manufacturing film and a component manufacturing tool that are for use in the component manufacturing method. This method comprises: a step for arranging a plurality of electronic components on a support having a substrate and a holding layer with electrodes of the electronic components exposed via the holding layer; and a step for simultaneously performing energization assessment for electrical characteristics of 80 or more of the electronic components arranged on the support by bringing a probe into contact with all or some of the exposed electrodes. The component manufacturing film comprises a resin base layer, a holding layer provided to one surface side of the resin base layer, and a joint layer provided to the opposite surface side of the resin base layer so as to join the component manufacturing film to the substrate. The component manufacturing tool comprises a substrate and a holding layer provided to one surface of the substrate.
H01L 21/66 - Testing or measuring during manufacture or treatment
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
G01R 31/26 - Testing of individual semiconductor devices
33.
REAR SURFACE GRINDING METHOD FOR WAFER AND ELECTRONIC DEVICE PRODUCTION METHOD
The present invention addresses the problem of providing a rear surface grinding method for a wafer, in which the rear surface of a wafer is ground such that the impact of recesses and protrusions on the front surface of the wafer can be suppressed and in which handling after wafer thinning is improved. The present problem is solved by a rear surface grinding method for a wafer having recesses and protrusions on the front surface thereof, the rear surface grinding method for a wafer being characterized by comprising, prior to rear surface grinding of the wafer, a step (1) for forming a protective layer on the front surface of the wafer, a step (2) for flattening the surface of the protective layer that is not in contact with the wafer, and a step (3) for adhering a support to the surface of the protective layer that is not in contact with the wafer, with an adhesive layer therebetween.
B23D 5/02 - Planing or slotting machines cutting otherwise than by relative movement of the tool and workpiece in a straight line involving rotary and straight-line movements only, e.g. for cutting helical grooves
B24B 7/04 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfacesAccessories therefor involving a rotary work-table
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
The present invention addresses the problem of blending an antibacterial and antiviral component, which contains stearyl diethanolamine, in a resin molded body with high uniformity and stability exceeding the limits of prior arts. The problem is solved by the resin molded body containing a polymer resin, stearyl diethanolamine and palmityl diethanolamine, wherein the content of the palmityl diethanolamine is 2-25 parts by mass with respect to 100 parts by mass of the total amount of the stearyl diethanolamine and the palmityl diethanolamine, and the polymer resin contains polyolefin or polyamide.
C08L 23/00 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondCompositions of derivatives of such polymers
C08L 77/00 - Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chainCompositions of derivatives of such polymers
The present invention provides a multilayer film which has a thermally fusible layer, and which exhibits: high impact resistance that is suitable for cover materials for plastic containers or the like; excellently easy openability if combined with an adherend such as a plastic container; and the like. The above are achieved by means of a multilayer film which comprises a thermally fusible layer, an intermediate layer and a laminate layer, wherein a specific amount of a low-density polyethylene that is derived from biomass is contained in a specific layer.
The present invention provides polyethylene-based multilayer films which are suitable for use for packaging bags and the like, and specifically provides: a multilayer film which exhibits excellent tearability, while maintaining excellent characteristics such as mechanical strength and blocking resistance; a multilayer film which has further improved mechanical strength such as Young's modulus, while maintaining excellent characteristics such as blocking resistance; and a multilayer film which exhibits excellent blocking resistance and excellent lamination strength with respect to an outer film, while maintaining excellent characteristics such as sealing strength and impact resistance. The above are achieved by means of a multilayer film which comprises (A) a thermally fusible layer, (B) an intermediate layer and (C) a laminate layer, said layers respectively containing a petroleum-derived linear low density polyethylene, wherein at least one of (A) the thermally fusible layer, (B) the intermediate layer and (C) the laminate layer contains a plant-derived biomass polyethylene.
The present invention addresses the problem of providing high-impact strength laminated film and sheet that have high visible light transparency and that are colorable quite freely, using highly oriented polyolefin film and sheet. The problem is solved by laminated film and sheet that are each provided with an orientated layer A comprising a polyolefin resin and having the degree of orientation of 30% or more in the direction of the principal orientation axis, and an orientated layer B comprising a polyolefin resin and having the degree of orientation of 30% or more in the direction of the principal orientation axis. The laminated film and sheet each have a visible light transmittance of 1.5% or more. An angle formed by the principal orientation axis of the orientated layer A and the principal orientation axis of the orientated layer B is 20-160°.
B29C 65/06 - Joining of preformed partsApparatus therefor by heating, with or without pressure using friction, e.g. spin welding
B29C 65/08 - Joining of preformed partsApparatus therefor by heating, with or without pressure using ultrasonic vibrations
B29C 65/20 - Joining of preformed partsApparatus therefor by heating, with or without pressure using heated tool with direct contact, e.g. using "mirror"
B32B 7/03 - Layered products characterised by the relation between layers Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties Layered products characterised by the interconnection of layers with respect to the orientation of features
A method for producing an electronic device comprising at least: a step (A) for preparing a structure (100) which is provided with an electronic component (30) that has a circuit formation surface (30A), and an adhesive film (50) that is bonded to the circuit formation surface (30A) side of the electronic component (30); a step (B) for back grinding the surface of the electronic component (30) on the reverse side of the circuit formation surface (30A); and a step (C) for removing the adhesive film (50) from the electronic component (30) after irradiating the adhesive film (50) with UV rays. The adhesive film (50) comprises a base material layer (10) and a UV curable adhesive resin layer (20) that is provided on one surface of the base material layer (10), and the 60° peel strength of the adhesive film (50) in step (C), as measured using the following method, after being irradiated with UV rays is 0.4N/25mm to 5.0N/25mm, inclusive. (Method) A tensile testing machine is used to peel the adhesive film (50), which has been irradiated with UV rays, from the electronic component (30) at 23°C and a speed of 150 mm/min in a 60° direction, and the strength (N/25mm) at that time serves as the 60° peel strength.
C09J 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
An adhesive film (50) that is for back grinding, is used for protecting the surface of an electronic component (30), and comprises a base material layer (10) and a UV ray curable adhesive resin layer (20) provided on one surface of the base material layer (10), wherein the 60° peel strength of the adhesive film (50), as measured using the following method, after being irradiated with UV rays is 0.4N/25mm to 5.0N/25mm, inclusive. (Method) The adhesive film (50) is affixed to a silicon mirror wafer so that the adhesive resin layer (20) is in contact with the silicon mirror wafer. Subsequently, a high-pressure mercury lamp is used to irradiate the adhesive film (50) in an environment of 25°C with UV rays having a main wavelength of 365nm at an irradiation intensity of 100 mW/cm2and a UV ray amount of 1,080 mJ/cm2, thereby UV curing the adhesive resin layer (20). Then, a tensile testing machine is used to peel the adhesive film (50) from the silicon mirror wafer at 23°C and a speed of 150 mm/min in a 60° direction, and the strength (N/25mm) at that time serves as the 60° peel strength.
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
A method for producing an electronic device comprising at least: a step (A) for preparing a structure (100) which is provided with an electronic component (30) that has a circuit formation surface (30A), and an adhesive film (50) that is bonded to the circuit formation surface (30A) side of the electronic component (30); a step (B) for back grinding the surface of the electronic component (30) on the reverse side of the circuit formation surface (30A); and a step (C) for removing the adhesive film (50) from the electronic component (30) after irradiating the adhesive film (50) with UV rays. The adhesive film (50) comprises a base material layer (10) and a UV curable adhesive resin layer (20) that is provided on one surface of the base material layer (10), and the 60° peel strength of the adhesive film (50), as measured using the following method, after being irradiated with UV rays is 0.4N/25mm to 5.0N/25mm, inclusive. (Method) The adhesive film (50) is affixed to a silicon mirror wafer so that the adhesive resin layer (20) is in contact with the silicon mirror wafer. Subsequently, a high-pressure mercury lamp is used to irradiate the adhesive resin layer (20) in an environment of 25°C with UV rays having a main wavelength of 365nm at an irradiation intensity of 100 mW/cm2and a UV ray amount of 1,080 mJ/cm2, thereby UV curing the adhesive resin layer (20). Then, a tensile testing machine is used to peel the adhesive film (50) from the silicon mirror wafer at 23°C and a speed of 150 mm/min in a 60° direction, and the strength (N/25mm) at that time serves as the 60° peel strength.
C09J 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
The present invention provides: a protective film which is capable of suppressing the occurrence of an adsorption failure; and a back grinding method for a semiconductor wafer. This protective film 30 protects a surface 11, on which a circuit has been formed, of a semiconductor wafer 10 when a back surface 12 of the semiconductor wafer 10 is ground, while having the surface 11 adsorbed onto a fixture 41. The protective film 30 comprises an adhesive layer 33, a base material layer 31 and an auxiliary layer 32. The adhesive layer 33 is bonded to the semiconductor wafer 10, while the auxiliary layer 32 comes into contact with the fixture 41. The semiconductor wafer 10 has a level difference 13 in the outer peripheral edge of the surface 11 on which circuit has been formed.
B24B 7/22 - Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfacesAccessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
B24B 41/06 - Work supports, e.g. adjustable steadies
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
A method for producing an electronic device comprising at least: a step (A) for preparing a structure (100) which is provided with an electronic component (30) that has a circuit formation surface (30A) and an adhesive film (50) that is bonded to the circuit formation surface (30A) of the electronic component (30); a step (B) for back grinding a surface of the electronic component (30), said surface being on the reverse side of the circuit formation surface (30A); and a step (C) for removing the adhesive film (50) from the electronic component (30) after irradiating the adhesive film (50) with ultraviolet light. With respect to this method for producing an electronic device, the adhesive film (50) comprises a base material layer (10) and an ultraviolet curable adhesive resin layer (20) that is provided on one surface of the base material layer (10), and the elongation at break of the adhesive resin layer (20) after being irradiated with ultraviolet light with the ultraviolet dose of 1,080 mJ/cm2 is from 20% to 200%.
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
B23K 26/53 - Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 7/10 - Adhesives in the form of films or foils without carriers
A method for producing an electronic device comprising at least: a step (A) for preparing a structure (100) which is provided with an electronic component (30) that has a circuit formation surface (30A) and an adhesive film (50) that is bonded to the circuit formation surface (30A) of the electronic component (30); a step (B) for back grinding a surface of the electronic component (30), said surface being on the reverse side of the circuit formation surface (30A); and a step (C) for removing the adhesive film (50) from the electronic component (30) after irradiating the adhesive film (50) with ultraviolet light. With respect to this method for producing an electronic device, the adhesive film (50) comprises a base material layer (10) and an ultraviolet curable adhesive resin layer (20) that is provided on one surface of the base material layer (10), and the elongation at break of the adhesive resin layer (20) after being irradiated with ultraviolet light in the step (C) is from 20% to 200%.
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
B23K 26/53 - Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
Provided is an adhesive laminated film (50) used to protect circuit-forming surfaces of electronic components, the adhesive laminated film (50) comprising a base layer (20), a concave-convex absorbent resin layer (30), and an adhesive resin layer (40) in this order, wherein the concave-convex absorbent resin layer (30) contains an ethylene-based copolymer having a melting point of 40-80°C and a crosslinking agent, and the content of the crosslinking agent in the concave-convex absorbent resin layer (30) is 0.06-0.60 parts by mass with respect to 100 parts by mass of the ethylene-based copolymer.
A back-grinding adhesive film (50) is used for protecting the surface of an electronic component (30) and comprises a substrate layer (10) and an ultraviolet-ray curable adhesive resin layer (20) that is disposed on one surface of the substrate layer (10). The back-grinding adhesive film (50) is configured so that the elongation-to-break of the adhesive resin layer (20) after ultraviolet-ray curing is 20-200%.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
A method for producing an electronic device, said method comprising at least: a preparation step for preparing a structure (100) which is provided with a base material layer (10), an adhesive film (50) that comprises an adhesive resin layer (A) which is provided on a first surface (10A) side of the base material layer (10) for the purpose of provisionally affixing an electronic component (70), an adhesive resin layer (B) which is provided on a second surface (10B) side of the base material layer (10), and a relief absorbing resin layer (C) which is provided between the base material layer (10) and the adhesive resin layer (A) or between the base material layer (10) and the adhesive resin layer (B), while being able to be crosslinked by means of an external stimulus, and an electronic component (70) that is bonded to the adhesive resin layer (A) of the adhesive film (50), while having a relief structure (75); a crosslinking step for crosslinking the relief absorbing resin layer (C) in the structure (100) by applying an external stimulus to the relief absorbing resin layer (C); and a sealing step for sealing the electronic component (70) by means of a sealing material (60).
The present invention provides: a solar cell sealing material sheet which is mainly composed of a polyolefin resin, and which enables a solar cell module that uses this solar cell sealing material sheet to be effectively suppressed in the formation of air bubbles or bulges at high temperatures; and a method for producing this solar cell sealing material sheet. The above are achieved by means of a method for producing a solar cell sealing material sheet, said method comprising: a step wherein crosslinkable resin pellets are produced by impregnating pellets, which are mainly composed of a polyolefin resin, with a crosslinking agent and a crosslinking assistant; a step wherein the crosslinkable resin pellets are fed into a cylinder through a supply port of an extrusion molding machine, and a resin composition containing the polyolefin resin, the crosslinking agent and the crosslinking assistant is melted and kneaded in the cylinder; and a step wherein the resin composition is extrusion molded into a sheet through a die of the extrusion molding machine. With respect to this method for producing a solar cell sealing material sheet, the crosslinking agent contains a compound that has two or more alkylperoxy groups represented by formula (1) in the structure; and the crosslinking assistant contains triallyl isocyanurate. (1): R1-OO- (In the formula, R1 represents an alkyl group having from 1 to 6 carbon atoms.)
C08L 23/00 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondCompositions of derivatives of such polymers
The present invention provides a multilayer mold release film which has excellent physical properties such as breaking resistance, followability, mold releasability, lateral surface biting prevention and cushioning layer bleeding suppression. The above are achieved by means of a multilayer mold release film that is obtained by irradiating a multilayer film, which comprises a mold release layer A containing a non-crosslinkable resin and a radical scavenger and a resin layer B containing an ethylene polymer, with an electron beam, thereby crosslinking the resin layer B, wherein the contact angle with water of the mold release layer A after the electron beam irradiation is from 90° to 130°.
Provided is a release film that is used in the joining of electronic components through thermal compression bonding, wherein: the release film is provided with a heat-resistant resin layer (A) and a release layer (B) that contains a fluorine-based resin and that is disposed on one surface of the heat-resistant resin layer (A); the thickness of the heat-resistant resin layer (A) is less than 25μm; the thickness of the release layer (B) is 5μm or less; and the thickness of the release film is less than 25μm.
H01L 21/603 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of pressure, e.g. thermo-compression bonding
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
51.
SUCTIONING ASSISTANCE FILM AND METHOD FOR SUCTIONING SEMICONDUCTOR WAFER
The present invention addresses the problem of providing: a suctioning assistance film capable of suppressing the occurrence of a suctioning failure; and a method for suctioning a semiconductor wafer. As the solution to the problem, a suctioning assistance film 30 interposed between a fixture 41 and a semiconductor wafer 10 when a non-polished surface 11, on which the circuit of the semiconductor wafer 10 is formed, is suctioned to the fixture 41, has: a base material layer 31 adhered to the non-polished surface 11 side on which the circuit is formed; and an assistance layer 32 that is brought into contact with the fixture 41 in a state of being supported by the base material layer 31 and assists the suctioning.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
C09J 7/25 - PlasticsMetallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
Provided is a release film that is used in joining electronic components that have a non-conductive adhesive film therebetween by means of heating and pressing, said release film comprising a metal layer (A), and a release layer (B) that is disposed on one surface of the metal layer (A) and contains a fluororesin.
B32B 15/082 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising vinyl resinsLayered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising acrylic resins
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
H01L 21/603 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of pressure, e.g. thermo-compression bonding
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
Provided is a method for producing an electronic device, comprising: a preparation step (A) for preparing a structure (60) which is provided with an electronic part (10) having a circuit formation surface (10A) and an adhesive laminated film (50) having, in this order, a base material layer (20) that includes one polyester-based resin layer, an unevenness absorption resin layer (30) that is ultraviolet-curable, and an adhesive resin layer (40), and in which the adhesive laminated film (50) is affixed to the circuit formation surface (10A) of the electronic part (10) so as to protect the circuit formation surface (10A); an ultraviolet curing step (B) for irradiating the adhesive laminated film (50) with ultraviolet rays so as to cure the unevenness absorption resin layer (30) of the adhesive laminated film (50); and a surface treatment step (C) for treating, under vacuum and with application of heat, the surface of the electronic part (10) on the opposite side from the circuit formation surface (10A).
C08J 3/28 - Treatment by wave energy or particle radiation
C09J 201/02 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
This gas barrier film is constituted from a cured product of a mixture containing a polycarboxylic acid, a polyamine compound and a polyvalent metal compound. In an infrared absorption spectrum of the gas barrier film, if A denotes the total peak area within an absorption band of 1493 cm-1- 1780 cm-1, B denotes the total peak area within an absorption band of 1598 cm-1- 1690 cm-1, C denotes the total peak area within an absorption band of 1690 cm-1- 1780 cm-1and D denotes the total peak area within an absorption band of 1493 cm-1- 1598 cm-1, the amide bond area ratio represented by B/A is 0.380 or less, the carboxylic acid area ratio represented by C/A is 0.150 or less, and the carboxylate area ratio represented by D/A is 0.520 or more.
B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
B05D 5/00 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
B05D 7/00 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
B05D 7/24 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
C09D 133/02 - Homopolymers or copolymers of acidsMetal or ammonium salts thereof
C09D 177/00 - Coating compositions based on polyamides obtained by reactions forming a carboxylic amide link in the main chainCoating compositions based on derivatives of such polymers
Provided is a packaging body (10) composed of a packaging film, wherein the outermost layer of the packaging body is a polyethylene-based resin layer, and the polyethylene-based resin layer is stretched uniaxially or biaxially.
A method for producing an electronic device, which comprises at least: a step (1) for preparing a structure (100) that is provided with an adhesive film (50), which comprises a base material layer (10), an adhesive resin layer (A) provided on a first surface (10A) side of the base material layer (10), and an adhesive resin layer (B) provided on a second surface (10B) side of the base material layer (10) and having an adhesive force that decreases by external stimuli, wherein the storage elastic modulus E' of the adhesive resin layer (A) at 125°C is from 0.2 × 106Pa to 4.5 × 106 Pa (inclusive), an electronic component (70) which is bonded to the adhesive resin layer (A) of the adhesive film (50), and a supporting substrate (80) which is bonded to the adhesive resin layer (B) of the adhesive film (50); a step (2) for sealing the electronic component (70) by means of a sealing material (60); a step (3) for separating the supporting substrate (80) from the structure (100) by decreasing the adhesive force of the adhesive resin layer (B) by applying external stimuli thereto; and a step (4) for separating the adhesive film (50) from the electronic component (70).
C09J 5/06 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
C09J 7/24 - PlasticsMetallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
C09J 7/25 - PlasticsMetallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
A packaging film equipped with a base material layer including polyethylene and a coating layer including a resin provided in contact with one side of the base material layer or provided via an anchor coating layer. An embodiment in which the value of Tgc is from -25 to 120°C and the value of Tgc-Tgs is from 90 to 245°C, taking the glass transition temperature of the coating layer to be Tgc and the glass transition temperature of the base material layer to be Tgs, can be given as one preferred embodiment of this packaging film.
B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
B05D 3/02 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
B05D 7/04 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber to surfaces of films or sheets
B32B 3/30 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
This electronic apparatus production method comprises: a preparatory step (A) for preparing a structure (60) provided with an electronic component (10) which has a circuit-forming surface (10A), a pressure-sensitive laminate film (50) which has, in this sequence, a substrate layer (20), an unevenness-absorbing resin layer (30), and a pressure-sensitive resin layer (40) and which is bonded to the circuit-forming surface (10A) side of the electronic component (10), and a thermosetting protective film (70) which is bonded to a surface (10C) on the side opposite to the circuit-forming surface (10A) of the electronic component (10); and a thermal curing step (B) for thermally curing the thermosetting protective film (70) by heating the structure (60).
The present invention is a method for manufacturing an adhesive film (50) comprising: a substrate layer (10); and an adhesive resin layer (A) which is provided on a first surface (10A) of the substrate layer (10) and which includes thermally expandable fine microspheres. This method includes: a storing step in which the thermally expandable microspheres are stored in an environment where the temperature is 20°C or less and the humidity is 40%RH or less; and a step performed after the storing step, in which the adhesive resin layer (A) containing the thermally expandable microspheres is formed on the first surface (10A) of the substrate layer (10).
Provided are: a mold releasing film for a printed wiring board manufacturing process that has followability, crease resistance, and releasability at a high level; and a printed board manufacturing method that has releasability, prevention of outflow of adhesive, and prevention of occurrence of wrinkles in a mold releasing film at a high level. The above problem is solved by a mold releasing film for a printed wiring board manufacturing process that includes at least a mold releasing layer (A) and an intermediate layer (B), the mold releasing film characterized in that the mold releasing layer (A) has a thickness of 15 μm or less, and the intermediate layer (B) has a modulus of elasticity of tension of 11 MPa or more at 180°C, and a printed board manufacturing method using the mold releasing film for a process.
The present invention addresses the problem of providing an affixing device capable of planarizing the surface of a film 20 affixed to a major surface 10A of a plate-like body 10. An affixing device 30 for affixing a film 20 onto a plate-like body 10 is provided with: a plate-like mounting member 31 having a mounting portion 31A for mounting the plate-like body 10; a plate-like pressing member 32 installed in a position opposing the mounting member 31; and a support member 33 which is installed on an outer edge of the mounting portion 31A so as to be positioned between the mounting member 31 and the pressing member 32.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
Provided are a protection film affixing method, a semiconductor component manufacturing method, and a protection film used for an affixing method with which make it possible to suppress generation of troubles caused by a height difference in a main surface of a semiconductor wafer. The affixing method comprises an arranging step for arranging a protection film 20 so as to cover a main surface 10A of a semiconductor wafer 10, and an affixing step for affixing the protection film 20 by pressing the protection film 20 onto the main surface 10A. The main surface 10A includes a first region 12 in which bumps 11 are provided, and a second region 13 which includes at least a part of a periphery of the main surface 10A and in which the bumps 11 are not provided. The affixing step includes a compressing step for compressing the protection film 20 in a thickness direction thereof. The compressing step is performed using a pressing member 32 for pressing the protection film 20 onto the main surface 10A, and a support member 33 installed along an outer periphery of the second region 13.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
This electronic device production method at least comprises a preparation step for preparing a structure (100), and a sealing step for sealing an electronic component (70) using a sealing material (60). The structure (100) includes: an adhesive film (50) including a base material layer (10), an adhesive resin layer (A) that is provided to a first surface (10A) side of the base material layer (10) and used for provisionally immobilizing the electronic component (70), an adhesive resin layer (B) that is provided to a second surface (10B) side of the base material layer (10) and loses adhesiveness due to external stimulation, and an absorbent relief resin layer (C) that is provided between the base material layer (10) and the adhesive resin layer (A) or between the base material layer (10) and the adhesive resin layer (B); the electronic component (70) joined to the adhesive resin layer (A) of the adhesive film (50) and having a relief structure (75); and a support substrate (80) joined to the adhesive resin layer (B) of the adhesive film (50).
H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
C09J 123/00 - Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondAdhesives based on derivatives of such polymers
C09J 125/04 - Homopolymers or copolymers of styrene
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
An electronic device manufacturing method comprising at least: a preparation step for preparing a structure (100) comprising an adhesive film (50) that is provided with a base layer (10), an adhesive resin layer (A) provided to a first surface (10A) side of the base layer (10) and for temporarily fixing an electronic component (70), and an adhesive resin layer (B) provided to a second surface (10B) side of the base layer (10) and having an adhesive force that decreases in response to an external stimulus, the electronic component (70) that is adhered to the adhesive resin layer (A) of the adhesive film (50), and a support substrate (80) that is adhered to the adhesive resin layer (B) of the adhesive film (50); a prebake step for heating the structure (100); and a sealing step for sealing the electronic component (70) by means of a sealing material (60).
H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
C09J 123/00 - Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondAdhesives based on derivatives of such polymers
C09J 125/04 - Homopolymers or copolymers of styrene
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
Provided is a gas barrier polymer provided by thermosetting a mixture comprising a polycarboxylic acid and a polyamine compound. With reference to the infrared absorption spectrum of the gas barrier polymer, the gas barrier polymer has an R, defined by formula (1), of greater than 1, wherein, using the straight line that connects the measurement point at 1493 cm-1with the measurement point at 1780 cm-1as the base line, I(1660) is the absorption intensity at 1660 cm-1and I(1625) is the absorption intensity at 1625 cm-1. R = I(1660)/I(1625) - {-0.65 × (total amine/COOH) + 0.4225} (1)
C08G 69/26 - Polyamides derived from amino carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
68.
ADHESIVE FILM AND ELECTRONIC DEVICE PRODUCTION METHOD
An adhesive film (50) comprising a base material layer (10), an adhesive resin layer (A) provided on a first surface (10A) side of the base material layer (10), and an adhesive resin layer (B) provided on a second surface (10B) side of the base material layer (10) and having an adhesive force which decreases under external stimulus, wherein as measured in accordance to JIS C2151 under the heating conditions of 150°C for 30 minutes, the adhesive film has a contraction rate of between 0.0% and 0.40% inclusive in the direction in which the thermal contraction of the adhesive film (50) is greatest.
C09J 7/25 - PlasticsMetallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
C09J 11/00 - Features of adhesives not provided for in group , e.g. additives
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
A method for manufacturing an electronic device according to the present invention includes in the following order: a step (A) for preparing a structure (60) including a half-diced electronic component (10) having a circuit forming surface (10A), and an adhesive laminate film (50) which has a base layer and an adhesive resin layer (40), the adhesive resin layer (40) side adhered on the circuit forming surface (10A) of the electronic component (10) so as to protect the circuit forming surface (10A); a step (B) for back-grinding the opposite surface to the circuit forming surface (10A) of the electronic component (10); a step (C) for performing a full-dicing on the electronic component (10); and a step (D) for forming an electromagnetic wave shielding layer (70) on the segmented pieces of the electronic component (10), wherein, in the step (A), the step (B), the step (C), and the step (D), the same adhesive laminate film is used as the adhesive laminate film (50).
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
70.
ADHESIVE FILM AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
This adhesive film (50) is used for provisionally securing an electronic component when sealing the electronic component with a sealant in a manufacturing step for an electronic device, the film comprising: an adhesive resin layer (A) for provisionally securing the electronic component; an adhesive resin layer (B) used for affixing to a support substrate and having an adhesive force decreased by external stimulation; and an intermediate layer (C) disposed between the adhesive resin layer (A) and the adhesive resin layer (B). The storage elastic modulus E' of the intermediate layer (C) at 120°C is at least 1.0 × 105Pa and no more than 8.0 × 106 Pa, and the loss tangent (tanδ) of the intermediate layer (C) at 120°C is no more than 0.1.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
Provided is a release film that is used to connect electronic components by thermocompression bonding, the release film including a heat resistant resin layer (A), and a release layer (B) disposed on one surface of the heat resistant resin layer (A), wherein the release layer (B) has a thickness of 5 μm or less.
The pressure-sensitive adhesive film (100) of the present invention is for use in processing an electronic component, and comprises a base layer (10), an irregularity-absorbing resin layer (20), and a pressure-sensitive adhesive resin layer (30) in this order, wherein the irregularity-absorbing resin layer (20) includes a thermoplastic resin and has a melting point (Tm), as measured with a differential scanning calorimeter (DSC), in the range of 10-50°C. The electronic component has a circuit formation surface, and the pressure-sensitive adhesive film is used for grinding the surface of the electronic component on the reverse side from the circuit formation surface so that the thickness of the electronic component is reduced to 250 μm or less.
2.5) 2.5) of the tack force of the adhesive resin layer (B) measured with method 1 described below at a test speed of 2.5 mm/m and a test temperature of 130°C is greater than or equal to 1.0 gf/s, and the integral value (F30) of the tack force of the adhesive resin layer (B) at a test speed of 30 mm/m and a test temperature of 130°C is greater than or equal to 7.0 gf/s. (Method 1) A tack tester is used to press a probe for 60 seconds onto the adhesive resin layer (B) under the conditions of a probe load of 100 gf and a probe pressing speed of 120 mm/m, thereafter the tack strength (gf) is measured at a test temperature of 130°C at test speeds 2.5 mm/m and 30 mm/m; with the measurement time on the horizontal axis and the tack strength (gf) on the vertical axis, the integral values are computed from the point when the tack strength begins to rise from 0 until the point when the tack force returns to 0, and are set as F2.5 and F30.
This method involves at least: a step (1) for preparing a structure (100) provided with an adhesive film (50), which comprises a substrate layer (10), an adhesive resin layer (A) provided on a first side (10A) of the substrate layer (10) and for temporarily fixing an electronic component (70), and an adhesive resin layer (B) provided on the second side (10B) of the substrate layer (10) and which has an adhesive force that decreases with external stimulation, the electronic component (70), which is adhered to the adhesive resin layer (A) of the adhesive film (50), and a support substrate (80), which is adhered to the adhesive resin layer (B) of the adhesive film (50); at least one step (2) selected from a step (2-1) for lowering the water content in the adhesive film (50) and a step (2-2) for lowering the water content in the structure (100); and a step (3) for sealing the electronic component (70) with a sealing material (60).
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers
75.
ADHESIVE FILM AND ELECTRONIC DEVICE MANUFACTURING METHOD
This adhesive film (50) is provided with a substrate layer (10), an adhesive resin layer (A) which is provided on a first side (10A) of the substrate layer (10), and an adhesive resin layer (B) which is provided on the second side (10B) of the substrate layer (10) and which has an adhesive force that decreases with external stimulation. The adhesive resin layer (B) side is attached to a stainless steel plate and then a microscope slide is placed on and adhered to the adhesive resin layer (A); thereafter, heat treatment is performed at 130°C for 30 minutes, and then, in a vacuum oven, when the pressure in the vacuum oven has been reduced at 125°C at an evacuation speed of 120L/min, no lifting of the adhesive film (50) from the stainless steel plate is observed before the pressure inside of the vacuum oven has reached 100 Pa.
C09J 11/00 - Features of adhesives not provided for in group , e.g. additives
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
76.
COMPONENT PRODUCING METHOD, HOLDING FILM, AND HOLDING TOOL FORMING DEVICE
E1E1E1≤1, and E'(25) is 35-1500 MPa. The holding tool forming device is provided with: a mechanism for forming an extended state by pushing a material film from a base layer side; a mechanism for fixing the material film to a frame body such that the extended state is maintained; and a mechanism for obtaining a holding film by cutting off an unnecessary portion from the material film.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
77.
SEALING MATERIAL FOR SOLAR CELLS AND SOLAR CELL MODULE
Provided is an antibacterial material comprising: a base material; and a surface layer that is disposed on at least one surface of the base material, and that includes a molecule A having a weight average molecular weight of 500-10000 and having at least one structure selected from the group consisting of structures derived from guanidine, structures derived from glucosamine, and structures derived from amino acids, and a cationic or nonionic component B comprising a compound other than the molecule A, wherein the weight of the molecule A per unit area on the surface layer is 0.2 mg/m2-300 mg/m2.
A01N 63/00 - Biocides, pest repellants or attractants, or plant growth regulators containing microorganisms, viruses, microbial fungi, animals or substances produced by, or obtained from, microorganisms, viruses, microbial fungi or animals, e.g. enzymes or fermentates
A01N 25/34 - Shaped forms, e.g. sheets, not provided for in any other group of this main group
B65D 65/42 - Applications of coated or impregnated materials
B65D 81/28 - Applications of food preservatives, fungicides, pesticides or animal repellants
B65D 85/50 - Containers, packaging elements or packages, specially adapted for particular articles or materials for living organisms, articles or materials sensitive to changes of environment or atmospheric conditions, e.g. land animals, birds, fish, water plants, non-aquatic plants, flower bulbs, cut flowers or foliage
79.
ANTIMICROBIAL MATERIAL AND FRESHNESS-RETAINING MATERIAL
An antimicrobial material provided with a base material and a surface part, said surface part comprising molecule A having a structure derived from guanidine and molecule B having a structure derived from at least one kind of molecule selected from the group consisting of glucosamine and lysine, wherein the surface part is in contact with at least a part of the base material and the ratio by mass of molecule A to molecule B (molecule A:molecule B) is from 8:2 to 4:6.
A01N 25/34 - Shaped forms, e.g. sheets, not provided for in any other group of this main group
A01N 37/44 - Biocides, pest repellants or attractants, or plant growth regulators containing organic compounds containing a carbon atom having three bonds to hetero atoms with at the most two bonds to halogen, e.g. carboxylic acids containing at least one carboxylic group or a thio-analogue, or a derivative thereof, and a nitrogen atom attached to the same carbon skeleton by a single or double bond, this nitrogen atom not being a member of a derivative or of a thio-analogue of a carboxylic group, e.g. amino-carboxylic acids
A01N 63/00 - Biocides, pest repellants or attractants, or plant growth regulators containing microorganisms, viruses, microbial fungi, animals or substances produced by, or obtained from, microorganisms, viruses, microbial fungi or animals, e.g. enzymes or fermentates
A01P 1/00 - DisinfectantsAntimicrobial compounds or mixtures thereof
A method for manufacturing an electronic device according to the present invention comprises: a step (A) for preparing a structure (60) provided with an electronic component (10) which has a circuit forming surface (10A), and an adhesive laminated film (50) which has a base material layer (20), an uneven absorptive resin layer (30), and an adhesive resin layer (40) in this order, with the adhesive resin layer (40) side being stuck to the circuit forming surface (10A) of the electronic component (10) so as to protect the circuit forming surface (10A); and a step (B) for forming an electromagnetic wave shield layer (70) with respect to the electronic component (10) in the state of being stuck to the adhesive laminated film (50).
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
H01L 23/00 - Details of semiconductor or other solid state devices
H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
A method for manufacturing an electronic device according to the present invention comprises, in the following order: a step (A) for preparing a structure (60) provided with an electronic component (10) which has a circuit forming surface (10A), and an adhesive laminated film (50) which has a base material layer (20) and an adhesive resin layer (40), with the adhesive resin layer (40) side being stuck to the circuit forming surface (10A) of the electronic component (10) so as to protect the circuit forming surface (10A); a step (B) for back-grinding a surface opposed to the circuit forming surface (10A) of the electronic component (10) in the state of being stuck to the adhesive laminated film (50); a step (C) for dicing the electronic component (10) in the state of being stuck to the adhesive laminated film (50); and a step (D) for forming an electronic wave shield layer (70) with respect to the diced electronic components (10) in the state of being stuck to the adhesive laminated film (50). In the steps (A), (B), (C), and (D), the same adhesive laminated film is used as the adhesive laminated film (50).
H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
82.
COMPONENT MANUFACTURING DEVICE AND COMPONENT MANUFACTURING METHOD
The purpose of the present invention is to provide a component manufacturing device and a component manufacturing method with which a component holding film can be correctly suction-attracted and fixed onto a chuck table while being heated. The component manufacturing device 1 is provided with: a suction-attracting/fixing means 20 which suction-attracts and fixes a component holding film onto a suction-attract surface 21a being heated; and a blocking means 30 which blocks a thermal convection generated on the suction-attract surface 21a from hitting the component holding film. The component manufacturing method comprises a setting step of suction-attracting and fixing a component holding film onto a suction-attract surface 21a being heated, wherein the setting step includes a blocking step of blocking a thermal convection generated on the suction-attract surface 21a from hitting the component holding film.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
83.
COMPONENT MANUFACTURING TOOL AND COMPONENT MANUFACTURING METHOD
The purpose of the present invention is to provide a component manufacturing tool and a component manufacturing method with which suction-attachment onto a chuck table can be achieved even under a heated environment. A component manufacturing tool 1 comprises a frame body 10 and a holding film 20 covering an opening portion 10h. The frame body 20 is provided with a first frame 11 and a second frame 12. The holding film 20 is provided with a base layer 21 and a holding layer 22 provided on one surface side, and is held in an extended state between the first frame 11 and the second frame 12. The base layer 21 is such that a ratio RE1(= E'(100)/E'(25)) of an elastic modulus E'(100°C) and an elastic modulus E'(25°C) is 0.2 ≤ RE1 ≤ 1, where E'(25) is not less than 35 MPa and not more than 3500 MPa. The component manufacturing method is provided with: a component holding step of holding a component onto the holding layer 22 of the component manufacturing tool 1; and a suction-attachment step in which a holding film being held is fixed by suction-attachment onto a surface of a heated chuck table.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
This adhesive laminated film (50) protects the surface of an indium tin oxide (ITO) film, wherein the adhesive laminated film (50) is provided with a base material layer (10) and an adhesive resin layer (20) provided on one surface of the base material layer (10), and the adhesive resin layer (20) includes structural units derived from (meth)acrylonitrile.
This adhesive laminated film (50) protects the surface of an indium tin oxide (ITO) film, wherein the adhesive laminated film (50) is provided with a base material layer (10) and an adhesive resin layer (20) provided on one surface of the base material layer (10). In addition, in this adhesive laminated film (50), the ratio P1/P0 is 1.0-25, where P0 [N/25 mm] is the peel strength between an ITO film vapor-deposited on a base material film and the adhesive resin layer (20), and P1 [N/25 mm] is the peel strength between the ITO film and the adhesive resin layer (20) after the adhesive laminated film (50) is affixed to the ITO film, which has been vapor-deposited on the base material film, so that the adhesive resin layer (20) is in contact with the ITO film, and then the resulting structure is heat-treated for 60 minutes at 150°C.
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
The present invention provides an adhesive laminated film (50) for protecting the surface of an indium tin oxide (ITO) film, said adhesive laminated film (50) comprising a base layer (10), and an adhesive resin layer (20) that is disposed on one surface of the base layer (10). In the adhesive laminated film (50) according to the present embodiment, a first peak, the peak top temperature of which is 0ºC or higher, is observed in a temperature dependent curve of the loss tangent (tanδ) of the adhesive resin layer (20) as obtained by a dynamic viscoelasticity measurement at a temperature rise rate of 5ºC/min and a frequency of 1 Hz.
This multilayer barrier film (100) is sequentially provided with a base material layer (101), a stress relaxation layer (102), an inorganic material layer (103) and a barrier resin layer (104) in this order. The barrier resin layer (104) contains an amide crosslinked product of a polycarboxylic acid and a polyamine; and the stress relaxation layer (102) contains a polyurethane resin that has an aromatic ring structure in the main chain.
Provided is an electretized film composed of a cyclic olefin-based polymer, wherein the electretized film is a non-porous film, and has a thickness direction piezoelectric constant d33 of 100 pC/N or greater as measured by applying a pressive force, under the conditions of a load of 0.5 N, a dynamic load of ±0.25N, a frequency of 110Hz, a temperature of 23˚C, and a humidity of 50%, in the thickness direction of the electretized film.
A foam body of the first invention of the present application is constituted of a 4-methyl-1-pentene-based polymer. The maximum loss tangent value (tanδ) of dynamic viscoelasticity of the foam body, which is obtained from the dynamic viscoelasticity measurement conducted under the condition of temperature increase rate of 4oC/min, frequency of 1.59 Hz, and distortion of 0.1% is reached at least at one temperature within the range of 10 to 100oC, and the maximum loss tangent value is 0.5 to 3.5. A polyolefin-based foam sheet of the second invention of the present application is constituted of a 4-methyl-1-pentene-based polymer. In hardness measurement conducted in accordance with JIS K6253 at 23oC, when Shore A hardness of at least one surface of the polyolefin-based foam sheet immediately after the measurement is HS0, and Shore A hardness in 15 seconds after the measurement is HS1, ΔHS, which is (HS0 – HS1), is 30 to 60. A complex of the third invention of the present application comprises a foam body constituted of a 4-methyl-1-pentene-based polymer, and a member that is bonded to the foam body and that is different from the foam body.
C08J 9/04 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent
90.
COMPONENT-MANUFACTURING FILM, COMPONENT-MANUFACTURING TOOL, AND COMPONENT-MANUFACTURING METHOD
The purpose of the present invention is to provide a component-manufacturing film, a component-manufacturing tool, and a component-manufacturing method with which reliable chucking to a chuck table is possible in a heated environment while providing versatility in which shared use in different steps is possible. To address the above: this film 1 has a first region S1 and a second region S2 disposed so as to surround the region S1; the region S1 is formed from a base layer 11 and an adhesive layer 12 provided on one surface side of the base layer 11; the region S2 is formed from the base layer 11, the adhesive layer 12, and an additional layer 13 affixed onto the layer 12. In the temperature range of 190°C or below, the tensile modulus of elasticity of the additional layer 13 is equal to or greater than the tensile modulus of elasticity of the base layer 11. The present method has a component fixing step, a film placement step for performing placement so that the boundary between the region S1 and the region S2 is located on the inner side of the edge of the chuck table, a chucking step, and a heating step.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
91.
ADHESIVE FILM, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
An adhesive film (50) according to the present invention can be used for temporally fixing an electronic component in the sealing of the electronic component with a sealing material in the process of manufacturing an electronic device, and is provided with a base layer (10), an adhesive resin layer (A) which is arranged on the first surface (10A) side of the base layer (10) and can temporally fix the electronic component, and an adhesive resin layer (B) which is arranged on the second surface (10B) side of the base layer (10) and can be decreased in an adhesion power upon the application of an external stimulation, wherein the adhesive resin layer (A) contains a polyhydric carboxylic acid ester-type plasticizer (X) and an adhesive resin (Y) and the content of the polyhydric carboxylic acid ester-type plasticizer (X) in the adhesive resin layer (A) is 0.7 to 50 parts by mass inclusive relative to 100 parts by mass of the adhesive resin (Y) contained in the adhesive resin layer (A).
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 201/00 - Adhesives based on unspecified macromolecular compounds
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
An antimicrobial material which comprises a surface part containing molecule A having a guanidine-derived structure, wherein the content of molecule A in the surface part is 0.2-300 mg/m2.
A01N 63/00 - Biocides, pest repellants or attractants, or plant growth regulators containing microorganisms, viruses, microbial fungi, animals or substances produced by, or obtained from, microorganisms, viruses, microbial fungi or animals, e.g. enzymes or fermentates
A01N 25/02 - Biocides, pest repellants or attractants, or plant growth regulators, characterised by their forms, or by their non-active ingredients or by their methods of applicationSubstances for reducing the noxious effect of the active ingredients to organisms other than pests containing liquids as carriers, diluents or solvents
This polypropylene foamed sheet (100) includes a polypropylene resin and an inorganic filler, the density of the polypropylene foamed sheet (100) being from 0.5 g/cm3 to 1.0 g/cm3. In addition, the relationship W1 ᡶ W2 is satisfied, where the total thickness of the polypropylene foamed sheet (100) is T [mm], and in the thickness direction of the polypropylene foamed sheet (100), the inorganic filler content with respect to the total amount of polypropylene resin and inorganic filler in a surface region (103) from the surface (101) to 0.1 T [mm] toward the center (102) is W1, and the inorganic filler content with respect to the total amount of polypropylene resin and inorganic filler in a center region (104) from the center (102) to ±0.1 T [mm] toward the surface (101) is W2.
C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
B32B 5/18 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer containing foamed or specifically porous material
This adhesive laminated film (50) has a heat-resistant resin layer (10), a flexible resin layer (20), and an adhesive resin layer (30), in the stated order. The peel strength P0 between the heat-resistant resin layer (10) and the flexible resin layer (20) measured by the following method in accordance with JIS Z0237 is from 0.01 N/25 mm to 2.0 N/25 mm, and the peel strength P1 between the heat-resistant resin layer (10) and the flexible resin layer (20) after the adhesive laminated film (50) has been heat treated for four hours at 160°C is from 0.05 N/25 mm to 1.5 N/25 mm. (Method for measuring peel strength) The adhesive laminated film (50) is affixed to a silicon wafer so that the adhesive resin layer (30) is in contact with the silicon wafer. Next, the heat-resistant resin layer (10) is peeled from the flexible resin layer (20) in a 180° direction at a tensile speed of 300 mm/min at 25°C using a tensile tester. The strength (N/25 mm) at that time is measured twice, and the average value is taken as the peel strength.
C09J 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
95.
SOLAR CELL REAR SURFACE SEALANT SHEET SET, SOLAR CELL MODULE AND METHOD FOR PRODUCING SOLAR CELL MODULE
This solar cell rear surface sealant sheet set is positioned between a solar cell element and a rear-side protective member, is used to seal the non-light-receiving side of the solar cell element, and is equipped with a transparent sealant sheet and a colored sealant sheet. The transparent sealant sheet contains at least one type of ethylene copolymer selected from an ethylene alpha-olefin copolymer and an ethylene polar monomer copolymer, and is positioned on the solar cell element side. The colored sealant sheet contains a coloring agent and at least one type of ethylene copolymer selected from an ethylene alpha-olefin copolymer and an ethylene polar monomer copolymer, and is positioned on the rear-side protective member side. When sealing the solar cell element, the transparent sealant sheet and the colored sealant sheet are used by being laminated to one another.
This solar cell rear-side sealant sheet set is positioned between a solar cell element and a rear-side protective member, is used to seal the non-light-receiving side of the solar cell element, and is equipped with a transparent sealant sheet and a colored sealant sheet. The transparent sealant sheet contains at least one type of ethylene copolymer selected from an ethylene alpha-olefin copolymer and an ethylene polar monomer copolymer. The colored sealant sheet contains a coloring agent and at least one type of ethylene copolymer selected from an ethylene alpha-olefin copolymer and an ethylene polar monomer copolymer. When used to seal the solar cell element, the transparent sealant sheet and the colored sealant sheet are used by being laminated to one another.
This electronic device production method includes: a step (A) for preparing a structure which is provided with an adhesive film and one or more electronic components attached to the adhesive surface of the film; a step (B) for placing the structure within an electronic component testing device equipped with a sample stage which has an electronic component placement region and a probe card which is provided in a position opposite the sample stage and which is provided with probe terminals, the structure being placed in the electronic component testing device such that the electronic component is positioned upon the electronic component placement region of the sample stage with the adhesive film therebetween; a step (C) for evaluating the properties of the electronic component by bringing the probe terminals into contact with the terminals of the electronic component while the electronic component is attached to the adhesive film; and a step (D) for thereafter picking up the electronic component from the adhesive film. Additionally, in at least step (C), the structure is placed within the border of a frame, the ends of the adhesive film are secured in the frame, and the top surface of the frame is disposed below the top surface of the electronic component placement region of the sample stage in the vertical direction of the sample stage.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
H01L 21/66 - Testing or measuring during manufacture or treatment
98.
ELECTRONIC DEVICE PRODUCTION METHOD, ADHESIVE FILM FOR ELECTRONIC DEVICE PRODUCTION, AND ELECTRONIC COMPONENT TESTING DEVICE
This electronic device production method includes: a step (A) for preparing a structure which is provided with an adhesive film and one or more electronic components attached to the adhesive surface of the film; a step (B) for placing the structure within an electronic component testing device equipped with a sample stage which has an electronic component placement region and a probe card which is provided in a position opposite the sample stage and which is provided with probe terminals, the structure being placed in the electronic component testing device such that the electronic component is positioned upon the electronic component placement region of the sample stage with the adhesive film therebetween; a step (C) for evaluating the properties of the electronic component by bringing the probe terminals into contact with the terminals of the electronic component while the electronic component is attached to the adhesive film; and a step (D) for thereafter picking up the electronic component from the adhesive film. Additionally, the sample stage is provided with a first vacuum suctioning means for vacuum suctioning the adhesive film in a region on the outer peripheral side that differs from the electronic component placement region, and in at least step (C), the region of the adhesive film to which the electronic component is not attached is vacuum suctioned by the first vacuum suctioning means.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
H01L 21/66 - Testing or measuring during manufacture or treatment
99.
POLYPROPYLENE-BASED RESIN COMPOSITION FOR FOAM MOLDING, POLYPROPYLENE-BASED FOAM MOLDED BODY, POLYPROPYLENE-BASED MULTILAYER FOAM MOLDED BODY, AND PRODUCTION METHOD FOR POLYPROPYLENE-BASED FOAM MOLDED BODY
This polypropylene-based resin composition for foam molding includes a polypropylene-based resin and an inorganic filler. The inorganic filler includes at least one type selected from talc or silica and the inorganic filler water content is no more than 0.10% by mass of the whole inorganic filler.
C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
B29C 47/00 - Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor (extrusion blow-moulding B29C 49/04)
This polypropylene-based foam sheet (100) includes a polypropylene-based resin and an inorganic filler. The inorganic filler includes at least one type selected from talc, mica, and silica. The inorganic filler content in the polypropylene-based foam sheet is 15–65 parts by mass relative to a total of 100 parts by mass of polypropylene-based resin and inorganic filler.
C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
B32B 5/18 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer containing foamed or specifically porous material
patents
