Abstract

A gas barrier film formed of a cured product of a mixture including a polycarboxylic acid, a polyamine compound, and a polyvalent metal compound, in which in an infrared absorption spectrum of the gas barrier film, an area ratio of an amide bond represented by B/A is equal to or less than 0.380, an area ratio of a carboxylic acid represented by C/A is equal to or less than 0.150, and an area ratio of carboxylate represented by D/A is equal to or more than 0.520.

IPC Classes  ?

• B32B 27/34 - Layered products essentially comprising synthetic resin comprising polyamides
• B05D 3/02 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
• B05D 3/04 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
• B05D 7/00 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
• B05D 7/24 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
• B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters
• B65D 65/42 - Applications of coated or impregnated materials
• C08G 69/26 - Polyamides derived from amino carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
• C08J 7/048 - Forming gas barrier coatings
• C08L 33/02 - Homopolymers or copolymers of acidsMetal or ammonium salts thereof
• C09D 7/61 - Additives non-macromolecular inorganic
• C09D 177/06 - Polyamides derived from polyamines and polycarboxylic acids
• C08K 3/22 - OxidesHydroxides of metals

Abstract

A packaging body configured with a packaging film, in which the outermost layer is a polyethylene-based resin layer and the polyethylene-based resin layer is uniaxially or biaxially stretched.

IPC Classes  ?

• B65D 75/00 - Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes or webs of flexible sheet material, e.g. in folded wrappers
• B32B 7/027 - Thermal properties
• B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
• B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
• B32B 27/32 - Layered products essentially comprising synthetic resin comprising polyolefins
• B32B 38/00 - Ancillary operations in connection with laminating processes

Abstract

A method for manufacturing an electronic device includes at least a step (1) of preparing a structure comprising (i) an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer, and an adhesive resin layer (B) provided on a second surface side of the base material layer, (ii) an electronic component attached to the adhesive resin layer (A) of the adhesive film, and (iii) a support substrate attached to the adhesive resin layer (B) of the adhesive film; a step (2) of sealing the electronic component with a sealing material; a step (3) of peeling the support substrate from the structure by reducing an adhesive force of the adhesive resin layer (B) by applying an external stimulus; and a step (4) of peeling the adhesive film from the electronic component.

IPC Classes  ?

• H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
• H01L 21/263 - Bombardment with wave or particle radiation with high-energy radiation

Abstract

Provided is a packaging film including: a substrate layer that includes polyethylene; and a coating layer that includes a resin and is provided in contact with one surface of the substrate layer or is provided over one surface of the substrate layer through an anchor coat layer. In one preferable aspect of the packaging film, when a glass transition temperature of the coating layer is represented by Tgc and a glass transition temperature of the substrate layer is represented by Tgs, a value of Tgc is −25° C. to 120° C. and a value of Tgc-Tgs is 90° C. to 245° C.

IPC Classes  ?

• B65D 65/42 - Applications of coated or impregnated materials
• B05D 3/02 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
• B05D 7/04 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber to surfaces of films or sheets
• C08J 7/048 - Forming gas barrier coatings

Abstract

A method for manufacturing an electronic device includes at least a preparing step of preparing a structure provided with an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer, an adhesive resin layer (B) provided on a second surface side of the base material layer and in which an adhesive force is reduced by external stimuli, and an unevenness-absorbing resin layer (C) provided between the base material layer and the adhesive resin layer (A) or between the base material layer and the adhesive resin layer (B), an electronic component attached to the adhesive resin layer (A) of the adhesive film and having an uneven structure, and a support substrate attached to the adhesive resin layer (B) of the adhesive film; and a sealing step of sealing the electronic component with a sealing material.

IPC Classes  ?

• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
• B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
• B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
• C09J 7/38 - Pressure-sensitive adhesives [PSA]

Abstract

Provided are a film for manufacturing semiconductor component, a film for electronic component manufacture, a method for manufacturing a semiconductor component using such a film for manufacturing semiconductor component, and a method for manufacturing an electronic component using such a film for electronic component manufacture. The film for component manufacture includes a base layer and an adhesive layer provided on one surface side of the base layer, and the Ra (μm) of the surface of one side of the base layer on which the adhesive layer is not provided is 0.1 to 2.0, and the Rz (μm) is 1.0 to 15. The method using the film for component manufacture includes a segmenting step, a pickup step, and an evaluation step prior to the pickup step.

IPC Classes  ?

• H01L 21/66 - Testing or measuring during manufacture or treatment
• C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
• C09J 7/22 - PlasticsMetallised plastics
• C09J 201/00 - Adhesives based on unspecified macromolecular compounds
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
• H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• B32B 43/00 - Operations specially adapted for layered products and not otherwise provided for, e.g. repairingApparatus therefor
• G01R 1/04 - HousingsSupporting membersArrangements of terminals
• G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof

Abstract

Described is an affixing apparatus capable of flattening a surface of a film affixed to a main surface of a plate-shaped body. An affixing apparatus for affixing the film to the plate-shaped body includes: a plate-shaped mounting member provided with a mounting portion on which the plate-shaped body is mounted; a plate-shaped pressing member installed at a position facing the mounting member; and a support member installed at an outer edge of the mounting portion so as to be positioned between the mounting member and the pressing member.

IPC Classes  ?

• B32B 37/10 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using direct action of vacuum or fluid pressure
• B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping

Abstract

Provided are a method for affixing a protective film, a method for manufacturing a semiconductor component, and a protective film for use in the affixing method, which are capable of suppressing occurrence of a failure caused by a step on a main surface of a semiconductor wafer. The affixing method includes: an arrangement step of arranging a protective film so as to cover a main surface A of a semiconductor wafer; and an affixing step of pressing the protective film against the main surface to affix the protective film to the main surface. The affixing step includes a compression step of compressing the protective film in a thickness direction thereof.

IPC Classes  ?

• B32B 37/10 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using direct action of vacuum or fluid pressure
• B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping

Abstract

R=I(1660)/I(1625)−{−0.65×(total amine/COOH)+0.4225}  (1)

IPC Classes  ?

• C08J 7/048 - Forming gas barrier coatings
• C08F 20/06 - Acrylic acidMethacrylic acidMetal salts or ammonium salts thereof
• C08G 73/02 - Polyamines
• B29C 71/02 - Thermal after-treatment

Abstract

A component manufacturing method includes a step of obtaining a holding tool. The holding tool includes: a frame body having an opening; and a holding film placed on the frame body. The step is a step of placing the holding film on the frame body while stretching the holding film in at least three different directions or in all directions to the frame body. The holding film includes a base layer and a holding layer. The holding tool forming device includes: a mechanism that pushes a plain film from a base layer side to bring about a stretched state; a mechanism that fixes the plain film to the frame body such that the stretched state is maintained; and a mechanism that isolates an unnecessary portion from the plain film to obtain the holding film.

IPC Classes  ?

• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• C09J 7/25 - PlasticsMetallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
• C09J 7/38 - Pressure-sensitive adhesives [PSA]
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
• H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Abstract

A coating material for a gas barrier includes polycarboxylic acid, a polyamine compound, a polyvalent metal compound, and a base, in which (molar number of —COO— groups included in the polycarboxylic acid)/(molar number of amino groups included in the polyamine compound)=100/20 to 100/90.

IPC Classes  ?

• C09D 7/61 - Additives non-macromolecular inorganic
• C09D 7/40 - Additives
• B32B 27/30 - Layered products essentially comprising synthetic resin comprising vinyl resinLayered products essentially comprising synthetic resin comprising acrylic resin
• C08K 5/00 - Use of organic ingredients
• C09D 133/02 - Homopolymers or copolymers of acidsMetal or ammonium salts thereof
• C08K 3/00 - Use of inorganic substances as compounding ingredients
• C09D 179/02 - Polyamines
• C08L 79/02 - Polyamines
• C08J 7/04 - Coating
• C08J 7/043 - Improving the adhesiveness of the coatings per se, e.g. forming primers
• C08J 7/048 - Forming gas barrier coatings
• B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
• B32B 37/06 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
• C08J 7/16 - Chemical modification with polymerisable compounds
• C09D 4/06 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups
• C09D 5/00 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects producedFilling pastes
• C08K 3/22 - OxidesHydroxides of metals

Abstract

A method for manufacturing electronic apparatus includes: a step (A) of preparing a structure provided with an adhesive film and one or two or more electronic components affixed to an adhesive surface of the adhesive film; a step (B) of disposing the structure in the electronic component testing apparatus such that the electronic component is positioned over an electronic component installation region of a sample stand of the electronic component testing apparatus in a defined manner; a step (C) of evaluating the properties of the electronic component in a state of being affixed to the adhesive film with the probe terminal being in contact with a terminal of the electronic component; and a step (D) of picking up the electronic component from the adhesive film after the step (C). A defined sample stand is also provided.

IPC Classes  ?

• G01R 31/26 - Testing of individual semiconductor devices
• H01L 21/66 - Testing or measuring during manufacture or treatment
• G01R 1/04 - HousingsSupporting membersArrangements of terminals
• G01R 1/073 - Multiple probes

Abstract

30) of the adhesive resin layer (B) is 7.0 gf/sec or more at a test speed of 30 mm/min and a test temperature of 130° C.

IPC Classes  ?

• C09J 7/38 - Pressure-sensitive adhesives [PSA]
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping

Abstract

A barrier laminate film (100) of the present invention includes: a base material layer (101), a stress relaxation layer (102), an inorganic material layer (103), and a barrier resin layer (104) in this order. The barrier resin layer (104) includes an amide cross-linked compound of a polycarboxylic acid and a polyamine, and the stress relaxation layer (102) includes a polyurethane-based resin having an aromatic ring structure in a main chain.

IPC Classes  ?

• B32B 27/14 - Layered products essentially comprising synthetic resin next to a particulate layer
• B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
• B32B 27/34 - Layered products essentially comprising synthetic resin comprising polyamides
• B32B 27/40 - Layered products essentially comprising synthetic resin comprising polyurethanes
• B32B 37/24 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate

Abstract

Provided is a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. The film includes a base layer, and an adhesive layer disposed on one surface side of the base layer, wherein the ratio RE (=E′(160)/E′(−40)) of the elastic modulus of the base layer at 160° C. to the elastic modulus of the base layer at −40° C. is RE≥0.01, and the elastic modulus E′(−40) is 10 MPa to less than 1000 MPa. The method includes bonding the adhesive layer to a back surface of a semiconductor wafer, separating the semiconductor wafer into segments to obtain semiconductor parts, and separating the semiconductor parts from the adhesive layer, and includes a step of evaluating.

IPC Classes  ?

• H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
• C09J 7/25 - PlasticsMetallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
• C09J 201/00 - Adhesives based on unspecified macromolecular compounds
• C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
• C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
• C09J 133/08 - Homopolymers or copolymers of acrylic acid esters
• C09J 133/12 - Homopolymers or copolymers of methyl methacrylate
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Abstract

The method for manufacturing an electronic device includes at least: a step of preparing a structure provided with an adhesive film provided with a base material layer, an adhesive resin layer (A) provided on a first surface side of the base material layer and for temporarily fixing an electronic component, and an adhesive resin layer (B) provided on a second surface side of the base material layer and in which an adhesive force is decreased by an external stimulus, an electronic component attached to the adhesive resin layer (A) of the adhesive film, and a support substrate attached to the adhesive resin layer (B) of the adhesive film; at least one step selected from a step of decreasing water content in the adhesive film and a step of decreasing water content in the structure; and a step of sealing the electronic component with a sealing material.

IPC Classes  ?

• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• C09J 7/38 - Pressure-sensitive adhesives [PSA]
• B32B 37/06 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
• B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
• B32B 37/18 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
• C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
• C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
• H01L 23/00 - Details of semiconductor or other solid state devices

Abstract

A method for manufacturing a semiconductor device according to the present invention includes at least the following three steps: (A) a step of preparing a first structure (100) including an adhesive laminate film (50) having a heat-resistant resin layer (10), a flexible resin layer (20) and an adhesive resin layer (30) in this order, and a first semiconductor component (60) adhered to the adhesive resin layer (30) and having a first terminal (65); (B) a step of performing solder reflow processing on the first structure (100) in a state where the first semiconductor component (60) is adhered to the adhesive resin layer (30); and (C) a step of, after the step (B), peeling the heat-resistant resin layer (10) from the adhesive laminate film (50).

IPC Classes  ?

• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/482 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body

Abstract

Provided is a method of producing an electronic device, including a step of preparing a structure which includes an electronic component having a circuit forming surface, and an adhesive laminated film which includes a base material layer, an unevenness-absorptive resin layer, and an adhesive resin layer in this order and in which the adhesive resin layer is attached to the circuit forming surface of the electronic component such that the circuit forming surface is protected; and a step of forming an electromagnetic wave-shielding layer on the electronic component in a state of being attached to the adhesive laminated film.

IPC Classes  ?

• H01L 23/552 - Protection against radiation, e.g. light
• H01L 23/00 - Details of semiconductor or other solid state devices
• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields

Abstract

Provided is a method of producing an electronic device, including a step of preparing a structure which includes an electronic component having a circuit forming surface, and an adhesive laminated film which includes a base material layer and an adhesive resin layer and in which the adhesive resin layer is attached to the circuit forming surface of the electronic component; a step of back-grinding a surface of the electronic component opposite to the circuit forming surface in a state of being attached to the adhesive laminated film; a step of dicing the electronic component in a state of being attached to the adhesive laminated film; and a step of forming an electromagnetic wave-shielding layer on the separated electronic components in a state of being attached to the adhesive laminated film, in this order.

IPC Classes  ?

• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
• H01L 23/552 - Protection against radiation, e.g. light

Abstract

An adhesive laminate film has a heat-resistant resin layer, a flexible resin layer, and an adhesive resin layer in this order, a peel strength P0 between the heat-resistant resin layer and the flexible resin layer, which is based on JIS Z0237 and measured under defined conditions, is equal to or more than 0.01 N/25 mm and equal to or less than 2.0 N/25 mm, and a peel strength P1 between the heat-resistant resin layer and the flexible resin layer after a thermal treatment of the adhesive laminate film at 160° C. for four hours is equal to or more than 0.05 N/25 mm and equal to or less than 1.5 N/25 mm.

IPC Classes  ?

• B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
• B32B 27/30 - Layered products essentially comprising synthetic resin comprising vinyl resinLayered products essentially comprising synthetic resin comprising acrylic resin
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H01M 50/124 - Primary casingsJackets or wrappings characterised by the material having a layered structure
• C09J 7/25 - PlasticsMetallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
• C09J 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical

Abstract

E1≤1, and E′(25) is 35 MPa or more and 3500 MPa or less. A component-manufacturing method includes a component holding step of holding components to the holding layer of the component-manufacturing tool; and a chucking step of chucking and fixing the holding film, to which holds the components, to a surface of a heated chuck table.

IPC Classes  ?

• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
• G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
• H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation

Abstract

An adhesive film used when sealing an electronic component to temporarily fix the electronic component, the adhesive film including a base material layer, an adhesive resin layer which is provided on a first surface side of the base material layer and which is for temporarily fixing the electronic component, and an adhesive resin layer which is provided on a second surface side of the base material layer and of which the adhesive strength decreases according to an external stimulus, in which the adhesive resin layer includes a polyvalent carboxylic acid ester-based plasticizer and an adhesive resin, and a content of the polyvalent carboxylic acid ester-based plasticizer in the adhesive resin layer is more than or equal to 0.7 parts by mass and less than or equal to 50 parts by mass with respect to 100 parts by mass of the adhesive resin included in the adhesive resin layer.

IPC Classes  ?

• H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
• C09J 7/24 - PlasticsMetallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
• C09J 7/35 - Heat-activated
• C09J 11/06 - Non-macromolecular additives organic
• C09J 201/00 - Adhesives based on unspecified macromolecular compounds
• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
• H01L 23/00 - Details of semiconductor or other solid state devices

Abstract

Provided is a component-manufacturing film that includes a first region S1 and a second region S2 disposed so as to surround the region S1; the region S1 is formed of a base layer and an adhesive layer provided on one surface side of the base layer; the region S2 is formed of the base layer, the adhesive layer, and an additional layer affixed onto the layer. In the temperature range of 190° C. or lower, a tensile elastic modulus of the additional layer is equal to or greater than the tensile elastic modulus of the base layer. Further provided are a component-manufacturing tool and method, the latter including a component fixing step; a film placement step of performing placement so that the boundary between the region S1 and the region S2 is located inside with respect to an edge of the chuck table; a chucking step; and a heating step.

IPC Classes  ?

• H01L 23/52 - Arrangements for conducting electric current within the device in operation from one component to another
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• C09J 7/25 - PlasticsMetallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
• C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
• B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
• B32B 15/09 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyesters
• B32B 15/18 - Layered products essentially comprising metal comprising iron or steel
• B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
• B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters

Abstract

A method for manufacturing electronic apparatus includes: a step (A) of preparing a structure provided with an adhesive film and one or two or more electronic components affixed to an adhesive surface of the adhesive film; a step (B) of disposing the structure in the electronic component testing apparatus such that the electronic component is positioned over an electronic component installation region of a sample stand of the electronic component testing apparatus in a defined manner; a step (C) of evaluating the properties of the electronic component in a state of being affixed to the adhesive film with the probe terminal being in contact with a terminal of the electronic component; and a step (D) of picking up the electronic component from the adhesive film after the step (C). A defined sample stand is also provided.

IPC Classes  ?

• G01R 31/26 - Testing of individual semiconductor devices
• H01L 21/66 - Testing or measuring during manufacture or treatment
• G01R 1/04 - HousingsSupporting membersArrangements of terminals
• G01R 1/073 - Multiple probes

Abstract

A method for manufacturing electronic apparatus includes: a step (A) of preparing a structure provided with an adhesive film and at least one electronic component affixed to an adhesive surface of the adhesive film; a step (B) of disposing the structure in an electronic component testing apparatus such that the electronic component is positioned over an electronic component installation region of a sample stand with the adhesive film interposed between the electronic component and the electronic component installation region, the electronic component testing apparatus being provided with a probe card at a position facing the sample stand and includes a probe terminal; a step (C) of evaluating the properties of the electronic component while being affixed to the adhesive film with the probe terminal being in contact with a terminal of the electronic component; and a subsequent step (D) of picking up the electronic component from the adhesive film.

IPC Classes  ?

• G01R 31/26 - Testing of individual semiconductor devices
• C09J 7/25 - PlasticsMetallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
• C09J 7/38 - Pressure-sensitive adhesives [PSA]
• G01R 1/04 - HousingsSupporting membersArrangements of terminals
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
• H01L 21/66 - Testing or measuring during manufacture or treatment
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
• H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
• C09J 7/24 - PlasticsMetallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds

Abstract

A method for manufacturing a semiconductor device includes at least the following three steps. A step (A) of preparing a structure including a semiconductor wafer having a circuit-formed surface and an adhesive film attached to the circuit-formed surface side of the semiconductor wafer. A step (B) of back grinding a surface on a side opposite to the circuit-formed surface side of the semiconductor wafer. A step (C) of radiating ultraviolet rays to the adhesive film and then removing the adhesive film from the semiconductor wafer. In addition, as the adhesive film, an adhesive film having a base material layer, an antistatic layer, and an adhesive resin layer including a conductive additive in this order is used, and the adhesive film is used so that the adhesive resin layer faces the circuit-formed surface side of the semiconductor wafer.

IPC Classes  ?

• H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• C09J 9/02 - Electrically-conducting adhesives
• C09J 133/08 - Homopolymers or copolymers of acrylic acid esters
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching

Abstract

A method for manufacturing a semiconductor device according to the present invention includes at least the following four steps: (A) a step of preparing a structure (100) including an adhesive laminate film (50) having a heat-resistant resin layer (10), a flexible resin layer (20) and an adhesive resin layer (30) in this order, and one or two or more semiconductor chips (70) adhered to the adhesive resin layer (30); (B) a step of confirming an operation of the semiconductor chips (70) in a state of being adhered to the adhesive resin layer (30); (C) a step of, after the step (B), peeling the heat-resistant resin layer (10) from the adhesive laminate film (50); and (D) a step of, after the step (C), picking up the semiconductor chips (70) from the adhesive resin layer (30).

IPC Classes  ?

• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• B32B 43/00 - Operations specially adapted for layered products and not otherwise provided for, e.g. repairingApparatus therefor
• H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
• H01L 21/66 - Testing or measuring during manufacture or treatment
• G01R 31/26 - Testing of individual semiconductor devices
• C09J 7/29 - Laminated material
• C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
• B32B 27/00 - Layered products essentially comprising synthetic resin
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components

Abstract

Provided are a film for manufacturing semiconductor component, a film for electronic component manufacture, a method for manufacturing a semiconductor component using such a film for manufacturing semiconductor component, and a method for manufacturing an electronic component using such a film for electronic component manufacture. The film for component manufacture includes a base layer and an adhesive layer provided on one surface side of the base layer, and the Ra (μm) of the surface of one side of the base layer on which the adhesive layer is not provided is 0.1 to 2.0, and the Rz (μm) is 1.0 to 15. The method using the film for component manufacture includes a segmenting step, a pickup step, and an evaluation step prior to the pickup step.

IPC Classes  ?

• H01L 21/66 - Testing or measuring during manufacture or treatment
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• C09J 201/00 - Adhesives based on unspecified macromolecular compounds
• C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
• C09J 7/22 - PlasticsMetallised plastics
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
• H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
• B32B 43/00 - Operations specially adapted for layered products and not otherwise provided for, e.g. repairingApparatus therefor
• G01R 1/04 - HousingsSupporting membersArrangements of terminals
• G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer

Abstract

A method for manufacturing a semiconductor device of the present invention includes at least following four steps. (A) A step of preparing a structure having an adhesive film having a radiation-curable adhesive resin layer and one or two or more semiconductor chips adhered to the adhesive resin layer ; (B) a step of irradiating the adhesive film with a radiation to crosslink the adhesive resin layer; (C) a step of, after the step (B), confirming the operation of the semiconductor chips in a state of being adhered to the adhesive resin layer; and (D) a step of, after the step (C), picking up the semiconductor chips from the adhesive resin layer.

IPC Classes  ?

• H01L 21/66 - Testing or measuring during manufacture or treatment
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
• C09J 7/38 - Pressure-sensitive adhesives [PSA]
• C09J 7/29 - Laminated material
• C09J 7/25 - PlasticsMetallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
• G01R 31/26 - Testing of individual semiconductor devices

Abstract

1 of a surface of the adhesive resin layer after ultraviolet curing, which is measured using a specific method, is equal to or less than 2.0 kV.

IPC Classes  ?

• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
• H01L 23/60 - Protection against electrostatic charges or discharges, e.g. Faraday shields
• H01L 23/00 - Details of semiconductor or other solid state devices

Abstract

The invention provides a sensor capable of detecting deformation. The deformation sensor has a structure in which an ion-conductive polymer layer is sandwiched between soft electrodes, wherein non-uniform ion distribution is generated in the ion-conductive polymer layer by deformation, thereby generating a potential difference between the electrodes.

IPC Classes  ?

• G01L 1/00 - Measuring force or stress, in general
• G01B 7/16 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
• G01D 5/14 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
• G01L 1/04 - Measuring force or stress, in general by measuring elastic deformation of gauges, e.g. of springs
• G01L 1/14 - Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
• G01L 1/16 - Measuring force or stress, in general using properties of piezoelectric devices
• G01L 1/06 - Measuring force or stress, in general by measuring the permanent deformation of gauges, e.g. of compressed bodies
• G01L 5/00 - Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
• G01B 5/30 - Measuring arrangements characterised by the use of mechanical techniques for measuring the deformation in a solid, e.g. mechanical strain gauge
• H01B 1/24 - Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon, or silicon
• C08K 3/04 - Carbon
• B82B 1/00 - Nanostructures formed by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units

Abstract

The present invention is a method for producing a polyfunctional polymer that contains a structural unit having a urethane bond and a polymerizable unsaturated bond in a side chain, and is characterised by including a reaction process in which a polymer (P) containing a structural unit (a) having a hydroxy group in a side chain and a monomer (M) having an isocyanate group and a polymerizable unsaturated bond are reacted in the presence of a bismuth carboxylate.

IPC Classes  ?

• C08F 8/30 - Introducing nitrogen atoms or nitrogen-containing groups
• C08G 18/81 - Unsaturated isocyanates or isothiocyanates
• C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
• C08G 18/62 - Polymers of compounds having carbon-to-carbon double bonds
• C08F 299/00 - Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
• C09J 175/16 - Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
• C08G 18/22 - Catalysts containing metal compounds
• C09D 175/16 - Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
• C08J 3/24 - Crosslinking, e.g. vulcanising, of macromolecules
• C09J 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical

Abstract

The present invention is an adhesive composition that is characterized by including (A) a polymer comprising a structural unit having a hydroxy group in a side chain, (B) a compound having two or more isocyanate groups, (C) a bismuth carboxylate, and (D) a tertiary amine having a pKa of 6 or more. The polymer (A) may include further a structural unit having a urethane bond and a polymerizable unsaturated bond in a side chain.

IPC Classes  ?

• C09J 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
• C09J 175/14 - Polyurethanes having carbon-to-carbon unsaturated bonds
• C09J 7/38 - Pressure-sensitive adhesives [PSA]
• C09J 11/06 - Non-macromolecular additives organic
• C09J 201/06 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups containing oxygen atoms
• C09J 175/04 - Polyurethanes
• C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers
• C08K 5/098 - Metal salts of carboxylic acids
• C08K 5/17 - AminesQuaternary ammonium compounds

Abstract

This semiconductor wafer surface protection film has a substrate layer A, an adhesive absorption layer B, and adhesive surface layer C, in the stated order. The adhesive absorption layer B comprises an adhesive composition containing a thermoset resin b1, said adhesive absorption layer B having a minimum value G′bmin of the storage elastic modulus G′b in the range of 25° C. to less than 250° C. of 0.001 MPa to less than 0.1 MPa, a storage elastic modulus G′b250 at 250° C. of 0.005 MPa or above, and a temperature at which G′bmin is exhibited of 50-150° C. The adhesive surface layer C has a minimum value G′cmin of the storage elastic modulus G′c in the range of 25° C. to less than 250° C. of 0.03 MPa.

IPC Classes  ?

• C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
• B32B 27/00 - Layered products essentially comprising synthetic resin
• B32B 27/30 - Layered products essentially comprising synthetic resin comprising vinyl resinLayered products essentially comprising synthetic resin comprising acrylic resin
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
• C09J 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
• C09J 133/10 - Homopolymers or copolymers of methacrylic acid esters
• C09J 133/12 - Homopolymers or copolymers of methyl methacrylate
• C09J 201/02 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups
• H01L 21/283 - Deposition of conductive or insulating materials for electrodes
• H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Abstract

Provided are an electronic-device-protecting film used when semiconductor parts obtained by segmentation are to be sealed in the form of an array using a sealant after the semiconductor parts are rearranged, wherein the curing temperature of the sealant does not need to be adjusted downward; an electronic-device-protecting member; a method for manufacturing an electronic device; and a method for manufacturing a package. The electronic-device-protecting film includes a base layer and an adhesive layer, and the method includes: bonding the adhesive layer to one surface of a frame having an opening, the adhesive layer being bonded so as to cover the opening; subsequently bonding a plurality of semiconductor parts to the surface of the adhesive layer that is exposed via the opening with the semiconductor parts set apart from each other; subsequently covering the semiconductor parts and the surface of the adhesive layer with a sealant; and heat-curing the sealant.

IPC Classes  ?

• H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• C09J 201/00 - Adhesives based on unspecified macromolecular compounds
• C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
• B32B 27/04 - Layered products essentially comprising synthetic resin as impregnant, bonding, or embedding substance
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
• B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
• B32B 27/30 - Layered products essentially comprising synthetic resin comprising vinyl resinLayered products essentially comprising synthetic resin comprising acrylic resin
• B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters

Abstract

Provided is a film for manufacturing a semiconductor part in which an evaluation step accompanied with a temperature change, a segmenting step, and a pickup step can be commonly performed, a method for manufacturing a semiconductor part, a semiconductor part, and an evaluation method. The film includes a base layer, and an adhesive layer disposed on one surface side of the base layer, wherein the ratio RE (=E′(160)/E′(−40)) of the elastic modulus of the base layer at 160° C. to the elastic modulus of the base layer at −40° C. is RE≥0.01, and the elastic modulus E′(−40) is 10 MPa to less than 1000 MPa. The method includes bonding the adhesive layer to a back surface of a semiconductor wafer, separating the semiconductor wafer into segments to obtain semiconductor parts, and separating the semiconductor parts from the adhesive layer, and includes a step of evaluating.

IPC Classes  ?

• H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
• C09J 7/25 - PlasticsMetallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
• C09J 201/00 - Adhesives based on unspecified macromolecular compounds
• C09J 7/20 - Adhesives in the form of films or foils characterised by their carriers
• C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
• C09J 133/08 - Homopolymers or copolymers of acrylic acid esters
• C09J 133/12 - Homopolymers or copolymers of methyl methacrylate
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping

Abstract

A coating material for a gas barrier includes polycarboxylic acid, a polyamine compound, a polyvalent metal compound, and a base, in which (molar number of —COO— groups included in the polycarboxylic acid)/(molar number of amino groups included in the polyamine compound)=100/20 to 100/90.

IPC Classes  ?

• C09D 9/00 - Chemical paint or ink removers
• C09D 7/61 - Additives non-macromolecular inorganic
• C09D 7/40 - Additives
• B32B 27/30 - Layered products essentially comprising synthetic resin comprising vinyl resinLayered products essentially comprising synthetic resin comprising acrylic resin
• C08K 5/00 - Use of organic ingredients
• C09D 133/02 - Homopolymers or copolymers of acidsMetal or ammonium salts thereof
• C08K 3/00 - Use of inorganic substances as compounding ingredients
• C09D 179/02 - Polyamines
• C08L 79/02 - Polyamines
• C08J 7/04 - Coating
• B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
• B32B 37/06 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
• C08J 7/16 - Chemical modification with polymerisable compounds
• C09D 4/06 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups
• C09D 5/00 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects producedFilling pastes
• C08K 3/22 - OxidesHydroxides of metals

Abstract

According to the present invention, there is provided a semiconductor wafer protective film including a substrate layer (A) and an adhesive layer (C) formed on the substrate layer (A), in which the substrate layer (A) includes polymer, and a solubility parameter of the polymer determined by a Van Krevelen method is equal to or greater than 9.

IPC Classes  ?

• H01L 21/30 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• B32B 27/30 - Layered products essentially comprising synthetic resin comprising vinyl resinLayered products essentially comprising synthetic resin comprising acrylic resin
• C09J 7/02 - on carriers
• B32B 27/06 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance
• C08F 222/10 - Esters
• C09J 133/10 - Homopolymers or copolymers of methacrylic acid esters
• B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind
• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
• H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Abstract

Provided is a manufacture method of a laminate film accurately precut into a desired shape. The manufactured laminate film comprises an elongated release film having thereon a plurality of insular adhesive films (A) and (B) mutually adjacent in the lengthwise direction, and the method includes: obtaining an elongated laminate having a release film and an adhesive film; precutting the adhesive film to obtain a first peeling part; and peeling off the first peeling part from the release film. The first peeling part includes peripheral parts (A1) and (B2) of insular adhesive films (A) and (B) respectively positioned at one and the other widthwise end side of the release film; and connection part (C) connecting peripheral parts (A1) and (B2), but not including peripheral parts (A2) and (B1) of insular adhesive films (A) and (B) respectively positioned at the other and the one widthwise end side of the release film.

IPC Classes  ?

• H01L 21/46 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups
• C09J 7/02 - on carriers
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• C09J 123/14 - Copolymers of propene
• C09J 123/20 - Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
• H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Abstract

5 Pa·s, and the content of the organic peroxide in the encapsulating material for solar cell is in a range of 0.1 parts by weight to 3 parts by weight with respect to 100 parts by weight of the ethylene/α-olefin copolymer.

IPC Classes  ?

• H01L 31/048 - Encapsulation of modules
• C08L 23/08 - Copolymers of ethene
• C08K 5/14 - Peroxides
• C08K 3/00 - Use of inorganic substances as compounding ingredients
• C08K 5/00 - Use of organic ingredients

Abstract

Provided is a solar cell module wherein a rear surface protective sheet has excellent long-term durability, and transmissivity of ultraviolet that reaches the solar cell is retained for a long time. This solar cell module is configured by laminating a front surface protective sheet, a light receiving-side sealing sheet, a solar cell element, a rear surface-side sealing sheet, and a rear surface protective sheet in this order. The solar cell module is characterized in that the light receiving-side sealing sheet has a transmissivity of 50% or more with respect to light having a wavelength of 300 nm, and the rear surface-side sealing sheet contains a reactive ultraviolet absorbent.

IPC Classes  ?

• H01L 31/042 - PV modules or arrays of single PV cells
• H01L 31/048 - Encapsulation of modules
• C08K 5/3475 - Five-membered rings condensed with carbocyclic rings
• C08K 5/134 - Phenols containing ester groups
• H02S 20/23 - Supporting structures directly fixed to an immovable object specially adapted for buildings specially adapted for roof structures
• H01L 31/049 - Protective back sheets
• C08L 23/08 - Copolymers of ethene

Abstract

A method for manufacturing an encapsulating material sheet for a solar battery of the invention includes a step of producing an additive-containing pellet by soaking an additive A into a pellet including a polyolefin-based resin as a main component, a step of injecting the additive-containing pellet into a cylinder from a supply opening in an extrusion molder, and melting and kneading a resin composition including the polyolefin-based resin and the additive A in the cylinder, and a step of molding by extrusion the resin composition from a die in the extrusion molder into a sheet shape.

IPC Classes  ?

• B29C 47/00 - Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor (extrusion blow-moulding B29C 49/04)
• B29C 47/10 - Feeding the material to the extruder
• H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
• B29B 9/04 - Making granules by dividing preformed material in the form of plates or sheets
• B29C 47/38 - using screws
• C08J 3/20 - Compounding polymers with additives, e.g. colouring
• C08J 5/18 - Manufacture of films or sheets
• B29D 7/01 - Films or sheets
• B29B 9/16 - Auxiliary treatment of granules
• B29K 105/24 - Condition, form or state of moulded material cross-linked or vulcanised
• H01L 31/048 - Encapsulation of modules
• B29B 7/38 - MixingKneading continuous, with mechanical mixing or kneading devices with movable mixing or kneading devices rotary
• B29B 7/88 - Adding charges
• B29C 47/14 - with broad opening, e.g. for sheets
• B29C 47/40 - using at least two intermeshing screws
• B29C 47/82 - Heating the cylinders
• B29C 47/92 - Measuring, controlling or regulating
• B29K 23/00 - Use of polyalkenes as moulding material

Abstract

An encapsulating material for solar cell of the invention contains an ethylene/α-olefin copolymer, and a content of a fluorine element in the ethylene/α-olefin copolymer, which is determined using a combustion method and an ion chromatograph method, is equal to or less than 30 ppm.

IPC Classes  ?

• C08L 23/16 - Ethene-propene or ethene-propene-diene copolymers
• H01L 31/0203 - Containers; Encapsulations
• C08L 23/08 - Copolymers of ethene
• H01L 31/048 - Encapsulation of modules
• C08F 210/16 - Copolymers of ethene with alpha-alkenes, e.g. EP rubbers

Abstract

An encapsulating material for solar cell of the invention contains an ethylene/α-olefin copolymer, an organic peroxide, at least one crosslinking aid selected from a group consisting of divinyl aromatic compounds, cyanurates, diallyl compounds, triallyl compounds, oximes and maleimides, and a (meth)acrylate-based monomer. The content of the (meth)acrylate-based monomer in the encapsulating material for solar cell is in a range of 0.1 parts by weight to 5.0 parts by weight with respect to 100 parts by weight of the ethylene/α-olefin copolymer, and the content of the crosslinking aid in the encapsulating material for solar cell is in a range of 0.1 parts by weight to 3 parts by weight with respect to 100 parts by weight of the ethylene/α-olefin copolymer.

IPC Classes  ?

• C08F 255/00 - Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group
• C08F 255/10 - Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group on to polymers of olefins having four or more carbon atoms on to butene polymers
• H01L 31/048 - Encapsulation of modules
• C08J 5/18 - Manufacture of films or sheets
• C08K 5/00 - Use of organic ingredients
• C08F 2/48 - Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
• C08F 8/30 - Introducing nitrogen atoms or nitrogen-containing groups
• C08F 8/42 - Introducing metal atoms or metal-containing groups
• C08F 8/00 - Chemical modification by after-treatment

Abstract

A sheet set for encapsulating a solar battery including a first encapsulating sheet and a second encapsulating sheet which are disposed between a light-incident surface protective member and a back surface protective member, and are used to encapsulate solar battery elements is provided. When the first encapsulating sheet and the second encapsulating sheet are subjected to a heating and pressurization treatment in which the first encapsulating sheet and the second encapsulating sheet are heated and depressurized under defined conditions, a volume resistivity of the first encapsulating sheet measured under defined conditions, is higher than a volume resistivity of the second encapsulating sheet. The first encapsulating sheet is disposed between the light-incident surface protective member and the solar battery elements. The second encapsulating sheet has at least one polar group selected from a carboxyl group, an ester group, a hydroxyl group, an amino group, and an acetal group.

IPC Classes  ?

• H01L 31/048 - Encapsulation of modules
• C08F 210/02 - Ethene
• C08F 210/16 - Copolymers of ethene with alpha-alkenes, e.g. EP rubbers
• C09D 123/08 - Copolymers of ethene
• C08F 220/06 - Acrylic acidMethacrylic acidMetal salts or ammonium salts thereof
• C08F 218/08 - Vinyl acetate

Abstract

18 Ω·cm.

IPC Classes  ?

• B60C 1/00 - Tyres characterised by the chemical composition or the physical arrangement or mixture of the composition
• C08F 118/02 - Esters of monocarboxylic acids
• C08F 210/00 - Copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
• H02N 6/00 - Generators in which light radiation is directly converted into electrical energy (solar cells or assemblies thereof H01L 25/00, H01L 31/00)
• C08L 23/08 - Copolymers of ethene
• C08L 23/02 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondCompositions of derivatives of such polymers not modified by chemical after-treatment
• H01L 31/048 - Encapsulation of modules
• C08L 33/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical

Abstract

a2) MFR is from 2 to 50 g/10 minutes as measured under the conditions of a temperature of 190 degrees centigrade and a load of 2.16 kg in accordance with ASTM D1238.

IPC Classes  ?

• H01L 31/0203 - Containers; Encapsulations
• H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
• C08K 5/14 - Peroxides
• H01L 31/048 - Encapsulation of modules
• C09D 123/08 - Copolymers of ethene
• C08K 5/5425 - Silicon-containing compounds containing oxygen containing at least one C=C bond

Abstract

A solar-cell sealant that has excellent properties such as transparency, flexibility, adhesiveness, heat resistance, appearance, cross-linking characteristics, electrical characteristics, and calenderability. A solar-cell sealant that contains an ethylene/α-olefin/unconjugated-polyene copolymer satisfying requirements (a1) through (a3). Requirement (a1) is that constituent units derived from ethylene constitute 80-90 mol %, constituent units derived from C3-20 α-olefin constitute 9.99-19.99 mol %, and constituent units derived from an unconjugated polyene constitute 0.01-5.0 mol % of said copolymer. Requirement (a2) is that the MFR of said copolymer, as measured in accordance with ASTM D1238 at 190° C. under a 2.16 kg load, be at least 2 g/10 min. and less than 10 g/10 min. Requirement (a3) is that the Shore A hardness of said copolymer, as measured in accordance with ASTM D2240, be 60 to 85.

IPC Classes  ?

• H01L 31/0203 - Containers; Encapsulations
• H01L 31/048 - Encapsulation of modules
• C08F 210/18 - Copolymers of ethene with alpha-alkenes, e.g. EP rubbers with non-conjugated dienes, e.g. EPT rubbers
• C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers
• C08F 4/659 - Component covered by group containing a transition metal-carbon bond

Abstract

3 as measured in accordance with ASTM D1505; and (a4) the shore A hardness is from 60 to 85 as measured in accordance with ASTM D2240.

IPC Classes  ?

• H01L 31/048 - Encapsulation of modules
• C08F 210/16 - Copolymers of ethene with alpha-alkenes, e.g. EP rubbers
• C08L 23/08 - Copolymers of ethene
• C09D 123/08 - Copolymers of ethene
• C08K 5/14 - Peroxides
• C08K 5/5425 - Silicon-containing compounds containing oxygen containing at least one C=C bond
• C08L 23/26 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondCompositions of derivatives of such polymers modified by chemical after-treatment

Abstract

3 as measured in accordance with ASTM D1505; and (a4) the shore A hardness is from 60 to 85 as measured in accordance with ASTM D2240.

IPC Classes  ?

• H01L 31/048 - Encapsulation of modules
• H01L 31/042 - PV modules or arrays of single PV cells
• C08F 210/00 - Copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond

Abstract

A(60) of the resin layer A.

IPC Classes  ?

• H01L 23/58 - Structural electrical arrangements for semiconductor devices not otherwise provided for
• H01L 21/30 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups
• H01L 21/46 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups
• H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
• B32B 9/00 - Layered products essentially comprising a particular substance not covered by groups
• B32B 33/00 - Layered products characterised by particular properties or particular surface features, e.g. particular surface coatingsLayered products designed for particular purposes not covered by another single class

Abstract

3. b) The melting peak temperature is 90 to 125 ° C. as determined by DSC. c) The melt flow rate (MFR2) is 0.1 to 100 g/10 minutes as measured at 190 ° C. and a load of 2.16 kg in accordance with JIS K-6721. d) The Mw/Mn ratio is 1.2 to 3.5. e) The content of metal residues is 0.1 to 50 ppm.

IPC Classes  ?

• H01L 31/048 - Encapsulation of modules
• B32B 3/30 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids characterised by a layer formed with recesses or projections, e.g. grooved, ribbed
• B32B 27/32 - Layered products essentially comprising synthetic resin comprising polyolefins
• C08F 10/02 - Ethene
• C08L 23/08 - Copolymers of ethene
• C08L 23/26 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondCompositions of derivatives of such polymers modified by chemical after-treatment
• C08F 255/02 - Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group on to polymers of olefins having two or three carbon atoms
• C08L 51/06 - Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
• C08K 5/00 - Use of organic ingredients
• C08K 5/5425 - Silicon-containing compounds containing oxygen containing at least one C=C bond

Abstract

At heat sealable multilayer film includes a cohesive failure heat seal layer (1) that includes a resin composition including 75 to 85 wt % of a propylene polymer (A) and 15 to 25 wt % of an ethylene polymer (B) (based on the total of (A) and (B) of 100 wt %), and a support layer (2) including a propylene block copolymer (C). The heat sealable multilayer film can package oil-rich contents to be retort sterilized without separation (delamination) of a cohesive failure heat seal layer due to penetration of oil from the contents and have appropriate heat seal strength and excellent easy openability, and can be opened with stable peel conditions.

IPC Classes  ?

• B32B 27/08 - Layered products essentially comprising synthetic resin as the main or only constituent of a layer next to another layer of a specific substance of synthetic resin of a different kind