Abstract

In the circuit board assembly and the method thereof provided by the embodiments of the present disclosure, the support layer (including the base layer and the adhesive layers) is directly embedded in the through groove of the inner substrate, and the support layer is recessed inside the through groove to form the recess, so that embedded electronic devices can be respectively disposed in the through groove and the recess. The support layer does not need to be peeled off, thereby simplifying the process, improving production efficiency, and avoiding the problem of adhesive layer residue during peeling. In addition, the electronic devices are respectively disposed on upper and lower surfaces of the inner substrate, that is, components can be mounted on both upper and lower sides of the inner substrate, thus improving the space utilization rate of the circuit board assembly.

IPC Classes  ?

• H05K 1/185 -
• H05K 1/03 - Use of materials for the substrate
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A circuit board includes a first circuit base board, a second circuit base board, an annular interposer disposed between the first circuit base board and the second circuit base board, and a conductive element. A first annular groove of the first circuit base board has a first internal extension groove. A second annular groove of the second circuit base board has a second internal extension groove. The annular interposer is located in the first annular groove and the second annular groove. The conductive element is disposed in the first internal extension groove and the second internal extension groove and electrically connects the first conductive layer and the second conductive layer.

IPC Classes  ?

• H05K 1/14 - Structural association of two or more printed circuits
• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/36 - Assembling printed circuits with other printed circuits

Abstract

A bendable circuit board includes a first structure and a second structure. The first structure includes a first insulation layer, a first insulation extension material, a first conductive layer and a first conductive extension feature. The first insulation extension material surrounds the first insulation layer. The first conductive layer includes a first conductive feature and a second conductive feature. The first conductive extension feature connects the first conductive feature to the second conductive feature. The second structure is bonded to the first structure, and includes a second insulation layer, a second insulation extension material, a second conductive layer and a second conductive extension feature. The second insulation extension material surrounds the second insulation layer. The second conductive layer includes a third conductive feature and a fourth conductive feature. The second conductive extension feature connects the third conductive feature to the fourth conductive feature.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/03 - Use of materials for the substrate
• H05K 1/09 - Use of materials for the metallic pattern

Abstract

A circuit board having a switch includes an insulation material layer, first and second insulation layers, a circular channel, a first cover layer, an inert liquid material, a first conductive block, a second conductive block and a conductive layer. The first and second insulation layers are respectively on bottom and top surfaces of the insulation material layer. The circular channel is in the first and second insulation layers and the insulation material layer, and includes a first sub-channel, a second sub-channel, a first connection channel and a second connection channel. The first cover layer is on a bottom surface of the first insulation layer. The inert liquid material is in the circular channel. The first conductive block is in the first sub-channel. The second conductive block is in the second sub-channel. The conductive layer is in the insulation material layer and adjacent to the circular channel.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/22 - Secondary treatment of printed circuits
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A bio-implantable device and a fabricating method of the same are provided. The bio-implantable device includes a flexible circuit board, a sensor, an elastic conductive layer, an electrode structure, and an elastic insulating layer. The flexible circuit board includes a wiring layer. The sensor is disposed on the wiring layer. The elastic conductive layer covers the sensor. The electrode structure is disposed on the elastic conductive layer and is configured to collect an electric signal from a creature. The electrode structure is electrically connected to the sensor through the elastic conductive layer. The elastic insulating layer covers the flexible circuit board and exposes the electrode structure and the elastic conductive layer.

IPC Classes  ?

• H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
• G06F 3/01 - Input arrangements or combined input and output arrangements for interaction between user and computer
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A pressure sensor and method of manufacturing the same are provided. The pressure sensor includes a flexible sensor board. The flexible sensor board includes a dielectric layer, two circuit layers and piezoelectric sensing blocks. The dielectric layer has a first surface and a second surface opposite to the first surface. The two circuit layers are placed on the first surface and the second surface of the dielectric layer respectively. The piezoelectric sensing blocks are placed in dielectric layer and electrically connected with the two circuit layers. The mentioned pressure sensor utilizes the flexible sensor board that can be suitable for to the curvature of the diffident curved surfaces of the tested sample, which helps to improve the consistency and accuracy of the measurements.

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• G01L 1/16 - Measuring force or stress, in general using properties of piezoelectric devices
• H05K 1/14 - Structural association of two or more printed circuits
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A circuit board and a fabricating method of the same are provided. The circuit board includes multiple first wiring layers, a plated through hole, a filling material, a cover wiring layer, a second wiring layer and a conductive structure. The plated through hole extends through the first wiring layers and is electrically connected to the first wiring layers. The filling material is disposed in the plated through hole. The cover wiring layer covers the plated through hole and is electrically connected to the plated through hole. The second wiring layer is stacked on the first wiring layers and the cover wiring layer. The conductive structure extends through the cover wiring layer to the filling material from the second wiring layer and is inserted in the filling material. The conductive structure does not penetrate the filling material.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/02 - Printed circuits Details
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• H05K 3/42 - Plated through-holes

Abstract

A transmission line structure and a fabricating method of the same are provided. The transmission line structure includes a baseboard, two transmission lines, a grounding plate, a metal plate, a shielding element, and an elastic conductor. The baseboard has an air hole. The transmission lines are spaced side by side, and are disposed on the baseboard. The grounding plate is separated from the transmission lines, and is disposed on the baseboard. The metal plate is separated from the baseboard. The transmission lines are located between the baseboard and the metal plate. The shielding element is disposed on the metal plate and extends toward the baseboard. The elastic conductor is disposed between the baseboard and the metal plate, and is electrically connected to the grounding plate and the metal plate. The baseboard, the metal plate, and the elastic conductor define a transmission cavity that communicates with the air hole.

IPC Classes  ?

• H01P 3/02 - WaveguidesTransmission lines of the waveguide type with two longitudinal conductors
• H01P 11/00 - Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type

Abstract

An electronic module and a method of manufacturing the same are provided. The electronic module includes an interposer, a first electronic component, a flexible circuit board, and a second electronic component. The interposer includes a Redistribution Layer (RDL), and a main body layer. The main body layer is disposed on the RDL and has a recess exposing the RDL. The first electronic component is embedded in the recess of the interposer and electrically connected with the RDL. The flexible circuit board wraps the interposer and the first electronic component. The second electronic component is disposed on the flexible circuit board and overlaps the first electronic component.

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

A circuit board includes a wiring base including pads, a temperature control element, flexible parts, conductive pillars and an electronic component disposed on the temperature control element. The temperature control element is disposed on the wiring base, forms a gap with the wiring base, and includes a first memory metal layer, a second memory metal layer fixed on the first memory metal layer, first magnetic attraction parts disposed in the first memory metal layer, and second magnetic attraction parts disposed in the second memory metal layer and corresponding to the first magnetic attraction parts, respectively. The flexible parts are disposed in the gap and correspond to the first magnetic attraction parts, respectively, and are electrically connected to the pads, respectively. The conductive pillars are disposed between the electronic component and the temperature control element, penetrate the second magnetic attraction parts, respectively, and are electrically connected to the electronic component.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
• H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

Abstract

A flexible circuit base board and a flexible flat cable are provided. The flexible flat cable includes the flexible circuit base board and a transmission element. The flexible circuit base board includes a base film, multiple conductive wires, a transmission signal pad, a conductive structure, a collecting signal pad and a cover film. The conductive wires are spaced and placed on the base film. The transmission signal pad and the collecting signal pad are electrically connected to and are disposed on the base film. The conductive structure is disposed on the base film, and is electrically connected to at least one of the conductive wires and the transmission signal pad. The cover film is disposed on the base film, and covers the conductive wires, the conductive structure, the transmission signal pad, and the collecting signal pad. The transmission element is electrically connected to the collecting signal pad.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H01B 7/04 - Flexible cables, conductors, or cords, e.g. trailing cables
• H01B 7/08 - Flat or ribbon cables
• H01M 50/569 - Constructional details of current conducting connections for detecting conditions inside cells or batteries, e.g. details of voltage sensing terminals
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 3/28 - Applying non-metallic protective coatings

Abstract

A circuit board assembly and a fabricating method of the same are provided. The circuit board assembly includes a wiring board and a shielding structure. The wiring board includes a dielectric layer, a wiring layer, a metal film and a metal cover. The first wiring layer includes an antenna. The shielding structure is disposed in the wiring board. The metal film covers a part of the shielding structure, and the metal cover touches the metal film and covers another part of the shielding structure not covered by the metal film. The dielectric layer and the wiring layer are in stacks while the dielectric layer is located on one side of the shielding structure. A material of the shielding structure includes carbon nanotube, metal and resin while the carbon nanotube and the metal are distributed in the resin.

IPC Classes  ?

• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/22 - Secondary treatment of printed circuits
• H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor

Abstract

A circuit board includes a first wiring substrate, a second wiring substrate, a channel, a first electronic component, a second electronic component and a sealing material layer. The first wiring substrate includes a first wiring layer and a second wiring layer. The second wiring substrate is disposed on one side of the first wiring substrate. The channel extends through the first wiring substrate and the second wiring substrate. The first electronic component is disposed in the channel and is electrically connected to the first wiring layer. The second electronic component is disposed in the channel and is electrically connected to one of the first wiring layer and the second wiring layer. The sealing material layer fills the channel and covers the first electronic component and the second electronic component.

IPC Classes  ?

• H05K 1/14 - Structural association of two or more printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A circuit board and a method of fabricating the same are provided. The circuit board has a flexible insulation film and a circuit substrate with a bending part. The circuit substrate is a rigid board and includes a plurality of grooves which are distributed in the bending part. Each of the grooves extends to two opposite ends of the circuit substrate in a direction of long axis, and an opening of one of the grooves is exposed to the surface of the circuit substrate. The flexible insulation layer is disposed on the surface of the circuit substrate and covers the opening of the groove, while the groove is not filled with the flexible insulation layer.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/03 - Use of materials for the substrate
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/42 - Plated through-holes

Abstract

A multilayered flexible flat cable includes at least two cable units. Each of the cable units includes a plurality of wires, two insulating films, a plurality of detecting elements, a plurality of crimping terminals and a plurality of cut-off holes. The wires are arranged in parallel between the two insulating films. The detecting elements are respectively electrically connected to the wires. The crimping terminals are respectively crimped to the wires, and the crimping terminals are respectively electrically connected to the wires. The cut-off holes are respectively extended through one of the two insulating films and the wires. One of the two insulating films of one of the cable units is attached to one of the two insulating films of another one of the cable units.

IPC Classes  ?

• H01R 12/69 - Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal deformable terminals e.g. crimping terminals
• H01B 7/08 - Flat or ribbon cables
• H01B 13/06 - Insulating conductors or cables
• H01R 43/04 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for forming connections by deformation, e.g. crimping tool

Abstract

A transmission line structure and a fabricating method of the same are provided. The transmission line structure includes a dielectric layer, a magnet member and a diamagnetism transmission line. The dielectric layer has a transmission cavity. The transmission cavity has an inner wall. The magnet member is disposed in the transmission cavity and is fixed to the inner wall. The magnet member generates a magnetic field. The diamagnetism transmission line can repel the magnetic field to be levitated in the transmission cavity.

IPC Classes  ?

• H01P 3/08 - MicrostripsStrip lines
• H01P 11/00 - Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type

Abstract

A strain sensing structure and a fabricating method of the same are provided. The strain sensing structure includes a flexible substrate, strain resistor members, a first wiring layer and a second wiring layer. The flexible substrate has through holes which are distributed separately. The strain resistor members are respectively disposed in the through holes. The first wiring layer is stacked on an upper side of the flexible substrate and includes first wirings, where the first wirings are separate from each other. The second wiring layer is stacked on a lower side of the flexible substrate and includes second wirings, where the second wirings are separate from each other. Each strain resistor member is electrically connected to one of the first wirings and one of the second wirings, so that the strain resistor members form a series circuit through the first wirings and the second wirings.

IPC Classes  ?

• G01L 1/22 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges

Abstract

A flexible circuit board includes an inner wiring substrate, a first cover film, a second cover film, a first adhesive block, and two outer wiring substrates. The inner wiring substrate includes a dielectric layer, and the dielectric layer includes a first flat portion, a second flat portion, and a foldable portion connecting the first flat portion and the second flat portion. The first cover film is disposed on the first flat portion and located between the first flat portion and the second flat portion. The second cover layer is disposed on the second flat portion and is located between the first flat portion and the second flat portion. The first adhesive block bonds the first cover film and the second cover film, and the inner wiring substrate is located between the two outer wiring substrate. A method for manufacturing the flexible circuit board is also disclosed.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Abstract

A flexible circuit board includes a first circuit substrate having a first metal layer, a second circuit substrate having a second metal layer and at least one electrical connection part. The electrical connection part is electrically connected between the first circuit substrate and the second circuit substrate. The electrical connection part includes a flexible part and at least one liquid metal material. The flexible part is connected between the first circuit substrate and the second circuit substrate and has at least one passage. The passage connects the first metal layer and the second metal layer. The liquid metal material fills the passage and is electrically connected between the first metal layer and the second metal layer.

IPC Classes  ?

• H05K 1/14 - Structural association of two or more printed circuits
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A circuit board includes a circuit base, an electronic component and a heat dissipation block. The circuit base has first and second surfaces, and a groove recessed from the second surface toward the first surface and has first and second side walls, and a bottom part adjacent to the first surface, where the width of the bottom part is smaller than the distance between the first and the second side walls. The circuit base includes first connection wiring and second connection wirings disposed on the first and the second side walls, first and second pads disposed on the bottom part and electrically connected to the first and the second connection wirings. The electronic component is disposed in the groove and is electrically connected to the first and the second connection wirings. The heat dissipation block is disposed in the groove and is thermally coupled to the electronic component.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Abstract

A circuit board includes a glass substrate, a wiring layer, an electronic component, a first build-up structure and a second build-up structure. The glass substrate has a first surface, a second surface opposite to the first surface, and a conductive through hole connecting to the first surface and the second surface. The melting point of the glass substrate is not greater than 600° C. and is greater than the temperature of soldering. The wiring layer and the electronic component are disposed in the glass substrate. The first layer build-up structure is disposed on the first surface and is electrically connected to the conductive through hole. The second build-up structure is disposed on the second surface and is electrically connected to the conductive through hole.

IPC Classes  ?

• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 1/03 - Use of materials for the substrate

Abstract

A transducer circuit board includes a movable circuit board unit, a fixed circuit board unit, suspensions and an actuator circuit board unit. The movable circuit board unit includes a main body and cantilevers extending from the main body. The fixed circuit board unit is disposed outside the movable circuit board unit and has a first side, a second side, a third side, and a fourth side. The suspensions are disposed between the movable circuit board unit and the fixed circuit board unit, and each suspension connects to the movable circuit board unit and the fixed circuit board unit. The actuator circuit board unit is electrically connected to the fixed circuit board unit, and includes an X-axis coil disposed at the first side, a Y-axis coil disposed at the third side, and a Z-axis coil disposed at the fourth side.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H04N 23/54 - Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• H04N 23/68 - Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
• H05K 1/02 - Printed circuits Details
• H05K 3/36 - Assembling printed circuits with other printed circuits

Abstract

A circuit board and a method of fabricating the same are provided. The circuit board has a connecting part and a bending part, and this circuit board includes a plurality of flexible circuit substrates electrically connected to each other and an elastic material. The flexible circuit substrate with a corrugated region is located on the bending part and is disposed on another flexible circuit substrate. A spacing is formed between those two flexible circuit substrates, while this spacing is located at the bending part. The elastic material is located at one of the flexible circuit substrates and located inside the spacing, and the elastic material is located inside a trough of the corrugated region.

IPC Classes  ?

• H05K 3/36 - Assembling printed circuits with other printed circuits
• H05K 1/02 - Printed circuits Details
• H05K 1/03 - Use of materials for the substrate
• H05K 1/14 - Structural association of two or more printed circuits
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A radio frequency transmission circuit board has a bending portion, a signal transmitting portion and a signal receiving portion, and includes a first multilayer structure, a second multilayer structure, a third multilayer structure, a blind hole, a lens and an optical fiber. The blind hole extends from the second multilayer structure to the first multilayer structure. A reflective layer is arranged in the blind hole. The lens is embedded in the first multilayer structure and partially exposed in the blind hole. The optical fiber is embedded in the first multilayer structure and connected to the lens. The bending portion does not include the second multilayer structure and the third multilayer structure. The blind hole and the lens are located in the signal transmitting portion. The optical fiber is located in the bending portion.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• G02B 6/42 - Coupling light guides with opto-electronic elements

Abstract

A pressure sensing flexible circuit board and a method of fabricating the same are provided. The pressure sensing flexible circuit board includes a flexible circuit substrate and a pressure sensing element and a vibrating element disposed on the flexible circuit substrate. The pressure sensing element includes a first piezoelectric layer; plural first interlayer electrical conductor dispersed within the first piezoelectric layer; a first polymer layer adjacent to the first piezoelectric layer; and a first electrode layer disposed on the first piezoelectric layer. The vibrating element includes a multi-layer piezoelectric structure; a second electrode layer disposed on the multi-layer piezoelectric structure; and a second polymer layer adjacent to the multi-layer piezoelectric structure. Each layer of the multi-layer piezoelectric structure includes a second piezoelectric layer and plural second interlayer electrical conductor dispersed within the second piezoelectric layer.

IPC Classes  ?

• G01L 1/16 - Measuring force or stress, in general using properties of piezoelectric devices

Abstract

A method of packaging a chip includes: forming a groove on a circuit board. Providing a chip assembly, the chip assembly includes the chip, conductive pastes, and a deformable member. Placing the chip assembly at a first temperature to cause the deformable member to contract. Placing the chip assembly in the groove; heating the chip assembly at a second temperature. Subjecting the circuit board and the chip assembly to reflow soldering at a third temperature. The third temperature is greater than the second temperature, and the second temperature is greater than the first temperature. The present disclosure further provides a chip packaging structure and a terminal device.

IPC Classes  ?

• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
• H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H01L 23/498 - Leads on insulating substrates

Abstract

A relay circuit board includes a first external circuit structure, a second external circuit structure, an internal circuit structure, a magnetic induction element, and a switch assembly. The internal circuit structure is disposed between the first external circuit structure and the second external circuit structure. The switch assembly is disposed in a first cavity of the first external circuit structure. The magnetic induction element is disposed in a second cavity of the internal circuit structure. The internal circuit structure includes a plurality of multiple coil loops. The coil loops surround the magnetic induction element and are embedded in an inner wall of the second cavity. When the coil loops are energized, the magnetic induction element generates a magnetic field.

IPC Classes  ?

• H01H 47/22 - Circuit arrangements not adapted to a particular application of the relay and designed to obtain desired operating characteristics or to provide energising current for supplying energising current for relay coil
• H01H 49/00 - Apparatus or processes specially adapted to the manufacture of relays or parts thereof
• H01H 50/02 - BasesCasingsCovers
• H01H 50/44 - Magnetic coils or windings

Abstract

A circuit board assembly includes a first circuit board. The first circuit board includes a first substrate, a first circuit structure, a first magnetic layer and a connecting pillar. The first circuit structure is connected to the first substrate. The first magnetic layer is connected to the first circuit structure and makes the first circuit structure be arranged between the first magnetic layer and the first substrate. The first magnetic layer is not electrically connected to the first circuit structure. The connecting pillar is connected to the first circuit structure. The connecting pillar extends in a direction from the first circuit structure toward the first magnetic layer and through the first magnetic layer, and the connecting pillar is electrically connected to the first circuit structure.

IPC Classes  ?

• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 1/02 - Printed circuits Details
• H05K 1/05 - Insulated metal substrate

Abstract

A circuit board includes two first circuit substrates, two second circuit substrates, a magnetic assembly, a first component, and a second component. The first circuit substrate includes a first coil. Two second circuit substrates are disposed between the two first circuit substrates and electrically connects the two first circuit substrates. The second circuit substrate includes a second coil. Two grooves are defined on second circuit substrate. The magnetic assembly is disposed between the two first circuit substrates and between the two second circuit substrates. The magnetic assembly includes a magnetic member. The first circuit substrate can be bent by an interaction of a magnetic field generated by the magnetic assembly and a magnetic field generated by the first coil or the second coil. The present disclosure further provides method for manufacturing the circuit board and a terminal device.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/14 - Structural association of two or more printed circuits
• H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
• H05K 3/36 - Assembling printed circuits with other printed circuits
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

Abstract

A sensing module includes a temperature sensing element, a pressure sensing element surrounded by the temperature sensing element, and a thermal conductive film covering the temperature sensing element. The temperature sensing element includes a first temperature sensing part, a second temperature sensing part, a third temperature sensing part and a fourth temperature sensing part. The first temperature sensing part and the second temperature sensing part are arranged in a first direction. The third temperature sensing part and the fourth temperature sensing part are arranged in a second direction. The first direction is different from the second direction. The pressure sensing element includes a pressure sensing upper part and a pressure sensing lower part. The pressure sensing upper part and the pressure sensing lower part are arranged in a third direction, where an acute angle is formed between the third direction and the first direction.

IPC Classes  ?

• G01L 1/22 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
• G01K 7/22 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a non-linear resistance, e.g. thermistor

Abstract

A pressure-sensitive ink includes an adhesive, conductive particles, and inorganic fillers dispersed in the adhesive. The inorganic fillers include hydrophobic groups, and the inorganic fillers can increase the dispersibility of the conductive particles. The conductive particles can be uniformly dispersed in the adhesive by adding inorganic fillers with hydrophobic groups. The sensitivity and structure stability of a flexible pressure sensing structure are improved, and the noise of the flexible pressure sensing structure is reduced. In addition, the stability and the process yield of the flexible pressure sensing structure are also improved A flexible pressure sensing structure and an electronic device are also disclosed.

IPC Classes  ?

• G01L 1/18 - Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
• G01L 1/22 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges

Abstract

A dispersant is applied in pressure-sensitive materials and has a chemical structural formula of A dispersant is applied in pressure-sensitive materials and has a chemical structural formula of A dispersant is applied in pressure-sensitive materials and has a chemical structural formula of Ar1 represents a group selected from a group consisting of A dispersant is applied in pressure-sensitive materials and has a chemical structural formula of Ar1 represents a group selected from a group consisting of A dispersant is applied in pressure-sensitive materials and has a chemical structural formula of Ar1 represents a group selected from a group consisting of and any combination thereof. Ar2 represents a group selected from a group consisting of A dispersant is applied in pressure-sensitive materials and has a chemical structural formula of Ar1 represents a group selected from a group consisting of and any combination thereof. Ar2 represents a group selected from a group consisting of A dispersant is applied in pressure-sensitive materials and has a chemical structural formula of Ar1 represents a group selected from a group consisting of and any combination thereof. Ar2 represents a group selected from a group consisting of and any combination thereof. A degree of polymerization x and a degree of polymerization y are respectively greater than zero. A composition having the dispersant and a pressure-sensitive film formed by the composition are also provided.

IPC Classes  ?

• C09D 133/14 - Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
• C08F 220/28 - Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
• C08K 3/04 - Carbon
• C09D 7/61 - Additives non-macromolecular inorganic

Abstract

A provided circuit board includes an embedded capacitor, a substrate, and an insulating layer. The embedded capacitor includes a dielectric layer, a first electrode and a second electrode. The dielectric layer has a first side surface, a second side surface adjacent to the first side surface, a third side surface opposite to the first side surface, and a fourth side surface opposite to the second side surface. The first and second electrodes respectively cover the first and third side surfaces. The substrate surrounds the embedded capacitor and is physically connected to the second and fourth side surfaces. The first electrode is between the first side surface and a sidewall of the substrate. The insulating layer covers the embedded capacitor and the substrate and extends from an upper surface to a lower surface of the substrate along the first electrode and the sidewall of the substrate.

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor

Abstract

A stretchable circuit board assembly and a method for manufacturing the same are provided. The circuit board assembly includes a flexible circuit board and an outer circuit board. The flexible circuit board includes a first base layer and an inner wiring layer. The flexible circuit board is divided into a connecting area and a stretchable area. The inner wiring layer within the connecting area includes an electrical connecting portion exposed from the outer circuit board. The stretchable area is configured to deform into at least one bent portion. The bent portion is used to cause the electrical connecting portion to stretch relative to the outer circuit board. The outer circuit board includes a second base layer and an outer wiring layer. A surface of the second base layer away from the outer wiring layer defines at least one blind groove. The blind groove is configured to receive the bent portion.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Abstract

A transducer wiring board includes a movable unit, a fixing unit, plural suspensions, plural X-axis actuators, and plural Y-axis actuators. The movable unit includes a first movable section and plural second movable sections. The second movable sections are disposed on two sides of the first movable section along a Y axial direction. The fixing unit is spaced apart from the movable unit and includes plural fixing sections. The fixing sections are disposed on another two sides of the first movable section along an X axial direction. Each suspension connects the movable unit and the fixing unit. Each X-axis actuator connects one of the fixing sections and the first movable section. Each Y-axis actuator connects the first movable section and one of the second movable section.

IPC Classes  ?

• G03B 5/02 - Lateral adjustment of lens
• H02N 1/00 - Electrostatic generators or motors using a solid moving electrostatic charge carrier

Abstract

A circuit board includes a first circuit layer, a second circuit layer, a third circuit layer, a first differential line group, a second differential line group, a third differential line group, and a fourth differential line group. The first differential line group and the third differential line group are disposed between the first circuit layer and the second circuit layer. The second differential line group and the fourth differential line group are disposed between the first circuit layer and the third circuit layer. A first distance between the first differential line group and the first circuit layer is less than a third distance between the third differential line group and the first circuit layer. A second distance between the second differential line group and the first circuit layer is less than a fourth distance between the fourth differential line group and the first circuit layer.

IPC Classes  ?

• H05K 1/03 - Use of materials for the substrate
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A flexible circuit board and a method for fabricating the same are provided. The flexible circuit board includes an insulation substrate with two trenches on its two opposite end surfaces separately. A signal wire is disposed in the insulation substrate, and thus the insulation substrate surrounds the signal wire. Two flexible circuit substrates are separately located on two opposite surfaces of the insulation substrate, and each flexible circuit substrate includes a conductive layer and a power layer. The conductive layer is extended from one surface to end surfaces of the insulation substrate, and then is extended to the trenches along the end surfaces. The power layer is located between the conductive layer and the insulation substrate and is electrically connected to the conductive layer. In each trench, one conductive layer is connected to the other conductive layer, and two conductive layers are electrically connected to each other.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A circuit board with embedded resistors and a method for fabricating the same are provided. The circuit board includes the circuit substrate and the variable resistor region. The variable resistor region includes the first resistor layer, the second resistor layer and the liquid metal material. The first resistor layer is electrically connected to the circuit substrate, and the second resistor layer overlaps the first resistor layer. The liquid metal material is located on and is electrically connected to the first resistor layer. The liquid metal material is spaced from the second resistor layer without any electrical connection under the initial temperature. The liquid metal material is electrically connected to the second resistor layer under the first temperature which is higher than the initial temperature.

IPC Classes  ?

• H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• H05K 3/42 - Plated through-holes

Abstract

A circuit board includes a main board, a thermistor layer, a plurality of n-type semiconductor units and a plurality of p-type semiconductor units. The main board includes a first external structure, a second external structure, and an internal structure disposed between the first external structure and the second external structure. The internal structure includes a first internal circuit layer, a second internal circuit layer, and an insulating layer disposed between the first internal circuit layer and the second internal circuit layer. The thermistor layer is disposed on the insulating layer and the first internal circuit layer. The n-type semiconductor units and the p-type semiconductor units are electrically connected to the second internal circuit layer and the second external structure, in which the n-type semiconductor units and the p-type semiconductor units are alternately arranged in one direction.

IPC Classes  ?

• H01L 23/38 - Cooling arrangements using the Peltier effect
• H01L 23/00 - Details of semiconductor or other solid state devices
• H10N 19/00 - Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups

Abstract

A flexible circuit board and a method of fabricating the same are provided. The flexible circuit board includes a flexible substrate, in which the flexible substrate includes a first portion, two second portions, two third portions, two first bending portion and two second bending portions. The flexible circuit board includes first connecting circuit layers extending from an upper surface of the first portion through the first portions to upper surfaces of the second portions, second connecting circuit layers extending from lower surfaces of the second portions through the third portions to lower surfaces of the third portions, first circuit layers disposed on the upper surface of the first portion and second circuit layers disposed on the lower surfaces of the third portions. Therefore, the flexible circuit board can achieve no-via-hole and high density for circuit board.

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/189 -
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/36 - Assembling printed circuits with other printed circuits

Abstract

A flexible circuit board and a method of fabricating the same are provided. The flexible circuit board includes a first dielectric layer, a second dielectric layer disposed on the first dielectric layer, a signal layer disposed within the second dielectric layer, a third dielectric layer disposed on the second dielectric layer, and liquid metal composites. The signal layer includes a trace and a pad. The liquid metal composites are disposed to surround the trace, but not enclose the pad, thereby satisfying requirements of the signal layer for great bending numbers and high frequency signal transmission.

IPC Classes  ?

• H05K 1/03 - Use of materials for the substrate
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Abstract

A circuit board includes a first multilayered structure, a second multilayered structure, a third multilayered structure, a first adhesive layer, a second adhesive layer and a plurality of hollow portions. The first adhesive layer is disposed between the first multilayered structure and the second multilayered structure. The second adhesive layer is disposed between the second multilayered structure and the third multilayered structure, wherein the second multilayered structure is arranged between the first adhesive layer and the second adhesive layer. The plurality of hollow portions are formed on at least one of the first multilayered structure, the second multilayered structure and the third multilayered structure. When the circuit board is bent, a force is applied on the plurality of hollow portions to make the plurality of hollow portions deform and change a cross-sectional area of each of the plurality of hollow portions.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits

Abstract

A circuit board includes an inner wiring substrate and a first side plate. The inner wiring substrate includes a plurality of first connection pads at a side. The first side plate is disposed on the inner wiring substrate and defines a plurality of first holes exposing the first connection pads. Each first hole includes a first end facing the first connection pad and a second end facing away from the first connection pad. A central distance between two adjacent first connection pads is greater than a center distance between two second ends of two adjacent first holes. The first holes are filled with first conductive bodies, each first conductive body is electrically connected to the first connection pad and extends out of the first hole to form a connection portion. A method for manufacturing the circuit board and a display module are also disclosed.

IPC Classes  ?

• H05K 5/00 - Casings, cabinets or drawers for electric apparatus
• H05K 1/05 - Insulated metal substrate
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

Abstract

A circuit board includes a circuit substrate. The circuit substrate includes an insulating substrate and an electronic component embedded therein. The insulating substrate defines two first slots. A first phase change material fills in the two first slots and thermally connects to the electronic component. A first wiring layer is formed on a surface of the insulating substrate, the first wiring layer covers the two first slots and thermally connects to the first phase change material. A second wiring layer is formed on another surface of the insulating substrate. The second wiring layer includes a plurality of wiring portions and a wiring slot formed between adjacent wiring portions. The electronic component electrically connects to the second wiring portion. A second phase change material fills in at least one wiring slot and thermally connects a portion of the wiring portions together to form a heat dissipation zone.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
• H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor

Abstract

A packaging substrate includes a circuit board defining a through groove. The circuit board includes an insulating body and a first wiring layer formed on the insulating body. A colloid is formed in the through groove. The packaging substrate further includes at least one lead. Each lead includes a lead body and a lead terminal connected to an end of the lead body. The lead terminal protrudes from the colloid. Another end of the lead body away from the lead terminal is electrically connected to the circuit board, and the colloid covering the lead body.

IPC Classes  ?

• H10W 70/05 -
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 1/185 -
• H05K 3/321 -
• H10W 90/00 -

Abstract

A method of manufacturing a circuit board assembly, including: providing a circuit substrate, the circuit substrate having a base layer, a wiring layer formed on the base layer, and a conductive casing formed on the wiring layer, the conductive casing defining a cavity for exposing the wiring layer; mounting an electronic component in the cavity, the electronic component electrically connected to the exposed wiring layer; filling a heat conductive medium in the cavity, the electronic component immersed in the heat conductive medium; forming a conductive cover on the conductive casing, the conductive cover enclosing the conductive casing.

IPC Classes  ?

• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Abstract

The disclosure provides a circuit board assembly, which includes a core layer, an electronic component, a first shielding ring wall, a second shielding ring wall, a first circuit layer, a second circuit layer, a first insulating layer and a plurality of shielding columns. The core layer has an accommodating space, in which the accommodating space has an inner sidewall. The electronic component is disposed in the accommodating space. The first shielding ring wall is disposed in the accommodating space and covers the inner sidewall, in which the first shielding ring wall surrounds the electronic component and is not in contact with the electronic component. The second shielding ring wall is disposed in the core layer and surrounds the first shielding ring wall. The core layer is disposed between the first circuit layer and the second circuit layer. The shielding columns are disposed in the first insulating layer.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Abstract

The present application provides a circuit board and a manufacturing method thereof. The manufacturing method includes: providing a stacked board; the stacked board includes a third conducting circuit, a second substrate, a first conducting circuit, a first substrate, and a second conducting circuit, which are stacked disposed in that order; defining several through holes on a surface of the stacked board along a stacked direction of the stacked board; and manufacturing antenna conductors in the through holes. The antenna conductors are disposed in the through holes on a surface of the stacked board, the antenna conductors on different layers are connected to corresponding conducting circuits, some of the antenna conductors are directly connected with the conducting circuit. A loss of signals while transmitting is reduced, and the circuit board including the antenna structure is changed from an up-down structure into a left-right structure for reducing a board thickness.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
• H01Q 9/04 - Resonant antennas

Abstract

A method for manufacturing a circuit board includes disposing an electronic component in a recess formed in a first circuit substrate, and bonding a second circuit substrate to the first circuit substrate to form a third circuit substrate with the electronic component embedded. The method includes forming an opening in the third circuit substrate to expose the electronic component and an inner surface of the third circuit substrate. The method includes disposing an insulation case in the opening. The insulation case has a first segment directly contacting the electronic component, a second segment facing the inner surface, an inner wall between the first and second segments, a first chamber surrounded by the first segment and the inner wall, and a second chamber surrounded by the second segment and the inner wall. The method includes adding a heat-exchanging fluid into the first chamber.

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Abstract

A circuit board utilizing thermocouples for improved heat dissipation performance from circuit boards includes a heat dissipation module which itself includes a first circuit substrate, a thermocouple, and a second circuit substrate. The first circuit substrate includes a first wiring layer comprising first and second wiring portions. The thermocouple includes a P-type and an N-type semiconductor. The second circuit substrate includes a second wiring layer with a third wiring portion. Conductive members electrically connect the P-type semiconductor with the first wiring portion, connect the P-type semiconductor with the third wiring portion, connect the N-type semiconductor with the second wiring portion, and connect the N-type semiconductor with the third wiring portion, to transfer away heat generated by working elements mounted on the board.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
• H05K 3/46 - Manufacturing multi-layer circuits
• H10N 10/852 - Thermoelectric active materials comprising inorganic compositions comprising tellurium, selenium or sulfur

Abstract

A buried thermistor includes a lower substrate, an upper substrate, and a number of thermistor stacks. Each thermistor stack includes two resistor subjects. Each resistor subject includes a base layer, a medium layer, a metal layer, a resistor layer, a nanometal layer, and a conductive layer. Applicable material of the resistor layer becomes more diverse by disposing the number of thermistor stacks, and the buried thermistor shows variable thermal sensitivity.

IPC Classes  ?

• H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
• H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
• H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors

Abstract

A method for manufacturing a photoelectric composite circuit board, includes providing a copper-clad carrier and an intermediate circuit, the copper-clad carrier includes a substrate layer and a bottom copper layer, a first groove is defined on the intermediate circuit. Forming an optical fiber in the first groove. Forming a first accommodating groove and a second accommodating groove at each end the optical fiber. Accommodating a first coupling element in the first accommodating groove. Removing the substrate layer. Removing the bottom copper layer corresponding to the optical fiber, the intermediate circuit on one side of the optical fiber and the bottom copper layer forming a first circuit substrate, the intermediate circuit on another side of the optical fiber and the bottom copper layer forming a second circuit substrate. Electrically connecting a chip to the first circuit substrate, and electrically connecting an electronic component to the second circuit substrate.

IPC Classes  ?

• G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
• G02B 6/13 - Integrated optical circuits characterised by the manufacturing method
• H05K 1/02 - Printed circuits Details
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A wiring substrate includes a first insulating layer with a first opening, a second insulating layer with a second opening, a high-frequency wiring layer, a first wiring layer, a second wiring layer, and a plurality of conductive pillars. The high-frequency wiring layer including a high-frequency trace is sandwiched between the first insulating layer and the second insulating layer. The first opening and the second opening expose two sides of the high-frequency trace respectively. The high-frequency trace has a smooth surface which is not covered by the first insulating layer and the second insulating layer and has the roughness ranging between 0.1 and 2 μm. The first insulating layer and the second insulating layer are all located between the first wiring layer and the second wiring layer. The conductive pillars are disposed in the second insulating layer and connected to the high-frequency trace.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A circuit board with embedded components and a method of fabricating the same are provided. The method includes coating an adhesive layer over a substrate, and disposing electronic components on the adhesive layer. Subsequently, after disposing a dielectric layer over the electronic components and the adhesive layer, the substrate and the adhesive layer are removed to form an embedded layer. Then, a wiring layer is formed on the electronic components, and conductive connecting components are formed within the dielectric layer. A cover layer is laminated over the dielectric layer and the wiring layer. Therefore, the electronic components are embedded within the dielectric layer, and the wiring layer electrically connecting to the electronic components are precisely located on a surface of the embedded layer.

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A circuit board includes an inner circuit substrate and an outer circuit substrate electrically connected to the inner circuit substrate. The outer circuit substrate includes an outer dielectric layer and an outer circuit layer facing the inner circuit substrate embedded in the outer dielectric layer. A portion of the outer circuit layer facing away from the inner circuit substrate protruding from the outer dielectric layer. The circuit board can increase contact area between the outer circuit layer and the outer dielectric layer, improving adhesion between the outer circuit layer and the outer dielectric layer, and reducing a thickness of the outer circuit substrate, thereby reducing the overall thickness of the circuit board.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 1/05 - Insulated metal substrate
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
• H05K 3/42 - Plated through-holes

Abstract

A circuit board includes a dielectric substrate, a signal line and a pair of ground wires. The dielectric substrate includes a base and an elevated platform protruding from an upper surface of the base. The signal line is conformally disposed on the dielectric substrate and includes a first segment disposed on an upper surface of the elevated platform, a second segment extending on the upper surface of the base, and a third segment disposed on a sidewall of the elevated platform and connecting the first segment and the second segment. The pair of ground wires are disposed on the dielectric substrate and are spaced apart from the signal line. A projection of the second segment of the signal line on the upper surface of the base partly overlaps projections of the pair of ground wires on the upper surface of the base.

IPC Classes  ?

• H01P 3/00 - WaveguidesTransmission lines of the waveguide type
• H01P 3/02 - WaveguidesTransmission lines of the waveguide type with two longitudinal conductors
• H05K 1/02 - Printed circuits Details
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Abstract

The disclosure provides a circuit board assembly, which includes a core layer, an electronic component, a first shielding ring wall, a second shielding ring wall, a first circuit layer, a second circuit layer, a first insulating layer and first shielding columns. The core layer includes an accommodating space, and the accommodating space has an inner side wall. The first shielding ring wall is disposed in the accommodating space and covers the inner side wall, in which the first shielding ring wall surrounds the electronic component. The second shielding ring wall is disposed in the core layer and surrounds the first shielding ring wall. The core layer is disposed between the first circuit layer and the second circuit layer. The second circuit layer is disposed between the first insulating layer and the core layer. The first shielding columns are disposed in the first insulating layer.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 3/46 - Manufacturing multi-layer circuits
• H01L 23/552 - Protection against radiation, e.g. light

Abstract

The disclosure provides a circuit board assembly, which includes a core layer, an electronic component, a first shielding ring wall, a second shielding ring wall, a first circuit layer, a second circuit layer, a first insulating layer and a plurality of shielding columns. The core layer has an accommodating space, in which the accommodating space has an inner sidewall. The electronic component is disposed in the accommodating space. The first shielding ring wall is disposed in the accommodating space and covers the inner sidewall, in which the first shielding ring wall surrounds the electronic component and is not in contact with the electronic component. The second shielding ring wall is disposed in the core layer and surrounds the first shielding ring wall. The core layer is disposed between the first circuit layer and the second circuit layer. The shielding columns are disposed in the first insulating layer.

IPC Classes  ?

• H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

A circuit board assembly includes an inner circuit substrate, a first outer circuit substrate, a second outer circuit substrate, a heat conducting block, an electronic component, and a reinforcing plate. The first outer circuit substrate and second outer circuit substrate are disposed on surfaces of the inner circuit substrate. The heat conducting block penetrates through the inner circuit substrate and connects to the first outer circuit substrate and the second outer circuit substrate. The heat conducting block made of aluminum nitride. An electronic component at least partially accommodated in the heat conducting block. The reinforcing plate is disposed on a surface of the second outer circuit substrate corresponding to the electronic component and faces away from the electronic component. The present disclosure further provides a method for manufacturing the circuit board assembly.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Abstract

A battery assembly includes a circuit board and a battery cell. The circuit board includes a first dielectric layer, a second dielectric layer, an adhesive film, a bus bar, a first copper block, a fuse, and a second copper block. The adhesive film is located between the first dielectric layer and the second dielectric layer and includes cavities. The first copper block and the bus bar are on the first dielectric layer. The second copper block and the fuse are on the second dielectric layer. The circuit board is divided into heat dissipation areas and bending areas which are connected and alternately arranged, the heat dissipation areas and the bending areas enclose a holding groove. The bus bar and the first block copper are accommodated in the holding groove. The battery cell is accommodated in the holding groove. A battery module and a manufacturing method are also disclosed.

IPC Classes  ?

• H01M 50/519 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing comprising printed circuit boards [PCB]
• H01M 50/505 - Interconnectors for connecting terminals of adjacent batteriesInterconnectors for connecting cells outside a battery casing comprising a single busbar
• H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
• H01M 50/583 - Devices or arrangements for the interruption of current in response to current, e.g. fuses
• H01M 10/04 - Construction or manufacture in general
• H01M 10/613 - Cooling or keeping cold
• H01M 10/6551 - Surfaces specially adapted for heat dissipation or radiation, e.g. fins or coatings

Abstract

A wiring substrate includes a first insulating layer with a first opening, a second insulating layer with a second opening, a high-frequency wiring layer, a first wiring layer, a second wiring layer, and a plurality of conductive pillars. The high-frequency wiring layer including a high-frequency trace is sandwiched between the first insulating layer and the second insulating layer. The first opening and the second opening expose two sides of the high-frequency trace respectively. The high-frequency trace has a smooth surface which is not covered by the first insulating layer and the second insulating layer and has the roughness ranging between 0.1 and 2 μm. The first insulating layer and the second insulating layer are all located between the first wiring layer and the second wiring layer. The conductive pillars are disposed in the second insulating layer and connected to the high-frequency trace.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/03 - Use of materials for the substrate
• H05K 3/42 - Plated through-holes
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The circuit board includes a heat dissipation substrate, an insulating layer on the heat dissipation substrate, an electronic component, a base layer on the insulating layer, and a circuit layer on the base layer. The heat dissipation substrate includes a phase change structure and a heat conductive layer wrapping the phase change structure. The heat dissipation substrate defines a first through hole. The insulating layer defines a groove for receiving the electronic component. A second through hole is defined in the circuit layer, the base layer, and the insulating layer. A bottom of the second through hole corresponds to the heat conductive layer. A heat conductive portion is disposed in the second through hole.

IPC Classes  ?

• H05K 1/03 - Use of materials for the substrate
• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 3/42 - Plated through-holes

Abstract

A method for manufacturing a circuit board including the following steps: providing a flexible double-sided metal-clad laminate including a first metal foil, a flexible dielectric layer, and a second metal foil. A carrier is attached to the second metal foil. A first wiring layer including a first wiring region and a second wiring region is formed by the first metal foil. The first wiring region includes a first connecting pad, and the second wiring region includes a connecting pad. A plurality of rigid dielectric blocks surrounded to form an interval and a first groove exposing the first connecting pad is pressed on the flexible dielectric layer to form a rigid dielectric layer. An electronic component is fixed the first groove. The carrier is removed. The intermediate structure is bent along the interval and pressed. A second wiring layer is formed by the second metal foil.

IPC Classes  ?

• H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits

Abstract

A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The circuit board includes a heat dissipation substrate, an insulating layer on the heat dissipation substrate, an electronic component, a base layer on the insulating layer, and a circuit layer on the base layer. The heat dissipation substrate includes a phase change structure and a heat conductive layer wrapping the phase change structure. The heat dissipation substrate defines a first through hole. The insulating layer defines a groove for receiving the electronic component. A second through hole is defined in the circuit layer, the base layer, and the insulating layer. A bottom of the second through hole corresponds to the heat conductive layer. A heat conductive portion is disposed in the second through hole.

IPC Classes  ?

• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 1/03 - Use of materials for the substrate
• H05K 3/42 - Plated through-holes

Abstract

A method for manufacturing a circuit board, includes: stacking a first peelable film on a second peelable film, and disposing fluffy carbon nanotubes between the first peelable film and the second peelable film, thereby obtaining a carbon nanotube layer; pressing the first peelable film, the carbon nanotube layer, and the second peelable film to compact the fluffy carbon nanotubes, thereby obtaining a thermal conductive layer; removing the first peelable film, and disposing a first adhesive layer, a first dielectric layer, and a first circuit layer on a side of the thermal conductive layer away from the second peelable film; removing the second peelable film, and disposing a second adhesive layer, a second dielectric layer, and a second circuit layer on a side of the thermal conductive layer away from the first adhesive layer; mounting an electronic component on the first circuit layer.

IPC Classes  ?

• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
• H05K 1/02 - Printed circuits Details
• B82Y 40/00 - Manufacture or treatment of nanostructures

Abstract

A circuit board includes a circuit substrate, a solder, and a surrounding portion. The circuit substrate includes a connecting pad. The solder is formed on a surface of the connecting pad. The surrounding portion is formed on the surface of the connecting pad and cooperates with the connecting pad to form a groove receiving the solder. The surrounding portion surrounds the solder and is spaced from the solder. A method for manufacturing a circuit board is also provided.

IPC Classes  ?

• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 1/02 - Printed circuits Details
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

A circuit board includes a circuit substrate, at least one metal pad, and a tin bar corresponding to each of the at least one metal pad. Each of the at least one metal pad is formed on a side of the circuit substrate and is electrically connected to the circuit substrate. A surface of the metal pad facing away from the circuit substrate is recessed toward the circuit substrate to from a recess. The tin bar is received in the recess. A method for manufacturing a circuit board is also provided.

IPC Classes  ?

• H05K 1/03 - Use of materials for the substrate
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/28 - Applying non-metallic protective coatings

Abstract

A flexible circuit board includes two first wiring boards, a first adhesive, and a first conductive structure. Each of the two first wiring boards includes a first bent portion, and two first bent portions of the two wiring boards is connected to each other. The first adhesive layer is sandwiched between the two first bent portions. The first conductive structure penetrates the two first bent portions and the first adhesive layer and electrically connects the two first bent portions.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
• H05K 3/22 - Secondary treatment of printed circuits
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A circuit board utilizing the better and faster performance of optical signals includes interconnected first, second, and third areas. The first area includes a first circuit substrate, and a first coupling element and a chip connected thereon. The second area includes an optical fiber within an insulating layer. The third area includes a second circuit substrate, and a second coupling element and an electronic element connected thereon. The first coupling element and the second coupling element are optically aligned with the optical fiber for signal reception and transmission. A method for manufacturing such composite circuit board is also disclosed.

IPC Classes  ?

• G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
• G02B 6/13 - Integrated optical circuits characterised by the manufacturing method
• H05K 1/02 - Printed circuits Details
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A circuit board includes a first outer wiring layer, a circuit substrate, and a second outer wiring layer stacked. The circuit substrate includes a first inner wiring layer, an insulating layer, and a second inner wiring layer stacked. A plurality of thermally conductive pillars is arranged at intervals on the first inner wiring layer, a liquid storage space is formed between every two adjacent thermally conductive pillars, and a thermally conductive agent is received in the liquid storage space. The first outer wiring layer is formed on the plurality of thermally conductive pillars. The second outer wiring layer is formed the second inner wiring layer. A first groove penetrates the second outer wiring layer, the second inner wiring layer and the insulating layer, exposes a portion of the first inner wiring layer, and corresponds to the thermally conductive pillars. At least one heating element is installed in the first groove.

IPC Classes  ?

• H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 1/02 - Printed circuits Details
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

A method for manufacturing a fixing belt for a wearable device, includes providing a flexible circuit board including a first area, a second area, and a pad in the first area; disposing an insulating layer on the flexible circuit board, the insulating layer being disposed in the second area; forming an electric conductive portion in the insulating layer; disposing a first protective layer and a second protective layer on opposite surfaces of the flexible circuit board, the electric conductive portion being between the flexible circuit board and the first protective layer; mounting an electronic component on the pad. A portion of the fixing belt containing the second area is a plug-in area, and the plug-in area is configured to be engaged with a device body of the wearable device, the electric conductive portion is disposed in the plug-in area.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A method for manufacturing a circuit board embeds a portion of an outer circuit layer in an outer dielectric layer which increases contact area between the outer circuit layer and the outer dielectric layer, improving adhesion between the outer circuit layer and the outer dielectric layer, and reducing a thickness of the outer circuit substrate, thereby reducing the overall thickness of the finished circuit board.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
• H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
• H05K 3/42 - Plated through-holes
• H05K 3/46 - Manufacturing multi-layer circuits
• H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H01L 23/498 - Leads on insulating substrates
• G02B 6/10 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 1/05 - Insulated metal substrate
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Abstract

A circuit board includes a substrate, a first inner circuit layer, a second inner circuit layer, a first insulating layer, a first optical fiber extending along a first direction, an optical component, an electrical component, a transparent insulating layer, a first inclined surface, a first reflective layer, a second inclined surface, a second reflective layer, and a second optical fiber extending along a second direction.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• G02B 6/36 - Mechanical coupling means
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A method for manufacturing a circuit board is provided, which includes a wiring board. The wiring board includes a first wiring layer, a dielectric layer and a second wiring layer stacked, and conductive pillars. Each conductive pillar connects the first wiring layer and the second wiring layer. A groove is recessed from a side of the dielectric layer facing away from the second wiring layer, and includes first recessed portion and second recessed portions recessed from a sidewall of the first recessed portion. An end surface of each conductive pillar is exposed from the at least two spaced second recessed portions, and a sidewall of each pillar close to the first recessed portion is exposed from the second recessed portion. An one electronic component is received in the first recessed portion, and is connected to the conductive pillars through electrical connecting portions received in the second recessed portions.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A circuit board includes a substrate, a first inner circuit layer, a second inner circuit layer, a first insulating layer, a first optical fiber extending along a first direction, an optical component, an electrical component, a transparent insulating layer, a first inclined surface, a first reflective layer, a second inclined surface, a second reflective layer, and a second optical fiber extending along a second direction.

IPC Classes  ?

• H05K 13/00 - Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• H05K 1/02 - Printed circuits Details
• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
• G02B 6/36 - Mechanical coupling means

Abstract

A method for manufacturing a flexible circuit board includes providing a first laminated structure, the first laminated structure including two first wiring boards, a first adhesive layer sandwiched between the two first wiring boards, and a first conductive structure. The first conductive structure penetrates the two first wiring boards and the first adhesive layer and electrically connects the two first wiring boards. The first adhesive layer defines a first opening, the first opening includes a first edge away from the first conductive structure. The first laminated structure is cut along the first edge and then the two first wiring boards are unfolded. A flexible circuit board manufactured by such method is also disclosed.

IPC Classes  ?

• H05K 1/00 - Printed circuits
• H05K 1/02 - Printed circuits Details
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
• H05K 3/22 - Secondary treatment of printed circuits
• H05K 3/28 - Applying non-metallic protective coatings
• H05K 3/36 - Assembling printed circuits with other printed circuits
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits

Abstract

A method for manufacturing a board-to-board connecting structure, including providing a first circuit board, including a first dielectric layer, a second dielectric layer stacked on the first dielectric layer, and a first wiring layer sandwiched between the first dielectric layer and the second dielectric layer. A second circuit board is provided, including a third dielectric layer, a fourth dielectric layers stacked on the third dielectric layer, and a second wiring layer sandwiched between the third dielectric layer and the fourth dielectric layer. The first step and the fourth dielectric layer are bonded through a first adhesive layer. The third step and the dielectric layer are bonded through a second adhesive layer. The second step and the fourth step are bonded through the conductive layer.

IPC Classes  ?

• H01R 13/40 - Securing contact members in or to a base or caseInsulating of contact members
• H01R 12/58 - Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
• H01R 12/52 - Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
• H01R 12/71 - Coupling devices for rigid printing circuits or like structures
• H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor

Abstract

A circuit board includes a wiring board. The wiring board includes a first wiring layer, a dielectric layer and a second wiring layer stacked, and a plurality of spaced conductive pillars. Each conductive pillar connects the first wiring layer and the second wiring layer. A groove is recessed from a side of the dielectric layer facing away from the second wiring layer, and includes first recessed portion and at least two spaced second recessed portions recessed from a sidewall of the first recessed portion. An end surface of each conductive pillar is exposed from the at least two spaced second recessed portions, and a sidewall of each pillar close to the first recessed portion is exposed from the second recessed portion. At least one electronic component is received in the first recessed portion, and is connected to the conductive pillars through electrical connecting portions received in the second recessed portions.

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 1/02 - Printed circuits Details

Abstract

A method for manufacturing the ultrathin heat dissipation structure includes providing a copper clad sheet, the copper clad sheet comprising an insulation layer and a copper clad layer; stamping the copper clad sheet to form a plurality of containing grooves and a plurality of ribs around each of the plurality of containing grooves, the cooper clad layer is used as an inner surface of the containing groove and the insulation layer is then an outer surface of the containing groove; providing bond blocks on each of the plurality of ribs; infilling phase-change material into the containing grooves of the copper clad sheet; providing a cover, pressing the cover to the bond blocks, the cover is fixed with the copper clad sheet by the bond blocks, the cover seals the containing grooves, and the phase-change material is received in the containing grooves; and solidifying the bond blocks.

IPC Classes  ?

• B21D 39/00 - Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by platingTube expanders
• B29L 31/18 - Heat-exchangers or parts thereof
• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
• H01L 23/427 - Cooling by change of state, e.g. use of heat pipes
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A method of manufacture of a circuit board without annular through-hole rings and thus allowing a higher component density includes a base layer, a first wire pattern layer, and a second wire pattern layer on both sides of the base layer. A portion of the base layer not covered by the first wire pattern layer defines at least one first hole. The circuit board further includes a wire layer. The wire layer includes at least a first portion and a second portion connecting to the first portion. The first portion is filled in the first hole. The second portion is formed on the first portion extending away from the base layer. A diameter of the second portion is less than an aperture diameter of the first hole. The wire layer is electrically conductive between the first wire pattern layer and the second wire pattern layer through the first portion.

IPC Classes  ?

• H05K 1/09 - Use of materials for the metallic pattern
• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

Abstract

An ultrathin heat dissipation structure includes a copper clad sheet, a cover, a number of bond blocks, and a phase-change material. The copper clad sheet is given containing grooves and a number of ribs round each containing groove. The containing grooves are formed by stamping. The copper clad sheet includes an insulation layer. The copper clad layer is inner surface of the containing groove. The bond blocks are arranged on the ribs and cover is pressed to the stamped copper clad sheet and secured using the bond blocks. The containing grooves form sealing cavities and the phase-change material in the sealed cavity gathers and transfers out any heat generated by components.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A printed circuit board includes a first printed circuit substrate and a second printed circuit substrate. The first printed circuit substrate includes a substrate layer and a first conductive circuit layer. The first conductive circuit layer is formed on the substrate layer. The substrate layer includes at least two first grooves. The first conductive circuit layer includes at least one signal wire. The first grooves are defined in both sides of the signal wire. The second printed circuit substrate is formed on the first printed circuit substrate. The second circuit substrate includes a third copper layer. A second groove is defined in the third copper layer. The first grooves are opposite to the second groove. The first grooves and the second groove form a space.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/02 - Printed circuits Details
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A flexible circuit board includes an insulating layer, a linear signal line, a plurality of grounding lines, a metal coating layer, a circuit layer and an electromagnetic shielding layer. The insulating layer includes a first face and a second face. The metal coating layer covers the linear signal line on the first face. The metal coating layer has a thickness less than that of the linear signal line, and an electrical conductivity larger than that of the linear signal line. The grounding lines are at two opposite sides of the linear signal line on the first face. The circuit layer is on the second face. The electromagnetic shielding layer covers the linear signal line and the grounding lines. The linear signal line and the grounding lines are between the electromagnetic shielding layer and the circuit layer. A method for manufacturing the flexible circuit board is also provided.

IPC Classes  ?

• H05K 3/28 - Applying non-metallic protective coatings
• H05K 1/02 - Printed circuits Details
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Abstract

A flexible circuit board includes two copper clad laminates, a circuit pattern and two bonding layers. Each copper clad laminate includes an insulating base and an outer circuit layer. The circuit pattern is located between the two copper clad laminates. The circuit pattern includes a linear signal line, two grounding lines located at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and the grounding lines. Each bonding layers is located between the circuit pattern and a corresponding copper clad laminate. Each boding layer defines a slot without adhesive therein. The bonding layers are spaced from the linear signal line by the slots. The slots and the hollow areas cooperatively define an air medium layer enclosing the linear signal line. A method for manufacturing the flexible circuit board is also provided.

IPC Classes  ?

• H05K 1/00 - Printed circuits
• H05K 1/02 - Printed circuits Details
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Abstract

A circuit board includes a core layer, at least one passive component, a first and a second conductive wire layers, at least one contact pad, and a resin packing layer. The core layer defines at least one through hole to receive the passive component. The first and the second conductive wire layers are connected to two opposite surfaces of the core layer. Each contact pad is positioned between and connected to one passive component and the first conductive wire layer. The resin packing layer is filled among the core layer, each passive component, each contact pad, the first and the second conductive wire layers. The resin packing layer can connect the first and the second conductive wire layers to the core layer, and connect the core layer, each passive component, and each contact pads to each other.

IPC Classes  ?

• H01K 3/10 - Machines therefor
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/02 - Printed circuits Details
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 1/03 - Use of materials for the substrate
• H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

Abstract

The present disclosure relates to a method for manufacturing a printed circuit board. The method includes the steps as follows. First, a substrate including a base layer and a copper foil layer on a surface of the base layer is provided. Second, a conductive layer is formed on portions of the copper foil layer. Third, portions of the copper foil layer exposed from the conductive layer are removed by an etching process, and the conductive layer is thinner by the etching process. The reserved portions of the copper foil layer and the conductive layer form a conductive pattern to obtain a printed circuit board without plating wires. A printed circuit board without plating wires made by the above method is also provided.

IPC Classes  ?

• H05K 1/09 - Use of materials for the metallic pattern
• H05K 3/24 - Reinforcing of the conductive pattern
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• H05K 3/42 - Plated through-holes

Abstract

A flexible circuit board includes a first base layer, a circuit layer, a second base layer and a bonding layer. The circuit layer is coupled to a side of the first base layer and includes a linear signal line, two grounding lines located at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and the grounding lines. The bonding layer couples the second base layer to the circuit layer and defines a first opening corresponding to the linear signal line and communicating with the hollow areas of the circuit layer. The first opening of the bonding layer and the hollow areas of the circuit layer cooperatively define an air medium layer surrounding the linear signal line. A method for manufacturing the flexible circuit board is also provided.

IPC Classes  ?

• H05K 1/00 - Printed circuits
• H05K 1/03 - Use of materials for the substrate
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• H05K 1/02 - Printed circuits Details
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
• H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

The flexible printed circuit board includes a base layer, a first circuit layer and a second circuit layer, the first circuit and the second circuit layer formed on both sides of the base layer; conducting holes extending through the base layer and the first copper layer, the conducting holes include annular copper ring embedded in the first circuit layer. A height difference between a surface of the annular copper ring and a surface of the first circuit layer is in a range from 0 to 3 micrometers. A method for manufacturing the flexible printed circuit board is also provided.

IPC Classes  ?

• H05K 3/42 - Plated through-holes
• H05K 1/02 - Printed circuits Details
• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

Abstract

A heat dissipation device includes a first copper sheet and a second copper sheet. The first copper sheet includes a number of first recesses and the second copper sheet includes a number of corresponding second recesses. The second copper sheet is fixed on the first copper sheet and an airtight receiving cavity is formed by each first recess and each the second recess, a working fluid in the airtight receiving cavity carries unwanted heat away.

IPC Classes  ?

• F28F 21/08 - Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
• F28F 3/04 - Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes

Abstract

A rigid-flexible printed circuit board (PCB) a method for manufacturing the rigid-flexible PCB, and a PCB module having the rigid-flexible PCB are provided. The rigid-flexible printed circuit board (PCB) defines a first area, a second area, and a third area connected in the described order. The rigid-flexible PCB includes a first flexible PCB, a second flexible PCB adhered with the first flexible PCB through a bonding sheet in the third area, and, a first conductive layer and a second conductive layer formed on opposite side of the rigid-flexible PCB in the first area and the third area. The first flexible PCB is apart from the second flexible PCB in the first area and the second area.

IPC Classes  ?

• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 1/14 - Structural association of two or more printed circuits

Abstract

A PCB includes a base layer, a wiring pattern formed on a surface of the base layer, and a protecting layer formed on the wiring pattern. The protecting layer is formed by printing and solidifying an ink on the wiring pattern. The ink includes a cycloaliphatic epoxy resin, a phenoxyl resin solution, a solvent, a hardener, and an antifoaming agent.

IPC Classes  ?

• H05K 3/28 - Applying non-metallic protective coatings

Abstract

A method for manufacturing a resin coating on copper foil includes following steps. Firstly, two diamines of 2,2-bis[4-(4-aminophenoxy)phenyl] propane and 4,4′-oxydianiline, and two acid anhydrides of pyromellitic diandydride and oxydiphthalic anhydride are added into a polar aprotic solvent and the solvent is stirred to form a mixed solution. Secondly, the mixed solution is heated to a temperature of about 170° C.-190° C. to allow a cross-linking reaction to be completed between the two diamines and the two acid anhydrides, thereby forming a thermoplastic polyimide adhesive fluid. The thermoplastic polyimide adhesive fluid is coated on a copper foil and cured to form a thermoplastic polyimide adhesive layer on the copper foil, thereby obtaining a resin coated copper foil. This disclosure also relates to resin coated copper foil and a method for manufacturing a multi-layer circuit board.

IPC Classes  ?

• H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables

Abstract

An apparatus for heating and pressing a printed circuit board includes a first pressing member, a second pressing member, a driving member, a heater and an electromagnetic assembly. The driving member is configured for driving the first pressing member and the second pressing member to move toward or away from each other. The heater is configured for heating one of the first and second walls, and the electromagnetic assembly is capable of generating a magnetic field to attract the second wall to create additional pressure.

IPC Classes  ?

• B30B 9/00 - Presses specially adapted for particular purposes
• B30B 15/34 - Heating or cooling presses or parts thereof

Abstract

An exemplary multilayer printed circuit board includes a first circuit substrate, a third circuit substrate, a second circuit substrate between the first and third circuit substrates, a first anisotropically conductive adhesive layer between the first and second circuit substrates, and a second anisotropically conductive adhesive layer between the second and third circuit substrates. The first circuit substrate includes a first conductive terminal and a first through hole. The second circuit substrate includes a second conductive terminal and two through holes (i.e. second and third through holes). The third circuit substrate includes a third conductive terminal and a fourth through hole. The first anisotropically conductive adhesive layer fills the first and third through holes to electrically connect the first and second conductive terminals. The second anisotropically conductive adhesive layer fills the second and fourth through holes to electrically connect the second and third conductive terminals.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/02 - Printed circuits Details
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Abstract

A method for manufacturing a rigid-flexible printed circuit board includes certain steps. A flexible substrate including an exposed portion and an attaching portion is provided. An adhesive sheet defining an opening, and a rigid copper clad laminate are provided. The rigid copper clad laminate includes an insulating layer and a copper layer. A blind first slit is defined in the insulating layer. The flexible substrate, the adhesive sheet and the copper clad laminate are laminated. An outer circuit is formed in the copper layer. A second slit is defined in the copper clad laminate, and the second slit is in communication with the first slit. A portion of the copper clad laminate is removed to expose the flexible portion of the flexible substrate.

IPC Classes  ?

• B32B 37/00 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
• B29C 65/00 - Joining of preformed partsApparatus therefor

Abstract

An electronic component device for electrically and mechanically connecting to a lead wire includes a base and a cover. The base includes a receiving body, at least one electronic component, and two spaced stripping connectors. The receiving body defining an installation groove. The at least one electronic component and the stripping connectors are received in the receiving body. Each stripping connector is in electrically connected with the at least one electronic component. The stripping connector defines a stripping slot for extension of the core therethrough, which has a size smaller than or equal to the diameter of the core. The cover includes a pressing surface and an electrically insulating cutting body. The cutting body is used for cutting off the lead wire. The pressing surface is configured for pressing the lead wire into the stripping slot, thus making the core in electrical connection with the at least one electronic component.

IPC Classes  ?

• H05K 5/00 - Casings, cabinets or drawers for electric apparatus

Abstract

A method for manufacturing multilayer printed circuit board includes step below. A metal substrate is provide, the metal substrate includes a number of substrate unit. A first insulating layer is formed on one surface of the metal substrate. The first insulating layer has a number of first through holes. An electrically conductive circuit is formed in each substrate unit. A second insulating layer is formed on the other surface of the metal substrate. The second insulating layer has a number of second through holes. A first metal cylinder is formed in a first through hole and a second metal cylinder is formed in a second through hole. The number of substrate units are folded and laminated, the connected and aligned first metal cylinder and the second metal cylinder communicates the electrically conductive circuits.

IPC Classes  ?

• H01K 3/10 - Machines therefor
• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

Abstract

A printed circuit board includes an insulating layer, a signal trace, a ground trace, and a fin. The insulating layer has a first surface and an opposite second surface. The signal trace and the ground trace are formed on the first surface of the insulating layer. The first fin is directly formed on the ground trace. Also provided is a method for manufacturing the printed circuit board.

IPC Classes  ?

• H05K 1/00 - Printed circuits

Abstract

A method for manufacturing a multilayer FPCB which includes providing a first substrate, a second substrate and a binder layer; defining an opening on the binder layer; defining a first slit in the dielectric layer of the first substrate; laminating the first substrate, the binder layer and the second substrate; forming a second slit in the conductive layer of the first substrate, the second slit being created so as to align with the first slit, cutting the first substrate, the binder layer and the second substrate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas.

IPC Classes  ?

• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A method for manufacturing a rigid-flexible printed circuit boards includes following steps. First, a first rigid substrate is attached to a first adhesive layer. Second, a first opening through the combined first rigid substrate and the first adhesive layer is defined. Third, the first rigid substrate is laminated to a flexible substrate, the flexible substrate includes an exposed portion exposed via the first opening. Fourth, a second rigid substrate is attached to a second adhesive, a glass transition temperature of the second adhesive layer being lower than that of the first adhesive layer. Fifth, a second opening through the combined first rigid substrate and the first adhesive layer is defined. Sixth, the second rigid substrate is laminated to the flexible substrate in such a manner that the flexible substrate is sandwiched between the first and second adhesive layers, the exposed portion is exposed in the first and the second openings.

IPC Classes  ?

• B32B 38/10 - Removing layers, or parts of layers, mechanically or chemically