The objective of the invention is to provide a plant activator having a resistance to the wash-off and a superior handleability, transportability and storage stability. A powdery plant activator comprising, at least one compound selected from an oxo fatty acid or a derivative or a salt thereof and a hydroxy fatty acid or a derivative or a salt thereof, and an unsaturated fatty acid (excluding an oxo fatty acid and a hydroxy fatty acid).
A01N 37/36 - Biocides, pest repellants or attractants, or plant growth regulators containing organic compounds containing a carbon atom having three bonds to hetero atoms with at the most two bonds to halogen, e.g. carboxylic acids containing at least one carboxylic group or a thio-analogue, or a derivative thereof, and a singly bound oxygen or sulfur atom attached to the same carbon skeleton, this oxygen or sulfur atom not being a member of a carboxylic group or of a thio-analogue, or of a derivative thereof, e.g. hydroxy-carboxylic acids
A01N 37/42 - Biocides, pest repellants or attractants, or plant growth regulators containing organic compounds containing a carbon atom having three bonds to hetero atoms with at the most two bonds to halogen, e.g. carboxylic acids containing within the same carbon skeleton a carboxylic group or a thio-analogue, or a derivative thereof, and a carbon atom having only two bonds to hetero atoms with at the most one bond to halogen, e.g. keto-carboxylic acids
A wiring substrate includes a conductor layer, an insulating layer formed on the conductor layer such that the insulating layer is covering the conductor layer, and a via conductor formed in a through hole penetrating through the insulating layer such that the through hole has a first opening on the opposite side with respect to the conductor layer and a second opening facing the conductor layer and that the via conductor is connecting to the conductor layer. The conductor layer has a surface facing the via conductor and having a recess communicating with the through hole such that the recess is smaller than the second opening and has a conical shape tapering toward the opposite side with respect to the via conductor and the recess has the center on the surface of the conductor layer that is offset from the center of the first opening of the through hole.
A heat transfer suppression sheet includes a heat insulating material containing inorganic particles and an organic fiber; and a resin film encompassing the heat insulating material. The resin film has holes. The resin film is composed of a first surface-side film and a second surface-side film that are respectively disposed on a first surface side and a second surface side which are orthogonal to a thickness direction of the heat insulating material, and an end surface-side film that is disposed on an end surface side which is parallel to the thickness direction of the heat insulating material.
H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
B32B 3/26 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layerLayered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a layer with cavities or internal voids
B32B 5/16 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer formed of particles, e.g. chips, chopped fibres, powder
A wiring substrate includes a first insulating layer, a conductor layer formed on the first insulating layer, and a second insulating layer formed on the first insulating layer such that the second insulating layer is covering the conductor layer. The conductor layer includes wirings formed such that the wirings have the minimum wiring width of 3 μm or less and the minimum inter-wiring distance of 3 μm or less and that the conductor layer has mesh-like unevenness formed on a side surface of the conductor layer and not on an upper surface of the conductor layer.
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
A wiring substrate includes a first conductor layer, an insulating layer covering the first conductor layer, a second conductor layer formed on a surface of the insulating layer, and a via conductor formed in a hole penetrating through the insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer. The insulating layer is formed such that the hole includes a first portion decreasing in width on the first conductor layer side, a second portion formed on the first conductor layer side of the first portion and increasing in width on the first conductor layer side, and a third portion formed on the first conductor layer side of the second portion and decreasing in width on the first conductor layer side.
A printed wiring board includes an insulating layer, a first conductor layer formed on the insulating layer, an adhesive layer formed on the first conductor layer, a resin insulating layer formed on the insulating layer such that the adhesive layer is formed between the first conductor layer and the resin insulating layer, and a second conductor layer formed on the resin insulating layer. The first conductor layer is formed such that the first conductor layer has a smooth upper surface and a smooth side surface and that the adhesive layer has a smooth film formed on the smooth upper and side surfaces, and a protruding part protruding from the smooth film.
A component built-in wiring board includes a core substrate, a connecting component positioned in opening of the substrate and including electronic components, a first build-up part formed on a first surface side of the substrate, a second build-up part formed on a second surface side of the substrate, and filling resin part filling space formed between the substrate and connecting component in the opening of the substrate. The connecting component includes molding resin part positioning the electronic components spaced apart from each other, and penetrating conductors formed in the molding resin part, and the electronic components include a first component having terminals on the first surface side of the substrate and a second component having terminals on the second surface side of the substrate such that the penetrating conductors are formed on the second surface side and connected to the terminals of the second component on the second surface side.
A wiring substrate includes an electrical wiring part including an insulating layer and a conductor layer and having an optical wiring region and a component region, and a support member formed on a surface of the electrical wiring part such that the support member is spanning across the optical wiring region and component region of the electrical wiring part. The component region of the electrical wiring part positions a component on the surface of the electrical wiring part, and the optical wiring region of the electrical wiring part positions an optical wiring part on the surface of the electrical wiring part.
A printed wiring board includes an insulating layer, a conductor layer formed on the insulating layer, an adhesive layer formed on the conductor layer, and a resin insulating layer formed on the insulating layer such that the resin insulating layer is covering the conductor layer. The conductor layer includes a main component including copper such that the conductor layer includes a copper oxide film forming a surface thereof.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
A coil substrate includes a flexible substrate having a first surface and a second surface on the opposite side with respect to the first surface, a coil including a wiring and formed on the first surface and/or second surface of the flexible substrate, and a resin insulating layer covering the wiring of the coil formed on the first surface and/or second surface of the flexible substrate. The coil is formed such that the wiring has a first layer and a second layer covering an outer surface of the first layer and that the second layer has a first portion covering an upper surface of the first layer and a second portion covering a side surface of the first layer, and the wiring of the coil is formed such that the wiring has a width in a range of 60 μm to 400 μm and that a ratio T1/T2 of a thickness T1 of the first portion to a thickness T2 of the second portion satisfies 1.0
A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on a surface of the insulating layer, and a via conductor formed in an opening formed in the insulating layer such that the via conductor is connecting the first and second conductor layers. The second conductor layer and via conductor include a seed layer and an electrolytic plating layer formed on the seed layer such that the seed layer has a first portion formed on the surface of the insulating layer, a second portion formed on an inner wall surface of the insulating layer in the opening, and a third portion formed on the first conductor layer exposed from the opening and that the first portion has a thickness that is greater than a thickness of the second portion and a thickness of the third portion.
A mat material having a generally rectangular shape in a plan view, the mat material including inorganic fibers, wherein the mat material includes a first main surface and a second main surface opposite to each other in a thickness direction, a first end surface and a second end surface opposite to each other in a longitudinal direction that is a winding direction, and a first side surface and a second side surface opposite to each other in a width direction perpendicular to the thickness direction and the longitudinal direction, the mat material includes, on the first end surface, a protrusion designed to protrude toward the second end surface during winding of the mat material, and non-protruding portions provided at both sides of the protrusion in the width direction and designed not to protrude toward the second end surface during winding of the mat material, the mat material includes, on the second end surface, a recess designed to fit the shape of the protrusion on the first end surface during winding of the mat material, and non-recessed portions provided at both sides of the recess in the width direction and designed to fit the shapes of the non-protruding portions on the first end surface during winding of the mat material, and a ratio [D/C] of a length [D] of the non-recessed portion in the width direction to a length [C] of the non-recessed portion in the longitudinal direction is 1.0 or more.
An inorganic fiber mat produced by a method including a preparing step of preparing a first inorganic fiber molding including an organic binder attached thereto and derived from a needle-punched mat, a defibrating step of defibrating the first inorganic fiber molding to obtain defibrated inorganic fibers, and a papermaking step of forming the inorganic fiber mat by papermaking using a slurry containing the defibrated inorganic fibers.
D04H 1/72 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres characterised by the method of forming fleeces or layers, e.g. reorientation of fibres the fibres being randomly arranged
D21B 1/12 - Fibrous raw materials or their mechanical treatment by dividing raw materials into small particles, e.g. fibres by wet methods by the use of steam
14.
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND LAMINATING SYSTEM USED FOR IMPLEMENTING THE METHOD
A laminating system includes a laminating device including a laminating roll device that applies a dry film onto a seed layer formed on a surface of a resin insulating layer, and a pressure application device positioned such that the pressure application device applies heat and pressure to the dry film.
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K 3/14 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material
A method for manufacturing a printed wiring board includes forming a resin insulating layer on a first conductor layer, forming a protective film on a surface of the insulating layer, forming opening through the protective film and insulating layer, removing the film, cleaning the surface of the insulating layer, forming a second conductor layer on the surface of the insulating layer; and forming a via conductor connecting the first and second conductor layers in the opening. The insulating layer includes resin and inorganic particles having spherical shapes, the cleaning includes selectively removing the resin such that the particles include first particles partially embedded and second particles completely embedded in the resin. The forming the second conductor layer includes forming a seed layer by sputtering, forming a plating resist using DI exposure, forming an electrolytic plating layer, removing the resist, and removing the seed layer exposed from the electrolytic plating layer.
A wiring substrate includes a core substrate including a resin substrate, a glass substrate in opening of the resin substate, and filling resin between the resin and glass substrates, and a build-up part on the core substrate and including conductor layers and resin insulating layers. The glass substrate has first through-hole conductors including main material including copper, the resin substrate has second through-hole conductors including main material including copper, and the first and second through-hole conductors are formed in the glass and resin substrates respectively such that density of the first through-hole conductors is greater than density of the second through-hole conductors, where the density of the first through-hole conductors is number of the first through-hole conductors per unit area of surface of the glass substrate, and the density of the second through-hole conductors is number of the second through-hole conductors per unit area of surface of the resin substrate.
A method for manufacturing a wiring substrate includes preparing a glass substrate having one or more product areas formed on surface, and forming a build-up part including conductor layers and insulating layers on the surface of the substrate across the product areas. The product areas have a rectangular shape with each side in range of 80 mm to 240 mm, the forming the build-up part includes alternately laminating three or more conductor layers and three or more insulating layers such that each insulating layer has elongation rate of 7% or more, the laminating the conductor layers includes forming a resist layer having a resist pattern and forming a conductor pattern including wirings according to the pattern such that the wirings have minimum width of 2 μm or less and minimum inter-wiring distance of 2 μm or less, and the forming the resist includes exposing the resist by direct imaging exposure.
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
C03C 17/40 - Surface treatment of glass, e.g. of devitrified glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal all coatings being metal coatings
C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating
C23C 28/02 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and only coatings of metallic material
C25D 5/02 - Electroplating of selected surface areas
C25D 5/54 - Electroplating of non-metallic surfaces
C25D 7/00 - Electroplating characterised by the article coated
A method for manufacturing a wiring substrate includes preparing a glass substrate having one or more product areas on a surface, and forming a build-up part on the surface across the product area. The one or more product areas have a rectangular shape with each side in range of 80 mm to 240 mm, the forming the build-up part includes alternately laminating three or more conductor layers and three or more insulating layers such that difference in thermal expansion coefficient between the substrate and insulating layers is 13 ppm/° C. or less, the laminating the conductor layers includes forming a resist layer having resist pattern and forming conductor pattern including wirings according to the pattern such that the wirings have the minimum width of 2 μm or less and the minimum inter-wiring distance of 2 μm or less, and the forming the resist includes exposing the resist by direct imaging exposure.
A method for manufacturing a wiring substrate includes preparing a glass substrate having one or more product areas on first surface, and forming a build-up part including conductor layers and insulating layers on the first surface across the one or more product areas. The glass substrate has a support body attached to second surface. The one or more product areas have a rectangular shape with each side in range of 80 mm to 240 mm, the forming the build-up part includes alternately laminating three or more conductor layers and three or more insulating layers, the laminating the conductor layers includes forming a resist layer having pattern and forming conductor pattern including wirings according to the pattern. The wirings have the minimum width of 2 μm or less and the minimum inter-wiring distance of 2 μm or less, and the forming the resist includes exposing the resist by direct imaging exposure.
A method for manufacturing a printed wiring board includes forming a resin insulating layer on a first conductor layer, forming a protective film on a surface of the insulating layer, forming an opening through the film and the resin insulating layer, removing the film, treating the surface of the insulating layer, forming a second conductor layer on the surface of the resin insulating layer, and forming a via conductor connecting the first and second conductor layers. The insulating layer includes resin and inorganic particles including first and second particles. The surface of the insulating layer includes a surface of the resin and substantially flat exposed portions of the first particles, and the forming the second conductor layer includes forming a seed layer by sputtering, forming a plating resist using DI exposure, forming an electrolytic plating layer, removing the resist, and removing the seed layer exposed from the electrolytic plating layer.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 3/07 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
A wiring substrate includes a build-up part including a conductor layer and an insulating layer, a solder resist layer formed in contact with a surface of the build-up part, and a metal post formed on the build-up part and protruding from the solder resist layer. The build-up part includes conductor layers including the conductor layer and insulating layers including the insulating layer such that the conductor layer includes a conductor pad, is formed on a surface of the solder resist layer and is in contact with a surface of the insulating layer forming the surface of the build-up part, and the metal post includes a base plating layer connected to the conductor pad of the conductor layer in the build-up part such that the base plating layer includes a penetrating portion formed in an opening of the solder resist layer and a pad portion protruding from the solder resist layer.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
A method for manufacturing a wiring substrate includes forming a build-up part including conductor layers and insulating layers across one or more product areas on a support substrate such that the one or more product areas have a rectangular shape with each side in a range of 80 mm to 240 mm. The forming the build-up part includes forming a resist layer having a resist pattern and forming a conductor pattern according to the resist pattern, and forming wirings in the conductor pattern such that the wirings have a minimum width of 2 μm or less and a minimum inter-wiring distance of 2 μm or less, and the forming the resist layer having the resist pattern includes exposing the resist layer by direct imaging exposure.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
A method for manufacturing a wiring substrate includes preparing two support substrates having one or more product areas, forming a first build-up part including first conductor and insulating layers across the one or more product areas on a first surface of each support substrate, positioning the substrates such that second surfaces of the substrates face each other, and forming a second build-up part including second conductor and insulating layers on each first build-up part. The minimum wiring width and the minimum inter-wiring distance of wirings in the first conductor layers are smaller than those of wirings in the second conductor layers. The forming the first build-up part includes forming a first resist layer having a first resist pattern and forming a conductor pattern according to the first resist pattern for each first conductor layer. The forming the first resist layer includes exposing the first resist layer by direct imaging exposure.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
24.
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
A wiring substrate includes a conductor layer including a via land, a conductor film formed on the via land of the conductor layer, an insulating layer covering the conductor layer and the conductor film formed on the via land, and a via conductor formed in the insulating layer such that the via conductor is penetrating through the insulating layer and is connecting to the via land via the conductor film. A ratio of the shortest distance between an upper surface of the conductor film and an end surface of the via conductor on the opposite side with respect to an end surface connected to the conductor film to the shortest distance between an upper surface of the via land and the end surface of the via conductor on the opposite side with respect to the end surface connected to the conductor film is in the range of 0.4 to 0.7.
A motor coil substrate includes a flexible substrate, and coils including wirings such that the wirings are formed on a first surface of the flexible substrate and a second surface on the opposite side with respect to the first surface. The flexible substrate is wound circumferentially from one end of a longitudinal direction of a flexible substrate around an axis extending in a direction perpendicular to the longitudinal direction of the flexible substrate such that the flexible substrate is formed into a cylindrical shape and that a cylindricity of an outer circumferential surface is greater than 0.0 mm and equal to or less than 0.3 mm.
The objective of the invention is to provide a plant activator with superior resistance-inducing activity and low toxicity and soil contamination. A plant activator comprising, as an active ingredient, an oxo fatty acid derivative of general formula (I):
The objective of the invention is to provide a plant activator with superior resistance-inducing activity and low toxicity and soil contamination. A plant activator comprising, as an active ingredient, an oxo fatty acid derivative of general formula (I):
HOOC—(R1)—C═C—C(═O)—R2 (I)
The objective of the invention is to provide a plant activator with superior resistance-inducing activity and low toxicity and soil contamination. A plant activator comprising, as an active ingredient, an oxo fatty acid derivative of general formula (I):
HOOC—(R1)—C═C—C(═O)—R2 (I)
(wherein, R1 is a straight or branched alkylene group with 6 to 12 carbon atoms, and optionally comprises one or more double bonds, R2 is an alkyl group with 2 to 8 carbon atoms, and optionally comprises one or more branches and/or double bonds) or a salt or an ester thereof.
A01N 37/42 - Biocides, pest repellants or attractants, or plant growth regulators containing organic compounds containing a carbon atom having three bonds to hetero atoms with at the most two bonds to halogen, e.g. carboxylic acids containing within the same carbon skeleton a carboxylic group or a thio-analogue, or a derivative thereof, and a carbon atom having only two bonds to hetero atoms with at the most one bond to halogen, e.g. keto-carboxylic acids
27.
FLAMEPROOF MATERIAL, METHOD FOR PRODUCING FLAMEPROOF MATERIAL, AND BATTERY MODULE
A flameproof material contains a heat insulation material containing an inorganic fiber or an infusible fiber, and an inorganic fiber cloth. The heat insulation material and the inorganic fiber cloth are integrated to each other by physical means. The physical means may be at least one of needling, a resin staple, a resin tag pin, or thread sewing.
H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
D04H 1/413 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties containing granules other than absorbent substances
D04H 1/498 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties the fleeces or layers being consolidated by mechanical means, e.g. by rolling by needling or like operations to cause entanglement of fibres entanglement of layered webs
H01M 50/204 - Racks, modules or packs for multiple batteries or multiple cells
A connection structure includes an electrical wiring part, an optical element having a light receiving or light emitting surface, and an optical waveguide including a core part, a first cladding layer in contact with a first surface of the core part, and a second cladding layer in contact with a second surface of the core part on the opposite side. The waveguide has a first end surface and a second end surface formed such that the core part and first cladding layer are substantially flush on the first end surface and the second cladding layer has the second end surface extending from the first end surface, the core part has a light transmitting surface that is exposed on the first end surface and faces the light receiving or light emitting surface of the optical element, and the optical element is positioned on the second end surface of the optical waveguide.
A motor coil substrate includes a flexible substrate, and coils including wirings such that the wirings are formed on a first surface of the flexible substrate and a second surface on the opposite side with respect to the first surface. The flexible substrate is wound circumferentially from one end of a longitudinal direction of a flexible substrate around an axis extending in a direction perpendicular to the longitudinal direction of the flexible substrate such that the flexible substrate is formed into a cylindrical shape, and the coils are formed such that a space factor of the coils in a cross section of the motor coil substrate is in a range of 50% to 99%.
An object of the present invention is to provide a penetration promoter and an agricultural composition, which are capable of promoting penetration of an organic substance into a plant tissue.
An object of the present invention is to provide a penetration promoter and an agricultural composition, which are capable of promoting penetration of an organic substance into a plant tissue.
A penetration promoter for an organic substance for plants, containing at least one compound selected from an oxo fatty acid, or a derivative thereof or a salt thereof, and a hydroxy fatty acid, or a derivative thereof or a salt thereof. An agricultural composition containing: (a) at least one compound selected from an oxo fatty acid, or a derivative thereof or a salt thereof, and a hydroxy fatty acid, or a derivative thereof or a salt thereof; and (b) at least one organic substance for plants.
An optical waveguide includes a core part, a first cladding layer formed on the core part such that the first cladding layer is in contact with a first surface of the core part, and a second cladding layer formed on the core part such that the second cladding layer is in contact with a second surface of the core part. The core part, first cladding layer and second cladding layer form an end portion of the optical waveguide such that the core part and first cladding layer form a first end surface of the optical waveguide on which the core part is exposed and the core part and the first cladding layer are flush with respect to each other, and a second end surface of the optical waveguide including a portion of the second cladding layer extending from the first end surface at the end portion of the optical waveguide.
A method of producing an inorganic fiber mat. The method includes a preparing step of preparing a first inorganic fiber molding including an organic binder attached thereto and derived from a needle-punched mat, a firing step of firing the first inorganic fiber molding prepared in the preparing step, a defibrating step of defibrating the first inorganic fiber molding fired in the firing step to obtain defibrated inorganic fibers, and a papermaking step of forming the inorganic fiber mat by papermaking using a slurry containing the defibrated inorganic fibers.
D04H 1/72 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres characterised by the method of forming fleeces or layers, e.g. reorientation of fibres the fibres being randomly arranged
D21B 1/12 - Fibrous raw materials or their mechanical treatment by dividing raw materials into small particles, e.g. fibres by wet methods by the use of steam
A wiring substrate includes a first wiring substrate including first insulating layers, first conductor layers, and first via conductors, and a second wiring substrate mounted on the first substrate and including second insulating layers, second conductor layers, and second via conductors. The second substrate is formed such that the minimum wiring width of wirings in the second conductor layers is smaller than the minimum wiring width of wirings in the first conductor layers, the minimum inter-wiring distance of the wirings in the second conductor layers is smaller than the minimum inter-wiring distance of the wirings in the first conductor layers, the wiring widths of the wirings in the second conductor layers are 3 μm or less, the inter-wiring distances of the wirings in the second conductor layer are 3 μm or less, and aspect ratio of the wirings in the second conductor layer is in range of 2.0 to 4.0.
A flameproof sheet contains a flameproof material and an elastic member, and the flameproof material is laminated with the elastic member so that a joint surface of the flameproof material with the elastic member and a joint surface of the elastic member with the flameproof material are movable along the joint surface.
H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
B32B 7/08 - Interconnection of layers by mechanical means
B32B 25/04 - Layered products essentially comprising natural or synthetic rubber comprising rubber as the main or only constituent of a layer, next to another layer of a specific substance
B32B 25/10 - Layered products essentially comprising natural or synthetic rubber next to a fibrous or filamentary layer
35.
COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACTURING COMPONENT BUILT-IN WIRING BOARD
A component built-in wiring board includes a core substrate having an opening, electronic components positioned in the opening of the substrate such that the electronic components are spaced apart with respect to each other, a build-up part formed on the substrate such that the build-up part is covering the electronic components in the opening of the substrate, and a resin part formed in the opening of the substrate and including a first resin part and a second resin part such that the second resin part is connecting the electronic components in the opening of the substrate and the first resin part is filling a space formed between the core substrate and the second resin part in the opening of the 10 substrate. The second resin part of the resin part is connecting the electronic components having different heights such that terminal surfaces of the electronic components are flush with each other.
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
H01L 23/14 - Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
A wiring substrate includes an electrical wiring part including insulating layers and conductor layers, and an optical wiring part positioned on a surface of the electrical wiring part and including a support substrate and an optical waveguide such that the optical wiring part has a component region configured to position a component on the optical wiring part and the optical waveguide includes a core part and a cladding part. The support substrate in the optical wiring part has a thermal expansion coefficient lower than a thermal expansion coefficient of the optical waveguide and includes a conductor region and a non-conductor region such that the optical waveguide is formed on a surface of the support substrate in the non-conductor region and the optical wiring part includes one or more penetrating conductors penetrating through the support substrate in the conductor region.
A printed wiring board includes an uppermost conductor layer having an electrode that mounts an electronic component, an upper build-up part including conductor layers and resin insulating layers such that the uppermost conductor layer is formed on the upper build-up part, and a lower build-up part including conductor layers and resin insulating layers and formed such that the lower build-up part is formed below the upper build-up part. The upper build-up part is formed such that each of the conductor layers includes a seed layer formed by sputtering, and an electrolytic plating layer formed below the seed layer, and the lower build-up part is formed such that each of the conductor layers includes a seed layer formed by electroless plating, and an electrolytic plating layer formed below the seed layer.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
A printed wiring board includes a first conductor layer, an insulating layer formed on the first conductor layer, a second conductor layer formed on the insulating layer, and a via conductor formed in the insulating layer such that the via conductor is connecting the first and second conductor layers. The insulating layer has opening exposing portion of the first conductor layer such that the via conductor is formed in the opening, the second conductor layer and via conductor are formed such that the second conductor layer and via conductor include a seed layer and an electrolytic plating layer on the seed layer, and the insulating layer includes resin and inorganic particles dispersed in the resin such that the particles include first particles forming inner wall surface in the opening and second particles embedded in the insulating layer and the first particles have shapes different from shapes of the second particles.
A coil substrate includes a flexible substrate including a first substrate and a second substrate extending from the first substrate, and coils formed on the flexible substrate. The coils are positioned substantially in a row and include an m-th coil, an (m+1)-th coil, an (m+2)-th coil, an (m+3)-th coil, and an (m+4)-th coil. The (m+1)-th coil is positioned next to the m-th coil, the (m+2)-th coil is positioned next to the (m+1)-th coil, the (m+3)-th coil is positioned next to the (m+2)-th coil, the (m+4)-th coil is positioned next to the (m+3)-th coil, the m-th coil, the (m+1)-th coil, and the (m+2)-th coil partially overlap, and the m-th coil and the (m+4)-th coil do not overlap, where m is a natural number.
A method for producing a heat transfer suppression sheet contains processing a mixture containing an inorganic particle, a binder fiber having a core-sheath structure, and a hot melt powder into a sheet. The binder fiber having a core-sheath structure includes a core portion extending in its longitudinal direction, and a sheath portion formed to cover an outer peripheral surface of the core portion, and a melting point of a first organic material constituting the core portion is higher than a melting point of a second organic material constituting the sheath portion and a melting point of a third organic material constituting the hot melt powder.
H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
H01M 50/213 - Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for cells having curved cross-section, e.g. round or elliptic
H01M 50/293 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by spacing elements or positioning means within frames, racks or packs characterised by the material
41.
MAT MATERIAL, EXHAUST GAS PURIFICATION DEVICE, AND METHOD FOR PRODUCING MAT MATERIAL
A mat material including inorganic fibers, with an inorganic binder and an organic binder attached to the mat material, wherein a ratio [w1B/w1A] of a weight percentage w1B of the organic binder to a weight percentage w1A of the inorganic binder satisfies the following condition (1) or (2), where w1A is the weight percentage of the inorganic binder relative to a weight of the mat material as a whole, and w1B is the weight percentage of the organic binder relative to the weight of the mat material as a whole:
A mat material including inorganic fibers, with an inorganic binder and an organic binder attached to the mat material, wherein a ratio [w1B/w1A] of a weight percentage w1B of the organic binder to a weight percentage w1A of the inorganic binder satisfies the following condition (1) or (2), where w1A is the weight percentage of the inorganic binder relative to a weight of the mat material as a whole, and w1B is the weight percentage of the organic binder relative to the weight of the mat material as a whole:
0
A mat material including: inorganic fibers; and multiple entanglement points formed by needling at least one of a front surface or a back surface of the mat material, wherein a density p of the entanglement points is in a range of 0.5 pcs/cm2≤ρ<18 pcs/cm2, at least one of a 4 mm×4 mm first region without the entanglement points or a 3 mm×8 mm second region without the entanglement points is arranged in a 25 mm×25 mm region, and the mat material contains an inorganic binder and has a shear modulus of 0.20 or more and a post-firing surface pressure of 50 kPa or more.
D04H 1/488 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties the fleeces or layers being consolidated by mechanical means, e.g. by rolling by needling or like operations to cause entanglement of fibres in combination with at least one other method of consolidation in combination with bonding agents
D04H 1/587 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties by applying, incorporating or activating chemical or thermoplastic bonding agents, e.g. adhesives characterised by the bonding agents used
An electronic component mounting substrate includes an electronic component, a printed wiring board that mounts the electronic component thereon, and a cover that accommodates and seals the electronic component mounted on the printed wiring board. The cover has an upper portion and a support portion supporting the upper portion such that the upper portion has a thickness of 2 mm or more, and the printed wiring board includes an upper build-up part and a lower build-up part such that the upper build-up part mounts the electronic component thereon and includes an uppermost resin insulating layer not containing a reinforcing material and that the lower build-up part includes a lowermost resin insulating layer including a reinforcing material.
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/367 - Cooling facilitated by shape of device
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
A heat transfer suppression sheet contains a first inorganic fiber having a glass transition point of 800° C. or lower and/or a first inorganic particle having a glass transition point of 800° C. or lower; a second inorganic fiber having a glass transition point of 1000° C. or higher; a second inorganic particle having a glass transition point of 1000° C. or higher; and an organic binder.
A method for producing a heat transfer suppression sheet contains processing a mixture into a sheet by a dry method, the mixture containing an inorganic particle and a binder fiber having a core-sheath structure. The binder fiber having a core-sheath structure includes a core portion extending in its longitudinal direction, and a sheath portion formed to cover an outer peripheral surface of the core portion, and a melting point of a first organic material constituting the core portion is higher than a melting point of a second organic material constituting the sheath portion.
A wiring substrate includes a first build-up part including a first conductor layer, a first insulating layer, and first via conductors penetrating through the first insulating layer, a second build-up part including second conductor layers, second insulating layers, and second via conductors penetrating though the second insulating layers, a third build-up part including a third conductor layer, a third insulating layer, and third via conductors penetrating through the third insulating layers such that the second built-up part is formed between the first built-up part and the third build-up part. The first, second and third build-up parts are formed such that a diameter of each of the first via conductors is smaller than a diameter of each of the second via conductors and that the diameter of each of the second via conductors is smaller than a diameter of each of the third via conductors.
A heat insulation sheet contains a first inorganic particle, a second inorganic particle composed of a nanoparticle, and an inorganic fiber. A total content of the first inorganic particle and the second inorganic particle is 30 mass % or more and 90 mass % or less with respect to a total mass of the heat insulation sheet, D50 is 1 μm or more and 100 μm or less, and a ratio (D90/D10) is 10 or more and 1000 or less in a volume-based cumulative distribution of the first inorganic particle.
H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
H01M 10/651 - Means for temperature control structurally associated with the cells characterised by parameters specified by a numeric value or mathematical formula, e.g. ratios, sizes or concentrations
A heat transfer suppression sheet contains inorganic particles, and an organic fiber. At least a part of the organic fiber has a branched structure containing a base portion and branch portions extending from the base portion in at least three directions. The base portion may be a fused portion in which a plurality of the organic fibers are fused with each other. The heat transfer suppression sheet may have a plurality of empty holes.
H01M 10/651 - Means for temperature control structurally associated with the cells characterised by parameters specified by a numeric value or mathematical formula, e.g. ratios, sizes or concentrations
H01M 10/6555 - Rods or plates arranged between the cells
A printed wiring board includes an insulating layer, a conductor layer formed on the insulating layer, an adhesive layer formed on the conductor layer and including organic material, and a resin insulating layer formed on the insulating layer such that the resin insulating layer is covering the adhesive layer on the conductor layer formed on the insulating layer. The resin insulating layer includes resin and inorganic particles dispersed in the resin, and the adhesive layer has a smooth film part and a protruding part including protrusions protruding from the smooth film part such that a number of the inorganic particles in spaces between the protrusions with respect to a predetermined area is smaller than a number of the inorganic particles outside the spaces between the protrusions with respect to the predetermined area.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 3/07 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
An inorganic fiber mat is produced by a method of producing an inorganic fiber mat. The method includes a preparing step of preparing a first inorganic fiber molding derived from a needle-punched mat and a second inorganic fiber molding derived from a papermaking mat, a defibrating step of defibrating the first inorganic fiber molding and the second inorganic fiber molding to obtain defibrated 10 inorganic fibers, and a papermaking step of forming the inorganic fiber mat by papermaking using a slurry containing the defibrated inorganic fibers.
D04H 1/70 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres characterised by the method of forming fleeces or layers, e.g. reorientation of fibres
D04H 1/46 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties the fleeces or layers being consolidated by mechanical means, e.g. by rolling by needling or like operations to cause entanglement of fibres
D21B 1/12 - Fibrous raw materials or their mechanical treatment by dividing raw materials into small particles, e.g. fibres by wet methods by the use of steam
D21B 1/32 - Defibrating by other means of waste paper
A wiring substrate includes an insulating layer having through holes, a first conductor layer, a second conductor layer, interlayer conductors formed in the through holes. The interlayer conductors are connecting the first and second conductor layers and include first interlayer conductors formed in first region of the insulating layer and second interlayer conductors formed in second region of the insulating layer at density higher than density of the first interlayer conductors formed in the first region. A thickness of each first interlayer conductor is larger than a thickness of each second interlayer conductor. The insulating layer is formed such that the through holes includes first through holes having the first interlayer conductors formed therein and second through holes having the second interlayer conductors formed therein and that an inner diameter of each of the first through holes is larger than an inner diameter of each of the second through holes.
A printed wiring board includes an uppermost resin insulating layer, an uppermost conductor layer, a solder resist layer, a dam conductor connected to the upper most conductor layer, and a metal dam formed on and connected to the dam conductor. The uppermost conductor layer includes electrodes and a conductor circuit that are positioned to mount an electronic component in a mounting area in the solder resist layer. The metal dam is surrounding the mounting area. The solder resist layer has first openings reaching to the electrodes of the uppermost conductor layer and a second opening reaching to the conductor circuit of the uppermost conductor layer. The dam conductor is formed in the second opening of the solder resist layer. The conductor circuit in the uppermost conductor layer is a ground circuit or power supply circuit such that the conductor circuit is connected to the metal dam via the dam conductor.
A heat transfer suppression sheet contains a first organic fiber having no glass transition point at a temperature lower than 120° C., a first inorganic particle, and a resin binder. The first organic fiber may be a crystalline organic fiber having a glass transition point of 120° C. or higher and/or an organic fiber having no glass transition point.
H01M 50/24 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by physical properties of casings or racks, e.g. dimensions adapted for protecting batteries from their environment, e.g. from corrosion
H01M 50/293 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by spacing elements or positioning means within frames, racks or packs characterised by the material
A heat transfer suppression sheet contains a fiber component and a particle component. A main component of a first inorganic fiber contained in the fiber component is the same kind as a main component of a first inorganic particle contained in the particle component, and a content of the main component of the first inorganic particle is larger than a content of the main component of the first inorganic fiber.
H01M 10/651 - Means for temperature control structurally associated with the cells characterised by parameters specified by a numeric value or mathematical formula, e.g. ratios, sizes or concentrations
55.
PLATE-SHAPED HEAT INSULATOR, COMBUSTION CHAMBER, BOILER AND WATER HEATER
A plate-shaped heat insulator including a plate-shaped papermaking product containing inorganic fibers, and one or more grooves in at least one of its surfaces. The plate-shaped heat insulator is intended to be disposed in a combustion chamber.
F23M 5/02 - CasingsLiningsWalls characterised by the shape of the bricks or blocks used
F22B 21/34 - Water-tube boilers of vertical or steeply-inclined type, i.e. the water-tube sets being arranged vertically or substantially vertically built-up from water tubes grouped in panel form surrounding the combustion chamber, i.e. radiation boilers
F24H 1/00 - Water heaters, e.g. boilers, continuous-flow heaters or water-storage heaters
A heat transfer suppression sheet contains an inorganic particle uniformly dispersed, a first inorganic fiber uniformly dispersed and oriented in one direction parallel to a main surface of the sheet, and a second inorganic fiber intertwined with the first inorganic fiber to form a three-dimensional web structure. The first inorganic fiber may have an average fiber diameter larger than an average fiber diameter of the second inorganic fiber.
A heat transfer suppression sheet contains a first inorganic particle, a resin binder; and an organic fiber, in which the organic fiber has a glass transition point higher than a glass transition point of the resin binder. At least a part of the organic fiber may be fused each other to form a three-dimensional framework.
A printed wiring board includes a first conductor layer, a resin insulating layer laminated on the first conductor layer, a second conductor layer formed on a surface of the resin insulating layer, and a via conductor formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer. The resin insulating layer includes resin and inorganic particles including first particles and second particles such that the first particles have flat exposed portions, the second particles are embedded in the resin, and the surface of the resin insulating layer includes the resin and the flat exposed portions of the first particles.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
A battery protection sheet contains a papermaking sheet layer containing a first inorganic fiber; and a cross layer made of a second inorganic fiber. The first inorganic fiber may have an average fiber length of 0.5 mm to 10 mm, the papermaking sheet layer may further contain an inorganic particle, the papermaking sheet layer may further contain a binding material.
H01M 50/242 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by physical properties of casings or racks, e.g. dimensions adapted for protecting batteries against vibrations, collision impact or swelling
H01M 50/204 - Racks, modules or packs for multiple batteries or multiple cells
H01M 50/293 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by spacing elements or positioning means within frames, racks or packs characterised by the material
A wiring substrate includes a core substrate including a glass substrate and a through-hole conductor, a resin insulating layer having an opening extending through the resin insulating layer, a conductor layer including a seed layer and an electrolytic plating layer on the seed layer, and a via conductor formed in the opening such that the via conductor electrically connects to the through-hole conductor in the core substrate and includes the seed layer and electrolytic plating layer extending from the conductor layer. The resin insulating layer includes resin and inorganic particles including first and second particles such that the first particles are partially embedded in the resin and that the second particles are embedded in the resin, the first particles have first portions protruding from the resin and second portions embedded in the resin respectively, the surface includes the resin and exposed surfaces of the first portions exposed from the resin.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 3/16 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material by cathodic sputtering
H05K 3/26 - Cleaning or polishing of the conductive pattern
H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
An inorganic fiber mat includes inorganic fibers, a particle obtained by firing an inorganic binder, and a mixture of an unfired inorganic binder and an organic binder.
D04H 1/72 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres characterised by the method of forming fleeces or layers, e.g. reorientation of fibres the fibres being randomly arranged
D21B 1/12 - Fibrous raw materials or their mechanical treatment by dividing raw materials into small particles, e.g. fibres by wet methods by the use of steam
A printed wiring board includes a first insulating layer, a connection conductor having a connection wiring, a second insulating layer formed on the connection conductor layer, a mounting conductor layer including a first electrode that mounts a first electronic component and a second electrode that mounts a second electronic component, and connection via conductors including a first connection via conductor that electrically connects the first electrode and the connection wiring and a second connection via conductor that electrically connects the second electrode and the connection wiring. The first insulating layer includes resin and inorganic particles including first particles and second particles such that each first particle has a first portion protruding from the resin and a second portion embedded in the resin, and the surface of the first insulating layer includes a surface of the resin and exposed surfaces of the first portions exposed from the surface of the resin.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/16 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material by cathodic sputtering
H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
A printed wiring board includes a first insulating layer, a connection conductor layer including wiring, a second insulating layer covering the connection conductor layer, a conductor layer including first and second electrodes such that the first electrode mounts a first electronic component and the second electrode mounts a second electronic component, and via conductors including first and second via conductors. The first via conductor connects the first electrode and wiring. The second via conductor connects the second electrode and wiring. The conductor layer includes a seed layer and an electrolytic plating layer. The seed layer includes a first layer formed on the first insulating layer and a second layer formed on the first layer, a width of the first layer is larger than a width of the second layer, and a width of the electrolytic plating layer is larger than the width of the first layer of the seed layer.
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/16 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material by cathodic sputtering
A coil substrate includes a flexible substrate, terminals formed on one side of the flexible substrate such that the terminals are positioned in a longitudinal direction of the flexible substrate, coils each comprising a first wiring formed on a first surface and a second wiring formed on a second surface on the opposite side with respect to the first surface, and connection wirings formed on the flexible substrate such that the connection wirings include wirings connecting the terminals and the coils respectively and wirings connecting two of the coils respectively and that the connection wirings extend obliquely with respect to the longitudinal direction of the flexible substrate. The coil substrate is wound along the longitudinal direction of the flexible substrate around an axis extending in an orthogonal direction orthogonal to the longitudinal direction such that the coil substrate is formed into a cylindrical shape.
H02K 3/04 - Windings characterised by the conductor shape, form or construction, e.g. with bar conductors
H02K 5/22 - Auxiliary parts of casings not covered by groups , e.g. shaped to form connection boxes or terminal boxes
H02K 7/00 - Arrangements for handling mechanical energy structurally associated with dynamo-electric machines, e.g. structural association with mechanical driving motors or auxiliary dynamo-electric machines
A printed wiring board includes a conductor layer including wirings, a resin insulating layer having openings, a mounting conductor layer including first and second electrodes, first via conductors including a seed layer and an electrolytic plating layer such that the first via conductors connect the first electrodes and the wirings, and second via conductors including the seed layer and electrolytic plating layer such that the second via conductors connect the second electrodes and the wirings. The first electrodes are positioned to mount a first electronic component. The second electrodes are positioned to mount a second electronic component. The first and second via conductors are formed such that the seed layer is covering an inner wall surface of each opening in the insulating layer and has a first portion and a second portion connected to the first portion and having a part of the first portion formed on the second portion.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/16 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material by cathodic sputtering
66.
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
A printed wiring board includes an insulating layer, and a conductor layer formed on the insulating layer and having degas holes formed such that the degas holes are penetrating through the conductor layer and exposing portions of the insulating layer. The conductor layer is formed such that each of the degas holes is a polygon shape having at least one inner angle of 100 degrees or more.
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
A coil substrate includes a flexible substrate having a first surface and a second surface on the opposite side with respect to the first surface, and coils including first wirings and second wirings such that the first wirings are formed on the first surface of the flexible substrate and that the second wirings are formed on the second surface of the flexible substrate. The flexible substrate has one or more recesses formed on one or more longitudinal sides of the flexible substrate and is formed to be wound in a circumferential direction around an axis extending in the width direction of the flexible substrate orthogonal to the longitudinal direction of the flexible substrate such that the flexible substrate is formed into a cylindrical shape.
A coil substrate includes a flexible substrate and coils including first wirings and second wirings. The first wirings are formed on a first surface of the substrate. The second wirings are formed on a second surface of the substrate. The flexible substrate has a first end in a longitudinal direction of the substrate and is wound from the first end in a circumferential direction around an axis extending in an orthogonal direction orthogonal to the longitudinal direction such that the substrate is formed into a cylindrical shape, the first surface of the substrate is positioned on an inner circumferential side of the cylindrical shape, and the second surface of the substrate is positioned on an outer circumferential side of the cylindrical shape, and the substrate has a first region adjacent to the first end such that the first region includes the second wirings and does not include the first wirings.
A motor coil substrate includes a coil substrate including a flexible substrate and coils such that the coils include first wirings formed on a first surface of the flexible substrate and second wirings formed on a second surface of the flexible substrate on the opposite side. The coil substrate is wound N turns where N is an integer of 2 or more in a circumferential direction such that the first surface of the flexible substrate is positioned on an inner circumferential side of the coil substrate, the second surface of the flexible substrate is positioned on an outer circumferential side of the coil substrate, and a gap is formed between an M-th layer where M is an integer equal to or larger than 1 and less than N and an (M+1)-th layer from an inner side of N circumferential layers formed by winding the coil substrate N turns.
A printed wiring board includes a mounting conductor layer including first and second electrodes, a connection conductor layer including connection wirings such that the connection wirings connect the first and second electrodes, a resin insulating layer formed between the mounting conductor layer and the connection conductor layer and having openings, and connection via conductors formed in the openings of the resin insulating layer and including first and second connection via conductors such that the first connection via conductors electrically connect the first electrodes and the connection wirings and the second connection via conductors electrically connect the second electrodes and the connection wirings. The resin insulating layer includes inorganic particles and resin. The inorganic particles include first inorganic particles forming inner wall surfaces in the openings and second inorganic particles embedded in the resin insulating layer. Shapes of the first inorganic particles are different from shapes of the second inorganic particles.
A wiring substrate includes a first build-up part including an insulating layer and a conductor layer, and a second build-up part laminated on the first build-up part and including an insulating layer and a conductor layer. The minimum width and minimum inter-wiring distance of wirings in the first build-up part are smaller than the minimum width and minimum inter-wiring distance of wirings in the second build-up part. The insulating layer in the first build-up part includes resin and inorganic particles including first inorganic particles partially embedded in the resin and second inorganic particles completely embedded in the resin such that the first inorganic particles have first portions protruding from the resin and second portions embedded in the resin, respectively. The insulating layer of the first build-up part has a surface covered by the conductor layer and including a surface of the resin and exposed surfaces of the first portions.
A wiring substrate includes a first build-up part including first insulating layers, first conductor layers, and first via conductors, and a second build-up part including second insulating layers and second conductor layers. The minimum wiring width and minimum inter-wiring distance in the first conductor layers are smaller than the minimum wiring width and minimum inter-wiring distance in the second conductor layers. The first conductor layers and via conductors include a first layer and a second layer formed on the first layer. The first layer includes a lower layer including a sputtering film including an alloy including copper, aluminum, and at least one element selected from nickel, zinc, gallium, silicon, and magnesium, and an upper layer including a sputtering film including copper. The lower layer is formed in contact with surfaces of the first insulating layers and inner wall surfaces and bottom surfaces in via openings for the first via conductors.
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
73.
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
A wiring substrate includes insulating layers including a first insulating layer and a second insulating layer, conductive layers including a first conductive layer including a pad and a second conductive layer, a coating film covering the first conductive layer including the pad and improving adhesion between the first conductive layer and the second insulating layer, and a via conductor formed in a through hole penetrating through the second insulating layer and the coating film on the pad and connecting the pad and the second conductive layer. The pad has a surface formed such that a root mean square roughness of the surface is in a range of 0.10 μm to 0.23 μm, and a peeling part is formed between the pad and the second insulating layer such that the peeling part is formed within 15 μm around an outer edge of the through hole on the surface of the pad.
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
A wiring substrate includes a core substrate having a through-hole conductor, a resin insulating layer formed on the core substrate, a conductor layer formed on the insulating layer and including a seed layer and an electrolytic plating layer, and a via conductor formed in the insulating layer. The via conductor electrically connects the through-hole conductor and conductor layer. The via conductor includes the seed layer and electrolytic plating layer extending from the conductor layer. The core substrate includes a glass substrate and has a through hole penetrating through the glass substrate. The through-hole conductor is formed in the through hole. The seed layer is covering inner wall surface of the insulating layer in opening in which the via conductor is formed. The seed layer has a first portion and a second portion electrically connected to the first portion. That part of the first portion is formed on the second portion.
H05K 1/09 - Use of materials for the metallic pattern
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
A wiring substrate includes a first build-up part including first insulating and conductor layers, and via conductors, and a second build-up part including second insulating and conductor layers. The minimum wiring width in the first conductor layers is smaller than the minimum wiring width in the second conductor layers. The minimum inter-wiring distance in the first conductor layers is smaller than the minimum inter-wiring distance in the second conductor layers. Each first conductor layer and each via conductor include first and second layers. The first layer includes a first portion covering respective surface of the first insulating layers, a second portion covering inner wall surface in respective via opening in the first insulating layers, and a third portion covering bottom surface in the respective via opening. The thickness of the first portion is larger than the thickness of the second portion and larger than the thickness of the third portion.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
A wiring substrate includes a first build-up part including an insulating layer and a conductor layer, and a second build-up part including an insulating layer and a conductor layer. The minimum wiring width of wirings in the conductor layer of the first build-up part is smaller than the minimum wiring width of wirings in the conductor layer of the second build-up part. The minimum inter-wiring distance of the wirings in the first part is smaller than the minimum inter-wiring distance of the wirings in the second part. The first build-up part is formed such that the conductor layer includes a conductor pattern including a first metal layer, a second metal layer, and a third metal layer. The width of the first metal layer is larger than the width of the second metal layer. The width of the third metal layer is larger than the width of the first metal layer.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
77.
Method of producing inorganic fiber mat and inorganic fiber mat
Provided is a method of producing an inorganic fiber mat, the method including: a preparing step of preparing a first inorganic fiber molding including an organic binder attached thereto and derived from a needle-punched mat; a defibrating step of defibrating the first inorganic fiber molding to obtain defibrated inorganic fibers; and a papermaking step of forming the inorganic fiber mat by papermaking using a slurry containing the defibrated inorganic fibers.
D04H 1/72 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres characterised by the method of forming fleeces or layers, e.g. reorientation of fibres the fibres being randomly arranged
D21B 1/12 - Fibrous raw materials or their mechanical treatment by dividing raw materials into small particles, e.g. fibres by wet methods by the use of steam
78.
THERMAL INSULATION SHEET, METHOD FOR PRODUCING THERMAL INSULATION SHEET, AND BATTERY PACK
A thermal insulation sheet containing a thermal insulation material containing inorganic particles and a resin film covering at least a part of a surface of the thermal insulation material. A method for producing the thermal insulation sheet, including: molding a material for a thermal insulation material containing the inorganic particles into a sheet shape; and coating the surface of the thermal insulation material molded into the sheet shape with the resin film forming composition by a screen printing method or a spray coat printing method to form the resin film.
H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
F16L 59/02 - Shape or form of insulating materials, with or without coverings integral with the insulating materials
H01M 50/204 - Racks, modules or packs for multiple batteries or multiple cells
H01M 50/293 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by spacing elements or positioning means within frames, racks or packs characterised by the material
79.
THERMAL INSULATION MATERIAL AND METHOD FOR PRODUCING THERMAL INSULATION MATERIAL
A thermal insulation material having carbon fibers, the thermal insulation material containing; a covering layer containing pyrolytic carbon at a surface of the thermal insulation material; and a base layer containing carbon-based particles between the carbon fibers below the covering layer. A method for producing a thermal insulation material including: forming a base layer by impregnating a surface of a molded body containing carbon fibers with a slurry containing carbon-based particles; and forming a covering layer containing pyrolytic carbon on the base layer by applying a chemical vapor deposition method to the molded body in a CVD furnace.
A wiring substrate includes a first build-up part including first insulating and conductor layers, and via conductors, and a second build-up part including second insulating and conductor layers. The first build-up part is laminated on the second build-up part. The minimum wiring width of wirings in the first conductor layers is smaller than the minimum wiring width of wirings in the second conductor layers. The minimum inter-wiring distance of the wirings in the first conductor layers is smaller than the minimum inter-wiring distance of the wirings in the second conductor layers. The first conductor layers and via conductors include a first layer and a second layer. The first layer of each via conductor is covering inner wall surface in a via opening and has a first portion and a second portion. The first portion has a portion formed closer to the center of the via opening than the second portion.
Provided is a method of producing an inorganic fiber mat the method including: a preparing step of preparing a first inorganic fiber molding derived from a needle-punched mat and a second inorganic fiber molding derived from a papermaking mat; a defibrating step of defibrating the first inorganic fiber molding and the second inorganic fiber molding to obtain defibrated inorganic fibers; and a papermaking step of forming the inorganic fiber mat by papermaking using a slurry containing the defibrated inorganic fibers.
D04H 1/70 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres characterised by the method of forming fleeces or layers, e.g. reorientation of fibres
D04H 1/46 - Non-woven fabrics formed wholly or mainly of staple fibres or like relatively short fibres from fleeces or layers composed of fibres without existing or potential cohesive properties the fleeces or layers being consolidated by mechanical means, e.g. by rolling by needling or like operations to cause entanglement of fibres
D21B 1/12 - Fibrous raw materials or their mechanical treatment by dividing raw materials into small particles, e.g. fibres by wet methods by the use of steam
D21B 1/32 - Defibrating by other means of waste paper
An assembled battery in which a plurality of battery cells is connected serially or in parallel, the battery cells each having an electrode surface having an electrode and a peripheral surface orthogonal to the electrode surface and being disposed such that the peripheral surfaces face each other. The assembled battery contains the battery cells, an insulating material covering the peripheral surface of the battery cells, and a heat dissipation member covering the peripheral surface of the battery cells which is covered with the insulating material. The insulating material has a plurality of holes piercing the insulating material from a surface thereof facing the battery cells to a surface thereof facing the heat dissipation member.
H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
A wiring substrate includes a core substrate including a through-hole conductor, a first resin insulating layer, a first conductor layer including a seed layer and an electrolytic plating layer, a via conductor formed such that the via conductor electrically connects the through-hole conductor and first conductor layer, and a second resin insulating layer covering the first conductor layer. The core substrate includes a glass substrate such that the through-hole conductor is penetrating through the glass substrate, the seed layer includes a first layer formed on the first resin insulating layer and a second layer formed on the first layer, and the first conductor layer includes a conductor circuit such that a width of the first layer is larger than a width of the second layer in the conductor circuit and a width of the electrolytic plating layer is larger than the width of the first layer in the conductor circuit.
H05K 3/16 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material by cathodic sputtering
84.
FLAMEPROOF SHEET, ASSEMBLED BATTERY, AND BATTERY PACK
A flameproof sheet for use in an assembled battery in which a plurality of battery cells is connected serially or in parallel, the battery cells each having an electrode surface having an electrode and a peripheral surface orthogonal to the electrode surface and being disposed such that the peripheral surfaces face each other. The flameproof sheet contains a pair of flameproof materials and an elastic member disposed between the pair of flameproof materials.
H01M 50/383 - Flame arresting or ignition-preventing means
H01M 50/209 - Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for prismatic or rectangular cells
H01M 50/213 - Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for cells having curved cross-section, e.g. round or elliptic
H01M 50/291 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by spacing elements or positioning means within frames, racks or packs characterised by their shape
H01M 50/293 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by spacing elements or positioning means within frames, racks or packs characterised by the material
A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on a surface of the resin insulating layer, and a via conductor formed in the resin insulating layer such that the via conductor is connecting the first and second conductor layers and has a land portion extending on a boundary part of the resin insulating layer. The via conductor is formed in a via hole formed in the resin insulating layer. The resin insulating layer is formed such that the boundary part has a surface roughness that is larger than a surface roughness of the surface on which the second conductor layer formed and that an inner wall surface in the via hole in the resin insulating layer is equal to or larger than the surface roughness of the boundary part of the resin insulating layer.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 3/16 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material by cathodic sputtering
A wiring substrate includes a core substrate including a glass substrate and a through-hole conductor formed in the glass substrate, a resin insulating layer formed on the core substrate and including resin and inorganic particles, a conductor layer formed on the insulating layer and including a seed layer and an electrolytic plating layer, and a via conductor formed in the insulating layer such that the via conductor is electrically connected to the through-hole conductor formed in the glass substrate and includes the seed layer and electrolytic plating layer extending from the conductor layer. The conductor layer and the via conductor are formed such that the seed layer is formed by sputtering, and the resin insulating layer has an opening in which the via conductor is formed such that the inorganic particles include first particles forming an inner wall surface in the opening and second particles embedded in the insulating layer.
H05K 3/16 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material by cathodic sputtering
A wiring substrate includes a core substrate including a through-hole conductor, a resin insulating layer formed on the core substrate, a conductor layer formed on a surface of the resin insulating layer and including a seed layer and an electrolytic plating layer formed on the seed layer, and a via conductor formed in the resin insulating layer such that the via conductor is connected to the through-hole conductor in the core substrate and includes the seed layer and electrolytic plating layer extending from the conductor layer. The core substrate includes a glass substrate such that the through-hole conductor is formed in a through hole penetrating through the glass substrate, and the conductor layer and via conductor are formed such that the seed layer is formed by sputtering and includes an alloy including copper, aluminum, and one or more metals selected from nickel, zinc, gallium, silicon, and magnesium.
H05K 3/16 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material by cathodic sputtering
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on the resin insulating layer and including a seed layer and a metal layer on the seed layer, a via conductor formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer, and a base layer formed on the resin insulating layer and including resin and one of iron and chromium in a range of 0.2 at % to 5.0 at % with respect to the resin such that the base layer includes part formed between the resin insulating layer and the seed layer.
A printed wiring board includes a first conductor layer, a resin insulating layer including resin and inorganic particles, a second conductor layer including a seed layer and an electrolytic plating layer on the seed layer, and a via conductor connecting the first conductor layer and second conductor layer and including the seed layer and electrolytic plating layer extending from the second conductor layer. The second conductor layer and via conductor are formed such that the seed layer includes an alloy including copper, aluminum and a metal including one or more metals selected from nickel, zinc, gallium, silicon and magnesium, and the resin insulating layer is formed such that the inorganic particles include first inorganic particles forming an inner wall surface in the opening and second inorganic particles embedded in the resin insulating layer and that shapes of the first inorganic particles are different from shapes of the second inorganic particles.
A printed wiring board includes a first conductor layer, a resin insulating layer formed on the first conductor layer, a second conductor layer formed on the resin insulating layer and including a seed layer and an electrolytic plating layer, and a via conductor connecting the first conductor layer and the second conductor layer and including the seed layer and electrolytic plating layer extending from the second conductor layer. The second conductor layer and via conductor are formed such that the seed layer includes a first layer including copper, aluminum and one or more metals selected from nickel, zinc, gallium, silicon and magnesium, and a second layer formed on the first layer and including copper. The seed layer in the via conductor has a first portion and a second portion such that the first portion is electrically connected to the second portion and has a portion formed on the second portion.
A wiring substrate includes a core substrate including a glass substrate, a resin insulating layer including inorganic particles and resin, a conductor layer including a seed layer and an electrolytic plating layer such that the conductor layer includes signal wirings, and a via conductor formed in an opening formed in the resin insulating layer and including the seed layer and electrolytic plating layer extending from the conductor layer. The core substrate includes a through-hole conductor formed such that the core substrate has a through hole penetrating through the glass substrate and the through-hole conductor is formed in the through hole, the via conductor is electrically connected to the through-hole conductor formed in the core substrate, and the resin insulating layer is formed such that the surface upon which the conductor layer is formed includes the resin and an inner wall surface in the opening includes the resin and inorganic particles.
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
A wiring substrate includes an electrical wiring part including insulating layers and conductor layers, and an optical wiring part formed on a surface of the electrical wiring part and including a support plate and an optical waveguide formed on the support plate. The optical wiring part is formed such that the optical waveguide includes at least one core part that transmits light and a cladding part surrounding the at least one core part and that the support plate has a thermal expansion coefficient that is lower than a thermal expansion coefficient of the optical waveguide.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
A printed wiring board includes a first conductor layer, a resin insulating layer including glass particles and resin, a second conductor layer formed on a surface of the resin insulating layer and including a seed layer and an electrolytic plating layer, and a via conductor connecting the first conductor layer and second conductor layer and including the seed layer and electrolytic plating layer extending from the second conductor layer. The second conductor layer and the via conductor are formed such that the second conductor layer includes signal wirings and that the seed layer is formed by sputtering an alloy including copper, aluminum, and one or more metals selected from nickel, zinc, gallium, silicon, and magnesium, and the resin insulating layer is formed such that the surface of the resin insulating layer includes the resin and that an inner wall surface in the opening includes the resin and the glass particles.
A printed wiring board includes a base insulating layer, a conductor layer formed on the base layer and including first and second pads, a solder resist layer formed on the base layer, covering the conductor layer and having first opening exposing the first pad and second opening exposing the second pad, bumps including a first bump and a second bump such that the first bump is formed on the first conductor pad of the conductor layer and that the second bump is formed on the second conductor pad of the conductor layer. The second opening has diameter smaller than diameter of the first opening, the second bump has diameter smaller than diameter of the first bump, the first pad has a first recess formed on the first pad, the second pad has a second recess formed on the second pad, and the first recess is larger than the second recess.
A printed wiring board includes a first conductor layer, a resin insulating layer including inorganic particles and resin, a second conductor layer including a seed layer and an electrolytic plating layer, and a via conductor connecting the first conductor layer and second conductor layer and including the seed layer and electrolytic plating layer extending from the second conductor layer. The inorganic particles include first particles, second particles, third particles and fourth particles formed such that the first and second particles are solid particles, the third and fourth particles are hollow particles, the first and third particles form an inner wall surface of the opening in the resin insulating layer, the second and fourth particles are embedded in the resin insulating layer, the first particles have shapes that are different from shapes of the second particles, and the third particles have shapes that are different from shapes of the fourth particles.
H05K 3/16 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material by cathodic sputtering
A printed wiring board includes a conductor layer, an outermost insulating layer formed on the conductor layer and having an opening exposing a portion of the conductor layer, and a metal post formed in the opening of the outermost insulating layer and including a seed layer and an electrolytic plating layer formed on the seed layer such that the metal post has a height exceeding a surface of the outermost insulating layer and has a portion exceeding a height of the outermost insulating layer, the seed layer of the metal post has a first layer and a second layer formed on the first layer. The portion exceeding the height of the outermost insulating layer is formed such that a width of the first layer is larger than a width of the second layer, and a width of the electrolytic plating layer is larger than the width of the first layer.
H05K 3/16 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material by cathodic sputtering
97.
Antiviral substrate, antiviral composition, method for manufacturing antiviral substrate, antimicrobial substrate, antimicrobial composition and method for manufacturing antimicrobial substrate
In an antimicrobial substrate, a cured material of a binder containing a copper compound and a polymerization initiator is fixed onto a surface of a base material. At least a part of the copper compound is exposed on a surface of the cured material of the binder. A surface composition ratio of the cured material of the binder obtained by an energy dispersive X-ray analyzer is calculated on a basis of a peak intensity of a characteristic X-ray of a carbon element and a copper element that are a main constituent element of a resin component, and a weight ratio is C/Cu=28.0/1.0 to 200.0/1.0.
A wiring substrate includes an insulating layer, a conductor pad that is formed on a surface of the insulating layer and is connected to a component such that the insulating layer has a component region that is covered by the component connected to the conductor pad, and an optical waveguide including a core part that transmits light and is positioned on an outer side of the component region of the insulating layer such that the core part has an end surface exposed and facing a component region side. The optical waveguide is positioned such that the end surface of the core part is adjacent to the component region.
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
The objective of the invention is to provide a plant activator having a resistance to the wash-off and a superior handleability, transportability and storage stability. A powdery plant activator comprising, at least one compound selected from an oxo fatty acid or a derivative or a salt thereof and a hydroxy fatty acid or a derivative or a salt thereof, and an unsaturated fatty acid (excluding an oxo fatty acid and a hydroxy fatty acid).
A01N 37/36 - Biocides, pest repellants or attractants, or plant growth regulators containing organic compounds containing a carbon atom having three bonds to hetero atoms with at the most two bonds to halogen, e.g. carboxylic acids containing at least one carboxylic group or a thio-analogue, or a derivative thereof, and a singly bound oxygen or sulfur atom attached to the same carbon skeleton, this oxygen or sulfur atom not being a member of a carboxylic group or of a thio-analogue, or of a derivative thereof, e.g. hydroxy-carboxylic acids
A01N 37/42 - Biocides, pest repellants or attractants, or plant growth regulators containing organic compounds containing a carbon atom having three bonds to hetero atoms with at the most two bonds to halogen, e.g. carboxylic acids containing within the same carbon skeleton a carboxylic group or a thio-analogue, or a derivative thereof, and a carbon atom having only two bonds to hetero atoms with at the most one bond to halogen, e.g. keto-carboxylic acids
A wiring substrate includes a first insulating layer, a first conductive layer laminated on a surface of the first insulating layer and including pads, a second insulating layer laminated on the first insulating layer such that the second insulating layer is covering the first conductive layer and has a cavity exposing the pads of the first conductive layer, an electronic component accommodated in the cavity of the second insulating layer such that the electronic component has electrodes formed on a surface of the electronic component, and a conductive connecting part formed between the electrodes of the electronic components and the pads of the first conductive layer in the cavity of the second insulating layer such that the conductive connecting part electrically connects the electrodes of the electronic components and the pads of the first conductive layer.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H01L 23/00 - Details of semiconductor or other solid state devices
patents
