A high-speed circuit assembly includes a high-speed circuit including at least one waveguide/transmission line, and a radiation absorbing material disposed in contact with or in close proximity with the waveguide/transmission line.
G01R 1/04 - HousingsSupporting membersArrangements of terminals
H01R 13/646 - Details of coupling devices of the kinds covered by groups or specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
An apparatus (100) including a contactor (102) having a hole (106) and including a radio frequency absorptive material (108) and a probe (104) inserted in the hole (106) to couple a test signal to a device under test, such as an integrated circuit (206), is disclosed. A test system for testing integrated circuits (206) including a contactor (102) including a radio frequency absorptive material (108) is disclosed. A method for making the contactor (102) is also disclosed, where the radio frequency absorptive material (108) is formed by 3D printing, moulding, coating or micro-machining.
An apparatus (100) including a contactor (102) having a hole (106) and including a radio frequency absorptive material (108) and a probe (104) inserted in the hole (106) to couple a test signal to a device under test, such as an integrated circuit (206), is disclosed. A test system for testing integrated circuits (206) including a contactor (102) including a radio frequency absorptive material (108) is disclosed. A method for making the contactor (102) is also disclosed, where the radio frequency absorptive material (108) is formed by 3D printing, moulding, coating or micro-machining.
An apparatus including a contactor having a hole and including a radio frequency absorptive material and a probe inserted in the hole to couple a test signal to a device under test is disclosed. A test system for testing integrated circuits including a contactor including a radio frequency absorptive material is disclosed. A method for making the contactor is also disclosed.
A verification probe system is configured to verify an automated test platform and includes: an integrated circuit test probe assembly; and a moveable platform configured to position the integrated circuit test probe assembly proximate one of more conductive pins included within a test socket assembly of the automated test platform.
An apparatus and method for the manufacturing and use in a semiconductor test system is disclosed. The apparatus includes a signal probe and a dielectric sleeve surrounding the signal probe. A method includes forming a mold to receive a component of a contactor assembly, inserting the component into the mold, and forming a dielectric sleeve in at least one of the one or more signal probe holes through an injection molding process. The component includes one or more signal probe holes.
A test socket assembly includes a contactor body having one or more compliant interconnects, and a socket opening sized and configured to receive a device under test therein. The test socket assembly further includes a lead frame assembly disposed within the contactor body and electrically coupled with the one or more compliant interconnects, and one or more antennas at least partially disposed within the contactor body, the one or more antennas configured to directly and wirelessly communicate to the device under test when the device is disposed within the socket opening.
A high-speed circuit assembly includes a high-speed circuit including at least one waveguide/transmission line, and a radiation absorbing material disposed in contact with or in close proximity with the waveguide/transmission line.
G01R 1/04 - HousingsSupporting membersArrangements of terminals
H01R 13/646 - Details of coupling devices of the kinds covered by groups or specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
A test contactor is disclosed. The test contactor includes two or more dielectric layers and a test probe embedded in the one or more dielectric layers. The test contactor traverses the one or more dielectric layers. The test probe to include an input signal port and an output signal port and the test probe to transmit a test signal from the input signal port to the output signal port.
A test socket assembly including a contactor body having a socket opening sized and configured to receive a device under test therein, and one or more waveguides at least partially disposed within the contactor body or external to the contactor body. The assembly further including at least one waveguide antenna probe coupled with the one or more waveguides, where the at least one waveguide antenna probe including a first set of sides and a second set of sides, at least one of the first set of sides are flared out away from the longitudinal axis.
A high speed circuit assembly includes a high speed circuit including at least one transmission line extending to a transmission line end, and radar absorbing material disposed adjacent the transmission line.
A test probe for use with a testing apparatus. The test probe includes a first portion, a second portion, and a third portion, with hinges between the first and second portions and the second and third portions. The first portion folded at the first hinge over the second portion, the third portion folded at the second hinge over the second portion, where the second portion is stacked between the first portion and the third portion. The test probe is compressible from a first uncompressed state to a second compressed state.
A hybrid probe head assembly for testing a wafer device under test includes a housing, at least a portion of a lead frame assembly disposed in the housing, the lead frame assembly including a at least one cantilever portion, the at least one cantilever portion including an undeflected position and a deflected position, where the lead frame assembly hinges between the undeflected position and the deflected position at a lead frame pivot point, and the at least one cantilever portion extends to a wafer contact. In the undeflected position, the at least one cantilever portion is disposed at a 8-12 degree angle, and in the deflected position, the at least one cantilever portion is disposed at a 2-4 degree angle. One or more spring probes are disposed within the housing and have a wafer contact tip.
A hybrid probe head assembly for testing a wafer device under test includes a housing, at least a portion of a lead frame assembly disposed in the housing, the lead frame assembly including a at least one cantilever portion, the at least one cantilever portion including an undeflected position and a deflected position, where the lead frame assembly hinges between the undeflected position and the deflected position at a lead frame pivot point, and the at least one cantilever portion extends to a wafer contact. In the undeflected position, the at least one cantilever portion is disposed at a 8 - 12 degree angle, and in the deflected position, the at least one cantilever portion is disposed at a 2 - 4 degree angle. One or more spring probes are disposed within the housing and have a wafer contact tip.
A test socket assembly for coupling a device under test to a test apparatus includes a housing, and a pivotable link, elastomer, and slidable mount at least partially disposed within a cavity of the housing. The pivotable link and slidable mount are disposed adjacent to the elastomer such that the elastomer biases both the first contact end of the link and the PCB contact members of the slidable mount toward out of the housing. The slidable mount has a side wall defined by a side wall plane, where the side wall plane is vertically slidable along an inner side wall of the housing.
A test socket assembly includes a frame assembly having one or more compliant interconnects, and a socket opening sized and configured to receive a device under test therein. The test socket assembly further includes a lead frame assembly disposed adjacent to the frame assembly and electrically coupled with the one or more compliant interconnects. The lead frame assembly includes a hybrid ring coupler.
The invention relates to a test needle for measuring electrically conductive layers in holes in printed circuit boards, and to a test probe having a test needle of this type and a finger tester for testing printed circuit boards which has a test needle of this type or a test probe of this type. The test needle has a capacitive measuring element which is connected to a capacitive measuring device by means of a cable. The cable is shielded and therefore only the capacitive measuring element is able to form a capacitive coupling with additional electrically conductive elements. As a result, this capacitive coupling can be determined with high spatial resolution.
A test socket assembly includes a contactor body having one or more compliant interconnects, and a socket opening sized and configured to receive a device under test therein. The test socket assembly further includes a lead frame assembly disposed within the contactor body and electrically coupled with the one or more compliant interconnects, and one or more antennas at least partially disposed within the contactor body, the one or more antennas configured to directly and wirelessly communicate to the device under test when the device is disposed within the socket opening.
A test socket assembly includes a socket housing having one or more spring probes therein, and a lead frame assembly including one or more cantilever members. The test socket assembly further includes at least one linear spring damper disposed within the socket housing adjacent the lead frame assembly and supporting the cantilever members, the at least one linear spring damper extending from a first end to a second end, the second end disposed adjacent to a second movable end portion of the one or more cantilever members.
A test socket assembly includes a contactor body, the contactor body having a socket opening sized and configured to receive a device under test therein. A lead frame assembly is disposed within the contactor body, the lead frame assembly includes at least a portion of a waveguide transition. At least one transmission line is disposed within the lead frame assembly, the at least one transmission line configured to communicate to the device under test when the device under test is disposed within the socket opening. One or more rectangular waveguides are at least partially disposed within the contactor body or external to the contactor body, and the waveguide transition is configured to provide a transition between the at least one transmission line and the rectangular waveguide, the waveguide transition disposed within the contactor body.
The invention relates to a testing device and to a method for testing printed circuit boards, in particular unpopulated or partially populated printed circuit boards. The testing device is a finger tester having a shuttle or two sub-shuttles (5, 6), which can alternately move a printed circuit board to be tested to a testing region. In addition, the sub-shuttles can be used to jointly hold a large printed circuit board.
An automated microtester array, for simultaneously testing a plurality of devices under test, includes a plurality of automated microtesters, wherein each of the plurality of automated microtesters is configured to test a plurality of devices under test. A central computing system is configured to automate the testing of the plurality of devices under test coupled to the plurality of automated microtesters. A method and computer program product for instructing a plurality of automated microtesters to load an automated test process; and instructing the plurality of automated microtesters in execute the automated test process.
A test probe for use with a testing apparatus. The test probe includes a first portion, a second portion, and a third portion, with hinges between the first and second portions and the second and third portions. The first portion folded at the first hinge over the second portion, the third portion folded at the second hinge over the second portion, where the second portion is stacked between the first portion and the third portion. The test probe is compressible from a first uncompressed state to a second compressed state.
An automated microtester, for simultaneously testing a plurality of devices under test, includes a processing system including a plurality of processor assemblies. A plurality of test sites are configured to releasably engage a plurality of devices under test. An instrumentation system is controllable by the processing system and is configured to provide one or more input signals to the plurality of test sites and read one or more monitored signals from the plurality of test sites.
A test socket with a link and mount system is used to couple a device under test to a testing apparatus for quick and reliable testing of microchips post-production. The socket includes a pivoting link that connects to the DUT, an elastomer for biasing the link in a first preferred orientation, and a mount that operates as a fulcrum to rotate the link into engagement with the DUT. The mount includes projections that extend below a bottom surface of the socket, such that engagement of the mount with the test device at the projections translates the mount parallel to a diagonal support wall in the socket such that the mount is driven away from the bottom surface of the socket and also toward the elastomer. The socket includes a gap above the mount to allow for movement of the mount within the socket, eliminating the fixed arrangement and the non-compliant loads that accompany the engagement of the mount to the test apparatus. The mount projections carry a small preload that ensures successful contact with the test equipment without the risk of damaging the test equipment with rigid contact surfaces.
H01R 12/71 - Coupling devices for rigid printing circuits or like structures
G01R 1/04 - HousingsSupporting membersArrangements of terminals
H01R 4/48 - Clamped connectionsSpring connections using a spring, clip or other resilient member
H01R 12/00 - Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocksCoupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structuresTerminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
H01R 13/00 - Details of coupling devices of the kinds covered by groups or
A test socket with a link and mount system is used to couple a device under test to a testing apparatus for quick and reliable testing of microchips post-production. The socket includes a pivoting link that connects to the DUT, an elastomer for biasing the link in a first preferred orientation, and a mount that operates as a fulcrum to rotate the link into engagement with the DUT. The mount includes projections that extend below a bottom surface of the socket, such that engagement of the mount with the test device at the projections translates the mount parallel to a diagonal support wall in the socket such that the mount is driven away from the bottom surface of the socket and also toward the elastomer. The socket includes a gap above the mount to allow for movement of the mount within the socket, eliminating the fixed arrangement and the non-compliant loads that accompany the engagement of the mount to the test apparatus. The mount projections carry a small preload that ensures successful contact with the test equipment without the risk of damaging the test equipment with rigid contact surfaces.
G01R 1/04 - HousingsSupporting membersArrangements of terminals
G01R 31/26 - Testing of individual semiconductor devices
H01R 12/85 - Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
H01R 9/05 - Connectors arranged to contact a plurality of the conductors of a multiconductor cable for coaxial cables
A socket assembly including a housing that has one or more spring probes therein. The socket assembly further includes a leadframe assembly that has one or more cantilever members, and the leadframe assembly has microwave structures and a flexible ground plane. The socket assembly further includes an elastomeric spacer adjacent the leadframe assembly, the elastomeric spacer having one or more holes receiving the spring probes therethrough.
An automated test platform includes a CPU subsystem housed in an enclosure and configured to execute an automated test process. A test head is housed in the enclosure and is configured to apply one or more test signals to a device under test. A power supply is housed in the enclosure and is configured to provide electrical power to the CPU subsystem and the test head.
A method, computer program product, computing system, and an automated test platform for testing at least one device under test includes a test head configured to receive the at least one device under test. A processing system is configured to: provide a voltage signal having a plurality of voltages to the at least one device under test, and monitor a current flow into the at least one device under test during each of the plurality of voltages, thus generating a plurality of monitored current values that correspond to the plurality of voltages. The plurality of monitored current values are stored.
A method, computer program product, computing system, and an automated test platform for testing at least one device under test includes a test head configured to receive the at least one device under test. A processing system is configured to: provide a voltage signal having a plurality of voltages to the at least one device under test, monitor a current flow into the at least one device under test during each of the plurality of voltages, thus generating a plurality of monitored current values that correspond to the plurality of voltages, and determine if one or more of the plurality of monitored current values exceeds one or more of a plurality of current thresholds.
A method, computer program product, computing system, and an automated test platform for testing at least one device under test includes a test head configured to receive the at least one device under test. A processing system is configured to: provide a voltage signal having a plurality of voltages to the at least one device under test, and monitor a current flow into the at least one device under test during each of the plurality of voltages, thus generating a plurality of monitored current values that correspond to the plurality of voltages. The plurality of monitored current values are stored.
A method, computer program product, computing system, and an automated test platform for testing at least one device under test includes a test head configured to receive the at least one device under test. A processing system is configured to: provide a voltage signal having a plurality of voltages to the at least one device under test, monitor a current flow into the at least one device under test during each of the plurality of voltages, thus generating a plurality of monitored current values that correspond to the plurality of voltages, and determine if one or more of the plurality of monitored current values exceeds one or more of a plurality of current thresholds.
The invention relates to a positioning device for a parallel tester (1), a parallel tester (1) and to a method for testing a printed circuit board. One aspect to the invention relates to fine adjusting a positioning device wherein the test adapter (14) can be secured to an inner holding part (28) of a holding device, and the inner holding part (28) can be moved in relation to the remaining positioning device. Exclusively one or more pivot joints and/or one or more air bearings and/or more magnetic bearings are provided as bearings.
An integrated circuit test socket includes a highly conductive compliant material that is cut and installed into the test socket. The conductive material draws electrical charge away from the test socket, leading to more accurate testing. The test socket base is grounded, and a ground current runs through the base and into conductive strips. The configuration forms an electromagnetic impulse shield, protecting the chip from electromagnetic interference. The compliance of the shield material allows the shield to be sealed when activated, ensuring that the electromagnetic impulse shield is complete around the semi-conductor chip.
An automated test platform for testing a first device under test includes N voltage sources for providing N different voltages. A cross matrix switching system is coupled to the N voltage sources, the cross matrix switch being configured to provide the N different voltages to M discrete test points within the first device under test, wherein M is larger than N. An N voltage measuring system is coupled to the first device under test, the N voltage measuring system being configured to measure the voltage potential present on the M discrete test points.
A socket for testing or connecting an integrated circuit is disclosed having a platform for receiving the integrated circuit and adapted to overlay a piece of test equipment or other board, the platform formed with an array of slots each locating a portion of a two-piece connector assembly. When the integrated circuit is seated on the platform, the two piece connector assemblies pivot so as to make contact between a contact pad on the IC and the board for establishing or evaluating signal transmission by the IC. The platform houses a resilient elongate elastomer that biases the connector assembly out of the platform to make contact with the board or test equipment. When the IC is placed on the platform, the bias of the resilient tubular member is overcome and an electrical connection is established across the connector assembly.
H01R 13/64 - Means for preventing, inhibiting or avoiding incorrect coupling
H01R 12/85 - Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
A socket assembly including a housing that has one or more spring probes therein. The socket assembly further includes a leadframe assembly that has one or more cantilever members, and the leadframe assembly has microwave structures and a flexible ground plane. The socket assembly further includes an elastomeric spacer adjacent the leadframe assembly, the elastomeric spacer having one or more holes receiving the spring probes therethrough.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
A socket for testing or connecting an integrated circuit is disclosed having a platform for receiving the integrated circuit and adapted to overlay a piece of test equipment or other board, the platform formed with an array of slots each locating a portion of a two-piece connector assembly. When the integrated circuit is seated on the platform, the two piece connector assemblies pivot so as to make contact between a contact pad on the IC and the board for establishing or evaluating signal transmission by the IC. The platform houses a resilient elongate elastomer that biases the connector assembly out of the platform to make contact with the board or test equipment. When the IC is placed on the platform, the bias of the resilient tubular member is overcome and an electrical connection is established across the connector assembly.
H01R 12/85 - Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures
H01R 12/87 - Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting automatically by insertion of rigid printed or like structures
H01R 13/15 - Pins, blades or sockets having separate spring member for producing or increasing contact pressure
A socket assembly including a housing that has one or more spring probes therein. The socket assembly further includes a leadframe assembly that has one or more cantilever members, and the leadframe assembly has microwave structures and a flexible ground plane. The socket assembly further includes an elastomeric spacer adjacent the leadframe assembly, the elastomeric spacer having one or more holes receiving the spring probes therethrough.
A debugging system for debugging an automated test process used on an automated test platform. The debugging system includes a debugging subsystem and a debugging coupler electrically coupled to the debugging subsystem. The debugging coupler is configured to be releasably electrically coupleable to a test head of the automated test platform.
An integrated circuit test socket is adapted to use with Kelvin connectors by creating closely spaced connectors and counter-rotating links that are nested to conserve space. The connectors are shaped to make contact with a chip and communicate force and sense signals to a tester, allowing a measure of the chip's actual resistance.
A test probe assembly includes a first elongate electrically conductive plunger that extends from a proximal first plunger end to a distal first plunger end, and is defined in part by a central longitudinal axis. The first plunger has a first spring latch at the distal first plunger end. At least a portion of the first plunger has an arc with a first plunger outer contact point opposite the first spring latch relative to the longitudinal axis. The first plunger is disposed in a spring. The first plunger outer contact point in contact with the inner diameter of the spring, and the first spring latch engages at least a portion of the spring. A method includes disposing a first plunger within a spring along a spring longitudinal axis, disposing a second probe within the spring along the spring longitudinal axis, and engaging the spring latch and the second plunger spring latch with the spring, for instance by capturing an end coil of the spring with the spring latch of at least one of the spring latch or the second plunger spring latch.
A wiring board for transmission of test signals between test point locations on a circuit board under test and an external analyzer having compliant contacts making electrical contact with a pad positioned on a conductive surface circuit layer having a trace extending to a second pad having a hole for receipt of an interface pin having a swaged head electrically connected to the external analyzer.
∘. The magnitude and phase of the distortion component of the first source may be determined based upon, at least in part, the first and second differential residual signal.
G01R 27/28 - Measuring attenuation, gain, phase shift, or derived characteristics of electric four-pole networks, i.e. two-port networksMeasuring transient response
A cross-bar unit for a test apparatus for circuit boards having at least one cross-bar spanning a test field in which a circuit board to be tested may be placed, and is configured to hold positioning units for test fingers in a linearly traversable manner so that the test fingers are able to scan at least part of the test field. The cross-bar unit is configured to hold at least two linear guides, independent of one another, for guiding in each case at least one of the positioning units.
The invention relates to a crossmember unit (2) for a test apparatus (1) for printed circuit boards, wherein the crossmember unit (2) has at least one crossmember (9), which spans a test area in which a printed circuit board to be tested can be arranged, and is designed to receive positioning units (6) for test fingers (8) in a linearly movable manner in such a way that the test fingers (8) can scan at least a portion of the test area. According to the invention, the crossmember unit (2) is designed to receive at least two linear guides (5), which are independent of one another, for guiding in each case at least one of the positioning units (6). The invention is also directed to a test apparatus (1) having at least one crossmember unit (2) of this kind.
A socket mount for use in connection with an integrated circuit test socket having a body with fastener holes, a plurality of electrical connector links, and a plurality of elastomer elements biasing said links, the socket mount comprising a block having a flat upper surface, a flat lower surface, and four flat edges defining a square, and respective fastener holes aligned with the fastener holes in the test socket, a first groove oriented perpendicularly with respect to a flat edge along the flat lower surface, and a second groove oriented diagonally from a first edge to a second edge along the flat lower surface, the grooves having a length equal to a length of elastomer in the test socket.
H01R 12/00 - Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocksCoupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structuresTerminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
H01L 23/32 - Holders for supporting the complete device in operation, i.e. detachable fixtures
G01R 1/04 - HousingsSupporting membersArrangements of terminals
H01L 23/00 - Details of semiconductor or other solid state devices
H01R 12/71 - Coupling devices for rigid printing circuits or like structures
49.
Automated test platform utilizing segmented data sequencers to provide time controlled test sequences to device under test
A segmented subsystem, for use within an automated test platform, includes a first subsystem segment including a first data sequencer configured to coordinate the execution of one or more instructions within the first subsystem segment. A second subsystem segment includes a second data sequencer configured to coordinate the execution of one or more instructions within the second subsystem segment.
A method, computer program product, and computing system for, upon the occurrence of a computer-related event, comparing code utilized by one or more subsystems included within a scalable test platform to code available from a remote location. If the code available from the remote location is newer than the code utilized by one or more subsystems, the code available from the remote location is obtained, thus defining newer code. The code utilized by one or more subsystems is updated with the newer code.
A segmented subsystem, for use within an automated test platform, includes a first subsystem segment configured to execute one or more instructions within the first subsystem segment. A second subsystem segment is configured to execute one or more instructions within the second subsystem segment. The first subsystem segment includes: a first functionality, a second functionality, and a status polling engine. The status polling engine is configured to: determine a first status for the first functionality and a second status for the second functionality, and generate a consolidated status indicator for the first subsystem segment based, at least in part, upon the first status for the first functionality and the second status for the second functionality.
A high voltage connector assembly includes a plurality of pin assemblies, each of the plurality of pin assemblies having a first end and a second end. The first end of each of the plurality of pin assemblies is configured to releasably electrically engage a load board. A plurality of pin pads, wherein the second end of each of the plurality of pin assemblies is configured to electrically engage a pin pad included within the plurality of pin pads. A plurality of connector pads are electrically coupled to the plurality of pin pads, wherein each of the plurality of connector pads is configured to be electrically coupled to a wire-based conductor included within a plurality of wire-based conductors. A potting compound is configured to encapsulate the plurality of connector pads.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
G01R 1/04 - HousingsSupporting membersArrangements of terminals
H01R 13/24 - Contacts for co-operating by abutting resilientContacts for co-operating by abutting resiliently mounted
H01R 12/71 - Coupling devices for rigid printing circuits or like structures
H01R 12/73 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
53.
Scalable test platform in a PCI express environment with direct memory access
A scalable test platform includes a PCIe-based event fabric. One or more CPU subsystems are coupled to the PCIe-based event fabric and configured to execute an automated test process. One or more instrument subsystems are coupled to the PCIe-based event fabric and configured to interface one or more devices under test.
A scalable test platform includes a PCIe-based event fabric. One or more instrument subsystems are coupled to the PCIe-based event fabric and configured to interface one or more devices under test and generate captured test data. One or more digital signal processing subsystems are coupled to the PCIe-based event fabric and configured to process the captured test data.
Tagging techniques use user interface features such as face icons that can be manipulated by a variety of cursors to tag media items including but not limited to photos. Tagged items can be presented automatically in response to establishing network communications between two devices.
A device under test is divided into multiple test domains, and test conditions for each of the multiple test domains are defined separately, so that each test domain has its own test pattern, timing data, and other test conditions. Each test domain can start and stop independently, and run at different speeds. Further, triggers are used to specify how the tests executed in the different test domains interact and communicate with one another. Any test domain can generate or wait for a trigger from any other test domain. A test domain can wait for a trigger from a test domain in a CPU.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
A spring contact assembly having a first plunger with a tail portion having a flat contact surface and a second plunger having a tail portion with a flat contact surface wherein the flat contact surfaces are overlapping and are surrounded by an external compression spring such that the sliding engagement of the flat surfaces increases during compression of the spring.
A method for identifying and reducing spurious frequency components is provided. A method in accordance with at least one embodiment of the present disclosure may include generating a digital sinusoidal waveform at a direct digital synthesizer (DDS) and receiving the digital sinusoidal waveform at an audio digital-to-analog converter. The method may further include converting the digital sinusoidal waveform to an analog sinusoidal waveform containing spurious frequency components, combining the analog sinusoidal waveform with an analog distortion correction waveform to generate a composite output waveform and receiving the composite output waveform at notch filter circuitry. The method may also include filtering the composite output waveform to generate a filtered composite output waveform and amplifying a difference between the filtered composite output waveform and a signal from a circuit-under-test (CUT) to generate an amplified analog signal. The method may also include converting the amplified analog signal to an amplified digital signal. Of course, additional implementations are also within the scope of the present disclosure.
A wiring board for transmission of test signals between test point locations on a circuit board under test and an external analyzer having compliant contacts making electrical contact with a pad positioned on a conductive surface circuit layer having a trace extending to a second pad having a hole for receipt of an interface pin electrically connected to the external analyzer.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
G01R 31/319 - Tester hardware, i.e. output processing circuits
61.
Loaded printed circuit board test fixture and method for manufacturing the same
A test fixture for testing loaded printed circuit boards having a plurality of test points having a probe plate including an array of widely spaced high force spring test probes in compliant contact with solid translator pins located in a translator fixture removably positioned over the probe plate. The test fixture includes optimization software wherein translation of the test signals are optimized by providing the shortest interconnect distance in the x-y plane between the test points on the printed circuit board and the test probes in the probe plate. The fixture further includes an unpowered opens device for testing components on the loaded printed circuit board.
A socket for testing or connecting an integrated circuit is disclosed having a platform for receiving the integrated circuit and adapted to overlay a piece of test equipment or other board, the platform formed with an array of slots each locating a portion of a two-piece connector assembly. When the integrated circuit is seated on the platform, the two piece connector assemblies pivot so as to make contact between a contact pad on the IC and the board for establishing or evaluating signal transmission by the IC. The platform houses a resilient tubular member that biases the connector assembly in a disengaged position out of contact with the board or test equipment. When the IC is placed on the platform, the bias of the resilient tubular member is overcome and an electrical connection is established across the connector assembly.
H01R 12/00 - Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocksCoupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structuresTerminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
G01R 31/02 - Testing of electric apparatus, lines, or components for short-circuits, discontinuities, leakage, or incorrect line connection
A spring contact assembly having a first plunger with a tail portion having a flat contact surface and a second plunger having a tail portion with a flat contact surface wherein the flat contact surfaces are overlapping and are surrounded by an external compression spring such that the sliding engagement of the flat surfaces increases during compression of the spring.
In a device and a method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier that are separated from each other, the terminal carrier has spring elements, which are part of a spring plate. The spring plate has a plurality of recesses disposed next to each other for forming a corresponding plurality of receiving pockets for the semi-conductor components, wherein the spring elements are formed from the spring plate in one piece.
In a contact base with a plurality of contact springs for making contact with electronic components, in particular ICs, the contact springs each have an elongate contact blade, the longitudinal center plane of said contact blade being situated parallel to the bending plane of the spring arm of the contact spring. Furthermore, the spring arm is formed in such a way that, when a pin is pressed, the contact blade moves in a direction which differs from the feed direction of the component in such a way that the contact blade moves along the pin.
A filter includes at least a pin diode, an inductive element, and a varactor diode coupled as a resonant circuit. The filter injects data dependent jitter into a digital data signal with a given data rate for testing a transceiver.
The contact assembly having a contact member with a contact tip positioned within holes in a test socket or probe plate wherein the contact tip or the hole in the probe plate or test socket has a cam surface to provide lateral movement of the contact tip across a surface of a test location during compression of the contact member to induce scrubbing on the surface of the test site.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
68.
Test systems and methods for integrated circuit devices
One embodiment of the invention is a portion of a test system that includes a timing generation circuit and a formatter that are coupled together, which are on a single CMOS (complementary metal oxide semiconductor) integrated circuit. The timing Generation circuit generates software words. The formatter receives the software words and provides a specified number of transitions per second and a specified edge placement resolution and accuracy. It is noted that the formatter includes a drive circuit and a response circuit. Specifically, the drive circuit includes a plurality of slices, where each slice receives an independent data stream and produces an independent formatted level. The response circuit includes a plurality of slices, where each slice receives an independent data stream and produces an independent strobe marker.
This disclosure relates to a system and method for pulse generation. A system in accordance with the present disclosure may include a power dissipating element configured to receive power from a power source. At least one of the power source and the power dissipating element may be configured to generate a first signal. The system may further include a measuring instrument in communication with the power source. The measuring instrument may be configured to measure the first signal and to provide an input corresponding to a measured signal to a duty cycle limiter. The system may also include a pulse controller operatively connected to the power source. The pulse controller may be configured to control a duty cycle of the first signal and to receive a second signal from the duty cycle limiter. The pulse controller may be configured to disable at least one of the power source and the power dissipating element if the duty cycle limiter has determined that a maximum condition has been exceeded. Other embodiments are also within the scope of the present disclosure.
An enhanced loadboard and method for enhanced automated test equipment (ATE) signaling. More specifically, embodiments provide an effective mechanism for reducing signal degradation and error interjection by replacing one or more relays with signal splitters for directing signals between one or more pins of a coupled ATE instrument, where the signal splitters reduce loadboard size and operating cost.
A spring contact assembly having a first plunger with a tail portion having a flat contact surface and a second plunger having a tail portion with a flat contact surface wherein the flat contact surfaces are overlapping and are surrounded by an external compression spring such that the sliding engagement of the flat surfaces increases during compression of the spring.
A system, method, and apparatus for distortion analysis is provided. A method in accordance with at least one embodiment of the present disclosure may include receiving a clock frequency at a direct digital synthesizer (DDS) and generating at least one stream of phase numbers via said DDS. The method may further include generating a digital sine wave using, at least in part, said clock frequency and said at least one stream of phase numbers. Of course, additional implementations are also within the scope of the present disclosure.
A method, circuit, and computer program product for receiving a first intermediate signal that is at least partially based upon a first reference signal. A second intermediate signal is received that is a time-shifted version of the first intermediate signal. An output signal is generated that is based upon the difference between the first intermediate signal and the second intermediate signal. An anticipated differential change in the output signal is determined, the anticipated differential change to occur based upon a transition in the first reference signal. A realized differential change in the output signal is measured, the realized differential change occurring based upon a transition in the first reference signal. The realized differential change in the output signal is compared to the anticipated differential change in the output signal to determine a nonlinearity indicator.
A method for identifying and reducing spurious frequency components is provided. A method in accordance with at least one embodiment of the present disclosure may include generating a digital sinusoidal waveform at a direct digital synthesizer (DDS) and receiving the digital sinusoidal waveform at an audio digital-to-analog converter. The method may further include converting the digital sinusoidal waveform to an analog sinusoidal waveform containing spurious frequency components, combining the analog sinusoidal waveform with an analog distortion correction waveform to generate a composite output waveform and receiving the composite output waveform at notch filter circuitry. The method may also include filtering the composite output waveform to generate a filtered composite output waveform and amplifying a difference between the filtered composite output waveform and a signal from a circuit-under-test (CUT) to generate an amplified analog signal. The method may also include converting the amplified analog signal to an amplified digital signal. Of course, additional implementations are also within the scope of the present disclosure.
A method, circuit and system for determining at least one of an amplitude and a relative phase of a signal under test. A reference signal is generated based, at least in part, upon the at least one of the amplitude and the relative phase of the signal under test. The reference signal is combined with the signal under test to generate a residual signal indicative of a distortion within the signal under test. The residual signal is measured.
A finger tester for testing non-componented printed circuit boards uses two or more test fingers, each having a test probe. A detection device is provided above each test probe for optical detection of the position above the circuit board of at least one contact tip of the test probe. The detection devices of the test fingers are each arranged in different vertically spaced planes, so that areas of the detection devices located above the test fingers are positioned above one another, aligned vertically to prevent contact during testing.
A driver block for a differential pin driver that supports out-of-band signaling. The driver block includes a main enable switch that is controlled by a high speed driver inhibit (DINH) signal. The main enable switch controls coupling between a main current source and a differential pin driver output stage. The main enable switch is coupled in series with an output select switch that selects between a positive output and a negative output. The driver block also includes a positive enable switch for controlling coupling between the positive output and a positive level shifter that shifts voltages of the positive output. The driver block also includes a negative enable switch for controlling coupling between the negative output and a negative level shifter that shifts voltages of the negative output.
1 remains as close a possible to a value for which circuit performance is substantially optimal with respect to a selected combination of performance criteria.
H02M 3/335 - Conversion of DC power input into DC power output with intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode to produce the intermediate AC using devices of a triode or a transistor type requiring continuous application of a control signal using semiconductor devices only
79.
Semiconductor integrated circuit tester with interchangeable tester module
A test head for an integrated circuit tester includes a main chassis defining a chamber that is open at the top. Tester modules are installed in the chamber, each tester module being removable as a unit from the chamber and including a tester module chassis, multiple pin electronics cards, and a tester module interface structure exposed at the top of the chamber. A test head interface structure is engageable with the tester module interface structures of the tester modules for connecting the tester module interface structures to a device interface unit.
A compliant electrical interconnect having a first component and a second component interlockingly engaged with the first component. Each component has two cantilever arms lockingly engaged and continuously biased against each other. Contact springs are captivated by the cantilever arms providing a contact force for the first and second components.
An apparatus for testing electronic devices employs a programmable device to adjust the timing of the strobes such that the strobes sample the bit stream from a device under test at or near the center of the bit position. The strobe time adjustment is performed based on pairs of strobe readings made around a number of different bit positions. The programmable device examines the pairs of strobe reading made around each of the different bit positions to determine whether or not a bit transition has occurred there. The programmable device selects the bit positions around which a bit transition has not occurred as eye candidates, and defines the center of the largest contiguous region of eye candidates as the center of the bit position.
A product change tool for selectively engaging a product change element with an IC tester interface and disengaging the product change element from the tester interface includes a mobile frame mounted to a base frame and constrained to move relative to the base frame along an axis of linear movement, and a force mechanism for urging the mobile frame to move along the axis of linear movement relative to the base frame. The force mechanism includes first and second links pivotally connected together at their proximal ends and secured at their distal ends to the mobile frame and the base frame respectively. The distal ends of the links are spaced apart along the axis of linear movement and the proximal ends of the links are between the distal ends relative to that axis. An actuator is coupled to the proximal ends of the links for urging the proximal ends of the links in directions transverse to the axis of linear movement, whereby the spacing of the distal ends of the links along the axis changes and the mobile frame moves relative to the base frame along the axis.
09 - Scientific and electric apparatus and instruments
40 - Treatment of materials; recycling, air and water treatment,
Goods & Services
Printed circuit board probing and testing equipment, testers, test fixtures and kits for making test fixtures and parts therefor, test probes, translator modules for making electrical test connections to integrated circuit packages, test adapters for aligning a pattern of test probes with a product under test, electronic test receivers, sockets for semi-conductor testing, circuit board handling equipment; computer software for use in conducting product tests and test fixture and repair software. Construction of circuit board test fixtures to customer specifications; testing of circuit boards and circuit devices for customers.
09 - Scientific and electric apparatus and instruments
40 - Treatment of materials; recycling, air and water treatment,
Goods & Services
Testers, test fixtures, and test fixture kits for printed wiring boards; components for all the aforesaid testers and test fixtures; test probes; translator modules for making electrical test connections to integrated circuit packages. Providing customised test fixtures to customer specifications.
09 - Scientific and electric apparatus and instruments
40 - Treatment of materials; recycling, air and water treatment,
Goods & Services
PRINTED CIRCUIT BOARD PROBING AND TESTING EQUIPMENT, NAMELY, TESTERS; TEST FIXTURES; KITS FOR MAKING TEST FIXTURES AND PARTS THEREFOR, NAMELY, SUPPORT PLATES, GASKETS, GAS HINGES AND VACUUM CONNECTORS; TEST PROBES; TRANSLATOR MODULES FOR MAKING ELECTRICAL TEST CONNECTIONS TO INTEGRATED CIRCUIT PACKAGES; TEST ADAPTERS FOR ALIGNING A PATTERN OF TEST PROBES WITH A PRODUCT UNDER TEST; ELECTRONIC TEST RECEIVERS; SOCKETS FOR SEMI-CONDUCTOR TESTING; CIRCUIT BOARD HANDLING EQUIPMENT; AND SOFTWARE FOR USE IN CONDUCTING PRODUCT TESTS AND TEST FIXTURE AND REPAIR SOFTWARE CONSTRUCTION OF CIRCUIT BOARD TEST FIXTURES TO CUSTOMER SPECIFICATIONS
09 - Scientific and electric apparatus and instruments
40 - Treatment of materials; recycling, air and water treatment,
Goods & Services
PRINTED CIRCUIT BOARD PROBING AND TESTING EQUIPMENT, NAMELY, TESTERS; TEST FIXTURES; KITS FOR MAKING TEST FIXTURES AND PARTS THEREFOR, NAMELY, SUPPORT PLATES, GASKETS, GAS HINGES AND VACUUM CONNECTORS, TEST PROBES; TRANSLATOR MODULES FOR MAKING ELECTRICAL TEST CONNECTIONS TO INTEGRATED CIRCUIT PACKAGES; TEST ADAPTERS FOR ALIGNING A PATTERN OF TEST PROBES WITH A PRODUCT UNDER TEST; ELECTRONIC TEST RECEIVERS; SOCKETS FOR SEMI-CONDUCTOR TESTING; CIRCUIT BOARD HANDLING EQUIPMENT; AND SOFTWARE FOR USE IN CONDUCTING PRODUCT TESTS AND TEST FIXTURE AND REPAIR SOFTWARE CONSTRUCTION OF CIRCUIT BOARD TEST FIXTURES TO CUSTOMER SPECIFICATIONS
09 - Scientific and electric apparatus and instruments
40 - Treatment of materials; recycling, air and water treatment,
Goods & Services
printed wiring board probing and testing equipment; namely, testers, test fixtures, and kits for making test fixture and parts therefor; test probes for making electrical test connections; translator modules for making electrical test connections to integrated circuit packages construction of printed wiring board test fixtures to customer specifications
