09 - Scientific and electric apparatus and instruments
Goods & Services
Machines for automated assembly of electronic components,
namely, pick and place machines, circuit board assembly
machines, feeders, feeder interfaces and pick and place
control units. Computer hardware and computer software for operating
circuit board assembly machines or computer hardware and
computer software for operating machines used for automated
assembly of electronic components.
2.
CARRIER TAPE SYSTEM AND SPROCKET FOR REDUCING JAMS
A pick and place system includes a carrier tape radial feeder and a pick head configured to pick up the component of the plurality of components of the carrier tape. The carrier tape radial feeder includes a drive sprocket having a plurality- of sprocket teeth, a component cut and/or present location including a tooling datum surface and a pulldown mechanism located proximate the component cut and/or present location. The drive sprocket is configured to rotate, the sprocket teeth engage with carrier holes in a earner tape carrying a plurality of components to propel the carrier tape forward as the drive sprocket rotates, the pulldown mechanism is configured to pull down the carrier tape until a component bottoms out on the tooling datum surface, and the drive sprocket is configured to flex in response to the pulldown mechanism pulling down the carrier tape. Methods of feeding components are also disclosed.
09 - Scientific and electric apparatus and instruments
Goods & Services
Machines for packaging, feeding, and automated assembly of
electronic components, namely, pick and place machines,
circuit board assembly machines, feeders, feeder interfaces,
pick and place control units, printing machines, material
dispensing and placement machines, component placement,
insertion and mounting machines, ovens, and component
handling machines. Computer hardware and computer software for operating
circuit board assembly machines or computer hardware and
computer software for operating machines used for automated
assembly of electronic components.
09 - Scientific and electric apparatus and instruments
Goods & Services
Machines for automated assembly of electronic components, namely, pick and place machines, circuit board assembly machines, feeders, feeder interfaces and pick and place control units Computer hardware and downloadable computer software for operating circuit board assembly machines and computer hardware and downloadable computer software for operating machines used for automated assembly of electronic components
5.
ACTIVE SYNCHRONIZED VIBRATION DAMPING OF PLACEMENT HEAD
An electronic device placement system includes a placement head including a spindle, a positioning system configured to move the spindle between a picking location and a placement location, a spindle assembly Z-drive, a piezo stage movably coupled between the spindle assembly Z-drive and the spindle, the piezo stage configured to move the spindle with respect to the spindle assembly Z-drive to make fine positioning adjustments to the positioning of the spindle, the piezo stage including a motion controller and a spindle accelerometer system connected to the motion controller. The electronic device placement system includes a substrate support configured to hold a substrate that is a target for placement of an electronic component by the spindle and a substrate accelerometer system mounted to the substrate support, the substrate accelerometer system configured to measure vibrations in the X-direction and the Y-direction.
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H05K 13/08 - Monitoring manufacture of assemblages
Machines for packaging, feeding, and automated assembly of electronic components, namely, pick and place machines, circuit board assembly machines, feeders, feeder interfaces, pick and place control units, printing machines, material dispensing and placement machines, component placement, insertion and mounting machines, ovens, and component handling machines
09 - Scientific and electric apparatus and instruments
Goods & Services
Machines for packaging, feeding, and automated assembly of electronic components, namely, pick and place machines, circuit board assembly machines, feeders, feeder interfaces, pick and place control units, printing machines, material dispensing and placement machines, component placement, insertion and mounting machines, ovens, and component handling machines Computer hardware and computer software for operating circuit board assembly machines or computer hardware and computer software for operating machines used for automated assembly of electronic components
An electronic device placement system includes a spindle assembly having a positioning system configured to move between a picking location and a placement location, the spindle assembly including a spindle having a transparent spindle body and a vertical nozzle, an upward facing camera configured to image a bottom of an electronic device picked up by the nozzle of the spindle prior to a placement stroke of the electronic device, and a downward facing camera movable above the spindle during picking and placement of an electronic device by the spindle. The downward facing camera is configured to image outer edges of the electronic device during the placement stroke of the spindle through the transparent spindle body and to capture an image of a surface of a substrate prior to and/or during the placement stroke.
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H04N 23/56 - Cameras or camera modules comprising electronic image sensorsControl thereof provided with illuminating means
A method of assembly comprising a spindle bank for a pick-and-pace machine, a base including a plurality of mount locations, each of the plurality of mount locations configured to receive a mountable spindle module including at least one pick-and-place spindle and nozzle, a bearing system attachable to a movement axis of a pick-and-place machine such that the spindle bank is movable along the movement axis, and a power delivery system configured to deliver electrical power to each of the plurality of mount locations, wherein each of the plurality of mount locations is configured to deliver the electrical power to each of the mountable spindle modules when mounted.
A spindle for a pick-and-place machine includes a shaft including a length extending between a first end and a second end, the shaft including an outer body and a hollow interior, a nozzle tip disposed at the first end of the shaft, the nozzle tip configured to contact an electronic component for manipulation of the electronic component, and a theta gear disposed on the shaft, the theta gear configured to engage with a motor of a pick-and-place head. The spindle is configured to be removably attachable from the pick-and-place head. A dispensing head spindle module, spindle bank and assembly machine incorporating the spindle are disclosed.
A method of assembly comprising a pick-and-place spindle module having a modular body structure including a first receiving location configured to receive a spindle, a first z-axis motor configured to move a spindle received in the first receiving location in a z-axis, a first theta motor configured to rotate a spindle received in the receiving location, an air distribution system including an air distribution port, the air distribution system configured to deliver received air from the air distribution port to a spindle received in the first receiving location, an electrical distribution system including an electrical distribution port, and a mechanical attachment mechanism, the mechanical attachment mechanism configured to facilitate attachment of the modular body structure to a spindle bank such that the air distribution port is connected to receive air from the spindle bank and the electrical distribution port is configured to receive electricity from the spindle bank.
A pick-and-place spindle module comprises: a modular body structure including a first receiving location configured to receive a spindle; a first z-axis motor configured to move a spindle received in the first receiving location in a z-axis; a first theta motor configured to rotate a spindle received in the receiving location; a first motion control chip each attached to the body structure, the first motion control chip configured to control the first z-axis motor and the first theta motor; and a mechanical attachment mechanism, the mechanical attachment mechanism configured to facilitate attachment of the modular body structure to a spindle bank.
A clinch mechanism for assembling a printed circuit board with electronic components includes a drive shaft configured to move along a vertical axis, a stationary anvil configured to remain stationary during movement of the drive shaft, a cutter having a cutting tip, and a toggle configured to rotate about a toggle rotation axis that includes an involute gear shaped tooth configured to roll across an involute trapezoidal slot of the cutter in order to impart movement on the cutter relative to the stationary anvil. Movement of the drive shaft along the linear axis is configured to move the cutter relative to the stationary anvil, and to move the cutting tip across the stationary anvil to cut an electronic lead located between the cutting tip and the stationary anvil, and to rotate the toggle about the axis.
H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
H05K 13/00 - Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
A pick-and-place dispensing head comprises: a body structure having a z-axis motor attachment location and a linear track; a z-axis motor attached to the body structure at the axis motor attachment location, the z-axis motor configured to exact movement in a z-axis; a body attached to the linear track and operably connected to the z-axis motor such that the body moves along the linear track when the z-axis motor is actuated; a theta motor operably connected to the first body; a receiving location operably connected to the body; and an optical detector extending from the first body configured to detect upward z-axis movement of a received pick-and-place spindle relative to the body.
A dispensing head comprises: a body structure including a first z-axis motor attachment location, a second z-axis motor attachment location, a first linear track and a second linear track; a first z-axis motor attached to the body structure at the first z-axis motor attachment location; a second z-axis motor attached to the body structure at the second z-axis motor attachment location; a first body attached to the first linear track and operably connected to the first z-axis motor such that the first body moves along the first linear track when the first z-axis motor is actuated; a second body attached to the second linear track and operably connected to the second z-axis motor such that the second body moves along the second linear track; a first theta motor operably connected to the first body; and a second theta motor operably connected to the second body.
A clamping assembly for use in a pick and place assembly process includes a fixture and a carrier. The fixture includes at least one retaining feature configured to releasably secure to the carrier such that a part and a substrate are clamped together between the fixture and the carrier.
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
H05K 7/00 - Constructional details common to different types of electric apparatus
H05K 13/00 - Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/34 - Arrangements for cooling, heating, ventilating or temperature compensation
H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
H01L 23/42 - Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
H01L 23/427 - Cooling by change of state, e.g. use of heat pipes
H01L 23/467 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing gases, e.g. air
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
H05K 3/36 - Assembling printed circuits with other printed circuits
A method and system for improving an automated pick and place apparatus semiconductor device placement process is provided. The method includes automatically executing a shift measurement associated with an offset from an original placement of a plurality of semiconductor die of a semiconductor wafer for processing. An associated shift measurement value is retrieved and stored in a database that includes previously retrieved shift measurement values of previously measured shift measurements. Specified models are executed with respect to all shift measurement values and a predicted shift measurement value associated with a future offset for a new plurality of semiconductor die on a new semiconductor wafer for processing is determined. Placement hardware of the pick and place apparatus is placed in multiple positions for generating the new plurality of semiconductor die on the new semiconductor wafer in accordance with the predicted shift measurement value.
G05B 19/418 - Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
G06F 13/10 - Program control for peripheral devices
A pick and place machine includes a feeder system configured to feed components to a picking location, a dispensing head configured to pick fed components from the picking location, a vision system configured to detect features of components picked by the dispensing head. The vision system includes an image capture device pointed in a direction. The pick and place machine further includes an illumination device that includes a plurality of light sources each configured to produce light having a controlled thickness and at a controlled angle relative to the direction. The controlled angle is configured to be non-normal with respect to the direction at which the image capture device is pointed.
B23P 19/00 - Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformationTools or devices therefor so far as not provided for in other classes
H05K 13/08 - Monitoring manufacture of assemblages
An assembly machine comprising a continuous circuitous track; a dispensing head system configured to at least partially assemble products, wherein the dispensing head system includes one or more dispensing heads movable around the continuous circuitous track; a product conveyance system extending between a first location of the continuous circuitous track and a second location of the continuous circuitous track and a placement module, the placement module including a first positioning system configured to move along a first axis that intersects with the product conveyance system, wherein the first positioning system is configured to receive a first of the products from the product conveyance system and move the first of the products from the product conveyance system to a first placement location; and a second positioning system configured to move along a second axis that intersects with the product conveyance system, wherein the second positioning system is configured to receive a second of the products from the product conveyance system and move the second of the products from the product conveyance system to a second placement location.
Disclosed herein is a system that includes a placement head, the placement head including a spindle assembly, the spindle assembly including a spindle capable of receiving one of a plurality of nozzles for attachment. The system includes a nozzle changer, the nozzle changer including a revolver capable of holding a plurality of nozzles. A position of the nozzle changer is changeable in response to movement of the spindle assembly. Further disclosed is a method of receiving and attaching nozzles with a nozzle changer.
A spindle for a pick-and-place machine includes a shaft including a length extending between a first end and a second end, the shaft including an outer body and a hollow interior, a nozzle tip disposed at the first end of the shaft, the nozzle tip configured to contact an electronic component for manipulation of the electronic component, and a theta gear disposed on the shaft, the theta gear configured to engage with a motor of a pick-and-place head. The spindle is configured to be removably attachable from the pick-and-place head. A dispensing head spindle module, spindle bank and assembly machine incorporating the spindle are disclosed.
B23Q 3/02 - Devices holding, supporting, or positioning, work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
B23Q 3/12 - Devices holding, supporting, or positioning, work or tools, of a kind normally removable from the machine for securing to a spindle in general
B23Q 3/155 - Arrangements for automatic insertion or removal of tools
B23Q 3/16 - Devices holding, supporting, or positioning, work or tools, of a kind normally removable from the machine controlled in conjunction with the operation of the tool
B23Q 7/04 - Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of grippers
F16H 1/00 - Toothed gearings for conveying rotary motion
H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
Die handling systems and methods of use for preparing or processing dies from multiple types of pre-expanded wafer materials. The die handling systems are configured in a modular fashion, allowing for concurrent processes to expand the wafers, process the wafers, extract the dies, and inspect the extracted dies without forcing one of the processes of the system to remain idle. Embodiments of the wafer handler module include a mechanism, such as an expander capable of stretching or expanding wafers having one or more different sizes to a pre-expanded state without interrupting the die handler. The pre-expanded wafers are stored as a proprietary cartridge and delivered to the die handler, where a pick head of the die handler removes each die of the pre-expanded wafer and delivers the extracted dies to subsequent machinery, such as a pick and place machine, for further processing.
H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H01L 21/50 - Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups or
H01L 21/66 - Testing or measuring during manufacture or treatment
A feeder system includes a feeder configured to receive a component, a pick location configured to present the component from the carrier tape for a subsequent picking process, a camera system configured to view the component at or prior to the pick location. The camera system is configured to measure an offset between one or more topside features of the component and an outline of the component. A pick and place machine that includes the feeder, and a method of inspecting components.
A slip track includes a continuous circuitous track. The continuous circuitous track includes a layered printed circuit board. The layered printed circuit board includes a top track layer configured to supply electric power to a device having a contact element sliding across the top track layer, the layered printed circuit board further having a lower layer connected to the top track layer, the lower layer configured to supply electric power to the top track layer. The layered printed circuit board is flexible and is bent around curves in the continuous circuitous track. A method of assembly using the slip track is further disclosed.
H01S 4/00 - Devices using stimulated emission of electromagnetic radiation in wave ranges other than those covered by groups , or , e.g. phonon masers, X-ray lasers or gamma-ray lasers
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
Disclosed is a dispensing head that includes a first spindle configured for movement in a vertical direction, a first nozzle operatively attached to the spindle, a heater device removably attachable to the dispensing head. The heater device includes a heat source and an opening configured to receive the first nozzle. The heat source is configured to heat the first nozzle above an ambient temperature. An assembly system is further disclosed, along with a method of heating a nozzle.
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
26.
FIXTURE TO HOLD PART BEFORE AND AFTER REFLOW, AND METHOD
A clamping assembly for use in a pick and place assembly process includes a fixture and a carrier. The fixture includes at least one retaining feature configured to releasably secure to the carrier such that a part and a substrate are clamped together between the fixture and the carrier.
A pick and place machine includes a feeder system configured to feed components to a picking location, a dispensing head configured to pick fed components from the picking location, a vision system configured to detect features of components picked by the dispensing head. The vision system includes an image capture device pointed in a direction. The pick and place machine further includes an illumination device that includes a plurality of light sources each configured to produce light having a controlled thickness and at a controlled angle relative to the direction. The controlled angle is configured to be non-normal with respect to the direction at which the image capture device is pointed.
An assembly machine comprising a continuous circuitous track; a dispensing head system configured to at least partially assemble products, wherein the dispensing head system includes one or more dispensing heads moveable around the continuous circuitous track; a product conveyance system extending between a first location of the continuous circuitous track and a second location of the continuous circuitous track and a placement module, the placement module including a first positioning system configured to move along a first axis that intersects with the product conveyance system, wherein the first positioning system is configured to receive a first of the products from the product conveyance system and move the first of the products from the product conveyance system to a first placement location; and a second positioning system configured to move along a second axis that intersects with the product conveyance system, wherein the second positioning system is configured to receive a second of the products from the product conveyance system and move the second of the products from the product conveyance system to a second placement location.
H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
B23P 21/00 - Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
B65G 1/12 - Storage devices mechanical with article supports or holders movable in a closed circuit to facilitate insertion or removal of articles
B65G 35/00 - Mechanical conveyors not otherwise provided for
B65G 47/00 - Article or material-handling devices associated with conveyorsMethods employing such devices
H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
Disclosed herein is a system that includes a placement head, the placement head including a spindle assembly, the spindle assembly including a spindle capable of receiving one of a plurality of nozzles for attachment. The system includes a nozzle changer, the nozzle changer including a revolver capable of holding a plurality of nozzles. A position of the nozzle changer is changeable in response to movement of the spindle assembly. Further disclosed is a method of receiving and attaching nozzles with a nozzle changer.
A feeder system includes a feeder configured to receive a component, a pick location configured to present the component from the carrier tape for a subsequent picking process, a camera system configured to view the component at or prior to the pick location. The camera system is configured to measure an offset between one or more topside features of the component and an outline of the component. A pick and place machine that includes the feeder, and a method of inspecting components.
Die handling systems and methods of use for preparing or processing dies from multiple types of pre-expanded wafer materials. The die handling systems are configured in a modular fashion, allowing for concurrent processes to expand the wafers, process the wafers, extract the dies, and inspect the extracted dies without forcing one of the processes of the system to remain idle. Embodiments of the wafer handler module include a mechanism, such as an expander capable of stretching or expanding wafers having one or more different sizes to a pre-expanded state without interrupting the die handler. The pre-expanded wafers are stored as a proprietary cartridge and delivered to the die handler, where a pick head of the die handler removes each die of the pre-expanded wafer and delivers the extracted dies to subsequent machinery, such as a pick and place machine, for further processing.
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
32.
SLIPTRACK ARCHITECTURE FOR AN ASSEMBLY MACHINE, SYSTEM AND METHOD
A slip track includes a continuous circuitous track. The continuous circuitous track includes a layered printed circuit board. The layered printed circuit board includes a top track layer configured to supply electric power to a device having a contact element sliding across the top track layer, the layered printed circuit board further having a lower layer connected to the top track layer, the lower layer configured to supply electric power to the top track layer. The layered printed circuit board is flexible and is bent around curves in the continuous circuitous track. A method of assembly using the slip track is further disclosed.
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
B25J 5/00 - Manipulators mounted on wheels or on carriages
B25J 5/02 - Manipulators mounted on wheels or on carriages travelling along a guideway
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 1/14 - Structural association of two or more printed circuits
H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
A method and system for improving an automated pick and place apparatus semiconductor device placement process is provided. The method includes automatically executing a shift measurement associated with an offset from an original placement of a plurality of semiconductor die of a semiconductor wafer for processing. An associated shift measurement value is retrieved and stored in a database that includes previously retrieved shift measurement values of previously measured shift measurements. Specified models are executed with respect to all shift measurement values and a predicted shift measurement value associated with a future offset for a new plurality of semiconductor die on a new semiconductor wafer for processing is determined. Placement hardware of the pick and place apparatus is placed in multiple positions for generating the new plurality of semiconductor die on the new semiconductor wafer in accordance with the predicted shift measurement value.
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
G06F 13/10 - Program control for peripheral devices
G06F 17/30 - Information retrieval; Database structures therefor
H01L 21/66 - Testing or measuring during manufacture or treatment
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
34.
DISPENSING HEAD HAVING A NOZZLE HEATER DEVICE, SYSTEM AND METHOD
Disclosed is a dispensing head that includes a first spindle configured for movement in a vertical direction, a first nozzle operatively attached to the spindle, a heater device removably attachable to the dispensing head. The heater device includes a heat source and an opening configured to receive the first nozzle. The heat source is configured to heat the first nozzle above an ambient temperature. An assembly system is further disclosed, along with a method of heating a nozzle.
Disclosed herein is a feeder that includes a receiver configured to receive a reel of carrier tape having media disposed thereon, a presentation location configured to present media from the reel for a subsequent picking process, a media straightener. The media straightener includes an inlet configured to receive the carrier tape and an outlet configured to expel the carrier tape to the presentation location. The media straightener includes a path located between the inlet and the outlet, the path including a first bend configured to permanently deform the media as the carrier tape moves through the first bend. Further disclosed is a media straightener and a method of straightening media.
A test device is disclosed for verifying the accuracy of a pick and place process. The test device includes a surface configured to receive components, and a ferromagnetic layer located under the surface. A system is further disclosed including the test device and a plurality of components each including a magnetic element, the plurality of components configured to be received by a plurality of pockets of the test device. A method of picking and placing a component onto the test device is further disclosed.
B65G 49/06 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
H05K 13/08 - Monitoring manufacture of assemblages
09 - Scientific and electric apparatus and instruments
Goods & Services
Machines for packaging, feeding, and automated assembly of electronic components, namely, pick and place machines, circuit board assembly machines, feeders, feeder interfaces, pick and place control units, printing machines, material dispensing and placement machines, component placement, insertion and mounting machines, ovens, and component handling machines Computer hardware and computer software for operating circuit board assembly machines or computer hardware and computer software for operating machines used for automated assembly of electronic components
Disclosed herein is a household type sewing machine that includes a transmitter configured to connect to a local device such as a Wi-Fi device, and an image capture device configured to capture a video of a workpiece being sewn by the household type sewing machine. The transmitter is configured to send the video captured by the image capture device to the local device. Further disclosed is a method that includes capturing, by the image capture device, a video of a workpiece being sewn by the household type sewing machine and sending the video captured by the image capture device to a mobile device. A sewing system is further disclosed.
A test device is disclosed for verifying the accuracy of a pick and place process. The test device includes a surface configured to receive components, and a ferromagnetic layer located under the surface. A system is further disclosed including the test device and a plurality of components each including a magnetic element, the plurality of components configured to be received by a plurality of pockets of the test device. A method of picking and placing a component onto the test device is further disclosed.
Disclosed herein is a dispensing head that includes a motor, an air pump operably connected to and powered by the motor, and a first spindle connected to the air pump. The air pump is configured to create airflow in the first spindle. Further disclosed is a method of creating airflow in a dispensing head, and an assembly machine system having a dispensing head.
Disclosed herein is a dispensing head that includes a motor, an air pump operably connected to and powered by the motor, and a first spindle connected to the air pump. The air pump is configured to create airflow in the first spindle. Further disclosed is a method of creating airflow in a dispensing head, and an assembly machine system having a dispensing head.
An assembly machine includes a plurality of track modules, each track module including a section of track, the plurality of track modules connectable to form a continuous circuitous track, the continuous circuitous track configured to receive a dispensing head, the dispensing head configured to rotate about the continuous circuitous track and at least partially assemble an unfinished product. The machine includes a first feeder module attached to a first length of the continuous circuitous track configured to feed a component to the dispensing head, and a first placement module attached to a second length of the continuous circuitous track configured to receive the unfinished product. The dispensing head is configured to place the component on the unfinished product. The assembly machine is reconfigurable by attaching or removing one or more of the plurality of track modules, the first feeder module and the first placement module.
H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
B25J 5/02 - Manipulators mounted on wheels or on carriages travelling along a guideway
B65G 35/00 - Mechanical conveyors not otherwise provided for
H05K 13/08 - Monitoring manufacture of assemblages
B23P 21/00 - Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
B25J 11/00 - Manipulators not otherwise provided for
Disclosed herein is a method that includes picking up a plate with a nozzle, the plate including at least one opening to allow air to flow therethrough. The method includes picking up a die with the nozzle such that the plate is located between the nozzle and the die. The method includes placing the die and the plate onto a device, substrate or another die such that the plate is located on top of the die. The method includes heating the device, substrate or another die and the die in a heat chamber while the plate remains on top of the die to permanently attach the die to the device, substrate or another die. Further disclosed herein is an assembly system configured to perform a method that utilizes the plate and die combination for attaching the die to a device, substrate or another die by heating.
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
A dispensing head is disclosed including a control system located in the dispensing head, an encoder read head located in the dispensing head, and a light-capture sensor located in the dispensing head configured to detect a light flash of a stationary camera when the light flash illuminates a component on the dispensing head or an element of the dispensing head. The control system is configured to determine a precise encoder position with the encoder read head at a moment of the light flash. The dispensing head is configured to at least partially assemble an unfinished product. An assembly machine having the dispensing head and a method of at least partially assembling an unfinished product with the dispensing head is further disclosed.
B25J 11/00 - Manipulators not otherwise provided for
B65G 35/00 - Mechanical conveyors not otherwise provided for
H05K 13/08 - Monitoring manufacture of assemblages
B25J 5/02 - Manipulators mounted on wheels or on carriages travelling along a guideway
B23P 21/00 - Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
An assembly machine includes a plurality of track modules, each track module including a section of track, the plurality of track modules connectable to form a continuous circuitous track, the continuous circuitous track configured to receive a dispensing head, the dispensing head configured to rotate about the continuous circuitous track and at least partially assemble an unfinished product. The machine includes a first feeder module attached to a first length of the continuous circuitous track configured to feed a component to the dispensing head, and a first placement module attached to a second length of the continuous circuitous track configured to receive the unfinished product. The dispensing head is configured to place the component on the unfinished product. The assembly machine is reconfigurable by attaching or removing one or more of the plurality of track modules, the first feeder module and the first placement module.
B25J 11/00 - Manipulators not otherwise provided for
B65G 35/00 - Mechanical conveyors not otherwise provided for
H05K 13/08 - Monitoring manufacture of assemblages
B25J 5/02 - Manipulators mounted on wheels or on carriages travelling along a guideway
B23P 21/00 - Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
An assembly machine includes a plurality of track modules, each track module including a section of track, the plurality of track modules connectable to form a continuous circuitous track, the continuous circuitous track configured to receive a dispensing head, the dispensing head configured to rotate about the continuous circuitous track and at least partially assemble an unfinished product. The machine includes a first feeder module attached to a first length of the continuous circuitous track configured to feed a component to the dispensing head, and a first placement module attached to a second length of the continuous circuitous track configured to receive the unfinished product. The dispensing head is configured to place the component on the unfinished product. The assembly machine is reconfigurable by attaching or removing one or more of the plurality of track modules, the first feeder module and the first placement module.
B25J 5/02 - Manipulators mounted on wheels or on carriages travelling along a guideway
B65G 35/00 - Mechanical conveyors not otherwise provided for
B25J 11/00 - Manipulators not otherwise provided for
H05K 13/08 - Monitoring manufacture of assemblages
B23P 21/00 - Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
Disclosed herein is a method that includes picking up a plate with a nozzle, the plate including at least one opening to allow air to flow therethrough. The method includes picking up a die with the nozzle such that the plate is located between the nozzle and the die. The method includes placing the die and the plate onto a device, substrate or another die such that the plate is located on top of the die. The method includes heating the device, substrate or another die and the die in a heat chamber while the plate remains on top of the die to permanently attach the die to the device, substrate or another die. Further disclosed herein is an assembly system configured to perform a method that utilizes the plate and die combination for attaching the die to a device, substrate or another die by heating.
An assembly machine includes a plurality of track modules, each track module including a section of track, the plurality of track modules connectable to form a continuous circuitous track, the continuous circuitous track configured to receive a dispensing head, the dispensing head configured to rotate about the continuous circuitous track and at least partially assemble an unfinished product. The machine includes a first feeder module attached to a first length of the continuous circuitous track configured to feed a component to the dispensing head, and a first placement module attached to a second length of the continuous circuitous track configured to receive the unfinished product. The dispensing head is configured to place the component on the unfinished product. The assembly machine is reconfigurable by attaching or removing one or more of the plurality of track modules, the first feeder module and the first placement module.
B65G 47/90 - Devices for picking-up and depositing articles or materials
H02K 41/03 - Synchronous motorsMotors moving step by stepReluctance motors
G05B 19/418 - Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
49.
Method and apparatus for applying fluid during a placement cycle
Disclosed herein is a method for applying a fluid to a component during a placement cycle. The method includes providing a component placement machine including a housing having a frame attached thereto, the frame having a pick and place head. The method includes providing a fluid application station contiguous with the housing and adapted to apply fluid to the component, moving the housing to a pick location, picking the component from a supply of components using the pick and place head, moving the housing to a location, applying fluid to the picked component, and placing the picked component with the fluid applied onto the printed circuit board at the location. The fluid application step is accomplished during the moving step or placing step. The method may further include repeating the steps for another component where the fluid application step is accomplished during the repeated picking step of the additional component.
H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
B23P 19/00 - Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformationTools or devices therefor so far as not provided for in other classes
A component placement machine that includes a movable housing that is adapted for movement in an X and a Y axis above a printed circuit board. The housing includes a rotatable frame having at least one pick and place head configured to pick up a component and place the component on the printed circuit board. The housing further includes a fluid application station configured to apply fluid to the component after being picked up by the pick and place head and before being placed on the printed circuit board.
09 - Scientific and electric apparatus and instruments
Goods & Services
Machines for automated assembly of electronic components, namely, pick and place machines, circuit board assembly machines, feeders, feeder interfaces and pick and place control units Computer hardware and computer software for operating circuit board assembly machines or Computer hardware and computer software for operating machines used for automated assembly of electronic components
A substrate carrier system is provided for physical management of substrate(s) during a variety of assembly techniques performed on the both sides of the substrate(s) without dismounting or changing carrier systems.
Apparatus and method to aid in the reproducible and reversible tensioning of flexible substrates, such as polyimide or other file, to ensure planarity before, during, and after processing while mounted in tensioning apparatus.
Apparatus and method to aid in the reproducible and reversible tensioning of flexible substrates, such as polyimide or other file, to ensure planarity before, during, and after processing while mounted in tensioning apparatus.
B23P 11/02 - Connecting or disconnecting metal parts or objects by metal-working techniques, not otherwise provided for by first expanding and then shrinking or vice versa, e.g. by using pressure fluidsConnecting or disconnecting metal parts or objects by metal-working techniques, not otherwise provided for by making force fits
A component placement machine for assembling at least one component on to at least one printed circuit board (PCB) is provided. The component placement machine comprises at least one head configured for picking a component from at least one feeder and placing the picked component on to a PCB of a first PCB product. The component placement machine also includes at least one feeder bank system separate from the head, wherein the feeder system includes a first feeder bank and a second feeder bank and a positioning system for moving both the entire first feeder bank and the entire second feeder bank in both a horizontal X direction and a perpendicular horizontal Y direction, wherein the feeder bank system is configured to enable a setup of a second PCB product on the component placement machine while the component placement machine assembles the PCB of the first PCB product. The entire first feeder bank and the entire second feeder bank of the at least one feeder bank system are each movably located on said component placement machine independently from each other, so that movement of the entire first feeder bank occurs while said component placement machine uses the second feeder bank to assemble said printed circuit board of said first printed circuit board product.
B23P 19/00 - Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformationTools or devices therefor so far as not provided for in other classes
Provided is a PCB assembly machine including a board handling system configured to transport a PCB through the PCB assembly machine, wherein the PCB assembly machine further includes a pick and place system configured to pick and place electrical components onto the PCB. The PCB assembly machine also includes a feeder system configured to supply the electrical components, wherein the board handling system mounts directly to the feeder system.
B23P 19/00 - Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformationTools or devices therefor so far as not provided for in other classes
A spindle assembly drive system that includes a rack unit, a drive gear, a motor, and a plurality of bearings, such that said rack unit laterally moves in a first axis with little or no movement in or rotation about any other axis.
