The present invention provides a photocurable composition capable of providing a cured product, the durability of which against compression set is unlikely to decrease. This photocurable composition comprises: a component (A), which is a photocurable polyisobutylene resin composition; and a component (B), which is surface-treated silica powder, wherein a specific group remains, and no methacrylsilyl group remains on particle surfaces.
Provided is an anaerobically curable composition that suppresses chelating agent precipitates and residues and has excellent storage stability. This anaerobically curable composition contains the following components (A)-(D), and the content of component (D) is 0.00001-0.01 mass% relative to the total mass of the anaerobically curable composition. Component (A): a (meth)acrylate compound (excluding phosphate ester compounds containing a (meth)acryloyl group in one molecule); component (B): an organic peroxide; component (C): an anaerobic curing catalyst; and component (D): a chelating agent.
C08F 230/02 - Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing phosphorus
3.
MOISTURE CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF
[Problem] The present disclosure can provide a means for a moisture curable resin composition to achieve excellent deep curing and excellent curing speed. The present disclosure relates to a moisture curable resin composition containing components (A) to (E). Component (A): a hydrolyzable silyl group-containing organic polymer. Component (B): a metal catalyst. Component (C): an amine compound. Component (D): a compound having a carbonyl group. Component (E): a compound having a hydroxyl group.
C08L 101/10 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups containing hydrolysable silane groups
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
4.
STRUCTURE OF DISCHARGE PART OF FOAMING DEVICE AND FOAMING DEVICE
[Problem] To prevent or suppress dripping of a foamable material discharged from a discharge part. [Solution] A discharge part 45 has an inlet part 46, an outlet part 47, a space formation part 49, and a valve body 48. A distance d2 from the outlet part to a proximity portion of the valve body in a state where the inlet part is not in communication with the outlet part is shorter than a distance d1 from the inlet part to the proximity portion of the valve body.
B05B 1/02 - Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops
B05B 7/04 - Spray pistolsApparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
B05C 5/00 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
B29C 39/22 - Component parts, details or accessoriesAuxiliary operations
B29C 44/00 - Shaping by internal pressure generated in the material, e.g. swelling or foaming
B29C 44/34 - Component parts, details or accessoriesAuxiliary operations
5.
ELECTROCONDUCTIVE RESIN COMPOSITION AND CURED OBJECT THEREFROM
Provided is an electroconductive resin composition which can be cured at low temperatures (e.g., 50-100°C) and gives a cured object having excellent electrical conductivity and excellent flexibility. The electroconductive resin composition comprises the following (A) to (D) components. (A) component, a urethane (meth)acrylate having two or more (meth)acryloyl groups in the molecule; (B) component, a polyfunctional (meth)acrylate (which is not a urethane (meth)acrylate) having a skeleton derived from a polyalkylene glycol; (C) component, electroconductive particles; (D) component, a thermal radical generator.
Provided is an electrically conductive resin composition that can be cured at a low temperature (for example, 80°C) and gives a cured product having good electrical conductivity even after keeping (storing) the electrically conductive resin composition for a long time (for example, 48 hours) at 25°C (normal temperature). A conductive resin composition according to the present invention contains the following components (A) to (D). Component (A): at least one of the following components (A1) and (A2); component (A1): a urethane (meth)acrylate having two or more (meth)acryloyl groups per molecule, component (A2): an epoxy (meth)acrylate having two or more (meth)acryloyl groups per molecule (excluding the component (A1), component (B): a monofunctional (meth)acrylate having an ether skeleton, component (C): electrically conductive particles, and component (D): a thermal radical generator
C08F 299/06 - Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polyurethanes
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
The present invention provides a photocurable resin composition capable of forming a cured product that has excellent adhesiveness and allows for easy dimensional control of compression ratio, with almost no permanent compression set. The photocurable resin composition according to the present invention contains components (A) to (C), and contains 50 parts by mass or more of component (B) per 100 parts by mass of component (A). Component (A): a monofunctional urethane (meth)acrylate oligomer having a hydrogenated polybutadiene skeleton. Component (B): a monofunctional (meth)acrylate monomer having a C5-10 linear alkyl group (excluding component (A)). Component (C): a photoradical polymerization initiator.
In the past, there has been demand for a two-component curable resin composition having high reactivity because a long time is required for curing when the reactivity of the two-component curable resin composition is lowered, but it has been difficult to suppress discharge of a gelled substance generated during mixing when the reactivity is high. The present invention relates to a device for discharging a two-component curable resin composition, wherein the two-component curable resin composition is supplied from the discharge device to an injection port of a static mixer in which hydrophilic surface treatment is performed on an element and a housing having a discharge port (nozzle) and the injection port at an end portion thereof, and a mixture is applied from the discharge port of the static mixer.
B01F 25/4314 - Straight mixing tubes with baffles or obstructions that do not cause substantial pressure dropBaffles therefor with helical baffles
B01F 23/45 - Mixing liquids with liquidsEmulsifying using flow mixing
B01F 23/47 - Mixing liquids with liquidsEmulsifying involving high-viscosity liquids, e.g. asphalt
B01F 35/512 - Mixing receptacles characterised by surface properties, e.g. coated or rough
B05C 5/00 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
B05D 1/26 - Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
B05D 7/24 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
9.
PHOTOCURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF
The present disclosure provides a means for obtaining a photocurable resin composition that is capable of maintaining a low curing shrinkage rate while realizing adhesive strength with respect to a cured product and reactivity with short-term curing. The present disclosure relates to a photocurable resin composition containing components (A) to (E). Component (A) is (A-1) a urethane (meth)acrylate having a bisphenol skeleton and/or (A-2) a urethane (meth)acrylate having a polybutadiene skeleton. Component (B) is a (meth)acrylamide having a heterocyclic structure. Component (C) is a (meth)acrylamide having a specific structure. Component (D) is a (meth)acrylate having a fluorene skeleton. Component (E) is a photoinitiator.
B29C 39/00 - Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressureApparatus therefor
The present invention provides a photocurable resin composition that can be cured with visible light, can be used as an adhesive or a sealant for members that include polyethylene naphthalate (PEN) and do not readily transmit ultraviolet light, and also has excellent acidic aqueous solution resistance. This photocurable resin composition includes (A) an oligomer that has at least one (meth)acryloyl group, (B) a thioxanthone photoinitiator, and (C) a tertiary amine that has at least two aromatic rings in the molecule thereof.
C08F 290/00 - Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers
The present invention provides a photocurable resin composition which has favorable thick film curability and of which the cured product after curing is excellent in flexibility and heat resistance. The photocurable resin composition according to the present invention includes component (A): a polyorganosiloxane having one or more vinyl groups in one molecule, component (B): a compound having one or more mercapto groups in one molecule, component (C): a photoinitiator, and component (D): hollow resin particles.
The present invention provides a moisture-curable resin composition in which neither a polysiloxane nor a tin catalyst is used and which has high adhesiveness to metals and plastics and further has stable adhesion performance as an adhesive or sealant. The present disclosure relates to a moisture-curable resin composition comprising: component (A), which is a polyoxyalkylene polymer having a hydrolyzable silyl group and a (meth)acrylic polymer having a hydrolyzable silyl group; component (B), which is a silane coupling agent having one or more epoxy groups in the molecule; and component (C), which is a titanium catalyst.
[Problem] There have been problems such that the appearance of a coating film is deteriorated and the storage stability of a coating agent is deteriorated if an antifungal agent is added to a coating agent for outdoor installation for the purpose of imparting antifungal properties to the coating agent. Disclosed is a coating agent composition which contains the following components (A) to (D), wherein the component (B) is contained in an amount of 0.1 part by mass to 3.6 parts by mass inclusive with respect to 100 parts by mass of the component (A). Component (A): a silicone oligomer having an alkoxy group, Component (B): an organic antibacterial agent, Component (C): an organic solvent having no hydroxyl group and having a boiling point of 130°C or less, Component (D): a curing catalyst
C09D 183/06 - Polysiloxanes containing silicon bound to oxygen-containing groups
B05D 7/24 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
C09D 5/14 - Paints containing biocides, e.g. fungicides, insecticides or pesticides
14.
HEAT-DISSIPATING RESIN COMPOSITION AND CURED PRODUCT THEREOF
The purpose of the present invention is to provide a heat-dissipating resin composition which is free of siloxanes and can yield a cured product having excellent durability at high temperatures. The present invention relates to a heat-dissipating resin composition which contains components (A) to (C), component (A) including component (A-1) and component (A-2). Component (A) is a crosslinkable silyl group-containing organic polymer. Component (A-1) is a vinyl-based polymer having one or more crosslinkable silyl groups in the molecule. Component (A-2) is an organic polymer having two or more crosslinkable silyl groups in the molecule (excluding component (A-1)). Component (B) is a heat-dissipating filler. Component (C) is a curing catalyst containing a zinc compound.
C08L 101/10 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups containing hydrolysable silane groups
C08K 3/013 - Fillers, pigments or reinforcing additives
The present invention provides: a method that enables more efficient production of a laminated steel sheet; and an adhesive composition for an adhesive that can be used in said method and has high preservation stability. This method is for producing a laminated steel sheet formed by laminating a prescribed number of thin steel sheets formed by punching a prescribed shape out from a band-shaped thin steel sheet. The method includes the following steps 1–4. Step 1 is for forming the thin steel sheets in the prescribed shape by punching; step 2 is for applying an adhesive composition to prescribed sites on the thin steel sheets from step 1; step 3 is for layering the thin steel sheets from step 2; and step 4 is for irradiating a layered body of a prescribed number of sheets with an energy beam. The adhesive composition contains the following constituents (A) to (C). Constituent (A) is a compound with at least one (meth)acryloyl group in one molecule; constituent (B) is a thermal radical initiator; constituent (C) is a photoinitiator; and constituent (D) is an anaerobically curing catalyst.
B32B 15/082 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising vinyl resinsLayered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising acrylic resins
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 15/18 - Layered products essentially comprising metal comprising iron or steel
B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
The purpose of the present invention is to provide a means for imparting adhesiveness to nails without sanding. The present invention is a primer coat resin composition for nails, the composition containing components (A) and (B) but being free of a photo-radical initiator. Component (A) is at least one selected from the group consisting of secondary alcohols having a molecular weight of at least 145 and a (meth)acryloyl group and tertiary alcohols having a molecular weight of at least 145 and having a (meth)acryloyl group (excluding component (B)). Component (B) is a phosphoric acid ester compound having a (meth)acryloyl group.
The present invention relates to a moisture-curable resin composition comprising the following (A), (B), (C), and (D) components. The (A) component is an oxyalkylene polymer having a hydrolyzable silyl group. The (B) component is a biomass filler. The (C) component is a filler surface-treated with a C12-C18 fatty acid. The (D) component is a metal catalyst.
C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers
18.
PRIMER COMPOSITION, PRODUCTION METHOD FOR PRIMER COMPOSITION, PRODUCTION METHOD FOR LAMINATE, PRODUCTION METHOD FOR LAMINATED STEEL SHEET, ADHESIVE COMPOSITION KIT, AND CURING ACCELERATION METHOD FOR ANAEROBIC ADHESIVE AGENT
The present disclosure provides a means with which it is possible to suppress a reduction in the performance (a reduction in the lubricating properties over time) of a primer composition containing a curing accelerator and a lubricating oil (e.g. a press working oil) and to improve the curing speed and the adhesion strength of an anaerobic adhesive agent. The present disclosure relates to a primer composition which is a curing accelerator for an anaerobic adhesive agent containing components (A)-(C) below, said primer composition containing components (D) and (E) below, not containing ethanol, and not containing acetone. Component (A): a compound having at least one (meth)acryloyl group Component (B): An organic peroxide Component (C): An anaerobic curing catalyst Component (D): a metal complex Component (E): A solvent having a boiling point of 80°C or higher
C09J 5/02 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
C10M 169/00 - Lubricating compositions characterised by containing as components a mixture of at least two types of ingredient selected from base-materials, thickeners or additives, covered by the preceding groups, each of these compounds being essential
19.
PRIMER COMPOSITION, PRODUCTION METHOD FOR LAMINATE, PRODUCTION METHOD FOR LAMINATED STEEL SHEET, AND ADHESIVE COMPOSITION KIT
The present disclosure provides a means with which it is possible to suppress a reduction in the performance (a reduction in the lubricating properties over time) of a primer composition containing a curing accelerator and a lubricating oil (e.g. a press working oil) and to improve the curing speed and the adhesion strength of an anaerobic curable adhesive agent. The present disclosure relates to a primer composition containing an (A) component and a (B) component, wherein the (A) component contains an (A-1) metal complex, and the (A) component content is 35 parts by mass per 100 parts by mass of the (B) component. (A) component: a curing accelerator for an anaerobic curing adhesive agent (B) component: a lubricating oil
C09J 5/02 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
C10M 169/00 - Lubricating compositions characterised by containing as components a mixture of at least two types of ingredient selected from base-materials, thickeners or additives, covered by the preceding groups, each of these compounds being essential
The purpose of the present invention is to provide a moisture curable composition, a cured product of which has high elongation, high strength, and excellent heat resistance. The present invention provides a moisture curable composition which contains the following components (A) to (C). Component (A): an organic polymer which has two or more alkoxysilyl groups in each molecule Component (B): an organic metal catalyst Component (C): an aromatic secondary amine compound
C08L 101/10 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups containing hydrolysable silane groups
C08L 33/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
C09J 133/04 - Homopolymers or copolymers of esters
C09J 171/00 - Adhesives based on polyethers obtained by reactions forming an ether link in the main chainAdhesives based on derivatives of such polymers
C09J 201/10 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups containing hydrolysable silane groups
C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers
The present invention provides a means that is capable of maintaining resistance to a coolant. A moisture-curable resin composition according to the present invention contains the following components (A) to (D): Component (A): an organic polymer having a hydrolyzable silyl group; component (B): an organic zinc catalyst; component (C): (C-1) a monoamine compound having a C7-C20 alkyl group and/or (C-2) a diamine compound which has a nitrogen atom and is such that a C5 or less alkyl group is directly bonded to the nitrogen atom; and component (D): a silane coupling agent having an epoxy group.
C08L 101/10 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups containing hydrolysable silane groups
A purpose of the present invention is to provide a two-pack curable resin composition capable of giving a cured object which can retain flexibility at low temperatures, is inhibited from suffering excessive resin softening at high temperatures, and has excellent creep resistance. The two-pack curable resin composition comprises the following (A) to (D) components, wherein the amount of the (C) component is 27-80 parts by mass per 100 parts by mass of the (A) component. (A) component: an epoxy resin; (B) component: a metal catalyst; (C) component: an organic polymer having a hydrolyzable silyl group; (D) component: a hardener for epoxy resins
The present invention provides an electroconductive resin composition which, even when cured at a low temperature such as about 80°C, can give cured objects excellent in terms of adhesive force and electroconductivity. The electroconductive resin composition comprises the following (A) to (C) components, wherein the (C) component comprises (C-1) and (C-2): (A) component, an epoxy resin; (B) component, electroconductive particles; and (C) component, polyamine-based latent hardeners comprising (C-1) a polyamine-based latent hardener having a softening point of 50-129°C and (C-2) a polyamine-based latent hardener having a softening point of 130-180°C.
The purpose of the present invention is to provide a release agent capable of achieving a removal property (releasability) in a short time with respect to gel nails treated therewith without using aluminum foil or cotton for preventing volatilization of solvents. The present invention provides a release agent comprising components (A) through (D). Component (A): a carbonate-based solvent Component (B): a polyether-based solvent that does not contain a hydroxyl group in the molecule Component (C): an unsaturated fatty acid as an oil Component (D): a thickener
2322]- unit Component (B): a compound which has one or more (meth)acryloyl groups and one or more hydrolyzable silyl groups, while having a main chain that is composed of an organic chain, and which has a weight average molecular weight of 300 or more (excluding the component (A)) Component (C): a radical photopolymerization initiator
The present invention provides a detergent composition or a coating agent composition having exceptional rust prevention properties. The present disclosure relates to either a detergent composition that has a pH of 8.0-11.0 and contains component (A): an alkaline aqueous solution and component (B): sodium benzoate, or a coating agent composition that has a pH of 8.0-11.0 and contains component (A): an alkaline aqueous solution, component (B): sodium benzoate, and component (C): emulsion particles.
C09D 133/00 - Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofCoating compositions based on derivatives of such polymers
C09D 201/00 - Coating compositions based on unspecified macromolecular compounds
The present invention makes it possible to develop, within a short time, removability of a gel manicure that has been applied. The remover contains components (A) to (C) and satisfies at least one requirement selected from the group consisting of requirements (i) and (ii). Requirement (i): the pH of the remover is greater than 7. Requirement (ii): the remover is composed of only five components, i.e., the components (A) to (C), a pH adjusting agent, and a surfactant. Component (A): a solvent. Component (B): a thickening agent having a solid form at 25°C. Component (C): a hydrophobic compound that is non-volatile at 25°C.
A61K 8/81 - Cosmetics or similar toiletry preparations characterised by the composition containing organic macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
Provided is an epoxy resin composition having high adhesion characteristics. An epoxy resin composition according to the present invention contains the following components (A)-(D): (A) an epoxy resin (excluding component (B) indicated below); (B) an epoxy resin derived from cottonseed oil; (C) rubber particles; and (D) a latent curing agent.
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
Provided is a conductive resin adhesive agent which can be cured in a short period of time and from which a cured product having excellent adhesive strength and excellent conductivity is obtained. This conductive resin adhesive agent contains the following components (A)-(D). Component (A): An epoxy resin having two or more glycidyl groups. Component (B): A polyfunctional vinyl ether having a ring structure (excluding the epoxy resin having two or more glycidyl groups). Component (C): Conductive particles. Component (D): A thermal cationic polymerization initiator.
The present invention addresses the problem of improving the durability of a base coat for gel nail enamels regardless of the presence or absence of a sanding treatment. The present invention provides a photocurable composition which contains the components (A) to (C) described below, wherein a bisphenol skeleton or a hydrogenated bisphenol skeleton, and a polyether skeleton are included in the molecular skeleton of the component (A). Component (A): a urethane-modified (meth)acrylate oligomer Component (B): a (meth)acrylate monomer having a hydroxyl group in each molecule Component (C): a photoinitiator The present invention particularly provides a photocurable composition for nails or artificial nails.
A61K 8/81 - Cosmetics or similar toiletry preparations characterised by the composition containing organic macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
Provided is a photocurable resin composition which has satisfactory workability during application and gives, after curing, a flexible cured object having a low storage modulus. This photocurable resin composition comprises the following components (A) to (C): (A) a compound having one or more (meth)acryloyl groups in the molecule; (B) hollow resin particles having, adhered to the surfaces thereof, an inorganic filler treated with a silane coupling agent having a (meth)acryloyl group; and (C) a photoinitiator.
The purpose of the present invention is to provide an epoxy resin composition which contains a plasticizer and improves tensile shear adhesive strength. The present invention provides an epoxy resin composition which contains the components (A)-(C) described below, wherein 10 parts by mass to 50 parts by mass of the component (B) is contained relative to 100 parts by mass of the component (A). Component (A): an epoxy resin Component (B): particles of a castor oil that is in a solid state at 25° C Component (C): a curing agent and/or a curing accelerator
C08G 59/18 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
C08K 3/013 - Fillers, pigments or reinforcing additives
C08K 5/103 - EstersEther-esters of monocarboxylic acids with polyalcohols
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
The present invention provides a curable resin composition that can be cured at room temperature without using a heat source or light source, and of which a cured material has excellent high compression resistance and sealing property. The curable resin composition according to the present invention contains the following (A) to (D) components: (A) component: A compound having 2 or more epoxy groups (B) component: A thiol curing agent (C) component: Resin hollow particles (D) component: A curing accelerator.
The present invention provides a curable resin composition which contains capsules and is capable of maintaining sealability at a screwed part of a screwing member in an endurance test such as a heat cycle test. The present invention provides a curable resin composition which contains the following components (A) to (D). Component (A): capsules which each internally contain, as contents, a multifunctional epoxy resin and a monofunctional epoxy resin Component (B): capsules which each internally contain, as a content, a polythiol Component (C): a compound which accelerates the curing of the contents of the component (A) and the content of the component (B) Component (D): an inorganic filler
Conventional curable resin compositions exhibit the problem that, when a resin is colored in order to, for example, hide component wiring, the promotion of curing by active energy ray irradiation is inhibited, and curability is thus affected. The present invention relates to a photocurable resin composition that has excellent surface curability even when colored and that provides a cured product having excellent tensile strength. The above problem is solved by a photocurable resin composition comprising components (A) to (D). Component (A) is an organic polymer have two or more alkoxysilyl groups in one molecule thereof. Component (B) is a compound having an isocyanuric ring and an alkoxysilyl group in one molecule thereof. Component (C) is a pigment. Component (D) is a photoacid generator.
C08L 101/10 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups containing hydrolysable silane groups
The present invention provides a means for achieving a cured product which has high adhesion to at least one kind of metal and high resistance to coolants. Provided is a curable resin composition which contains components (A)-(C). Component (A): a polymer which has a main chain that is a polymerized product of a monomer including a (meth)acrylic monomer, and which has a hydrolyzable silyl group in each molecule Component (B): an organic zinc catalyst Component (C): a silane coupling agent having an epoxy group
C08L 33/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofCompositions of derivatives of such polymers
C08K 3/013 - Fillers, pigments or reinforcing additives
[Problem] To provide an aqueous composition for screw-member coating which can attain high visibility although being an aqueous composition. [Solution] The aqueous composition for screw-member coating comprises an (A) component, which is an aqueous binder, and a (B) component, which is an aqueous emulsion containing a fluorescent pigment and having a surface tension of 15.5-80 mN/m.
C09D 133/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
The purpose of the present invention is to provide a photocurable resin composition containing a colorant, the photocurable resin composition having excellent adhesion to plastic members. The present invention provides a photocurable resin composition containing the following components (A)-(E): component (A): an organic polymer having at least two alkoxysilyl groups in one molecule; component (B): Talc powder and/or calcium carbonate powder; component (C): a pigment; component (D): a photoacid generator; and component (E): a compound having an isocyanuric ring and an alkoxysilyl group in one molecule.
C08L 101/10 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups containing hydrolysable silane groups
C08K 3/013 - Fillers, pigments or reinforcing additives
A gasket molding method according to the present invention for molding a gasket on a workpiece comprises, in the following order: an coating step for applying, inside a cavity of a molding die, an active energy ray curable liquid that has a structural viscosity ratio of 1.5 to 4.0; a bonding step for bonding the molding die, to which the active energy ray curable liquid has been applied, and a workpiece; a curing step for curing the applied active energy ray curable liquid by irradiation of active energy rays; and a molding die release step for separating, from the molding die, the cured active energy ray curable liquid together with the workpiece. In the coating step, the coating path has overlapping regions. Consequently, the present invention provides a gasket molding method which suppresses the inclusion of air bubbles in the overlapping regions of coating path.
[Problem] To provide a photocurable composition for nails or artificial nails that suppresses heat generation, that achieves both storage stability and photocurability, and that exhibits luster on a surface of a cured product thereof. [Solution] A photocurable composition for nails or artificial nails which comprises components (A)-(D), said photocurable composition containing 30-70 parts by mass of component (B) and 10-80 parts by mass of component (C) with respect to 100 parts by mass of component (A). Component (A) is a urethane-modified (meth)acrylate oligomer having a weight-average molecular weight of 3,000-6,000 and including three to five (meth)acryloyl groups per molecule. Component (B) is a (meth)acrylate (excluding component (A)) including one or more (meth)acryloyl groups per molecule. Component (C) is a polythiol compound. Component (D) is a photoinitiator.
A61K 8/81 - Cosmetics or similar toiletry preparations characterised by the composition containing organic macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
[Problem] To provide a photocurable composition for nails or artificial nails that is capable of forming a cured product having excellent abrasion resistance and high gloss. [Solution] A photocurable composition for nails or artificial nails containing the following components (A) to (E), wherein, when component (C) contains component (c-1), the composition contains no monofunctional (meth)acrylate as component (D), or the content of a monofunctional (meth)acrylate as component (D) is 50 mass% or less of the total amount of component (D). Component (A): a urethane-modified (meth)acrylate oligomer. Component (B): a (meth)acrylate having a bisphenol skeleton. Component (C): one or more (meth)acrylates [excluding components (A) and (B)] selected from the group consisting of component (c-1) and component (c-2); component (c-1) a (meth)acrylate having an alicyclic hydrocarbon skeleton; and component (c-2) a (meth)acrylate having an isocyanurate skeleton. Component (D): a (meth)acrylate other than components (A) to (C). Component (E): a photoinitiator.
A61K 8/81 - Cosmetics or similar toiletry preparations characterised by the composition containing organic macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
The present invention provides a low-temperature-curable epoxy resin composition that achieves both excellent adhesive strength and ink resistance. Provided is an epoxy resin composition that includes components (A)–(C), the epoxy resin composition including at least 40 mass% of a glycidyl amine epoxy resin (A-1) per 100 mass% of component (A). (A) An epoxy resin. (B) Talc. (C) A curing agent that is a liquid at 25°C.
Conventional coating agents have the problems of being peeled off by strong impacts due to being outdoors even when the coating agent is applied in advance, and impairing the design of an outdoor installation due to damage to the coating agent itself. Also, there is a problem in that even if the coating agent is applied after damage is incurred, the damage cannot be concealed and the design is impaired. The coating composition contains the following components (A) to (D): The component (A) is a silicone oligomer having only an alkoxy group, a phenyl group and an alkyl group in the molecule; the component (B) is a compound having an alkoxy group in the molecule and an amino group and/or a mercapto group; the component (C) is a silicone oligomer having only an alkoxy group and an alkyl group in the molecule; and the component (D) is a curing catalyst.
The purpose of the present invention is to provide a two component curable resin composition by which can be obtained a cured product that excels in hydrogen gas barrier properties and exhibits high stretchability and high strength. The present invention provides a two component curable resin composition which comprises agent A and agent B mentioned blow, and for which the cured product of the same has a sea-island structure. Agent A is a composition containing an epoxy resin as component (a) and a catalyst as component (b), and agent B is a composition containing, as a component (c), an organic polymer having two or more hydrolyzable silyl groups per molecule, and an epoxy resin curing agent as component (d).
C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C08L 101/10 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups containing hydrolysable silane groups
C08G 59/18 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
[Problem] The present invention relates to a moisture-curable resin composition which yields a cured product that exhibits excellent displacement-following properties and resin strength while having excellent flame retardancy corresponding to UL94V-0. [Solution] Provided is a moisture-curable resin composition containing components (A) to (D). Component (A): an oxyalkylene polymer having a hydrolyzable silyl group. Component (B): a flame retardant that is liquid at 25°C. Component (C): a flame retardant that is solid at 25°C. Component (D): a curing catalyst.
C08L 49/00 - Compositions of homopolymers or copolymers of compounds having one or more carbon-to-carbon triple bondsCompositions of derivatives of such polymers
46.
GASKET FORMING METHOD, GASKET FORMING MOLD, AND GASKET FORMING DEVICE
The present invention is a gasket forming method for forming a gasket on a workpiece. The method comprises, in the following order, an application step for applying an activated energy beam-curing liquid on a cavity (41) of a transparent forming mold (40), an adhering step for adhering the forming mold (40), to which the activated energy beam-curing liquid has been applied, and a workpiece to each other, a curing step for curing the applied activated energy beam-curing liquid by radiating activated energy beams, and a mold release step for releasing the cured activated energy beam-curing liquid, together with the workpiece, from the forming mold (40). In the adhering step, when the workpiece and the forming mold (40) have been adhered to each other via the activated energy beam-curing liquid, some of the activated energy beam-curing liquid or gas is discharged, to the atmosphere, from a communication path (44) that is in communication with the cavity (41). As a result thereof, it is possible to reduce a releasing force for releasing the gasket from the forming mold and to uniform the dimensional precision of the gasket.
B29C 39/10 - Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressureApparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
The present disclosure provides a means which is capable of suppressing the connection resistance to a low level in cases where base metals, or a base metal and another material are electrically connected to each other with use of a conductive composition. This means is required only to suppress the connection resistance to a low level in cases where at least one base metal is used as an object to be electrically connected. The present disclosure relates to a conductive composition which contains the following components (A) to (D). Component (A): an epoxy resin Component (B): a thermal curing agent Component (C): a nickel powder serving as a conductive powder Component (D): an organic aluminum complex
In cases where a component having a low molecular weight is added to conventional epoxy resin compositions for the purpose of improving the workability thereof, the component having a low molecular weight is likely to volatilize and it is difficult to suppress discharge of outgas. Meanwhile, an epoxy resin composition according to the present invention is capable of suppressing the generation of outgas during a curing process even if a component having a low molecular weight is added thereto for the purpose of workability improvement; and this epoxy resin composition is able to be cured at low temperatures. An epoxy resin composition according to the present invention contains the components (A) to (D) described below; the content of epoxy resins that do not contain an aromatic ring in each molecule is 9.5% by mass or less relative to the total amount of the component (A); and the content of the component (D) is 25% by mass or less relative to the entirety of the composition. Component (A): epoxy resins Component (B): a compound which has two or more thiol groups in each molecule Component (C): a curing accelerator Component (D): a filler
C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
49.
GASKET MOLDING METHOD, GASKET, FUEL CELL COMPONENT, FUEL CELL, FUEL CELL PRODUCTION METHOD, SEALING METHOD, AND GASKET MOLDING DEVICE
The present invention is a gasket molding method for molding a gasket on a workpiece, the method comprising, in the stated order: an application step (S1) for applying, to the inner side of a cavity of a molding die, an active energy ray curable liquid; a bonding step (S2) for bonding the molding die, to which the active energy ray curable liquid has been applied, and a workpiece; a precuring step (S3) for emitting active energy rays with a cumulative light amount achieving a reaction rate of 20%-85%; a mold releasing step (S4) for peeling off, from the molding die, the precured active energy ray curable liquid together with the workpiece; and a main curing step (S5) for emitting active energy rays with a cumulative light amount achieving a reaction rate of more than 85% and not more than 100%. The present invention thereby provides a gasket molding method that improves productivity even using a molding die.
B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
B05D 3/06 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
B05D 3/12 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
B05D 7/00 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
B05D 7/24 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
Provided according to the present disclosure is a conductive resin composition that suppresses generation of outgas. The present disclosure relates to a conductive resin composition containing the following components (A)-(D). Component (A): bisphenol epoxy resin, component (B): epoxy resin having a boiling point of 300°C or higher (excluding component (A)), component (C): conductive particles, component (D): epoxy resin curing agent
C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
The purpose of the present invention is to provide an electrically conductive resin composition that cures at normal temperature (5 to 50℃) and produces a cured product having excellent electrical conductivity. This electrically conductive resin composition contains an epoxy resin as component (A), a spike-like electrically conductive filler as component (B), and a curing agent for epoxy resins as component (C).
The present disclosure relates to an electroconductive paste containing components (A) through (C). Component (A) is an epoxy resin, component (B) is a latent curing agent, and component (C) is a plate-like crystalline metal powder having an average grain size of 0.6 to 1.4 μm. The present invention provides an electroconductive paste that is capable of producing a balance between the conductivity and the adhesive strength of the resulting cured product.
According to the present disclosure, provided is an electrically conductive resin composition which exhibits excellent storage stability and yields a cured product having low connection resistance. The present disclosure relates to an electrically conductive resin composition which contains components (A) to (E) and in which the organic solvent content is 1 mass% or less relative to the overall electrically conductive resin composition. Component (A): an epoxy resin having two or more epoxy groups per molecule. Component (B): a reactive diluent having one epoxy group per molecule. Component (C): rubber particles. Component (D): electrically conductive particles containing (d-1) and (d-2). (d-1): plate-type silver particles. (d-2): electrically conductive particles other than plate-type silver particles. Component (E): an epoxy curing agent.
[Problem] In the past, it was difficult to suppress damage to natural nails and inflammation of the skin of fingers when softening and peeling off coating films with solvents such as ethanol or acetone in order to remove the cured coating films of photocurable compositions for nails or artificial nails. [Solution] Provided is a photocurable composition for nails, which contains components (A) to (D). Component (A): a urethane-modified oligomer which has a weight average molecular weight of 25,000-100,000 and has two or more (meth)acryloyl groups per molecule. Component (B): a monomer which has two or more ether groups and one (meth)acryloyl group in the molecule. Component (C) (which excludes component (A)): a monomer of a component (c-1) and/or a component (c-2) (component (c-1) is a chain-like monomer having four or more (meth)acryloyl groups per molecule and component (c-2) is a monomer having two or more (meth)acryloyl groups and a cyclic structure per molecule). Component (D): a photoinitiator.
A61K 8/81 - Cosmetics or similar toiletry preparations characterised by the composition containing organic macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
55.
TWO-COMPONENT THERMALLY CONDUCTIVE RESIN COMPOSITION AND CURED PRODUCT
Provided is a two-component thermally conductive resin composition which can be cured at room temperature, and a cured product of which has a sufficient resin stretching ratio. The two-component thermally conductive resin composition comprises components (A)-(F). Component (A): an epoxy resin (excluding epoxy resins having a (meth)acrylic polymer backbone). Component (B): a metal catalyst. Component (C): an acrylic polymer and/or a polyether polyol (excluding component (D)). Component (D): an organic polymer containing a crosslinkable silyl. Component (E): an epoxy curing agent. Component (F): a heat-dissipating filler.
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C08G 59/18 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
C08K 3/013 - Fillers, pigments or reinforcing additives
C08K 5/56 - Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
C08L 33/08 - Homopolymers or copolymers of acrylic acid esters
C08L 71/00 - Compositions of polyethers obtained by reactions forming an ether link in the main chainCompositions of derivatives of such polymers
C08L 101/10 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups containing hydrolysable silane groups
[Problem] The present invention addresses the problem of providing a novel multilayer body which comprises a metal layer and a carbon fiber-reinforced plastic layer. [Solution] A multilayer body which comprises a carbon fiber-reinforced plastic layer, an intermediate layer and a metal layer, wherein the intermediate layer contains a cellulose or a derivative thereof and a cured product derived from an adhesive, while being arranged so as to separate the carbon fiber-reinforced plastic layer and the metal layer from each other.
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 5/10 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments characterised by a fibrous layer reinforced with filaments
B32B 23/04 - Layered products essentially comprising cellulosic plastic substances comprising such substance as the main or only constituent of a layer, next to another layer of a specific substance
C08J 5/04 - Reinforcing macromolecular compounds with loose or coherent fibrous material
57.
METHOD FOR SHIPPING RESIN COMPOSITION FILLING CONTAINER, COOLING AND THAWING METHOD, AND SHIPPING SYSTEM
A shipping method according to the present invention includes: a step for accepting, on the basis of an instruction from a purchaser, a filled container obtained by filling a prescribed container with a resin composition; a step for inputting the number of filled containers to a computer; a step for cooling the resin composition in the filled containers at a specific cooling rate using a thermostat until a phase transition temperature is reached; a step for storing the resin composition that has been cooled to the phase transition temperature in a refrigerated warehouse that is at a temperature equal to or less than the phase transition temperature; a step for receiving a shipping count for the filled containers from the purchaser; a step for thawing the resin composition in some or all of the filled containers stored in the refrigerated warehouse at a specific warming rate using a thermostat, on the basis of the shipping count, until a transport temperature is reached; and a step for shipping the filled containers filled with the resin composition that has been thawed to the transport temperature to the purchaser while keeping the temperature at or below the transport temperature. The phase transition temperature is the temperature at which heat absorption initially occurs in differential scanning calorimetry (DSC) (μW) upon warming at a warming rate of 10°C/min from –200°C according to DSC measurement.
[Problem] The purpose of the present invention is to provide a two-part curable resin composition that has excellent room temperature curability and is capable of suppressing coloring of the cured product. [Solution] A two-part curable resin composition containing agent A and agent B. Agent A: a composition containing component (a) and component (b) Component (a): an epoxy resin having two or more epoxy groups in one molecule Component (b): an alkoxide aluminum catalyst Agent B: a composition containing component (c) and component (d) Component (c): an organic polymer having two or more hydrolyzable silyl groups Component (d): a curing agent for component (a)
C08L 101/10 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups containing hydrolysable silane groups
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
The purpose of the present invention is to provide a curable resin composition that has low viscosity but is viscous enough to be suited to application by screen printing and, when cured, has a low compression set and is durable, e.g., is heat resistant, acid resistant, high temperature and high humidity resistant, and refrigerant resistant. Specifically, the present invention provides a curable resin composition that is characterized by containing components (A)–(D). Component (A): a vinyl polymer that has at least one alkenyl group per molecule thereof. Component (B): a compound that has at least one hydrosilyl group per molecule thereof. Component (C): a catalyst. Component (D): a silicone rubber powder that is coated with a silicone resin.
The present invention provides a microcapsule type curable resin composition which is applied to a screw member so as to reduce the generation of dust when the screw member is screwed into a base material, while additionally having excellent loosening prevention effect. The present invention also provides a method for producing a screw member, the method having a step in which a precoat adhesive layer is formed by applying the above-described microcapsule type curable resin composition to the surface of a screw member and drying the curable resin composition thereon. The present invention also provides a screw member which has a precoat adhesive layer that is formed by applying the above-described microcapsule type curable resin composition to the surface of the screw member and drying the curable resin composition thereon. The present invention provides a microcapsule type curable resin composition which contains the components (A) to (D) described below. Component (A): an epoxy resin Component (B): a water-dispersible binder Component (C): a curing agent for epoxy resins Component (D): a hollow filler
2322]- unit. The (B) component is an acrylate monomer (b1) having a C5-C25 alicyclic hydrocarbon group and an acrylate monomer (b2) having a C5-C30 linear or branched alkyl group. The (C) component is a photoradical polymerization initiator.
C08F 290/04 - Polymers provided for in subclasses or
C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
C08F 20/00 - Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide, or nitrile thereof
[Problem] The purpose of the present invention is to provide: a curing agent that can suppress change in viscosity of a one-part type curable resin composition and that does not affect physical properties of a cured product; and a method for producing the curing agent. [Solution] This processed curing agent is obtained by mixing components (A)-(C) so as to disperse the same, and removing component (B) therefrom. Component (A): A curing agent that is solid at 25°C. Component (B): A solvent that does not dissolve component (A). Component (C): A metal alkoxide compound.
C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
Conventionally, it has been difficult to achieve both photocurability and storage stability through the addition of a polythiol compound to a compound having a (meth)acryloyl group. The present invention pertains to a photocurable composition containing components (A)-(D). Component (A): A compound having a (meth)acryloyl group. Component (B): A polythiol compound. Component (C): A photoinitiator. Component (D): A preservation stabilizer having a pKa of 1.0-4.0 (but not including component (A)).
A61K 8/46 - Cosmetics or similar toiletry preparations characterised by the composition containing organic compounds containing sulfur
A61K 8/81 - Cosmetics or similar toiletry preparations characterised by the composition containing organic macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
The present invention provides a means which enables a photocurable composition for nails or artificial nails, the photocurable composition containing a polythiol compound and fumed silica, to achieve both high structural viscosity ratio (high thixotropy) and high transparency (low turbidity) of a cured product. The present invention provides a photocurable composition for nails or artificial nails, the photocurable composition containing the components (A) to (D) described below. Component (A): a compound having a (meth)acryloyl group Component (B): a polythiol compound Component (C): a photoinitiator Component (D): a filler containing component (D-1) and component (D-2), with each of the component (D-1) and the component (D-2) being a surface-treated fumed silica having a specific surface residue
A61K 8/81 - Cosmetics or similar toiletry preparations characterised by the composition containing organic macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
Provided is a means whereby a photocurable composition of a polythiol-compound-containing compound having a (meth)acryloyl group is inhibited from heating up when photocured. The photocurable composition comprises (A) to (D) components: (A) component, a compound having a (meth)acryloyl group; (B) component, a polythiol compound; (C) component, a photoinitiator; and (D) component, a phenol compound (excluding the (A) component) of a specific structure having one phenol group in the molecule.
A61K 8/46 - Cosmetics or similar toiletry preparations characterised by the composition containing organic compounds containing sulfur
A61K 8/81 - Cosmetics or similar toiletry preparations characterised by the composition containing organic macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
Conventionally, properties ranging from production efficiency to fast curing have been desirable in anaerobic curable compositions which are used in the assembly of laminated steel sheets; however, in recent years, accelerating curing by heating in addition to accelerating curing by using a primer have been developed in response to the diversification of assembly methods. In order to improve the durability of a laminated steel sheet, it has become desirable to improve the peeling adhesive force and the shear adhesive force of an anaerobic curable composition. The present invention pertains to an anaerobic curable composition which contains the following components (A)-(D): (A) a (meth)acryloyl compound; (B) a hydroperoxide; (C) saccharin; and (D) a sodium salt, potassium salt or calcium salt of saccharin.
The present invention provides a photocurable composition having good adhesion to an adherend and good durability when a cured product is compressed. The present invention is a photocurable composition including the following components (A)-(D), the contained amount of monomers having an alicyclic structure and a (meth)acryloyl group being 6-20 mass%, where the total amount of component (C) is 100 mass%: Component (A): polyisobutylene compound having a (meth)acryloyl group in each molecule. Component (B): urethane-modified (meth)acrylate oligomer (excluding component (A)). Component (C): monomer having a (meth)acryloyl group (excluding component (A) and component (B)). Component (D): photoinitiator.
C08F 290/00 - Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers
G11B 33/12 - Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
This curable composition comprises the following (A)-(E) components: (A) an organic solvent having an initial boiling point of 85-145ºC (exclusive of 145); (B) an organic solvent having an initial boiling point of 145-190ºC (exclusive of 190); (C) an organic solvent having an initial boiling point of 190-250ºC (exclusive of 250); (D) a polysilazane compound; and (E) a catalyst, wherein 12-85 mass% of the (A) component, 12-85 mass% of the (B) component, and 0.5-20 mass% of the (C) component are contained with respect to 100 mass% of the total of the (A) component, the (B) component, and the (C) component. According to the present invention, provided is a curable composition having excellent drying properties, recovery workability after a certain period of time, and film water repellency.
C08K 5/56 - Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
C08L 83/16 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon onlyCompositions of derivatives of such polymers in which all the silicon atoms are connected by linkages other than oxygen atoms
C08L 91/00 - Compositions of oils, fats or waxesCompositions of derivatives thereof
C09D 183/08 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
This moisture-curable resin composition includes the components (A) to (D). Component (A): A (meth)acrylic polymer having a hydrolyzable silyl group. Component (B): A metallic hydroxide flame retardant. Component (C): A phosphorus-based flame retardant. Component (D): A curing catalyst. The present invention provides a moisture-curable resin composition that has an extremely low content of low-molecular siloxane and that gives a cured product having high flexibility and high resin strength while also having excellent flame retardancy equivalent to V-0.
The purpose of the present invention is to provide a thermally conductive resin composition which enables the achievement of a cured product that exhibits excellent tensile strength and excellent elongation, while maintaining adequate thermal conductivity. The present invention provides a thermally conductive resin composition which contains the components (A) to (E) described below. Component (A): a urethane (meth)acrylate which has a polyether skeleton, while having a (meth)acryloyl group at one end Component (B): a monofunctional (meth)acrylic monomer which has a polyether skeleton, but does not have a urethane skeleton Component (C): a radical polymerization initiator Component (D): a plasticizer Component (E): a thermally conductive powder
A photocurable resin composition for nails or artificial nails is provided from which cured objects having a gloss can be formed. The photocurable resin composition for nails or artificial nails comprises the following (A) to (D) components, wherein the (C) component is contained in an amount of 0.01-3.0 parts by mass per 100 parts by mass of the compound having (meth)acryloyl groups. (A) component: A urethane (meth)acrylate oligomer (B) component: A compound having three or more (meth)acryloyl functional groups (the (A) component is excluded) (C) component: A polyfunctional thiol compound (D) component: A photoinitiator
A61K 8/46 - Cosmetics or similar toiletry preparations characterised by the composition containing organic compounds containing sulfur
A61K 8/55 - Cosmetics or similar toiletry preparations characterised by the composition containing organic compounds containing phosphorus
A61K 8/81 - Cosmetics or similar toiletry preparations characterised by the composition containing organic macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
Provided is a gasket molding method that enables molding under low pressure. A gasket molding method according to the present invention for molding a gasket (30) on a workpiece (10) comprises, in the order stated: an application step (S1) for applying, inside a cavity (41) of a molding die (40), an active energy ray curable liquid (20); a bonding step (S2) for bonding the molding die (40), to which the active energy ray curable liquid (20) has been applied, and the workpiece (10); a curing step (S3) for curing, by irradiation with active energy rays, the active energy ray curable liquid (20) which has been applied; and a molding die release step for peeling off, from the molding die (40), the cured active energy ray curable liquid (20) together with the workpiece (10).
H01M 8/0273 - Sealing or supporting means around electrodes, matrices or membranes with sealing or supporting means in the form of a frame
B29C 39/10 - Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressureApparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
Provided is a curable resin composition containing the following components (A)-(E). (A) A compound having two or more glycidyl groups per molecule (however, not including (B)). (B) A glycidyl-group-containing acrylic polymer. (C) A tackifier having a phenol skeleton and having an OH value of 100 or greater. (D) An inorganic filler. (E) A curing agent. According to the present invention, there is provided a structural adhesive having high flexibility and exceptional resin strength, adhesive strength, and toughness coefficient.
C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
The present invention provides a syringe transport method, a packaging member, a method for using the packaging member, and a syringe transport tool set that has: an encircling member (200) that is arranged in a housing space in a packaging container (100), encircles a syringe (500) comprising a material storing container (510) that stores a viscous material, and comprises a cushioning member (250) that cushions against external force applied to the syringe during transportation of the syringe; and a cold storage agent (300) comprising a housed-product that can be arranged between the syringe and the cushioning member in the housing space and which cools the syringe and a housed-product housing container (310) that houses the housed product. The thermal conductance of the cushioning member is no more than 0.022 W/m·K. The melting point of the housed product is no more than –30°. The present invention uses a configuration other than vacuum heat insulation and prevents or suppresses excessive cooling of the viscous material.
B65D 81/18 - Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient
B65D 81/38 - Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents with thermal insulation
75.
HOLDER, USAGE METHOD FOR HOLDER, SYRINGE TRANSPORT ARTICLE SET, AND TRANSPORT METHOD FOR SYRINGES
The present invention provides a holder that is to be arranged in a storage space of a packaging container (100) and has: an insertion part (410) into which a syringe (500) that comprises a material storage container (510) that stores a viscous material can be inserted in an upright posture; and a solid part (420) that is provided around the insertion part and forms the insertion part. The solid part: is formed from a first end part (424) at which the insertion part is positioned in the direction in which the viscous material is inserted into the insertion part to a second end part (425) that is on the opposite side from the first end part; includes a non-crosslinked polyethylene foam; and prevents bubbling when the viscous material as frozen at 0°C or below thaws. The present invention also provides a usage method for the holder, a syringe transport article set, and a transport method for syringes.
B65D 81/38 - Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents with thermal insulation
A61M 5/00 - Devices for bringing media into the body in a subcutaneous, intra-vascular or intramuscular wayAccessories therefor, e.g. filling or cleaning devices, arm rests
B65D 81/18 - Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents providing specific environment for contents, e.g. temperature above or below ambient
76.
TWO-PART CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF
The present invention provides a two-part curable resin composition that does not use a dibutyltin catalyst, has exceptional storage stability, cures quickly upon mixing, and yields a cured product having high elongation and high strength. Provided is a two-part curable resin composition comprising part A and part B below. Part A: composition containing component (a) and component (b). Component (a): hydrogenated epoxy resin. Component (b): one or more compounds selected from the group consisting of titanium dialkoxybis(acetylacetonate), titanium tetraisopropoxide, tetra-tert-butyl titanate, and aluminum catalysts. Part B: composition containing component (c) and component (d). Component (c): organic polymer having two or more hydrolyzable silyl groups. Component (d): curing agent for component (a).
C08L 101/10 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups containing hydrolysable silane groups
C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
77.
TWO-PART CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF
The present invention provides a two-part curable resin composition that, while maintaining the adhesive strength with respect to metals, can provide a cured product having high strength and high elongation. Provided is a two-part curable resin composition comprising agent A and agent B. Agent A: A composition containing component (a), which includes (a-1) a hydrogenated epoxy resin and (a-2) a bisphenol-type epoxy resin, and component (b), which is a curing catalyst for component (c). Agent B: A composition containing component (c), which is an organic polymer having two or more hydrolysable silyl groups, and component (d), which is a curing agent for component (a).
C08L 101/10 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups containing hydrolysable silane groups
C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
78.
CURABLE COMPOSITION, AND CURED COATING FILM, ARTICLE, AND COATING FILM FORMING METHOD USING SAID COMPOSITION
This curable composition has a weight average molecular weight of 3,000-10,000 and a number average molecular weight of 2,000-8,000, and contains a polysiloxazane compound (A) component having a specific structure, and a silicone compound (B) having a hydrolysable silyl group or a hydroxyl group. The present invention provides a curable composition from which it is possible to form a coating film having excellent water repellency and sliding properties, and which provides excellent stability to a coating film at the initial stage of being applied.
C08L 83/14 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon onlyCompositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
C09D 183/14 - Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon onlyCoating compositions based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
C08K 3/011 - Crosslinking or vulcanising agents, e.g. accelerators
The present invention relates to an epoxy resin composition having excellent low-temperature curability and excellent permeability through narrow clearances. This epoxy resin composition contains components (A) through (C). Component (A) is a compound having two or more epoxy groups; component (B) is a silica treated by phenylaminosilane; and component (C) is a compound that cures component (A).
C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
This aerosol composition includes the following component (A) and component (B): a fluorine-based solvent as component (A), and a helium gas propellant as component (B). Through the present invention, the propellent force of the aerosol is continuously maintained at a high level to the end.
C23G 5/028 - Cleaning or de-greasing metallic material by other methodsApparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing halogenated hydrocarbons
C09K 3/30 - Materials not provided for elsewhere for aerosols
Provided is a photocurable resin composition for nails or artificial nails, the composition having low curing heat. The present invention provides a photocurable resin composition for nails or artificial nails, the composition containing components (A) to (D), indicated below, wherein the molecular weight of the component (C) is equal to or greater than 200: the component (A) is a urethane (meth)acrylate oligomer; the component (B) is a monomer selected from the group consisting of a (meth)acrylate monomer, a (meth)acrylamide monomer, and a (meth)acrylic acid (excluding the component (A)); the component (C) is a compound having a polyglycerin that does not have a (meth)acryloyl group and/or a polyglyceryl ether skeleton that does not have a (meth)acryloyl group; and the component (D) is a photoinitiator.
A61K 8/81 - Cosmetics or similar toiletry preparations characterised by the composition containing organic macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
[Problem] To provide a liquid application device that applies liquid material using an application needle while causing the mechanism for moving the application needle to respond well to acceleration and deceleration. [Solution] A liquid application device 100 according to the present invention comprises: a tank 40 provided with a storage space S in which liquid material is stored; an application needle 50 provided with an end part 51 to which the liquid material stored in the storage space can adhere and which can move between the storage space and the outside of the storage space, the application needle being configured to apply the liquid material to a surface of a subject; a linear motor 20 provided with a movable part 21 capable of linear movement and a fixed part 22 longer than the movable distance of the movable part, the linear motor being configured to apply driving force for moving the application needle; and an air cylinder 30 that applies upward force in the direction of gravitational force to the movable part to hold the movable part.
B05C 1/02 - Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to separate articles
The present invention provides a foaming device (100) which discharges a foamable material (M) obtained by mixing a gas (G) into a viscous material of a resin (R) to disperse bubbles in the liquid of the viscous material, wherein the foaming device (100) includes: a pipe (10) allowing the resin and the gas to flow; a material supply unit (20) for supplying the viscous material into the pipe; a gas supply unit (32) for supplying the gas into the pipe; a first gear pump (31) disposed midway along the pipe; a second gear pump (33) which is disposed on the downstream side of the pipe relative to the first gear pump and which is rotationally driven at a higher speed than the first gear pump, thereby causing the gas to flow into the pipe and feeding the viscous material containing the gas to the downstream side of the pipe; a third gear pump (34) which is disposed on the downstream side of the pipe relative to the second gear pump and which is rotationally driven at the same speed as the second gear pump, thereby feeding the viscous material containing the gas further to the downstream side of the pipe; a mixer (41) which is disposed on the downstream side of the pipe relative to the third gear pump to disperse bubbles in the viscous material into the liquid of the viscous material; a discharge unit (45) which discharges the foamable material obtained as a result of the bubbles being dispersed in the liquid of the viscous material by the mixer; and a control unit (50) which controls a discharge operation for discharging the foamable material.
B01F 23/235 - Mixing gases with liquids by introducing gases into liquid media, e.g. for producing aerated liquids for making foam
B01F 25/62 - Pump mixers, i.e. mixing within a pump of the gear type
B05B 1/02 - Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to produce a jet, spray, or other discharge of particular shape or nature, e.g. in single drops
B05B 7/26 - Apparatus in which liquids or other fluent materials from different sources are brought together before entering the discharge device
B05B 7/32 - Apparatus in which liquids or other fluent materials from different sources are brought together before entering the discharge device in which one liquid or other fluent material is fed or drawn through an orifice into a stream of a carrying fluid the fed liquid or other fluent material being under pressure
84.
EPOXY RESIN COMPOSITION, CURED PRODUCT, AND COMPLEX
The objective of the present invention is to provide an epoxy resin composition which has a low temperature curability (75-160 °C), and from which a cured product that can suppress deterioration of characteristics due to heating can be obtained. An epoxy resin composition according to the present invention includes: as a component (A), an epoxy resin having at least two functional glycidyl groups in one molecule; and as a component (B), a polymerization initiator having a butoxy group and an alkali metal in one molecule.
C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
85.
PHOTOCURABLE SHEET-SHAPED SEALING AGENT FOR FUEL CELL, CURED PRODUCT, FUEL CELL, AND SEALING METHOD
The purpose of the present invention is to provide a photocurable sheet-shaped sealing agent having a hydrogen gas barrier and adherence to an electrolyte membrane. The photocurable sheet-shaped sealing agent for a fuel cell comprises component (A): a urethane (meth)acrylate, component (B): a phenoxy resin, and a component (C): a photopolymerization initiator.
C08F 299/06 - Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates from polyurethanes
C09K 3/10 - Materials not provided for elsewhere for sealing or packing joints or covers
[Problem] To provide a moisture curable resin composition which does not use an organic tin catalyst, has excellent quick curability and thick film curability due to moisture, and also has excellent adhesive properties to aluminum. [Solution] A moisture curable resin composition includes the following components (A) to (C): component (A) which is a polyoxyalkylene having hydrolyzable silyl groups at both ends thereof; component (B) which is a zinc-based catalyst; and component (C) which is a compound having, in one molecule, one hydrolyzable silyl group, and at least one amino group, wherein component (B) is contained in a predetermined amount with respect to 100 parts by mass of component (A).
An epoxy resin composition is provided which has excellent adhesiveness to dissimilar materials. This epoxy resin composition contains (A) to (E) below: (A) a compound which is liquid at 25°C, has two or more epoxy groups in one molecule, and has an epoxy equivalent of less than 210 g/eq; (B) (B-1) a compound which is liquid at 25°C, has two or more epoxy groups in one molecule and has an epoxy equivalent of greater than or equal to 210 g/eq, and/or (B-2) a compound which is solid at 25°C and has two or more epoxy groups in one molecule, (C) a thiol curing agent, (D) a latent curing agent and (E) a reactive diluent.
C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
Provided is an epoxy resin composition that, although being curable at a low temperature, can form a cured product having excellent impact resistance and has excellent adhesive strength. Specifically, provided is an epoxy resin composition containing: (A) an epoxy resin that is liquid at 25°C; (B) an epoxy resin that is solid at 25°C; (C) a rubber modified epoxy resin (excluding (A) and (B)); (D) a block urethane resin; (E) a true-spherical inorganic filler having an average particle size of 0.1-150 μm; (F) an organic filler; and (G) a latent curing agent.
C08G 59/00 - Polycondensates containing more than one epoxy group per moleculeMacromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compoundsMacromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
2322)- unit Component (B): a radical polymerization initiator Component (C): an antifoaming agent which does not contain an organic solvent, while containing a silicone compound that does not have any one of a methoxysilyl group, an ethoxysilyl group and a (meth)acryloyl group.
The present invention provides a photocurable resin composition for nails or artificial nails, which can form a cured product that has sufficient hardness for coating nails or artificial nails and exhibits excellent transparency and gloss. This photocurable resin composition for nails or artificial nails contains components (A) to (D): Component (A): a urethane (meth)acrylate oligomer. Component (B): a compound having three or more (meth)acryloyl functional groups (excluding component (A)). Component (C): a compound which has a molecular weight of 200 or less and has a hydroxyl group and a methacryloyl group (excluding components (A) and (B)). Component (D): a photoinitiator.
The present invention pertains to an epoxy resin composition that excels in flexibility and resin strength and can suppress warpage during curing with respect to adhesion of different types of materials. Specifically, the present invention provides a thermosetting epoxy resin composition comprising (A) to (C). (A) A dimer acid-modified epoxy resin and/or an aliphatic epoxy resin having an oxyalkylene skeleton; (B) A urethane (meth)acrylate; (C) A hydrazide compound
C08F 283/10 - Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass on to polymers containing more than one epoxy radical per molecule
C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
92.
PHOTOCURABLE COMPOSITION, SEALING MATERIAL, AND CURED OBJECT
The present invention provides a photocurable composition which has excellent barrier properties against both water and helium and can retain satisfactory force of adhesion to adherends. This photocurable composition comprises the following (A) to (D) components, wherein the (B) component and the (C) component are contained in amounts of 1-50 parts by mass and 50-300 parts by mass, respectively, per 100 parts by mass of the (A) component: (A) component is polyisobutylene having a (meth)acryloyl group in the molecule; (B) component is a urethane-modified (meth)acrylate oligomer (excluding the (A) component); (C) component is a (meth)acrylate monomer (excluding the (A) and (B) components); and (D) component is a photoinitiator.
The present invention is a container (100) comprising a seal part (13) in which a composite film (20) is affixed so as to form an accommodating space (11) that accommodates a humidity-curable resin. The humidity-curable resin is selected from a de-oximated condensation-curable resin at 120-500 Pa·s, a de-acetonated condensation-curable resin at 30-500 Pa·s, and de-alcoholized condensation-curable resin at 30-500 Pa·s. At least an aluminum foil layer (22) is positioned in the composite film (20). The seal part (13) comprises a plurality of recesses (26) in which the thickness of a heat-fusible layer (24) is less than at a peripheral edge. A plurality of the recesses (26) are positioned to form rows. A set of recesses constituting an nth row is positioned between an adjacent set of recesses in an n+1th row adjacent to the nth row and other recesses, as seen from a direction orthogonal to the rows. In the container (100), after the humidity-curable resin is preserved, curing of the humidity-curable resin is suppressed and the occurrence of abnormalities in external appearance is also suppressed.
B65D 75/26 - Articles or materials wholly enclosed in laminated sheets or wrapper blanks
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B65D 30/02 - Sacks, bags or like containers characterised by the material used
[Problem] To provide an epoxy resin composition attaining excellent flexibility and having low curing shrinkage. [Solution] The epoxy resin composition comprises the following (A) to (E) components. Component (A): a compound having two or more epoxy groups Component (B): a phenyl monoglycidyl ether having an alkyl group having 1-10 carbon atoms Component (C): an oxetane compound Component (D): a thiol hardener Component (E): a curing accelerator
[Problem] To keep a material application device from becoming heavy. [Solution] This material application device 100 comprises a pressing section 20 and a drive section 30, and the drive section 30 is provided with: a first drive section 40 that can impart driving force from a motor 41 to the pressing section; and a second driving section 60 that can impart driving force to the pressing section by feeding a fluid into an internal space S isolated from the outside.
The purpose of the present invention is to provide a cationically curable composition that exhibits an excellent adhesiveness with aluminum die castings, PPS, and the like, while retaining photocurability and low-temperature curability. The present invention is a cationically curable composition that contains components (A) to (E) and contains 12-100 parts by mass of component (E) per a total of 100 parts by mass of component (A) and component (B). Component (A) is an aromatic epoxy resin, component (B) is at least one among a hydrogenated epoxy resin (B1) and an alicyclic epoxy resin (B2), component (C) is a photo-cationic polymerization initiator, component (D) is a thermal cationic polymerization initiator, and component (E) is a polycaprolactone polyol that has at least three hydroxyl groups and a molecular weight of not more than 1,700.
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
[Problem] The present invention provides a curable resin composition that, without the use of an organic tin catalyst, has superior surface curability and has superior interior curability when used to adhere together adhesion members. [Solution] A curable resin composition including components (A) to (E). Component (A) is an epoxy resin having two or more epoxy groups per molecule, component (B) is a bismuth-based catalyst, component (C) is water with a pH of 8.0 or higher, component (D) is an organic polymer having two or more hydrolyzable silyl groups per molecule, and component (E) is a curing agent for epoxy resins.
C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
C08L 101/10 - Compositions of unspecified macromolecular compounds characterised by the presence of specified groups containing hydrolysable silane groups
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C08K 3/18 - Oxygen-containing compounds, e.g. metal carbonyls
The present invention relates to a primer composition that achieves excellent adhesion to poorly adhesive materials. Specifically, the present invention relates to a primer composition that includes (A) benzophenone, (B) a compound that has at least 2 benzene rings and a molecular weight of at least 190, and (C) a solvent.
C09D 5/00 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects producedFilling pastes
C09J 5/02 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
C09D 201/00 - Coating compositions based on unspecified macromolecular compounds
C09D 201/02 - Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups
C09D 201/06 - Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups containing oxygen atoms
C09D 201/10 - Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups containing hydrolysable silane groups
C09J 201/02 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups
C09J 201/06 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups containing oxygen atoms
C09J 201/10 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups containing hydrolysable silane groups
The present invention provides a curable composition which can ensure a delayed curing time for operations such as bonding or tightening after heating or irradiating the curable composition with energy rays regardless of whether an adherend is transparent, and then can develop the delayed curability. The present invention is a curable composition containing components (A) to (C). Component (A): Compound having a (meth)acryloyl group in a molecule Component (B): Saccharin Component (C): At least one among a photocationic catalyst as a component (C-1) and a thermal cationic catalyst as a component (C-2).
