The invention relates to an attachment arrangement for the strings of a stringed instrument, especially a guitar. To the body of the stringed instrument is attached a bridge body, first restraining means for restraining the strings from the first end area, second restraining means, which are arranged in conjunction with the bridge body for restraining the strings from the second end area. Lever means are arranged in conjunction with the bridge body in order to move the second restraining means for temporarily loosening and/or tightening the strings by means of a lever part included in the lever means. The lever means are provided with moving means comprising at least one moving mechanism, which is a mechanism separate from the lever means. One or more second restraining means are arranged to move with respect to the bridge body. The moving means are arranged to transmit the movement of the lever means into the desired movement of one or more restraining means.
A laminate contains conductive circuit patterns, a substrate material, and an adhesive pattern or other bond. Each conductive circuit pattern and the substrate material are interconnected by the adhesive pattern or other bond, having its size and shape substantially matching the main outlines of each conductive circuit pattern. Each conductive circuit pattern has thin lines and thin interline spaces, patterned on top of the adhesive pattern or other bond by a removal of conductive material, such that the circuit pattern's thin interline spaces may have residues of the adhesive patterns or other bond. Outside the conductive circuit patterns' main outlines, the substrate material is substantially void of an adhesive or other bond, with the exception of edge areas of the main outlines.
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
G08B 13/24 - Electrical actuation by interference with electromagnetic field distribution
B32B 38/10 - Removing layers, or parts of layers, mechanically or chemically
H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
3.
ATTACHMENT ARRANGEMENT FOR STRINGS OF STRINGED INSTRUMENT, ESPECIALLY GUITAR
The invention relates to an attachment arrangement (1) for the strings (S) of a stringed instrument, especially a guitar. To the body (100) of the stringed instrument is attached a bridge body (2), first restraining means for restraining the strings (S) from the first end area, second restraining means (3), which are arranged in conjunction with the bridge body (2) for restraining the strings from the second end area. Lever means (5) are arranged in conjunction with the bridge body (2) in order to move the second restraining means (3) for temporarily loosening and/or tightening the strings by means of a lever part (5') included in the lever means (5). The lever means (5) are provided with moving means (6, 7) comprising at least one moving mechanism (7), which is a mechanism separate from the lever means (5). One or more second restraining means (3) are arranged to move with respect to the bridge body (2). The moving means (6, 7) are arranged to transmit the movement of the lever means (5) into the desired movement of one or more restraining means (3).
G10H 3/18 - Instruments in which the tones are generated by electromechanical means using mechanical resonant generators, e.g. strings or percussion instruments, the tones of which are picked up by electromechanical transducers, the electrical signals being further manipulated or amplified and subsequently converted to sound by a loudspeaker or equivalent device using mechanically actuated vibrators with pick-up means using strings, e.g. electric guitars
A laser process alignment measuring method applicable to a reel-to-reel manufacturing process including a laser process stage, wherein before at least one laser process stage, marks, patterns or surfaces (4,9) are made with printing ink on the base or carrier material of the web (2), and on which the laser beam used can make a mark (7, 10), for example, by removing or changing the printing ink, whereby at the laser process stage, another mark is plotted with the laser beam on the mark et al. printed with printing ink, and the position of the mark et al. printed with printing ink (4, 9) and the mark plotted with the laser (7, 10) are read optically to measure the alignment of the printing ink stage and the laser process stage.
B41J 2/47 - Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light
B41J 2/045 - Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
B23K 26/03 - Observing, e.g. monitoring, the workpiece
B23K 26/08 - Devices involving relative movement between laser beam and workpiece
B41J 11/46 - Controlling by marks or formations on the paper being fed
G01D 15/14 - Optical recording elementsRecording elements using X- or nuclear radiation
5.
Manufacturing method of electrical bridges suitable for reel to reel mass manufacturing
A manufacturing method of electrical bridges, wherein a conductive pattern (2) from electroconductive material, such as metal foil, is applied over a substrate (1) made of electrically insulating material and the electroconductive material has at least one strip tongue (3) unattached to the substrate, one side of the tongue is attached to the conductive pattern (2), and the said strip tongue (3) is folded over an area insulated electrically from the conductive pattern (2), and the strip tongue (3) is connected electroconductively to a predetermined other part (5) of the conductive pattern (2).
A reel to reel manufacturing method of electrical bridges, wherein over a substrate (1) made of electrically insulating material is patterned a conductive pattern (2) from electroconductive material, such as metal foil, and from the said electroconductive material is made at least one strip tongue (3) unattached to the substrate, one side of which is attached to the conductive pattern (2), and the said strip tongue (3) is folded over an area insulated electrically from the conductive pattern (2), and the strip tongue (3) is connected electroconductively to a predetermined other part (5) of the conductive pattern (2).
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
B32B 38/10 - Removing layers, or parts of layers, mechanically or chemically
G08B 13/24 - Electrical actuation by interference with electromagnetic field distribution
H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
1. A method for manufacturing a circuit board featuring conductive patterns, said method comprising the following steps of: i) affixing a conductive layer, such as a metal foil (3), to a substrate material (1) selectively, such that a part of the conductive layer, such as the metal foil (3), comprising desired areas (3a) for the final product and narrow areas (3c) between the final product's conducting areas, is affixed to the substrate material (1) by means of a bond (2), and removal-intended more extensive areas (3b) of the conductive layer, for example the metal foil (3), are left substantially unattached to the substrate material in such a way that the removable area (3b) is in attachment with the substrate material (1) by not more than its edge portion to be patterned in a subsequent step ii) and possibly by sites which preclude a release of the removable areas prior to a step iii); ii) patterning, by a removal of material, the conductive layer, such as the metal foil (3), from narrow gaps between the desired conducting areas (3a), and from an outer periphery of the area (3b) removable in a solid state, for establishing conductor patterns; iii) removing the removable areas (3b), not affixed to the substrate material (1), from the conductive layer, such as the metal foil (3), in a solid state after the conductive layer's edge area, which was removed from the removable area's outer periphery during the course of step ii), no longer holds the removable areas (3b) attached by their edges to the substrate material.
B32B 38/10 - Removing layers, or parts of layers, mechanically or chemically
H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
patents
