Abstract

Methods of and apparatuses for monitoring a plating bath composition by using voltammetric consolidated designer waveforms. The designer AC waveforms are optimized and consolidated to maximize analytical output of the solitary measurement thus drastically reducing the total time required for a full analysis of a plating bath as compared to traditional analytical techniques. More specifically, the present invention relates to a novel concept of generating of a consolidated designer waveform from the preselected segments of designer AC waveforms. More particularly, the method of present invention relates to determination of segments of designer AC waveforms based on a novel chemometric parameter of Analysis of Variance relative F-ratio.

IPC Classes  ?

• G01N 27/48 - Systems using polarography, i.e. measuring changes in current under a slowly-varying voltage
• C25D 21/12 - Process control or regulation
• G01N 27/02 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
• G01N 27/416 - Systems

Goods & Services

Chemicals for use in the process of producing printed circuit boards, namely, liquid photo-definable halogen-free flexible black matte solder mask

Abstract

344); - from 0.015 wt% to 0.2 wt% of a compound chosen from among diethylenetriamine penta(methylene phosphonic acid) (DTPMP), aminotris(methylenephosphonic acid) (ATMP) and mixtures thereof; - water, wherein the weight percentages are expressed relative to the weight of the chemical etching solution, the solution having a pH of 6.5 to 8.6. The invention also relates to a method for chemically etching a layer of a titanium-based material on a microelectronic device by means of the etching solution and to a method for preparing the etching solution.

IPC Classes  ?

• H01L 21/3213 - Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
• C23F 1/26 - Acidic compositions for etching refractory metals
• H01L 21/311 - Etching the insulating layers

Abstract

Methods of and apparatuses for monitoring a plating bath composition by using complex designer voltammetry. The designer waveforms are optimized in order to maximize analytical output of the solitary measurement thus drastically reducing the total time required for a full analysis of a plating bath compared to traditional analytical techniques.

IPC Classes  ?

• C25D 21/12 - Process control or regulation
• C23C 18/16 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coatingContact plating by reduction or substitution, i.e. electroless plating

Abstract

characterised in that it is prepared by mixing a composition B comprising bromide ions and a composition H comprising hydrogen peroxide such that in the composition C, at the moment of mixing, the molar concentration of bromide ions is comprised between 0.15 mol/L and 0.45 mol/L and the molar ratio of hydrogen peroxide with respect to bromide ions is comprised between 1.1 and 2. placing the hot chemical composition C and the substrate in contact for a sufficient duration to remove the nickel-platinum alloy residues from the substrate.

IPC Classes  ?

• C23F 1/28 - Acidic compositions for etching iron group metals

Abstract

The present invention concerns an aqueous chemical composition C for selective hot removal, from a substrate, of nickel-platinum alloy residues containing at least 8% by mass Pt in relation to the total weight of the nickel-platinum alloy, characterised in that it is prepared by mixing a composition B comprising bromide ions and a composition H comprising hydrogen peroxide so that in the composition C, at the time of mixing, the molar concentration of bromide ions is between 0.15 mol/L and 0.45 mol/L and the molar ratio of hydrogen peroxide to bromide ions is between 1.1 and 2. The invention also relates to a method for selectively removing nickel-platinum alloy residues containing at least 8% by mass Pt in relation to the total weight of the nickel-platinum alloy from a substrate, comprising the following steps: - hot preparation of a chemical composition C according to any one of claims 1 to 3, - placing the hot chemical composition and the substrate in contact for a sufficient duration to remove the nickel-platinum alloy residues from the substrate.

IPC Classes  ?

• C23F 1/28 - Acidic compositions for etching iron group metals
• H01L 21/3213 - Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
• H01L 21/28 - Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups
• H01L 21/285 - Deposition of conductive or insulating materials for electrodes from a gas or vapour, e.g. condensation
• H01L 29/66 - Types of semiconductor device
• H01L 29/78 - Field-effect transistors with field effect produced by an insulated gate

Abstract

A cleaning chemical composition suitable, for removing a passivation layer from a substrate, wherein the passivation layer comprises residues resulting from etching of said Substrate.

IPC Classes  ?

• C11D 11/00 - Special methods for preparing compositions containing mixtures of detergents
• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof

Goods & Services

Chemical solutions, powders, salts and alloys for use in plating, immersing, and coating of precious metals and non-precious metals; etchants for use in electronics manufacturing

Abstract

The invention relates to a solution for etching titanium based materials, comprising from about 27 w % to about 39 w % hydrogen peroxide, from about 0.2 w % to about 0.5 w % potassium hydroxide, and at about 0.002 w % to about 0.02 w % 1,2-Diaminocyclohexane-N,N,N,N Tetra acetic Acid (CDTA), the rest being water, said solution comprising no corrosion inhibitor, and said solution having a pH comprised between about 7 and about 8. The invention further relates to a chemical composition for preparing such a solution by mixing said composition with concentrated hydrogen peroxide, said chemical composition comprising potassium hydroxide from about 5 w % to about 30 w %, C.D.T.A. at a concentration ranging from about 1% to about 5% of the potassium hydroxide concentration, the rest being water. The invention also relates to a method of etching a Titanium, Titanium nitride or Titanium Tungsten barrier layer from a microelectronic device, said method comprising contacting the Titanium, Titanium nitride or Titanium tungsten barrier layer with the solution for a time sufficient to remove the Titanium, Titanium nitride or Titanium tungsten barrier layer.

IPC Classes  ?

• C09K 13/02 - Etching, surface-brightening or pickling compositions containing an alkali metal hydroxide
• C23F 1/38 - Alkaline compositions for etching refractory metals
• C23G 1/20 - Other heavy metals
• H01L 21/3213 - Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer

Abstract

The present invention concerns a chemical cleaning composition suitable for removing, from a substrate (1A, 1B, 4), a passivation layer (2) comprising etching residues resulting from the etching of said substrate (1A, 1B, 4), comprising: - a weak acid comprising acetic acid, the amount of weak acid being between 20% by weight and 95% by weight, and preferably between 0% by weight and 80% by weight, relative to the weight of the chemical composition, - a strong non-oxidising acid comprising sulfonic methane acid, the amount of strong non-oxidising acid being between 5% by weight and 50% by weight, and preferably between 15% by weight and 50% by weight, relative to the weight of the chemical composition, - hydrofluoric acid, in an amount of between 0.2% by weight and 2% by weight relative to the weight of the chemical composition, - water, in amount of between 2% by weight and 20% by weight relative to the weight of the chemical composition. The invention also concerns a cleaning method for removing, from a substrate (1A, 1B, 4), a passivation layer (2) comprising etching residues resulting from the etching of said substrate (1A, 1B, 4), comprising the following steps: - providing a chemical cleaning composition according to the abovementioned composition, - bringing the chemical cleaning composition into contact with the passivation layer (2) for a period sufficient to remove said passivation layer (2) from the substrate (1A, 1B, 4).

IPC Classes  ?

• H01L 21/311 - Etching the insulating layers
• H01L 21/3213 - Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof

Abstract

An apparatus for the electrodeposition of metals or metal alloys on semiconductor wafers is described. The apparatus includes plating cell, an anode disposed within the plating cell, a cathode comprising a semiconductor wafer positioned with the surface to be electroplated facing and in spaced-apart relation to the anode, a power supply providing electrical contact between the anode and the cathode, a hollow bar positioned mean the cathode having a series of spaced-apart holes facing the cathode and arranged in a line extending from one end or near one end of the cross bar to the other end or near end of the cross bar and means for rotating either the cathode or the hollow bar about a central axis to spray the surface of the semiconducting wafer to be plated continuously and repeatedly as the cathode or the solution spraying means rotates.

IPC Classes  ?

• B05B 5/04 - Discharge apparatus, e.g. electrostatic spray guns characterised by having rotary outlet or deflecting elements
• C25D 5/02 - Electroplating of selected surface areas
• C25D 5/08 - Electroplating with moving electrolyte, e.g. jet electroplating
• C25D 5/16 - Electroplating with layers of varying thickness
• C25D 7/12 - Semiconductors
• H01L 21/288 - Deposition of conductive or insulating materials for electrodes from a liquid, e.g. electrolytic deposition
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• A47L 15/22 - Rotary spraying devices

Abstract

The invention relates to a solution for etching titanium based materials, comprising from about 27w% to about 39w% hydrogen peroxide, from about 0.2w% to about 0.5w% potassium hydroxide, and at about 0.002 w% to about 0.02 w% 1,2-Diaminocyclohexane-N,N,N,N Tetra acetic Acid (CDTA), the rest being water, said solution comprising no corrosion inhibitor, and said solution having a pH comprised between about 7 and about 8. The invention further relates to a chemical composition for preparing such a solution by mixing said composition with concentrated hydrogen peroxide, said chemical composition comprising potassium hydroxide from about 5w% to about 30w%, C.D.T.A. at a concentration ranging from about 1% to about 5% of the potassium hydroxide concentration, the rest being water. The invention also relates to a method of etching a Titanium, Titanium nitride or Titanium Tungsten barrier layer from a microelectronic device, said method comprising contacting the Titanium, Titanium nitride or Titanium tungsten barrier layer with the solution for a time sufficient to remove the Titanium, Titanium nitride or Titanium tungsten barrier layer.

IPC Classes  ?

• C23F 1/38 - Alkaline compositions for etching refractory metals
• C09K 13/02 - Etching, surface-brightening or pickling compositions containing an alkali metal hydroxide
• C11D 11/00 - Special methods for preparing compositions containing mixtures of detergents
• C23G 1/20 - Other heavy metals
• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
• H01L 21/3213 - Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Goods & Services

Perfumery products and perfumes; beauty care and body cleaning preparations; mineral water sprays for cosmetic use; cosmetics; cosmetics other than for medical use; cosmetics in the form of oils; massage creams, other than for medical use; massage oils; scented lotions [toiletries]; scented body lotions [toiletries]; cleansing foams; cosmetic foams; shaving foam; shaving foams; pre-shave foams; shower gels; cleansing gels; soapy gels; shaving gels; bath gels; moisturizing gels [cosmetics]; cleansing gels and soaps; after-sun gels [cosmetics]; sun-tanning gels [cosmetics]; bath foaming gels; cosmetic eye contour gels; soaps; liquid soaps; perfumed soaps; shaving soaps; shower soaps; washes or deodorants for intimate hygiene; douching preparations for intimate hygiene, deodorant or for sanitary purposes [toiletries]; perfumed oils; cosmetic oils; moisturizers [cosmetics]; sunscreens [cosmetics]; self-tanning products [cosmetics]; make-up; make-up products; lipstick; perfumes; perfumes in solid form; perfumes for personal use; shaving creams; non-medicated hair shampoos; body milks; depilatory cream; creams for cellulite reduction; cleansing creams; perfumed creams; exfoliating creams; cosmetic creams. Contraceptive foams; spermicidal gels; gels for sexual stimulation; vaginal lubricants; sexual lubricants; hygienic lubricants; hygiene preparations (toiletries) and hygienic articles, namely napkins, panty liners, tissues, tampons, diapers. Vibration massage apparatus; massage apparatus for personal use; condoms; spermicidal condoms; condoms for prophylactic use; condoms for hygiene use; condoms for medical use; vibrators being adult sex toys; geisha balls, namely adult sex toys; electric massage apparatus.

Goods & Services

Perfumery and fragrances; Body cleaning and beauty care preparations; Mineral water sprays for cosmetic purposes; Cosmetics; Non-medicated cosmetics; Cosmetics in the form of oils; Massage creams, not medicated; Massage oils; Perfumed lotions [toilet preparations]; Perfumed body lotions [toilet preparations]; Cleansing foam; Mousses [cosmetics]; Shaving soap; Shower gels; Cleansing gels; Soaps in gel form; Shaving gel; Bath gel; Moisturising gels [cosmetic]; Soaps and gels; After-sun gels [cosmetics]; Foaming bath gels; Cosmetic eye gels; Cakes of toilet soap; Soaps in liquid form; Perfumed soaps; Shower soap; Douching preparations for personal sanitary or deodorant purposes [toiletries]; Oils for perfumes and scents; Oils for cosmetic purposes; Cosmetic moisturisers; Sun protecting creams [cosmetics]; Self-tanning preparations [cosmetics]; Make-up; Lipsticks; Perfumes; Solid perfumes; Fragrances for personal use; Shaving cream; Non-medicated hair shampoos; Body milks; Depilatory creams; Creams for cellulite reduction; Cleansing creams; Perfumed creams; Exfoliant creams; Cosmetic creams. Contraceptive foams; Spermicidal gels; Sexual stimulant gels; Vaginal lubricants; Personal sexual lubricants; Hygienic lubricants; Hygienic preparations and articles. Vibromassage apparatus; Massaging apparatus for personal use; Condoms; Spermicidal condoms; Condoms for prophylactic purposes; Condoms for hygienic purposes; Condoms for medical purposes; Vibrators, being adult sexual aids; Benwa balls, being adult sexual aids; Electrically operated massagers.

Goods & Services

cosmetics; cosmetics other than for medical use; cosmetics in the form of oils; massage creams, other than for medical use; massage oils; [ cosmetic foams; shaving foam; shaving foams; pre-shave foams; ] shower gels; [ shaving gels; ] bath gels; bath foaming gels; [ cosmetic eye contour gels; soaps; liquid soaps; perfumed soaps; shaving soaps; shower soaps; ] washes or deodorants for intimate hygiene; perfumed oils; cosmetic oils; make-up; lipstick; perfumes; [ perfumes in solid form; ] perfumes for personal use; [ shaving creams; non-medicated hair shampoos; body milks; depilatory cream; creams for cellulite reduction; cleansing creams; perfumed creams; exfoliating creams; ] cosmetic creams [ Contraceptive foams; spermicidal gels; ] gels for sexual stimulation; vaginal lubricants; sexual lubricants [ Vibration massage apparatus; massage apparatus for personal use; condoms; spermicidal condoms; condoms for prophylactic use; condoms for hygiene use; condoms for medical use; vibrators being adult sex toys; geisha balls, namely, adult sex toys; electric massage apparatus ]

Goods & Services

Perfumery and fragrances; Body cleaning and beauty care preparations; Mineral water sprays for cosmetic purposes; Cosmetics; Non-medicated cosmetics; Cosmetics in the form of oils; Massage creams, not medicated; Massage oils; Perfumed lotions [toilet preparations]; Perfumed body lotions [toilet preparations]; Cleansing foam; Mousses [cosmetics]; Shaving soap; Shaving soap; Shaving soap; Shower gels; Cleansing gels; Soaps in gel form; Shaving gel; Bath gel; Moisturising gels [cosmetic]; Soaps and gels; After-sun gels [cosmetics]; After-sun gels [cosmetics]; Foaming bath gels; Cosmetic eye gels; Soaps; Soaps in liquid form; Perfumed soaps; Shaving soap; Shower soap; Douching preparations for personal sanitary or deodorant purposes [toiletries]; Douching preparations for personal sanitary or deodorant purposes [toiletries]; Oils for perfumes and scents; Oils for cosmetic purposes; Cosmetic moisturisers; Sun protecting creams [cosmetics]; Self-tanning preparations [cosmetics]; Make-up; Make-up; Lipstick; Perfumery; Solid perfumes; Fragrances for personal use; Shaving cream; Non-medicated hair shampoos; Body milks; Depilatory creams; Creams for cellulite reduction; Cleansing creams; Perfumed creams; Exfoliant creams; Creams (Cosmetic -). Contraceptive foams; Spermicidal gels; Sexual stimulant gels; Vaginal lubricants; Personal sexual lubricants; Hygienic lubricants; Hygiene preparations and articles. Vibromassage apparatus; Massaging apparatus for personal use; Condoms; Spermicidal condoms; Condoms for prophylactic purposes; Condoms for hygienic purposes; Condoms for medical purposes; Vibrators, being adult sexual aids; Benwa balls, being adult sexual aids; Electrically operated massagers.

Abstract

The invention, concerns conductive coatings for use in the manufacture of for example, electrical connectors, LED arrays, and lead frames used in the computer industry. The coatings are composed of silver, antimony, and a protective layer composed of a fluoropolymer.

IPC Classes  ?

• C25D 3/46 - ElectroplatingBaths therefor from solutions of silver
• C25D 3/64 - ElectroplatingBaths therefor from solutions of alloys containing more than 50% by weight of silver
• C25D 3/54 - ElectroplatingBaths therefor from solutions of metals not provided for in groups

Abstract

The invention provides an electroplating composition, method, and improved apparatus, which enables electroplating tin-silver alloys at high speed and without burning. The composition is an aqueous acidic solution including salts of stannous tin and a monovalent silver, and a complexing agent selected from the group consisting of thiocarbazides and thiohydrazides, and optionally an aldehyde and/or dialdehyde organic brightener compound. A sulfonic acid and a surfactant may also be included. The improved apparatus provides a protective structure substantially surrounding the anode(s) to decrease turbulence and the problematic silver displacement reaction.

IPC Classes  ?

• C25D 3/56 - ElectroplatingBaths therefor from solutions of alloys
• C25D 3/60 - ElectroplatingBaths therefor from solutions of alloys containing more than 50% by weight of tin

Goods & Services

chemical preparations, namely, solutions, powders, salts and alloys for use in plating, immersing and coating of precious metals and non-precious metals; chemical preparations, namely, powders and chemicals for use in the manufacture of photovoltaic and solar cells, modules and devices; chemicals for use in the manufacture of photovoltaic and solar cells, modules and devices Machines for metal finishing, namely, for electroplating parts, electroless plating parts, anodizing parts, electrocoating parts, phosphating parts, cleaning, etching and electropolishing parts, chromating parts and electroforming parts; machines for the processing and electrodeposition of solar cells and semiconductors

Abstract

The present invention relates to the formulation of a chemical, comprised of an ether solvent as the principal solvent, an ether or non-ether cosolvent, an acid, optionally a surfactant and optionally a corrosion inhibitor, dedicated to the complete and selective stripping by pure dissolution of photoresists (novolac and semi-novolac) of all thicknesses used in microelectronic component integration processes. Said solution is optimized to dissolve the polymer matrix while ensuring and protecting the physicochemical integrity of exposed materials such as metal interconnections (copper, aluminum), dielectrics (SiO2, MSQ, etc.) and adhesion and diffusion barriers (TiN, Ti, Ta, TaN, etc.). Furthermore, the singular cleaning properties and performance characteristics of these solutions make it possible to envisage the use thereof in a variety of industrial applications such as single wafer, batch, immersion and/or spray by simple adjustment of process time and temperature.

IPC Classes  ?

• G03F 7/42 - Stripping or agents therefor
• C23G 5/024 - Cleaning or de-greasing metallic material by other methodsApparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing hydrocarbons

Abstract

The invention is an apparatus and method for forming highly uniform layers of metal on a substrate by electro-deposition. The substrate is electroplated in a bath composed of a quiescent (i.e., no external agitation) electrolyte solution using an effective constant current density carefully selected to match the chemical composition of the electrolyte.

IPC Classes  ?

• C25D 17/10 - Electrodes

Goods & Services

chemical solutions, powders, salts and alloys for use in plating, immersing, and coating of precious metals and non-precious metals chemical solutions, powders, and salts for use in preventing tarnish of precious metals and non-precious metals chemical solutions, powders, and salts for use in cleaning and stripping of precious metals and non-precious metals machines for metal finishing, namely, for electroplating parts, electroless plating parts, anodizing parts, electrocoating parts, phosphating parts, cleaning, etching and electropolishing parts, chromating parts and electroforming parts; machines for the processing and electrodeposition of solar cells and semiconductors computer programs for use in operating and monitoring machines for electroplating parts, electroless plating parts, anodizing parts, electrocoating parts, phosphating parts, cleaning, etching and electropolishing parts, chromating parts and electroforming parts and machines for the processing and electrodeposition of solar cells and semiconductors

Goods & Services

Machines for metal finishing, namely, for electroplating parts, electroless plating parts, anodizing parts, electrocoating parts, phosphating parts, cleaning, etching and electropolishing parts, chromating parts and electroforming parts

Goods & Services

chemical solutions for use in the manufacture of semiconductors

Goods & Services

Chemical solutions for use in the manufacture of electronic components, namely, electronic connectors, lead frames, light emitting diodes, integrated circuits and semiconductor components

Goods & Services

chemical solutions used in the manufacture of semiconductors, namely, solutions for removing photo resist from semiconductors

Abstract

The invention relates to a metallized solar cell and the method of making thereof that includes depositing a metal or metals such as silver, nickel, copper, tin, indium, gallium, or selenium or their alloys on solar cells in a manner to form more substantial and robust electrical contacts that can carry current more efficiently and effectively or to provide the active layers required to convert sunlight into electricity. These deposits also protect the underlying metallic materials from corrosion, oxidation or other environmental changes that would deleteriously affect the electrical performance of the cell. The invention also relates to the use of specialized electroplating chemistries that minimize residual stress and/or are free of organic sulfonic acids to minimize chemical attack on solar cell substrates or prior metallizations that include organic and/or inorganic binders or related materials for depositing the initial metallic portions of the cell.

IPC Classes  ?

• H01L 31/042 - PV modules or arrays of single PV cells

Goods & Services

Chemicals for use in the manufacture of photovoltaic and solar cells, modules, and devices

Goods & Services

Semiconductor wafer plating processing machines

Goods & Services

CHEMICAL GOLD ELECTROPLATING SOLUTIONS WHICH CONSIST IN PART OF PURE GOLD AND ALLOYS OF GOLD

Goods & Services

CHEMICAL COMPOSITION FOR A TARNISH PREVENTATIVE SILVER, SILVER ELECTROPLATE, COPPER, COPPER ALLOYS, BRASS AND GOLD PLATED SILVER AND GOLD PLATED COPPER

Goods & Services

RHODIUM PLATING SOLUTIONS

Goods & Services

SILVER PLATING SOLUTIONS

Goods & Services

COMPOSITIONS AND MIXTURES OF PALLADIUM AND SALTS THEREOF (( USEFUL IN PROCESSES FOR THE DEPOSITION OF BRIGHT COATINGS OF PALLADIUM FOR USE IN THE ELECTRONICS AND DECORATIVE COATING INDUSTRIES AND WHENEVER A SURFACE COATING OF PALLADIUM IS DESIRED ))

Goods & Services

CYANIDE-FREE METALLIC SALTS FOR USE AS AN ELECTROPLATING COMPOSITION

Goods & Services

GOLD PLATING SOLUTION

Goods & Services

PLATING SOLUTIONS FOR RHODIUM

Goods & Services

GOLD PLATING SOLUTIONS

Goods & Services

Gold Plating Solution and Salts to Be Used in Gold Plating Solutions

Goods & Services

Gold Plating Solution and Salts to Be Used in Gold Plating Solutions

Goods & Services

Gold Plating Solution and Salts to Be Used in Gold Plating Solutions

Goods & Services

GOLD PLATING SOLUTION AND SALTS TO BE USED IN GOLD PLATING SOLUTIONS