There is provided a colloidal silica with reduced fine particles and a production method therefor. In the colloidal silica, the number distribution ratio of fine particles having a particle diameter of 50% or less of the particle diameter median value based on the equivalent circle diameter (Heywood diameter) by image analysis using an electron microscope is 1% or less. Also, the method for producing such a colloidal silica is a method in which an easily hydrolyzable organosilicate is fed to and allowed to react with a reaction solution containing a hydrolysis catalyst composed of one or a mixture of two or more selected from organic amines, wherein the feeding is performed with the feeding port of the easily hydrolyzable organosilicate immersed under the surface of the reaction solution.
The present invention provides: colloidal silica which has both a smooth surface and a reduced content of alkali metal impurities, and preferably has little surface change with time; and a method for producing the colloidal silica. The present invention specifically provides colloidal silica which is characterized by satisfying the following requirements (1) and (2) at the same time. (1) The degree of unevenness represented by formula (i) is 1.0740 or less. Formula (i): (Degree of unevenness) = (Equivalent circle diameter converted from length of periphery calculated from projection image that is obtained by image analysis with electronic microscope (equivalent circle diameter in terms of length of periphery))/(Equivalent circle diameter converted from projection area that is obtained by image analysis with electronic microscope (equivalent circle diameter in terms of area)) (2) The content of the metal impurities is 1 ppm or less.
The present invention provides: a colloidal silica which is in a single-digit nanometer size or has a small particle diameter close to the single-digit nanometer size, and which is substantially free from aggregation; and a method for producing the colloidal silica. This colloidal silica is characterized in that: the surface is modified; the BET diameter is 12 nm or less; and the colloidal silica is not substantially aggregated. This method for producing the colloidal silica is characterized by including: a starting material preparation step for preparing a starting material colloidal silica having a BET diameter of 12 nm or less by supplying an easily decomposable organosilicate to a reaction liquid that contains a hydrolysis catalyst composed of an organic amine and reacting the easily decomposable organosilicate with the reaction liquid; a concentration adjustment step for setting the solid content concentration of the starting material colloidal silica to 13 mass% or less and setting the concentration of an alcohol generated from the starting material preparation step to 1-25 mass%; a modification step for modifying the concentration-adjusted starting material colloidal silica; and a concentration step for concentrating the modified colloidal silica so that the residual organic solvent in the modified colloidal silica becomes 1 mass% or less.
The present invention provides colloidal silica in which fine particles are reduced and a production method therefor. Provided is colloidal silica wherein the number distribution ratio of fine particles having a particle diameter such that the median value of particle diameter is not more than 50% on the basis of an equivalent circle diameter (Heywood diameter) found by image analysis using an electron microscope is not more than 1%. Also provided is a method for producing said colloidal silica in which a readily hydrolyzable organosilicate is supplied to a reaction liquid containing a hydrolysis catalyst comprising an organic amine or a mixture of two or more organic amines and then a reaction is performed, wherein the supply is carried out in a state where a supply port for the readily hydrolyzable organosilicate is immersed below the liquid level of the reaction liquid.
Techniques for performing bath metrology on electroplating mixtures are disclosed. In particular, the disclosed techniques can be used in conjection with traditional metrology methods such as cyclic voltammatric stripping (CVS), and are capable of detecting changes in bath components at a more sensitive level than CVS in some circumstances. In some instances, deviations in observed current values from potentiostatic methods vis-à-vis a calibration standard can provide indications of changes in the mixture, and provide an indicator when a depleted component has been sufficiently added to restore the mixture to a previous state.
Techniques for performing bath metrology on electroplating mixtures are disclosed. In particular, the disclosed techniques can be used in conjection with traditional metrology methods such as cyclic voltammatric stripping (CVS), and are capable of detecting changes in bath components at a more sensitive level than CVS in some circumstances. In some instances, deviations in observed current values from potentiostatic methods vis-à-vis a calibration standard can provide indications of changes in the mixture, and provide an indicator when a depleted component has been sufficiently added to restore the mixture to a previous state.
Embodiments of the invention are directed to methods of electroplating copper onto at least one surface of a substrate in which more uniform electrical double layers are formed adjacent to the at least one surface being electroplated (i.e., the cathode) and an anode of an electrochemical cell, respectively. In one embodiment, the electroplated copper may be substantially-free of dendrites, exhibit a high-degree of (111) crystallographic texture, and/or be electroplated at a high-deposition rate (e.g., about 6 μm per minute or more) by electroplating the copper under conditions in which a ratio of a cathode current density at the at least one surface to an anode current density at an anode is at least about 20. In another embodiment, a porous anodic film may be formed on a consumable copper anode using a long conditioning process that promotes forming a more uniform electrical double layer adjacent to the anode.
C25D 5/00 - Electroplating characterised by the processPretreatment or after-treatment of workpieces
C25D 17/00 - Constructional parts, or assemblies thereof, of cells for electrolytic coating
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A method for refining alkaline treatment fluid for semiconductor substrates and a refining device are provided that are capable of refining all kinds of alkaline treatment fluid used for treating semiconductor substrates for a variety of purposes, to an ultrahigh purity, particularly Fe concentrations to ppq levels, and which use an absorbing and purifying means with excellent chemical resistance and mechanical strength. Specifically provided are a refining device and a method for refining alkaline treatment fluid for semiconductor substrates, which are means for refining alkaline treatment fluid for treating semiconductor substrates for a variety of purposes when producing semiconductor substrates or semiconductor devices, and whereby alkaline treatment fluid is brought in contact with a silicon carbide crystal surface of an absorbing and purifying means and made to flow into gaps in, for example, an absorption plate laminate (2) wherein both surfaces are CVD silicon carbide surfaces, and metal impurities are made to attach to the silicon carbide crystal surface and removed.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
B01J 20/10 - Solid sorbent compositions or filter aid compositionsSorbents for chromatographyProcesses for preparing, regenerating or reactivating thereof comprising inorganic material comprising silica or silicate
C02F 1/28 - Treatment of water, waste water, or sewage by sorption
C02F 1/42 - Treatment of water, waste water, or sewage by ion-exchange
A copper electroplating bath that includes an aqueous solution that comprises a copper salt and at least one acid and a container that comprises a copper salt in solid form, is disclosed. The container supplies copper ions to the aqueous solution to maintain the copper ion concentration of the aqueous solution at saturation levels while retaining the copper salt in solid form within the container.
Copper electroplating bath that includes an aqueous solution that comprises a copper salt and at least one acid and a container that comprises a copper salt in solid form, is disclosed. The container supplies copper ions to the aqueous solution to maintain the copper ion concentration of the aqueous solution at saturation levels while retaining the copper salt in solid form within the container.
In one embodiment, a substrate holder comprises a base supporting a substrate that includes a surface having a peripheral region. A cover may be assembled with the base and includes at least one opening exposing only a portion of the surface therethrough. A seal assembly substantially seals a region between the cover and base and further adjacent to the peripheral region of the substrate. An electrode includes at least one contact portion positioned within the region and extending over at least a portion of the peripheral region of the substrate. A compliant member comprises a polymeric material and may be positioned within the region between the at least one contact portion and either the peripheral region of the substrate or the cover. In other embodiments, an electroplating system is disclosed that may employ such a substrate holder.
In one embodiment of the invention, an electroplating aqueous solution is disclosed. The electroplating aqueous solution includes at least two acids, copper, at least one accelerator agent, and at least two suppressor agents. The at least one accelerator agent provides an acceleration strength of at least about 2.0 and the at least two suppressor agents, collectively, provide a suppression strength of at least about 5.0. Methods of making and using such an electroplating aqueous solution are also disclosed.
Provided is an electrode for electrolysis with excellent corrosion resistance and durability which can be used sustainably in the production of a high-purity quaternary ammonium hydroxide by the electrolysis of a quaternary ammonium inorganic acid salt in an electrolytic cell partitioned by a cation exchange membrane on a commercial scale with reduced electric power consumption at low cost. The electrode for electrolysis is useful for the production of a quaternary ammonium hydroxide by the electrolysis of a quaternary ammonium inorganic acid salt in an electrolytic cell partitioned by a cation exchange membrane and comprises an electrode base material of an electrically conductive metal, an electrode active layer containing an electrode active material covering the electrode base material, and an intermediate layer of a mixed oxide of an oxide of at least one kind of metal selected from In, Ir, Ta, Ti, Ru, and Nb and an oxide of Sn disposed between the electrode base material and the electrode active layer.
Disclosed is a uniformly-dispersed photocatalyst coating liquid having excellent dispersion stability of titanium oxide particles which have photocatalytic activity, which coating liquid places no burden on the environment while being excellent in handling properties. In addition, this uniformly-dispersed photocatalyst coating liquid enables to form a photocatalyst coating film, which is excellent in photocatalytic activities (antifouling property and/or antibacterial property), transparency and durability, on the surface of a base when applied thereto. Also disclosed are a method for producing such a uniformly-dispersed photocatalyst coating liquid, and a photocatalytically active composite material obtained by using such a uniformly-dispersed photocatalyst coating liquid. Specifically disclosed is a uniformly-dispersed photocatalyst coating liquid which is a composition containing, in an aqueous solvent, titanium oxide dispersed particles having an average primary particle diameter of 5-50 nm and an average dispersed particle diameter of 10-100 nm, a polymer dispersing agent, an alkoxysilane hydrolysis-polycondensation product, an organic amine, and additionally if necessary, silver particles. The uniformly-dispersed photocatalyst coating liquid has a pH within a range of 5-9.Also specifically disclosed are a method for producing such a uniformly-dispersed photocatalyst coating liquid, and a photocatalytically active composite material having antifouling property and antibacterial property, which is obtained by applying such a uniformly-dispersed photocatalyst coating liquid over the surface of a base.
C09D 185/00 - Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbonCoating compositions based on derivatives of such polymers
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