A multilayer ceramic electronic component includes a first external electrode provided at an end portion of a ceramic element, and a second external electrode provided at another end portion of the ceramic element. An internal electrode provided in the ceramic element includes a lead internal electrode connected to the first external electrode or the second external electrode, and a first floating electrode facing the lead internal electrode via a dielectric layer in the ceramic element and provided in a state of being separated from the first external electrode and the second external electrode. At least one of the lead-out internal electrode and the first floating electrode includes a first boundary layer in contact with the dielectric layer formed between the lead-out internal electrode and the first floating electrode. The boundary layer contains at least one of Au, Pt, Ag, Fe, Sn, Ge, Hf, In, Si, V, or Y.
A ceramic electronic component, in which a dimension in a first direction is equal to or greater than 1.3 times a dimension in a second direction orthogonal to the first direction, includes a multilayer chip including dielectric layers and internal electrode layers that are alternately stacked, the internal electrode layers containing Ni as a main component, the internal electrode layers being alternately exposed to first and second end surfaces facing each other in a third direction orthogonal to the first and second directions, and external electrodes provided on the first and second end surfaces, the external electrodes each including a plating layer on a base layer, wherein each internal electrode layer contains a metal component having a melting point of 700° C. or less, and an end in the first direction of at least one internal electrode layer of the internal electrode layers is in contact with a void.
H01G 13/00 - Apparatus specially adapted for manufacturing capacitorsProcesses specially adapted for manufacturing capacitors not provided for in groups
3.
MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME
A multilayer ceramic capacitor includes a plurality of terminal electrodes containing a metal having nickel as a main component element on the surface of at least one cover layer of a multilayer chip. Each of terminal electrode facing portions has nickel segregation regions each having a maximum dimension of 0.4 μm or more and having a nickel concentration higher than surroundings in an element distribution map generated by measuring a concentration distribution of nickel in any cross section parallel to the lamination direction, and a density of a nickel segregation region having a maximum dimension of 0.5 μm or more in the nickel segregation regions is 0.015 or more per 1 μm2. In a terminal electrode non-facing portion, a density of the nickel segregation region having the maximum dimension of 0.5 μm or more is 0.008 or less per 1 μm2 in the element distribution map.
A ceramic electronic component includes a multilayer chip including a multilayer body having cover layers provided on a top and a bottom of a multilayer structure in which dielectric layers and internal electrode layers are alternately stacked, and side margins covering two opposing side surfaces of the multilayer body, wherein the internal electrode layers contain a metal component having a melting point of 700° C. or less, the cover layers has a higher Mg concentration than the dielectric layers, at least an outermost internal electrode layer of the internal electrode layers has oxides containing Ni and Mg at both ends in a width direction, and at least some of the internal electrode layers are in contact with voids at both ends in the width direction in a section where internal electrode layers connected to a first external electrode without internal electrode layers connected to a second external electrode interposed therebetween.
A multilayer ceramic electronic component includes a ceramic element having dielectric layers and internal electrodes that are alternately laminated, main surfaces along a first axis direction, side surfaces along a second axis direction, and end surfaces along a third axis direction, step portions formed at both ends of at least one surface of the main surfaces and the side surfaces along the third axis direction, and external electrodes each including a base layer provided on each of both ends of the ceramic element in the third axis direction to cover the step portions, and a plating layer covering the base layer. A center-side end of the base layer located near a center of the ceramic element is located closer to the center of the ceramic element than a center-side end of each of the step portions located near the center of the ceramic element.
A pulse wave detecting device includes a sensor substrate, a plurality of light emitting elements, a plurality of light receiving elements, and a processing circuit. The plurality of light emitting elements are arranged in one row on a principal surface of the sensor substrate and configured to emit light. The plurality of light receiving elements are arranged in one row parallel with the row of the plurality of light emitting elements on the principal surface and configured to receive return light. The processing circuit is configured to change light outputs of the plurality of light emitting elements differently for each light emitting element based on first signals output by at least two light receiving elements of the plurality of light receiving elements, and detect a pulse wave based on second signals output by the plurality of light receiving elements after the changing of the light outputs.
A filter includes a piezoelectric substrate, a multimode filter provided on the piezoelectric substrate, the multimode filter including input IDTs and output IDTs, the input IDTs being connected to an input terminal, the output IDTs being connected to an output terminal and arranged alternately with the input IDTs, and an inductor having a first end, which is connected to two or more and half or less IDTs of the input IDTs and the output IDTs, and a second end connected to a ground, the two or more and half or less IDTs including at least one input IDT of the input IDTs and at least one output IDT of the output IDTs.
A multilayer ceramic electronic component that can achieve both high capacitance and high reliability, and a method of producing the same are provided. A multilayer ceramic electronic component includes a plurality of dielectric layers laminated along first axis, a plurality of internal electrode layers each positioned between dielectric layers adjoining along first axis, and oxide layers positioned between dielectric layers and internal electrode layers. Dielectric layers contain a compound having perovskite structure represented by general formula ABO3-α (0≤α>1). Internal electrode layers contain nickel and copper. Content of copper with respect to nickel in internal electrode layers is ≥0.5 at % and ≤8.5 at %. Content of nickel in oxide layers with respect to content of nickel in internal electrode layers is ≤90 at %. Content of oxygen in oxide layers with respect to content of oxygen in dielectric layers is ≤90 at %. Average thickness of oxide layers is ≥1.5 nm and ≤3.7 nm.
To provide multilayer ceramic electronic component having excellent life characteristics, multilayer ceramic electronic component includes: dielectric layers containing dielectric material having perovskite structure of general formula ABO3-α; internal electrode layers containing nickel as main component; and first intermediate regions containing copper. According to three-dimensional atom probe analysis performed along first axis, first intermediate regions are regions that are contained in a region where nickel concentration is <70 at % and B-site element concentration is ≥20 at %, and that are sandwiched between first boundary part at which B-site element concentration is 20 at % and second boundary part at which copper concentration peak appears. Copper concentration at copper concentration peak is ≥1.0 at % and ≤5.0 at %. Concentration C calculated by formula (1) is ≥10 at % and <35 at %. In formula (1), C(Cu) represents copper concentration at copper concentration peak, C(B) represents B-site element concentration, and C(A) represents A-site element concentration.
To provide multilayer ceramic electronic component having excellent life characteristics, multilayer ceramic electronic component includes: dielectric layers containing dielectric material having perovskite structure of general formula ABO3-α; internal electrode layers containing nickel as main component; and first intermediate regions containing copper. According to three-dimensional atom probe analysis performed along first axis, first intermediate regions are regions that are contained in a region where nickel concentration is <70 at % and B-site element concentration is ≥20 at %, and that are sandwiched between first boundary part at which B-site element concentration is 20 at % and second boundary part at which copper concentration peak appears. Copper concentration at copper concentration peak is ≥1.0 at % and ≤5.0 at %. Concentration C calculated by formula (1) is ≥10 at % and <35 at %. In formula (1), C(Cu) represents copper concentration at copper concentration peak, C(B) represents B-site element concentration, and C(A) represents A-site element concentration.
C
=
C
(
Cu
)
+
C
(
B
)
-
C
(
A
)
(
1
)
A multilayer ceramic capacitor includes a capacitance portion, in which dielectric layers and internal electrode layers are alternately stacked, and a cover layer arranged on an outer side of the capacitance portion in a stacking direction of the capacitance portion. The cover layer includes a perovskite compound represented by a general formula ABO3, and one or more elements selected from the group consisting of Cu, Au, Ag, Al, Ir, and W, where a number of atoms of the one or more elements is 0.002 or greater and 0.15 or less relative to 100 atoms of a B-site element of the general formula.
Provided is a magnetic base body having improved insulating properties of metal magnetic particles. A magnetic base body according to one embodiment includes: a plurality of metal magnetic particles containing Fe, Si, and an element a; first oxide films covering surfaces of the plurality of metal magnetic particles; and second oxide films covering surfaces of the first oxide films. The first oxide films are composed mainly of an oxide of Si. The second oxide films are composed mainly of an oxide of the element a. A first thickness indicating a thickness of the first oxide films is larger than a second thickness indicating a thickness of the second oxide films.
A multilayer ceramic electronic component includes a laminate including a plurality of ceramic layers laminated in a direction of a first axis, a plurality of internal electrodes one of which is located between each pair of adjacent ceramic layers of the plurality of ceramic layers, and a pair of side surfaces that are perpendicular to a second axis orthogonal to the first axis and at which ends of the plurality of internal electrodes in a direction of the second axis are located; and a pair of side margins covering the pair of side surfaces. At least at a part of boundaries between the laminate and the pair of side margins, an Si concentration discontinuously increases from the laminate to the pair of side margins.
A coil component includes: a base containing metal magnetic particles and a resin, a coil conductor provided inside the base, an external electrode provided on a surface of the base so as to be electrically connected to the coil conductor, and ceramic particles provided between the base and the external electrode.
To provide a multilayer ceramic electronic component having excellent internal electrode layer continuation percentage, a multilayer ceramic electronic component includes: a plurality of dielectric layers laminated along first axis; a plurality of internal electrode layers each positioned between dielectric layers adjacent to each other along first axis; and intermediate regions positioned between dielectric layers and internal electrode layers. Dielectric layers contain a compound represented by a general formula ABO3-α (0≤α≤1) and having perovskite structure, and manganese. Internal electrode layers contain a base metal element as a main component, and copper. Intermediate regions contain manganese and copper. Average value of manganese content ratio by number of atoms in intermediate regions is greater than average value of manganese content ratio by number of atoms in first reference regions, which are regions, within dielectric layers, that are apart from second boundaries by 2 nm or greater and 5 nm or less.
A coil component includes: a base including a metal magnetic particle and a binder; and a coil conductor arranged in the base. The base includes a first base and a second base. The first base includes a first surface facing the coil conductor. The first surface includes a first area that is a continuous flat surface and a second area other than the first area. The second base is connected to the first base at least in the second area of the first base. The first base includes a recess in the second area.
A laminated ceramic electronic component includes: a laminated portion, a pair of cover portions facing each with the laminated portion therebetween, and a pair of external electrodes. The laminated portion has a capacitance forming portion having a plurality of ceramic layers and internal electrodes, and a pair of internal electrode lead-out regions between the pair of cover portions. The capacitance forming portion is between internal electrode lead-out regions. A pair of margin regions are between the pair of cover portions. The cover portion has a central region adjacent to the capacitance forming portion having a first density, and a peripheral edge region surrounding the central region having a second density, wherein the internal electrode lead-out region has a third density and the margin region has a fourth density. At least one of the second density, the third density, and the fourth density is less than the first density.
A ceramic electronic device includes a multilayer chip including a multilayer portion in which each of dielectric layers and each of internal electrode layers are alternately stacked. Each of the internal electrode layers is alternately extracted to two end faces of the multilayer chip opposite to each other. The multilayer chip includes side margins outside of a capacity section in a third direction which is orthogonal to a first direction in which the internal electrode layers face each other and a second direction in which the two end faces are opposite to each other. The capacity section is a section in which the internal electrode layers face each other. A number of the internal electrode layers is 300 or more. A thickness of one of the internal electrode layers is 1.5 times a thickness of one of the dielectric layers or more.
A multilayer ceramic electronic component includes: an element body having multiple dielectric layers laminated along a first axis and multiple internal electrode layers respectively placed along the first axis between the adjacent pairs of the dielectric layers; and a pair of external electrodes provided on the surface of the element body and electrically connected to the internal electrode layers; wherein, the dielectric layers contain a compound expressed by the general formula ABO3-α (0≤α≤1) and having a perovskite structure; the internal electrode layers contain a first phase containing nickel and copper, as well as a co-existent material, and have, at the interfaces between the first phase and the co-existent material, first segregation parts where copper has segregated; the concentration of copper in the first segregation parts is higher than the concentration of copper in the first phase; and the external electrodes contain nickel.
A coil component includes a magnetic base body containing metal magnetic particles. The magnetic base body has a first surface and a second surface adjacent to each other such that a ridge is defined between the first surface and the second surface. The coil component also includes a conductor provided in or on the magnetic base body. The coil component also includes an insulating layer extending from the first surface to the second surface over the ridge. The coil component also includes an external electrode electrically connected to the conductor. The external electrode is provided on the first surface and spaced from the ridge.
A glucose concentration estimating device includes a first light source, a second light source, a third light source, a light receiving element and an estimating unit. The first light source irradiates a living body with first light which includes one wavelength in a wavelength range of 1375-1395 nm. The second light source irradiates the living body with second light which includes one wavelength in a wavelength range of 1575-1595 nm. The third light source irradiates the living body with third light which includes one wavelength in a wavelength range of 1835-1855 nm. The light receiving element receives reflected light returning from the living body upon irradiating the living body with the first to third light. The estimating unit estimates a glucose concentration based on an output of the light receiving element.
A61B 1/06 - Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopesIlluminating arrangements therefor with illuminating arrangements
A coil component includes a magnetic base body containing magnetic metal particles, and having a first surface and a second surface that are opposite each other, a third surface adjacent to both the first surface and the second surface, and a fourth surface adjacent to the first surface, the second surface, and the third surface, and having a first edge line portion defined by the third surface and the fourth surface; a conductor disposed inside or on a surface of the magnetic base body; an external electrode that overlaps the first surface of the magnetic base and is electrically connected to the conductor, the external electrode having a plating layer; and a first insulation part embedded in the magnetic base body and partially exposed at the first edge line portion, the first insulation part being arranged in a position closer to the first surface than the second surface.
A multi-layer ceramic electronic component includes a ceramic body including: a multi-layer unit including an electrode laminating unit including internal electrodes laminated in a first axis direction, a cover covering the electrode laminating unit in the first axis direction, and covered surfaces perpendicular to a second axis, and a side margin covering a covered surface and having a porosity of 3% or more in end regions. A porosity of a center region of the side margin is different from the porosity in both the end regions. The ceramic body has a dimension in the first axis direction, which is 1.5 times or more a dimension in the second axis direction, and a proportion of an area of the electrode laminating unit to an entire cross-section perpendicular to a third axis and located at the center portion of the ceramic body in a third axis direction is 80% or more.
This vibration generation device comprises: a rigid body; a first piezoelectric element that is provided along a first axis passing through the rigid body and that is fixed to the rigid body; a second piezoelectric element that is provided along a second axis which passes through the rigid body and is a direction different from the first axis, and that is fixed to the rigid body; a first pressing member that presses the first piezoelectric element toward the rigid body; and a second pressing member that presses the second piezoelectric element toward the rigid body.
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
B06B 1/04 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with electromagnetism
This measurement device comprises: a first substrate that is formed of a dielectric and that has a first main surface on which a signal line is provided and a second main surface which is on the opposite side from the first main surface and on which provided is a ground conductor having a surface area greater than the surface area of the signal line in plan view; and a second substrate that has greater bending rigidity than the first substrate and that has a third main surface connected to the second main surface via the ground conductor. Said measurement device measures information concerning the permittivity of a living body.
A61B 5/145 - Measuring characteristics of blood in vivo, e.g. gas concentration or pH-value
G01R 27/26 - Measuring inductance or capacitanceMeasuring quality factor, e.g. by using the resonance methodMeasuring loss factorMeasuring dielectric constants
25.
MULTILAYER CERAMIC ELECTRONIC DEVICE AND DIELECTRIC CERAMIC COMPOSITION
A multilayer ceramic electronic device includes a dielectric layer that contains a plurality of crystal grains, internal electrodes that sandwich the dielectric layer and contain nickel or copper as a main component, and an external electrode that is electrically connected to one of the internal electrodes. Each of the plurality of crystal grains has a core portion and a shell portion surrounding the core portion. A main component of the core portion and the shell portion is barium titanate. Calcium is solid-dissolved in the shell portion. A concentration of calcium of the shell portion is 10 times or more than a concentration of calcium of the core portion.
One object is to improve the insulation between conductor patterns without reducing the effective permeability. A magnetic base body according to one embodiment includes: a coil conductor provided in the magnetic base body so as to extend around a coil axis; a first external electrode electrically connected to one end of the coil conductor; and a second external electrode electrically connected to another end of the coil conductor. The coil conductor includes a first conductor pattern and a second conductor pattern opposed to the first conductor pattern in a first direction along the coil axis. The magnetic base body includes a first region and a second region, the first region containing a plurality of metal magnetic particles, the second region containing composite oxide particles containing Fe, Ni, and Zn, the second region being magnetic and insulating and being interposed between the first conductor pattern and the second conductor pattern.
H01F 1/08 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
H01F 27/06 - Mounting, supporting, or suspending transformers, reactors, or choke coils
A multilayer ceramic electronic component includes: a plurality of dielectric layers laminated along a first axis; a plurality of internal electrode layers each positioned between adjacent dielectric layers in the first axis of the plurality of dielectric layers; and intermediate regions positioned between the dielectric layers and the internal electrode layers, respectively. The internal electrode layers contain a nickel-copper alloy. The intermediate region contains copper. The concentration of the copper in each intermediate region varies in a thickness direction and has a peak at 2at % or greater and 10at % or less. The intermediate regions partially contain NiO layers at boundaries with the internal electrode layers. The total area of the NiO layers relative to the total area of the internal electrode layers is 1% or greater and 3.5% or less as measured on a cross-section of the multilayer ceramic electronic component along the first axis.
A multilayer ceramic capacitor includes an element body including dielectric layers containing a perovskite compound represented by the general formula ABO3, and internal electrode layers, which are laminated alternately, and also including intermediate regions between the dielectric layers and the internal electrode layers. The internal electrode layers and the intermediate regions each contain copper. Further, the following relation is satisfied: 1/(0.55t+1.54)≤a≤3, where t (μm) is the thickness of each internal electrode layer, and a (atomic %) is the concentration of copper in the internal electrode layers. The multilayer ceramic capacitor is intended to have a long service life and excellent dielectric properties.
C04B 35/468 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
A laminated ceramic capacitor includes a laminated body having a laminated structure of a plurality of dielectric layers containing a ceramic and a plurality of internal electrode layers that are alternately laminated. The laminated body has first and second side surfaces facing each other and first and second end surfaces facing each other. The internal electrode layers include first and second internal electrode layers. A length of the first internal electrode layer in a first direction in which the first and second side surfaces face each other is longer than a length of the second internal electrode layer in the first direction. The first internal electrode layer has at least one protrusion on a first surface facing the second internal electrode layer. The protrusion is in a region where the first and second internal electrode layers do not overlap in a lamination direction in the first internal electrode layer.
One aspect of the present invention is a multilayer ceramic capacitor, including: a cuboid element body having a stack formed with alternating ceramic layers and internal electrodes made primarily of metal, a protective portion covering a surface of the stack, and a plurality of via conductors arranged so as to pass through the ceramic layers in the stacking direction of the stack, electrically connected to the internal electrodes, and having one end reaching the surface of the protective portion while the other end is positioned in the protective portion, and a plurality of terminal electrodes arranged on the surface of the element body and electrically connected to the end of each via conductor reaching the surface of the protective portion, wherein the ends of the via conductors positioned in the protective portion form a flange that extends outwardly relative to the axis of the via conductor.
A multilayer ceramic electronic component includes: multiple dielectric layers laminated along a first axis; multiple internal electrode layers respectively placed along the first axis between the adjacent pairs of the dielectric layers; and intermediate regions placed between the dielectric layers and the internal electrode layers, respectively; wherein the dielectric layers contain a compound expressed by the general formula ABO3-α (0≤α≤1) and having a perovskite structure, as well as an additive element; the internal electrode layers contain a base metal element as the main component, as well as copper; the intermediate regions contain the additive element as well as copper; and the additive element encompasses one or more types selected from holmium, yttrium, samarium, dysprosium, europium, gadolinium, terbium, erbium, thulium, and ytterbium.
An inductor array includes: a base body containing a plurality of metal magnetic particles; first and second internal conductors provided inside the base body; a first external electrode connected to one end of the first internal conductor; a second external electrode connected to the other end of the first internal conductor; a third external electrode connected to one end of the second internal conductor; a fourth external electrode connected to the other end of the second internal conductor. The base body has a first surface, a second surface connected to this first surface via a first ridge portion, and a third surface connected to the first surface via a second ridge portion. The first to fourth external electrodes are provided on the first surface of the base body. The first to fourth external electrodes on the first surface are all spaced apart from both the first and second ridge portions.
H01F 27/32 - Insulating of coils, windings, or parts thereof
H01F 41/00 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
A coil component includes a magnetic base body, and a conductor provided in the magnetic base body or on a surface of the magnetic base body. The coil component also includes an external electrode provided on the surface of the magnetic base body. The external electrode includes a base electrode that has a joint portion joined to an end of the conductor. The joint portion extends in the same range as the end of the conductor. An area ratio of (111) crystal planes in the joint portion is smaller than an area ratio of other crystal planes in the joint portion.
A multilayer ceramic electronic component includes a laminate body including dielectric layers containing barium titanate and copper, and internal electrode layers and intermediate regions containing nickel and copper. The intermediate region are each arranged between the dielectric layers and the internal electrode layers, respectively. The metal concentration A (at %) of nickel in each intermediate region is 3 at %D11, D11
One aspect of the present invention is a multilayer ceramic capacitor, including: a cuboid element body having a stack formed with alternating ceramic layers and internal electrodes made primarily of metal, a protective portion covering a surface of the stack, and a plurality of via conductors arranged so as to pass through the ceramic layers in the stacking direction of the stack, electrically connected to the internal electrodes, and having one end portion reaching the surface of the protective portion while the other end is covered by the protective portion, and a plurality of terminal electrodes arranged on at least a mounting face, which is a face that faces the circuit board when the multilayer ceramic capacitor is mounted on the circuit board, among faces that form the surfaces of the element body, and connected electrically to the via conductors, wherein an electrode is not arranged on the opposite face, which is the face opposing the mounting face, among the faces that form the surfaces of the element body, and a protruding portion is provided at a position where the side of the end portion of a via conductors covered by the protective portion is projected in the stacking direction of the stack.
A circuit board includes a board, a multilayer ceramic electronic component mounted on a mounting surface of the board, and an electronic component that is adjacent to the multilayer ceramic electronic component and mounted on the mounting surface of the board. A mounting area of the multilayer ceramic electronic component on the board is 1/10 or less of a mounting area of the electronic component on the board. A dimension of the multilayer ceramic electronic component in a direction along a first axis orthogonal to the mounting surface is 1.3 times or more a dimension of the multilayer ceramic electronic component in a direction along a second axis orthogonal to the first axis.
The present invention inhibits the intrusion of moisture or hydrogen into a capacitance generation region even if the entirety of a dielectric layer has not been densified. The main body of this multilayer ceramic capacitor is divided into: a capacitance generation region in which a plurality of first internal electrodes and a plurality of second internal electrodes face each other in a first direction; a first outer peripheral region surrounding the capacitance generation region; and a second outer peripheral region surrounding the first outer peripheral region. A first porosity indicating the porosity of the first outer peripheral region is lower than a second porosity indicating the porosity of the second outer peripheral region. The first outer peripheral region has a cover part adjacent to the capacitance generation region in the first direction and a margin part adjacent to the capacitance generation region in a second direction orthogonal to the first direction. A second thickness indicating the thickness of the margin part in the second direction is greater than a first thickness indicating the thickness of the cover part in the first direction.
An all solid battery includes a first overlapping portion in which a tip of a first internal electrode layer and a part of a first margin overlap each other, viewed along a stacking direction. 0°<θ<90° and 0.1×t1/tan θ≤d<2.0×t1/tan θ are satisfied when in the first overlapping portion, an angle formed by a straight line connecting a tip point E1 of the first internal electrode layer on the first margin side and a tip point E2 of the first margin on the first internal electrode layer side and a straight line connecting both ends of the first internal electrode layer is “θ”, a thickness of the first margin is “t1”, and a length between the tip point E1 and the tip point E2 in the third direction is “d”.
One aspect of the present invention is a multilayer ceramic capacitor, including: a cuboid element body having a stack formed with alternating ceramic layers and internal electrodes made primarily of metal, a protective portion covering a surface of the stack, and a plurality of via conductors arranged so as to pass through the ceramic layers in the stacking direction of the stack, electrically connected to the internal electrodes, and having one end portion reaching the surface of the protective portion while the other end is covered by the protective portion, and a plurality of terminal electrodes arranged on at least a mounting face, which is the face that faces the circuit board when the multilayer ceramic capacitor is mounted on the circuit board, among faces that form the surfaces of the element body, and connected electrically to the via conductors, wherein an electrode is not arranged on the opposite face, which is the face opposing the mounting face, among the faces that form the surfaces of the element body, and a recessed portion is provided at a position where the side of the end portion of a via conductor covered by the protective portion is projected in the stacking direction of the stack.
A measurement apparatus includes a substrate that is a dielectric, a ground conductor provided on the substrate, a first signal line provided separately from the ground conductor on the substrate and against which a living body is pressed, a second signal line provided on the substrate such that the second signal line is separated from the ground conductor and the first signal line, and the second signal line does not come into contact with the living body when the living body is pressed against the first signal line, an oscillation circuit that oscillates an alternating current first signal, and a computation circuit that acquires biological information according to comparison of a second signal that is the first signal passing through the first signal line and a third signal that is the first signal passing through the second signal line.
A61B 5/1477 - Measuring characteristics of blood in vivo, e.g. gas concentration or pH-value using chemical or electrochemical methods, e.g. by polarographic means non-invasive
A61B 5/00 - Measuring for diagnostic purposes Identification of persons
A61B 5/145 - Measuring characteristics of blood in vivo, e.g. gas concentration or pH-value
41.
COIL COMPONENT, CIRCUIT BOARD ARRANGEMENT, ELECTRONIC DEVICE AND METHOD OF MANUFACTURING COIL COMPONENT
A coil component includes a base body, a conductor inside the base body, and an external electrode electrically connected to the conductor. The base body has metal magnetic particles bonded by a first resin, and has a first surface that faces a mounting board, and a second surface adjacent to the first surface. The external electrode includes a first conductive resin layer on the first surface, which is made of a material that contains a second resin and first metal particles. The external electrode includes a second conductive resin layer on the second surface, which is made of a material that contains a third resin and second metal particles. A content rate of the third resin is smaller than a content rate of the second resin. The external electrode includes a metal layer covering the first and second conductive resin layers.
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
A multilayer ceramic capacitor in an embodiment includes: a multilayer chip, having multiple dielectric layers formed by a dielectric ceramic, and internal electrodes respectively placed on the top and bottom faces of each of the dielectric layers, whose main component element is nickel and which further contain, by a total amount of more than 0% and no more than 10% by atom relative to nickel, at least two additive elements selected from a group that consists of metal elements that form an alloy together with nickel, and of silicon, wherein a pair of extraction faces are formed in a manner facing each other and having the internal electrodes alternately extracted to and exposed on the respective extraction faces; and external electrodes that electrically connect together the internal electrodes extracted onto the respective extraction faces of the multilayer chip.
One aspect of the present invention is a multilayer ceramic capacitor, including: a cuboid element body having a stack formed with alternating ceramic layers and internal electrodes made primarily of metal and a protective portion covering a surface of the stack, and a plurality of terminal electrodes arranged on at least a mounting face, which is the face that faces the circuit board when the multilayer ceramic capacitor is mounted on the circuit board, among faces that form the surfaces of the element body, the mounting face being the face opposing the circuit board during circuit board mounting, and connected electrically to the internal electrodes, wherein the mounting face has a sloped portion in the vicinity of the end portion of each terminal electrode opposing the other terminal electrode, the outer edge thereof rising toward the opposite side of the stack.
One aspect of the present invention is a multilayer ceramic capacitor, including: a cuboid element body having a stack formed with alternating ceramic layers and internal electrodes made primarily of metal, a protective portion covering a surface of the stack, and a plurality of via conductors arranged so as to pass through the ceramic layers in the stacking direction of the stack, electrically connected to the internal electrodes, and having at least one end portion reaching the surface of the protective portion, and a plurality of terminal electrodes arranged on at least a mounting face, which is the face that faces the circuit board when the multilayer ceramic capacitor is mounted on the circuit board, among faces that form the surfaces of the element body, and connected electrically to the via conductors, wherein the element body includes a capacitance forming portion, which is a region in which internal electrodes of different polarities overlap in the stacking direction, and an internal electrode partially facing portion formed by a region in which the internal electrodes of the same polarity overlap in the stacking direction, and the via conductor arranged adjacent to this region, and the thickness Tp of the internal electrode partially facing portion in the stacking direction is less than the maximum thickness T1 of the capacitance forming portion in the stacking direction.
First and second ceramic electronic devices are arranged on a mounting surface in a state in which respective height directions are orthogonal to the mounting surface, length directions of the first and second ceramic electronic devices are in the same direction, and one of a first external electrode and a second external electrode of the first multilayer ceramic electronic device and one of a first external electrode and a second external electrode of the second multilayer ceramic electronic device are adjacent to each other along a length direction and opposed to each other along the length direction. A height dimension of the first multilayer ceramic electronic device is 1.3 times or more larger than a width dimension or a length dimension thereof. A height dimension of the second multilayer ceramic electronic device is 1.3 times or more larger than a width dimension or a length dimension thereof.
A multilayer ceramic capacitor in an embodiment includes a multilayer chip, which includes a plurality of dielectric layers formed of a dielectric ceramic and internal electrodes disposed on upper and lower surfaces of each of the dielectric layers and containing nickel, a noble metal element, and a base metal element that forms an alloy with nickel, wherein the internal electrodes are alternately extracted and exposed to form a pair of extraction faces facing each other, and which includes external electrodes that electrically interconnect the internal electrodes extracted onto the extraction faces of the multilayer chip, wherein, in the internal electrodes observed on a cross-section perpendicular to the extraction faces, 10 or more segregation sites of the base metal element per layer are detected in a region located in a capacitance-forming part in which the internal electrodes adjacent to each other in a lamination direction overlap.
A ceramic grain is provided across an interface between an external electrode and a multilayer chip. In a dielectric layer of a capacity section, a standard deviation of grain size of ceramic grains is 30 nm or less. In an outer periphery surrounding the capacity section of the multilayer chip, a standard deviation of grain size of ceramic grains is 15 nm or less. An average grain size of the ceramic grains in the plurality of dielectric layer of the capacity section is larger than an average grain size of the ceramic grains in the outer periphery.
The present invention addresses the problem of suppressing concentration of residual stress caused by thermal shrinkage in a multilayer ceramic capacitor. One embodiment of the present invention relates to a multilayer ceramic capacitor comprising a main body, a first external electrode provided to the main body, and a second external electrode provided to the main body. The main body has a plurality of dielectric layers and a plurality of internal electrode layers that are stacked in a stacking direction with at least one of the plurality of dielectric layers interposed therebetween. The main body is partitioned into a central portion, a lower cover portion that is positioned below the central portion in the stacking direction, and an upper cover portion that is positioned above the central portion in the stacking direction. The main body is configured so that, from the upper end to the lower end of the central portion in the stacking direction, the area of each internal electrode layer constituting the plurality of internal electrode layers decreases with increasing proximity to the lower surface of the main body.
According to the present invention, fail-open is more surely achieved in a multilayer ceramic capacitor. In this multilayer ceramic capacitor, one first internal electrode layer among a plurality of first internal electrode layers is disposed adjacent to one second internal electrode layer among a plurality of second internal electrode layers, in a first direction. The one first internal electrode layer has a first thin layer portion in a first end region that faces an end portion of the one second internal electrode layer. A first thickness that represents the dimension in the first direction of the first thin layer portion is smaller than a first average thickness that represents the average of dimensions in the first direction of the one first internal electrode layer.
A ceramic electronic device includes a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked. At least one of the plurality of dielectric layers comprises a first layer positioned at center thereof in a stacking direction and second layers each of which is adjacent to each of two internal electrode layers adjacent to the at least one of the plurality of dielectric layers and has an average grain size of dielectric grains smaller than that of the first layer.
A multilayer ceramic capacitor pertaining to one aspect of the present invention comprises: a rectangular solid element having a laminate in which ceramic layers and internal electrodes mainly composed of metal are stacked alternately; a protective section covering the surface of the laminate; and an element having a plurality of via conductors, disposed so as to penetrated said ceramic layers in the stacking direction of said laminate, at least one end of which reaches the surface of the protective section and is electrically connected to said internal electrodes; and a plurality of terminal electrodes disposed on a mounting surface that, among the surfaces that form the front surface of said element, faces the circuit board when mounted on said circuit board; wherein all of the plurality of terminal electrodes are electrically connected to said via conductors and arranged with a spacing of 10 μm or more from the outer edge of said mounting surface.
A ceramic electronic device includes a multilayer chip in which a plurality of internal electrode layers are alternately exposed to opposing first and second end faces, and a pair of external electrodes that are formed respectively on the first end face and the second end face and have contact layers respectively contacting the first end face and the second end face and containing Cu as a main component. The plurality of internal electrode layers and the contact layers contain a low melting point metal having a melting point lower than that of Cu. One or more of the plurality of internal electrode layers from an outermost one have a connection portion connected to one of the pair of external electrodes, a width of the connection portion being narrower than other region of the one or more of the plurality of internal electrode layers.
The multilayer ceramic capacitor pertaining to one aspect of the present invention includes: a ceramic element body that has a laminate with a roughly rectangular parallelepiped shape and comprising multiple internal electrodes facing each other in the stacking direction and a dielectric layer arranged between the multiple internal electrodes, a pair of external electrodes arranged in connection with the ends of draw-out portions of the internal electrodes on a draw-out surface of the ceramic element body where the internal electrodes are drawn out, and a ceramic layer arranged in contact with the entire circumference of the external electrodes when viewed from the draw-out surface side.
A tactile sensation generating device includes a housing and a piezoelectric actuator. The housing is constituted by a first member and a second member being joined together, and has a bar-like shape. The piezoelectric actuator includes piezoelectric layers made of piezoelectric material, positive internal electrodes provided in the piezoelectric layers, and negative internal electrodes provided in the piezoelectric layers and facing the positive internal electrodes, respectively, via the piezoelectric layers, respectively; expands/contracts along the direction perpendicular to the electrode faces of the positive internal electrodes and the negative internal electrodes upon voltage application between each positive internal electrode and each negative internal electrode; is interposed between the first member and the second member in an orientation that the direction perpendicular to the electrode faces corresponds to the longitudinal direction of the housing; and is pressed by the first member and the second member along the longitudinal direction.
A circuit board includes a multilayer ceramic electronic component; and a mounting board mounting the multilayer ceramic electronic component thereon, wherein the multilayer ceramic electronic component comprises: a ceramic main body having a dimension in the first axis direction of the ceramic main body of 0.1 mm or more, and a ratio of a dimension in the second axis direction of the ceramic main body to the dimension in the first axis direction of 130% or more, a plurality of internal electrodes laminated inside the ceramic main body in the first axis direction, and both edges of the plurality of internal electrodes in the second axis direction being aligned with each other within 0.5 μm in the second axis direction, and external electrodes respectively covering the end surfaces, and wherein the mounting board faces the second principal surface of the multilayer ceramic electronic component mounted thereon.
With a view to improving the sensitivity of an optical sensor, an optical sensor according to one embodiment of the present invention comprises: a substrate that has first wiring and second wiring; a first electrode that is electrically connected to the first wiring; a second electrode that is electrically connected to the second wiring; a light-receiving layer that receives light and that is provided at a position in a manner sandwiching the first electrode and the second electrode between the substrate and the light-receiving layer; and an electric current varying layer that is positioned between the light-receiving layer and the substrate, and that is electrically connected to the first electrode and the second electrode to allow electric current to flow therethrough, the electric current being varied in association with the light received on the light-receiving layer.
A ceramic electronic device includes a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked. σ≤dAVE×0.25 is satisfied when an average value of long diameters of dielectric grains is dAVE and a standard deviation of the long diameters of the dielectric grains is σ in a cross section of at least one of the plurality of dielectric layers.
A multilayer ceramic electronic component includes an element body including internal electrode layers and dielectric layers stacked alternately. Each of the dielectric layers includes core-shell grains each including a core portion, a first shell layer provided around the core portion, and a second shell layer provided around the first shell layer. The dielectric layer further includes a grain boundary between adjacent ones of the core-shell grains. Each of a concentration of a donor element in the first shell layer and a concentration of a donor element in the second shell layer is higher than a concentration of a donor element in the core portion.
In order to improve the responsiveness of motor driving for an electric vehicle, this motor control device comprises: (A) a smoothing unit that smooths a drive operation amount related to an operation input for the driving of a motor; (B) a generation unit that, in accordance with an increase or decrease in the drive operation amount, generates a component for emphasizing the increase or decrease; and (C) a control unit that controls the driving of the motor on the basis of the results of combining the smoothed drive operation amount and the component.
A multilayer ceramic capacitor has a dimension in a first direction equal to or greater than 1.5 times a dimension in a second direction, and includes a ceramic body and a pair of external electrodes. The ceramic body further includes a multilayer portion including internal electrodes that are alternately stacked with ceramic layers along a stacking direction parallel to the first or second direction, and a pair of margin portions that cover the multilayer portion from a width direction of the internal electrodes, and contain an additive element composed of at least one of the following elements: Mg, Mn, Zr, Ti, Li, Mo, Nb, Cu, a rare earth element, and Sn at a higher concentration than the multilayer portion. The internal electrodes include inner-side internal electrodes, and outer-side internal electrodes having a maximum width dimension smaller than a minimum width dimension of the inner-side internal electrodes.
A ceramic electronic device includes a multilayer chip in which dielectric layers and internal electrode layers are alternately stacked. The internal electrode layers include a main component element and a sub-element. The dielectric layers include a plurality of crystal grains. Near an interface between each of the internal electrode layers and each of the dielectric layers, each of the internal electrode layers has a high concentration layer, in which the sub-element concentration is 1.5 times or more as that in an entire of each of the internal electrode layers.
A multilayer ceramic electronic component including a plurality of internal electrode layers, a plurality of dielectric layers having a perovskite structure represented by a general formula ABO3, wherein the internal electrode layers and the dielectric layers are alternately laminated along a first axis, wherein an intermediate layer is provided between an internal electrode layer and a dielectric layer, which are adjacent each other, along the first axis. When a main component element of the internal electrode layer is M, an element at an A-site of the dielectric layer is A, and an element at a B-site is B, the intermediate layer includes M atoms, B atoms, and oxygen atoms, wherein a combined proportion of M atoms, B atoms, and oxygen atoms in the intermediate layer is 50 at % or more, and a proportion of A atoms is 5 at % or less.
A multilayer ceramic electronic device includes a dielectric layer that has a dielectric grain which includes a core portion, a shell portion surrounding the core portion and including a rare earth element, and an oxide segregated inside the shell portion and having a higher concentration of the rare earth element than the shell portion, and has a perovskite structure expressed by a general formula ABO3, a plurality of internal electrode layers that sandwich the dielectric layer and face each other, and a plurality of external electrodes each of which is electrically coupled to each of the plurality of internal electrode layers.
C04B 35/468 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
C04B 37/00 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating
A multilayer chip includes side margins outside of a capacity section in a third direction which is orthogonal to a first direction in which plurality of internal layers face each other and a second direction in which two end faces are opposite to each other. A first internal layer and a second internal layer are included in the capacity section and include a metal component. The first internal layer includes a protruding section which protrudes toward outside from the capacity section in the third direction. The protruding section includes an oxidized portion of the metal component. A relationship do1>do2 is satisfied when a length of the oxidized portion of the protruding section is do1 and a length of an oxidized portion at an end of the second internal layer on a side of one of the side margins is do2.
A multilayer ceramic electronic device includes a multilayer body having a rectangular parallelepiped shape in which a plurality of first dielectric layers, a plurality of second dielectric layers, and a plurality of internal electrode layers are stacked. Each average thickness of each of the plurality of first dielectric layers is different from that of each of the plurality of second dielectric layers. Each of the plurality of first dielectric layers and each of the plurality of second dielectric layers are alternately stacked through each of the plurality of internal electrode layers.
The multilayer ceramic capacitor pertaining to one aspect of the present invention includes: a ceramic element body having a laminate having a rectangular parallelepiped shape, a plurality of internal electrodes facing each other in the stacking direction, and a dielectric layer disposed between the plurality of internal electrodes, wherein the internal electrode ends are drawn out to a pair of end surfaces disposed parallel to the stacking direction and facing each other, a protective portion disposed on the top and bottom surfaces of the laminate in the stacking direction and a side margin portion disposed on a pair of lateral surfaces that are orthogonal to both the top and bottom surfaces and the end surfaces of the laminate, and covering the ends of the internal electrodes that are extended at the lateral surfaces, and an external electrode structure including a first base electrode disposed on the end surface of the ceramic element body and electrically connected to the ends of the internal electrode, a base ceramic layer disposed on the end surface of the ceramic element body and in contact with the circumferences of the first base electrode and a second base electrode covering the first base electrode and the base ceramic layer and electrically connected to the first base electrode.
A detection device includes a storage member in which liquid is stored, a sensor chip that is provided on the storage member and has a sensitive membrane on a lower surface thereof, and a pressing member that is provided below the sensitive membrane, and presses the storage member to supply the liquid to the sensitive membrane when the sensor chip is pressed downward.
G01N 29/22 - Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic wavesVisualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object Details
To improve sensing sensitivity by enhancing the effect of agitating a specimen through heating, a fluid sensor according to the present invention comprises: a piezoelectric layer having a main surface; a substrate including the piezoelectric layer; a heater provided on the main surface; a sensitive film which is provided on the main surface, has a surface on the opposite side from the piezoelectric layer, and reacts with a target substance; bottom and top electrodes which are stacked with the piezoelectric layer sandwiched in between and which are for propagating an elastic wave within the piezoelectric layer in at least a region where the piezoelectric layer and the surface overlap; a first channel which is provided on the main surface, which has a first inner wall, and in which, when a liquid flows, the first inner wall, the region, and an inner wall including the surface of the heater act as a channel for the liquid; and a second channel which is provided on the main surface in communication with the first channel, which has a second inner wall, and in which, when a liquid flows, the second inner wall and an inner wall including the surface act as a channel for the liquid, the second channel being located downstream of the first channel in the direction of liquid flow.
A ceramic electronic device includes a multilayer chip in which internal electrode layers are alternately stacked with dielectric layers, respectively, and are exposed alternately at a first surface and a second surface of the multilayer chip, wherein, in a capacity section in which the internal electrode layers exposed at the first and second surface overlap each other as viewed in the stacking direction, the dielectric layers are at least three dielectric layers, each dielectric layer including Sn, wherein each side margin has a portion having a smaller Sn concentration which is in contact with the capacity section and is closer to an outermost end in the stacking direction than is a portion of each side margin having a larger Sn concentration which is in contact with the capacity section and is located at a center area in the stacking direction.
An inductor array includes a base body having a first surface, first to fourth external electrodes touching the first surface, a first internal conductor provided in the base body and connected at the ends thereof to the first and second external electrodes, and a second internal conductor provided in the base body and connected at the ends thereof to the third and fourth external electrodes. The first and second internal conductors are spaced away from each other in a reference direction. The first internal conductor has a first aspect ratio of greater than one, where the first aspect ratio denotes a ratio of (i) a dimension of a section of the first internal conductor orthogonal to a current flowing direction in a direction perpendicular to the reference direction to (ii) a dimension of the section in the reference direction.
H01M 4/485 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of mixed oxides or hydroxides for inserting or intercalating light metals, e.g. LiTi2O4 or LiTi2OxFy
A waveguide member 100 comprises: a member 10 composed of a non-electroconductive material, the member 10 having an upper surface 11, a lower surface 12, a belt-form portion 14 that is dug from the lower surface 12 toward the upper surface 11 and has a first top surface 15 expanding in a belt-form shape, and a plurality of holes 16 that extend from the lower surface 12 toward the upper surface 11 and are arranged adjacent to at least part of the belt-form part 14, the plurality of holes 16 having a second top surface 17 and a side peripheral surface 18; and an electroconductive film 20 that covers at least the upper surface 11, the lower surface 12, the first top surface 15 of the belt-form portion 14, and the second top surface 17 and the side peripheral surface 18 of the plurality of holes 16 of the member 10.
This multilayer ceramic electronic component comprises: an element body in which a plurality of internal electrodes and a plurality of dielectric layers mainly composed of ceramic are alternately laminated in a first direction, and the laminated plurality of internal electrodes have end surfaces that are alternately exposed and opposed to each other in a second direction; a base metal layer that is in contact with some of the plurality of internal electrodes exposed from the end surfaces and is disposed at the end portion on the end surface side among four surfaces connected to the end surfaces of the element body; and a plating layer that is disposed so as to sandwich the base metal layer with the element body at the end portion and forms an external electrode together with the base metal layer, wherein θ1 is at most 30°, T1 is at most 0.9 times T2, and T3 is at least 1.1 times T2, where, when the distance between the tip and the end surface is L, θ1 is the angle between the surface of the element body and a line connecting a point on the element body at the tip and a point on the surface of the base metal layer at position P1 having a distance of 0.1 X L, T1 is the thickness of the base metal layer at position P1, T2 is the thickness of the base metal layer at position P2 having a distance of 0.5 X L, and T3 is the thickness of the base metal layer at position P3 having a distance of 0.9 X L.
A waveguide device 100 comprises: a first member 10 that has a conductive surface 11; a second member 20 that has a conductive surface 21 facing the surface 11; a waveguide member 40 that is provided to extend in the planar direction of the surface 11 between the surface 11 and the surface 21, is in contact with the surface 11, forms a gap 42 with the surface 21, and has a conductive waveguide surface 41 facing the surface 21; a plurality of rods 30 that are provided around the waveguide member 40 between the surface 11 and the surface 21, are in contact with the surface 11, extend toward the surface 21, form a gap 31 with the surface 21, and each have a conductive surface; and a wall part 50 that is in contact with or is high-frequency coupled to the surface 11 and the surface 21 and provided adjacent to the waveguide member 40 without the plurality of rods 30 interposed therebetween between the surface 11 and the surface 21, wherein at least a side surface 51 facing the waveguide member 40 has conductivity.
A multilayer ceramic electronic component includes a ceramic body including ceramic layers stacked in a first axis direction and internal electrodes disposed between the plurality of ceramic layers and alternately led out to respective sides along a second axis direction orthogonal to the first axis direction, and external electrodes connected to the internal electrodes and opposed to each other in the second axis direction across the ceramic body. The internal electrodes include first and second peripheral internal electrodes collectively disposed in first and second peripheral portions at respective outer sides in the first axis direction, respectively and central internal electrodes collectively disposed closer to a center in the first axis direction than the first and second peripheral internal electrodes, and each of the first and second peripheral internal electrodes has a higher content ratio of ceramic particles than each of the central internal electrodes.
A multilayer ceramic electronic component includes a laminate body having a pair of principal faces orthogonal to a Z axis, a pair of end faces orthogonal to an X axis, and a pair of lateral faces orthogonal to a Y axis; a first margin part provided at one side of the laminate body in a Y-axis direction; a second margin part provided at another side of the laminate body in the Y-axis direction; and a pair of external electrodes provided on the pair of respective end faces. The external electrodes each include an extended portion extended to a plane of the first margin part that is defined by a Z-axis direction and an X-axis direction. At least the first margin part has a dimension in the Z-axis direction that is set greater than a dimension of the laminate body in the Z-axis direction.
A multilayer ceramic electronic component includes a ceramic body including ceramic layers stacked in a first axis direction and internal electrodes disposed between the plurality of ceramic layers and alternately led out to respective sides along a second axis direction orthogonal to the first axis direction, and external electrodes connected to the internal electrodes and opposed to each other in the second axis direction across the ceramic body. The internal electrodes include first and second peripheral internal electrodes collectively disposed in first and second peripheral portions at respective outer sides in the first axis direction, respectively and central internal electrodes collectively disposed closer to a center in the first axis direction than the first and second peripheral internal electrodes, and each of the first peripheral internal electrodes and the second peripheral internal electrodes is thicker in the direction of the first axis than each of the central internal electrodes.
A multilayer ceramic electronic device includes a multilayer section, a side margin section that is provided on a side surface facing in a first direction, and an external electrode that is provided on an end surface facing in a second direction and is connected to at least one of the plurality of internal electrode layers. When viewing a cross section of the multilayer section along a stacking direction and the first direction, at least at one corner of the multilayer section, a first end of the side margin section in the stacking direction contacts a second end of the cover layer in the first direction from the stacking direction. A ratio of a distance in the first direction between a tip of the first end of the side margin section and the side surface to a thickness of the cover layer in the stacking direction is 2.8 or less.
A waveguide device 100 comprises: a first member 10 that has a conductive surface 11 and a through-hole 14 penetrating a space between the surface 11 and a surface 15 on the reverse side and having a conductive inner surface; a second member 20 that has a conductive surface 21 facing the surface 11; a waveguide member 40a that is provided to extend in a planar direction between the surfaces 11, 21, is in contact with the surface 11, forms a gap 42 with the surface 21, and has a tip 45 adjacent to the through-hole 14 and a conductive waveguide surface 41 facing the surface 21; a plurality of rods 30 each having a conductive surface that are provided around the waveguide member 40a between the surfaces 11, 21, are in contact with the surface 11, form a gap 31 with the surface 21, and are not disposed between the through-hole 14 and the tip 45 of the waveguide member 40a; and a wall portion 50a that is in contact with or is high-frequency coupled to the surfaces 11, 21 and provided adjacent to the through-hole 14 without the rods 30 interposed therebetween between the surfaces 11, 21, and has conductive side surfaces.
This multilayer ceramic electronic component comprises: an element body in which a plurality of internal electrodes and a plurality of dielectric layers mainly composed of ceramic are alternately laminated in a first direction, and the laminated plurality of internal electrodes have end surfaces that are alternately exposed and opposed to each other in a second direction; a base metal layer that is in contact with some of the plurality of internal electrodes exposed from the end surfaces and is disposed at the end portion on the end surface side among surfaces connected to the end surfaces of the element body; a glass layer disposed across from between the tip of the base metal layer and the element body at the end portion to the opposite side of the end surfaces; and a plating layer that is disposed so as to sandwich the base metal layer and the glass layer with the element body at the end portion and forms an external electrode together with the base metal layer.
A negative electrode active material, characterized in that a composition formula of the negative electrode active material is TiTa2−xMxO7, 0.2≤x≤1.0, and M includes at least Nb.
H01M 4/485 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of mixed oxides or hydroxides for inserting or intercalating light metals, e.g. LiTi2O4 or LiTi2OxFy
H01M 4/02 - Electrodes composed of, or comprising, active material
H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
82.
MULTILAYER CERAMIC ELECTRONIC DEVICE AND DIELECTRIC CERAMIC COMPOSITION
A multilayer ceramic electronic device includes a dielectric layer that has a main phase having a perovskite structure expressed by a general formula ABO3 and a secondary phase which includes barium, chromium, and a transition metal element other than chromium, and has a molar ratio of a sum of the chromium and the transition metal element other than the chromium to barium of the secondary phase of 7.0 or more, a plurality of internal electrode layers that sandwich the dielectric layer and face each other, and a plurality of external electrodes each of which is electrically coupled to each of the plurality of internal electrode layers.
One object is to inhibit magnetic flux from concentrating in the region of the base body near the end of the inner peripheral surface of the coil conductor in the height direction. A coil component in one aspect includes a base body containing metal magnetic particles and a coil conductor including a winding portion. The base body includes a core portion positioned inside the winding portion, one end portion covering one end surface of the winding portion, and another end portion covering another end surface of the winding portion. The core portion includes a core center portion at the center. An average particle size of metal magnetic particles contained in the one end portion and an average particle size of metal magnetic particles contained in the other end portion are smaller than an average particle size of metal magnetic particles contained in the core center portion.
H01F 27/34 - Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
An electronic component includes an element body having a contour having a pair of end faces and multiple lateral faces each of which is connected to the end faces and extends from one of the end faces to another of the end faces, and at least one conductor within the element body; base layers each of which is in contact with the lateral faces and one of the end faces; and Ni layers formed on the base layers, respectively, each of the Ni layers disposed over the lateral faces and the corresponding end face. Each of the Ni layers has at least one thickest portion disposed over at least one of the lateral faces, and a thickness of the thickest portion is at least 30 percent greater than a thickness of a portion of the Ni layer disposed over the corresponding end face.
A multilayer ceramic electronic component includes a laminate including an internal electrode group including internal electrodes laminated along a first axis, and ceramic layers, each of which is between adjacent internal electrodes; and a pair of external electrodes connected to the internal electrodes. The internal electrode group includes a first internal electrode group including one or more first internal electrodes at an end in a first direction of the first axis; a second internal electrode group including one or more second internal electrodes at an end in a second direction opposite to the first direction; and a third internal electrode group including one or more third internal electrodes between the first and second internal electrode groups. A first thermal expansion coefficient of the first internal electrode and a second thermal expansion coefficient of the second internal electrode are less than a third thermal expansion coefficient of the third internal electrode.
An acoustic wave device includes a pair of comb-shaped electrodes provided on a piezoelectric substrate, each of the pair of comb-shaped electrodes including electrode fingers and metal portions that are provided between electrode fingers adjacent to each other, the metal portions having a shorter length than the electrode fingers, the electrode fingers of one comb-shaped electrode and the electrode fingers of the other comb-shaped electrode being alternately arranged at least in a part, an acoustic velocity of an acoustic wave propagating through a region where the metal portions are located being higher than an acoustic velocity of an acoustic wave propagating through a central region of an overlap region where the electrode fingers of the one comb-shaped electrode and the electrode fingers of the other comb-shaped electrode overlap, and being equal to or less than 1.10 times the acoustic velocity of the acoustic wave propagating through the central region.
A multilayer ceramic capacitor includes a ceramic body and first and second external electrodes. The ceramic body has a capacitance forming portion including first and second internal electrodes and ceramic layers. Each of the first and second internal electrodes has a first region arranged along margin portions of the ceramic body and a second region arranged at inner sides of the first region. Each of the first and second internal electrodes includes a conductive component, and a continuity rate of the conductive component in a plan view as seen from the second axial direction in the first region has a first value, and a continuity rate of the conductive component in the plan view as seen from the second axial direction in the second region has a second value, the first value being greater than the second value.
This multilayer ceramic electronic component has: a lamination body in which inner electrode layers and dielectric layers are alternately laminated and which has a substantially rectangular parallelepiped shape; and a pair of outer electrodes which are connected to the inner electrode layers alternately drawn out, at two end faces directed in a substantially orthogonal direction with respect to the lamination direction of the lamination body. The lamination body has: a capacitance formation part in which the inner electrode layers connected to the mutually different outer electrodes face each other with the dielectric layers therebetween so as to form capacitances; and an end margin part which is located, in the substantially orthogonal direction, on an end face side viewed from the capacitance formation part. In a cross section of the lamination body along the lamination direction and the substantially orthogonal direction, the ratio of the number of flat ceramic particles with respect to the number of all ceramic particles per unit area within the end margin part is greater than the ratio of the number of the flat ceramic particles with respect to the number of all ceramic particles per unit area within the capacitance formation part.
A multilayer ceramic electronic device includes a multilayer structure that has a side margin that is provided so as to cover ends of internal electrode layers extending toward two side faces and has a thickness of 10 μm or more and 70 μm or less, wherein with reference to a first straight line drawn from a tip on a side of the side margin in an opposing direction in which the two side faces oppose each other, a distance between the tip and one of a first position where the thickness to a surface on one side in a thickness direction first reaches a maximum value from the tip and a second position where the thickness to a surface on the other side first reaches a maximum value from the tip which is located closer to the tip in the opposing direction is 15 μm or less.
H01M 10/0585 - Construction or manufacture of accumulators having only flat construction elements, i.e. flat positive electrodes, flat negative electrodes and flat separators
90.
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
This multilayer ceramic electronic component is provided with: a body in which a plurality of internal electrodes and a plurality of dielectric layers mainly composed of ceramic are alternately laminated in a first direction, the body having a pair of end surfaces on which the plurality of laminated internal electrodes are alternately exposed and that face each other in a second direction; and a pair of external electrodes respectively in contact with the plurality of internal electrodes exposed from the pair of end surfaces. When one dielectric layer in a capacitance region which is at the central part in the second direction of the body when viewed from the first direction and where the plurality of internal electrodes overlap is virtually divided into three equal regions of a pair of first regions in contact with the internal electrodes and a second region sandwiched between the pair of first regions, a first molar ratio of phosphorus to a primary metallic element of the ceramic in the pair of first regions is higher than a second molar ratio of phosphorus to the primary metallic element in the second region.
A ceramic electronic device includes a multilayer chip in which dielectric layers and internal electrode layers are alternately stacked. The internal electrode layers include a main component element and a sub-element. The dielectric layers include a plurality of crystal grains. A segregation portion, in which the sub-element is segregated in shell portions and a grain boundary of the plurality of crystal grains and a sub-element concentration is 1.5 times or more as that in an entire of each of the dielectric layers, is formed. near an interface between each of the internal electrode layers and each of the dielectric layers, each of the internal electrode layers has a high concentration layer, in which the sub-element concentration is 1.5 times or more as that in an entire of each of the internal electrode layers.
A detection device includes a vibrator having a sensitive membrane, a heater configured to heat the sensitive membrane, a detector configured to detect a detection value related to a resonance frequency of the vibrator, a control unit configured to cause the heater to start heating the sensitive membrane, acquire a first detection value detected by the detector in a state where the sensitive membrane is heated, and cause the heater to stop heating the sensitive membrane based on the first detection value and a first reference value, and an arithmetic unit configured to acquire a second detection value related to a gas to be measured detected by the detector after heating of the sensitive membrane is stopped, and calculate determination information about the gas based on the second detection value.
The present invention suppresses the generation of air bubbles in a flow passage for a liquid and secures a reaction area of a target material in the flow passage. A fluid sensor (1) comprises: a piezoelectric substrate (10); a sensitive film (21) provided on the piezoelectric substrate and including a surface (21S) that reacts with a target substance in a liquid; a measurement unit (11) for propagating a surface acoustic wave (SW) to a region of the surface of the piezoelectric substrate, in which the piezoelectric substrate and the surface overlap; a flow path structure (3) including the surface, a ceiling part (31c) facing the surface, a plurality of side wall parts surrounding sides, and an introduction port (32) and a discharge port (33) for the liquid that are provided separated from each other on the ceiling part, the flow path structure including the surface, the ceiling part, and the plurality of side wall parts in order to form a flow path for the liquid; and first and second structures (34a) and (34b) provided at positions sandwiched by the introduction port and the discharge port of the ceiling part, extending from the ceiling part toward the surface, and separated from the surface and the plurality of side wall parts.
A ceramic electronic device includes a multilayer structure in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked. In at least one of the plurality of dielectric layers, an average grain size of dielectric grains is 150 nm or less, and a number of the dielectric grains per one metal grain of one of the plurality of internal electrode layers adjacent to the at least one of the plurality of dielectric layers is 5 or more and 35 or less in an extension direction of the one of the plurality of internal electrode layers.
An all solid battery includes a positive electrode layer that includes a positive electrode active material that is a Co-containing phosphate in which a portion of a Co site is replaced with at least one of Mg, Zn, or Ni, a negative electrode layer that includes a negative electrode active material, and a solid electrolyte layer that is sandwiched by the positive electrode layer and the negative electrode layer.
H01M 4/58 - Selection of substances as active materials, active masses, active liquids of inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFySelection of substances as active materials, active masses, active liquids of polyanionic structures, e.g. phosphates, silicates or borates
H01M 4/02 - Electrodes composed of, or comprising, active material
An operation device according to the present invention comprises: an operation panel including a tactile panel that has a first main surface and a second main surface on the reverse side of the first main surface, a touch panel that has a third main surface and a forth main surface, which is on the reverse side of the third main surface and faces the first main surface, and that outputs a detection signal corresponding to a touched location on the tactile panel, and a piezoelectric actuator that is disposed on the first main surface and generates vibrations; and a control device to which the detection signal output from the touch panel is input and which outputs a drive signal corresponding to the touched location on the tactile panel to the piezoelectric actuator while the detection signal is input.
G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
H01H 36/00 - Switches actuated by change of magnetic field or of electric field, e.g. by change of relative position of magnet and switch, by shielding
97.
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF, AND CIRCUIT BOARD
A multilayer ceramic electronic component is equipped with a ceramic component and an external electrode. Said ceramic body has a plurality of internal electrodes that are stacked in the direction of a first axis, and an end surface that is perpendicular to a second axis that is orthogonal to the first axis, and from which said plurality of internal electrodes are drawn. Said external electrode includes a base layer that covers said end surface and is connected to said plurality of internal electrodes. Said plurality of internal electrodes and said base layer are made of a polycrystalline material mainly composed of copper. The average crystal grain size of the base layer described above is 1.2 times or more that of the plurality of internal electrodes described above.
A multilayer ceramic capacitor, which has a dimension in a first axis direction equal to or greater than 1.5 times a dimension in a second axis direction orthogonal to the first axis direction and is to be mounted on a mounting surface perpendicular to the first axis direction, includes a ceramic body having main surfaces perpendicular to the first axis, side surfaces perpendicular to the second axis, an end surface perpendicular to a third axis orthogonal to the first and second axes, a multilayer body having internal electrodes that are stacked in the second axis direction and led out to a connection end on the end surface, and margin portions covering the multilayer body from respective sides in the first axis direction, and having a higher concentration of a grain growth inhibiting element than the multilayer body, and an external electrode covering the end surface.
A waveguide device 100 comprises: a first member 10 having a conductive upper surface 11; a second member 20 facing the upper surface 11 and having a conductive lower surface 22; a ridge 30 disposed on the upper surface 11 between the upper surface 11 and the lower surface 22, forming a first gap 32 with the lower surface 22, and having a conductive first waveguide surface 31 facing the lower surface 22; a characteristic adjustment body 60 disposed on the upper surface 11 between the upper surface 11 and the lower surface 22, having a conductive second waveguide surface 61 facing the lower surface 22 with a second gap 62 interposed therebetween, and having one end 63 connected to a side of the ridge 30 and the other end 64 being an open end; and a plurality of rods 50 provided at least on the peripheries adjacent to the ridge 30 and the characteristic adjustment body 60 between the upper surface 11 and the lower surface 22, being in contact with the upper surface 11, and forming a third gap 52 with the lower surface 22, at least the upper surface and the side surface thereof having conductivity.
A multilayer ceramic capacitor has a dimension in a first direction equal to or greater than 1.5 times a dimension in a second direction orthogonal to the first direction, and includes a ceramic body, which has main surfaces perpendicular to the first direction, an end surface perpendicular to a third direction orthogonal to the first and second directions, and internal electrodes mainly composed of Ni, stacked in the second direction, and led out to respective connection ends on the end surface, and an external electrode, which is mainly composed of Cu and covers the end surface. The internal electrodes include outer-side internal electrodes located in both outer sides and inner-side internal electrodes located an inner side in the second direction. Distances from the main surfaces are larger at the connection ends of the outer-side internal electrodes than in central portions in the third direction of the inner-side internal electrodes.
