The present invention relates to a manufacturing method of a shadow mask, the manufacturing method including the steps of: forming a conductive layer on a base substrate; laminating a photoresist on the conductive layer and patterning the photoresist in a shape corresponding to a mask pattern; forming a mask sheet by performing electroforming on a region except for the patterned photoresist; forming a mask frame by patterning the base substrate and the conductive layer to expose the mask pattern; and performing light treatment or heat treatment to reinforce bonding force between the mask sheet and the conductive layer before and after forming the mask frame or in a process of forming the mask frame.
H10K 71/16 - Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
C23C 14/04 - Coating on selected surface areas, e.g. using masks
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
A deposition apparatus is disclosed. The deposition apparatus according to an aspect of the present invention comprises: a deposition chamber providing a deposition space; a first plate arranged above the deposition chamber to be separatable; a second plate which is supported by the first plate and is arranged above the first plate; a hexapod which is connected to the second plate and extends to the deposition space after passing through the first plate; a fixing means which is arranged on the lower side of the hexapod and fixes a substrate on which deposition particles are deposited; a first support portion which extends from the second plate to the deposition space and supports a mask facing the substrate; and a camera which is arranged on the second plate so as to prevent vibration of the first plate from transferring and which identifies the position of the substrate.
C23C 14/54 - Controlling or regulating the coating process
H04N 7/18 - Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
F16F 15/023 - Suppression of vibrations of non-rotating, e.g. reciprocating, systemsSuppression of vibrations of rotating systems by use of members not moving with the rotating system using fluid means
F16F 15/027 - Suppression of vibrations of non-rotating, e.g. reciprocating, systemsSuppression of vibrations of rotating systems by use of members not moving with the rotating system using fluid means comprising control arrangements
3.
DEPOSITION DEVICE FOR IMPROVING PRECISION OF SUBSTRATE POSITION MEASUREMENT
Disclosed is a deposition device. The deposition device according to one aspect of the present invention comprises: a deposition chamber providing a deposition space; a first plate detachable from the upper side of the deposition chamber; a second plate that is supported by the first plate and disposed above the first plate; a hexapod that is connected to the second plate, passes through the first plate, and extends to the deposition space; a fixing means that is disposed below the hexapod and fixes a substrate on which deposition particles are deposited; a first support part that extends from the second plate to the deposition space and supports a mask facing the substrate; a camera that is disposed on the first plate and used to identify the position of the substrate; and a light source unit that is disposed below the fixing means and emits light. The light from the light source may pass through the substrate and be transmitted to the camera.
H10K 71/16 - Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
H10K 71/70 - Testing, e.g. accelerated lifetime tests
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
G01N 21/88 - Investigating the presence of flaws, defects or contamination
C23C 14/04 - Coating on selected surface areas, e.g. using masks
A substrate deposition device and a control method therefor are disclosed. The substrate deposition device, according to one aspect of the present invention, may comprise: a chamber forming a deposition space and having an opening that is open at a portion of an upper surface thereof; an aligner frame located above the opening and supported on the edge of the opening at the upper surface of the chamber; a vibration damping unit disposed between the chamber and the aligner frame to isolate vibration from the chamber and the aligner frame; a substrate fixing means for fixing a substrate inserted into the deposition space; a displacement control unit coupled to and supported on the aligner frame, arranged to face the deposition space inside the chamber, having the substrate fixing means on a lower end thereof, and moving the substrate fixed to the substrate fixing means in the horizontal and vertical directions to adjust the horizontality and angle; a mask support frame coupled to the aligner frame and extending to the lower side of the substrate fixing means; a mask fixing means provided on the mask support frame to fix a mask to the lower side of the substrate fixing means; a gap sensor for measuring a gap between the substrate fixed to the substrate fixing means and the mask fixed to the mask fixing means; a force sensor provided between the mask fixing means and the mask support frame to measure a load applied to the mask fixing means; and a control unit for controlling the substrate fixing means, the displacement control unit, and the mask fixing means.
A substrate deposition device including a gap sensor is disclosed. The substrate deposition device including a gap sensor, according to one aspect of the present invention, may comprise: a chamber, which has a deposition space and has an opening opened at one part of the upper side thereof; an aligner frame located at the top of the opening so as to be supported by the edge of the opening of the upper side of the chamber; a vibration isolation unit arranged between the chamber and the aligner frame so as to isolate the vibration of the chamber and the aligner frame; a substrate fixing means for fixing a substrate inserted into the deposition space; a displacement adjustment unit, which is coupled to the aligner frame and supported thereby, is arranged to face the deposition space inside the chamber, has the substrate fixing means provided at the lower end thereof, moves the substrate fixed to the substrate fixing means in the horizontal direction and the vertical direction, and adjusts horizontality and angle; a mask support frame, which is coupled to the aligner frame and extends to bottom of the substrate fixing means; a mask fixing means, which is provided at the mask support frame so as to fix the mask at the bottom of the substrate fixing means; a gap sensor for measuring the gap between the substrate fixed at the substrate fixing means and the mask fixed at the mask fixing means; and a control unit for controlling the substrate fixing means, the displacement adjustment unit and the mask fixing means.
C23C 14/04 - Coating on selected surface areas, e.g. using masks
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H10K 71/16 - Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
6.
SUBSTRATE DEPOSITION APPARATUS HAVING FORCE SENSOR AND CONTROL METHOD THEREOF
A substrate deposition apparatus having a force sensor is disclosed. The substrate deposition apparatus having a force sensor according to one aspect of the present invention may comprise: a chamber that forms a deposition space and has an open opening formed on a portion of the top surface thereof; an aligner frame located above the opening and supported on the edges of the opening on the top surface of the chamber; a vibration isolation unit disposed between the chamber and the aligner frame to isolate the chamber and the aligner frame from vibration; a substrate fixing means for fixing a substrate introduced into the deposition space; a displacement adjustment unit that is coupled to and supported by the aligner frame, disposed to face the deposition space within the chamber, has the substrate fixing means at the bottom thereof, and moves the substrate fixed to the substrate fixing means in the horizontal and vertical directions and adjusts the horizontality and angle; a mask support frame that is coupled to the aligner frame and extends to the lower side of the substrate fixing means; a mask fixing means configured to be supported on the mask support frame to fix a mask to the lower side of the substrate fixing means; a force sensor disposed between the mask fixing means and the mask support frame to measure a load acting on the mask fixing means; and a control unit that controls the substrate fixing means, the displacement adjustment unit, and the mask fixing means.
C23C 14/04 - Coating on selected surface areas, e.g. using masks
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H10K 71/16 - Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
7.
METHOD FOR INSTALLING DEPOSITION UNIT FOR VACUUM DEPOSITION EQUIPMENT
The present invention relates to a method for installing a deposition unit for vacuum deposition equipment and, more specifically, to a method for installing a deposition unit including a wafer chuck and a mask chuck in vacuum deposition equipment. According to one aspect of the present invention, a method comprises: a gap sensor assembly step; a deposition unit installation step; and a parallelism adjustment step.
VACUUM DEPOSITION EQUIPMENT VISION SYSTEM HAVING INSTALLED THEREIN TRANSMISSIVE LIGHTING AND REFLECTIVE LIGHTING, AND CAMERA UNIT FOR VISION SYSTEMS, WHICH IS FOR ALIGNMENT OF SUBSTRATES AND APPLIED THERETO
The present invention relates to a vision system used in vacuum deposition equipment and, more specifically, to a vision system for vacuum deposition equipment, the system having a transmissive lighting and a reflective lighting installed therein, and a camera unit for the vision system, which is for alignment of substrates and is provided to be used in a narrow space by using an imaging position control device. The vision system for vacuum deposition equipment according to an aspect of the present invention comprises a lighting unit including a first lighting that irradiates first light and a second lighting that radiates second light. A camera unit for vision systems, which is for alignment of substrates, according to another aspect of the present invention, comprises a beam splitter unit, a lens unit, and a camera unit.
C23C 14/04 - Coating on selected surface areas, e.g. using masks
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H01L 23/544 - Marks applied to semiconductor devices, e.g. registration marks, test patterns
9.
SUBSTRATE SUPPORT APPARATUS AND METHOD FOR MANUFACTURING SUBSTRATE USING THE SAME
A substrate support apparatus reduces sagging of a substrate. The substrate support apparatus includes a plurality of position adjusters arranged in parallel and spaced apart with respect to a first direction; and a plurality of supports connected to the plurality of position adjusters and configured to support a substrate, wherein the plurality of supports are spaced apart from each other under the substrate and are configured to support the substrate, and wherein the plurality of supports are configured to be raised by the plurality of position adjusters.
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
The deposition device according to one aspect of the present invention comprises: a deposition chamber providing a deposition space; a first plate separable from the upper side of the deposition chamber; a second plate disposed above the first plate; a hexapod connected to the second plate and extending toward the deposition space through the first plate; an electrostatic chuck disposed under the hexapod and holding a substrate to which a deposition particle is deposited; a first support part extending into the deposition space from the second plate and supporting a mask facing the substrate; and a vibration prevention part disposed between the first plate and the second plate and preventing vibration of the second plate from being transferred to the first plate.
The present invention relates to a method for aligning substrates and may comprise the steps of: a) after aligning an upper substrate and a lower substrate, obtaining optical images of an upper alignment key of the upper substrate and a lower alignment key of the lower substrate by using vision; b) performing linearization processing on the image of each of the upper alignment key and the lower alignment key, which are obtained in step a), to obtain a linear image indicated by a waveform; and c) processing the linear image by using a smoothing technique to remove a noise component.
H10K 71/10 - Deposition of organic active material
H10K 71/16 - Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
The present invention relates to a method for aligning substrates, and the method may comprise the steps of: (a) aligning a first substrate and a second substrate, and then using vision to obtain optical images of a first alignment key and a second alignment key that include a plurality of key patterns; (b) for each of the key patterns of the first alignment key obtained in step (a), sequentially detecting the distance to each of the key patterns of the second alignment key in order from the closest key pattern to the furthest key pattern along a misalignment direction; (c) standardizing the detected distance values; and (d) obtaining an average value, which is the average of the standardized distance values, and realigning the first and second substrates on the basis of the obtained average value.
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
The present invention relates to a key pattern for initial alignment of substrates, and an initial alignment method using same, the key pattern comprising: a reference key pattern formed on a first substrate and positioned in the center of the angle of view of vision as a division marking pattern in which identification of directions is facilitated; and a relative key pattern formed on a second substrate and formed of a pair of patterns arranged in diagonal directions of the angle of view.
H01L 23/544 - Marks applied to semiconductor devices, e.g. registration marks, test patterns
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
14.
OLEDoS pixel compensation circuit for removing substrate effect, and method for controlling same
The present invention relates to an OLED pixel compensation circuit for removing a substrate effect. The pixel compensation circuit according to the present invention uses six transistors and two storage batteries to fix both a source voltage and a body voltage of a driving transistor that drives an OLED, thereby having the effects of eliminating errors due to a substrate effect and presenting more accurate pixel compensation results.
G09G 3/3233 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element
G09G 3/3266 - Details of drivers for scan electrodes
G09G 3/3291 - Details of drivers for data electrodes in which the data driver supplies a variable data voltage for setting the current through, or the voltage across, the light-emitting elements
15.
OLEDOS PIXEL COMPENSATION CIRCUIT FOR REMOVING SUBSTRATE EFFECT, AND METHOD FOR CONTROLLING SAME
The present invention relates to an OLED pixel compensation circuit for removing a substrate effect. The pixel compensation circuit according to the present invention uses six transistors and two storage batteries to fix both a source voltage and a body voltage of a driving transistor that drives an OLED, thereby having the effects of eliminating errors due to a substrate effect and presenting more accurate pixel compensation results.
G09G 3/3225 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
G09G 3/3266 - Details of drivers for scan electrodes
16.
CRUCIBLE FOR METAL THIN FILM DEPOSITION AND EVAPORATION SOURCE FOR METAL THIN FILM DEPOSITION
An aspect of the present invention provides a crucible for metal thin film deposition, in which a vaporized material of a metal is contained and melted then sublimated by heating to form a metal thin film on a substrate, the crucible comprising: a body part of a container shape with an open upper end; and a stepped part extending inward from an inner wall of the body part so as to form a first melting hole in a depth direction at the center of the body part, wherein a plurality of second melting holes are concentrically formed along the stepped part around the first melting hole.
H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
H01L 21/22 - Diffusion of impurity materials, e.g. doping materials, electrode materials, into, or out of, a semiconductor body, or between semiconductor regionsRedistribution of impurity materials, e.g. without introduction or removal of further dopant
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/324 - Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
The present invention relates to a chemical vapor deposition system using an initiator, the system comprising: a first chamber that forms a polymerization reaction site by feeding an initiator and a monomer in order to cause a polymerization reaction between the initiator and the monomer on the surface of a substrate; a second chamber that forms a polymer through a polymerization reaction between the initiator and the monomer after the substrate having the polymerization reaction site formed thereon by the first chamber is introduced thereinto; a third chamber that stops the reaction in order to control the thickness of deposition by removing the residual initiator after the substrate having the polymer formed thereon is introduced thereinto; and a substrate transfer device for moving the substrate from the first chamber to the third chamber via the second chamber, whereby it is possible to enhance the deposition speed and to reduce the material consumption when carrying out the deposition process using the initiator.
H01L 21/205 - Deposition of semiconductor materials on a substrate, e.g. epitaxial growth using reduction or decomposition of a gaseous compound yielding a solid condensate, i.e. chemical deposition
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
18.
FLEXIBLE SUBSTRATE CHEMICAL VAPOR DEPOSITION SYSTEM
The present invention relates to a chemical vapor deposition system using a flexible substrate. The system according to the present invention comprises: an evaporation source which evaporates a deposition material which is to be deposited on a flexible substrate, and includes a plurality of evaporation nozzles for ejecting the deposition material; a vacuum chamber which includes the evaporation source therein and provides a space in which the deposition material is deposited; a substrate provision device which is provided in the vacuum chamber and provides a flexible substrate on which the deposition material will be deposited; and a supporter which is provided in the vacuum chamber, receives a transfer of the substrate from the substrate provision device, and supports the flexible substrate such that the deposition material can be deposited on the flexible substrate. Here, the supporter has a curved outer surface so as to maintain a constant interval between the plurality of evaporation nozzles and the flexible substrate while the flexible substrate is supported by the supporter, and the plurality of evaporation nozzles are arranged to form a virtual curved surface to correspond to the outer surface of the supporter. Accordingly, the deposition material is deposited on a flexible substrate to have a uniform thickness, thereby increasing production quality.
H01L 21/205 - Deposition of semiconductor materials on a substrate, e.g. epitaxial growth using reduction or decomposition of a gaseous compound yielding a solid condensate, i.e. chemical deposition
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/324 - Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
19.
THIN FILM DEPOSITION APPARATUS HAVING PLURALITY OF CRUCIBLES
The present invention relates to a thin film deposition apparatus, comprising: a deposition chamber in which a substrate is supported; a distribution conduit which sprays, via multiple nozzles formed on an upper portion thereof, a deposition material evaporated from a plurality of crucibles in which the deposition material for being deposited on the substrate is held; a distribution conduit heater which is installed independently so as to be positioned to face the outer surface of the distribution conduit in order to heat the distribution conduit; a crucible heater for heating the crucibles to evaporate the deposition material; and an upper plate, formed on the upper portion of the distribution conduit in which outlets corresponding to the nozzles are formed. As such, the invention can decrease the height of a chamber by decreasing the height of the crucibles, and has an effect of enabling a symmetrical or asymmetrical deposition by independently performing left/right deposition of the substrate.
H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
H01L 21/203 - Deposition of semiconductor materials on a substrate, e.g. epitaxial growth using physical deposition, e.g. vacuum deposition, sputtering
The present invention relates to a thin film deposition device comprising: a deposition chamber in which a substrate is supported; a plurality of crucibles for accommodating deposition materials therein for deposition on the substrate; a plurality of distribution pipes respectively coupled with the crucibles so as to be arranged in a line such that the vaporized deposition materials are sprayed through a plurality of nozzles; a partition provided between the distribution pipes for the uniformity of a thin film to be deposited on the substrate, so as to delimit a spraying range of the vaporized deposition materials; a distribution pipe heater independently provided so as to be positioned to face the outer side of the distribution pipes in order to heat the distribution pipes; a crucible heater for vaporizing the deposition materials by heating the crucibles; and an upper plate having an outlet corresponding to the nozzles so as to be provided on the upper part of the distribution pipes. Therefore, a chamber height can be reduced by reducing the height of a crucible, and left/right deposition of a substrate is independently performed so as to enable symmetric or asymmetric deposition.
H01L 51/56 - Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
H01L 21/203 - Deposition of semiconductor materials on a substrate, e.g. epitaxial growth using physical deposition, e.g. vacuum deposition, sputtering
An evaporation source unit and a deposition device are disclosed. An aspect of the present invention provides an evaporation source unit arranged inside a deposition chamber to conduct deposition with regard to a substrate, the evaporation source unit comprising: a lower case having an open upper end; a heating unit of a barrel shape positioned in the lower case and configured to move up/down; a rail unit coupled to the upper end of the lower case in the transverse direction and configured to guide a straight movement; an upper case having an open lower end mounted on the rail unit such that, as the same moves along the rail unit, the same is integrated with the lower case or separated therefrom; and a crucible positioned in the upper case such that, as the heating unit moves up/down, the crucible is brought into the heating unit or taken out of the same.
A deposition apparatus is disclosed. The deposition apparatus according to one aspect of the present invention comprises: a deposition chamber which is divided into a first deposition area and a second deposition area and in which a first substrate is drawn into and out of the first deposition area in a first radial direction from one central point, and a second substrate is drawn into and out of the second deposition area in a second radial direction from the central point; a linear evaporation source which is disposed within the deposition chamber and jets deposition particles towards the first substrate or the second substrate; an evaporation source transfer unit for having the evaporation source reciprocate between the first deposition area and the second deposition area according to a predetermined movement path; a first substrate loading part, on which the first substrate is loaded and seated, for rotating the first substrate such that one side thereof is perpendicular to the movement path of the first deposition area; and a second substrate loading part, on which the second substrate is loaded and seated, for rotating the second substrate such that one side thereof is perpendicular to the movement path of the second deposition area.
Disclosed are an evaporation source conveying unit, an evaporation device, and an evaporation method. According to one aspect of the present invention, provided is the evaporation source conveying unit which is an evaporation source conveying unit arranged in a deposition chamber and conveying a linear evaporation source, comprising: a lower rail including a first linear rail perpendicular to a first virtual radial direction crossing the deposition chamber at one center point, a second linear rail perpendicular to a second virtual radial direction crossing the deposition chamber at the center point, and a third curved rail connecting the first rail and the second rail; an upper rail including a fourth linear rail which is spaced from the first rail and parallel thereto, a fifth linear rail which is spaced from the second rail and parallel thereto, and a sixth curved rail for connecting the fourth rail and the fifth rail; and a conveying part coupled such that the linear evaporation source is perpendicular to the lower rail and the upper rail and reciprocatingly moves along the lower rail and the upper rail.
Disclosed are an organic substance deposition device and an organic substance deposition method using the same. The present invention relates to an organic substance deposition device and a deposition method using the same, wherein deposition processes are conducted with regard to a plurality of substrates inside a single chamber and, during a deposition process with regard to a substrate, a transfer process or an alignment process with regard to another substrate is conducted, thereby reducing tact time and reducing loss of organic substance materials occurring during processes for transferring or aligning substrates.
Disclosed are a pressing module and a substrate stretching device. Provided is the pressing module for stretching the substrate, comprising: pressing rods for providing vertical pressing force by moving downward from a direction perpendicular to the upper surface of the substrate; and pressing ends for receiving the vertical pressing force, and distributing the vertical pressing force into a vertical component force and a horizontal component force directed at outer end portions of the substrate.
Disclosed are an organic material deposition apparatus and an organic material deposition method using same. The organic material deposition apparatus includes: a main chamber partitioned into a first deposition area and a second deposition area, wherein a first substrate is drawn into and out of the first deposition area in a first radial direction from one central point, and a second substrate is drawn into and out of the second deposition area in a second radial direction from the central point; a first substrate-loading unit in which the first substrate is loaded in the first radial direction and received; a second substrate-loading unit in which the second substrate is loaded in the second radial direction and received; a scanner having a linearly-shaped organic material deposition source which injects organic material particles, a source-moving means to which the organic material deposition source is coupled and which linearly moves the organic material deposition source along the surface of the first substrate or second substrate such that the organic material particles are injected onto the surface of the first substrate or second substrate, and a rotating means which rotates the source-moving means such that the linearly-shaped organic material deposition source is parallel to one side of the first substrate or second substrate; and a scanner-moving means which enables the scanner to reciprocate such that the scanner is positioned in the first deposition area or second deposition area.
Provided are an evaporator for fabricating an organic light emitting device, and a vacuum deposition apparatus including the evaporator. The evaporator includes a pot storing organic matter, a pot cover covering an opening of the pot, and evaporation outlets spaced apart from each other to evaporate the organic matter. The evaporator further includes a shield plate disposed over the pot cover and preventing heat radiation, and a heating member preventing the clogging of the evaporation outlets between the pot cover and the shield plate. The evaporation outlets, evaporating organic matter, are different from each other in length to improve the uniformity of a deposited thin film and prevent the loss of the organic matter. The shield plate, preventing heat radiation to a substrate, protects the substrate or a thin film on the substrate from thermal damage.
patents
