ShenZhen Sunlord Electronics Co., Ltd.

China

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IPC Class
H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets 15
H01F 27/29 - TerminalsTapping arrangements 14
H01F 27/28 - CoilsWindingsConductive connections 10
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils 8
H01F 27/24 - Magnetic cores 6
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Status
Pending 4
Registered / In Force 18
Found results for  patents

1.

PROCESSING METHOD OF SURFACE-MOUNTED TRANSFORMER

      
Application Number 19021078
Status Pending
Filing Date 2025-01-14
First Publication Date 2025-05-15
Owner Shenzhen Sunlord Electronics Co., Ltd. (China)
Inventor
  • Lin, Hui
  • Xie, Wei

Abstract

A processing method of a surface-mounted transformer, comprising the following steps: hanging lead starting ends on electrodes and conducting welding and fixation by hot pressing; winding, wherein a coil is wound on a middle pillar of an I-shaped magnetic core; hanging lead finishing ends on the electrodes and conducting welding and fixation by hot pressing to obtain a winding product; leading out leading-out ends of the coil in a right-angle manner relative to connecting lines of the electrodes on a same side and conducting welding and fixation by hot pressing; molding pressing and solidifying forming, wherein a magnetic molding material is injected into a mold cavity in which the winding product is stored for mold pressing, solidifying forming is carried out and finally, an adhesive layer coating structure is formed around the winding product; finally, demolding. The product is high in reliability and can support a PSIP plastic package environment.

IPC Classes  ?

  • H01F 27/29 - TerminalsTapping arrangements
  • H01F 1/34 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
  • H01F 27/255 - Magnetic cores made from particles
  • H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
  • H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils

2.

Manufacturing method of molded-forming power inductor

      
Application Number 18813011
Status Pending
Filing Date 2024-08-22
First Publication Date 2024-12-12
Owner Shenzhen Sunlord Electronics Co., Ltd. (China)
Inventor
  • Xia, Shengcheng
  • Yu, Xinshu
  • Li, Youyun
  • Che, Xin

Abstract

A method is provided for manufacturing the molded-forming power inductor. The molding package layer completely covers the prefabricated magnetic core and a part of the conductor except the electrode, the structure is integrally formed, and the leakage magnetic flux is less; when the equivalent magnetic permeability is 60 or more, the equivalent saturation magnetic flux density can be 0.55T or higher; and the space utilization rate is high to facilitate miniaturization of an inductor design.

IPC Classes  ?

  • H01F 27/34 - Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
  • H01F 27/24 - Magnetic cores
  • H01F 27/29 - TerminalsTapping arrangements
  • H01F 27/33 - Arrangements for noise damping
  • H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
  • H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils

3.

Nonlinear inductor, manufacturing method thereof, and nonlinear inductor row

      
Application Number 17714167
Grant Number 12494315
Status In Force
Filing Date 2022-04-06
First Publication Date 2023-07-06
Grant Date 2025-12-09
Owner Shenzhen Sunlord Electronics Co., Ltd. (China)
Inventor
  • Guo, Hai
  • Xia, Shengcheng
  • Hou, Qintian

Abstract

Disclosed is a nonlinear inductor, a manufacturing method thereof, and a nonlinear inductor row. The nonlinear inductor includes two magnetic core assemblies, a conductor and a magnetic plastic encapsulation layer; the magnetic core assemblies include magnetic cores; each magnetic core includes a flange and a central column arranged on the flange; two central columns of the two magnetic core assemblies are opposite to each other; a non-uniform air gap exists between the two central columns and/or the magnetic core assemblies are made of different materials; the conductor is arranged on the two central columns; the two magnetic core assemblies and the conductor are located in the magnetic plastic encapsulation layer; electrode parts of the conductor are exposed outside the magnetic plastic encapsulation layer; and the magnetic core assemblies and the magnetic plastic encapsulation layer are made of different materials; thereby the nonlinear inductor has stepped saturation characteristics.

IPC Classes  ?

  • H01F 27/02 - Casings
  • H01F 27/26 - Fastening parts of the core togetherFastening or mounting the core on casing or support
  • H01F 27/29 - TerminalsTapping arrangements
  • H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
  • H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils

4.

Inductor with special-shaped structure and manufacturing method thereof

      
Application Number 17707933
Grant Number 12387866
Status In Force
Filing Date 2022-03-29
First Publication Date 2023-05-25
Grant Date 2025-08-12
Owner Shenzhen Sunlord Electronics Co., Ltd. (China)
Inventor
  • Guo, Hai
  • Xia, Shengcheng
  • Hou, Qintian

Abstract

An inductor with the special-shaped structure includes an inductor main body and a pair of supporting legs fixed below the inductor main body, wherein the pair of supporting legs is conductors and is electrically connected to a pair of electrodes of the inductor main body, and the pair of supporting legs is configured to support the inductor main body during installation, so that a gap space is left below the inductor main body. Due to the unique structural design of the inductor in the present invention, the utilization ratio of the area of the PCB can be effectively increased, and the inductor is particularly suitable for very-high-density component installation on the PCB during power application. Moreover, by changing relative positions of the supporting legs, lower cavities with different sizes may be formed below the inductor main body, thereby facilitating optimal design for meeting different demands.

IPC Classes  ?

  • H01F 27/06 - Mounting, supporting, or suspending transformers, reactors, or choke coils
  • H01F 27/29 - TerminalsTapping arrangements
  • H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets

5.

Surface-mounted transformer and processing method thereof

      
Application Number 17527189
Grant Number 12266467
Status In Force
Filing Date 2021-11-16
First Publication Date 2022-06-02
Grant Date 2025-04-01
Owner Shenzhen Sunlord Electronics Co., Ltd. (China)
Inventor
  • Zeng, Deping
  • Lin, Hui
  • Tang, Xiaohu
  • Zhou, Qunsheng
  • Xie, Wei
  • He, Yongming

Abstract

A surface-mounted transformer includes an adhesive layer and a winding product. The winding product is disposed inside the adhesive layer; the winding product includes an I-shaped magnetic core and a coil wound on a middle pillar of the I-shaped magnetic core; leading-out ends of the coil are connected to electrodes; the electrodes are exposed on the surface of the adhesive layer; and the adhesive layer is obtained through compression molding forming of a magnetic molding material. Compared with a surface-mounted transformer in the prior art, which has equal performance indexes, the surface-mounted transformer has a smaller size with a decrease proportion of over 50%; and a BOBBIN and an insulating rubber tape do not need to be used in processing. The winding product in the surface-mounted transformer is completely covered by the adhesive layer, so that the product is high in reliability and can support a PSIP plastic package environment.

IPC Classes  ?

  • H01F 27/28 - CoilsWindingsConductive connections
  • H01F 1/34 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
  • H01F 27/255 - Magnetic cores made from particles
  • H01F 27/29 - TerminalsTapping arrangements
  • H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
  • H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils

6.

Manufacturing method of an integrally formed inductor

      
Application Number 17322920
Grant Number 12148564
Status In Force
Filing Date 2021-05-18
First Publication Date 2022-05-19
Grant Date 2024-11-19
Owner Shenzhen Sunlord Electronics Co., Ltd. (China)
Inventor
  • Yu, Xinshu
  • Li, Youyun
  • Xia, Shengcheng
  • Yao, Zehong
  • Hong, Yupeng
  • Wang, Yingying
  • Su, Qiang
  • Yi, Wanhe
  • Che, Xin

Abstract

A manufacturing method of an integrally formed inductor, comprises: sintering a soft magnetic material to prepare a magnetic core plate with a plurality of grooves; respectively putting hollow coils into the plurality of grooves; putting a magnetic core plate provided with coils into a forming die, adding a soft magnetic material in a fluid state, and integrally forming the soft magnetic material in the fluid state on the magnetic core plate through pressing; coating semi-finished inductors with an insulating material to form an insulating coating layer, and exposing only two terminals of the coils; areas where the coil terminals are exposed on a surface of the insulating coating layer being metallized to form electrodes of the integrally formed inductor. Therefore, the disclosure provides a manufacturing method of an integrally formed inductor which is subminiature in size, ultra-thin and high in reliability.

IPC Classes  ?

  • H01F 7/06 - ElectromagnetsActuators including electromagnets
  • H01F 1/24 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
  • H01F 17/04 - Fixed inductances of the signal type with magnetic core
  • H01F 27/255 - Magnetic cores made from particles
  • H01F 27/29 - TerminalsTapping arrangements
  • H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets

7.

Winding structure for inductor and method for manufacturing the same, winding inductor and method for manufacturing the same

      
Application Number 17200887
Grant Number 11854735
Status In Force
Filing Date 2021-03-14
First Publication Date 2022-05-19
Grant Date 2023-12-26
Owner Shenzhen Sunlord Electronics Co., Ltd. (China)
Inventor
  • Su, Qiang
  • Li, Youyun
  • Xia, Shengcheng
  • Yu, Xinshu

Abstract

A winding structure includes a coil having a wire wrap and two wire tails, and a magnetic core having a center column, a flange, four wire-hanging parts and two bosses; the center column is connected at a top surface of the flange, the first boss is disposed in the middle of a first side of the flange, and the second boss is symmetrical to the first boss; transition surfaces of wire-hanging parts to a bottom surface of the flange are chamfered surfaces; first to fourth sections of the first wire tail are sequentially attached to the first wire-hanging part and the first chamfered surface, the bottom surface of the flange, the third chamfered surface, the third wire-hanging part, and the top surface of the flange; first to fourth sections of the second wire tail are symmetrical to first to fourth sections of the first wire tail, respectively.

IPC Classes  ?

  • H01F 27/29 - TerminalsTapping arrangements
  • H01F 27/30 - Fastening or clamping coils, windings, or parts thereof togetherFastening or mounting coils or windings on core, casing, or other support
  • H01F 41/061 - Winding flat conductive wires or sheets
  • H01F 27/24 - Magnetic cores
  • H01F 27/28 - CoilsWindingsConductive connections

8.

Laminated shielding inductor

      
Application Number 17472720
Grant Number 12073984
Status In Force
Filing Date 2021-09-13
First Publication Date 2022-04-14
Grant Date 2024-08-27
Owner Shenzhen Sunlord Electronics Co., Ltd. (China)
Inventor
  • Yang, Yihua
  • Chen, Xianren
  • Wu, Zhongdong

Abstract

A laminated shielding inductor includes a laminated body, an internal coil, and a shielding cover; the laminated body includes a plurality of insulator layers; shielding conductor through grooves which are located at the periphery of the internal coil are formed in the plurality of insulator layers; shielding conductors are arranged in the shielding conductor through grooves, are electrically and mutually connected and jointly form a shielding conductor laminated layer; a shielding conductor upper layer and a shielding conductor lower layer are respectively arranged above and below the internal coil; and the shielding conductor laminated layer, the shielding conductor upper layer and the shielding conductor lower layer are closed to form the shielding cover. Thus, high shielding effect of the laminated chip inductor can be realized, external radiation of the laminated chip inductor is effectively reduced, and the reliability of a circuit system is improved.

IPC Classes  ?

  • H01F 27/28 - CoilsWindingsConductive connections
  • H01F 17/00 - Fixed inductances of the signal type
  • H01F 27/29 - TerminalsTapping arrangements
  • H01F 27/32 - Insulating of coils, windings, or parts thereof

9.

Laminated Electronic Device and Manufacturing Method Thereof

      
Application Number 17412228
Status Pending
Filing Date 2021-08-25
First Publication Date 2022-04-14
Owner Shenzhen Sunlord Electronics Co., Ltd. (China)
Inventor
  • Lu, Dafu
  • Qin, Jieyong
  • Liang, Zhenren
  • Li, Shuyan

Abstract

A laminated electronic device includes a laminate wherein the laminate includes a plurality of laminated insulator layers, the laminate has a multi-layer coil pattern provided between the plurality of insulator layers in a laminated manner, adjacent layers of the coil pattern are electrically connected through conductive via holes to form an internal coil, a first external electrode and a second external electrode are disposed on a bottom surface of the laminate which is parallel to a direction of lamination. In surface-mounting of the laminated electronic device, it only needs to connect the external electrodes on the bottom surface of the laminate to a soldering board, and needs not to preserve a space for solder wicking in the surrounding, thereby significantly saving the occupied space of surface mount components to achieve high-density mounting; in addition, the Q value of the product is improved.

IPC Classes  ?

  • H01F 27/28 - CoilsWindingsConductive connections
  • H01F 27/29 - TerminalsTapping arrangements
  • H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
  • H01F 41/10 - Connecting leads to windings

10.

Inductive component and manufacturing method therefor

      
Application Number 17211789
Grant Number 12224106
Status In Force
Filing Date 2021-03-24
First Publication Date 2021-10-21
Grant Date 2025-02-11
Owner Shenzhen Sunlord Electronics Co., Ltd. (China)
Inventor
  • Wang, Yingying
  • Yu, Xinshu
  • Xia, Shengcheng
  • Li, Youyun

Abstract

An inductive component comprises a hollow coil wound by Litz wire, a magnetic plastic packaging layer covering the coil, and a first electrode and a second electrode of the coil. The first electrode and the second electrode are exposed outside the magnetic plastic packaging layer. A manufacturing method for the inductive component comprises: winding a hollow coil by using Litz wire; connecting two leading-out terminals of the coil to portions of a leadframe to be formed into two electrodes; manufacturing a formed magnetic plastic packaging layer on the periphery of the coil; curing the magnetic plastic packaging layer through heat treatment; and carrying out leadframe cutting on the cured semi-finished product to form the two electrodes exposed outside the magnetic plastic packaging layer, and bending the two electrodes to flatly extend to the surface of the magnetic plastic packaging layer.

IPC Classes  ?

  • H01F 27/28 - CoilsWindingsConductive connections
  • H01F 27/02 - Casings
  • H01F 27/29 - TerminalsTapping arrangements
  • H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
  • H01F 41/10 - Connecting leads to windings

11.

Molded-forming power inductor and manufacturing method thereof

      
Application Number 17238224
Grant Number 12100543
Status In Force
Filing Date 2021-04-23
First Publication Date 2021-09-30
Grant Date 2024-09-24
Owner Shenzhen Sunlord Electronics Co., Ltd. (China)
Inventor
  • Wang, Yingying
  • Yu, Xinshu
  • Xia, Shengcheng
  • Li, Youyun
  • Che, Xin

Abstract

A molded-forming power inductor comprises a conductor, a magnetic core and a magnetic molding package layer, wherein the conductor comprises an integrally formed insulation-processed base part, an insulation-processed side enclosing part and an electrode part, the base part and the side enclosing part are assembled with the magnetic core in a gapless fit mode, and the magnetic molding package layer is gaplessly wrapped outside the conductor and the magnetic core. A method is provided for manufacturing the molded-forming power inductor. The molding package layer completely covers the prefabricated magnetic core and a part of the conductor except the electrode, the structure is integrally formed, and the leakage magnetic flux is less; when the equivalent magnetic permeability is 60 or more, the equivalent saturation magnetic flux density can be 0.55 T or higher; and the space utilization rate is high to facilitate miniaturization of an inductor design.

IPC Classes  ?

  • H01F 27/28 - CoilsWindingsConductive connections
  • H01F 27/24 - Magnetic cores
  • H01F 27/29 - TerminalsTapping arrangements
  • H01F 27/33 - Arrangements for noise damping
  • H01F 27/34 - Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
  • H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
  • H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils

12.

Metal soft magnetic composite material inductor and preparation method thereof

      
Application Number 17211775
Grant Number 11685980
Status In Force
Filing Date 2021-03-24
First Publication Date 2021-07-08
Grant Date 2023-06-27
Owner Shenzhen Sunlord Electronics Co., Ltd. (China)
Inventor
  • Yu, Xinshu
  • Xia, Shengcheng
  • Li, Youyun
  • Che, Xin

Abstract

A preparation method for a metal soft magnetic composite material inductor includes: smelting Fe, Si and Cr and then employing a water atomization or gas atomization means to fabricate an alloy powder; after sifting by particle size, mixing powders of different particle size levels and performing coating insulation, and performing post-granulation to obtain a metal soft composite material granulation powder; adopting the granulation powder to press a material cake, and transferring and molding same; adopting a hollow coil in a liquid-phase coating mold cavity, curing and demolding to obtain a semi-finished product, then continuously heating and curing the semi-finished product, and preparing an end electrode to obtain a finished inductor.

IPC Classes  ?

  • C22C 38/34 - Ferrous alloys, e.g. steel alloys containing chromium with more than 1.5% by weight of silicon
  • B22F 9/08 - Making metallic powder or suspensions thereofApparatus or devices specially adapted therefor using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
  • H01F 1/01 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials
  • H01F 1/26 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
  • H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
  • B22F 1/102 - Metallic powder coated with organic material
  • H01F 3/08 - Cores, yokes or armatures made from powder
  • B22F 1/10 - Metallic powder containing lubricating or binding agentsMetallic powder containing organic material
  • C22C 1/10 - Alloys containing non-metals

13.

Preparation method for an inductance component

      
Application Number 17211811
Grant Number 12040120
Status In Force
Filing Date 2021-03-24
First Publication Date 2021-07-08
Grant Date 2024-07-16
Owner Shenzhen Sunlord Electronics Co., Ltd. (China)
Inventor
  • Su, Qiang
  • Yu, Xinshu
  • Xia, Shengcheng
  • Li, Youyun

Abstract

A preparation method for an inductance component, comprising: prefabricating a continuous coil row containing a plurality of hollow coils with the connections of every two adjacent hollow coils being bent feet; placing the continuous coil row into a cavity of a prefabricated mold, the cavity comprising a plurality of sub-chambers and one sub-chamber being used for placing a hollow coil; injecting the prepared soft-magnetic magnetic glue into the cavity to enable the soft-magnetic magnetic glue to coat the hollow coil, and simultaneously exposing the bent feet to the outside to perform magnet forming; cutting the formed semi-finished product; and peeling the exposed bent foot copper wire, and performing metallization to form an electrode to obtain a finished product of the inductance component. The invention has high inductance preparation efficiency, and the obtained product electrode has no risks of a dry joint, poor contact, and the like.

IPC Classes  ?

  • H01F 7/06 - ElectromagnetsActuators including electromagnets
  • H01F 27/24 - Magnetic cores
  • H01F 27/28 - CoilsWindingsConductive connections
  • H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
  • H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils

14.

Integrally-Molded Inductor and Method for Manufacturing Same

      
Application Number 16999042
Status Pending
Filing Date 2020-08-20
First Publication Date 2020-12-03
Owner Shenzhen Sunlord Electronics Co., Ltd. (China)
Inventor
  • Xia, Shengcheng
  • Xiao, Gengxin
  • Yu, Xinshu

Abstract

An integrally-molded inductor comprises a coil having an insulation coating layer and a magnetic material integrally molded with the coil by compression molding, with electrodes, which are exposed outside the magnetic material, formed at two ends of the coil, wherein the insulation coating layer of the coil comprises a non-conductive inorganic particle component and a resin component which are uniformly mixed, the inorganic particle component and the resin component being in a ratio by weight percentage of 70%:30% to 90%:10%. According to the integrally-molded inductor and a method for manufacturing same, the pressure resistance of the integrally-molded inductor is improved, and the electrical properties and reliability of the inductor product are improved.

IPC Classes  ?

  • H01F 1/153 - Amorphous metallic alloys, e.g. glassy metals
  • H01F 17/04 - Fixed inductances of the signal type with magnetic core
  • H01F 41/26 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates from liquids using electric currents
  • H01F 41/22 - Heat treatmentThermal decompositionChemical vapour deposition
  • H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets

15.

Switching power supply module and packaging method thereof

      
Application Number 15931609
Grant Number 11657947
Status In Force
Filing Date 2020-05-14
First Publication Date 2020-08-27
Grant Date 2023-05-23
Owner Shenzhen Sunlord Electronics Co., Ltd. (China)
Inventor
  • Wang, Wenjie
  • Lu, Dafu

Abstract

A switching power supply module includes a power inductor which includes a magnetic core and L-shaped metal end electrodes and a switching power supply chip which includes a packaging body, a bare chip and a bottom bonding pad of the bare chip; the L-shaped metal end electrode includes a first electrode part which is welded at 90° to the magnetic core and a second electrode part which extends in parallel from the first electrode part to the middle of the magnetic core and is perpendicular to the first electrode part; the bare chip and the packaging body are embedded between the first, the second electrode part and the magnetic core; the bottom bonding pad abuts between the two second electrode parts and is insulated from the second electrode part, and the weld face of the bottom bonding pad is flush with that of the second electrode part.

IPC Classes  ?

  • H01F 27/28 - CoilsWindingsConductive connections
  • H01F 27/24 - Magnetic cores
  • H01F 27/29 - TerminalsTapping arrangements
  • H01L 23/495 - Lead-frames
  • H01L 23/00 - Details of semiconductor or other solid state devices
  • H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
  • H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets

16.

Inductive element and manufacturing method

      
Application Number 15973516
Grant Number 11309117
Status In Force
Filing Date 2018-05-07
First Publication Date 2019-09-26
Grant Date 2022-04-19
Owner Shenzhen Sunlord Electronics Co., Ltd. (China)
Inventor
  • Xia, Shengcheng
  • Li, Youyun
  • Yu, Xinshu
  • Xiao, Gengxin

Abstract

An inductive element includes a magnetic core, a flat coil wound on a middle column of the magnetic core, and a magnetic plastic package layer covering the magnetic core and the flat coil. Two electrodes connected to two pigtails of the flat coil are exposed outside of the magnetic plastic package layer. The flat coil is configured to enable a width direction of a flat wire of the flat coil to be perpendicular to an axial direction of the middle column of the magnetic core, and the flat wire is stacked layer by layer in the axial direction of the middle column. A manufacturing method for the inductive element is also disclosed herein. By using the wounding method of the flat coil of the inductive element, a height of a product may be reduced while obtaining a same DCR, so that the product is thinner.

IPC Classes  ?

  • H01F 27/24 - Magnetic cores
  • H01F 27/02 - Casings
  • H01F 27/28 - CoilsWindingsConductive connections
  • H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
  • H01F 1/147 - Alloys characterised by their composition
  • H01F 41/061 - Winding flat conductive wires or sheets
  • H01F 27/29 - TerminalsTapping arrangements

17.

Electronic device and ceramic back cover used in electronic device

      
Application Number 15912503
Grant Number 10224984
Status In Force
Filing Date 2018-03-05
First Publication Date 2019-03-05
Grant Date 2019-03-05
Owner Shenzhen Sunlord Electronics Co., Ltd. (China)
Inventor
  • Li, Youyun
  • Zhu, Yanjun

Abstract

Disclosed is a ceramic back cover used in an electronic device and an electronic device having the ceramic back cover. A wireless charging RX coil is disposed on an inner surface of the ceramic back cover, a groove used for disposing the wireless charging RX coil is in an intermediate region of the inner surface of the ceramic back cover, and at least two wireless charging RX electrode grooves that extend outward separately from an intermediate region of the groove and a marginal region of the groove are formed on the inner surface of the ceramic back cover. Electrodes formed in the at least two wireless charging RX electrode grooves are used as leading-out ends of the wireless charging RX coil disposed in the groove, and two ends of the wireless charging RX coil are welded at the leading-out ends.

IPC Classes  ?

  • H02J 50/10 - Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
  • H04B 5/00 - Near-field transmission systems, e.g. inductive or capacitive transmission systems
  • H02J 7/02 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries for charging batteries from AC mains by converters

18.

Method for preparing a composite wire and a power inductor

      
Application Number 15869054
Grant Number 10867748
Status In Force
Filing Date 2018-01-12
First Publication Date 2018-05-17
Grant Date 2020-12-15
Owner Shenzhen Sunlord Electronics Co., Ltd. (China)
Inventor
  • Xia, Shengcheng
  • Li, Youyun

Abstract

A method for preparing a power inductor includes the following steps A to E: A: preparing a composite wire; B: winding the composite wire according to a predetermined shape and a predetermined coil quantity, so as to form coils; C: placing the coils into a mold cavity, adding metal soft magnetic powder to the mold cavity, and pressing the metal soft magnetic powder and the coils to form a base comprising the coils; D: performing sintering treatment on the base; and E: plating two terminal electrodes on two ends of the base to form the power inductor.

IPC Classes  ?

  • H01F 41/12 - Insulating of windings
  • H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
  • H01B 13/00 - Apparatus or processes specially adapted for manufacturing conductors or cables
  • H01B 13/012 - Apparatus or processes specially adapted for manufacturing conductors or cables for manufacturing wire harnesses
  • H01B 3/10 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances metallic oxides
  • H01B 13/16 - Insulating conductors or cables by passing through, or dipping in, a liquid bathInsulating conductors or cables by spraying
  • H01F 41/061 - Winding flat conductive wires or sheets
  • H01F 41/32 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film
  • H01F 41/26 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates from liquids using electric currents
  • H01B 7/02 - Disposition of insulation
  • H01B 7/18 - Protection against damage caused by external factors, e.g. sheaths or armouring by wear, mechanical force or pressure
  • H01B 7/28 - Protection against damage caused by external factors, e.g. sheaths or armouring by moisture, corrosion, chemical attack or weather
  • H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys

19.

Metal matrix composite wire, power inductor, and preparation methods for same

      
Application Number 15865291
Grant Number 10811188
Status In Force
Filing Date 2018-01-09
First Publication Date 2018-05-10
Grant Date 2020-10-20
Owner Shenzhen Sunlord Electronics Co., Ltd. (China)
Inventor
  • Xia, Shengcheng
  • Li, Youyun

Abstract

A preparation method for a metal matrix composite wire includes the following steps: 1) preparing a metal inner core; 2) preparing a glass-resin mixture; 3) dissolving self-adhesive resin in a solvent to prepare a self-adhesive resin solution; 4) uniformly coating the glass-resin mixture on a surface of the metal inner core, then coating the self-adhesive resin solution on a surface of the glass-resin mixture, and performing drying at a temperature of 80° C. to 150° C.; and 5) repeating the step 4) until a thickness of the glass-resin mixture plus the self-adhesive resin reaches 2 to 10 μm. When an inductor is prepared by using the composite wire, the inductor may have relatively good weather resistance, a relatively good dielectric voltage-withstand capability, as well as relatively good high-temperature resistance and electrical performance.

IPC Classes  ?

  • H01F 41/076 - Forming taps or terminals while winding, e.g. by wrapping or soldering the wire onto pins, or by directly forming terminals from the wire
  • H01B 13/06 - Insulating conductors or cables
  • H01F 41/064 - Winding non-flat conductive wires, e.g. rods, cables or cords
  • H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
  • C03C 14/00 - Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
  • H01F 41/12 - Insulating of windings
  • H01B 3/08 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartzInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances glassInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances glass woolInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances slag woolInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances vitreous enamels
  • H01F 27/255 - Magnetic cores made from particles
  • B05D 3/02 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
  • B05D 3/12 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
  • C03C 8/16 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions with vehicle or suspending agents, e.g. slip
  • H01B 7/02 - Disposition of insulation
  • H01F 27/28 - CoilsWindingsConductive connections
  • H01F 27/29 - TerminalsTapping arrangements
  • H01F 41/06 - Coil winding

20.

Low-temperature co-fired ceramic material and preparation method thereof

      
Application Number 15693448
Grant Number 10179749
Status In Force
Filing Date 2017-08-31
First Publication Date 2018-03-01
Grant Date 2019-01-15
Owner Shenzhen Sunlord Electronics Co., Ltd. (China)
Inventor
  • Liu, Jian
  • Nie, Min

Abstract

2. A preparation method comprises the following steps: ball milling and mixing according to the formula, sintering at a high temperature, quenching in deionized water, grinding, performing wet ball-milling, drying and grinding; and finally, granulating to prepare a green body, discharging glue, and sintering, to obtain a low-temperature co-fired ceramic material. According to the low-temperature co-fired ceramic material and the preparation method thereof provided in the present disclosure, the prepared low-temperature co-fired ceramic material has the advantages of low dielectric constant, low loss, good overall performance and the like.

IPC Classes  ?

  • C03C 10/00 - Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
  • C03B 1/00 - Preparing the batches
  • C03B 19/06 - Other methods of shaping glass by sintering
  • C03C 3/093 - Glass compositions containing silica with 40% to 90% silica by weight containing boron containing aluminium containing zinc or zirconium
  • C03C 4/16 - Compositions for glass with special properties for dielectric glass

21.

CBS-based LTCC material and preparation method thereof

      
Application Number 15693423
Grant Number 10160689
Status In Force
Filing Date 2017-08-31
First Publication Date 2018-01-18
Grant Date 2018-12-25
Owner Shenzhen Sunlord Electronics Co., Ltd. (China)
Inventor
  • Liu, Jian
  • Nie, Min

Abstract

5 as a final sintering aid, to prepare the material. In the present invention, a CBS-based LTCC material that is obtained by sintering at a low temperature and has the advantages of low dielectric constant, low loss, and good overall performance is provided.

IPC Classes  ?

  • C04B 35/22 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on silicates other than clay rich in calcium oxide
  • C04B 35/626 - Preparing or treating the powders individually or as batches
  • C04B 35/63 - Preparing or treating the powders individually or as batches using additives specially adapted for forming the products
  • C04B 35/64 - Burning or sintering processes
  • B28B 3/02 - Producing shaped articles from the material by using pressesPresses specially adapted therefor wherein a ram exerts pressure on the material in a moulding spaceRam heads of special form
  • B28B 11/24 - Apparatus or processes for treating or working the shaped articles for curing, setting or hardening

22.

Method for manufacturing laminated coil devices

      
Application Number 13978542
Grant Number 09251952
Status In Force
Filing Date 2012-03-23
First Publication Date 2015-01-22
Grant Date 2016-02-02
Owner ShenZhen Sunlord Electronics Co., Ltd. (China)
Inventor
  • Li, Youyun
  • Lu, Dafu
  • Zhang, Yang
  • Yuan, Cong

Abstract

A method of manufacturing a laminated coil device includes conductors for forming coils and insulation stacking for forming laminated bodies, and further includes the steps of: (A) manufacturing ceramic insulating thin sheets; (B) forming ceramic insulating thin sheets with conductive through-holes; (C) manufacturing coil thin sheets with coil conductors so as to embed the coil conductors inside the ceramic insulating thin sheets; (D) orderly stacking and cutting ceramic insulating thin sheets and coil thin sheets with coil conductors into unit sizes in order to obtain laminated bodies; (E) heating the laminated bodies in order to remove the binder, and then sintering the laminated bodies; (F) coating the conductive paste on the two ends of the laminated bodies so as to form external electrodes. Thus, the present invention is to provide a manufacturing method of producing a laminated coil power device with low direct current resistance, no delamination, no air space, and no lamination cracking.

IPC Classes  ?

  • H01F 7/06 - ElectromagnetsActuators including electromagnets
  • H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
  • H01F 17/00 - Fixed inductances of the signal type