An optical component (11) can include a chip comprising a carrier substrate (13) made of a semiconductor material and a membrane (15) disposed on a planar membrane-carrying surface of the carrier substrate (13). The membrane (15) is formed integrally with the carrier substrate (13). A cavity (14) is formed in the carrier substrate (13), the cavity having a first end and a second end. The membrane (15) has a cavity-spanning portion that spans the cavity (14) at its first end. The cavity-spanning portion of the membrane (15) is transparent to light in a desired wavelength range. An optical element (16) for shaping, diffusing, or filtering the light is formed on or in the cavity-spanning portion of the membrane (15). The optical component (11) may be manufactured in a wafer-level process. Also disclosed is an optoelectronic module that includes the optical component (11) together with an optoelectronic device.
A photoacoustic gas sensor device for determining a value indicative of a presence or a concentration of a chemical component in a gas comprises a substrate and a measurement cell body arranged on a first side of the substrate. The substrate and the measurement cell body define a measurement cell. A cap is arranged on the first side of the substrate within the measurement cell. The cap and the substrate define a cap volume. The cap and the substrate acoustically seal the cap volume. A measurement volume is confined by the measurement cell body, the substrate and the cap. An aperture is provided in the measurement cell for the gas to enter the measurement volume. Electrical components are arranged on the first side of the substrate and in the measurement cell.
A sensor device (10) comprises an environmental sensor (22) for determining an environmental parameter associated with a sensor gas flow (F2) through the sensor device. The environmental sensor may be a particulate matter sensor for detecting particulate matter in the sensor gas flow. The sensor gas flow is preheated upstream of the environmental sensor (22). To this end, waste heat generated by the environmental sensor (22) itself and/or by a different sensor (12) that is comprised in the sensor device is used. In this manner, the effects of evaporable droplets in the sensor gas flow (F2), as typically present in fog, may be reduced. In some embodiments, a fog signal is derived.
An optical component (11) can include a chip comprising a carrier substrate (13) made of a semiconductor material and a membrane (15) disposed on a planar membrane-carrying surface of the carrier substrate (13). The membrane (15) is formed integrally with the carrier substrate (13). A cavity (14) is formed in the carrier substrate (13), the cavity having a first end and a second end. The membrane (15) has a cavity-spanning portion that spans the cavity (14) at its first end. The cavity-spanning portion of the membrane (15) is transparent to light in a desired wavelength range. An optical element (16) for shaping, diffusing, or filtering the light is formed on or in the cavity-spanning portion of the membrane (15). The optical component (11) may be manufactured in a wafer-level process. Also disclosed is an optoelectronic module that includes the optical component (11) together with an optoelectronic device.
In a method for manufacturing an electrochemical gas sensor for sensing a target gas, a semi-manufactured gas sensor is provided. The semi-manufactured gas sensor comprises a substrate supporting an arrangement comprising a thin film of a thickness s≤5 pm arranged between a sensing electrode configured to chemically interact with the target gas and a reference electrode facing the substrate. The thin film is an electronically non-conducting and ionically non-conducting ceramic or glass. The arrangement then is heated to an annealing temperature for irreversibly turning the thin film into an ionic conductor by incorporating mobile ions released from the sensing electrode in response to the heating.
In a method of determining a flow rate of a flow of a fluid of interest in a fluidic system, a raw flow rate signal (Qsensor) is determined using a flow rate sensor. The raw flow rate signal is corrected using a flow rate correction function (Δ) to obtain a corrected flow rate signal (Qsensor,corr). The flow rate correction compensates for a flow rate signal error that is caused by integration of the flow rate sensor into the fluidic system. It is based on a reference correction function (δ) that is indicative of a flow rate signal error for a flow of a reference fluid due to the integration of the flow rate sensor into the fluidic system.
G01N 11/04 - Investigating flow properties of materials, e.g. viscosity or plasticityAnalysing materials by determining flow properties by measuring flow of the material through a restricted passage, e.g. tube, aperture
G01F 1/84 - Coriolis or gyroscopic mass flowmeters
A quantum cascade laser or interband cascade laser for outputting a frequency comb. The laser's active waveguide comprises a combination of narrow and wide sections which are engineered in combination such that the laser is operable to produce lasing only in the fundamental mode across the operating wavelength range, the narrow section squeezing light propagating in the waveguide to output a frequency comb via four-wave mixing. The narrow and wide sections are further engineered to reduce the waveguide's net GVD, and also to reduce the GVD variation across the operating range compared to a comparable waveguide that is of constant width, thus producing a more stable frequency comb. The proportion of the laser's full dynamic range (i.e. from threshold to the rollover current where the maximum output power is achieved) over which lasing remains in the frequency comb regime is thereby increased compared with a constant width single mode waveguide.
H01S 5/34 - Structure or shape of the active regionMaterials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
H01S 5/10 - Construction or shape of the optical resonator
8.
METHOD, DEVICE, SENSOR CARTRIDGE AND KIT OF PARTS FOR CULTURING AND DETECTING MICROORGANISMS
The invention relates to a method for culturing and detecting microorganisms, comprising the steps of providing a liquid sample (S) in a barrel (10) of a device (1) for culturing and detecting microorganisms, passing the liquid sample (S) through a first filtering membrane (40) such that microorganisms contained in the liquid sample (S) are retained at a first side (41) of the first filtering membrane (40), contacting said first side (41) with a first growth medium (210) capable of supporting growth of microorganisms, incubating the first filtering membrane (40) and the first growth medium (210) at an incubation temperature, arranging a sensing surface (51) of a gas sensor (50) in fluid connection with a second side (42) of the first filtering membrane (40), detecting a metabolic gas released by the microorganisms by means of the gas sensor (50). The invention further relates to a device (1) for culturing and detecting microorganisms, comprising a barrel (10) enclosing a barrel compartment (13) for receiving a liquid sample (S), a first piston (20) which (20) is movable in said barrel (10), wherein said barrel compartment (13) is configured to be brought in fluid communication via a first filtering membrane (40) with a sensing surface (51) of a gas sensor (50) configured to detect a metabolic gas released by microorganisms, wherein the first filtering membrane (40) is configured to retain microorganisms contained in the liquid sample (S) at the first side (41) of the first filtering membrane (40). Furthermore, a sensor cartridge (4) and a kit of parts comprising the device (1) are provided.
C12Q 1/04 - Determining presence or kind of microorganismUse of selective media for testing antibiotics or bacteriocidesCompositions containing a chemical indicator therefor
C12M 1/00 - Apparatus for enzymology or microbiology
C12M 1/34 - Measuring or testing with condition measuring or sensing means, e.g. colony counters
C12M 1/12 - Apparatus for enzymology or microbiology with sterilisation, filtration, or dialysis means
A thermal sensor device serves for determining a concentration of a target gas in a gas sample that further comprises a disturbance gas. The thermal sensor device comprises first and second measurement structures (1, 2) comprising first and second temperature sensors (TS1, TS2) and a heater element (31) operable to cause heat transfer to the measurement structures through the gas sample. Processing circuitry provides heating power (P_3) to the heater element and derives an output signal (S) based on a response of the temperature sensors to the heating power, the output signal being indicative of a concentration of the target gas in the gas sample. The first and second measurement structures have different heat dissipation capabilities, and the processing circuitry derives the output signal from a weighted difference of temperature signals from the first and second temperature sensors. Thereby, a cross-sensitivity of the output signal to a concentration change of the disturbance gas may be reduced or eliminated.
A dual-comb spectrometer comprising two lasers outputting respective frequency combs having a frequency offset between their intermode beat frequencies. One laser acts as a master and the other as a follower. Although the master laser is driven nominally with a DC drive signal, the current on its drive input line nevertheless oscillates with an AC component that follows the beating of the intermode comb lines lasing in the driven master laser. This effect is exploited by tapping off this AC component and mixing it with a reference frequency to provide the required frequency offset, the mixed signal then being supplied to the follower laser as the AC component of its drive signal. The respective frequency combs in the optical domain are thus phase-locked relative to each other in one degree of freedom, so that the electrical signals obtained by multi-heterodyning the two optical signals are frequency stabilized.
G01J 3/10 - Arrangements of light sources specially adapted for spectrometry or colorimetry
H01S 5/40 - Arrangement of two or more semiconductor lasers, not provided for in groups
H01S 5/062 - Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes
A dual-comb spectrometer comprising two lasers outputting respective frequency combs having a frequency offset between their intermode beat frequencies. One laser acts as a master and the other as a follower. Although the master laser is driven nominally with a DC drive signal, the current on its drive input line nevertheless oscillates with an AC component that follows the beating of the intermode comb lines lasing in the driven master laser. This effect is exploited by tapping off this AC component and mixing it with a reference frequency to provide the required frequency offset, the mixed signal then being supplied to the follower laser as the AC component of its drive signal. The respective frequency combs in the optical domain are thus phase-locked relative to each other in one degree of freedom, so that the electrical signals obtained by multi-heterodyning the two optical signals are frequency stabilized.
H01S 5/40 - Arrangement of two or more semiconductor lasers, not provided for in groups
H01S 5/062 - Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes
A particulate matter (PM) sensor comprises a substrate forming a cavity (5), the substrate comprising a semiconductor chip (4), and a light source (1) arranged in the cavity (5). The light source (1) is adapted to emit a light beam (7). The light beam (7) forms a detection volume (8) for particulate matter (9) outside the cavity (5). Optionally, the particulate matter sensor comprises an optical element (2) delimiting the cavity (5) at one end. The optical element (2) is configured to shape the light beam (7). Further, the particulate matter sensor comprises at least one photodetector (3) that is integrated into a surface of the semiconductor chip (4). The surface into which the at least one photodetector (3) is integrated faces the detection volume (8). The at least one photodetector (3) is adapted to detect light (10) scattered by particulate matter (9) in the detection volume (8).
A gas sensor includes a support structure with a cavity, a sensing element sensitive to a gas and arranged in the cavity, and a filter spanning the cavity. The filter is a size selective filter.
G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups
B01D 53/22 - Separation of gases or vapoursRecovering vapours of volatile solvents from gasesChemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by diffusion
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
A gas generator comprises a compartment confined by a casing configured to hold an active material generating a target gas in response to thermal activation, and a heater structure configured and arranged to heat the active material for generating the target gas. The heater structure is arranged outside the compartment and heats the active material from at least two sides.
A photodetector comprises a substrate, and supported by the substrate, a configuration to act as optical resonator and to absorb incident radiation of a band, including infrared. The configuration comprises: a resonant frontside structure facing the incident radiation; a backside structure and arranged between the frontside structure and the substrate; and a layer of an active material made from a semiconducting material, and configured to convert at least part of the incident radiation of the band into charge carriers. The frontside structure or the backside structure is made from electrically conducting material and is in contact with the active material. The configuration is configured to selectively absorb the incident radiation of the band. The frontside structure or the backside structure that is in contact with the active material is contacted by electrical contacts for sensing the charge carriers in the active material. The active material comprises amorphous or polycrystalline material.
G01N 21/3504 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing gases, e.g. multi-gas analysis
A photoacoustic gas sensor device for determining a value indicative of a presence or a concentration of a component in a gas comprises a measurement cell enclosing a measurement volume and a gas permeable area in the measurement cell for a gas to enter the measurement volume. An electromagnetic radiation source is arranged to emit electromagnetic radiation into the measurement volume, and a pressure transducer is arranged to measure a sound wave generated by the component in response to an absorption of electromagnetic radiation by the component in the measurement volume. In one aspect, the gas permeable area is represented by a porous gas permeable membrane with an average pore size of the porous gas permeable membrane between 10 nm and 1 μm. In another aspect the gas permeable area is represented by an area of the measurement cell containing holes reaching through an otherwise gas tight material of the measurement cell, with a diameter of the holes between 100 nm and 10 μm.
G01N 29/32 - Arrangements for suppressing undesired influences, e.g. temperature or pressure variations
G01N 29/22 - Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic wavesVisualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object Details
a) is configured to receive incoming ultraviolet light (5) emitted by the light source (4) and to down convert received ultraviolet light (5) and to emit said down converted light (50) in the visible or infrared spectrum so that emitted down converted light (50) impinges on the photodetector (3).
G01N 21/33 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using ultraviolet light
G01N 21/35 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
18.
Duct sensor with duct probe for sampling a fluid from a duct and method of operation
A duct probe (20) for sampling a fluid from a main fluid flow (Fm) in a duct (10) defines an elongated supply channel (21) n elongated discharge channel (22). The supply channel has at least one inflow opening (23) for diverting a partial flow (Fp) from the main fluid flow into the supply channel, and the discharge channel has at least one outflow opening for returning the partial flow from the discharge channel into the main fluid flow after it has passed an environmental sensor (30). The duct probe further comprises at least one compensation opening (26) that connects the supply channel and the discharge channel in a region that is located between their closed and open ends. By the presence of the compensation opening (26), a jet flow (Fj) is created, which acts to reduce a pressure difference between the supply channel and the discharge channel when the duct probe is exposed to the main fluid flow (Fm).
A photoacoustic gas sensor device is proposed for determining a value indicative of a presence or a concentration of a component in a gas. The photoacoustic gas sensor device comprises a substrate, and a measurement cell body arranged on a first side of the substrate. The substrate and the measurement cell body define a measurement cell enclosing a measurement volume. The measurement cell comprises an aperture for a gas to enter the measurement volume. The device further comprises an electromagnetic radiation source for emitting electromagnetic radiation, and a microphone for measuring a sound wave generated by the component in response to an absorption of electromagnetic radiation by the component. The electromagnetic radiation source and the microphone are arranged on the first side of the substrate and in the measurement volume. The microphone has a bottom port facing the substrate, and the measurement volume is communicatively coupled to the bottom port.
G01N 21/17 - Systems in which incident light is modified in accordance with the properties of the material investigated
G01N 21/3504 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing gases, e.g. multi-gas analysis
G01N 25/18 - Investigating or analysing materials by the use of thermal means by investigating thermal conductivity
G01K 15/00 - Testing or calibrating of thermometers
G01N 25/00 - Investigating or analysing materials by the use of thermal means
G01N 25/20 - Investigating or analysing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
21.
Sensor module, particularly for measuring ambient temperature
The invention relates to a sensor module (1) for measuring at least one measurand, comprising: a housing (2) having a flow duct (23) with an air inlet (21) and an air outlet (22), the housing (2) enclosing an interior (20) of the housing (2); a circuit board (4) arranged in the interior (20); at least one sensor (3) which is arranged on the circuit board (4) and is designed to measure at least one measurand of an air flow (L) conducted past the sensor (3); a terminal (5) arranged on the circuit board (4) for making electrical contact with the sensor module (1); and a fan (6), which has a motor (60) and a rotor (61) which can be rotated about an axis of rotation (z) by means of the motor (60), the motor (60) being electrically conductively connected to the circuit board (4), and the fan (6) being designed to generate an air flow (L) in the flow duct (23) between the air inlet (21) and the air outlet (22) such that the air flow (L) flows past the sensor (3) and, in the region of the air inlet (21), flows in a flow direction (x) which runs at an angle (V) in the range of 45° to 90° to the axis of rotation (z).
G01K 13/024 - Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow of moving gases
B60H 1/00 - Heating, cooling or ventilating devices
A resistive metal oxide gas sensor comprises a support structure and a porous sensing layer (1) arranged on the support structure or partly housed therein. Electrodes (2) are in electrical communication with the porous sensing layer (1), and a heater (3) is in thermal communication with the porous sensing layer (1). The heater (3) can be operated to heat the porous sensing layer (1) to a target temperature for allowing a determination of the presence or the concentration of a target gas, i.e., ozone, based on a sensing signal supplied via the electrodes (2). The porous sensing layer (1) comprises a network of interconnected monocrystalline metal oxide nanoparticles (14) and a gas-selective coating (12) of the network. A thickness (t1) of the porous sensing layer (1) is at most 10 pm. The coating (12) comprises one or more of silicon oxide and silicon nitride, and is of a thickness (t12) of less than 5 nm.
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups
A dual-comb spectrometer comprising two lasers outputting respective frequency combs having a frequency offset between their intermode beat frequencies. One laser acts as a master and the other as a follower. Although the master laser is driven nominally with a DC drive signal, the current on its drive input line nevertheless oscillates with an AC component that follows the beating of the intermode comb lines lasing in the driven master laser. This effect is exploited by tapping off this AC component and mixing it with a reference frequency to provide the required frequency offset, the mixed signal then being supplied to the follower laser as the AC component of its drive signal. The respective frequency combs in the optical domain are thus phase-locked relative to each other in one degree of freedom, so that the electrical signals obtained by multi-heterodyning the two optical signals are frequency stabilized.
H01S 5/40 - Arrangement of two or more semiconductor lasers, not provided for in groups
H01S 5/062 - Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying the potential of the electrodes
A capacitive sensor includes a substrate and an electrode structure including at least a first electrode, a second electrode and a sensing layer arranged between the first electrode and the second electrode. The sensor further includes a measurement circuit configured to measure the capacitance of the electrode structure by applying, at a first measurement phase, a first pair of electrical potentials including a first electrical potential of the first electrode and a first electrical potential of the second electrode to the first electrode and the second electrode by applying, at a second measurement phase, a second pair of electrical potentials including a second electrical potential of the first electrode and a second electrical potential of the second electrode to the first electrode and the second electrode. The first electrical potential of the second electrode and the second electrical potential of the second electrode are different from each other.
G01R 27/26 - Measuring inductance or capacitanceMeasuring quality factor, e.g. by using the resonance methodMeasuring loss factorMeasuring dielectric constants
G01N 27/22 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
G01D 5/24 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
A particulate matter sensor device comprising an enclosure (21) that comprises a flow inlet (11), a flow outlet (12) and a flow channel (2) extending therebetween, a radiation source for emitting radiation into the flow channel (2) for interaction of the radiation with the particulate matter in the flow (20) of an aerosol sample when guided through the flow channel (2), a radiation detector (4) for detecting at least part of said radiation after interaction with the particulate matter. The sensor device comprises a flow modifying device (511) arranged upstream of the radiation detector (4) and/or of the radiation source (3) for modifying the flow (20) for reducing particulate matter precipitation onto the radiation detector (4) and/or onto the radiation source (3) and/or the channel wall sections in close proximity to the detector (4) and/or source (3). The invention also relates to a method of determining parameters of particulate matter in an aerosol sample by using such a particulate matter sensor device.
A sensor device for determining at least one heat transfer parameter of a gas comprises a sensor unit (10) comprising at least one heater element and at least one temperature sensor. A first (inner) housing (20) receives the sensor unit. The first housing comprises a first membrane (22) allowing a diffusive gas exchange between the exterior and the interior of the first housing. The first housing is received in a second (outer) housing (30). The second housing comprises a second membrane (32) allowing a diffusive gas exchange between the exterior of the second housing and the exterior of the first housing. Thereby temperature gradients inside the first housing are reduced. The second housing can be made of metal and can be disposed on a support plate (40), taking the form of a cap. An auxiliary sensor (50) can be arranged in the space between the first and second housings.
G01N 25/18 - Investigating or analysing materials by the use of thermal means by investigating thermal conductivity
G01N 25/48 - Investigating or analysing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity on solution, sorption, or a chemical reaction not involving combustion or catalytic oxidation
27.
Device for regulating a mixing ratio of a gas mixture
A regulation device for regulating a mixing ratio (x) of a gas mixture comprises a first conduit (1) for carrying a flow of a first gas (e.g., air) and a second conduit (2) for carrying a flow of a second gas (e.g., a fuel gas). The first and second conduits (1, 2) open out into a common conduit (3) in a mixing region (M) to form the gas mixture. A first sensor (S1) is configured to determine at least one thermal parameter of the gas mixture downstream from the mixing region. A control device (10) is configured to receive, from the first sensor, sensor signals indicative of the at least one thermal parameter of the gas mixture and to derive control signals for adjusting device (V1) acting to adjust the mixing ratio, based on the at least one thermal parameter.
OM) supplied by the gas sensor in response to a second measurement (OM). Outgassing is understood as the release of chemical substances from the one or more components.
G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups
G01N 27/04 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
A vibrational circular dichroism (VCD) spectroscopy method and apparatus that can significantly reduce the measurement time needed to acquire a differential absorption spectrum compared to known approaches. A dual-comb is generated by superimposing the outputs from two quantum cascade laser sources, thus providing a third comb interferogram with beat frequencies higher than the polarization modulation frequency. Consequently, for each of the left and right circularly polarized light, the measurement signal measures transmission through the sample across the full wavelength range of interest during each period of the polarization modulation. A complete vibrational spectrum is thus acquired in each modulation of a polarization modulator, instead of only acquiring data for a single wavelength during each modulation of the polarization, as in dispersive or tunable laser VCD, or only a single Fourier component of the spectrum, as in Fourier transform VCD.
G01N 21/3581 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light using far infrared lightInvestigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light using Terahertz radiation
A heterodyne detection spectrometer setup comprises an optical path with at least a first cavity able to emit a first laser beam; a second cavity able to emit a second laser beam; and at least one combining and/or reflecting element. The cavities are connected to current drivers for stimulating laser emission, which shows increased signal-to-noise ratios of the heterodyne signal and an increased dynamic range. This can be reached if at least the second cavity comprises an active medium connected to a heterodyne signal extraction element and a (multi-) heterodyne signal processing unit, which is simultaneously usable for laser light generation and as detector element, comprising an active medium introduced in the optical path in order that the first and/or second laser beam can enter the respective other cavity. At least one reference path is established between the two cavities in the optical path with at least two combining and/or reflecting elements.
G01J 3/10 - Arrangements of light sources specially adapted for spectrometry or colorimetry
G01B 9/02003 - Interferometers characterised by controlling or generating intrinsic radiation properties using two or more frequencies using beat frequencies
A gas sensor includes a sensing element of a material including metal oxide and is sensitive to a target gas and to a recalibration gas different from the target gas. For recalibrating the gas sensor, a resistance of the sensing element is measured as an updated recalibration gas baseline resistance in a recalibration environment showing a recalibration gas baseline concentration.
G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups
G01N 27/04 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups
A dual-comb spectrometer 5 with two lasers 10, 12 serving as a local oscillator and an interrogator. The lasers output light beams with respective frequency combs C1, C2 of defined free spectral range, FSR. A detector 30 can detect heterodyne mixing of the combined beams to detect an RF frequency comb C3. Respective control signals are supplied to the lasers which have functional forms configured to cause the frequencies of the lasers' frequency combs C1, C2 to tune over a defined fraction of their FSR. This enables a reduction of the effective spectral sampling period by a factor equal to the ratio of the FSR to the spectral resolution of the spectrometer, which will typically be several orders of magnitude, so that the spectral sampling period can be reduced from the GHz to the MHz range, which in turn enables a gapless spectrum to be obtained in a short time.
G01N 21/39 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using tunable lasers
H01S 5/34 - Structure or shape of the active regionMaterials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
H01S 5/40 - Arrangement of two or more semiconductor lasers, not provided for in groups
A sensor module as well as a method for manufacturing a sensor module for determining a property of a fluid, in particular for measuring air quality, comprises a printed circuit board, at least one sensor on the printed circuit board for measuring a parameter of the surrounding air and a housing for the printed circuit board. A part of the printed circuit board protrudes from an opening in the housing (10), wherein the at least one sensor (21, 22) is located on a front side of the protruding part of the printed circuit board. In addition, at least the front side of the protruding part of the printed circuit board, with the exception of a recess for the at least one sensor, is encapsulated with a filling compound. The sensor module can be used in an interior or an air duct of motor vehicles or buildings. In one embodiment, the sensor module measures temperature, relative humidity and gas concentration in a fluid, especially in the surrounding air.
G01K 7/16 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements
G01K 13/02 - Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow
G01N 25/66 - Investigating or analysing materials by the use of thermal means by investigating moisture content by investigating dew-point
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups
G01K 13/024 - Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow of moving gases
35.
Sensor for determining the thermal capacity of natural gas
The disclosure concerns a sensor device for determining the thermal capacity of a natural gas. The sensor device comprises a substrate, a recess or opening arranged in the substrate, a first heating component and a first sensing component. The first heating component comprises a first heating structure and a temperature sensor and the first sensing component comprises a temperature sensor. The sensor device is configured to measure the thermal conductivity of the natural gas at a first measuring temperature and at a second measuring temperature. The sensor device is configured to determine a first, in particular a constant, and a second, in particular a linear temperature coefficient of a temperature dependency function of the thermal conductivity and to determine the thermal capacity of the natural gas based on a fitting function. The fitting function is dependent on the first and the second temperature coefficient.
A sensor module comprises a master sensor unit for sensing a first environmental parameter, a slave sensor unit for sensing a second environmental parameter, a common substrate on which the master sensor unit and the slave sensor unit are mounted, and a digital bus interface for a communication between the master sensor unit and the slave sensor unit. The master sensor unit comprises a non-volatile memory for storing calibration data and configuration data of the master sensor unit and the slave sensor unit. The master sensor unit is embodied as a first chip, and the slave sensor unit is embodied as a second chip. Such sensor module is compact, robust and versatile.
H04Q 9/00 - Arrangements in telecontrol or telemetry systems for selectively calling a substation from a main station, in which substation desired apparatus is selected for applying a control signal thereto or for obtaining measured values therefrom
G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups
G06F 1/04 - Generating or distributing clock signals or signals derived directly therefrom
A waveguide heterostructure for a semiconductor laser with an active part, comprising an active region layer depending of the type of semiconductor used, which is sandwiched between an electrode layer and a substrate, usable for dispersion compensation in a semiconductor laser frequency comb setup, an optical frequency comb setup and a manufacturing method.
H01S 5/34 - Structure or shape of the active regionMaterials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
H01S 5/32 - Structure or shape of the active regionMaterials used for the active region comprising PN junctions, e.g. hetero- or double- hetero-structures
A particulate matter sensor device comprises an enclosure (21) defining a flow channel (2), a radiation source (3) for emitting radiation into the flow channel for interaction of the radiation with particulate matter in an aerosol sample in the flow channel, and a radiation detector (4) for detecting at least part of said radiation after interaction with the particulate matter. The sensor device comprises a flow modifying device (511) arranged upstream of the radiation detector and/or radiation source so as to reduce particulate matter precipitation onto the radiation detector, the radiation source and/or the channel wall sections in their proximity. The invention also relates to a method of determining parameters of particulate matter in an aerosol sample by using such a particulate matter sensor device.
An infrared device comprises a substrate. A configuration for emitting infrared radiation is supported by the substrate. The configuration comprises an electrically conducting layer arrangement of less than 50 nm thickness between dielectric layers. In addition, a heater arranged for heating the configuration to emit the infrared radiation is supported by the substrate.
G01N 21/35 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
G01N 21/3504 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing gases, e.g. multi-gas analysis
G01J 3/10 - Arrangements of light sources specially adapted for spectrometry or colorimetry
A thermal sensor comprises an active element (41), e.g., a heater or cooler, at least one temperature sensor (31), and processing circuitry (50). The processing circuitry causes a change of power supplied to the active element (41). It then determines, at a plurality of times, a thermal parameter based on an output signal of the temperature sensors and analyzes the transient behavior of the thermal parameter. Based on this analysis, the processing circuitry determines a contamination signal that is indicative of a contamination on a sensing surface of the thermal sensor. If the thermal sensor comprises a plurality of temperature sensors arranged in different sectors of the sensing surface, a multi-sector thermal signal can be derived from the outputs of the sensors, and determination of the contamination signal can be based on the multi-sector thermal signal.
A sensor package comprises a sensor chip (3) with a sensitive element (31) exposed to an environment of the sensor package, and contact pads (2) for electrically contacting the sensor package. Electrical connections (5) are applied between the sensor chip (3) and the contact pads (2). A molding compound (1) at least partially encloses the sensor chip (3) and the contact pads (2). A unit (3, 73) consisting of the sensor chip (3) and optionally of a die pad (73) supporting the sensor chip (3) is arranged such that a top surface (ts) of the unit (3, 73) does not protrude from a level defined by a top surface (ts) of the contact pads (2), and a bottom surface (bs) of the unit (3,73) does not protrude from a level defined by a bottom surface (bs) of the contact pads (2).
4, comprising: an adsorption filter (30) comprising a body (2) consisting of a molecular sieve material, a sensing element (10) for detecting said gas (G), and a carrier (4) for carrying the sensing element (10), wherein the carrier (4) comprises an opening (50) via which said gas (G) to be detected can reach the sensing element (10), and wherein the adsorption filter (30) is connected, particularly glued, to the carrier (4) and closes said opening (50) so that said gas (G) to be detected can diffuse through said body (2) towards the sensing element (10).
The disclosure relates to a sensor for detecting and/or analysing a gas. The sensor comprises a substrate, a recess or opening arranged in the substrate, a first bridge structure and a second bridge structure. The first bridge structure and the second bridge structure extend over said recess or opening and are anchored in the substrate. The first bridge structure forms a first hotplate and comprises a first patch of sensing material, in particular of a metal oxide material, arranged on the first hotplate, electrodes adapted to measure an electrical property of the first patch and a heater adapted to heat the first hotplate. The second bridge structure comprises a temperature sensor. The sensor comprises circuitry for driving the heater and for processing signals from the electrodes and the temperature sensor. The sensor provides a first operation mode configured to perform a measurement of an electrical property of the first patch and a second operation mode configured to operate the second bridge structure in a sensing mode to perform a measurement of a thermal property of the gas. The thermal property is a thermal capacity and/or a thermal conductivity and/or a thermal diffusivity of the gas.
G01N 27/18 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of an electrically-heated body in dependence upon change of temperature caused by changes in the thermal conductivity of a surrounding material to be tested
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
H05B 3/22 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
A gas sensor comprises a support structure with a cavity (6), a sensing element (1) sensitive to a gas and arranged in the cavity (6), and a filter (3) spanning the cavity (6). The filter (3) is a size selective filter.
G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
B01D 53/22 - Separation of gases or vapoursRecovering vapours of volatile solvents from gasesChemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by diffusion
An electronic component comprises a carrier (3), a sensor device (2) mounted on the carrier (3), which sensor device (2) comprises a sensor chip (21), and an electrostatic discharge protection element (1) for protecting the sensor chip (21) from an electrostatic discharge, which protection element (1) is mounted on the carrier (3).
G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
H01L 27/02 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
H01L 23/60 - Protection against electrostatic charges or discharges, e.g. Faraday shields
2) and producing a comparison result (R), and monitoring said comparison result and producing a fault signal (FS) in case of a fault state. The present invention relates to such a sensor device.
G01N 25/18 - Investigating or analysing materials by the use of thermal means by investigating thermal conductivity
G01F 5/00 - Measuring a proportion of the volume flow
G01F 1/684 - Structural arrangementsMounting of elements, e.g. in relation to fluid flow
G01F 15/04 - Compensating or correcting for variations in pressure, density, or temperature of gases to be measured
G01F 1/68 - Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
G01N 25/00 - Investigating or analysing materials by the use of thermal means
G01F 25/00 - Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume
a) of the seat that faces a passenger (P) sitting on the automotive seat (2), wherein the sensor module (1) is configured to be mounted such in said automotive seat (2) that it is spaced apart from said seat cover region (200). Further, the invention relates to an automotive seat (2) comprising such a sensor module (1).
B60H 1/00 - Heating, cooling or ventilating devices
A47C 7/74 - Adaptations for incorporating lamps, radio sets, bars, telephones, ventilation, heating or cooling arrangements or the like for ventilation, heating or cooling
An infrared device comprises a substrate (1), and arranged on or in the substrate (1) a configuration (3) for one of selectively emitting and selectively absorbing infrared radiation of a band, the configuration (3) comprising a pattern made from an electrically conducting material on a first level (L1), an electrically conducting film (33) on a second level (L2), and a dielectric layer (24) between the pattern and the film (33). One or more of a heater (4) for heating the configuration (3), and a thermal sensor (5) arranged for sensing the selective infrared radiation of the band absorbed by the configuration (3) on or in the substrate.
G01J 5/06 - Arrangements for eliminating effects of disturbing radiationArrangements for compensating changes in sensitivity
G01J 5/10 - Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
G01N 21/3504 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing gases, e.g. multi-gas analysis
A method for processing a signal supplied by a sensor comprises receiving the sensed signal, and compensating the sensed signal for a contribution caused by one or more components thermally coupled to the sensor. The compensated signal in its dynamics, and the dynamics adjusted compensated sensor signal is provided.
G01K 1/20 - Compensating for effects of temperature changes other than those to be measured, e.g. changes in ambient temperature
G01D 3/036 - Measuring arrangements with provision for the special purposes referred to in the subgroups of this group mitigating undesired influences, e.g. temperature, pressure on measuring arrangements themselves
G01K 7/42 - Circuits effecting compensation of thermal inertiaCircuits for predicting the stationary value of a temperature
G01D 3/02 - Measuring arrangements with provision for the special purposes referred to in the subgroups of this group with provision for altering or correcting the transfer function
A gas sensor module integrated onto a board comprising at least one radiation source configured for emitting radiation, at least one radiation detector unit configured to detect at least part of said radiation, and a radiation cell providing at least one radiation path from said radiation source to said radiation detector unit. Said board is provided with a recess and said radiation path is propagating within said recess.
G01N 21/3504 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light for analysing gases, e.g. multi-gas analysis
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
A sensor assembly comprises a substrate arrangement and a sensor chip mounted to the substrate arrangement. A sensing element is integrated on or in the sensor chip and is sensitive to at least one parameter of a fluid. An access opening is provided in the substrate arrangement enabling the fluid to access the sensing element. A metallization arranged on at least a portion of the substrate arrangement seals a chamber containing the sensor chip which portion comprises one or more of a wall defining the access opening or an area facing the sensor chip.
G01N 33/487 - Physical analysis of biological material of liquid biological material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
A printed gas sensor is disclosed. The sensor may include a partially porous substrate, an electrode layer, an electrolyte layer, and an encapsulation layer. The electrode layer comprises one or more electrodes that are formed on one side of the porous substrate. The electrolyte layer is in electrolytic contact with the one or more electrodes. The encapsulation layer encapsulates the electrode layer and electrolyte layer thereby forming an integrated structure with the partially porous substrate.
C09D 11/03 - Printing inks characterised by features other than the chemical nature of the binder
C09D 11/106 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
B32B 37/18 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
B32B 38/00 - Ancillary operations in connection with laminating processes
2, Δρ and calibration data, the calorific value Hp, and/or the Wobbe index WI, or parameters indicative thereof, of an unknown fluid (g) are calculated. The invention also relates to such a sensor device (10) and to a computer program product for carrying out such a method.
G01N 25/20 - Investigating or analysing materials by the use of thermal means by investigating the development of heat, i.e. calorimetry, e.g. by measuring specific heat, by measuring thermal conductivity
A method for fabrication of a sensor device (1) for measuring a parameter of a test substance, comprising: i) providing a substrate; ii) arranging on its front side a structured first protection layer (2); iii) arranging on the substrate with the structured first protection layer (2) a stack including first and second electrodes (3,4), a sacrificial layer between the first and second electrodes (3,4); and iv) etching in an etching step from the back side through the substrate such as to remove material of the semiconductor substrate and the sacrificial layer. The present invention also relates to such a sensor device (1).
H01L 29/43 - Electrodes characterised by the materials of which they are formed
G01N 27/22 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
56.
Method for optical and electrical signal processing of a multi-heterodyne signal generated by a multi-mode semi-conductor laser and detection device utilizing that method
A method for optical and electrical signal processing of a multi-heterodyne signal generated by a multi-mode semi-conductor laser, for a system comprising two laser sources and an sample interaction unit. At least the beam of one of the laser passes through said sample interaction unit before being combined on a detector. The first laser is tuned (40=>42) by an amount keeping the tuning result within the available detector bandwidth (55). Then the second laser is roughly tuned by the same amount as the tuning of the first laser to bring back the signal to the vicinity (48) of the original place in the RF-domain and within the bandwidth (55) of the detector. The tuning steps are repeated with different value of mode spacing for reconstructing the sample spectrum and provide a high resolution image of the dip (41) absorption line (40).
G01F 1/688 - Structural arrangementsMounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
G01F 1/696 - Circuits therefor, e.g. constant-current flow meters
G01P 5/10 - Measuring speed of fluids, e.g. of air streamMeasuring speed of bodies relative to fluids, e.g. of ship, of aircraft by measuring thermal variables
G01F 1/684 - Structural arrangementsMounting of elements, e.g. in relation to fluid flow
The invention relates to a flow sensor (1) and a method for determining the presence of a gas bubble (G) in a liquid (L) flowing through the flow sensor (1).
G01F 1/68 - Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
A61M 1/16 - Dialysis systemsArtificial kidneysBlood oxygenators with membranes
G01F 1/688 - Structural arrangementsMounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
A61M 5/168 - Means for controlling media flow to the body or for metering media to the body, e.g. drip meters, counters
G01F 1/74 - Devices for measuring flow of a fluid or flow of a fluent solid material in suspension in another fluid
A61M 5/36 - Devices for bringing media into the body in a subcutaneous, intra-vascular or intramuscular wayAccessories therefor, e.g. filling or cleaning devices, arm rests with means for eliminating or preventing injection or infusion of air into body
59.
Electrochemical sensors and packaging and related methods
Some embodiments include an electrochemical sensor. The electrochemical sensor has a lid element comprising a substrate, multiple electrodes, multiple interior contacts electrically coupled to the multiple electrodes, a base element configured to be coupled to the lid element, and an electrolyte element. The base element includes a sensor cavity, multiple exterior contacts located at an exterior surface of the base element, and multiple signal communication channels comprising multiple signal communication lines, and the electrolyte element is located in the sensor cavity. When the lid element is coupled to the base element, the multiple electrodes are located in the sensor cavity, the multiple electrodes are in electrolytic communication with the electrolyte element, the multiple interior contacts are located in the sensor cavity, and the multiple interior contacts are electrically coupled to the multiple exterior contacts by the multiple signal communication lines. Other embodiments of related sensors and methods are also disclosed.
A wireless near-field gas sensor system includes a wireless communications tag and a printed gas sensor. The wireless communications tag includes an integrated circuit and a wireless antenna. The printed gas sensor includes a sensor housing having one or more gas access regions, an electrolyte cavity positioned within the sensor housing, an electrolyte housed within the electrolyte cavity, and one or more electrodes positioned within the electrolyte cavity in electrochemical engagement with the electrolyte, and a resistor communicatively coupled to the one or more electrodes and the wireless communications tag.
A flow sensor arrangement for determining the flow of a fluid comprises a substrate. A heater is arranged in or on the substrate as well as at least one first thermocouple for generating a first signal proportional to a temperature difference between a location downstream from the heater and a first reference location, and at least one second thermocouple for generating a second signal proportional to a temperature difference between a location upstream from the heater and a second reference location which second reference location is different from the first reference location. In addition, at least one third thermocouple is arranged in or on the substrate for generating a third signal proportional to a temperature difference between the first reference location and the second reference location. Means are provided for determining a sensing signal indicative of the flow of the fluid over the heater and the first and the second thermocouple dependent on the first signal, the second signal and the third signal.
G01F 1/688 - Structural arrangementsMounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
G01F 15/02 - Compensating or correcting for variations in pressure, density, or temperature
A sensor package comprises a carrier comprising a through hole, and a sensor chip with a front side and a back side and a recess in the back side. The sensor chip is attached to the carrier with its back side facing the carrier by means of an attachment layer thereby defining a first area of the carrier the sensor chip rests on and a second area of the carrier facing the recess. The through hole is arranged in the first area of the carrier.
A method for determining a fluid composition parameter, e.g., a fluid identifier, a mixing ratio or a parameter describing heat transfer properties, of an unknown fluid in a mass flow controller is disclosed. A control valve of the mass flow controller is set so as to establish a constant flow, preferably zero flow, through the mass flow controller. A heating element of the flow sensor is heated, and at least one temperature value is measured with temperature sensors arranged on both sides of the heater while the fluid contacts the flow sensor. First calibration data (LUT1) are retrieved. The first calibration data have, as input values, temperature values measured with the flow sensor at the previously established constant flow and have, as output values, values of the fluid composition parameter. The first calibration data are used to determine the fluid composition parameter from the measured temperature value.
A wearable electronic device (100) comprises a sensor (1) providing a sensor signal (s1), which sensor (1) is one of a temperature sensor and a humidity sensor. A control unit (3) determines, subject to at least the sensor signal (s1), if the wearable electronic device (100) is worn by a user, and provides an output signal (t1) indicative of a result of the determination.
H04Q 9/00 - Arrangements in telecontrol or telemetry systems for selectively calling a substation from a main station, in which substation desired apparatus is selected for applying a control signal thereto or for obtaining measured values therefrom
A flow sensor package comprises a chip comprising a sensitive structure for sensing the flow of a fluid and an encapsulation at least partly encapsulating the chip. A recess in the encapsulation contributes to a flow channel for guiding the fluid, which recess exposes at least the sensitive structure of the chip from the encapsulation, and which recess extends beyond an edge of the chip.
G01F 1/69 - Structural arrangementsMounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
G01F 1/684 - Structural arrangementsMounting of elements, e.g. in relation to fluid flow
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/34 - Arrangements for cooling, heating, ventilating or temperature compensation
G01F 1/688 - Structural arrangementsMounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
A sensor chip comprises a substrate (1) with a front side (11) and a back side (12), and an opening (13) in the substrate (1) reaching through from its back side (12) to its front side (11). A stack (2) of dielectric and conducting layers is arranged on the front side (11) of the substrate (1), a portion of which stack (2) spans the opening (13) of the substrate (1). Contact pads (32) are arranged at the front side (11) of the substrate (1) for electrically contacting the sensor chip. A sensing element (4) is arranged on the portion of the stack (2) spanning the opening (13) on a side of the portion facing the opening (13).
H01L 27/14 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy
G01N 27/04 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
G01N 27/22 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
G01N 27/14 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of an electrically-heated body in dependence upon change of temperature
G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups
An integrated chemical sensor chip comprises on or integrated in a common substrate a chemically sensitive layer and a heater heating the sensitive layer. In addition, a memory is provided for the storage of a measurement routine, the measurement routine comprising instructions defining a heating process over time and instructions defining one or more measurement points in time. An I/O interface is provided for receiving a trigger for the measurement routine and for supplying a result of the measurement routine. An engine controls the heater and measures a resistance of the sensitive layer according the instructions of the measurement routine.
G01N 7/00 - Analysing materials by measuring the pressure or volume of a gas or vapour
G01N 21/00 - Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
G01N 27/00 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
G01N 31/00 - Investigating or analysing non-biological materials by the use of the chemical methods specified in the subgroupsApparatus specially adapted for such methods
G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups
G01N 27/16 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of an electrically-heated body in dependence upon change of temperature caused by burning or catalytic oxidation of surrounding material to be tested, e.g. of gas
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
A sensor chip comprises a sensing element providing a sensor signal, an on-chip memory, a configuration of a look up table of dimension N stored in the on-chip memory for assigning an output value to a combination of N input values, and a look up table engine for determining a corresponding output value in response to receiving a memory address for the look up table configuration and in response to receiving a sensor value derived from the sensor signal as one of the N input values.
The sensor device comprises a hotplate on a membrane. The hotplate is heated by a N-fold rotationally symmetric heater structure having N>1 heater elements of identical design. Each heater element comprises an inner section, an intermediate section and an outer section arranged in series, with the inner section having a larger electrical cross section than the outer section. This design allows to heat the hotplate to a homogeneous temperature at moderate supply voltages.
H05B 3/68 - Heating arrangements specially adapted for cooking plates or analogous hot-plates
H05B 3/16 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being mounted on an insulating base
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
H05B 3/06 - Heater elements structurally combined with coupling elements or with holders
H05B 3/22 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
G01N 27/14 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of an electrically-heated body in dependence upon change of temperature
A gas sensor package comprises a gas sensor chip with a layer sensitive to a gas, and with a heater for heating the sensitive layer. Contact pads are provided for electrically contacting the gas sensor package and a die pad is provided for mounting the gas sensor chip to. Electrical connections connect the gas sensor chip and the contact pads. A molding compound at least partially encloses the gas sensor chip. An opening in the molding compound provides access to the sensitive layer of the gas sensor chip. One of the contact pads serves as a pin for supplying electrical current to the heater of the gas sensor chip.
G01N 27/26 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variablesInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by using electrolysis or electrophoresis
G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
72.
Automated self-compensation apparatus and methods for providing electrochemical sensors
Systems and methods for automated self-compensation are described herein. Accordingly, some embodiments of a method may include measuring a signal from an electrochemical sensor device, where the signal relates to the presence of a predetermined gas, and where the electrochemical sensor device includes a potentiostat, measuring an internal property of the electrochemical sensor device by electronically pinging the potentiostat, and receiving a response from the potentiostat. In some embodiments, the method may include interpreting the response through an associative relationship between the electrochemical sensor device and a data acquisition and calculation module, determining an effect of an environmental factor from the response, compensating for effects of the environmental factor by adjusting the signal from the electrochemical sensor device and outputting the adjusted signal.
G01N 27/49 - Systems involving the determination of the current at a single specific value, or small range of values, of applied voltage for producing selective measurement of one or more particular ionic species
73.
Semiconductor package with coated side walls and method of manufacture
A semiconductor package including an integrated device, the package having a front side, a back side and side walls linking the front and back sides, wherein each side wall is coated, to at least 80% of its area, with a coating material different from the material(s) of the back and front sides. A method of manufacturing a semiconductor package by providing an assembly containing an array of the packages, the assembly having thickness d0 and being attached to a dicing tape of thickness dd, fabricating a set of first dicing streets with width w1 and depth d1<(d0+dd), filling the first dicing streets at least partially with a coating material, and fabricating, in the coating material in each first dicing street, a second dicing street with width w2≦w1 and depth d2≧d0 but <(d0+dd).
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 21/302 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
In a portable electronic device, an ambient temperature is sensed by means of a temperature sensor. In addition, it is assessed if the portable electronic device is exposed to condensation. A corresponding condensation indicator is provided. The condensation indicator is determined based on a dew point and based on sensed temperature values of the past or temperature derived from the past sensed temperature values.
G06F 3/0488 - Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser using a touch-screen or digitiser, e.g. input of commands through traced gestures
G01N 25/66 - Investigating or analysing materials by the use of thermal means by investigating moisture content by investigating dew-point
G01K 1/20 - Compensating for effects of temperature changes other than those to be measured, e.g. changes in ambient temperature
G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
A sensor module for integration within a seat assembly is provided. The sensor module comprises a temperature and/or humidity sensor (21) and a separate sensor support (51) for mechanically supporting said temperature and/or humidity sensor. The sensor support is configured to be arranged on or in a support layer below an air-permeable cover of the seat assembly.
G01D 3/036 - Measuring arrangements with provision for the special purposes referred to in the subgroups of this group mitigating undesired influences, e.g. temperature, pressure on measuring arrangements themselves
G01K 13/00 - Thermometers specially adapted for specific purposes
A sensor device comprises a sensitive element (1) and a support (2) for the sensitive element, the support having a surface (3) with an access opening (4) to the sensitive element (1). A layer of adhesive material (5) covers at least parts of the surface (3). A venting medium (6) extends over the entire surface (3) of the support (2) and the access opening (4) and is attached to the support (2) by the layer of adhesive material (5).
A chemical sensor (10) is described with at least one layer of a metal oxide (11) arranged between two current injecting electrodes (16,16′) with the length (L) of the layer of a metal oxide between the current injecting electrodes being less than 50 microns and one or a pair of voltage sensing electrodes (17) connected to the layer of a metal oxide (11) with the electrodes (16,16′,17) forming a 3- or 4-terminal arrangement for determining the resistance changes of layer material (11) excluding series resistances such as contact resistances close to or at at least one of the current injecting electrodes (16) from the resistance measurement.
G01N 7/00 - Analysing materials by measuring the pressure or volume of a gas or vapour
G01N 9/00 - Investigating density or specific gravity of materialsAnalysing materials by determining density or specific gravity
H01L 27/14 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy
G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups
G01N 27/04 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
A portable electronic device comprises a chemical sensor that is sensitive to a concentration of a chemical analyte and at least two auxiliary sensors that are sensitive to parameters that are different from the concentration of the chemical analyte. The portable electronic device comprises a control device that receives signals from the chemical sensor and from the auxiliary sensors at a plurality of points in time distributed over a measurement period and correlates the time dependencies of these signals to obtain a corrected reading of the first chemical sensor. The portable electronic device may be employed for breath analysis.
There is provided a portable electronic device with one or more integrated temperature sensors (12) for measuring an ambient temperature, a compensator (25,26) for reducing the difference between a sensor output (Ts) and the ambient temperature (Ta) with the compensator (25,26) switching depending on environmental and/or handling conditions between a plurality of compensation modes selected dependent on measurements of one or more other integrated and/or external sensors.
G01K 7/42 - Circuits effecting compensation of thermal inertiaCircuits for predicting the stationary value of a temperature
G01D 3/036 - Measuring arrangements with provision for the special purposes referred to in the subgroups of this group mitigating undesired influences, e.g. temperature, pressure on measuring arrangements themselves
G01K 1/20 - Compensating for effects of temperature changes other than those to be measured, e.g. changes in ambient temperature
In a portable electronic device, a temperature sensor is provided for sensing an ambient temperature of the portable electronic device. At least one other temperature sensor is provided for sensing a temperature inside the portable electronic device. The portable electronic device further comprises a set of components radiating heat in an active state in response to the consumption of electrical energy. A calibration module is adapted to conduct a calibration measurement during or in connection with an active state of at least a first component out of the set, and is adapted to determine a set of calibration parameters in response to the calibration measurement for adjusting the at least one sensed inside temperature. A compensator is provided for determining a compensated ambient temperature dependent on at least the sensed ambient temperature and the at least one adjusted sensed inside temperature.
A printed gas sensor is disclosed. The sensor may include a partially porous substrate, an electrode layer, an electrolyte layer, and an encapsulation layer. The electrode layer comprises one or more electrodes that are formed on one side of the porous substrate. The electrolyte layer is in electrolytic contact with the one or more electrodes. The encapsulation layer encapsulates the electrode layer and electrolyte layer thereby forming an integrated structure with the partially porous substrate.
G01N 27/404 - Cells with anode, cathode and cell electrolyte on the same side of a permeable membrane which separates them from the sample fluid
B01J 31/06 - Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing polymers
C09D 11/03 - Printing inks characterised by features other than the chemical nature of the binder
C09D 11/106 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
B32B 37/18 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
B32B 38/00 - Ancillary operations in connection with laminating processes
In a method for manufacturing a chemical sensor with multiple sensor cells, a substrate is provided and an expansion inhibitor is applied to the substrate for preventing a sensitive material to be applied to an area on the substrate for building a sensitive film of a sensor cell to expand from said area. The sensitive material is provided and the sensitive film is built by contactless dispensing the sensitive material to said area.
H01L 21/302 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
H01L 21/4763 - Deposition of non-insulating-, e.g. conductive-, resistive-, layers on insulating layersAfter-treatment of these layers
A gas sensor comprises a set of one or more sensor cells (SC) and a substrate (1). Each sensor cell (SC) of the set comprises a sensitive film (42) built from a sensitive material (4) covering an area of the substrate (1). One or more elevated structures (2) are manufactured in or around said area for preventing the sensitive material (4) to expand when being applied thereto.
H01L 27/14 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy
H01L 29/82 - Types of semiconductor device controllable by variation of the magnetic field applied to the device
H01L 29/84 - Types of semiconductor device controllable by variation of applied mechanical force, e.g. of pressure
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
A breath analyzer is described with at least one chemical sensor sensitive to the concentration of a component in a sample of exhaled breath including a compensator for compensating for the effect of variations in the amount of exhaled breath between the user and the sensor location with the chemical sensor being integrated into a portable electronic device, particularly with the sensor being located in an air duct with an opening to the exterior of the housing of the analyzer with the total area of the opening being sufficiently small to restrict effectively mass transport between the exterior and the sensor and/or wherein the compensation includes the compensation for different responses of sensors.
G01N 33/98 - Chemical analysis of biological material, e.g. blood, urineTesting involving biospecific ligand binding methodsImmunological testing involving alcohol, e.g. ethanol in breath
G01N 33/497 - Physical analysis of biological material of gaseous biological material, e.g. breath
A chemical alert system for generating an alarm is described including a portable electronic device, preferably with telecommunication capabilities to allow for data and/or voice communication via private or public networks, and at least one chemical sensor integrated with the housing of the portable device and controlled by a chemical sensor processing unit, further comprising an alert discriminator receiving input based on measurements of the chemical sensor, performing a test on the input and based on an outcome of the test initiating the transfer of measurements of the chemical sensor to a remote processing facility.
G08B 21/12 - Alarms for ensuring the safety of persons responsive to undesired emission of substances, e.g. pollution alarms
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
G08B 17/117 - Actuation by presence of smoke or gases by using a detection device for specific gases, e.g. combustion products, produced by the fire
89.
Portable electronic device with improved chemical sampling
A portable electronic device and a related methods are described using an integrated chemical sensor linked to a chemical sensor processing unit and being sensitive to the concentration of a component in a sample of air and one or more contextual sensors not including chemical, temperature and humidity sensors, wherein output from the contextual sensors is linked to a local or remote interpretation processor generating a constraint or correlation set transferred to the chemical sensor processing unit for use in determining a result of a chemical measurement as performed by the chemical sensor.
A portable electronic device is described with telecommunication capabilities to allow for data and/or voice communication via private or public networks, having an integrated chemical sensor sensitive to ketones within a breath sample of a user wherein the sensor comprises at least one metal oxide gas sensor and a control circuit for the sensor integrated onto a common substrate or package.
A mobile device comprises a CPU operating a display and other user interface circuitry. Further, it comprises a gas sensor as well as a sensor hub connecting the gas sensor and other sensors to the CPU. In order to save power, the device can be brought into a low-power operating mode, where the CPU is idling or switched-off and the gas sensor itself has a low-power and a high-power operating mode. However, even in this low-power operating mode, the sensor hub still monitors for changes of the signal from the gas sensor and wakes the device up if such a change is detected.
A gas sensor comprises a metal oxide sensing patch, a heater for heating the sensing patch, electrodes for measuring the conductivity of the sensing patch and an evaluation unit for generating a resulting parameter indicative of at least one analyte. Further, a temperature sensor is provided for measuring the temperature at the location of the sensing patch. The evaluation unit is adapted to derive a first parameter indicative of the conductivity of the sensing patch and a second parameter indicative of the heating power required to maintain a desired temperature of the sensing patch or indicative of the deviation of the temperature at the sensing patch from the desired temperature. The evaluation unit further combines the first and second parameters for evaluating the resulting parameter, thereby using the sensing patch not only as a chemiresistor but also as a pellistor-type measurement device.
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups
93.
Method for determining analyte type and/or concentration with a diffusion based metal oxide gas sensor
A measuring device is provided for determining the type and/or concentration a gaseous analyte from a set of analytes in a gaseous carrier. It comprises a housing having a passage to a cavity. A gas sensor with a heated metal-oxide sensing layer is arranged in the cavity. In order to gain a better understanding of the type of the analyte, diffusion effects are exploited by taking into account that the diffusion process through the passage as well as the catalytic reaction rate at the metal-oxide sensing layer depend on the type of the analyte. These material parameters can be determined by taking several measurements in a non-steady state of the concentration of the analyte within the cavity or while varying the reaction rate.
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups
94.
CMOS gas sensor and method for manufacturing the same
A CMOS gas sensor comprises a membrane (13) extending over an opening (12) of a silicon substrate (1). A patch (2) of sensing material is arranged on the membrane (13) and in contact with electrodes (3) of platinum. A heater (5) of tungsten is located in or on the membrane (13) at the location of the patch (2) of metal-oxide sensing material. Combining platinum electrodes (3) with a tungsten heater (5) on top of a CMOS structure provides a gas sensor of high reliability and stability.
H01L 21/285 - Deposition of conductive or insulating materials for electrodes from a gas or vapour, e.g. condensation
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
95.
Portable electronic device with integrated chemical sensor and method of operating thereof
A portable electronic device and related methods are described using an integrated chemical sensor linked to a chemical sensor processing unit and being sensitive to the concentration of a component in a sample of air and further including an operating system providing instructions for the control of the portable device, wherein the chemical processing unit uses under operating conditions a first set of instructions and a second set of instructions stored within the portable device, wherein the first set of instructions is part of the operating system level of instructions and the second set of instructions is part of a user of instructions with the second set of instructions being linked to the operating system via a plugin interface and wherein the second set of instructions is communicated to the portable device from a remote computing system based on access to measurements and/or operating conditions of the chemical sensor.
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
A sensing device has a semiconductor substrate with an opening and a membrane spanning the opening. A heater is arranged on the membrane. To reduce the thermal conductivity of the membrane, a recess is etched into the membrane from below.
G01N 27/04 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
G01N 27/14 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of an electrically-heated body in dependence upon change of temperature
H01L 21/84 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
G01F 1/684 - Structural arrangementsMounting of elements, e.g. in relation to fluid flow
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
97.
Sensor chip and method for manufacturing a sensor chip
The present sensor chip comprises a substrate. A plurality of electrode elements is arranged at a first level on the substrate with at least one gap between neighboring electrode elements. A metal structure is arranged at a second level on the substrate, wherein the second level is different from the first level. The metal structure at least extends over an area of the second level that is defined by a projection of the at least one gap towards the second level.
G01R 27/26 - Measuring inductance or capacitanceMeasuring quality factor, e.g. by using the resonance methodMeasuring loss factorMeasuring dielectric constants
G01N 27/22 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
98.
Method for manufacturing chemical sensor with multiple sensor cells
In a method for manufacturing a chemical sensor with multiple sensor cells, a substrate is provided and an expansion inhibitor is applied to the substrate for preventing a sensitive material to be applied to an area on the substrate for building a sensitive film of a sensor cell to expand from said area. The sensitive material is provided and the sensitive film is built by contactless dispensing the sensitive material to said area.
H01L 21/302 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
H01L 21/461 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
H01L 21/4763 - Deposition of non-insulating-, e.g. conductive-, resistive-, layers on insulating layersAfter-treatment of these layers
An input device for triggering a function of an electronic device comprises a humidity sensor (12), and a control unit (11). The control unit (11) analyzes a humidity signal (RH) supplied by the humidity sensor (12) and provides a trigger signal (C) subject to the analysis of the humidity signal (RH) for triggering the function of the electronic device (3). In such way, the function of the electronic device can simply be controlled by blowing at the input device (1).
G09G 5/00 - Control arrangements or circuits for visual indicators common to cathode-ray tube indicators and other visual indicators
G06F 3/01 - Input arrangements or combined input and output arrangements for interaction between user and computer
H03K 17/94 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the way in which the control signals are generated
In a method for manufacturing a sensor chip a spacer (3) is arranged at the front side (11) of a substrate (1) at which front side (11) a sensing element (2) is arranged, too. Holes (14) are etched for building vias (15) extending through the substrate (1) between the front side (11) of the substrate (1) and its back side (12). After etching, the holes (14) are filled with conductive material to complete the vias (15). The spacer (3) provides protection to the sensing element (2) and the sensing chip throughout the manufacturing process.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
G09G 1/00 - Control arrangements or circuits, of interest only in connection with cathode-ray tube indicators
G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups
patents
