An electrically conductive component includes a substrate and an electrically conductive via that can include an electrically conductive coating bonded to an internal surface of the substrate, a fill that is surrounded by the electrically conductive coating, and first and second electrically conductive end caps that hermetically seal opposed ends of the vias.
Optical interconnect modules and systems for high-density applications, including foldable optical interconnect modules having connector interfaces configured to provide electrical connections to a host printed circuit board, flexible circuits for routing electrical signals, optical carrier assemblies integrating electrooptic components, and thermal management structures providing thermal dissipation paths are described. Also disclosed are modular optical interconnect modules employing stackable sub-modules integrating optical elements, printed circuit board assemblies, and thermal management interfaces, enabling scalable configurations with vertical fiber routing. The optical interconnect modules and arrangements support high-speed signal conversion between electrical and optical domains while maintaining thermal efficiency through direct coupling to external cooling systems. Methods of assembling and using the optical interconnect modules in high-density configurations around processing units are also provided, including techniques for electrical signal distribution, optical signal routing, and thermal management optimization.
An electrical conductor as described and claimed herein. The electrical conductor may include a first electrical ground shield coupled to a second electrical ground. The second electrical ground may include one or more cantilevered fingers. The conductor may include one or more biasing mechanisms.
An electrical connector as described and claimed herein. The electrical connector may be a signal transmission line. The electrical connector may use a high dielectric constant material.
A substrate includes a top substrate layer configured to mate with an electrical connector or electrical cable, a first middle substrate layer, and a lower substrate layer including a lower resistor layer. The top substrate layer or the first middle substrate layer can include a middle resistor layer. The substrate can further include a second middle substrate layer located between the first middle substrate layer and the lower substrate layer, and the second middle substrate layer can be an insulating layer.
An optical system and method for reducing optical feedback into a light source of a transmit channel in an optical interconnect module is disclosed. The optical system reduces optical feedback into the light source by attenuating back reflection, redirecting back reflections, or some combination of attenuation and redirection. The optical interconnect module may include a self-attenuating lens that attenuates back reflections and/or an angled fiber end face that redirects reflections from the end face so that they are not coupled back to the light source. A fiber ferrule that supports the optical fiber may be mated and unmated from the optical interconnect module.
An ambient and low-temperature, cryogenic interconnect and cable assembly can be made from materials that do not create unwanted parasitic heat transfer, particularly at transition temperatures at or around twenty degrees Kelvin. Because these materials are not generally solderable, ways of attaching electrically conductive wires or cable conductors to electrical conductors is also disclosed herein. In some embodiments, a cryogenic interconnect may include a housing, and at least one or more superconducting capable first electrical conductors being made from a non-SnPb solderable material.
Electrical cables are disclosed can include at least one electrical conductor, an inner electrical insulator that surrounds the at least one electrical conductor, and an electrical shield disposed about the inner electrical insulator. The electrical cables can include an electrically conductive material disposed between adjacent layers of the electrical cable. In one example, an electrical coating can be disposed in the electrical shield, for instance, in regions of overlap. Flowable electrically conductive materials are also disclosed that can flow into gaps during operation of the electrical cable.
The present embodiment relates to an electrical connector that may be fixed to a printed circuit board when assembled. The connector includes an outer periphery having one or more circumferential grooves receiving at least one sealing member, and when the connector is fixedly attached to the printed circuit board, the connector is configured to move within a bore hole of a panel in two opposite directions.
A twinaxial cable splitter includes first and second electrical splitter conductors that are configured to be placed in electrical communication with respective first and second signal conductors of a twinaxial electrical cable at one end of the electrical splitter conductors, and are configured to be placed in electrical communication with respective first and second electrical signal conductors of first and second coaxial electrical cables. Thus, the first and second coaxial electrical cables are placed in electrical communication with the first and second electrical signal conductors, respectively, of the twinaxial cable. The twinaxial cable is in electrical communication with an IC die package. The first and second coaxial electrical cables are configured to route electrical signals to a testing device that is configured to determine certain metrics of an IC chip of the die package.
H01R 25/00 - Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
H01R 12/72 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
H01R 12/75 - Coupling devices for rigid printing circuits or like structures connecting to cables except for flat or ribbon cables
14.
FLEX CIRCUIT AND ELECTRICAL COMMUNICATION ASSEMBLIES RELATED TO SAME
Flex circuit embodiments are provided having high signal conductor density and high signal integrity. Electrical communication systems are described that are configured to be placed in electrical communication with the flex circuits. Electrical communication systems are described that include an electrical connector that is selectively intermatable with an electrical connector that is mounted to a flex circuit, and an electrical connector that is mounted to a substrate such as a printed circuit board (PCB).
An interconnect module having a base substrate with a microcontroller on a top surface and a photonic integrated circuit (PIC) and photodetector array on an opposed bottom surface is described. The interconnect module has a top and bottom fiber assembly, which both have a row of optical fibers. The bottom fiber assembly is actively aligned with the PIC to maximize optical coupling efficiency between the bottom fiber assembly and the PIC and then permanently affixed in this position. The top fiber assembly is actively aligned with the photodetector array to maximize optical coupling efficiency between the top fiber assembly and the photodetector array and then permanently affixed in this position.
H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water
G02B 6/42 - Coupling light guides with opto-electronic elements
09 - Scientific and electric apparatus and instruments
Goods & Services
Electrical connectors for signals; radio frequency (RF)
electrical connectors; electrical power connectors; fiber
optic connectors; electrically conductive substrates,
namely, circuit boards made primarily of glass.
18.
ULTRA HIGH SPEED SIGNAL CABLE CONNECTOR HAVING CHARACTERISTICS OF COMPACT IN STRUCTURE, SMALL IN OCCUPIED SPACE, CONVENIENT TO WELD AND HIGH IN TRANSMISSION EFFICIENCY
A cable connector includes a cable including a center conductor, a first housing, and an overmold attached to the cable and the first housing. The cable connector can include a second housing and the overmold can be attached to the second housing. Alternatively, a cable connector system includes a cable connector including a first latch, and a board connector including a second latch and a shield, wherein the shield is staked to a substrate, and a body of the cable connector includes an outer wall that extends over the shield when the cable connector is mated to the board connector.
An interconnect module and mating ring connector are described. The interconnect module may be a transceiver, transmitter, or receiver that is part of an optical communication system. The interconnect module has a low profile and small footprint The interconnection system is capable of transferring information at high data rates.
An electrical connector comprising, an electrically insulative housing, the electrically insulative housing having a front face and an opposed rear face, a plurality of electrical cables carried by the insulative housing, a plurality of electrical conductors positioned at the front face of the insulative housing and each respective one of the plurality of electrical cables individually electrically attached to a respective one of the plurality of electrical conductors, and a forward biasing means extending from the opposed rear face of the electrically insulative housing, wherein a line drawn through a first biasing center of one biasing member of the forward biasing means and a first cable center of one or the plurality of electrical cables does not intersect a second biasing center of a second biasing member of the forward biasing means.
H01R 12/73 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
H01R 13/26 - Pin or blade contacts for sliding co-operation on one side only
An electrical connector apparatus and method as described herein. The electrical connector may include a plug connector. The electrical connector may include a mating interface. The mating interface may include a plurality of plates. The electrical connector may include a substrate. The electrical connector may include a cable connector. The electrical connector may have at least a density of at least 213 differential pairs per square inch, including 256 differential pairs per square inch. The electrical connector may include at least one internal and/or external locking mechanism.
H01R 25/00 - Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits
H01R 13/639 - Additional means for holding or locking coupling parts together after engagement
H01R 4/18 - Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one anotherMeans for effecting or maintaining such contactElectrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation effected solely by twisting, wrapping, bending, crimping, or other permanent deformation by crimping
A cable can include a first end and a second end. The cable can be adapted to transmit an electrical signal or light from the first end to the second end. The cable can be a non-extruded dielectric. The cable can be a waveguide. The cable can be manufactured by three-dimensional printing. The cable can have any desired length. The cable can be manufactured by sequentially printing any number of segments.
Methods and apparatus are provided for additively fabricating an electrical component such as an electrical connector. An additive manufacturing station includes at least two beams that intersect in a bath of resin, such that the combined energy of the beams at the intersection is sufficient to crosslink the resin.
H01R 43/20 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
B21D 22/02 - Stamping using rigid devices or tools
29.
INVERTIBLE TWO-PHASE MODULE COOLING APPARATUS AND METHOD
A heat sink apparatus and method for heat transfer. The heat sink may include one or more fins. The heat sink may include one or more cavities. The heat sink may include one or more working fluids. The heat sink, or portions thereof, may be made by additive manufacturing.
A data communication line can include a first segment, a second segment, and an electrically conductive element coupled to each of the first and second segments such that the first and second segments are movable relative to each other. The first and second segments can be electrically insulative. The first and second segments can be spaced from each other along a central axis of the data communication line. The first and second segments can be manufactured by an additive manufacturing process.
09 - Scientific and electric apparatus and instruments
Goods & Services
(1) Electrical connectors for signals; radio frequency (RF) electrical connectors; electrical power connectors; fiber optic connectors; electrically conductive substrates, namely, circuit boards made primarily of glass.
An apparatus and method for direct attachment to a host substrate. The electrical connectors may be positioned on a host substrate opposite to a die package. Adjacent shields of the electrical connectors may not physically touch one another. A film and/or interposer may include one or more compressible electrically nonconductive portion(s) and/or one or more compressible electrically conductive portion(s).
H05K 1/14 - Structural association of two or more printed circuits
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H01R 13/6587 - Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs
H01R 12/71 - Coupling devices for rigid printing circuits or like structures
Electrical components, and associated methods for manufacturing, are described herein. In one aspect, an electrical component can include a substrate defining a first external surface and a second external surface opposite the first surface, and an internal surface that extends from the first external surface toward the second external surface; an electrically conductive layer that extends along the internal surface of the substrate between the first and second surfaces; and an electrically conductive end cap that is bonded to the electrically conductive layer and extends at least to the first surface.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
Provided herein are methods and components for increasing the resistance of an electrical component to wear by the inclusion of hexagonal boron nitride (hBN) in coating applications for electronic components. Also provided are electronic components having enhanced wear resistance. The present disclosure also provides dielectric materials that contain hBN structures, as well as components for conducting an electrical signal that contain the inventive dielectric materials.
C25D 5/12 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
C23C 14/02 - Pretreatment of the material to be coated
C23C 14/06 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
C23C 14/16 - Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
C23C 30/00 - Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
C25D 3/12 - ElectroplatingBaths therefor from solutions of nickel or cobalt
37.
INDIVIDUALLY DEFINED OPTICAL ELEMENTS FOR USE IN AN OPTICAL INTERCONNECT MODULE WITH WIREBONDED COMPONENTS
An individually aligned optical element is incorporated in an optical interconnect module to enable efficient optical communication between an electrooptic component and an optical waveguide. Electrical connections to the electrooptic component are made using wirebonds attached to wirebond pads on a first surface of the electrooptic component. The individually aligned optical element is defined relative to either an active area on the first surface of the electrooptic component or a core of an optical waveguide. The optical element may be situated within or on a surface of a transparent substrate, within or on a surface of an optical block, or directly within or on a surface of an encapsulant covering the electrooptic component. There may be a plurality of active areas and optical waveguides, and each active area and optical waveguide has a corresponding optical element which is individually aligned.
G02B 6/42 - Coupling light guides with opto-electronic elements
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/122 - Basic optical elements, e.g. light-guiding paths
38.
INDIVIDUALLY DEFINED OPTICAL ELEMENTS FOR USE IN AN OPTICAL INTERCONNECT MODULE
An individually aligned optical element is incorporated in an optical interconnect module to enable efficient optical communication between an electrooptic component and an optical waveguide. The individually aligned optical element is defined, potentially using laser processing or additive manufacturing, within or on a surface of a transparent carrier to which the electrooptic component is mounted or within and/or on a surface of an optical block, which is arranged to attach to the transparent carrier. The individually aligned optical element is defined relative to either an active area of the electrooptic component or a core of an optical waveguide. There may be a plurality of active areas and optical waveguides, and each active area and optical waveguide has a corresponding optical element which is individually aligned, enabling high coupling efficiency and potentially providing features like collimated beams for enhanced assembly tolerance.
G02B 6/42 - Coupling light guides with opto-electronic elements
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/122 - Basic optical elements, e.g. light-guiding paths
An electrical connector includes a connector body and at least one row of electrical contacts included within the connector body. The at least one row of electrical contacts includes at least one power contact and a plurality of signal contacts, and the plurality of signal contacts includes a first signal contact and a second signal contact that are separated from one another by the at least one power contact.
H01R 12/72 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
H01R 13/24 - Contacts for co-operating by abutting resilientContacts for co-operating by abutting resiliently mounted
H01R 12/61 - Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
Disclosed are methods for producing articles, including multi-material articles, articles produced by such methods, and systems for producing such articles.
B29C 64/135 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources
B33Y 70/10 - Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
A printed circuit board apparatus and method as described herein. The printed circuit board may couple to one or more connectors. The printed circuit board may define at least a portion of one or more notches. The printed circuit board may include one or more fastener receiving holes. The printed circuit board may include one or more receptacles.
H01R 12/71 - Coupling devices for rigid printing circuits or like structures
H01R 12/72 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
H01R 12/73 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
A substrate is provided that includes a substrate body made of a material such as glass, and at least one electrical via that can extend at least into or through the substrate body. The via is metalized with a molten metal that enters the via under capillary action and solidifies to establish electrical conductivity through the via. The melting temperature of the metal is less than the transition temperature and melting temperature of the substrate body.
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
In accordance with one aspect of the present disclosure, an electrical connector can include an electrical cable. The electrical cable can terminate at a first end and at a second end. A first edge card connector can be coupled to the first end of the electrical cable, and a second edge card connector can be coupled to the second end of the electrical cable. The first edge card connector and the second edge card connector can be in electrical communication with each other via the electrical cable. The second edge card connector can be another of the first edge card connector. The first edge card connector and the second edge card connector can each be configured to couple to mating interfaces of a respective GPU, thereby placing the respective GPUs in direct data communication with one another.
An electrical connector, such as an RF or coaxial connector, can include a housing that can be electrically conductive. An electrically conductive conductor can be positioned in the electrically conductive connector housing. The electrically conductive conductor can define a compression end that defines a preformed bend. The preformed bend can be elastically compliant in a direction perpendicular to a mating substrate.
H01R 24/40 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
H01R 12/91 - Coupling devices allowing relative movement between coupling parts e.g. floating or self aligning
Customer services, namely, responding to customer inquiries
in the field of electrical signal interconnects, electrical
radio frequency (RF) interconnects, and electrical power
interconnects, optical interconnects, and electrically
conductive substrates.
09 - Scientific and electric apparatus and instruments
Goods & Services
Electrical connectors for signals; radio frequency (RF) electrical connectors; electrical power connectors; fiber optic connectors; electrically conductive substrates, namely, circuit boards made primarily of glass
42 - Scientific, technological and industrial services, research and design
Goods & Services
Computer services, namely, hosting an interactive web site
that features technology that allows users to design their
own cable assemblies and interconnects for use with
board-to-board systems, cable systems, power systems,
optical systems, and radio frequency (RF) systems customized
to user-defined specifications.
This present disclosure increases the interconnect density by using a different technology approach than the industry is currently using (stamping and molding). By using a MEMS-based technology approach, better geometry and impedance control can be carried out to reduce impedance discontinuities and feature size. Additional concepts include low connector insertion force, no contact wiping, and a precise alignment mechanism between the connector contacts and those on the mating substrate.
H01R 12/73 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
G02B 6/42 - Coupling light guides with opto-electronic elements
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
H01R 12/62 - Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
H01R 12/72 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
H01R 13/506 - BasesCases composed of different pieces assembled by snap action of the parts
H01R 13/631 - Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure for engagement only
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
A signal transmission line, such as a waveguide or electrical cable, can include a spacer that bears against an electrical shield so as to provide enhanced structurally stability and increased signal integrity performance. The waveguide can be a hollow or semi-hollow waveguide. The electrical cable can be a coaxial or twinaxial electrical cable.
This present disclosure seals the light propagation path in an optical interconnection element from external contaminants. The optical interconnection element includes a reflective surface, which can also be sealed from external contaminants. Additional novel concepts include all enclosed sealed regions of the optical interconnection element being fluidly connected and making the final seal of the optical interconnection element with a thin plate, which can bend reducing the pressure differential between the ambient environment and the sealed internal volume of the optical interconnection element.
An interconnection system is configured to be carried by a substrate and includes a cage that is configured to be connected to the substrate, that includes a first end and a second end opposed to the first end, and that is configured to receive an interconnection module; and an electrical connector located at the second end of the cage. The electrical connector includes a fixed connector that is configured to be rigidly attached to the substrate and a detachable connector that is configured to be mated and unmated from the fixed connector.
H01R 12/71 - Coupling devices for rigid printing circuits or like structures
H01R 12/75 - Coupling devices for rigid printing circuits or like structures connecting to cables except for flat or ribbon cables
H01R 13/6583 - Shield structure with resilient means for engaging mating connector with separate conductive resilient members between mating shield members
H04B 1/38 - Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
A radio frequency (RF) electrical contact includes an electrical contact having a stationary electrical contact member and a movable electrical contact member that is received by the stationary electrical contact member. The movable electrical contact member is movable between an initial position and a mated position. The movable electrical contact member can contact the stationary electrical contact member at a stationary or fixed contact location.
H01R 24/44 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency comprising impedance matching means or electrical components, e.g. filters or switches comprising impedance matching means
H01R 12/71 - Coupling devices for rigid printing circuits or like structures
H01R 13/24 - Contacts for co-operating by abutting resilientContacts for co-operating by abutting resiliently mounted
H01R 13/631 - Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure for engagement only
A data communication system can include a low-profile electrical connector that is sized to be mounted onto a PCB in a gap between the PCB and a heat sink that overhangs from an IC that is mounted to the PCB. The data communication system further includes an electrical cable that extends from the electrical connector to an optical transceiver. A cable management laminate can route the electrical cables along a predetermined path. The data communication system can be disposed in a system tray that is configured to force air over the heat sink. The airflow over the heat sink can be adjustable.
An electrical connector includes a connector housing that supports a plurality of leadframe assemblies that include a ground plate and a signal wafer that abuts the ground plate. The signal wafer of one leadframe assembly is spaced from the ground plate of an adjacent signal wafer so as to define an air gap therebetween. A housing portion defines at least one, at least two, at least three or three or more discrete, adjustable skew correction areas, skew voids or respective air voids.
H01R 13/6587 - Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs
H01R 12/72 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
H01R 13/6477 - Impedance matching by variation of dielectric properties
Electrical cables and optical waveguides are disclosed as including an electrically insulative foam. The electrically insulative foam can coat at least one electrical conductor of the electrical cable. The electrically insulative foam can coat the optical fiber of the waveguide. The electrically insulative foam can also define a waveguide.
An electrical contact for an electrical connector includes a contact body and a lossy material located on the contact body. An electrical connector includes contacts with a lossy material located on the contact body. A method of applying a lossy material to a contact for an electrical connector includes providing a contact and applying the lossy material to the contact.
H01R 12/62 - Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
H01R 12/75 - Coupling devices for rigid printing circuits or like structures connecting to cables except for flat or ribbon cables
H01R 13/03 - Contact members characterised by the material, e.g. plating or coating materials
H01R 13/6585 - Shielding material individually surrounding or interposed between mutually spaced contacts
H01R 13/6589 - Shielding material individually surrounding or interposed between mutually spaced contacts with wires separated by conductive housing parts
An electrical contact for an electrical connector includes a contact body and a lossy material located on the contact body. An electrical connector includes contacts with a lossy material located on the contact body. A method of applying a lossy material to a contact for an electrical connector includes providing a contact and applying the lossy material to the contact.
H01R 13/6599 - Dielectric material made conductive, e.g. plastic material coated with metal
H01R 12/75 - Coupling devices for rigid printing circuits or like structures connecting to cables except for flat or ribbon cables
H01R 13/6471 - Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
H01R 13/6587 - Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs
Belly-to-belly electrical connectors are disclosed that can be mounted on opposite sides of a substrate, such as printed circuit board, and have the identical footprints that are aligned when the connectors are mounted to the substrate. No projections of the first electrical connector that extend into the substrate are aligned with any projections of the second electrical connector that extend into the substrate. Similarly, no projections of the second electrical connector that extend into the substrate are aligned with any projections of the first electrical connector that extend into the substrate.
Shielded electrical connectors are described herein. An electrical connector can include a connector housing. The electrical connector can further include at least one electrical connector supported by the connector housing. The electrical connector can further include an electrical shield that at least partially surrounds the at least one electrical contact, where the electrical connector is configured to transmit data signals along the at least one electrical contact. The electrical connector can be configured to mate with a corresponding electrical connector having another electrical shield. When the electrical connector and the corresponding connector are partially seated, the data signals can experience crosstalk interference levels that are approximately the level of crosstalk interference the data signals experience when the electrical connector and the corresponding electrical connector are fully seated.
An electrical connector apparatus and method as described herein. The electrical connector may include a plug connector. The electrical connector may include a mating interface. The mating interface may include a plurality of plates. The electrical connector may include a substrate. The electrical connector may include a cable connector. The electrical connector may have at least a density of 256 differential pairs per square inch. The electrical connector may include at least one internal and/or external locking mechanism.
H01R 13/6587 - Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs
H01R 12/79 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
H01R 13/652 - Protective earth or shield arrangements on coupling devices with earth pin, blade or socket
H01R 13/514 - BasesCases formed as a modular block or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
H01R 13/518 - Means for holding or embracing insulating body, e.g. casing for holding or embracing several coupling parts, e.g. frames
42 - Scientific, technological and industrial services, research and design
Goods & Services
(1) Computer services, namely, hosting an interactive web site that features technology that allows users to design their own cable assemblies and interconnects for use with board-to-board systems, cable systems, power systems, optical systems, and radio frequency (RF) systems customized to user-defined specifications.
(1) Customer services, namely, responding to customer inquiries in the field of electrical signal interconnects, electrical radio frequency (RF) interconnects, and electrical power interconnects, optical interconnects, and electrically conductive substrates.
70.
MANAGING UNWANTED HEAT, MECHANICAL STRESSES AND EMI IN ELECTRICAL CONNECTORS AND PRINTED CIRCUIT BOARDS
A substrate reinforcement or stiffener can be toolless, slide-on, slide-off, and removable. A hold down can carry pre-attached solder balls, solder units, or fusible elements. Fusible elements can be shaped to reduce thermal and mechanical stresses when reflowed onto a substrate. A heat-producing article can include a heat-dissipation material selectively located on, or immediately adjacent to, a heat-producing article. Clips with a plurality of fingers can be added to power conductors. Graphene strips, graphene coatings, or nanomaterials can be applied to electrically non-conductive articles and are able to selectively direct unwanted heat away from the heat-producing article. Electro-magnetic interference can be reduced by selective placement of voids in a shield of an electrical component.
H05K 7/14 - Mounting supporting structure in casing or on frame or rack
H01F 27/36 - Electric or magnetic shields or screens
H01R 12/72 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
H01R 12/73 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
An electrical conductor assembly can include a first connector and a coupler configured to couple to the first connector and a second conductor so as to electrically connect the first connector to the second conductor. The first connector can be a coaxial cable. The second conductor can be a coaxial cable. The first connector can be more rigid than the second conductor. The first connector can be configured to couple to a substrate. An end of the first connector can include an engagement surface configured to remove oxidation on the substrate.
H01R 9/05 - Connectors arranged to contact a plurality of the conductors of a multiconductor cable for coaxial cables
H01R 24/38 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
H01R 13/629 - Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure
H01R 13/504 - BasesCases composed of different pieces different pieces being moulded, cemented, welded, e.g. ultrasonic, or swaged together
Electrically conductive pastes are disclosed that are configured to fill a hole in a substrate. The paste can be cured in the hole so as to define an electrically conductive metallized via. Fills that perform at high temperatures are also disclosed.
An edge-mount connector that self-adjusts against an edge thickness of a substrate, such as a printed circuit board. Rotation of fasteners, along with direct or indirect engagement between the fasteners and corresponding surfaces on the edge-mount connector or a clamp of the edge-mount connector can walk the edge-mount connector towards and against the edge thickness of the substrate.
H01R 24/50 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
Various embodiments of an electrical component and a method of forming such electrical component are disclosed. The electrical component includes a substrate and one or more corrosion-resistant vias Each of the one or more corrosion-resistant vias includes one or more sidewalls formed by the substrate an interface layer disposed on at least a portion of the one or more sidewalls, and gold alloy bonded to the interface layer.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
Various embodiments of an electrical component and a method of forming such electrical component are disclosed. The electrical component includes a substrate and one or more corrosion-resistant vias. The substrate includes ceramic or sapphire. Each of the one or more corrosion-resistant vias includes one or more sidewalls formed by the substrate a corrosion-resistant alloy bonded to the one or more sidewalls.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
An orthogonal electrical connector system includes vertical electrical connectors that are configured to e mated to each other so as to place respective pluralities of first and second substrates that are oriented orthogonal to each other in data communication with each other through the mated electrical connectors. Other connector systems are also disclosed.
H01R 12/71 - Coupling devices for rigid printing circuits or like structures
H01R 12/73 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
H01R 13/04 - Pins or blades for co-operation with sockets
An optical engine having an optically transparent substrate with a lens on a first major surface and an optoelectronic element on an opposed second major surface is described. The optical engine has a sealed optical path and is capable of operating submerged in a cooling liquid. The optical engine may be attached to a mounting substrate to form an optoelectronic subassembly that may be incorporated in many different types of optical interconnects.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
G02B 6/42 - Coupling light guides with opto-electronic elements
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 23/44 - Arrangements for cooling, heating, ventilating or temperature compensation the complete device being wholly immersed in a fluid other than air
An electrical connector includes first and second adjacent electrical contacts that each define respective first and second mating ends, the first mating end of a first one of the first and second adjacent electrical contacts defines a first contact surface, the second mating end of a second one of the first and second adjacent electrical contacts defines a second contact surface electrically isolated from the first contact surface; and a dielectric material positioned between the first and second adjacent electrical contacts. When a mating connector applies a force to the first contact surface and the second contact surface, the first and second mating ends and the dielectric material all move in a first direction.
H01R 13/6477 - Impedance matching by variation of dielectric properties
H01R 12/72 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
H01R 13/41 - Securing in non-demountable manner, e.g. moulding, riveting by frictional grip in grommet, panel or base
H01R 13/514 - BasesCases formed as a modular block or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
H01R 13/631 - Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure for engagement only
H01R 13/646 - Details of coupling devices of the kinds covered by groups or specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
A high density electrical connector can include a connector housing and electrical contacts supported by the connector housing. The contacts extend through channels of the connector housing. The channels can be arranged in rows of channels, wherein the channels of each row are spaced from each other along a row direction. The connector housing includes slots that can connect adjacent ones of the channels to each other along a row direction.
H01R 24/40 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
H01R 13/422 - Securing in a demountable manner in resilient one-piece base or caseOne-piece base or case formed with resilient locking means
H01R 13/639 - Additional means for holding or locking coupling parts together after engagement
A cable termination that helps prevent unwanted, inadvertent electrical shorting between a signal conductor and a cable ground shield, cable serve shield, or cable reference shield of a cable, such as a coaxial or twin axial cable.
Flex circuit embodiments are provided having high signal conductor density and high signal integrity. Electrical communication systems are described that are configured to be placed in electrical communication with the flex circuits. Electrical communication systems are described that include an electrical connector that is selectively intermatable with an electrical connector that is mounted to a flex circuit, and an electrical connector that is mounted to a substrate such as a printed circuit board (PCB).
An electrical component is provided by metallizing holes that extend through a glass substrate. The electrical component can be fabricated by forcing a suspension of electrically conductive particles suspended in a liquid medium through the holes. The suspension can be forced into the holes under an air pressure differential such as a pressure differential force, a centrifugal force, or an electrostatic force. The liquid medium in the holes can be dried, and the particles can be sintered. The particles can further be packed in the hole. Alternatively or additionally, the particles can be pressed against the outer surfaces of the substrate to produce buttons.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
An electrical connector apparatus and method as described herein. The electrical connector may include a plug connector. The electrical connector may include a mating interface. The mating interface may include a plurality of plates. The electrical connector may include a substrate. The electrical connector may include a cable connector. The electrical connector may have at least a density of 256 differential pairs per square inch. The electrical connector may include at least one internal and/or external locking mechanism. The electrical connector and/or interposer may include a film. The electrical connector may include a cup shaped connector. The electrical connector and/or interposer may include one or more containment structures.
H01R 13/6585 - Shielding material individually surrounding or interposed between mutually spaced contacts
H01R 13/639 - Additional means for holding or locking coupling parts together after engagement
H01R 12/71 - Coupling devices for rigid printing circuits or like structures
H01R 12/75 - Coupling devices for rigid printing circuits or like structures connecting to cables except for flat or ribbon cables
H01R 13/514 - BasesCases formed as a modular block or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
H01R 13/518 - Means for holding or embracing insulating body, e.g. casing for holding or embracing several coupling parts, e.g. frames
Radio frequency (RP) waveguides and related interconnect members are disclosed. The interconnect members can have a smaller footprint than WR15 flanges. Further, the interconnect members can be configured to mate with complementary interconnects without undergoing substantial relative rotation.
An electrical connector comprising, one or more aerosol structures deposited on one or more surfaces of the electrical connector and a method of depositing one or more aerosol materials onto one or more conductors comprising, providing one or more electrical conductors having one or more surfaces, aerosol jetting one or more aerosol structures on the one or more surfaces of the one or more electrical conductors, and at least one of masking, containing, and/or excluding one or more materials on the one or more surfaces of the one or more electrical conductors.
H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Radio frequency (RF) waveguides and related interconnect members are disclosed. The interconnect members can have a smaller footprint than WR15 flanges. Further, the interconnect members can be configured to mate with complementary interconnects without undergoing substantial relative rotation.
An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.
H04B 10/80 - Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups , e.g. optical power feeding or optical transmission through water
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
93.
OPTICAL BLOCK PROVIDING OPTICAL COMMUNICATION BETWEEN OPTICAL FIBERS AND OPTOELECTRONIC ELEMENTS
A system and method for making an optical connection between optical fibers and optoelectronic elements using an optical block is described. The optical block is a portion of an optical interconnect module that includes a detachable optical interface to a plurality of optical fibers. The optical interface may include two configurations: a first configuration and a second configuration. The first configuration includes an exposed optical path, and the second configuration includes a sealed optical path. A common optical interconnect module and a common optical block can be used in both configurations. The optical block may include alignment features that help enable accurate registration of the optical block to a mating element with respect to six degrees-of-freedom.
G02B 6/42 - Coupling light guides with opto-electronic elements
H01R 12/88 - Coupling devices connected with low or zero insertion force contact pressure producing means, contacts activated after insertion of printed circuits or like structures acting manually by rotating or pivoting connector housing parts
H01R 12/71 - Coupling devices for rigid printing circuits or like structures
H01R 12/79 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
94.
CONNECTOR WITH LINEAR COAXIAL, RIGHT ANGLE COAXIAL AND OPTICAL CONNECTORS
Modular block type of board connector having two different types of RF connectors and an optical cable with an optical connector. A RF connector with built-in impedance tuning and automatic biasing.
H01R 13/514 - BasesCases formed as a modular block or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
H01R 13/631 - Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure for engagement only
H01R 24/44 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency comprising impedance matching means or electrical components, e.g. filters or switches comprising impedance matching means
An electrical connector includes a housing and an aligner. The aligner is defined by a connector base of the housing or by an alignment peg. The aligner defined by the connector base is configured to cooperate with a corresponding fiducial to properly align the electrical connector on a mounting surface of a substrate. The aligner defined by an alignment peg includes a main body and an embossed portion that defines a protrusion that extends from the main body. The embossed portion is configured to mate with a raised or recessed portion of a substrate to properly locate and align the electrical connector to the substrate.
H01R 24/50 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
Customer services, namely, responding to customer inquiries in the field of electrical signal interconnects, electrical radio frequency (RF) interconnects, and electrical power interconnects, optical interconnects, and electrically conductive substrates
42 - Scientific, technological and industrial services, research and design
Goods & Services
Computer services, namely, providing an interactive web site that features technology that allows users to design their own cable assemblies and interconnects for use with board-to-board systems, cable systems, power systems, optical systems, and radio frequency (RF) systems customized to user-defined specifications
