Rohm Semiconductor USA, LLC

United States of America

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B41J 2/335 - Structure of thermal heads 1
B41J 2/375 - Protection arrangements against overheating 1
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1.

Thermal printhead with optimally shaped resistor layer

      
Application Number 13160503
Grant Number 08411121
Status In Force
Filing Date 2011-06-14
First Publication Date 2012-12-20
Grant Date 2013-04-02
Owner Rohm Semiconductor USA, LLC (USA)
Inventor Yamamoto, Tadashi

Abstract

A thermal printhead having an optimal resistor element shape which is capable of high speed and high quality printing is provided. The thermal printhead for progressively printing a pattern of dots on a thermosensitive paper moving in one direction, includes a substrate, and a plurality of resister elements on the substrate arranged in a substantially straight line extending in a direction perpendicular to a moving direction of the thermosensitive paper, the plurality of resistor elements each corresponding to respective one of the dots constituting the pattern to be printed onto the thermosensitive paper, each of the resistor elements having a heat transfer area that will be in contact with the thermosensitive paper upon printing the dot, wherein at least one of two sides of the heat transfer area that are substantially perpendicular to the moving direction of the thermosensitive paper has a sag in a substantially middle portion thereof to adjust a shape of the dot.

IPC Classes  ?

2.

Thermal printhead with temperature regulation

      
Application Number 13160494
Grant Number 08305411
Status In Force
Filing Date 2011-06-14
First Publication Date 2012-11-06
Grant Date 2012-11-06
Owner Rohm Semiconductor USA, LLC (USA)
Inventor Yamamoto, Tadashi

Abstract

A thermal printhead having a temperature regulation feature which is capable of high speed and high quality printing is provided. The thermal printhead includes a substrate, a resistor layer formed on one surface of the substrate, a control section and a thermoelectric element formed in direct contact with the other surface of the substrate opposite to where the resistor layer is formed, wherein the control section is configured to cool the resistor layer using the thermoelectric element.

IPC Classes  ?

  • B41J 2/375 - Protection arrangements against overheating