Goods & Services

Electric and electronic circuits; circuit components, namely, electric conductors and power distribution circuits for high currents; busbars

Abstract

A curable composition includes particular amounts of a hydrogenated block copolymer having terminal reactive groups, a polymeric reactive diluent having a glass transition temperature of greater than or equal to 100° C. and at least one crosslinkable reactive group, and a filler. The curable compositions can provide corresponding cured compositions which can be useful in applications including build-up films, polytetrafluoroethylene (PTFE) replacement materials, and filled laminate core materials.

IPC Classes  ?

• C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
• C08K 7/26 - Silicon-containing compounds

Abstract

A sound-absorbing material includes an open-cell, filled silicone foam having a density of less than 155 kg/m3 and a porosity of at least 70%, wherein the silicone foam has an average cell size of less than 2300 micrometers, determined in a direction parallel to the rise direction, and an average cell size of less than 800 micrometers, determined in a direction perpendicular to the rise direction, each determined by optical microscopy.

IPC Classes  ?

• C08G 77/12 - Polysiloxanes containing silicon bound to hydrogen
• C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
• C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
• C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof
• C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent

Abstract

A process for making polyurethane includes dissolving a metal acetyl acetonate catalyst in a solvent to form a catalyst solution including greater than 0.25 to 42 weight percent, or 4.8 to 42 weight percent, of metal acetyl acetonate catalyst, based on a total weight of the catalyst solution; combining the catalyst solution, a polyol, and an isocyanate to form a reactive mixture; and curing the reactive mixture to form polyurethane.

IPC Classes  ?

• C08G 18/22 - Catalysts containing metal compounds
• B01J 31/22 - Organic complexes
• C08G 18/48 - Polyethers
• C08G 18/72 - Polyisocyanates or polyisothiocyanates

Abstract

A process for making polyurethane includes dissolving a metal acetyl acetonate catalyst in a solvent to form a catalyst solution including greater than 0.25 to 42 weight percent, or 4.8 to 42 weight percent, of metal acetyl acetonate catalyst, based on a total weight of the catalyst solution; combining the catalyst solution, a polyol, and an isocyanate to form a reactive mixture; and curing the reactive mixture to form polyurethane.

IPC Classes  ?

• C08G 18/22 - Catalysts containing metal compounds
• C08G 18/08 - Processes
• C08G 101/00 - Manufacture of cellular products

Goods & Services

Insulation Material Made of Copper Clad Alumina Substrate; Insulation Material Made of Copper Clad Silicon Nitride Substrate; Insulation Material Made of Copper Clad Aluminum Nitride Substrate; Insulation Elements with Current Conductors Made of Copper on Ceramic Alloys; Insulation Material with Current Conductor Made of Copper on Ceramic Alloy.

Goods & Services

Insulation Material Made of Copper Clad Alumina Substrate; Insulation Material Made of Copper Clad Silicon Nitride Substrate; Insulation Material Made of Copper Clad Aluminum Nitride Substrate; Insulation Elements with Current Conductors Made of Copper on Ceramic Alloys; Insulation Material with Current Conductor Made of Copper on Ceramic Alloy

Abstract

A flame retardant foam including polyurethane; and flame retardant additives, wherein the flame retardant foam has a density of 8 to less than 11.7 pounds per cubic foot (128 to less than 187 kilograms per cubic meter), a thickness of 2.7 to 8 millimeters, or 2.8 to 8 millimeters, or 3 to 8 millimeters, and a UL 94 rating of V-0.

IPC Classes  ?

• C08J 9/06 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
• C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
• C08K 3/04 - Carbon
• C08K 3/32 - Phosphorus-containing compounds

Goods & Services

(1) Custom manufacture of foam designs to the order and specification of others (2) Providing information in the field of advanced material solutions, foam materials, materials selection, product design using foam materials, product testing, and custom foam designs (3) Custom design and engineering of foam designs

Abstract

Provided herein are various enhancements for planar antennas and corresponding antenna arrays. In one example, an assembly includes a plurality of antenna cells formed in a shared printed circuit board stackup, a rigid superstrate layer mounted onto the printed circuit board stackup, and a substrate layer mounting the printed circuit board stackup to a baseplate. Each of the antenna cells comprise conductive plates at quadrants of the antenna cell and coupled through vias in the layered stackup arrangement from a plate layer to a ground plane layer, flared antenna feeds arranged in an orthogonal pair positioned within central gaps between the conductive plates and below the plate layer, and barrier vias positioned in sets below the conductive plates in each of the quadrants and arrayed about the flared antenna feeds.

IPC Classes  ?

• H01Q 9/28 - Conical, cylindrical, cage, strip, gauze or like elements having an extended radiating surface Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines
• H01Q 21/00 - Antenna arrays or systems

Goods & Services

High-speed digital hubs. High-performance thermoset material in the nature of films and sheets made out of thermoset for use in the manufacture of circuit boards; structural thermoset composites, namely, structural thermoset molding composites containing fiber reinforcement for use in the manufacture of goods; semi-processed thermoset polymer resins for enhanced thermal conductivity, enhanced electrical conductivity, enhanced gas barrier properties and enhanced chemical resistance; semi-processed thermoset polymer resins for use in manufacture.

Goods & Services

High-performance thermoset material in the nature of films and sheets made out of thermoset for use in the manufacture of circuit boards; structural thermoset composites, namely, structural thermoset molding composites containing fiber reinforcement for use in the manufacture of goods; semi-processed thermoset polymer resins for enhanced thermal conductivity, enhanced electrical conductivity, enhanced gas barrier properties and enhanced chemical resistance; semi-processed thermoset polymer resins for use in manufacture

Abstract

The invention relates to a distribution structure (86) for a heat sink element for cooling an electric power module (10), wherein the heat sink element (1) comprises - a main part having a first end face (S1) which, in the installed state, faces a surface to be cooled, and having a second end face (S2) opposite the first end face (S1), and - cooling channels (30, 30') which are embedded in the main part between the first end face (S1) and the second end face (S2), wherein: the cooling channels (30, 30') each have a supply portion (31), a redirecting portion (32), and a discharge portion (33); in order to form a general flow profile in the respective cooling channel (30, 30'), the cooling channels (30, 30') are designed to conduct a cooling medium in the supply portion (31) towards the first end face (S1), to transfer it, in the redirecting portion (32), to the discharge portion (33), and to conduct it in the discharge portion (33) towards the second end face (S2); and the heat sink element (1) and the distribution structure (86) extend along a plane parallel to the main extension plane (HSE) and, in an assembled state, are arranged one above the other along a stacking direction (S) perpendicular to the main extension direction (HSE).

IPC Classes  ?

• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

Proposed is a method for providing a heat sink element (1) for a power module or an electronic component, providing an initial main body which has a plurality of cooling channels (30) which are formed into the initial main body between a first end face (S1), which in the installed state faces a surface to be cooled, and a second end face (S2), which is situated opposite the first end face (S1), wherein the cooling channels (30, 30') each have a feed portion (31), a diverting portion (32) and a discharge portion (33), wherein, in order to form a general flow profile in each cooling channel, the cooling channels (30, 30') are each designed to convey a cooling medium in the feed portion (31) in the direction of the first end face (S1), to transfer said cooling medium in the diverting portion (32) into the discharge portion (33), and to convey said cooling medium in the discharge portion (33) in the direction of the second end face (S2), and separating the initial main body into heat sink elements (1).

IPC Classes  ?

• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• H01L 23/367 - Cooling facilitated by shape of device

Abstract

A sound-absorbing material including a foam; and sound-absorbing particles fixed directly to surfaces of cells walls in the foam.

IPC Classes  ?

• H04R 1/28 - Transducer mountings or enclosures designed for specific frequency responseTransducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means

Abstract

The invention relates to a system consisting of a heat sink element (1) for an electrical power module and a distribution structure (86) for supplying the heat sink element (1) with a cooling fluid, wherein the heat sink element (1) comprises • - a main body (1) having a first end face (figure 7, top) which, when installed, faces a surface to be cooled, and having a second end face (the end face adjoining reference sign 86 in figure 7) opposite the first end face and facing the distribution structure and • - a cooling duct (30-33) fitted into the main body, wherein the cooling duct (30) has a feed portion (31), a deflection portion (32) and a discharge portion (33), wherein the cooling duct (30) is designed to form a general flow path (SR) for a cooling medium, wherein the feed portion and the discharge portion are separated from one another by a heat sink wall (15), wherein the distribution structure (86) is configured in such a way that it introduces the cooling fluid via a feed duct (81) into the feed portion (31) and receives the cooling fluid exiting from the discharge portion (32) via a discharge duct (82), wherein the feed duct and the discharge duct are separated from one another by a distributor wall (85) and wherein, in the assembled state, the heat sink wall (15) and the distributor wall (85) are arranged in such a way that, on feed of the cooling fluid from the distribution structure to the heat sink element, the flow between heat sink wall and distributor wall is less than the flow in the feed portion.

IPC Classes  ?

• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids

Abstract

A sound-absorbing material including a foam; and sound-absorbing particles fixed directly to surfaces of cells walls in the foam.

IPC Classes  ?

• G06F 1/16 - Constructional details or arrangements
• G10K 11/162 - Selection of materials
• G10K 11/165 - Particles in a matrix
• G10K 11/175 - Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effectsMasking sound
• H04R 1/28 - Transducer mountings or enclosures designed for specific frequency responseTransducer enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
• C08G 18/06 - Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
• C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
• C08K 3/34 - Silicon-containing compounds
• C08K 3/36 - Silica

Abstract

A sound-absorbing material includes an open-cell, filled silicone foam having a density of less than 155 kg/m3 and a porosity of at least 70%, wherein the silicone foam has an average cell size of less than 2300 micrometers, determined in a direction parallel to the rise direction, and an average cell size of less than 800 micrometers, determined in a direction perpendicular to the rise direction, each determined by optical microscopy.

IPC Classes  ?

• C08L 83/10 - Block- or graft-copolymers containing polysiloxane sequences
• C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
• C08G 77/08 - Preparatory processes characterised by the catalysts used
• C08G 77/442 - Block- or graft-polymers containing polysiloxane sequences containing vinyl polymer sequences
• C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof
• C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
• C08K 3/22 - OxidesHydroxides of metals

Abstract

An antenna assembly includes a substrate stack 105 comprising a magnetodielectric material, at least one patch radiating element 102 on an upper surface of the substrate stack 105, and a dielectric cover 200 including a gradient lens 204 disposed over the substrate stack 105. The gradient lens 204 includes a first lens portion having a first dielectric constant, DkL1, and a second lens portion having a second dielectric constant, DkL2, different from the first dielectric constant, DkL1.

IPC Classes  ?

• H01Q 15/08 - Refracting or diffracting devices, e.g. lens, prism formed of solid dielectric material
• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
• H01Q 1/48 - Earthing meansEarth screensCounterpoises
• H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart

Abstract

A curable composition includes particular amounts of a hydrogenated block copolymer having terminal reactive groups, a polymeric reactive diluent having a glass transition temperature of greater than or equal to 100°C and at least one crosslinkable reactive group, and a filler. The curable compositions can provide corresponding cured compositions which can be useful in applications including build-up films, polytetrafluoroethylene (PTFE) replacement materials, and filled laminate core materials.

IPC Classes  ?

• C08F 299/02 - Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
• C08K 3/36 - Silica
• C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
• C09D 153/02 - Vinyl aromatic monomers and conjugated dienes

Abstract

A very thin filled silicone foam layer is formed from a composition that includes a curable polysiloxane composition including an alkenyl-substituted polyorganosiloxane, a hydride-substituted polyorganosiloxane, and a cure catalyst; a plurality of expanded polymer microspheres having a largest dimension of less than the thickness of the foam; and a filler composition, wherein each component of the filler composition has a largest dimension of less than the thickness of the foam, the filler composition comprising a particulate ceramic filler, a particulate calcium carbonate filler, or a particulate aluminosilicate clay filler having a plate morphology, or a particulate aluminosilicate clay filler having a hollow tubular morphology, a particulate polymeric silsesquioxane filler, or a particulate methyl-phenyl MQ filler, or a plurality of glass microspheres, or a particulate paraffin wax, or a combination thereof; wherein the curable filled composition has a viscosity of less than 400,000 centiStokes, or 100,000 to 350,000 centiStokes.

IPC Classes  ?

• C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof
• C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
• C08G 77/08 - Preparatory processes characterised by the catalysts used
• C08G 77/12 - Polysiloxanes containing silicon bound to hydrogen
• C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups

Goods & Services

Custom manufacture of foam designs to the order and specification of others Providing information in the field of advanced material solutions, foam materials, materials selection, product design using foam materials, product testing, and custom foam designs Custom design and engineering of foam designs

Abstract

An embodiment includes a lens 1000 for use with a signal feed 2000 for shaping electromagnetic, EM, radiation energy originating from the signal feed 2000 when energized, the lens 1000 configured to operate at a defined center frequency fc having a free space wavelength λc, the lens 1000 comprising: a plurality of dielectric materials 1100 stacked side by side, wherein an adjacent one 1100.1 of the plurality of dielectric materials has a dielectric constant, Dk, value that is different from a Dk value of another adjacent one 1100.2, 1100.3 of the plurality of dielectric materials 1100, the plurality of dielectric materials 1100 having an overall footprint a x b in an x-y plane and an overall thickness t in a z-direction, of an orthogonal x-y-z coordinate system; wherein each cross-section of the plurality of dielectric materials 1100 in the x-y plane comprises each one of the plurality of dielectric materials 1100; wherein each cross-section of the plurality of dielectric materials in one of; the x-z plane, and the y-z plane, comprises each one of the plurality of dielectric materials 1100; wherein at least one cross-section of the plurality of dielectric materials in the other one of; the x-z plane, and the y-z plane, comprises only one of the plurality of dielectric materials 1100.

IPC Classes  ?

• H01Q 15/08 - Refracting or diffracting devices, e.g. lens, prism formed of solid dielectric material
• H01Q 15/10 - Refracting or diffracting devices, e.g. lens, prism comprising three-dimensional array of impedance discontinuities, e.g. holes in conductive surfaces or conductive discs forming artificial dielectric
• H01Q 19/06 - Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using refracting or diffracting devices, e.g. lens

Abstract

A lens is provided for shaping electromagnetic radiation energy originating from a signal feed when energized. The lens operates at a defined center frequency having a free space wavelength. The lens includes dielectric materials stacked side by side. An adjacent dielectric material has a dielectric constant value that is different from a dielectric constant value of another adjacent dielectric material. The dielectric materials have an overall footprint in an x-y plane and an overall thickness in a z-direction. Each cross-section of the dielectric materials in the x-y plane includes each one of the of dielectric materials. Each cross-section of the dielectric materials in one of the x-z plane and the y-z plane includes each one of the dielectric materials. At least one cross-section of the dielectric materials in the other one of the x-z plane and the y-z plane includes only one of the plurality of dielectric materials.

IPC Classes  ?

• H01Q 15/02 - Refracting or diffracting devices, e.g. lens, prism
• H01Q 19/06 - Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using refracting or diffracting devices, e.g. lens
• H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart

Goods & Services

Electronic circuit material; dielectric substrate clad on one or both sides with a conductive layer for fabricating electronic circuits.

Abstract

A laminate includes: a first outer copper layer; a second outer copper layer; a multilayer construct having at least three polymer films disposed between the first and second outer copper layers; wherein adjacent ones of the at least three polymer layers have dissimilar dielectric constant, Dk, values, dissimilar thicknesses, or preferably both dissimilar Dk values and dissimilar thicknesses; wherein adjacent ones of the first and second outer copper layers, and the at least three polymer layers, are bonded to each other; wherein each polymer film of the at least three polymer films has a voltage breakdown strength equal to or greater than 200 kV/mm, or equal to or greater than 5kV at a film thickness of 25 micrometers.

IPC Classes  ?

• H01G 4/18 - Organic dielectrics of synthetic material, e.g. derivatives of cellulose
• B32B 27/00 - Layered products essentially comprising synthetic resin
• B32B 15/00 - Layered products essentially comprising metal
• B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
• H01B 3/30 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes
• H01F 5/00 - Coils
• H01G 4/20 - Dielectrics using combinations of dielectrics from more than one of groups

Abstract

A laminate includes a first outer copper layer; a second outer copper layer; a multilayer construct having at least three polymer films disposed between the first and second outer copper layers. Adjacent ones of the at least three polymer layers have dissimilar dielectric constant, Dk, values, dissimilar thicknesses, or preferably both dissimilar Dk values and dissimilar thicknesses. Adjacent ones of the first and second outer copper layers, and the at least three polymer layers, are bonded to each other. Each polymer film of the at least three polymer films has a voltage breakdown strength equal to or greater than 200 kV/mm, or equal to or greater than 5 kV at a film thickness of 25 micrometers.

IPC Classes  ?

• B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
• B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
• B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
• B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
• B32B 37/04 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the partial melting of at least one layer
• H01F 5/06 - Insulation of windings
• H01F 37/00 - Fixed inductances not covered by group

Goods & Services

Custom lamination; custom manufacturing of laminated products. Research and development services in the field of lamination systems.

Goods & Services

Electronic circuit material; dielectric substrate clad on one or both sides with a conductive layer for fabricating electronic circuits.

Goods & Services

High-performance thermoset material.

Abstract

The invention relates to a method for dividing a metal-ceramic substrate (10), in particular a metal-ceramic substrate (10) provided in the form of a large metal-ceramic card, wherein the metal-ceramic substrate (10) is preferably divided into individual metal-ceramic substrates (1), comprising: - providing a metal-ceramic substrate (10), wherein the metal-ceramic substrate (10) comprises at least one metal layer (21) and a ceramic element (20), - forming a predetermined break line (7), in particular by removing ceramic material from the ceramic element (20), - locally heating the ceramic element (20) in the region of the predetermined break line (7), in particular by means of laser light (15), and - cooling the heated region of the predetermined break line (7) in order to separate the ceramic element (20) along the predetermined break line (7).

IPC Classes  ?

• B23K 26/364 - Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
• B23K 26/402 - Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
• B23K 26/70 - Auxiliary operations or equipment
• B23K 103/00 - Materials to be soldered, welded or cut
• B23K 101/36 - Electric or electronic devices
• B23K 103/12 - Copper or alloys thereof
• B23K 103/18 - Dissimilar materials

Goods & Services

High-performance thermoset material in the nature of films and sheets made out of thermoset for use in the manufacture of circuit boards; structural thermoset composites, namely, structural thermoset molding composites containing fiber reinforcement for use in the manufacture of goods; semi-processed thermoset polymer resins for enhanced thermal conductivity, enhanced electrical conductivity, enhanced gas barrier properties and enhanced chemical resistance; semi-processed thermoset polymer resins for use in manufacture

Goods & Services

Custom lamination of busbars; custom manufacturing of laminated products, namely, electrical circuits Research and development services in the field of lamination systems

Goods & Services

Electronic circuit material for use in fabricating electronic circuits, namely, an insulated dielectric substrate material which is clad on one side with a with a conductive layer sold as a unit and a dielectric substrate material which is clad on both sides with a conductive layer sold as a unit

Goods & Services

Electronic circuit material for use in fabricating electronic circuits, namely, an insulated dielectric substrate material which is clad on one side with a conductive layer sold as a unit and a dielectric substrate material which is clad on both sides with a conductive layer sold as a unit

Abstract

An electromagnetic, EM, device (1000) configured to be operational at a defined center frequency, f, having a free space wavelength, λ, is disclosed. The EM device includes: an integrated circuit, IC, chip (2000); and, a DRA subarray (3000) integrally arranged with and disposed on the IC chip (2000). The DRA subarray (3000) includes a plurality of DRAs (3100), that can resonate at the same frequency, f, defining a unit cell (3200) having an overall footprint (3300) of equal to or less than λ/2 in both x and y directions of an orthogonal x-y-z coordinate system, as observed in a plan view of the EM device (1000), where the z-direction is a direction of vertical extension of each DRA (3100′) of the plurality of DRAs (3100).

IPC Classes  ?

• H01Q 1/22 - SupportsMounting means by structural association with other equipment or articles
• H01Q 1/48 - Earthing meansEarth screensCounterpoises

Abstract

Printed circuit board (100) for electrical components (5) and/or conductor paths (4), comprising: a base body (2) which extends along a main extension plane (HSE), and an insert (1) which is integrated into the base body (2) in the assembled state, Printed circuit board (100) for electrical components (5) and/or conductor paths (4), comprising: a base body (2) which extends along a main extension plane (HSE), and an insert (1) which is integrated into the base body (2) in the assembled state, wherein the insert (1) is a metal-ceramic substrate (10), the metal-ceramic substrate (1) being covered, in particular surrounded, at least partially by an insulating element (8) on a side surface (SF) facing the base body (2) in the assembled state.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/03 - Use of materials for the substrate
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

An electromagnetic, EM, device (1000) configured to be operational at a defined center frequency, f, having a free space wavelength, X, is disclosed. The EM device includes: an integrated circuit, IC, chip (2000); and, a DRA subarray (3000) integrally arranged with and disposed on the IC chip (2000). The DRA subarray (3000) includes a plurality of DRAs (3100), that can resonate at the same frequency, f, defining a unit cell (3200) having an overall footprint (3300) of equal to or less than X /2 in both x and y directions of an orthogonal x-y-z coordinate system, as observed in a pian view of the EM device (1000), where the z-direction is a direction of vertical extension of each DRA (3100') of the plurality of DRAs (3100).

IPC Classes  ?

• H01Q 9/04 - Resonant antennas
• H01Q 21/00 - Antenna arrays or systems
• H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart
• H01Q 21/22 - Antenna units of the array energised non-uniformly in amplitude or phase, e.g. tapered array or binomial array

Abstract

An electromagnetic, EM, device (1000) configured to be operational at a defined center frequency, f, having a free space wavelength, X, is disclosed. The EM device (1000) includes: a plurality of dielectric resonator antennas, DRAs, that can resonate at the same frequency, f, (3100) forming a unit cell (3200) having an overall footprint of equal to or less than X /2 in both x and y directions of an orthogonal x-y-z coordinate system, as observed in a plan view of the EM device (1000), where the z-direction is a direction of vertical extension of each DR A (3100') of the plurality of DRAs (3100), the unit cell (3200) defining a DRA subarray (3000).

IPC Classes  ?

• H01Q 9/04 - Resonant antennas
• H01Q 21/00 - Antenna arrays or systems
• H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart

Abstract

An electromagnetic, EM, device (1000) configured to be operational at a defined center frequency, f, having a free space wavelength, λ, is disclosed. The EM device (1000) includes: a plurality of dielectric resonator antennas, DRAs, that can resonate at the same frequency, f, (3100) forming a unit cell (3200) having an overall footprint of equal to or less than λ/2 in both x and y directions of an orthogonal x-y-z coordinate system, as observed in a plan view of the EM device (1000), where the z-direction is a direction of vertical extension of each DRA (3100′) of the plurality of DRAs (3100), the unit cell (3200) defining a DRA subarray (3000).

IPC Classes  ?

• H01Q 9/04 - Resonant antennas
• H01Q 21/00 - Antenna arrays or systems

Abstract

A metal-ceramic substrate (1) as a carrier for electrical components, in particular in the form of a printed circuit board, comprising a ceramic element (20) and at least one metal layer (10, 20), wherein the at least one metal layer (10) and the ceramic element (30) extend along a main extension plane (HSE) and are arranged on top of one another along a stacking direction(S) running perpendicular to the main extension plane (HSE), wherein a bonding layer (12) is formed in the manufactured metal-ceramic substrate (1) between the at least one metal layer (10, 20) and the ceramic element (30), and wherein a bonding agent layer of the bonding layer (12) has a sheet resistance which is greater than 5 ohm/sq, more preferably greater than 10 ohm/sq and most preferably greater than 20 ohm/sq, wherein an interconnection (15) is formed in the ceramic element (30).

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/03 - Use of materials for the substrate
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

Abstract

A curable composition includes an alkenyl-containing component including an alkenyl-diterminated polyorganosiloxane; a hydride-containing component including a hydride-substituted polyorganosiloxane; and optionally, a polyhedral oligomeric silsesquioxane. At least a portion of the alkenyl-diterminated polyorganosiloxane, the hydride-substituted polyorganosiloxane, the polyhedral oligomeric silsesquioxane, or a combination thereof include phenyl pendant groups, and the curable composition has a particular phenyl content. Cured compositions, including compressible foams, made from the curable composition and methods of making the cured compositions are also disclosed.

IPC Classes  ?

• C08G 77/12 - Polysiloxanes containing silicon bound to hydrogen
• C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
• C08G 77/00 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon
• C08J 9/06 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
• C08L 83/04 - Polysiloxanes
• C09D 183/04 - Polysiloxanes
• H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
• H01M 50/24 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by physical properties of casings or racks, e.g. dimensions adapted for protecting batteries from their environment, e.g. from corrosion

Abstract

A method for forming a plated through-hole structure includes filling a first through- hole in a substrate with a composition having a coefficient of thermal expansion of less than 50 ppm/°C. The composition is disposed on the interior surface of the first through-hole from the first opening to the second opening. The method further includes forming a second through-hole in the first through-hole filled with the composition. The second through-hole has a diameter less than a diameter of the first through-hole. The method further includes plating the interior surface of the second through-hole to provide the plated through-hole structure. The method can provide plated through-hole structures exhibiting good adhesion to metal and providing a reliable electrical connection.

IPC Classes  ?

• H05K 3/44 - Manufacturing insulated metal core circuits
• H05K 1/02 - Printed circuits Details

Abstract

A method for forming a plated through-hole structure includes filling a first through-hole in a substrate with a composition having a coefficient of thermal expansion of less than 50 ppm/° C. The composition is disposed on the interior surface of the first through-hole from the first opening to the second opening. The method further includes forming a second through-hole in the first through-hole filled with the composition. The second through-hole has a diameter less than a diameter of the first through-hole. The method further includes plating the interior surface of the second through-hole to provide the plated through-hole structure. The method can provide plated through-hole structures exhibiting good adhesion to metal and providing a reliable electrical connection.

IPC Classes  ?

• H05K 3/42 - Plated through-holes
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits

Abstract

The invention relates to a method for producing a metal-ceramic substrate (1), comprising: - providing at least one metal layer (10) - providing a ceramic element (30), and - joining the at least one metal layer (10) to a joining surface on an outer face of the ceramic element (30), wherein the at least one metal layer (10) and the ceramic element (30) extend along a main plane of extent (HSE) and are arranged one above the other in a stacking direction (S) running perpendicular to the main plane of extent (HSE), wherein the joining surface has a roughness that is greater than 0.5 µm, preferably greater than 1.0 µm, and particularly preferably greater than 1.5 µm.

IPC Classes  ?

• C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
• C04B 35/645 - Pressure sintering

Goods & Services

Providing non-downloadable webinars and online non-downloadable videos in the fields of advanced material solutions, foam materials, materials selection, product design using foam materials, and product testing; educational services, namely, providing non-downloadable webinars and online non-downloadable videos in the fields of advanced material solutions, foam materials, materials selection, product design using foam materials, and product testing

Goods & Services

Providing non-downloadable webinars and online non-downloadable videos in the fields of advanced material solutions, sealing and gasketing enclosures; educational services, namely, providing non-downloadable webinars and online non-downloadable videos in the fields of advanced material solutions, sealing and gasketing enclosures

Abstract

A photocurable composition for stereolithographic three-dimensional printing, wherein the photocurable composition comprises a photoreactive oligomer component comprising a hydrophobic oligomer comprising a photoreactive end group, a photoreactive monomer component comprising a photoreactive monomer having a photoreactive end group, and a photoinitiation composition comprising a photoinitiator; the photocurable composition has a viscosity of 250 to 10,000 centipoise at 22° C., determined using a Brookfield viscometer; and the photocured composition has a dielectric loss of less than 0.010, preferably less than 0.008, more preferably less than 0.006, most preferably less than 0.004, each determined by split-post dielectric resonator testing at 10 gigahertz at 23° C.

IPC Classes  ?

• C08F 2/50 - Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
• B29C 64/106 - Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
• B29K 33/00 - Use of polymers of unsaturated acids or derivatives thereof, as moulding material
• B29K 35/00 - Use of polymers of unsaturated polycarboxylic acids as moulding material
• B33Y 10/00 - Processes of additive manufacturing
• B33Y 70/00 - Materials specially adapted for additive manufacturing
• B33Y 80/00 - Products made by additive manufacturing
• C08F 20/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
• C08F 22/10 - Esters
• C08F 22/20 - Esters containing oxygen in addition to the carboxy oxygen
• C08F 22/22 - Esters containing nitrogen
• C08F 136/06 - Butadiene
• C08K 3/22 - OxidesHydroxides of metals

Abstract

A waveguide antenna system, includes: an electromagnetic, EM, transition portion having a transition region having a signal feed interface and an open waveguide section, the EM transition portion configured to couple EM energy from the signal feed interface to a guided waveguide mode of EM energy to the open waveguide section via the transition region; and a leaky waveguide antenna portion configured and disposed to radiate electromagnetic energy received from the open waveguide section; wherein the EM transition portion is electromagnetically coupled to the leaky waveguide antenna portion, the EM transition portion being configured to support a transfer of electromagnetic energy from a signal feed structure to the leaky waveguide antenna portion.

IPC Classes  ?

• H01Q 21/06 - Arrays of individually energised antenna units similarly polarised and spaced apart
• H01Q 1/22 - SupportsMounting means by structural association with other equipment or articles
• H01Q 1/32 - Adaptation for use in or on road or rail vehicles
• H01Q 13/22 - Longitudinal slot in boundary wall of waveguide or transmission line

Abstract

Carrier substrate (1) for electrical components (4), comprising: a heat sink (20), and a ceramic element (71), wherein the ceramic element (71) is bonded to the heat sink (20) at least in sections, wherein a bonding layer free of solder material is formed in the manufactured carrier substrate (1) between the heat sink (20) and the ceramic element (71), and wherein a adhesion agent layer of the bonding layer has a sheet resistance which is greater than 5 ohm/sq, more preferably greater than 10 ohm/sq and most preferably greater than 20 ohm/sq.

IPC Classes  ?

• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• H01S 5/024 - Arrangements for thermal management

Abstract

A metal-ceramic substrate (1) provided as a printed circuit board for attaching electrical components, comprising a component metallization (10) and a backside metallization (20), and a ceramic element (30) arranged along a stacking direction (S) between the component metallization (10) and the backside metallization (20), wherein the component metallization (10) comprises a first metal section (11) and a second metal section (12), the first metal section (11) and the second metal section (12) being separated from each other by an isolation section (15), and wherein the backside metallization (20) has a material weakening (25), in particular a material recess, which is arranged to be congruent with the isolation section (15) when viewed in the stacking direction (S).

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 1/03 - Use of materials for the substrate
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Abstract

The invention relates to a method for producing and/or handling metal-ceramic substrates (1, 10), comprising: - providing a metal layer (12) and a ceramic layer (11) - connecting the metal layer (12) to the ceramic layer (11) to produce a metal-ceramic substrate (1, 10), - determining a surface quality in a partial section, preferably in a defined partial section, of a surface of the metal layer (12), the ceramic layer (11) and/or the metal-ceramic substrate (1, 10), and - using the determined surface quality as an identifier (21, 22, 23).

IPC Classes  ?

• C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
• H05K 1/02 - Printed circuits Details

Abstract

The invention relates to a heat sink element (1) for an electric power module (10), comprising - a main body having a first end face (S) which, in the installed state, faces a surface to be cooled, and having a second end face (S2) opposite the first end face (S1), and - a cooling channel (30, 30') which is embedded in the main body between the first end face (S1) and the second end face (S2), wherein: the cooling channel (30, 30') has a supply portion (31), a redirecting portion (32), and a discharge portion (33); the cooling channel (30, 30') is designed, in order to form a general flow path, to conduct a cooling medium in the supply portion (31) in the direction of the first end face (S1), to transfer it in the redirecting portion (32) into the discharge portion (33), and to conduct it in the discharge portion (33) in the direction of the second end face (S2); and at least one transverse-flow portion (50) which connects the supply portion (31) and the discharge portion (33) is formed between the redirecting portion (32) and the second end face (S2).

IPC Classes  ?

• H01L 23/367 - Cooling facilitated by shape of device
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• H01L 23/373 - Cooling facilitated by selection of materials for the device

Abstract

The invention relates to a heat sink element (1) for an electric power module (10), said heat sink element comprising: - a main body having a first end face (S1), which, when installed, faces a surface to be cooled, and a second end face (S2) opposite the first end face (S1), and - a cooling channel (30, 30') which is embedded into the main body between the first end face (S1) and the second end face (S2), wherein the cooling channel (30, 30') has a feed portion (31), a redirection portion (32), and a discharge portion (33), wherein the cooling channel (30, 30') is designed to form a general flow path to allow a cooling medium to be conveyed in the feed portion (31) in the direction of the first end face (S1), transferred in the redirection portion (32) to the discharge portion (33), and conveyed in the discharge portion (33) in the direction of the second end face (S2), wherein the feed portion (31) has a first flow cross-section (Q1) measured perpendicular to a flow direction (S), and the redirection portion (32) has a second flow cross-section (Q2) measured perpendicular to the flow direction (S), wherein the ratio of the second flow cross-section (Q2) to the first flow cross-section (Q1) is less than 0.5, preferably less than 0.4, and particularly preferably less than 0.3.

IPC Classes  ?

• H01L 23/367 - Cooling facilitated by shape of device
• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids

Abstract

The invention relates to a power module (10) comprising a heat sink element (1), the power module comprising - a ceramic element (25), - a component metallisation (20), and - the heat sink element (1), wherein the ceramic element (25), the component metallisation (20) and the heat sink element (1) each extend substantially along a plane running parallel to a main extension plane (HSE) and are arranged one above the other in a stacking direction (S) running perpendicular to the main extension plane (HSE), wherein the ceramic element (25) is arranged between the component metallisation (20) and the heat sink element (25), wherein the component metallisation (20) has a first thickness (D1) measured in the stacking direction (S), and the heat sink element (1) has a second thickness (D2) measured in the stacking direction (S), wherein the ratio of the first thickness (D1) to the second thickness (D2) is less than 0.4, preferably less than 0.3, and particularly preferably less than 0.2, wherein the heat sink element (1) is designed such that the flexural deformation of the power module (10) is five times smaller, preferably eight times smaller, and particularly preferably ten times smaller than that of a reference power module with dimensions corresponding to the power module (10), wherein the reference power module has a solid heat sink element (1).

IPC Classes  ?

• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• H01L 23/367 - Cooling facilitated by shape of device

Abstract

A substrate includes a monolithic structure formed from a dielectric material having a first side, a second side, and an intermediate region between the first side and the second side, and the intermediate region has a lattice structure of the dielectric material having a plurality of interstitial spaces between the dielectric material of the lattice structure. The lattice structure extends between and monolithically connects with the first side and the second side, wherein at least one of the first side and the second side has a substantially solid surface suitably configured to support one or more of electronic circuit imaging, electroplating, metal deposition, or, vias between the first side and the second side.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details

Abstract

A curable composition for preparing a compressible silicone foam includes an alkenyl-containing component including an alkenyl-diterminated polyorganosiloxane, an alkenyl-substituted MQ polyorganosiloxane, and an alkenyl-substituted copolyorganosiloxane, and a hydride-containing component comprising a hydride-substituted polyorganosiloxane. The curable composition includes a cure catalyst; a filler composition; and a blowing agent. Compressible foams made from the curable composition and methods of making compressible foams from the curable composition are also disclosed.

IPC Classes  ?

• C08J 9/06 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
• C08L 83/04 - Polysiloxanes

Abstract

A curable composition for preparing a compressible silicone foam includes an alkenyl-containing component including an alkenyl-diterminated polyorganosiloxane, an alkenyl-substituted MQ polyorganosiloxane, and an alkenyl-substituted copolyorganosiloxane, and a hydride-containing component comprising a hydride-substituted polyorganosiloxane. The curable composition includes a cure catalyst; a filler composition; and a blowing agent. Compressible foams made from the curable composition and methods of making compressible foams from the curable composition are also disclosed.

IPC Classes  ?

• C08J 9/228 - Forming foamed products
• C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof
• C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
• C08J 9/14 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent organic
• C08J 9/36 - After-treatment

Abstract

An combination of an open trough waveguide antenna (TWO A) and lens fixedly attached to the TWGA. The combination of the TWGA and lens provides an antenna assembly that is suitable for use in a radio frequency antenna applications.. The lens has a dielectric medium, and a plurality of non-conductive filler particles dispersed in the dielectric medium. The lens has a relative dielectric constant (Dk) of equal to or less than 2; the lens has a thickness, T, of equal to or greater than 5 microns, and equal to or less than 500 microns.

IPC Classes  ?

• H01Q 15/10 - Refracting or diffracting devices, e.g. lens, prism comprising three-dimensional array of impedance discontinuities, e.g. holes in conductive surfaces or conductive discs forming artificial dielectric
• H01Q 13/22 - Longitudinal slot in boundary wall of waveguide or transmission line
• H01Q 19/06 - Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using refracting or diffracting devices, e.g. lens
• H01Q 21/00 - Antenna arrays or systems
• H01Q 1/42 - Housings not intimately mechanically associated with radiating elements, e.g. radome

Abstract

An combination of an open trough waveguide antenna (TWGA) and lens fixedly attached to the TWGA. The combination of the TWGA and lens provides an antenna assembly that is suitable for use in a radio frequency antenna applications. The lens has a dielectric medium, and a plurality of non-conductive filler particles dispersed in the dielectric medium. The lens has a relative dielectric constant (Dk) of equal to or less than 2; the lens has a thickness, T, of equal to or greater than 5 microns, and equal to or less than 500 microns.

IPC Classes  ?

• H01Q 15/08 - Refracting or diffracting devices, e.g. lens, prism formed of solid dielectric material
• H01Q 19/06 - Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using refracting or diffracting devices, e.g. lens

Abstract

rhmaxmax, where the first grains (15) have a mean grain form factor, preferably determined as the arithmetic mean value, of less than 0.5, preferably less than 0.4 and more preferably less than 0.3, and where the first grains are oriented isotropically in the ceramic element.

IPC Classes  ?

• C04B 35/581 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxides based on borides, nitrides or silicides based on aluminium nitride
• C04B 35/645 - Pressure sintering
• C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles

Abstract

The invention relates to a support substrate (1), in particular a metal-ceramic substrate, as a support for electric components in the form of a printed circuit board, comprising: - at least one metal layer (10) and - an insulation element (30), in particular a ceramic element, a glass element, a glass-ceramic element, and/or a high temperature-resistant plastic element, wherein the at least one metal layer (10) and the insulation element (30) extend along a main extension plane (HSE) and are arranged one over the other along a stacking direction (S) which runs perpendicularly to the main extension plane (HSE). A binding layer (12) is formed between the at least one metal layer (10) and the insulation element (30) in the completed support substrate (1), and a contact layer (13) of the binding layer (12) - comprises preferably a titanium-nitrogen compound and/or a titanium-silicon compound and - has a first thickness, which is measured in the stacking direction (S) and which is averaged over a plurality of measurement points within one or more specified surfaces (F) that run/runs parallel to the main extension plane (HSE), said thickness equaling less than 900 nm, preferably less than 700 nm, preferably less than 500 nm.

IPC Classes  ?

• H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
• C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H05K 1/03 - Use of materials for the substrate
• H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Abstract

A method of forming a thermal management sheet for a battery including cured polyurethane foam, the method including combining an active hydrogen-containing component including a polyol and an isocyanate component including a polyisocyanate to form an uncured polyurethane foam; and curing the uncured polyurethane foam to form the cured polyurethane foam, wherein the uncured polyurethane foam includes, based on a total weight of the uncured polyurethane foam, 3 to 68 weight percent of sodium borate, 0.1 to 7 weight percent of surfactant, and 0.001 to 9 weight percent of catalyst, wherein the cured polyurethane foam has a density of 12 to 35 pounds per cubic foot, and wherein the cured polyurethane foam has a thickness of 1 to 30 millimeters.

IPC Classes  ?

• H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
• C08G 18/48 - Polyethers
• C08G 18/76 - Polyisocyanates or polyisothiocyanates cyclic aromatic
• C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof
• C08J 9/30 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof by mixing gases into liquid compositions or plastisols, e.g. frothing with air
• C08K 3/38 - Boron-containing compounds
• H01M 50/211 - Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for pouch cells

Abstract

A method of forming a thermal management sheet for a battery including cured polyurethane foam, the method including combining an active hydrogen-containing component including a polyol and an isocyanate component including a polyisocyanate to form an uncured polyurethane foam; and curing the uncured polyurethane foam to form the cured polyurethane foam, wherein the uncured polyurethane foam includes, based on a total weight of the uncured polyurethane foam, 3 to 68 weight percent of sodium borate, 0.1 to 7 weight percent of surfactant, and 0.001 to 9 weight percent of catalyst, wherein the cured polyurethane foam has a density of 12 to 35 pounds per cubic foot, and wherein the cured polyurethane foam has a thickness of 1 to 30 millimeters.

IPC Classes  ?

• C08G 18/76 - Polyisocyanates or polyisothiocyanates cyclic aromatic
• C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof
• C08K 3/38 - Boron-containing compounds
• C08L 75/06 - Polyurethanes from polyesters
• H01M 10/653 - Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials

Abstract

A multilayer conductor includes a conductor layer and a dielectric layer on the conductor layer. The dielectric layer includes a polymer composition having a dissipation factor (Df) of less than 0.001 and includes a cyclic olefin copolymer, a transoctenamer rubber, syndiotactic polystyrene, a polymethylpentene olefin copolymer, or a combination thereof. The materials described herein can advantageously provide an improved adhesive strength between the conductor and the dielectric layer. Methods for the manufacture of the multilayer conductor are also described. The multilayer conductor can be useful in the preparation of magnetic selfresonant structures.

IPC Classes  ?

• H01B 3/44 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes vinyl resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes acrylic resins
• H02J 7/00 - Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries

Abstract

A multilayer conductor includes a conductor layer and a dielectric layer on the conductor layer. The dielectric layer includes a polymer composition having a dissipation factor (Df) of less than 0.001 and includes a cyclic olefin copolymer, a transoctenamer rubber, syndiotactic polystyrene, a polymethylpentene olefin copolymer, or a combination thereof. The materials described herein can advantageously provide an improved adhesive strength between the conductor and the dielectric layer. Methods for the manufacture of the multilayer conductor are also described. The multilayer conductor can be useful in the preparation of magnetic self-resonant structures.

IPC Classes  ?

• H01F 27/28 - CoilsWindingsConductive connections
• H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils

Abstract

A trilayer polymer film includes a core layer and first and second outer layers on opposing surfaces of the core layer. The compositions of each of the layers is as described herein, wherein the first outer layer and the second outer layer each independently include a fluoropolymer having a melting temperature that is at least 15°C less than a melting temperature of the core layer. The core layer comprising polytetrafluoroethylene, a perfluoroalkoxy polymer, or a fluorinated ethylene propylene polymer. The film can be useful in the preparation of multilayer conductors and magnetic self-resonant structures.

IPC Classes  ?

• C09J 7/35 - Heat-activated

Abstract

A trilayer polymer film includes a core layer and first and second outer layers on opposing surfaces of the core layer. The compositions of each of the layers is as described herein, wherein the first outer layer and the second outer layer each independently include a fluoropolymer having a melting temperature that is at least 15° C. less than a melting temperature of the core layer. The film can be useful in the preparation of multilayer conductors and magnetic self-resonant structures.

IPC Classes  ?

• C09J 7/24 - PlasticsMetallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
• C09J 127/12 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogenAdhesives based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
• C09J 171/02 - Polyalkylene oxides
• H01B 1/12 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances organic substances

Abstract

A curable composition for preparing a low density cast silicone foam includes a first part and a second part. The first part includes particular amounts of an alkenyl-terminated polyorganosiloxane; an alkenyl-substituted copolyorganosiloxane; an alkenyl-substituted MQ polyorganosiloxane; a cure catalyst; an inorganic filler; and a chemical blowing agent. The second part includes a hydride-substituted polyorganosiloxane. The resulting silicone foams advantageously have a density of less than 240 kg/m3; and a closed cell content of at least 50%. Cured silicone foams and methods for the manufacture thereof are also described.

IPC Classes  ?

• C08G 77/20 - Polysiloxanes containing silicon bound to unsaturated aliphatic groups
• C08G 77/08 - Preparatory processes characterised by the catalysts used
• C08G 77/12 - Polysiloxanes containing silicon bound to hydrogen
• C08G 77/16 - Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxy groups
• C08J 9/00 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof
• C08J 9/06 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
• C08J 9/12 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent
• C08J 9/14 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a physical blowing agent organic
• C08K 3/12 - Hydrides

Abstract

A curable composition for preparing a low density cast silicone foam includes a first part and a second part. The first part includes particular amounts of an alkenyl-terminated polyorganosiloxane; an alkenyl-substituted copolyorganosiloxane; an alkenyl-substituted MQ polyorganosiloxane; a cure catalyst; an inorganic filler; and a chemical blowing agent. The second part includes a hydride-substituted polyorganosiloxane. The resulting silicone foams advantageously have a density of less than 240 kg/m3; and a closed cell content of at least 50%. Cured silicone foams and methods for the manufacture thereof are also described.

IPC Classes  ?

• C08J 9/06 - Working-up of macromolecular substances to porous or cellular articles or materialsAfter-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
• C08L 83/04 - Polysiloxanes

Abstract

A method of producing an inductive coil assembly includes: forming N(i) layers, (i) being an integer from 1 to M, N(i) being an i-th layer, and N(M) being a maximum number of N(i) layers; each N(i) layer includes: an (i) instance of a first conductor having a thickness (x)T bonded to a first side of an (i) instance of a ceramic; an (i) instance of a second conductor having a thick (y)T bonded to the second side of the (i) instance of the ceramic; stacking and registering the N(1) to N(M) layers, such that for (i=1 to M-1), an instance of the first conductor of an N(i+1) layer is disposed adjacent an instance of the second conductor of an N(i) layer; stacking and registering a third conductor having a thickness (y)T with the first conductor of the N(1) layer, and a fourth conductor having a thickness (x)T with the second conductor of the corresponding N(M) layer; and, bonding the third conductor to the first conductor of the N(1) layer, and the fourth conductor to the second conductor of the N(M) layer; wherein x and y are each equal to or greater than 0 and equal to or less than 1.

IPC Classes  ?

• H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
• H01F 41/12 - Insulating of windings
• H01F 27/28 - CoilsWindingsConductive connections
• H01F 27/32 - Insulating of coils, windings, or parts thereof
• H01F 5/00 - Coils

Abstract

A method of producing an inductive coil assembly includes forming N(i) layers, (i) being an integer from 1 to M, N(i) being an i-th layer, and N(M) being a maximum number of N(i) layers; stacking and registering the N(1) to N(M) layers such that for (i=1 to M−1), an instance of the first conductor of an N(i+1) layer is adjacent an instance of the second conductor of an N(i) layer; stacking and registering a third conductor having a thickness with the first conductor of the N(1) layer, and a fourth conductor having a thickness with the second conductor of the corresponding N(M) layer; and bonding the third conductor to the first conductor of the N(1) layer, and the fourth conductor to the second conductor of the N(M) layer.

IPC Classes  ?

• H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
• H01F 27/28 - CoilsWindingsConductive connections
• H01F 41/10 - Connecting leads to windings
• H01F 41/12 - Insulating of windings

Abstract

A metatarsal guard includes a base layer, an elastomeric polyurethane foam layer on the base layer, and a puncture resistant layer on the elastomer foam layer on a side opposite the base layer. Advantageously, the metatarsal guard is flexible and capable of providing top-of-foot protection to the metatarsal region of a foot. The metatarsal guard is formed by a molding process. A safety shoe or boot having improved protection for the metatarsal region of a wearer's foot is also disclosed.

IPC Classes  ?

• A43B 7/32 - Footwear with health or hygienic arrangements with shock-absorbing means

Abstract

The invention relates to a cooling device (1) for cooling an assembly of electrical or electrical components (4, 4'), in particular laser diodes, having a main body (2), wherein the main body (2) has a component region (BB) with a first connection region (A1) on an outer side, on which connection region a first component (4) can be mounted, and a second connection region (A2), on which a second component (4) can be mounted, wherein the first connection region (A1) and the second connection region (A2) are offset in height relative to one another in an offset direction (V), wherein the main body (2) has a cooling duct system, wherein the cooling duct system comprises a first cooling portion (41) for cooling the first connection region (A1) and a second cooling portion (42) for cooling the second connection region (A2), wherein the first cooling portion (41) and the second cooling portion (42) are designed in such a way that a first cooling effect of the first cooling portion (41) on the first connection region (A1) and a second cooling effect of the second cooling portion (42) on the second connection region (A2) deviate from a mean value of the first cooling effect and the second cooling effect by less than 15%, preferably less than 10% and particularly preferably less than 5% of the mean value of the first cooling effect and the second cooling effect.

IPC Classes  ?

• H01S 5/024 - Arrangements for thermal management
• H01S 5/40 - Arrangement of two or more semiconductor lasers, not provided for in groups
• H01S 5/02315 - Support members, e.g. bases or carriers

Goods & Services

Electronic circuit material, namely, an insulating dielectric substrate material which is clad on one or both sides with a conductor layer for use in fabricating electronic circuits; electronic circuit material, namely a dialectric substrate with a conductive layer for the manufacture of electronic circuits.

Goods & Services

Microporous plastic material used in the manufacture of synthetic shoes and parts thereof; microporous plastic material, namely, foams for use in further manufacture; microporous plastic material, namely, foams used in the manufacture of various products, namely, insoles for shoes, thermal insulation material, luggage cases. Insulating materials made of polyurethane foam with varying amounts of bio-based polyols and recycled materials; polyurethane foam made of varying amounts of bio-based polyols and recycled materials for insulation purposes; unprocessed and semi-processed rubber, gutta-percha, gum, asbestos, mica and substitutes for all these materials; plastics and resins in extruded form for use in manufacture; packing, stopping and insulating materials; flexible pipes, tubes and hoses, not of metal; polymeric foam material in sheet and roll form; plastic material in sheet and roll form.

Abstract

A metal-ceramic substrate, which can be used as a circuit board and comprises - a ceramic element and - at least one component metallization bonded to the ceramic element, wherein: the component metallization is structured in order to form conductor tracks; the ceramic element comprises magnesium oxide; and a magnesium oxide proportion is greater than 60 wt.-%, preferably greater than 80% and especially preferably greater than 95 wt.-%.

IPC Classes  ?

• C04B 35/04 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on magnesium oxide, calcium oxide or oxide mixtures derived from dolomite based on magnesium oxide
• C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
• H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof

Abstract

A process for producing a metal-ceramic substrate (1) for use as a circuit board, comprising - providing a silicon wafer (40), preferably a doped or non-doped silicon wafer (40, - nitriding the silicon wafer (40) in order to produce a silicon nitride layer (31), - bonding a metal layer (10) to the silicon nitride layer (31), and - structuring the metal layer (10) in order to form a metallized layer.

IPC Classes  ?

• C04B 35/591 - Fine ceramics obtained by reaction sintering
• C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles

Abstract

The invention relates to a method for producing a metal-ceramic substrate (1), which is designed as a printed circuit board, having the steps of: - providing a starting block (2) which comprises silicon, - separating (104) a wafer (4) from the starting block (2), in particular from the completely nitrided, partially nitrided, or non-nitrided starting block (2), - nitriding (105a) the wafer (4), if the wafer (4) has a first density, and/or the starting block (2), if the starting block (2) has a first density, - carrying out at least one sintering step (105b) in order to set a second density in the nitrided wafer (4) and/or the nitrided starting block (2), wherein the second density is greater than the first density, and - connecting (107) a metal layer (10) to the nitrided and sintered wafer (30) in order to form a metal-ceramic substrate (1).

IPC Classes  ?

• C04B 35/584 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxides based on borides, nitrides or silicides based on silicon nitride
• C04B 35/591 - Fine ceramics obtained by reaction sintering
• C04B 35/626 - Preparing or treating the powders individually or as batches
• C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
• C04B 35/645 - Pressure sintering

Goods & Services

Electronic circuit materials for use in fabricating electronic circuits, namely, a dielectric substrate material clad on one side with a copper-clad layer sold as a unit and a dielectric substrate material clad on both sides with a copper-clad layer sold as a unit; electronic circuit materials for use in fabricating electronic circuits, namely, an insulating dielectric substrate material clad on one side with a copper-clad layer sold as a unit and an insulating dielectric substrate material clad on both sides with a copper-clad layer sold as a unit

Goods & Services

Microporous plastic material used in the manufacture of synthetic shoes and parts thereof; microporous plastic material, namely, foams for use in further manufacture; microporous plastic material, namely, foams used in the manufacture of various products, namely, insoles for shoes, thermal insulation material, luggage cases. Insulating materials made of polyurethane foam with varying amounts of bio-based polyols and recycled materials; polyurethane foam made of varying amounts of bio-based polyols and recycled materials for insulation purposes; unprocessed and semi-processed rubber, gutta-percha, gum, asbestos, mica and substitutes for all these materials; plastics and resins in extruded form for use in manufacture; packing, stopping and insulating materials; flexible pipes, tubes and hoses, not of metal; polymeric foam material in sheet and roll form; plastic material in sheet and roll form.

Abstract

A method for producing a metal-ceramic substrate (1), comprising – providing at least one first metal layer (10) for forming a component metallization and a ceramic element (30), – bonding the at least one first metal layer (10) to the ceramic element (30) by means of a direct bonding method, more particularly a DCB method or a DAB method, to form a common first bonding layer (12) between the ceramic element (30) and the at least one metal layer (10), a first agent for promoting formation of spinel being provided in a region intended for the formation of the first bonding layer (12) in order to improve adhesive strength between the at least one first metal layer (10) and the ceramic element (30) for the bonding by means of the direct bonding method.

IPC Classes  ?

• C04B 37/02 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles

Abstract

A NiHf- or NiTi-doped Co2Y-type ferrite, having a formula of A NiHf- or NiTi-doped Co2Y-type ferrite, having a formula of Ban-xSrxCo2-yCuyNizHfzFe(m-2z)O22 A NiHf- or NiTi-doped Co2Y-type ferrite, having a formula of Ban-xSrxCo2-yCuyNizHfzFe(m-2z)O22 or A NiHf- or NiTi-doped Co2Y-type ferrite, having a formula of Ban-xSrxCo2-yCuyNizHfzFe(m-2z)O22 or Ban-xSrxCo2-yCuyNizTizFe(m-2z)O22 A NiHf- or NiTi-doped Co2Y-type ferrite, having a formula of Ban-xSrxCo2-yCuyNizHfzFe(m-2z)O22 or Ban-xSrxCo2-yCuyNizTizFe(m-2z)O22 wherein 2≤n≤2.4. 0≤x≤1, 0.1≤y≤1, 0

IPC Classes  ?

• H01F 1/34 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
• C01G 51/00 - Compounds of cobalt
• C01G 53/00 - Compounds of nickel
• C08K 3/22 - OxidesHydroxides of metals
• H01Q 1/36 - Structural form of radiating elements, e.g. cone, spiral, umbrella

Abstract

2n-xx2-yyz(m-2z)22n-xx2-yyzz(m-2z)2222 wherein 2 ≤ n ≤ 2.4, 0 ≤ x ≤ 1,0.1 ≤ y ≤ 1,0 < z ≤ 2, and 10 ≤ m ≤ 13.

IPC Classes  ?

• H01F 1/34 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
• C04B 35/26 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on ferrites
• H01F 1/36 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles
• H01F 1/37 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles in a bonding agent
• H01F 3/08 - Cores, yokes or armatures made from powder
• H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets

Abstract

A method of manufacturing a metal-ceramic substrate (1), comprising: providing a ceramic element (30) and at least one metal layer (10), wherein the ceramic element (30) and the at least one metal layer (10) extend along a main extension plane (HSE); and bonding the ceramic element (30) to the at least one metal layer (10) to form a metal-ceramic substrate (1), in particular by means of a direct metal bonding process, hot isostatic pressing and/or a soldering process, wherein a structuring, preferably for forming an isolation of metal sections (10′), and/or a recess, preferably for forming a solder stop, is realized in the at least one metal layer (10) by means of a laser process and a chemical process, in particular an etching process.

IPC Classes  ?

• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or

Abstract

forming a recess (15), in particular a through recess (15), in the metal-ceramic substrate (1) by processing by means of laser light (10), in particular of an ultrashort pulse (UKP) laser.

IPC Classes  ?

• B23K 26/382 - Removing material by boring or cutting by boring
• B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
• B23K 26/0622 - Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
• B23K 26/064 - Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
• B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
• B23K 26/384 - Removing material by boring or cutting by boring of specially shaped holes
• B23K 103/00 - Materials to be soldered, welded or cut
• B23K 103/18 - Dissimilar materials

Abstract

x2-yy3z3131, wherein 4.5 ≤ x ≤ 5.5, 0 < y < 2 or 0.05 ≤ y ≤ 1.5, and 11 ≤ z ≤ 13.

IPC Classes  ?

• H01F 1/34 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
• H01F 1/36 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles
• H01F 3/08 - Cores, yokes or armatures made from powder
• H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
• H01Q 7/06 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop with core of ferromagnetic material
• C04B 35/26 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on ferrites
• H01F 1/37 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles in a bonding agent

Goods & Services

Spray masking tape; thermal spray masking tape; thermal masking tape.

Abstract

A ferrite composition having a formula of BaxNi2-yCuyTi3FezO31, wherein 4.5≤x≤5.5 0

IPC Classes  ?

• C04B 35/26 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on ferrites
• C04B 35/626 - Preparing or treating the powders individually or as batches
• C04B 35/634 - Polymers
• C04B 35/64 - Burning or sintering processes

Abstract

An antenna includes: a substrate having a magnetodielectric material; and, an electromagnetic, EM, radiator having an electrically conductive material disposed on an upper surface of the substrate, the EM radiator including a plurality of chamfered sides extending contiguously from one another to define an octagon-shaped EM radiator.

IPC Classes  ?

• H01Q 5/364 - Creating multiple current paths
• H01Q 9/04 - Resonant antennas
• H01Q 1/32 - Adaptation for use in or on road or rail vehicles

Abstract

An antenna includes: a substrate having a magnetodielectric material; and, an electromagnetic, EM, radiator having an electrically conductive material disposed on an upper surface of the substrate, the EM radiator including a plurality of chamfered sides extending contiguously from one another to define an octagon-shaped EM radiator.

IPC Classes  ?

• H01Q 9/04 - Resonant antennas
• G01S 19/13 - Receivers
• H01Q 1/36 - Structural form of radiating elements, e.g. cone, spiral, umbrella

Abstract

Printed circuit board (100) for electrical components (5) and/or conducting paths (4), comprising a base body (2) extending along a main extension plane (HSE), and an insert (1) integrated in the base body (2), wherein the insert (1) comprises a metal-ceramic substrate (15), an electrical and/or electronic component (5), and an encapsulation (10) enclosing at least the electrical and/or electronic component (5).

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 1/03 - Use of materials for the substrate
• H05K 3/42 - Plated through-holes
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A method for machining a metal-ceramic substrate (1), in particular for producing a predetermined breaking point, comprising: providing a metal-ceramic substrate (1) and forming a predetermined breaking point (7) in the metal-ceramic substrate (1) wherein the predetermined breaking point (7) has along a direction (V) thereof at least a first portion (A1) having a first depth (T1) and at least a second portion (A2) having a second depth (T2), wherein a second depth (T2) is realized, which is different from the first depth (T1).

IPC Classes  ?

• B23K 26/364 - Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
• B23K 26/40 - Removing material taking account of the properties of the material involved

Abstract

A dielectric polarizer for electromagnetic applications, includes: a monolithic body of Dk material having a plurality of linear elongated ribs disposed parallel with each other; wherein each rib of the plurality of linear elongated ribs has a cross section x-z profile relative to an orthogonal X-Y-Z coordinate system; wherein the Y-direction of the coordinate system is oriented in a direction of elongation of the plurality of linear elongated ribs; wherein the Z-direction of the coordinate system is oriented in a direction of propagation of an EM wave through the uniformly spaced apart plurality of linear elongated ribs; wherein the monolithic body has an overall thickness dimension, T, aligned in the Z-direction, that extends from a first side to a second side of the body; wherein adjacent ones of the plurality of linear elongated ribs are monolithically connected to each other by a plurality of connecting bridges.

IPC Classes  ?

• H01P 1/17 - Auxiliary devices for rotating the plane of polarisation for producing a continuously rotating polarisation, e.g. circular polarisation
• H01Q 15/12 - Refracting or diffracting devices, e.g. lens, prism functioning also as polarisation filter

Abstract

A dielectric polarizer for electromagnetic applications, includes: a monolithic body of Dk material having a plurality of linear elongated ribs disposed parallel with each other; wherein each rib of the plurality of linear elongated ribs has a cross section x-z profile relative to an orthogonal X-Y-Z coordinate system; wherein the Y-direction of the coordinate system is oriented in a direction of elongation of the plurality of linear elongated ribs; wherein the Z-direction of the coordinate system is oriented in a direction of propagation of an EM wave through the uniformly spaced apart plurality of linear elongated ribs; wherein the monolithic body has an overall thickness dimension, T, aligned in the Z-direction, that extends from a first side to a second side of the body; wherein adjacent ones of the plurality of linear elongated ribs are monolithically connected to each other by a plurality of connecting bridges.

IPC Classes  ?

• G02B 5/30 - Polarising elements

Abstract

A dielectric structure useful for shaping electromagnetic, EM, phase wavefronts, includes: a body having a monolithic construct; the body having a height dimension, H, from a proximal end to a distal end equal to or less than 60% of an overall outside dimension, D, of the body at the distal end, the distal end being disposed a distance away from the proximal end along a z-axis of an orthogonal x-y-z coordinate system, the distal end forming an electromagnetic aperture of the structure; the body having a sidewall between the proximal end and the distal end that forms and defines an interior cavity that is open at the proximal end, and closed at the distal end, the sidewall having a plurality of structural disruptions around an enclosing boundary of the interior cavity, the plurality of structural disruptions disposed and configured to reduce electromagnetic reflections.

IPC Classes  ?

• H01Q 15/08 - Refracting or diffracting devices, e.g. lens, prism formed of solid dielectric material
• H01Q 17/00 - Devices for absorbing waves radiated from an antenna Combinations of such devices with active antenna elements or systems

Abstract

A dielectric structure useful for shaping electromagnetic, EM, phase wavefronts, includes: a body having a monolithic construct; the body having a height dimension, H, from a proximal end to a distal end equal to or less than 60% of an overall outside dimension, D, of the body at the distal end, the distal end being disposed a distance away from the proximal end along a z-axis of an orthogonal x-y-z coordinate system, the distal end forming an electromagnetic aperture of the structure; the body having a sidewall between the proximal end and the distal end that forms and defines an interior cavity that is open at the proximal end, and closed at the distal end, the sidewall having a plurality of structural disruptions around an enclosing boundary of the interior cavity, the plurality of structural disruptions disposed and configured to reduce electromagnetic reflections.

IPC Classes  ?

• H01Q 15/08 - Refracting or diffracting devices, e.g. lens, prism formed of solid dielectric material

Abstract

An electromagnetic device includes: a substrate comprising an elongated aperture having an overall length, L, and an overall width, W, as observed in a plan view of the device, where L is greater than W; a dielectric medium comprising a dielectric material other than air disposed on the substrate substantially covering the aperture, the dielectric medium having a cross sectional boundary, as viewed in the plan view of the device, that is symmetrical with respect to an in-plane axis of reflection of the dielectric medium; wherein the device is configured such that a line perpendicular to the overall length L of the elongated aperture and passing through a center point of the elongated aperture is not any in-plane axis of reflection.

IPC Classes  ?

• H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
• G02B 6/122 - Basic optical elements, e.g. light-guiding paths
• H01P 3/16 - Dielectric waveguides, i.e. without a longitudinal conductor
• H01P 5/02 - Coupling devices of the waveguide type with invariable factor of coupling
• H01Q 9/04 - Resonant antennas

Abstract

A thermally insulating multilayer sheet for preventing thermal runaway includes a nonporous elastomeric barrier layer having a first and a second opposed surface; a flexible foam layer disposed on the first surface of the barrier layer; and a flame retardant component, wherein the flame retardant component is distributed within the flexible foam layer, contacts a surface of the flexible foam layer, or both.

IPC Classes  ?

• H01M 10/658 - Means for temperature control structurally associated with the cells by thermal insulation or shielding
• B32B 5/18 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by features of a layer containing foamed or specifically porous material
• B32B 25/04 - Layered products essentially comprising natural or synthetic rubber comprising rubber as the main or only constituent of a layer, next to another layer of a specific substance
• B32B 25/16 - Layered products essentially comprising natural or synthetic rubber comprising polydienes or poly-halodienes
• B32B 25/18 - Layered products essentially comprising natural or synthetic rubber comprising butyl or halobutyl rubber
• C08J 5/12 - Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
• C08J 9/36 - After-treatment
• F16L 59/02 - Shape or form of insulating materials, with or without coverings integral with the insulating materials

Abstract

Proposed is an electronics module (100), in particular a power electronics module, comprising - a metal-ceramic substrate (1) which serves as a carrier and has a ceramic element (10) and a primary component metallization (21) and preferably a cooling side metallization (20), - an insulation layer (40) which is directly or indirectly connected to the primary component metallization (21), and - a secondary component metallization (22), said secondary component metallization being connected to the side of the insulation layer (40) which faces away from the ceramic element (10) and in particular being insulated with respect to the primary component metallization (21) by the insulation layer (40), wherein the ceramic element (10) has a first size (L, D) and the insulation layer (40) has a second size (L1, D1), and wherein, to form an island-like insulation layer (40) on the primary component metallization (21), a ratio of the second size (L1, ID1) to the first size (L, D) has a value that is less than 0.4, preferably less than 0.22 and particularly preferably less than 0.15 or even less than 0.1, and wherein, as viewed in a direction running perpendicularly to the main plane of extent (HSE), an outer side (A) of the secondary component metallization (22) and an outer side (A) of the first component metallization (21) end substantially at a common height.

IPC Classes  ?

• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
• H01L 23/498 - Leads on insulating substrates
• H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
• H01L 23/495 - Lead-frames
• H01L 23/50 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements for integrated circuit devices