Abstract

An electronic device includes a core layer, a first circuit structure, a second circuit structure, an electronic unit, and a connecting component. The core layer includes a conductive through via, an embedding portion, and a peripheral heat-dissipating portion surrounding the embedding portion. The conductive through via passes through the core layer and extends to the upper surface and the lower surface. The first circuit structure is disposed on an upper surface of the core layer and is electrically connected to the conductive through via. The second circuit structure is disposed on a lower surface of the core layer and is electrically connected to the conductive through via. The electronic unit is disposed on the first circuit structure and is electrically connected to the first circuit structure. The connecting component is disposed on the second circuit structure and is electrically connected to the second circuit structure.

IPC Classes  ?

• H10W 70/692 -
• H10W 40/20 -
• H10W 70/60 -
• H10W 70/63 -
• H10W 74/10 -
• H10W 90/00 -
• H10W 90/10 -
• H10B 80/00 - Assemblies of multiple devices comprising at least one memory device covered by this subclass
• H10D 80/30 - Assemblies of multiple devices comprising at least one device covered by this subclass the at least one device being covered by groups , e.g. assemblies comprising integrated circuit processor chips
• H10W 74/15 -

Abstract

An electronic device is proposed. The electronic device includes a first transistor, a second transistor, a third transistor, a fourth transistor, a first capacitor, a second capacitor, and a tunable component. The second transistor is coupled to the control terminal of the first transistor. The first capacitor is coupled between the first terminal of the first transistor and the second transistor. The second capacitor is coupled between the control terminal of the first transistor and the second transistor. The first capacitor and the second capacitor are connected in series between the first terminal and the control terminal of the first transistor. The third transistor is coupled to a first node between the second capacitor and the control terminal of the first transistor, and configured to receive a first voltage. The fourth transistor is coupled to a second node between the second capacitor and the second transistor.

IPC Classes  ?

• G09G 3/3291 - Details of drivers for data electrodes in which the data driver supplies a variable data voltage for setting the current through, or the voltage across, the light-emitting elements
• G09G 3/3266 - Details of drivers for scan electrodes

Abstract

In an electronic device, a shielding layer is disposed on a substrate and has at least one first through hole, a first insulating layer is disposed on the light shielding layer and has a second through hole, a semiconductor layer is disposed on the substrate, an organic insulating material is disposed on the first insulating layer, at least a portion of the organic insulating material is disposed in the second through hole, and a second insulating layer is disposed on the first insulating layer and has at least one third through hole, wherein a minimum distance between the substrate and the light shielding layer is less than a minimum distance between the substrate and the second insulating layer. A number of the first through hole(s) is different from a number of the third through hole(s).

IPC Classes  ?

• H10F 77/30 - Coatings
• H10H 20/855 - Optical field-shaping means, e.g. lenses
• H10W 90/00 -

Abstract

A display device is provided with a first panel including multiple first electrodes and multiple second electrodes intersecting with each other to define multiple pixels, and a cholesteric liquid crystal layer disposed between the first electrodes and the second electrodes. The pixels operate through a plurality of phases, and at least one of the phases is a low wave phase. Wherein, when one of the pixels operates in the low wave phase at a first temperature, one of the first electrodes is applied with a first voltage waveform, and one of the second electrodes is applied with a second voltage waveform, and the cholesteric liquid crystal layer corresponding to the one of the multiple pixels receives a first voltage difference, which is not equal to zero. Wherein, when the one of the pixels operates in the low wave phase at a second temperature different from the first temperature, the cholesteric liquid crystal layer corresponding to the one of the pixels receives a second voltage difference to present substantially same brightness as presented at the first temperature, and the first voltage difference is different from the second voltage difference.

IPC Classes  ?

• G02F 1/137 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells characterised by the electro-optical or magneto-optical effect, e.g. field-induced phase transition, orientation effect, guest-host interaction or dynamic scattering
• G02F 1/1343 - Electrodes
• G09G 3/36 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix by control of light from an independent source using liquid crystals

Abstract

A flexible electronic device including a first flexible layer, an electronic component layer, a polarization layer, an anti-reflective layer, a support layer, a first adhesive layer and a second adhesive layer. The electronic component layer is disposed on the first flexible layer. The polarization layer is disposed at one side of the electronic component layer away from the first flexible layer. The anti-reflective layer is disposed at one side of the polarization layer away from the electronic component layer. The support layer is disposed at one side of the first flexible layer away from the electronic component layer. The first adhesive layer is disposed between the first flexible layer and the support layer, and the second adhesive layer is disposed between the anti-reflective layer and the polarization layer. The thickness of the first adhesive layer is greater than the thickness of the second adhesive layer.

IPC Classes  ?

• H10H 29/24 - Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group comprising multiple light-emitting semiconductor devices

Abstract

A composite circuit laminate including a first redistribution layer, a second redistribution layer, and a core composite layer is provided. The second redistribution layer is disposed opposite to the first redistribution layer. The core composite layer is located between the first redistribution layer and the second redistribution layer. The core composite layer at least includes a first core sublayer, a second core sublayer, and a third core sublayer. The first core sublayer, the second core sublayer, and the third core sublayer have unequal physical properties. A manufacturing method of the composite circuit laminate is also provided.

IPC Classes  ?

• H10W 70/60 -
• H10W 70/05 -
• H10W 70/63 -
• H10W 70/685 -
• H10W 90/22 -
• H10W 90/00 -

Abstract

An electronic device includes a substrate, a first organic portion, a first opening, a second organic portion, a second opening, a third organic portion and a first element. In a cross-section view, the first organic portion, the first opening, the second organic portion, the second opening and the third organic portion are disposed on the substrate and arranged in a first direction, the first opening is located between the first organic portion and the second organic portion, the second opening is located between the second organic portion and the third organic portion, the second organic portion is located between the first organic portion and the third organic portion, and a width of the first opening and a width of the second opening are less than a width of the second organic portion in the first direction. The first element is overlapped with the first opening.

IPC Classes  ?

• H10W 90/00 -
• H10P 74/00 -

Abstract

A manufacturing method of an electronic device includes the following steps. A substrate is provided. A confinement region of the substrate is defined. An electronic element is bonded on the substrate. An underfill layer is formed on the substrate, wherein a thickness of the underfill layer is not greater than a height from a surface of the substrate to an upper surface of the electronic element.

IPC Classes  ?

• H10W 72/30 -
• H10W 72/00 -
• H10W 72/20 -
• H10W 74/15 -
• H10W 90/00 -

Abstract

An image capture system including an image sensor, a lens element, a first light projection unit, a second light projection unit and a control unit is provided. The lens element is disposed in front of the image sensor. The control unit is coupled to the image sensor, the first light projection unit and the second light projection unit. A first recording timing of the image sensor is synchronized with a turn-on timing of the first light projection unit to obtain a first image, and a second recording timing of the image sensor is synchronized with a turn-on timing of the second light projection unit to obtain a second image. An image generation method is also provided.

IPC Classes  ?

• H04N 5/77 - Interface circuits between an apparatus for recording and another apparatus between a recording apparatus and a television camera
• H04N 23/56 - Cameras or camera modules comprising electronic image sensorsControl thereof provided with illuminating means
• H04N 23/73 - Circuitry for compensating brightness variation in the scene by influencing the exposure time

Abstract

An electronic device includes: a substrate; a polymer material layer disposed on a first surface of the substrate, wherein the polymer material layer comprises a first portion, a second portion, a third portion, a first opening disposed between the first portion and the second portion, and a second opening disposed between the second portion and the third portion; a first light emitting unit disposed on the first surface, wherein at least a part of the first light emitting unit is disposed in the first opening; and a second light emitting unit disposed on the first surface and adjacent to the first light emitting unit, wherein at least a part of the second light emitting unit is disposed in the second opening, wherein in a cross-sectional view, the second portion comprises a second surface away from the first surface, and the second surface comprises a curved shape.

IPC Classes  ?

• H10H 29/14 - Integrated devices comprising at least one light-emitting semiconductor component covered by group comprising multiple light-emitting semiconductor components
• H10H 20/814 - Bodies having reflecting means, e.g. semiconductor Bragg reflectors
• H10H 20/853 - Encapsulations characterised by their shape

Abstract

An electronic device includes a first substrate, a plurality of electronic units, a reflective layer and a reflectivity matching layer. The first substrate has an active area and a peripheral area. The electronic units are disposed on the first substrate and located within the active area. The reflective layer is disposed above the first substrate and relatively overlaps the active area of the first substrate, and the reflective layer has a plurality of openings relatively overlapping the electronic units, respectively. The reflectivity matching layer is disposed above the first substrate and relatively overlaps the peripheral area of the first substrate.

IPC Classes  ?

• H10H 29/856 - Reflecting means
• H10H 29/45 - Active-matrix LED displays comprising two substrates, each having active devices thereon, e.g. displays comprising LED arrays and driving circuitry on different substrates
• H10H 29/80 - Constructional details
• H10H 29/855 - Optical field-shaping means, e.g. lenses
• H10K 59/127 - Active-matrix OLED [AMOLED] displays comprising two substrates, e.g. display comprising OLED array and TFT driving circuitry on different substrates
• H10K 59/18 - Tiled displays
• H10K 59/80 - Constructional details

Abstract

An electronic device is provided and includes a covering layer and a flexible substrate structure. The covering layer includes a first region and a second region. The flexible substrate structure is disposed under the covering layer and includes a first portion corresponding to the first region and a second portion corresponding to the second region, wherein an absolute value of a Gaussian curvature of the first region of the covering layer is less than an absolute value of a Gaussian curvature of the second region of the covering layer, wherein a length of the second portion of the flexible substrate structure is configured to expand in a direction transverse to a stretching direction.

IPC Classes  ?

• H10K 77/10 - Substrates, e.g. flexible substrates

Abstract

A manufacturing method of an electronic device includes: providing a substrate; forming a through hole penetrating the substrate; providing a seed layer, the seed layer extending into the through hole; performing a first coating step to form a first coating on a surface of the seed layer, the first coating filling a portion of the through hole; and performing a second coating step to form a second coating on a portion of the surface of the seed layer, the second coating filling another portion of the through hole and connected to the first coating. A current density used in the first coating step is greater than a current density used in the second coating step.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H10W 70/05 -
• H10W 70/60 -
• H10W 70/63 -

Abstract

An electronic device includes a substrate, a first signal line disposed on the substrate, first and second electronic units, first and second transistors, and a first connecting element. The first and second electronic units are disposed on the substrate and electrically connected to the first signal line. The first transistor is disposed on the substrate and has a first control element, a first conductive element, and a first semiconductor. The second transistor is disposed on the substrate and has a second control element, a second conductive element, and a second semiconductor. The first connecting element is electrically connected to the first control element and the second control element. The first semiconductor overlaps with the first control element and is disposed between the substrate and the first control element. The second semiconductor overlaps with the second control element and is disposed between the substrate and the second control element.

IPC Classes  ?

• H10K 59/121 - Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
• H10H 29/32 - Active-matrix LED displays characterised by the geometry or arrangement of elements within a subpixel, e.g. arrangement of the transistor within its RGB subpixel
• H10H 29/49 - Interconnections, e.g. wiring lines or terminals
• H10K 39/32 - Organic image sensors
• H10K 59/131 - Interconnections, e.g. wiring lines or terminals

Abstract

An electronic device comprising a substrate, a first conductive layer, a first insulating layer, a second conductive layer and a conductive pattern is provided. The first conductive layer is disposed on the substrate, and comprises a first electrode and a second electrode. The first insulating layer is disposed on the first conductive layer. The second conductive layer is disposed on the first insulating layer, and comprises a third electrode and a fourth electrode, wherein in a normal direction of the substrate, the first electrode overlaps the third electrode to form a first capacitor, and the second electrode overlaps the fourth electrode to form a second capacitor. The conductive pattern overlaps a gap between the first capacitor and the second capacitor in the normal direction.

IPC Classes  ?

• H10H 29/49 - Interconnections, e.g. wiring lines or terminals
• H10H 29/41 - Insulating layers formed between the driving transistors and the LEDs
• H10K 59/124 - Insulating layers formed between TFT elements and OLED elements
• H10K 59/131 - Interconnections, e.g. wiring lines or terminals

Abstract

This disclosure provides a communication device and a manufacturing method thereof. The manufacturing method of the communication device includes the following steps: providing a first dielectric layer, wherein the first dielectric layer includes a first region and a second region, and the first dielectric layer has a first surface and a second surface opposite to the first surface; providing a second dielectric layer; combining the first dielectric layer and the second dielectric layer with a sealing element, so that the sealing element is disposed between the first surface of the first dielectric layer and a third surface of the second dielectric layer; after combining the first dielectric layer and the second dielectric layer, thinning the second surface of the first dielectric layer; and disposing a first communication element on the first surface of the first dielectric layer in the first region.

IPC Classes  ?

• H10W 90/00 -
• H10D 1/64 - Variable-capacitance diodes, e.g. varactors
• H10D 30/67 - Thin-film transistors [TFT]

Abstract

A detection device detects an output electromagnetic wave signal passing through a test object. The detection device includes an electromagnetic wave signal generating unit, an output element, a receiving element and a measuring unit. The electromagnetic wave signal generating unit is used for generating an initial electromagnetic wave signal. The output element is used for outputting the initial electromagnetic wave signal. The receiving element is used for receiving the output electromagnetic wave signal. The measuring unit is used for measuring the value of the output electromagnetic wave signal.

IPC Classes  ?

• G01R 29/08 - Measuring electromagnetic field characteristics

Abstract

The disclosure provides an electronic device, including: a circuit substrate, an inorganic light emitting unit, and an opaque layer. The circuit substrate includes an optical sensor. The inorganic light emitting unit is disposed on the circuit substrate and is configured to emit a light. The opaque layer is disposed on the circuit substrate, including a first opening through which a portion of the light is transmitted to the optical sensor.

IPC Classes  ?

• H10W 90/00 -
• G06V 40/13 - Sensors therefor
• H10W 72/90 -

Abstract

An electronic device includes a plurality of sensing pixel circuits is provided. At least one of the sensing pixel circuits includes a photoelectric sensing element, a first transistor device, a second transistor device, and a third transistor device. A second end of the first transistor device is coupled to a data line, and a control end of the first transistor device is coupled to a first scan line. A read signal is transmitted on the first scan line, and the read signal includes a first period and a second period. The read signal turns on the first transistor device during the first period and the second period. A data voltage of the data line is at a first level during the first period, and the data voltage of the data line is at a second level during the second period.

IPC Classes  ?

• G09G 3/3233 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element
• G06K 7/10 - Methods or arrangements for sensing record carriers by electromagnetic radiation, e.g. optical sensingMethods or arrangements for sensing record carriers by corpuscular radiation

Abstract

An electrode structure includes a first electrode, a first insulating layer disposed on the first electrode, and a second electrode disposed on the first insulating layer. A third electrode is disposed on the first insulating layer and surrounds the second electrode, wherein the second electrode and the third electrode are in a same layer. A conductive layer is overlapped with the first electrode and the second electrode. An area of the conductive layer is greater than an area of the second electrode.

IPC Classes  ?

• G06V 40/13 - Sensors therefor
• G06F 3/044 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means

Abstract

An electronic device includes a substrate, a driving element, a conductive layer, and an electronic element is provided. The driving element is disposed on the substrate. The conductive layer is disposed on the substrate, wherein along a first direction, there is a first distance between the driving element and a first side of the conductive layer extended along a second direction, and there is a second distance between the driving element and a second side of the conductive layer extended along the second direction, wherein the first distance is different from the second distance. The electronic element is disposed on the conductive layer and electrically connected to the driving element through a first conductive line. In a top view, the first conductive line is overlapped with the first side of the conductive layer and the second side of the conductive layer.

IPC Classes  ?

• H10D 86/60 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
• H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs

Abstract

A display device including a substrate, a light-shielding layer disposed on the substrate, a plurality of light-emitting elements, a plurality of optical filter elements, an organic material disposed on the light-emitting elements, and a plurality of spacers disposed on the substrate is provided. The first light-shielding layer defines a plurality of openings, and the light-emitting elements are disposed in the openings. The optical filter elements respectively overlap the light-emitting elements. One of the light-emitting elements comprises a light-emitting area, and one of the spacers does not overlap the light-emitting area.

IPC Classes  ?

• H10H 20/855 - Optical field-shaping means, e.g. lenses
• H10H 20/01 - Manufacture or treatment
• H10W 90/00 -

Abstract

An electronic device includes a display panel unit and a functional panel unit. The display panel unit has a display region and a non-display region adjacent to the display region. The display panel unit includes a first light shielding element disposed in the non-display region. The functional panel unit is disposed on the display panel unit and has an active region and a non-active region adjacent to the active region. The functional panel unit includes a second light shielding element disposed in the non-active region. In a cross-sectional direction of the electronic device, a width of the first light shielding element is greater than a width of the second light shielding element.

IPC Classes  ?

• G09G 3/02 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes by tracing or scanning a light beam on a screen
• G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
• G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
• G09G 3/36 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix by control of light from an independent source using liquid crystals

Abstract

Electronic device is provided. The electronic device includes a substrate, an electronic element, a heat sink, a circuit board, a first conductive element, and a first heat dissipation element. The substrate has a first surface and a second surface opposite to each other. The electronic element is disposed on the first surface of the substrate. The heat sink is disposed on the electronic element. The circuit board is disposed on the second surface of the substrate. The first conductive element penetrates the substrate and electrically connects the electronic element and the circuit board. The first heat dissipation element penetrates the substrate and the circuit board, wherein the first heat dissipation element thermally exchanges with the heat sink.

IPC Classes  ?

• H10W 40/22 -
• H10W 70/685 -

Abstract

A detection device includes a detection module, a delivery module and a control module. The delivery module includes a delivery pipeline assembly, a gas pump assembly connected to the detection module via the delivery pipeline assembly, and a liquid pump assembly connected to the detection module via the delivery pipeline assembly. The control module is electrically connected to the delivery module for controlling the gas pump assembly and the liquid pump assembly.

IPC Classes  ?

• G01N 27/416 - Systems
• G01N 1/14 - Suction devices, e.g. pumpsEjector devices
• G01N 1/24 - Suction devices

Abstract

An electronic device includes a substrate, a pixel unit, a first chip on film and a second chip on film. The substrate has a first side and a second side opposite to each other. The pixel unit is disposed on the substrate. The first chip on film is disposed on the first side and is electrically connected to the pixel unit through a first wire. The second chip on film is disposed on the first side and is electrically connected to the pixel unit through a second wire. The first chip on film and the second chip on film respectively have different functions. The first chip on film at least partially overlaps the second chip on film.

IPC Classes  ?

• H10F 39/95 - Assemblies of multiple devices comprising at least one integrated device covered by group , e.g. comprising integrated image sensors

Abstract

Provided are an electronic device and a method for manufacturing the same. The electronic device includes a substrate including first and second surfaces opposite to each other in a first direction and including a cavity and a through hole penetrating the first and second surfaces, a first electronic unit disposed in the cavity, a conductive element disposed in the through hole and electrically connected to the first electronic unit and including a seed layer pattern and a conductive pillar extending from the seed layer pattern along the first direction, and a circuit structure disposed on the first surface of the substrate and electrically connected to the first electronic unit and the conductive element.

IPC Classes  ?

• H10W 70/63 -
• H10W 46/00 -
• H10W 70/05 -
• H10W 70/60 -
• H10W 70/68 -
• H10W 70/685 -
• H10W 90/00 -
• H10W 90/10 -
• H10W 90/22 -

Abstract

An electronic device includes a reflective panel, a transmittance switching element and a light absorbing element. The reflective panel has a first side and a second side opposite to each other. The transmittance switching element is disposed on the first side of the reflective panel. The light absorbing element is disposed on the second side of the reflective panel. The reflective panel includes at least one cholesteric liquid crystal layer, and the at least one cholesteric liquid crystal layer is used to reflect visible light in a reflective state.

IPC Classes  ?

• G02F 1/1347 - Arrangement of liquid crystal layers or cells in which the final condition of one light beam is achieved by the addition of the effects of two or more layers or cells
• G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
• G02F 1/137 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells characterised by the electro-optical or magneto-optical effect, e.g. field-induced phase transition, orientation effect, guest-host interaction or dynamic scattering
• G02F 1/157 - Structural association of cells with optical devices, e.g. reflectors or illuminating devices

Abstract

A switchable optical element including a first substrate, a second substrate, a switching medium, multiple lenses, and multiple spacers is provided. The second substrate is opposite to the first substrate. The switching medium is disposed between the first substrate and the second substrate. The lenses are disposed on the second substrate. The spacers are disposed between the lenses and the first substrate. In a cross-sectional direction of the switchable optical element, at least one of the spacers is disposed corresponding to at least one of the lenses. A switchable display device is also provided.

IPC Classes  ?

• G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
• G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
• G02F 1/1337 - Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
• G02F 1/1339 - GasketsSpacersSealing of cells

Abstract

An electronic device includes first and second substrates, a display medium layer, a plurality of gate lines, a plurality of data lines, and first and second spacer groups. The display medium layer has a minimum thickness and a maximum thickness. The first and second spacer groups are adjacently disposed along a first direction and have a same spacer arrangement. The first and second spacer groups respectively include first and second spacing units overlapped with a first gate line. In the first direction, a distance between the first and second spacing units is less than a reference dimension m, m=k*y*[ln(t*d)+t/y], wherein k is equal to the minimum thickness divided by the maximum thickness, y is a size of a sub-pixel in a second direction, t is a thickness of the first substrate, and d is the minimum thickness.

IPC Classes  ?

• G02F 1/1339 - GasketsSpacersSealing of cells
• G02F 1/1362 - Active matrix addressed cells

Abstract

A light-emitting module is provided. The light-emitting module includes a backplane, a light-emitting element, and a reflector. The light-emitting element is disposed on the backplane and adjacent to the light-emitting element. The reflector has a plurality of light-absorbing elements. The reflector includes a light-absorbing region, and the light-absorbing elements are located in the light-absorbing region. Light emitted by the light-emitting element has a beam angle between 45 degrees and 90 degrees.

IPC Classes  ?

• H10H 20/856 - Reflecting means
• H10W 90/00 -

Abstract

An electronic device having a display area and a non-display area includes a substrate; a first transistor including a first semiconductor layer and disposed in the non-display area; a second transistor including a second semiconductor layer and a gate electrode and disposed in the display area, wherein a material of the first semiconductor layer is different from a material of the second semiconductor layer; a barrier layer overlapping the gate electrode of the second transistor; and an organic layer disposed on the first transistor and the second transistor, wherein the organic layer includes a first portion disposed in the non-display area and a second portion disposed in the display area. A minimum distance from the substrate to the first portion is a first distance, a minimum distance from the substrate to the second portion is a second distance, and the first distance is different from the second distance.

IPC Classes  ?

• H10D 86/60 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
• H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs

Abstract

A transparent display device and a manufacturing method of a tiled display device are provided. The transparent display device includes a substrate, a plurality of units, and a first alignment mark. The substrate has a display region. The units are disposed in the display region and repeatedly arranged in a first direction and in a second direction, and each of the units includes a pixel region and a transparent region, in which each of the units includes at least one light-emitting element corresponding to the pixel region. The first alignment mark is disposed in the display region and formed of at least two pattern layers, in which at least one of the pattern layers includes metal, and in a top-view direction, the first alignment mark is disposed in one of the units.

IPC Classes  ?

• H10K 59/88 - Dummy elements, i.e. elements having non-functional features
• H10H 29/01 - Manufacture or treatment
• H10H 29/49 - Interconnections, e.g. wiring lines or terminals
• H10K 59/12 - Active-matrix OLED [AMOLED] displays
• H10K 59/131 - Interconnections, e.g. wiring lines or terminals
• H10K 59/18 - Tiled displays

Abstract

Disclosed is a reconfigurable surface configured to modulate a phase of an electromagnetic wave. The reconfigurable surface includes a first substrate, a plurality of modulating units, and a ground signal layer. The plurality of modulating units are disposed on the first substrate. One of the plurality of modulating units includes a first electrode, a second electrode, and a modulating medium. The first electrode is disposed on the first substrate. The second electrode is disposed adjacent to the first electrode. The modulating medium is located between the first electrode and the second electrode. The ground signal layer is disposed under the first substrate. A manufacturing method of a reconfigurable surface is also provided.

IPC Classes  ?

• H01Q 15/00 - Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
• H01Q 3/44 - Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the electric or magnetic characteristics of reflecting, refracting, or diffracting devices associated with the radiating element

Abstract

A manufacturing method of an electronic device includes: providing a substrate having a first surface and a second surface opposite to the first surface; forming a through hole penetrating the substrate, a side wall of the through hole being connected with the first surface and the second surface; forming a first protective layer on the first surface, the second surface and the side wall; forming a conductive layer on the first protective layer such that a portion of the conductive layer is disposed in the through hole; performing a thinning step to remove another portion of the conductive layer; and performing an inspection on the substrate to obtain a thickness variation value of the substrate, the thickness variation value being less than or equal to 20 micrometers.

IPC Classes  ?

• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
• H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
• H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

Abstract

A manufacturing method of an electronic device including following steps is provided. A substrate having a first surface and a second surface facing each other is provided. A plurality of localized regions of the substrate are modified. A first etching step is performed to form a plurality of holes in the localized regions. A second etching step is performed to form a plurality of through holes from the holes. Along a normal direction of the substrate, each of the holes has a first depth, each of the through holes has a second depth, and the first depth and the second depth satisfy a following equation (a): 0.5*T2≤T1≤T2, where T1 is the first depth, and T2 is the second depth.

IPC Classes  ?

• H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

Abstract

An electronic printing device is provided. The electronic printing device includes a print board, a cathode board, a storage tank and an electrolyte. The cathode board is disposed opposite to the print board. The print board and the electrolyte are disposed in the storage tank, and the electrolyte includes metal ions, wherein the print board includes a substrate, a print unit and a sensing line. The substrate includes an active region and a border region, and the active region is adjacent to the border region. The print unit is disposed on the substrate within the active region, wherein the print unit includes print electrode. The sensing line is disposed on the substrate, and is electrically connected to the print electrode, wherein the sensing line at least partially overlaps with the active region.

IPC Classes  ?

• C25D 17/12 - Shape or form
• C25D 5/02 - Electroplating of selected surface areas
• C25D 5/08 - Electroplating with moving electrolyte, e.g. jet electroplating
• C25D 17/02 - TanksInstallations therefor

Abstract

The disclosure provides a display device and a driving method thereof. The display device includes a substrate, a plurality of pixels, a first gate driver, a second gate driver, and a control circuit. The plurality of pixels are disposed on the substrate. The first gate driver has a first output terminal coupled to the plurality of pixels. The second gate driver has a second output terminal commonly coupled to the plurality of pixels. The control circuit is electrically coupled to the first gate driver for selectively disabling the first gate driver. When the first gate driver is disabled, the first output terminal is in a floating state.

IPC Classes  ?

• G09G 3/3266 - Details of drivers for scan electrodes
• G09G 3/00 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes

Abstract

A method for manufacturing an electronic device includes providing substrate; performing first modification step on at least portion of substrate; generating first side-incident light to introduce first side-incident light into interior of substrate; inspecting substrate after first modification step to acquire detection information related to state of substrate; and based on detection information, determining whether rework process is required.

IPC Classes  ?

• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

Abstract

An electronic device includes a circuit substrate, a first substrate, an electronic element, a drive unit, and an internal electrical connection structure. The first substrate overlaps the circuit substrate. The electronic element is disposed on the first substrate. The drive unit is disposed on the first substrate and electrically connected to the electronic element. The internal electrical connection structure is disposed between the circuit substrate and the first substrate and includes a first conductive terminal and a second conductive terminal, in which the first conductive terminal and the second conductive terminal are electrically connected to the first substrate and the circuit substrate, respectively.

IPC Classes  ?

• H05K 1/14 - Structural association of two or more printed circuits

Abstract

An electronic device includes a first substrate, an electronic unit, a phase retardation layer, and a polarizing layer. The electronic unit is disposed on the first substrate. The phase retardation layer is disposed at one side of the electronic unit away from the first substrate, and includes a first portion and a second portion disposed adjacent to each other. The first portion has a first fast axis, and the second portion has a second fast axis. The polarizing layer is disposed at one side of the phase retardation layer away from the electronic unit, and has a transmission axis. The included angle between the first fast axis and the transmission axis is different from the included angle between the second fast axis and the transmission axis, or the phase retardation of the first portion is different from the phase retardation of the second portion.

IPC Classes  ?

• H10K 59/80 - Constructional details

Abstract

Provided is a manufacturing method of an electronic device including the following steps. A substrate is provided, where the substrate has a first surface and a second surface opposite to each other. A through hole penetrating the substrate is formed. A build-up structure on the first surface and the second surface of the substrate is formed. The build-up structure disposed on the first surface and the second surface is simultaneously cut, so that the build-up structure forms a first groove and a second groove respectively. An electronic device is also provided.

IPC Classes  ?

• H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/15 - Ceramic or glass substrates
• H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

Abstract

Provided are an electronic device and a method for manufacturing the same. The electronic device includes at least one electronic unit and a connection substrate. The connection substrate is electrically connected to the electronic unit and includes a first base structure and a second base structure disposed between the first base structure and the electronic unit. The first base structure includes a first insulation layer and a first heat dissipation structure disposed in the first insulation layer, and the second base structure includes a second insulation layer and a second heat dissipation structure disposed in the second insulation layer. A thickness of the first insulation layer is greater than a thickness of the second insulation layer, and the first heat dissipation structure overlaps with the second heat dissipation structure.

IPC Classes  ?

• H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/367 - Cooling facilitated by shape of device
• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

Abstract

A composite circuit laminate is provided. The composite circuit laminate includes a first redistribution layer and a second redistribution layer. The first redistribution layer includes at least one first pad and at least one second pad. The second redistribution layer is disposed opposite to the first redistribution layer. The second redistribution layer includes at least one third pad. When the at least one first pad is bonded to the at least one third pad, the at least one first pad is electrically connected to the at least one third pad to transmit electrical signals. The at least one second pad has a functional material.

IPC Classes  ?

• H01L 23/498 - Leads on insulating substrates
• B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
• B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance

Abstract

The present disclosure provides an electronic device, an interposer and a method for manufacturing the same. The interposer includes a package structure including a plurality of connection units spaced apart from each other and arranged in an array, a first package layer surrounding the plurality of connection units, and a first circuit structure disposed at a first side of the first package layer and electrically connected to the plurality of connection units. Each connection unit includes a base layer and a first conductive element disposed in the base layer.

IPC Classes  ?

• H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

Abstract

An electronic device including at least one electronic component, a first circuit chip, a glass substrate, a first conductive line and a second conductive line. The glass substrate has a first surface, a second surface opposite to the first surface and at least one conductive via extending from the first surface to the second surface, wherein the first circuit chip is electrically connected to the at least one electronic component through the at least one conductive via and configured to control the at least one electronic component. The first conductive line and the second conductive line are arranged on the glass substrate, wherein the first conductive line is electrically connected to the at least one electronic component, and the second conductive line is electrically connected to the first circuit chip, wherein the first conductive line is electrically connected to the second conductive line through the at least one conductive via.

IPC Classes  ?

• G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
• H10H 20/85 - Packages
• H10H 20/856 - Reflecting means
• H10H 20/857 - Interconnections, e.g. lead-frames, bond wires or solder balls
• H10H 29/14 - Integrated devices comprising at least one light-emitting semiconductor component covered by group comprising multiple light-emitting semiconductor components

Abstract

A three-dimensional display device includes an eye tracking device, a display, and first and second processing units. The first processing unit calculates coordinates of left and right viewpoints based on left and right eye image data. The display includes light-emitting units for emitting light beams and light-splitting units for distributing the light beams to the left and right viewpoints. The second processing unit defines a crosstalk region based on an opening angle and optical paths of the light beams passing through the light-splitting units. The crosstalk region is simultaneously struck by a first light beam assigned to the left viewpoint and a second light beam assigned to the right viewpoint. The second processing unit compares preset gray levels of the first and second light beams and then determines corrected gray levels of the first and second light beams. An operation method of a three-dimensional display device is also provided.

IPC Classes  ?

• H04N 13/125 - Improving the 3D impression of stereoscopic images by modifying image signal contents, e.g. by filtering or adding monoscopic depth cues for crosstalk reduction
• H04N 13/305 - Image reproducers for viewing without the aid of special glasses, i.e. using autostereoscopic displays using lenticular lenses, e.g. arrangements of cylindrical lenses
• H04N 13/383 - Image reproducers using viewer tracking for tracking with gaze detection, i.e. detecting the lines of sight of the viewer's eyes

Abstract

The present disclosure provides an electronic device and a manufacturing method thereof. The manufacturing method includes providing a substrate including at least one through hole, forming a seed layer extending into the through hole on the substrate, forming an insulating layer extending into the through hole and exposing a portion of the seed layer in the through hole on the seed layer, and forming a conductor layer on the portion of the seed layer.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/18 - Printed circuits structurally associated with non-printed electric components

Abstract

A light emitting device includes a substrate, a first transistor, a first light emitting unit and a color conversion structure. The first transistor and the first light emitting unit are disposed on the substrate. The color conversion structure is disposed between the first transistor and the first light emitting unit, and has a first portion overlapped with the first light emitting unit and a second portion adjacent to the first portion. A light of the first light emitting unit passes through the first portion and the substrate, and the first light emitting unit is electrically connected to the first transistor through the second portion.

IPC Classes  ?

• H10H 29/39 - Connection of the pixel electrodes to the driving transistors
• H10H 29/41 - Insulating layers formed between the driving transistors and the LEDs
• H10H 29/49 - Interconnections, e.g. wiring lines or terminals
• H10H 29/85 - Packages
• H10H 29/851 - Wavelength conversion means
• H10H 29/856 - Reflecting means

Abstract

An electronic device includes: a substrate structure including: a substrate; a first conductive layer disposed on the substrate and including a first common electrode line extending along a first direction; a second conductive layer disposed on the first conductive layer and including a second common electrode line extending along a second direction different from the first direction, wherein the first common electrode line and the second common electrode line are partially overlapped in a normal direction of the substrate, the second common electrode line has a first part and a second part, and a width of the first part is greater than a width of the second part in the first direction; and a pixel electrode, wherein at least a part of the pixel electrode is disposed on the second conductive layer, and the pixel electrode and the second common electrode line are partially overlapped.

IPC Classes  ?

• G02F 1/1676 - Electrodes
• G02F 1/1362 - Active matrix addressed cells
• G02F 1/167 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on translational movement of particles in a fluid under the influence of an applied field characterised by the electro-optical or magneto-optical effect by electrophoresis

Abstract

A switching element has a gate and a semiconductor. The semiconductor includes a first region, a second region, and a third region. The first region is located between the second region and the third region. The first region includes at least one first subregion and a second subregion other than the at least one first subregion, and the at least one first subregion is adjacent to a side of the semiconductor. In a top view of the switching element, at least a portion of the first region overlaps with the gate. An ion concentration doped in the at least one first subregion is different from an ion concentration doped the second subregion.

IPC Classes  ?

• H10D 30/67 - Thin-film transistors [TFT]

Abstract

An electronic device is provided. The electronic device includes a substrate, a first signal line, a plurality of transistors, and a second signal line. The substrate has the peripheral region. The first signal line is disposed on the substrate, and extends along a first direction. The first signal line is disposed in the peripheral region. The transistors are disposed on the substrate, and are arranged along the first direction. The transistors are disposed in the peripheral region. A first transistor of the transistors is electrically connected to the first signal line. The second signal line is disposed on the substrate, and extends along the first direction. The second signal line is disposed between the plurality of transistors and the first signal line. The second signal line is electrically connected to a gate of the first transistor through a first via. The first via is overlapped with the second signal line.

IPC Classes  ?

• G09G 3/00 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
• G02F 1/1362 - Active matrix addressed cells

Abstract

An electronic device includes a first mirror display unit, a second mirror display unit, and a reflective element. The first mirror display unit and the second mirror display unit are disposed adjacent to each other. The reflective element is disposed between the first mirror display unit and the second mirror display unit.

IPC Classes  ?

• H10H 29/856 - Reflecting means
• H10H 29/01 - Manufacture or treatment
• H10H 29/24 - Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group comprising multiple light-emitting semiconductor devices
• H10H 29/85 - Packages
• H10H 29/855 - Optical field-shaping means, e.g. lenses

Abstract

A display device has a first area and a second area, and includes: a first driving unit and a first power source arranged in a first peripheral sub-area, a second driving unit and a second power source arranged in a second peripheral sub-area, a first signal line and a second signal line arranged in the first area and the second area; a first display unit arranged in a first display sub-area and connected to the first driving unit via the first signal line; a second display unit arranged in a second display sub-area and connected to the second driving unit via the second signal line, a first discharge unit connected between the first power source and the first signal line, and a second discharge unit connected between the second power source and the second signal line, wherein the first power source and the second power source are electrically separated.

IPC Classes  ?

• G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]

Abstract

A transparent display device and a manufacturing method thereof are provided. The transparent display device includes a substrate, a inorganic layer disposed on the substrate, a driving element layer disposed on the inorganic layer, a first organic layer disposed on the driving element layer, a second organic layer disposed on the first organic layer, and a light emitting element disposed on the second organic layer, wherein the first organic layer includes a side surface, and the second organic layer is disposed on the side surface of the first organic layer.

IPC Classes  ?

• H10K 59/124 - Insulating layers formed between TFT elements and OLED elements
• H10K 59/12 - Active-matrix OLED [AMOLED] displays
• H10K 59/122 - Pixel-defining structures or layers, e.g. banks

Abstract

A display device is provided. The display device includes a display panel, a first viewing angle control panel, and a second viewing angle control panel. The first viewing angle control panel overlaps the display panel and includes a first liquid-crystal layer. The second viewing angle control panel overlaps the display panel and the first viewing angle control panel and includes a second liquid-crystal layer. The first liquid-crystal layer is different from the second liquid-crystal layer, and the product of the first liquid-crystal birefringence value and the first liquid-crystal interlayer spacing is different from the product of the second liquid-crystal birefringence value and the second liquid-crystal interlayer spacing.

IPC Classes  ?

• G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
• G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
• G02F 1/1337 - Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers

Abstract

An electronic device includes a plurality of scan lines including first and second scan lines, a first scan transmission line, a second scan transmission line, at least one first conductive pattern electrically connected in parallel to at least one of the first scan transmission line and the first scan line, and having a first area, and at least one second conductive pattern electrically connected in parallel to at least one of the second scan transmission line and the second scan line, and having a second area. The first and second scan transmission lines cross the scan lines to form a plurality of first and second intersections, respectively. A length of the first scan transmission line is greater than a length of the second scan transmission line, and the first area is greater than the second area.

IPC Classes  ?

• H10K 59/131 - Interconnections, e.g. wiring lines or terminals
• H10H 29/32 - Active-matrix LED displays characterised by the geometry or arrangement of elements within a subpixel, e.g. arrangement of the transistor within its RGB subpixel
• H10H 29/49 - Interconnections, e.g. wiring lines or terminals
• H10K 59/121 - Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements

Abstract

Provided is an electronic device, which includes a substrate, a first electronic component, a second electronic component, a first switch element, a wire, and a first conductive pad. The first electronic component and the second electronic component are disposed on the substrate. The first switch element is disposed on the substrate. The wire is disposed on the substrate. The first conductive pad is disposed on the substrate. The first switch element is electrically connected to the first electronic component and the second electronic component through the wire and the first conductive pad.

IPC Classes  ?

• H10H 29/49 - Interconnections, e.g. wiring lines or terminals

Abstract

A display device and an operating method for the display device are provided. The display device includes an image data circuit, a recognition circuit and a compensation circuit. The image data circuit outputs an image data. The recognition circuit receives the image data and recognizes the image data to generate a recognition result. The compensation circuit generates a compensation signal according to the recognition result, and compensates the image data according to the compensation signal.

IPC Classes  ?

• G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
• G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• G06F 3/0488 - Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser using a touch-screen or digitiser, e.g. input of commands through traced gestures
• G06T 7/90 - Determination of colour characteristics

Abstract

The present disclosure provides an electronic device and a method for manufacturing the same. The electronic device includes a substrate including first and second surfaces opposite to each other in a first direction, a cavity, and a through-hole penetrating the first and second surfaces, a bonding element disposed in the cavity, a first electronic unit disposed in the cavity and bonded onto the substrate through the bonding element, a conductive element disposed in the through-hole and electrically connected to the first electronic unit, a circuit structure disposed on the first surface of the substrate and electrically connected to the first electronic unit and the conductive element, and a connection element disposed on the conductive element, wherein a reflow temperature of the bonding element is higher than a reflow temperature of the connection element.

IPC Classes  ?

• H10W 70/65 -
• H10W 70/05 -
• H10W 70/60 -
• H10W 70/63 -
• H10W 90/00 -

Abstract

A display device comprising a display unit, a processing unit and a light control unit is provided. The display unit is configured to display images. The processing unit is electrically connected to the display unit. The light control unit is electrically connected to the processing unit and configured to control an emitting light angle. The light control unit comprises a backlight unit, a mono cell array and a light control array. The mono cell array is disposed on the backlight unit and comprises a first mono cell and a second mono cell adjacent to the first mono cell. The light control array is disposed on the mono cell array and comprising a plurality of light control elements. The first mono cell overlaps one of the plurality of light control elements.

IPC Classes  ?

• G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
• G02F 1/13357 - Illuminating devices
• G06F 3/01 - Input arrangements or combined input and output arrangements for interaction between user and computer
• G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• G06F 21/84 - Protecting input, output or interconnection devices output devices, e.g. displays or monitors

Abstract

An electronic device includes: a frame including an accommodation space and a frame groove arranged to be adjacent to the accommodation space; a signal connection element disposed in the frame groove; and a modulation module disposed in the accommodation space. The modulation module includes: a first carrier board; a second carrier board corresponding to the first carrier board; an electromagnetic wave receiving element disposed on at least one of the first carrier board and the second carrier board; and an electromagnetic wave adjusting element disposed between the first carrier board and the second carrier board. The electromagnetic wave receiving element is electrically connected to the signal connection element in the frame groove.

IPC Classes  ?

• G02F 1/03 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on ceramics or electro-optical crystals, e.g. exhibiting Pockels or Kerr effect
• G02F 1/00 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics

Abstract

A test device includes a flexible detecting film and a supporting layer. The supporting layer supports the flexible detecting film. The flexible detecting film includes at least one probe and at least one first component, the first component overlaps the probe, the first component is disposed between the probe and the supporting layer, the flexible detecting film includes an organic material, and an elongation ratio of the organic material is greater than an elongation ratio of the supporting layer.

IPC Classes  ?

• G01R 1/067 - Measuring probes
• G01R 3/00 - Apparatus or processes specially adapted for the manufacture of measuring instruments

Abstract

An electronic device includes a substrate, a first electronic component, a second electronic component, a first drive circuit, a second drive circuit, and a first control circuit. The first electronic component and the second electronic component are arranged in a first area of the substrate. The first drive circuit and the second drive circuit are arranged in a second area of the substrate. The first drive circuit is coupled to the first electronic component. The second drive circuit is coupled to the second electronic component. The first control circuit is arranged in the second area of the substrate and is coupled to the first drive circuit and the second drive circuit. The first control circuit includes a first judgment transistor, a second judgment transistor, a first input control transistor, a second input control transistor, a first reset transistor, and a first capacitor.

IPC Classes  ?

• G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix

Abstract

An electronic device has a substrate, a plurality of transistors, a first lens unit, and a second lens unit. The plurality of transistors are arranged on the substrate, and each transistor has a channel. The first lens unit and the second lens unit are arranged on the substrate. The quantity of channels of the plurality of transistors that overlap with the first lens unit is different from the quantity of channels of the plurality of transistors that overlap with the second lens unit.

IPC Classes  ?

• H10H 29/32 - Active-matrix LED displays characterised by the geometry or arrangement of elements within a subpixel, e.g. arrangement of the transistor within its RGB subpixel
• G02B 5/20 - Filters
• H10H 29/49 - Interconnections, e.g. wiring lines or terminals
• H10H 29/85 - Packages
• H10H 29/855 - Optical field-shaping means, e.g. lenses

Abstract

A stretchable electronic device includes a first reflective panel. The first reflective panel includes a first substrate having at least one first opening, a second substrate opposite to the first substrate, a first liquid crystal layer disposed between the first substrate and the second substrate, a first frame glue disposed between the first substrate and the second substrate and adjacent to the first liquid crystal layer, and a first material layer disposed in the at least one first opening. A material of the first material layer is different from a material of the first substrate.

IPC Classes  ?

• G02F 1/1339 - GasketsSpacersSealing of cells
• G02F 1/1333 - Constructional arrangements
• G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
• G02F 1/1341 - Filling or closing of cells
• G02F 1/1343 - Electrodes

Abstract

An electronic device including a substrate, a first organic layer, a first electronic element, a second organic layer and a first lens is disclosed. The substrate includes a connection portion and at least two main portions, and the connection portion is connected to the at least two main portions. The first organic layer is disposed on one of the at least two main portions and includes a first opening. The first electronic element is disposed in the first opening. The second organic layer is disposed on the first organic layer and covers the first electronic element. The first lens is disposed on the second organic layer.

IPC Classes  ?

• H10K 59/80 - Constructional details
• H10H 29/37 - Pixel-defining structures, e.g. banks between the LEDs
• H10H 29/41 - Insulating layers formed between the driving transistors and the LEDs
• H10H 29/85 - Packages
• H10H 29/854 - Encapsulations characterised by their material, e.g. epoxy or silicone resins
• H10H 29/855 - Optical field-shaping means, e.g. lenses
• H10K 59/122 - Pixel-defining structures or layers, e.g. banks
• H10K 59/124 - Insulating layers formed between TFT elements and OLED elements
• H10K 59/38 - Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
• H10K 59/88 - Dummy elements, i.e. elements having non-functional features
• H10K 77/10 - Substrates, e.g. flexible substrates
• H10K 102/00 - Constructional details relating to the organic devices covered by this subclass

Abstract

An electronic device includes a privacy panel. The privacy panel includes a first substrate, a first alignment layer and a first electrode layer. The first alignment layer is disposed on the first substrate. The first electrode layer is disposed between the first substrate and the first alignment layer. At a wavelength of 550 nm, a refractive index of the first electrode layer is between 1.7 and 2.1.

IPC Classes  ?

• G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
• G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
• G02F 1/1337 - Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
• G02F 1/1343 - Electrodes

Abstract

A display device including a first light-emitting unit, a second light-emitting unit, a first conductive wire, a first redundant pad, and a second redundant pad is provided. The first conductive wire is electrically connected to the first light-emitting unit and the second light-emitting unit. The first redundant pad is electrically connected to the first conductive wire. The second redundant pad is electrically connected to the first conductive wire. The first light-emitting unit has a first electrode and a second electrode, and the second light-emitting unit has a third electrode and a fourth electrode. The first conductive wire is electrically connected to the second electrode and the third electrode, and the second electrode and the third electrode have different polarities.

IPC Classes  ?

• H10K 71/00 - Manufacture or treatment specially adapted for the organic devices covered by this subclass
• H10H 29/01 - Manufacture or treatment
• H10H 29/49 - Interconnections, e.g. wiring lines or terminals
• H10K 59/12 - Active-matrix OLED [AMOLED] displays
• H10K 59/131 - Interconnections, e.g. wiring lines or terminals

Abstract

A detection device includes: a substrate assembly; a cover assembly disposed on the substrate assembly, wherein the substrate assembly and the cover assembly together form a first cavity and a second cavity; a first electrode disposed in the first cavity; a second electrode disposed in the second cavity; a connecting pipe connecting the first cavity and the second cavity; an inflow pipe connecting the first cavity or the second cavity; and an outflow pipe connecting the first cavity or the second cavity.

IPC Classes  ?

• G01N 27/416 - Systems

Abstract

An electronic device installed on a vehicle with a windshield includes a display module, a cleaning module, and a dust collection module. The display module includes a light-emitting unit and a cover layer. The light-emitting unit is adapted to emit a light beam. The cover layer is disposed on the light-emitting unit and overlaps the light-emitting unit. The windshield is opposite to the display module. The light beam penetrates the cover layer and is incident on the windshield, allowing the human eye to observe a virtual image formed behind the windshield. The cleaning module and the dust collection module are disposed on two opposite sides of the display module. At least a portion of the cleaning module is adjacent to the cover layer, the dust collection module has an opening, and the opening is adjacent to the cover layer.

IPC Classes  ?

• G02B 27/00 - Optical systems or apparatus not provided for by any of the groups ,
• B60K 35/231 - Head-up displays [HUD] characterised by their arrangement or structure for integration into vehicles
• G02B 27/01 - Head-up displays

Abstract

An electronic device includes a substrate having a surface, a first conducting layer disposed on the surface of the substrate, a second conducting layer disposed on the first conducting layer, a first electronic component disposed on the first conducting layer and electrically connected to the first conducting layer, and a second electronic component disposed on the second conducting layer and electrically connected to the second conducting layer. The second conducting layer is disposed between the first conducting layer and the second electronic component. In a cross-section view, the first electronic component is overlapped with the second conducting layer along a direction parallel to the surface of the substrate.

IPC Classes  ?

• H10H 20/01 - Manufacture or treatment
• H10H 20/857 - Interconnections, e.g. lead-frames, bond wires or solder balls
• H10W 90/00 -

Abstract

A display device includes: a display panel including: a first substrate; a second substrate disposed opposite to the first substrate; and a light modulation element disposed between the first substrate and the second substrate; a backlight module disposed corresponding to the display panel, wherein the backlight module includes at least one optical film; and a support plate disposed between the display panel and the backlight module; wherein the first substrate has a first thickness, the second substrate has a second thickness, the support plate has a third thickness, and the third thickness is greater than or equal to a sum of the first thickness and the second thickness.

IPC Classes  ?

• G02F 1/1333 - Constructional arrangements
• G02F 1/13357 - Illuminating devices

Abstract

The present disclosure provides an electronic device including an electronic unit including a first conductive pad, a protective layer disposed on the electronic unit, a packaging layer surrounding the electronic unit and the protective layer, a conductive component disposed in the protective layer and overlapped with the first conductive pad, a bonding component disposed on the conductive component and overlapped with the first conductive pad, and an external component disposed on the bonding component and including a second conductive pad overlapped with the first conductive pad. The external component is electrically connected to the first conductive pad through the bonding component.

IPC Classes  ?

• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H01L 23/00 - Details of semiconductor or other solid state devices

Abstract

An electronic device includes a substrate, a semiconductor layer, a first electrode, a second electrode, an insulator and a dielectric layer. The semiconductor layer is disposed on the substrate. The first electrode is electrically connected to the semiconductor layer. The second electrode is electrically connected to the semiconductor layer. The insulator is disposed between the first electrode and the second electrode, and the insulator has a first opening. The dielectric layer is disposed on the semiconductor layer, and the dielectric layer has a second opening and a third opening. The second electrode is electrically connected to the semiconductor layer through the first opening and the second opening, and the first electrode is electrically connected to the semiconductor layer through the third opening.

IPC Classes  ?

• H10D 86/60 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
• H10D 86/01 - Manufacture or treatment
• H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs

Abstract

An electronic device comprises a panel, an optical layer and a light module. The optical structure layer is disposed on the panel, and comprises a plurality of silicon dioxide particles. The light module is configured to provide light to the panel, and a viewing angle corresponding to half of intensity of the light is greater than 40 degrees and less than 70 degrees. A glossiness of the electronic device is less than 5 GU, and a reflectivity of specular component included of the electronic device is less than 3%.

IPC Classes  ?

• G02B 1/11 - Anti-reflection coatings
• G02B 1/14 - Protective coatings, e.g. hard coatings
• G02B 5/30 - Polarising elements

Abstract

An electronic device includes: a backlight module including: a light guide plate; a plurality of light sources disposed adjacent to a light incident side of the light guide plate and arranged along a first direction; a first optical element disposed on the light guide plate and having a plurality of first prism structures, wherein at least one of the plurality of first prism structures extends along the first direction, and the plurality of the prism structures face the light guide plate.

IPC Classes  ?

• F21V 8/00 - Use of light guides, e.g. fibre optic devices, in lighting devices or systems

Abstract

An electronic device includes a first substrate, a circuit layer, at least one electronic unit, a second substrate, a reflective layer and an optical layer. The circuit layer is disposed on the first substrate. The electronic unit is disposed above the first substrate and electrically connected to the circuit layer. The second substrate is disposed opposite to the first substrate and includes at least one light transmission area and at least one light reflection area. The light transmission area is located next to the light reflection area, and the light transmission area is arranged corresponding to the electronic unit. The reflective layer is disposed at one side of the second substrate close to the first substrate, and is located corresponding to the light reflection area. The optical layer is disposed between the second substrate and the electronic unit, and is located at least corresponding to the light transmission area.

IPC Classes  ?

• H10H 29/856 - Reflecting means
• H10H 29/45 - Active-matrix LED displays comprising two substrates, each having active devices thereon, e.g. displays comprising LED arrays and driving circuitry on different substrates
• H10H 29/80 - Constructional details
• H10H 29/85 - Packages
• H10H 29/855 - Optical field-shaping means, e.g. lenses

Abstract

An electronic device includes a substrate, and a plurality of sub-pixels, a plurality of thin film transistors, and at least one data line, all of which are disposed on the substrate. The sub-pixels are arranged along a first direction and a second direction different from the first direction. One of the sub-pixels is coupled to at least one of the thin film transistors and has a first width in the first direction and a second width in the second direction. The data line extends along the second direction, is electrically coupled to the thin film transistor, and has a curved portion. The thin film transistor includes a gate and a semiconductor layer, a portion of the semiconductor layer overlapped with the gate is defined as a first channel region, and the second width is at least twice a length of the first channel region in the second direction.

IPC Classes  ?

• H10K 59/35 - Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
• H10K 59/121 - Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
• H10K 59/131 - Interconnections, e.g. wiring lines or terminals

Abstract

An electronic circuit is provided. The electronic circuit includes a first transistor, a second transistor, a first compensation transistor, and a second compensation transistor. The first compensation transistor includes a first terminal, a second terminal, and a third terminal. The first terminal of the first compensation transistor is coupled to the second terminal of the first compensation transistor and a first connection node between the first transistor and the second transistor. The third terminal of the first compensation transistor receives one of a scan signal and a reset signal. The second compensation transistor includes a first terminal, a second terminal, and a third terminal. The second terminal of the second compensation transistor is coupled to the first connection node. The third terminal of the second compensation transistor receives a reference low voltage signal.

IPC Classes  ?

• G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
• G09G 3/3225 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix

Abstract

An optical substrate and a manufacturing method thereof are provided. The optical substrate includes a base layer, a bank layer, a wavelength conversion unit, and a first encapsulating layer. The bank layer is disposed on the base layer and includes a first bank portion separated from an edge of the base layer. The wavelength conversion unit is disposed on the base layer and is adjacent to a side of the first bank portion away from the edge. The first encapsulating layer is disposed on the bank layer, the wavelength conversion unit, and a portion of the base layer not covered by the bank layer and the wavelength conversion unit. In the optical substrate and the manufacturing method thereof provided by the embodiments of the disclosure, infiltration of water vapor may be reduced or reliability may be improved.

IPC Classes  ?

• H10H 20/851 - Wavelength conversion means
• H10H 20/01 - Manufacture or treatment
• H10H 20/84 - Coatings, e.g. passivation layers or antireflective coatings
• H10H 20/853 - Encapsulations characterised by their shape
• H10W 90/00 -

Abstract

An electronic device includes an electronic unit, an integrated circuit, a first transistor and a second transistor. The integrated circuit is used to provide a sweep signal. The first transistor includes a first semiconductor, a first terminal electrically connected to a power source, a second terminal electrically connected to the electronic unit, and a first control terminal. The second transistor includes a second semiconductor, a third terminal configured to receive the sweep signal, a fourth terminal electrically connected to the first control terminal of the first transistor, and a second control terminal configured to receive a switch signal. The first transistor has a first channel width-to-length ratio, the second transistor has a second channel width-to-length ratio, of the first channel width-to-length ratio to the second channel width-to-length ratio is greater than or equal to 0.03 and less than or equal to 80.5.

IPC Classes  ?

• H10D 86/60 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
• G09G 3/20 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix
• G09G 3/32 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
• H10D 86/40 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
• H10H 29/32 - Active-matrix LED displays characterised by the geometry or arrangement of elements within a subpixel, e.g. arrangement of the transistor within its RGB subpixel

Abstract

A method for manufacturing an electronic device includes steps as follows. A substrate is provided. A first mask is provided on a first surface of the substrate. The first mask is patterned to form a first opening in the first mask, and the first opening exposes a corresponding portion of the substrate. A light source including a first energy is provided to the corresponding portion of the substrate to perform a first modification step, so as to form a first modified region in the substrate. Another light source including a second energy is provided to the corresponding portion of the substrate to perform a second modification step, so as to form a second modified region in the substrate. The second modified region at least partially overlaps the first modified region.

IPC Classes  ?

• H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/498 - Leads on insulating substrates
• H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

Abstract

An electronic device includes: a substrate; a scan line disposed on the substrate and used to output a first signal; a first data line disposed on the substrate and intersecting with the scan line, wherein the first data line is used to output a second signal; a first sub-pixel disposed on the substrate and receiving the first signal and the second signal; and a second sub-pixel disposed on the substrate and receiving the first signal and the second signal, wherein a color of the first sub-pixel is the same as a color of the second sub-pixel.

IPC Classes  ?

• H10H 29/49 - Interconnections, e.g. wiring lines or terminals
• H10H 29/34 - Active-matrix LED displays characterised by the geometry or arrangement of subpixels within a pixel, e.g. relative disposition of the RGB subpixels
• H10K 59/131 - Interconnections, e.g. wiring lines or terminals
• H10K 59/35 - Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels

Abstract

An electronic device including a first substrate, a second substrate, a display medium layer, a color filter layer, and a viewing-angle barrier layer is provided. The second substrate is disposed opposite to the first substrate and includes a first surface facing the first substrate and a second surface facing away from the first substrate. The display medium layer is disposed between the first substrate and the second substrate. The color filter layer is disposed between the display medium layer and the second substrate. The viewing-angle barrier layer contacts one of the first surface and the second surface. In a normal direction of the first surface, a thickness of the second substrate is less than a thickness of the first substrate.

IPC Classes  ?

• G02F 1/1335 - Structural association of cells with optical devices, e.g. polarisers or reflectors
• H10H 29/85 - Packages
• H10K 59/38 - Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]

Abstract

A light-emitting device is provided. The light-emitting device includes a display panel including a substrate and a plurality of scan lines disposed on the substrate and extending in a first direction, a backlight module disposed under the display panel, and an optical film disposed above the backlight module and including a plurality of light-blocking portions and a plurality of light-transmission portions which are arranged alternately. The light blocking portions extend in a second direction, and the first direction and the second direction are not parallel.

IPC Classes  ?

• G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
• G09G 3/34 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix by control of light from an independent source
• H10K 59/50 - OLEDs integrated with light modulating elements, e.g. with electrochromic elements, photochromic elements or liquid crystal elements

Abstract

An electronic device includes a display unit, a foldable region, a touch unit, and a line. The display unit includes a substrate. The display unit is foldable and has a folding axis. The foldable region is capable of being folded along the folding axis and is overlapped with the substrate. The touch unit is disposed on the display unit. The line is electrically connected to the touch unit and is at least partially located within the foldable region. The line includes a plurality of curve shapes defining an edge of the line in a top view direction of the electronic device.

IPC Classes  ?

• G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• G06V 40/13 - Sensors therefor
• G06F 3/044 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means

Abstract

An electronic device is provided. The electronic device includes a substrate, a thin-film transistor layer, a first passivation layer, an organic layer, a metal layer, and a light-emitting element. The thin-film transistor layer is disposed on the substrate. The first passivation layer is disposed on the thin-film transistor layer, and includes an opening or a recess. The organic layer is disposed on the first passivation layer. The organic layer includes a first portion and a second portion separated from the first portion by a space. The metal layer is disposed on the thin-film transistor layer, and the metal layer corresponds to the opening or the recess and the space. The light-emitting element is in contact with the metal layer. The metal layer is in direct contact with the first passivation layer. In a cross-sectional view, the organic layer and the metal layer do not overlap.

IPC Classes  ?

• H10D 30/67 - Thin-film transistors [TFT]
• H10D 30/01 - Manufacture or treatment

Abstract

An electronic device is provided. The substrate includes an active area and a peripheral area surrounding the active area. The first signal transmission signal line and the control signal line are disposed in the peripheral area. The first common voltage lines are disposed in the active area. The first switch components are coupled between the first common voltage lines and the first signal transmission line. In a display mode, the circuit board provides a first voltage to the first switch components through the control line, and the first common voltage lines are coupled to the first signal transmission line. In a sensing mode, the driving chip provides a sensing signal to the first common voltage lines, the circuit board provides a second voltage to the first switch components through the control line, and the first common voltage lines are not coupled to the first signal transmission line.

IPC Classes  ?

• G09G 3/00 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
• G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer

Abstract

A display device includes a backlight module, a light adjustment unit disposed on the backlight module, and a display unit disposed on the light adjustment unit, The light adjustment unit includes a first substrate, a second substrate disposed corresponding to the first substrate, a liquid crystal layer disposed between the first substrate and the second substrate, and a first electrode layer disposed between the first substrate and the liquid crystal layer and including multiple first patterns. Each first pattern has a first width, and two adjacent first patterns of the multiple first patterns have a first distance. A ratio of the first width to the first distance is greater than or equal to 0.5 and smaller than or equal to 7.5, and a phase retardation of the liquid crystal layer is greater than or equal to 500 nm and smaller than or equal to 2700 nm.

IPC Classes  ?

• G02F 1/1343 - Electrodes
• G02F 1/13 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
• G02F 1/1337 - Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers

Abstract

An electronic device including a substrate, at least two adjacent gate lines, at least two adjacent data lines, a semiconductor layer and a metal layer is provided. The at least two adjacent gate lines are disposed on the substrate, and extend along a first direction. The at least two adjacent data lines are disposed on the substrate, and are intersected with the at least two adjacent gate lines. The semiconductor layer is disposed on the substrate. The metal layer is disposed between the substrate and the semiconductor layer, wherein the metal layer is overlapped with the at least two adjacent data lines and the at least two adjacent gate lines.

IPC Classes  ?

• G02F 1/1362 - Active matrix addressed cells
• G02F 1/1333 - Constructional arrangements
• G02F 1/1339 - GasketsSpacersSealing of cells
• G02F 1/1368 - Active matrix addressed cells in which the switching element is a three-electrode device

Abstract

An electronic device includes: a back plate; a support module disposed on the back plate; and an adhesive layer disposed between the back plate and the support module, wherein the support module includes a base and a support unit disposed on the base, and the base is fixed to the back plate by the adhesive layer; wherein the base includes a side surface and a bottom surface adjacent to the back plate, the side surface includes a first curved and a second curved, and a curvature of the first curved is different from a curvature of the second curved; wherein the bottom surface includes two parts with different widths.

IPC Classes  ?

• G02F 1/13357 - Illuminating devices

Abstract

An electronic device and a manufacturing method thereof are disclosed. The manufacturing method of the electronic device includes: providing a substrate; performing a hole-forming process on the substrate to form a through hole in the substrate; performing a first inspection step to the substrate to obtain a first inspection result; and determining whether a condition of the through hole is abnormal based on the first inspection result. A through hole rework process is performed on the substrate when the condition of the through hole is determined to be abnormal, and the through hole rework process includes performing a rework direction determining step to determine whether the substrate needs to be flipped during performing the through hole rework process.

IPC Classes  ?

• H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
• H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

Abstract

An electronic device includes a second substrate disposed relative to a first substrate, a first light-emitting unit disposed between the first substrate and the second substrate, a first microstructure on the first surface of the first light-emitting unit and the first surface away from the first substrate, and an adhesive layer disposed between the second substrate and the first surface of the first light-emitting unit. There is a first gap between the adhesive layer and the first microstructure.

IPC Classes  ?

• H10H 20/855 - Optical field-shaping means, e.g. lenses
• H10H 29/32 - Active-matrix LED displays characterised by the geometry or arrangement of elements within a subpixel, e.g. arrangement of the transistor within its RGB subpixel
• H10H 29/37 - Pixel-defining structures, e.g. banks between the LEDs
• H10H 29/45 - Active-matrix LED displays comprising two substrates, each having active devices thereon, e.g. displays comprising LED arrays and driving circuitry on different substrates
• H10H 29/80 - Constructional details
• H10H 29/85 - Packages
• H10H 29/851 - Wavelength conversion means
• H10H 29/855 - Optical field-shaping means, e.g. lenses

Abstract

An electronic device including a base structure, a first conductive layer, a first insulating layer, a first electronic element, a second insulating layer and a second electronic element is provided. The first conductive layer comprising a first conductive part and a second conductive part is disposed on the base structure. The first insulating layer is disposed on the first conductive layer, and comprises a first hole exposing at least portion of the first conductive part. The second insulating layer comprising a second hole is disposed between the first insulating layer and the first electronic element. The second electronic element is electrically connected to the second conductive part. The first electronic element is electrically connected to the first conductive part through the second hole and the first hole. A first width of the first hole is different from a second width of the second hole.

IPC Classes  ?

• H05K 5/02 - Casings, cabinets or drawers for electric apparatus Details
• G09G 3/00 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
• H05K 5/30 - Side-by-side or stacked arrangements

Abstract

A vehicle and a driving method thereof are provided. The vehicle is configured to provide a first image and a second image with a projection distance respectively to a first position and a second position. The vehicle includes a windshield and a display device. The display device is configured to generate a plurality of first light beams and a plurality of second light beams to be projected on a side of the windshield and to present the first image and the second image on another side of the windshield.

IPC Classes  ?

• G09G 3/00 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
• G02B 3/00 - Simple or compound lenses
• G02B 27/01 - Head-up displays
• G06F 3/01 - Input arrangements or combined input and output arrangements for interaction between user and computer

Abstract

A manufacturing method of an electronic device includes providing a first substrate, wherein the first substrate includes a circuit layer; cutting the first substrate; forming a wire on a first surface which is exposed after cutting the first substrate and on a second surface of the first substrate, wherein the first surface is adjacent to the second surface, and the wire is electrically connected to the circuit layer; disposing an electronic element on the circuit layer; bonding the first substrate after cutting and a second substrate to form an electronic module; and disposing a driving element on the second surface of the first substrate to be electrically connected to the wire.

IPC Classes  ?

• H10H 20/01 - Manufacture or treatment
• H10H 29/01 - Manufacture or treatment
• H10H 29/02 - Manufacture or treatment using pick-and-place processes
• H10H 29/45 - Active-matrix LED displays comprising two substrates, each having active devices thereon, e.g. displays comprising LED arrays and driving circuitry on different substrates
• H10H 29/49 - Interconnections, e.g. wiring lines or terminals

Abstract

An electronic device is provided. The electronic device includes a flexible panel, a supporting sheet disposed under the flexible panel, and a heat sink disposed under the supporting sheet. The flexible panel has a foldable region and a non-foldable region. The supporting sheet includes a foldable portion overlapping the foldable region, and the foldable portion includes a plurality of strip parts and a plurality of edge parts. Each of the edge parts is connected to an end of at least two of the strip parts, and in a top view, a top end of the edge parts is not aligned with a top end of at least one portion of the non-foldable region. The heat sink includes a gap and a separation portion adjacent to the gap, and in the non-folded state, one of the edge parts overlaps the gap of the heat sink.

IPC Classes  ?

• G06F 1/183 -
• G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements

Abstract

An electronic device includes a substrate, a light-emitting unit, a first diffusion element, a first prism film, a second prism film and a protecting layer. The light-emitting unit is disposed on the substrate. The first diffusion element is disposed on the light-emitting unit. The first prism film is disposed on the first diffusion element. The second prism film is disposed between the first prism film and the first diffusion element. The protecting layer is disposed on the substrate and covers an upper surface of the light-emitting unit. The protecting layer contacts the first diffusion element.

IPC Classes  ?

• G02B 5/02 - Diffusing elementsAfocal elements

Abstract

An electronic device is proposed. The electronic device includes a first transistor, a second transistor, a third transistor, a fourth transistor, a first capacitor, a second capacitor, and a tunable component. The second transistor is coupled to the control terminal of the first transistor. The first capacitor is coupled between the first terminal of the first transistor and the second transistor. The second capacitor is coupled between the control terminal of the first transistor and the second transistor. The first capacitor and the second capacitor are connected in series between the first terminal and the control terminal of the first transistor. The third transistor is coupled to a first node between the second capacitor and the control terminal of the first transistor, and configured to receive a first voltage. The fourth transistor is coupled to a second node between the second capacitor and the second transistor.

IPC Classes  ?

• G09G 3/3233 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element
• G09G 3/3266 - Details of drivers for scan electrodes
• G09G 3/3291 - Details of drivers for data electrodes in which the data driver supplies a variable data voltage for setting the current through, or the voltage across, the light-emitting elements