Abstract

A wire guide device for a laser processing head for deposition welding by a laser beam has a plurality of guide parts arranged in succession to guide a welding wire. Two of the guide parts are movably coupled to each other by a coupling element. A second guide part of the two guide parts is displaceable and/or tiltable relative to a first guide part of the two guide parts.

IPC Classes  ?

• B23K 26/342 - Build-up welding

Goods & Services

Metalworking machines; laser cutting head with (or without) remote control (machine parts); laser head for metal and other surface treatment (machine parts); cutting heads, welding heads (machine parts), with (or without) programmable laser welding head (machine parts); process control instruments [mechanical]; system control instruments (mechanical -); computerised laser cutting machines and laser cutting heads for material treatment; optical beam deflectors, deflectors for laser beams and laser streams (parts of machines), with (or without) programmable laser welding heads (parts of machines); system control instruments (mechanical -). Electrical regulating apparatus; electronic control devices; laser lens; sensors; sensors for laser-cutting heads having remote control, measuring devices and apparatus; electronic measuring instruments, mechanical measuring instruments; sensors used to monitor, adjust and control the operation of machine tools (including laser machine tools); computer software, recorded; recorded or downloadable computer software platform; downloadable computer application software; downloadable mobile phone application software (downloadable software applications for mobile phones); computer programs, downloadable; software for controlling computerised laser cutting machines and laser cutting heads for material treatment.

Abstract

The present disclosure specifies a method for cutting a workpiece, comprising: forming a perforation by directing the laser beam onto the workpiece, wherein the forming of the perforation comprises multiple perforation steps, wherein a starting value and an end value are defined for each one of multiple processing parameters for each one of the multiple perforation steps, wherein, in at least one of the perforation steps, for multiple processing parameters the end value and the starting value differ and the multiple processing parameters are modified by using a transition function, defined for a respective processing parameter, to bring this processing parameter from the respective starting value to the respective end value during a transition period, defined for this processing parameter, within the perforation step, wherein the transition function is strictly monotonically decreasing or strictly monotonically increasing, and wherein the transition periods of the multiple processing parameters overlap. An apparatus designed for carrying out the method is also specified.

IPC Classes  ?

• B23K 26/0622 - Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
• B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
• B23K 26/142 - Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beamNozzles therefor for the removal of by-products
• B23K 26/38 - Removing material by boring or cutting

Abstract

A method for analysing a laser machining process includes the steps of: detecting a plurality of spectra of process emissions at successive points in time; generating at least one spectrogram on the basis of the detected spectra; and determining at least one prediction value of a physical quantity and/or determining at least one classification of the laser machining process by means of a trained neural network, wherein the neural network receives the spectrogram as input tensor and outputs the physical quantity and/or the classification of the laser machining process as output tensor.

IPC Classes  ?

• B23K 26/70 - Auxiliary operations or equipment
• B23K 26/38 - Removing material by boring or cutting

Abstract

A method for laser welding a first and an at least partially overlapping second workpiece sheet along a machining path includes: detecting a distance from a reference to the first and to the second sheet at a plurality of positions; determining a gap width between the sheets based on the distances; and welding together the sheets by radiating the beam along the path and forming a weld seam. The laser beam power is adapted to the respective gap width along the path. A laser machining system for welding sheets using a machining laser beam includes: a distance measuring device detecting a distance to a first and second sheet at a plurality of positions; deflection optics guiding the beam along a machining path; and a control device determining a gap width between the sheets based on the distances. The control device adapts the laser beam power to the respective gap width.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
• B23K 26/244 - Overlap seam welding
• B23K 101/36 - Electric or electronic devices

Abstract

A method for calibrating a laser machining system includes a scanner device for deflecting a laser beam to a plurality of positions on a surface and includes an observation device, an observation beam path of which runs coaxially to the laser beam path over the scanner device. The method includes calibrating the scanner device and calibrating the observation device. A laser machining system for machining a workpiece by means of a laser beam with a control configured to carry out said method is also provided.

IPC Classes  ?

• B23K 26/04 - Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

Goods & Services

Machines, parts of machines, for use in the following fields: metalworking, woodworking, plastic processing, especially, laser welding heads; process control instruments [mechanical]; laser welding machines; laser deposition welding machines; 3D printers. Electronic, optical and mechanical measuring, control and regulating apparatus, especially laser measuring systems; measuring, detecting, monitoring and controlling devices; sensors for monitoring, adjusting and controlling the operation of machine tools [including laser machine tools]; lasers; image scanning apparatus; cameras [photography]; computer software; recorded or downloadable computer software platform; downloadable software applications.

Abstract

The invention relates to a laser machining head for machining a workpiece by means of a laser machining beam, said laser machining head comprising: a scanning device for directing the laser machining beam onto a plurality of positions on the workpiece; a machining beam optical system for adjusting a focus position of the laser machining beam and for focusing the laser machining beam, the machining beam optical system being arranged between an entry port for the laser machining beam and the scanning device; a sensor assembly for detecting process light using at least one sensor; a decoupling optical system for decoupling process light to the sensor assembly, the decoupling optical system being arranged between the machining beam optical system and the scanning device; and a process light optical system for adjusting a focus position of the process light with respect to the sensor, the process light optical system being arranged between the decoupling optical system and the sensor assembly and comprising a variable lens with an adjustable focal length.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/046 - Automatically focusing the laser beam
• B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
• B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

Abstract

An optical coherence tomography device for a laser machining system for measuring distance to an object in a predetermined distance range comprises: a measuring arm for directing a measuring light beam at the object; a reference arm for guiding a reference beam with a plurality of reference sections having different measuring ranges; and a controllable switching element for switching between the reference sections of the reference arm. The measuring range of each reference section comprises a negative active measuring range and a positive active measuring range, between which a dead zone is located. The dead zone of one of the reference sections is overlapped by a positive or negative active measuring range of at least one other reference section. The positive and negative active measuring ranges of the reference sections together cover the predetermined distance range.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/38 - Removing material by boring or cutting

Abstract

A device for laser deposition welding includes: a laser machining head for radiating a laser beam; a distance measuring device for measuring a distance using a measuring beam; a scanning device for deflecting the measuring beam; a coupling device for coupling the beam path of the measuring beam into the beam path of the laser beam, said coupling device being arranged after the scanning device in the beam path of the measuring beam; a feed device for coaxially feeding a deposition material; and a first and second reflector arranged in a common beam path of the laser beam and the measuring beam on a common central axis. The first reflector is configured to reflect the laser beam and the measuring beam outwards onto the second reflector at an angle with the central axis, and wherein the second reflector is configured to reflect the laser beam toward a machining area.

IPC Classes  ?

• B23K 26/342 - Build-up welding
• B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
• B33Y 30/00 - Apparatus for additive manufacturingDetails thereof or accessories therefor
• B33Y 50/02 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes

Abstract

A method for monitoring a laser processing system is specified. The method comprises the steps of: acquiring, in a monitoring period, measured values of a measured variable of the laser processing process; comparing the measured values with value ranges of the measured variable of a plurality of process levels; determining whether the measured values lie in one of the value ranges of the process levels; and, if the measured values lie in one of the value ranges of the process levels, setting the process level, in the value range of which the measured values lie, for monitoring the process.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/70 - Auxiliary operations or equipment
• G05B 19/048 - MonitoringSafety
• B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials

Abstract

The invention relates to a laser working system. The laser working system comprises: a laser working head having at least one temperature sensor; and a control device having a model. The temperature sensor is designed to measure a temperature at a first point on the laser working head in order to ascertain a temperature measurement value. The control device is designed to determine a first temperature at the first point on the laser working head using the model, in order to ascertain a first model temperature value, to compare the temperature measurement value with the first model temperature value, and to initiate and/or carry out an action on the basis of the comparison.

IPC Classes  ?

• B23K 26/70 - Auxiliary operations or equipment
• B23K 31/00 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups
• B23Q 15/16 - Compensation for wear of the tool
• B23Q 23/00 - Arrangements for compensating for irregularities or wear, e.g. of ways, of setting mechanisms

Goods & Services

Machines, parts of machines, for use in the following fields: metalworking, woodworking, plastic processing, especially, laser welding heads; process control instruments [mechanical]; laser welding machines; laser deposition welding machines; 3D printers. Electronic, optical and mechanical measuring, control and regulating apparatus, especially laser measuring systems; measuring, detecting, monitoring and controlling devices; sensors for monitoring, adjusting and controlling the operation of machine tools [including laser machine tools]; lasers; image scanning apparatus; cameras [photography]; computer software; recorded or downloadable computer software platform; downloadable software applications.

Goods & Services

electronic measuring instruments, mechanical measuring instruments; Recorded or downloadable computer software platform; Downloadable mobile phone application software (downloadable software applications for mobile phones).

Abstract

A method and laser processing system for the laser processing of a workpiece by means of a laser beam, the method comprising: recording (S10) an image (32) of the workpiece (2) with a camera (60), the beam path of which is coupled coaxially into a beam path of the laser beam (4) and runs together with the beam path of the laser beam (4) over a scanning device (80); determining (S30) one contour point (34) for each measurement line (31) of a multiplicity of measurement lines (31) which are placed in the recorded image (32) by an anticipated contour profile (33) of the workpiece (2); determining (S40) an actual contour profile (36) of the workpiece (2) on the basis of the determined contour points (34); and activating (S50) the scanning device (80) for positioning the laser beam (4) for the laser processing on the basis of the actual contour profile (36).

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/035 - Aligning the laser beam
• B23K 26/044 - Seam tracking
• B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

Abstract

A method and a laser processing system are for laser processing a workpiece by a laser beam. The method includes: recording an image of the workpiece with a camera, the beam path of which is coaxially coupled into a beam path of the laser beam and runs together with the beam path of the laser beam via a scanning device; determining a respective contour point for each measuring line of a plurality of measuring lines which are laid through an expected contour path of the workpiece in the recorded image; determining an actual contour path of the workpiece based on the determined contour points; and controlling the scanning device for positioning the laser beam for laser processing based on the actual contour path.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
• G06T 7/564 - Depth or shape recovery from multiple images from contours

Abstract

The invention relates to a method for carrying out laser processing processes at a multiplicity of different processing positions by means of a laser beam, wherein the method comprises the following steps: capturing an image of the multiplicity of processing positions with a camera, identifying each of the processing positions of a first group, which comprises at least two of the multiplicity of processing positions, by processing the image, and carrying out the laser processing process at each of the identified processing positions of the first group by means of the laser beam.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
• B23K 26/22 - Spot welding
• B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials
• G01B 11/24 - Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
• G06T 7/50 - Depth or shape recovery
• H02K 15/00 - Processes or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
• B23K 101/38 - Conductors
• B23K 103/12 - Copper or alloys thereof

Abstract

A method for monitoring a laser welding process includes the steps of: performing the laser welding process by irradiating a laser beam onto at least one work piece to form a weld joint, wherein the laser beam is guided along a processing path by a deflection device, detecting sensor data by at least two sensors during the laser welding process, and determining whether the weld joint has a defect based on the detected sensor data and at least one processing parameter of the laser welding process. An associated laser welding system is also provided.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/21 - Bonding by welding

Abstract

A method for monitoring a laser machining process for machining workpieces includes: for a plurality of machining steps, detecting a measurement signal for at least one measurement variable during a machining step; in a setting phase, defining a limit value for at least one monitoring parameter based on the measurement signals detected during the setting phase; and in a monitoring phase, determining a monitoring parameter value for each machining step based on the measurement signal, comparing the monitoring parameter value with the limit value to identify a faulty machining step, and determining whether a process change condition is met based on the measurement signal of at least one machining step. After a predefined setting time interval or number of machining steps during the setting phase, switching from the setting to monitoring phase, and switching back from the monitoring to setting phase when the process change condition is met.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials

Goods & Services

machines, Parts of machines, for use in the following fields: Metalworking, Woodworking, Plastic processing, especially, Laser welding heads; Process control instruments [mechanical]; Laser welding machines; Laser deposition welding machines; 3D printers. Electronic, optical and mechanical measuring, control and regulating apparatus, Especially Laser measuring systems; Measuring, detecting, monitoring and controlling devices; Sensors for monitoring, adjusting and controlling the operation of machine tools [including laser machine tools]; Lasers; Image scanning apparatus; Cameras [photography]; Computer software; Recorded or downloadable computer software platform; Downloadable software applications.

Goods & Services

Sensors for measuring instruments and devices; Electronic measuring instruments, mechanical measuring instruments; Recorded or downloadable computer software platform; Downloadable mobile phone application software (downloadable software applications for mobile phones); All the aforesaid for use in connection with laser-cutting machines.

Abstract

The invention relates to a laser processing head comprising a housing (2) in which at least one optical unit (9) is arranged for directing the laser beam (3) onto a processing point (5) on the workpiece (4); at least one frequency-modulated and/or amplitude-modulated continuous wave lidar sensor (11) for detecting the distance to at least one point on the workpiece (4), wherein the lidar system (11) comprises an emitter (11a) and a detector (11b); and a controller (100) for monitoring and/or controlling and/or regulating the processing process on the basis of the detected distance. The invention also relates to a corresponding method for carrying out a laser processing process.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/044 - Seam tracking
• B23K 26/08 - Devices involving relative movement between laser beam and workpiece
• B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
• B23K 26/70 - Auxiliary operations or equipment
• B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials
• B23K 26/04 - Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
• B23K 26/046 - Automatically focusing the laser beam
• B23K 26/0622 - Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
• B23K 26/21 - Bonding by welding
• B23K 26/38 - Removing material by boring or cutting

Abstract

The present invention relates to a laser machining head (1) for machining a workpiece (4) by means of a laser beam (3), comprising: a housing (2) in which focusing optics (9) are arranged for focusing the laser beam (3); and at least one lidar sensor (11, 12, 13) for detecting a distance between the laser machining head (1) and an object in a process space; wherein the lidar sensor (11, 12, 13) is attached to the outside of the housing (2) and a beam path of the lidar sensor (11, 12, 13) extends outside the housing (2).

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/04 - Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
• B23K 26/044 - Seam tracking
• B23K 26/08 - Devices involving relative movement between laser beam and workpiece
• B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
• B23K 26/21 - Bonding by welding
• B23K 26/38 - Removing material by boring or cutting
• B23K 26/70 - Auxiliary operations or equipment
• B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials

Abstract

A method for optimizing a machining time of a laser machining process includes: specifying a machining path of the laser machining process on the workpiece, said machining path having a plurality of machining path sections, specifying at least one boundary condition for at least one of the machining path sections; and determining control data for the laser machining process of the machining path taking into account the at least one boundary condition such that a machining time of the laser machining process is minimal. Furthermore, a method for performing a laser machining process on a workpiece includes such a method and a laser machining system is configured to perform the methods.

IPC Classes  ?

• B23K 9/127 - Means for tracking lines during arc welding or cutting

Abstract

A laser working system for performing a working process on a workpiece with a laser beam includes: a laser working head for radiating a laser beam into a working region on the workpiece; and a sensor unit for monitoring the working process, the sensor unit having at least one hyperspectral sensor. The sensor unit is designed to capture a hyperspectral image of a region of the workpiece, the hyperspectral image having N times M pixels. The hyperspectral image has two spatial dimensions x and y and a spectral dimension λ. N indicates the number of pixels in the first spatial dimension x, M indicates the number of pixels in the second spatial dimension y, and L indicates the number of spectral bands in the spectral dimension λ. M, N and L are natural numbers. A method for monitoring a working process is also provided.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• G06T 7/00 - Image analysis
• G06V 10/143 - Sensing or illuminating at different wavelengths
• G06V 10/147 - Details of sensors, e.g. sensor lenses
• G06V 10/82 - Arrangements for image or video recognition or understanding using pattern recognition or machine learning using neural networks
• G06V 20/10 - Terrestrial scenes
• G06V 20/52 - Surveillance or monitoring of activities, e.g. for recognising suspicious objects

Abstract

A laser machining head for material processing with a laser includes: a focusing optics for focusing the laser beam; an exit opening for the laser beam; an optical sensor arrangement; a coupling optics for coupling light entering through the exit opening out of the beam path of the laser beam to the sensor arrangement; an optics for adjusting a focal position of the laser beam, which has at least one adjustable optical element for adjusting the focal position of the laser beam; and a compensating optics for correcting a chromatic aberration, caused by the focusing optics, of the light coupled out to the sensor arrangement. The compensating optics are arranged between the coupling optics and the sensor arrangement and are arranged for adjusting a focal position of the light coupled out to the sensor arrangement.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
• B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

Abstract

The present invention relates to a method for monitoring the condition of a laser machining head, said method comprising the steps of: detecting current measurement data by means of at least one sensor unit arranged within the laser machining head, determining an input vector based on the acquired current measurement data; and determining an output vector by applying a model trained by machine learning to the input vector, said output vector containing estimated current condition data of at least two elements of the laser machining head.

IPC Classes  ?

• B23K 31/00 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups
• B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials
• B23K 26/70 - Auxiliary operations or equipment

Abstract

A laser machining head for machining a workpiece by means of a laser beam, includes: a scanning device for directing the laser beam at a plurality of positions on a workpiece surface; an image acquisition device for acquiring an image of the workpiece surface, said image acquisition device including an objective with a lens having an adjustable focal length; and a control configured to adjust a focal length of the lens based on a measurement value.

IPC Classes  ?

• B23K 26/04 - Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

Abstract

A laser machining head for machining a workpiece by a laser beam includes: a scanning device for deflecting the laser beam on the workpiece; a housing in which the scanning device is arranged; and at least one overheat protection device configured to protect the housing from overheating, said overheat protection device comprising an energy distribution device for distributing incident radiation energy and/or a heat sink for dissipating heat.

IPC Classes  ?

• B23K 37/00 - Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
• B23K 26/70 - Auxiliary operations or equipment
• B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

Abstract

The invention relates to a laser processing head (1) comprising a two-phase closed heat exchanger (200) for cooling a component of the laser processing head (1) by phase change of a working fluid (150, 152) of the heat exchanger (100).

IPC Classes  ?

• B23K 26/70 - Auxiliary operations or equipment
• B23K 37/00 - Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass

Abstract

The invention relates to a method for determining a quality characteristic of a welded connection (2) between two conductor ends (1), in particular between two conductor ends of hairpin elements of an electric machine, wherein, for a number of pixels of a capturing region that includes the conductor ends (1), intensity information relating to the pixels and depth information relating to the pixels are captured, and wherein a quality characteristic, in particular an attachment surface area or a pore volume, is determined on the basis of the captured intensity information and depth information. The invention also relates to a method for providing a training data record, to a training data record, to a method for welding conductor ends and to a device for determining a quality characteristic of a welded connection.

IPC Classes  ?

• G06T 7/00 - Image analysis

Abstract

The invention relates to a deflection device (30) for a laser machining head (1), which device is intended for generating a parallel offset (d, dx, dy) of a machining laser beam (6) and comprises: at least one plate (30a), wherein the plate (30a) can be tilted about at least one axis (30d) parallel to the plate plane (30b); and an actuator for tilting the plate (30a), wherein a tilt angle (θ) of the plate (30a) about the axis (30d) is limited to at most 30°.

IPC Classes  ?

• B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
• B23K 26/20 - Bonding
• B23K 26/36 - Removing material

Abstract

A method for determining a position of a workpiece for a laser machining process includes the steps of: radiating a measurement beam to at least one workpiece and a support device surrounding the workpiece along at least one first and along at least one second measurement path, the first path forming a predetermined angle with the second path; acquiring a portion of the radiated measurement beam, reflected by the support device and the workpiece, along the first and along the second measurement path and generating a corresponding measurement signal, the support device and the workpiece comprising a reflectivity different from each other; and determining a position of the workpiece based on the measurement signal. A method for machining a workpiece by a laser beam includes the method for determining the position of the workpiece. An apparatus for determining a position of a workpiece is configured for conducting the methods.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/24 - Seam welding

Abstract

The present disclosure relates to a laser machining head for material machining by means of a laser beam, comprising: a housing which surrounds an optical chamber; a drive which is arranged outside the optical chamber and comprises a motor and a first slide with a first magnet element; an optical mount with an optical unit, wherein the optical mount is arranged movably with the optical unit in the optical chamber and comprises a second magnet element, wherein the first slide is coupled to the optical mount by a magnetic force fit between the first magnet element and the second magnet element so that a movement of the first slide causes a movement of the optical mount.

IPC Classes  ?

• B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
• B23K 26/70 - Auxiliary operations or equipment
• B23K 26/00 - Working by laser beam, e.g. welding, cutting or boring
• G02B 7/00 - Mountings, adjusting means, or light-tight connections, for optical elements

Abstract

A method for analyzing a workpiece surface for a laser machining process includes radiating a light line of light of a first wavelength range into a workpiece surface area and illuminating the area with light of at least one second wavelength range. Further, capturing an image of the workpiece surface area by a sensor device including an image sensor and imaging optics, the optics having different refractive indices for the first and second wavelength ranges. A first plane is defined by the light line and a light exit point. The optics and image sensor are arranged in a Scheimpflug arrangement. Further, evaluating the image to analyze workpiece surface features based on a predetermined offset between the first plane and a second plane for which the light of the second wavelength range from the optics is sharply imaged on the image sensor sensor plane. An analysis device carries out the method.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/044 - Seam tracking
• B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials

Abstract

The invention relates to a laser-machining head, comprising: at least one deflection mirror (12a) for deflecting the laser beam onto a target position within a machining field (14); a camera (20), the observation beam path of which is coaxially coupled into the laser-beam path; and an illumination device (100) for illuminating a component (30) in the machining field (14), wherein the illumination device comprises a plurality of illumination portions (130) which are arranged at various height regions and/or are arranged in various azimuth angle regions separated by gaps (132) between the illumination portions (130) in question, wherein the illumination portions (130) each comprise a plurality of light sources (120) for emitting light directly towards the machining field (14). The invention also relates to a laser-machining system comprising the laser-machining head (10) and a control device (200), which is designed to control the camera (20) for taking at least one image of a component (30), to determine a machining path on the basis of the image taken, and to carry out machining of the component (30) by the laser-machining head (10) according to the machining path.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/70 - Auxiliary operations or equipment
• G01N 21/88 - Investigating the presence of flaws, defects or contamination

Abstract

The invention relates to a process-monitoring module (1) for monitoring a laser-machining process, said process-monitoring module comprising: a sensor unit (2) with at least one photodiode for detecting process radiation in a specified wavelength range and generating a corresponding intensity signal; a computing unit (3) which is designed to monitor a laser machining process on the basis of an analysis of the intensity signal; and a housing (X), wherein the sensor unit (2) and the computing unit (3) are arranged in the housing (X).

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials

Abstract

A method for analyzing a laser machining process for machining workpieces includes the steps of acquiring at least one sensor data set for the laser machining process and determining a value of at least one physical property of a machining result of the laser machining process based on the at least one sensor data set using a transfer function. The transfer function is formed by a trained neural network. A system for analyzing a laser machining process and a laser machining system including such a system are also disclosed.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• G05B 19/406 - Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by monitoring or safety
• G06N 3/08 - Learning methods

Abstract

A deflection device for a laser machining head for deflecting a machining laser beam for machining a workpiece includes at least one mirror element which is deformable and/or is movably arranged in order to direct the machining laser beam to different positions on the workpiece. The mirror element includes at least one substrate and at least one reflective multilayer structure which is arranged on the substrate and in which a plurality of crystalline first layers having first refractive indices in a first range of values and a plurality of crystalline second layers having second refractive indices in a second range of values are arranged alternately one above the other. The first refractive indices of the crystalline first layers and the second refractive indices of the crystalline second layers are different from each other.

IPC Classes  ?

• G02B 26/10 - Scanning systems
• G02B 1/02 - Optical elements characterised by the material of which they are madeOptical coatings for optical elements made of crystals, e.g. rock-salt, semiconductors

Abstract

A method for piercing a workpiece by means of a laser beam includes radiating a pulsed laser beam onto a workpiece to form a piercing breakthrough, wherein a radiated mean pulse power (Pmittel) of the pulsed laser beam is reduced during piercing.

IPC Classes  ?

• B23K 26/0622 - Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
• B23K 26/382 - Removing material by boring or cutting by boring

Abstract

The present disclosure relates to a method for laser welding a first workpiece sheet and a second workpiece sheet at least partially overlapping the first workpiece sheet, along a processing path by means of a processing laser beam, comprising the steps of: detecting a distance from a reference to the first workpiece sheet and to the second workpiece sheet at a plurality of positions; determining a gap width of a gap between the first workpiece sheet and the second workpiece sheet on the basis of the detected distances; and welding the two workpiece sheets by irradiating the processing laser beam along the processing path and forming a weld seam; wherein a laser power of the processing laser beam is adapted to the respective gap width of the gap along the processing path. The invention further relates to a laser processing system for laser welding a first workpiece sheet and a second workpiece sheet by means of a processing laser beam, comprising: a distance measuring device for detecting a distance to the first workpiece sheet and to the second workpiece sheet at a plurality of positions; deflection optics for guiding the processing laser beam along a processing path; and a control device for determining a gap width of the gap between the first workpiece sheet and the second workpiece sheet on the basis of the detected distances; wherein the control device is designed to adapt a laser power of the processing laser beam to the respective gap width of the gap along the processing path.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/22 - Spot welding
• B23K 26/244 - Overlap seam welding

Abstract

A method for calibrating at least one optical sensor of a laser machining head is provided. The laser machining head comprises a first optical sensor, a deflection device, and a focusing device. A laser beam path of the first optical sensor passes through the deflection device and the focusing device. The method comprises the steps of: deflecting the beam path of the first optical sensor by the deflection device to a first position on a first reference; generating a first optical measurement signal based on measurement light received by the first optical sensor from the first position on the first reference; and determining a correction value for calibrating the first optical sensor based on the first optical measurement signal and according to a deviation of the first position on the first reference from a first target position, which is specified relative to a position of the machining laser beam.

IPC Classes  ?

• G01J 3/02 - SpectrometrySpectrophotometryMonochromatorsMeasuring colours Details
• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/70 - Auxiliary operations or equipment
• G01B 9/02055 - Reduction or prevention of errorsTestingCalibration
• G01J 3/10 - Arrangements of light sources specially adapted for spectrometry or colorimetry

Abstract

A method and a system for monitoring a laser machining process includes the steps of: inputting at least one process signal data set of the laser machining process into an autoencoder formed by a deep neural network; generating a reconstructed process signal data set by means of the autoencoder; determining a reconstruction error based on the at least one process signal data set and the at least one reconstructed process signal data set; and detecting an anomaly of the laser machining process based on the determined reconstruction error. A laser machining method includes the method and a laser machining system includes the system.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials

Abstract

The invention relates to a laser machining head (100), which comprises a housing (110, 120, 130), at least one optical unit (122, 132) for manipulating a laser beam (L), said optical unit being contained in the housing (110, 120, 130), and at least one adhesive trap (111) which is mounted on a surface in the interior of the housing (110, 120, 130) in order to immobilize particles in the interior of the housing (110, 120, 130).

IPC Classes  ?

• B23K 26/14 - Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beamNozzles therefor
• B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
• B23K 26/16 - Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
• B23K 26/21 - Bonding by welding
• B23K 26/36 - Removing material
• B23K 26/70 - Auxiliary operations or equipment

Abstract

A method of analyzing a welded connection during laser welding of workpieces includes acquiring a first measurement signal for a process radiation generated during laser welding, acquiring a second measurement signal for a laser radiation reflected by the workpieces, determining whether there is a gap between the workpieces based on the first measurement signal, and when it is determined that there is a gap, determining based on the second measurement signal whether there is a welded connection.

IPC Classes  ?

• B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials
• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/244 - Overlap seam welding
• H01M 50/516 - Methods for interconnecting adjacent batteries or cells by welding, soldering or brazing

Abstract

Disclosed is a method for analyzing a laser machining process, said method involving the following steps: acquiring a plurality of spectra of process emissions at consecutive points in time; producing at least one spectrogram on the basis of the acquired spectra; and ascertaining at least one predictive value of a physical quantity and/or ascertaining at least one classification of the laser machining process using a trained neural network, the neural network receiving the spectrogram as an input tensor and outputting the physical quantity and/or the classification of the laser machining process as an output tensor.

IPC Classes  ?

• G01N 21/71 - Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light thermally excited
• B23K 26/03 - Observing, e.g. monitoring, the workpiece

Abstract

A system for monitoring a laser machining process on a workpiece is disclosed. The system includes: a neuromorphic image sensor configured to generate image data of the laser machining process, and a computing unit configured to determine input data based on the image data, and to determine output data based on the input data by means of a transfer function, the output data containing information about the laser machining process. Further, a method for monitoring a laser machining process on a workpiece is disclosed.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/21 - Bonding by welding
• B23K 26/38 - Removing material by boring or cutting
• B23K 31/00 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups
• B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials

Abstract

A method of laser machining a workpiece includes the steps of: radiating a laser beam onto at least one workpiece, the laser beam having a core beam and a ring beam extending coaxially with one another, wherein the laser beam is moved over the workpiece along a pre-determined machining path, and adjusting a laser power of the core beam and/or a laser power of the ring beam as a function of a position of the laser beam on the workpiece. An associated laser machining system is also disclosed.

IPC Classes  ?

• B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
• B23K 26/073 - Shaping the laser spot
• B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

Abstract

The invention relates to a laser machining head. The laser machining head has a first housing part, which consists of a semi-finished part and has a first opening, a second opening opposite the first opening and an interior surrounded by an inner face; and at least one optical element that is at least in part arranged in the interior.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
• B23K 26/12 - Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
• B23K 26/21 - Bonding by welding
• B23K 26/38 - Removing material by boring or cutting

Abstract

The invention relates to a method for monitoring a laser welding process, said method comprising the following steps: carrying out the laser welding process by emitting a laser beam onto at least one workpiece to form a welded joint, the laser beam being guided along a processing path by a deflection device; collecting sensor data by at least two sensors during the laser welding process; and determining, on the basis of the collected sensor data and at least one processing parameter of the laser welding process, whether the welded joint has a defect. The invention also relates to an associated laser welding system.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/04 - Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
• B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
• B23K 26/08 - Devices involving relative movement between laser beam and workpiece
• B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials

Abstract

A method for comparing laser machining systems is provided, wherein a laser machining system comprises a laser machining head and a sensor module having at least one photodiode for detecting process radiation, said method comprising: detecting radiation emitted from a light source by means of the photodiode and generating a corresponding intensity signal, wherein the radiation is guided from the light source to the photodiode by at least one optical element in the laser machining head and/or by at least one optical element of the sensor module; aligning the laser machining head and the light source with one another so that the intensity signal assumes a maximum value; and comparing the intensity signal with at least one predetermined reference value. A method for monitoring a laser machining process and an associated laser machining system are also provided.

IPC Classes  ?

• B23K 26/70 - Auxiliary operations or equipment
• B23K 26/04 - Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light

Abstract

A method for determining a depth of a vapor capillary during laser machining includes: irradiating a machining laser beam onto a workpiece to form the capillary, the beam deflected by a first deflection device along a machining path within a first scan field, irradiating an optical measuring beam onto the workpiece, the measuring beam deflected by a second deflection device relative to the machining laser beam along a scanning path within a scanning area and then together with the machining laser beam by the first deflecting device, acquiring measured distance values along the path based on part of the measuring beam reflected by the workpiece, determining a depth/position of the capillary based on the acquired measured distance values. The scanning area size is based on a position of the laser beam and/or deflection of the laser beam by the first deflection device. A corresponding laser machining system is also provided.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
• B23K 26/24 - Seam welding

Goods & Services

Parts of laser welding machines, namely, machines for metalworking, woodworking, plastic processing, especially, laser welding heads; Process control instruments; Laser welding machines

Abstract

An alignment module coupling a sensor unit to a laser machining device for monitoring a laser machining process is provided. The module includes a first coupling device with a first optical input for a process radiation coupled out of the laser machining device and a coupling element for coupling to the machining device; a second coupling device with a first optical output and a coupling element for coupling to the sensor unit; a first adjustment module arranged between the first and second coupling devices and configured to tilt and/or displace the coupling devices with respect to one another; and a focusing optics between the first optical input and the first optical output, which is slidably disposed along the optical axis of the focusing optics. A sensor module monitoring a laser machining process is provided, which includes the alignment module. A laser machining system is also provided, including the sensor module.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/046 - Automatically focusing the laser beam
• G02B 19/00 - Condensers
• G02B 27/14 - Beam splitting or combining systems operating by reflection only

Abstract

A method is provided for analyzing a weld seam formed by a laser welding process, said method including thermally exciting the weld seam by radiating at least one laser pulse onto the weld seam, acquiring a decay characteristic of a thermal radiation emitted by the weld seam, and determining whether a welding defect is present based on an evaluation of the acquired decay characteristic. Furthermore, a laser machining system for analyzing a weld seam formed by a laser welding process between at least two workpieces is provided.

IPC Classes  ?

• B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials
• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/0622 - Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
• B23K 26/24 - Seam welding
• B23K 26/323 - Bonding taking account of the properties of the material involved involving parts made of dissimilar metallic material
• B23K 26/322 - Bonding taking account of the properties of the material involved involving coated metal parts
• G01N 25/72 - Investigating presence of flaws
• G01N 25/18 - Investigating or analysing materials by the use of thermal means by investigating thermal conductivity
• G01N 33/2045 - Defects
• G01N 33/207 - Welded or soldered jointsSolderability
• H01M 50/566 - Terminals characterised by their manufacturing process by welding, soldering or brazing

Abstract

The invention relates to a method for optimising a machining time of a laser machining process, the method comprising: specifying a machining path of the laser machining process on the workpiece, wherein the machining path comprises a plurality of machining path portions; specifying at least one boundary condition for at least one of the machining path portions; and determining control data for the laser machining process of the machining path, taking into account the at least one boundary condition, so that a machining time of the laser machining process is minimal. The invention also relates to a method for carrying out a laser machining process on a workpiece by means of such a method, and to a laser machining system which is designed to carry out the method.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
• B23K 26/21 - Bonding by welding
• B23K 26/36 - Removing material
• B23K 26/60 - Preliminary treatment
• B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials
• G05B 13/04 - Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
• G06Q 10/04 - Forecasting or optimisation specially adapted for administrative or management purposes, e.g. linear programming or "cutting stock problem"

Abstract

The invention relates to a laser machining head for material machining with a laser, said laser machining head comprising: a focusing optical unit (30) for focusing the laser beam (4); an outlet opening (112) for the laser beam (4); an optical sensor assembly (S1); a coupling optical unit (20) for coupling light (6), that is entering through the outlet opening (112), out of the beam path of the laser beam (4) to the sensor assembly (S1); an optical unit (10, 30) for adjusting a focus position of the laser beam (4), said optical unit comprising at least one adjustable optical element (10.1) for adjusting the focus position of the laser beam (4); and a compensation optical unit (70) for correcting a chromatic aberration, caused by the focusing optical unit (30), of the light (6) coupled out to the sensor assembly (S1), the compensation optical unit (70) being positioned between the coupling optical unit (20) and the sensor assembly (S1), and the compensation optical unit (70) being designed to adjust a focus position of the light (6) coupled out to the sensor assembly (S1).

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/04 - Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
• B23K 26/046 - Automatically focusing the laser beam
• B23K 26/21 - Bonding by welding
• B23K 26/38 - Removing material by boring or cutting
• B23K 26/70 - Auxiliary operations or equipment

Abstract

A system for machining materials by means of laser beam includes a deflection device for deflecting the laser beam and a wobble device configured to superimpose a wobble movement of the laser beam with a wobble figure and a wobble frequency onto a feed movement of the laser beam corresponding to a machining path by controlling the deflection device. The wobble device is configured, for carrying out the wobble movement, to control the deflection device according to a compensated wobble movement. Control values for a deflection of the laser beam along the wobble figure are adapted as a function of the wobble frequency and/or a path speed of the wobble movement that varies along the wobble figure is adapted as a function of a position of the laser beam in the wobble figure and as a function of the wobble frequency.

IPC Classes  ?

• B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
• B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

Abstract

A laser processing head is presented. The laser processing head includes a laser entry module for introducing a laser beam; a collimating module for collimating the laser beam; a scanning module for deflecting the laser beam; a focusing module for focusing the laser beam; and at least one diaphragm for increasing a scan field of the laser beam. The diaphragm comprises a diaphragm body and an opening, and is configured to limit a cross-sectional area of the laser beam by the diaphragm body. The at least one diaphragm is positioned optically downstream of the laser entry module and optically upstream of the focusing module. A laser processing system including the laser processing head is also presented. Furthermore, a method for increasing a scan field of the laser beam is also provided.

IPC Classes  ?

• B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
• G02B 5/00 - Optical elements other than lenses
• G02B 26/10 - Scanning systems
• B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

Abstract

A device for determining a focal position of a laser beam, in particular a processing laser beam in a laser processing head, has an optical decoupling element for decoupling a partial beam from a beam path of the laser beam, a detector for detecting at least one beam parameter of the partial beam, and at least one optical element with an adjustable focal length, which is arranged in a region of the beam path of the partial beam between the optical decoupling element and the detector. Also disclosed is a laser processing head which includes a device of this type, as well as a method for determining a focal position of a laser beam.

IPC Classes  ?

• B23K 26/70 - Auxiliary operations or equipment
• B23K 26/046 - Automatically focusing the laser beam
• G01J 1/04 - Optical or mechanical part
• G01J 1/42 - Photometry, e.g. photographic exposure meter using electric radiation detectors
• G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light

Goods & Services

machines, Parts of machines, for use in the following fields: Metalworking, Woodworking, Plastic processing, especially, Laser welding heads; Process control instruments [mechanical]; Laser welding machines. Electronic, optical and mechanical measuring, control and regulating apparatus, Especially Laser measuring systems; Measuring, detecting, monitoring and controlling devices; Sensors for monitoring, adjusting and controlling the operation of machine tools [including laser machine tools]; Lasers; Image scanning apparatus; Cameras [photography]; Computer software; Recorded or downloadable computer software platform; Downloadable computer application software.

Abstract

T of 2 W/(m·K) or more.

IPC Classes  ?

• B23K 26/38 - Removing material by boring or cutting
• B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing

Goods & Services

Metal processing machines; laser cutting head with (or without) remote control (machine parts); control motor for guide shaft; laser head for metal and other surface treatment (machine parts); machine for processing plastics; cutting heads, welding heads (machine parts), with (or without) programmable laser welding head (machine parts); process control instruments (mechanical) for machines and machine tools; system control instruments (mechanical -) for machines and machine tools; computerised laser cutting machines and laser cutting heads for material treatment. Optical beam deflectors, deflectors for laser beams and laser streams that can be used with (or without) programmable laser welding head; electric regulating equipment (apparatus); electronic and electromechanical controls; laser lens; sensors, sensor for remote control laser cutting head, sensor for remote control of glued (adhesive) head; measuring devices; electronic and mechanical measuring instruments; sensors used to monitor, adjust and control the operation of machine tools (including laser machine tools); computer software (recorded); recorded or downloadable computer software platform; downloadable computer application software; downloadable mobile phone application software (downloadable software applications for mobile phones); computer programs (downloadable software); software for controlling computerised laser cutting machines and laser cutting heads for material treatment.

Goods & Services

Metalworking machines; laser cutting head with (or without) remote control (machine parts); control motor for guide shaft; laser head for metal and other surface treatment (machine parts); machines for processing plastics; cutting heads, welding heads (machine parts), with (or without) programmable laser welding head (machine parts); process control instruments [mechanical]; system control instruments (mechanical -); computerised laser cutting machines and laser cutting heads for material treatment; optical beam deflectors, deflectors for laser beams and laser streams (parts of machines), with (or without) programmable laser welding heads (parts of machines); system control instruments (mechanical -). Electrical regulating apparatus; electronic control devices; laser lens; sensors, sensor for remote control laser cutting head, sensor for remote control of glued (adhesive) head; measuring devices; electronic measuring instruments, mechanical measuring instruments; sensors used to monitor, adjust and control the operation of machine tools (including laser machine tools); computer software, recorded; recorded or downloadable computer software platform; downloadable computer application software; downloadable mobile phone application software (downloadable software applications for mobile phones); computer programs, downloadable; software for controlling computerised laser cutting machines and laser cutting heads for material treatment.

Abstract

The present invention relates to a method for monitoring the condition of a laser machining head, the method comprising the steps of: detecting current measurement data by at least one sensor unit arranged within the laser machining head, determining an input vector based on the acquired current measurement data; and determining an output vector by applying a model trained by machine learning to the input vector, the output vector containing estimated current condition data of at least two elements of the laser machining head.

IPC Classes  ?

• B23K 31/00 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups
• B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials
• B23K 26/70 - Auxiliary operations or equipment

Abstract

A holder 1 for mounting an optical element 5 to a laser machining head 100 is presented. The holder 1 includes a socket 10, a spring part 20 and a fixing means 30. The socket 20 includes an aperture 12 and a seat 14 encircling the aperture 12. The optical element 5 is received in the seat 14 such that the optical element 5 is positioned at the aperture 12. The spring part 20 is annular disk-shaped and positioned at a mounting surface 10a of the socket. The spring part 20 has a rim portion 24 and a plurality of cantilever spring elements 40 extending radially inwards from the rim portion 24. Radially-inner edges 42 of the spring elements 40 define an opening 22 that overlaps the aperture 12. The fixing means 30 fixes the rim portion 24 of the spring part 20 to the mounting surface 10a of the socket 10 such that the cantilever spring elements 40 are disposed on the optical element 5 for pressing the optical element 5 towards the seat 14, when the optical element 5 is received at the seat 14.

IPC Classes  ?

• B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
• G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses

Abstract

The invention relates to a method for analyzing a workpiece surface for a laser machining process, having the steps of: emitting a light line of light of a first wavelength range into a region of the workpiece surface and illuminating the region of the workpiece surface with light of at least one second wavelength range; capturing an image of the region of the workpiece surface using a sensor device which comprises an image sensor and an optical unit for imaging onto the image sensor, wherein the optical unit has different refractive indices for the first and second wavelength range, and a first plane which is defined by the light line and a light outlet point of the light, the optical unit, and the image sensor are arranged in a Scheimpflug arrangement; and analyzing the image in order to analyze features of the workpiece surface on the basis of a specified offset between the first plane and a second plane for which the light of the second wavelength range is imaged sharply onto the sensor plane of the image sensor by the optical unit. The invention likewise relates to an analysis device which is designed to carry out the method.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials
• B23K 26/044 - Seam tracking

Abstract

The invention relates to a method for welding two bar-shaped electrodes by means of a laser beam, comprising: detecting the positions of the bar-shaped electrodes and determining a processing point on each of the bar-shaped electrodes; splitting the laser beam into two partial beams; and radiating the two partial beams respectively onto one of the processing points of the two bar-shaped electrodes and forming a common melt pool for welding the bar-shaped electrodes.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/067 - Dividing the beam into multiple beams, e.g. multi-focusing
• B23K 26/082 - Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
• B23K 26/21 - Bonding by welding
• H02K 3/28 - Layout of windings or of connections between windings
• H02K 15/04 - Processes or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines of windings prior to their mounting into the machines
• H02K 15/00 - Processes or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
• B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
• H01R 4/02 - Soldered or welded connections

Abstract

The present invention relates to a method for determining a position of a workpiece for a laser machining process, said method comprising the following steps: radiating a measurement beam onto at least one workpiece and onto a carrier device surrounding the at least one workpiece, along at least one first measurement path and along at least one second measurement path, the first measurement path having a predefined angle with respect to the second measurement path; sensing a portion of the radiated measurement beam that is reflected by the carrier device and by the at least one workpiece, along the first measurement path and along the second measurement path; and producing a corresponding measurement signal, the carrier device and the at least one workpiece having different reflectivities; and determining a position of the at least one workpiece on the basis of the measurement signal. The present invention also relates to a method for machining a workpiece by means of a laser beam, which method comprises the method for determining the position of the workpiece. The present invention additionally relates to a device for determining a position of a workpiece, which device is designed to carry out the methods.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/21 - Bonding by welding
• H02K 15/00 - Processes or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
• H02K 15/04 - Processes or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines of windings prior to their mounting into the machines
• B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials

Goods & Services

Metalworking machines; laser cutting head being machine parts; control motor for guide shaft not being for land vehicles; laser head for metal and other surface treatment being machine parts; machine parts, namely, cutting heads, welding heads Electronic control devices, namely, electrical controllers; lens for industrial laser cutting machines not sold as an integral component; sensor for remote control laser cutting head; sensor for remote control of glued adhesive head; measuring devices, namely, photodiodes and temperature sensors; electronic measuring instruments, mechanical measuring instruments, namely, photodiodes and temperature sensors; sensors used to monitor, adjust and control the operation of machine tools

Goods & Services

Metal processing machines; laser cutting head being machine parts; control motor for guide shaft not being for land vehicles; laser head for metal and other surface treatment being machine parts; machine parts, namely, cutting heads, welding heads Optical beam deflectors, optical deflectors for laser beams and laser; electronic and electromechanical controls, namely, electrical controllers; lens for industrial laser cutting machines not sold as an integral component; sensor for remote control laser cutting head; sensor for remote control of glued adhesive head; electronic and mechanical measuring instruments, namely, photodiodes and temperature sensors; sensors used to monitor, adjust and control the operation of machine tools, including laser machine tools

Abstract

A system for monitoring a laser machining process for machining a workpiece includes a computing unit configured to determine an input tensor on the basis of current data of the laser machining process and to determine an output tensor on the basis of the input tensor using a transfer function. The output tensor contains information on a current machining result. The transfer function between the input tensor and the output tensor is formed by a trained neural network.

IPC Classes  ?

• G05B 13/02 - Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
• G06N 3/08 - Learning methods
• G06N 3/082 - Learning methods modifying the architecture, e.g. adding, deleting or silencing nodes or connections
• G06T 7/00 - Image analysis

Abstract

A system for detecting machining errors for a laser machining system for machining a workpiece includes: a detection unit for detecting image data and height data of a machined workpiece surface; and a computing unit. The computing unit is designed to generate an input tensor based on the detected image data and height data and to determine an output tensor on the basis of the input tensor using a transfer function. The output tensor contains information on a machining error.

IPC Classes  ?

• G01N 21/88 - Investigating the presence of flaws, defects or contamination
• G01N 21/95 - Investigating the presence of flaws, defects or contamination characterised by the material or shape of the object to be examined
• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• G06T 7/00 - Image analysis
• G01B 9/02091 - Tomographic interferometers, e.g. based on optical coherence
• G01N 29/44 - Processing the detected response signal
• G06T 17/30 - Surface description, e.g. polynomial surface description

Abstract

The invention relates to a fibre coupler for securing a laser-light-guiding fibre to a laser machining head, comprising: a housing having an outlet opening arranged on an end side of the housing for letting laser light out of the fibre coupler, and a flange at least partially surrounding the outlet opening and with a contact surface for securing the fibre coupler to a laser machining head; and a laser-light-guiding fibre having a fibre end, wherein the fibre end is secured in the housing, in a region of the housing opposite the outlet opening, such that laser light exiting the fibre end is directed though the outlet opening.

IPC Classes  ?

• G02B 6/42 - Coupling light guides with opto-electronic elements
• G02B 6/36 - Mechanical coupling means
• G02B 6/24 - Coupling light guides

Abstract

t of the focus position (z).

IPC Classes  ?

• B23K 26/04 - Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
• B23K 26/046 - Automatically focusing the laser beam
• B23K 26/70 - Auxiliary operations or equipment
• G02B 7/28 - Systems for automatic generation of focusing signals
• G02B 19/00 - Condensers

Goods & Services

machines, Parts of machines, for use in the following fields: Metalworking, Woodworking, Plastic processing, especially, Laser welding heads; Process control instruments [mechanical]; Laser welding machines. Electronic, optical and mechanical measuring, control and regulating apparatus, Especially Laser measuring systems; Measuring, detecting, monitoring and controlling devices; Sensors for monitoring, adjusting and controlling the operation of machine tools [including laser machine tools]; Lasers; Image scanning apparatus; Cameras [photography]; Computer software; Recorded or downloadable computer software platform; Downloadable computer application software.

Abstract

The invention relates to a method for analysing a laser machining process for machining workpieces, said method comprising the following steps: detecting at least one sensor data set for the laser machining process; and determining a value of at least one physical property of a machining result of the laser machining process, based on the at least one sensor data set by means of a transfer function, wherein the transfer function is formed by a trained neural network. The invention also relates to a system (200) for analysing a laser machining process and a laser machining process (100) comprising a system (200) of this type.

IPC Classes  ?

• B23K 1/005 - Soldering by means of radiant energy
• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/21 - Bonding by welding
• B23K 26/38 - Removing material by boring or cutting
• B23K 31/00 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups
• B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials

Abstract

The invention relates to a laser processing device for processing workpieces using a laser beam, said laser processing device comprising: a laser processing head having a housing and a beam path for the laser beam arranged therein; at least one first optical element arranged in the beam path, wherein the first optical element is a moving optical element and/or an optical element with a negative focal length and/or a sealing optical element; and at least one transmissive second optical element arranged downstream of the first optical element in the beam path; characterised in that the first optical element and/or the second optical element comprises at least one surface with an anti-reflective structure for reducing back-reflections.

IPC Classes  ?

• B23K 26/064 - Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
• B23K 26/12 - Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
• H01S 3/00 - Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range

Abstract

A laser processing head includes a housing including a mounting surface for mounting the laser processing head on a carrier; a plurality of optical components arranged within the housing; and an access opening formed in the housing for removing or inserting at least one first optical component among the optical components, the access opening being formed in the mounting surface.

IPC Classes  ?

• B23K 26/064 - Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms

Abstract

A method for analysing a laser welding process is disclosed, the method comprising: forming a welded seam by radiating a laser beam onto at least one workpiece of workpieces to be welded and radiating a measurement beam onto the welded seam; capturing a measurement signal for a portion of the measurement beam that is reflected by the welded seam; and determining, on the basis of the measurement signal, whether there is a welding error.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/244 - Overlap seam welding
• B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials
• B23K 101/36 - Electric or electronic devices

Abstract

mittelmittel) of the pulsed laser beam (10) decreases during the cutting process.

IPC Classes  ?

• B23K 26/382 - Removing material by boring or cutting by boring
• B23K 26/0622 - Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses

Goods & Services

Metalworking machines; Laser cutting head with (or without) remote control (machine parts); Control motor for guide shaft; Laser head for metal and other surface treatment (machine parts); Machines for processing plastics; Cutting heads, welding heads (machine parts), with (or without) programmable laser welding head (machine parts); Process control instruments [mechanical]; System control instruments (Mechanical -); Computerised laser cutting machines and laser cutting heads for material treatment; Optical beam deflectors, deflectors for laser beams and laser streams (parts of machines), with (or without) programmable laser welding heads (parts of machines); System control instruments (Mechanical -). electrical regulating apparatus; Electronic control devices; Laser lens; Sensors, sensor for remote control laser cutting head, sensor for remote control of glued (adhesive) head; Measuring devices; Electronic measuring instruments, mechanical measuring instruments; Sensors used to monitor, adjust and control the operation of machine tools (including laser machine tools); Computer software, recorded; Recorded or downloadable computer software platform; Downloadable computer application software; Downloadable mobile phone application software (downloadable software applications for mobile phones); Computer programs, downloadable; Software for controlling computerised laser cutting machines and laser cutting heads for material treatment.

Abstract

The invention relates to a method for analysing a weld during laser welding of workpieces (30a, 30b), comprising: - detecting (S1) a first measurement signal (P1, P2) for process radiation generated during laser welding; - detecting (S2) a second measurement signal (P3) for radiation reflected by the workpieces (30a, 30b); - determining (S3), on the basis of the first measurement signal (P1, P2), whether there is a gap (S) between the workpieces (30a, 30b); and - if it is found that there is a gap (S), determining, on the basis of the second measurement signal (P3), whether a weld exists.

IPC Classes  ?

• B23K 26/244 - Overlap seam welding
• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 31/02 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to soldering or welding
• B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials
• B23K 101/38 - Conductors
• B23K 103/10 - Aluminium or alloys thereof
• B23K 103/12 - Copper or alloys thereof

Abstract

The invention relates to a method for optical distance measuring for a laser machining process for machining workpieces (11, 12), said method comprising the following steps: directing an optical measuring beam (43) onto a workpiece surface (1); scanning the workpiece surface (1) with the optical measuring beam (43) along at least one measuring path (3, 3a, 3b, 3c); and determining distances to the workpiece surface (1) at a plurality of measuring points along the measuring path (3, 3a, 3b, 3c), wherein the determining of distances occurs with a first resolution in a first measuring region (31) of the measuring path (3, 3a, 3b, 3c) and with a second resolution in a second measuring region (32) of the measuring path (3, 3a, 3b, 3c), wherein the first resolution is higher than the second resolution.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 31/00 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups
• G01B 9/02 - Interferometers
• G01B 11/06 - Measuring arrangements characterised by the use of optical techniques for measuring length, width, or thickness for measuring thickness

Abstract

A laser processing head includes a housing including a mounting surface for mounting the laser processing head on a carrier; a plurality of optical components arranged within the housing; and an access opening formed in the housing for removing or inserting at least one first optical component among the optical components, the access opening being formed in the mounting surface.

IPC Classes  ?

• B23K 26/064 - Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
• B23K 26/12 - Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
• B23K 26/70 - Auxiliary operations or equipment

Goods & Services

Metal processing machines; Laser cutting head with (or without) remote control (machine parts); Control motor for guide shaft; Laser head for metal and other surface treatment (machine parts); Machine for processing plastics; Cutting heads, welding heads (machine parts), with (or without) programmable laser welding head (machine parts); Process control instruments (mechanical); System control instruments (mechanical -); Computerised laser cutting machines and laser cutting heads for material treatment. Optical beam deflectors, deflectors for laser beams and laser streams (machine parts), with (or without) programmable laser welding head (machine parts); Electric regulating equipment (apparatus); Electronic and mechanical control devices; Laser lens; Sensors, sensor for remote control laser cutting head, sensor for remote control of glued (adhesive) head; Measuring devices; Electronic and mechanical measuring instruments; Sensors used to monitor, adjust and control the operation of machine tools (including laser machine tools); Computer software (recorded); Recorded or downloadable computer software platform; Downloadable computer application software; Downloadable mobile phone application software (downloadable software applications for mobile phones); Computer programs (downloadable software); Software for controlling computerised laser cutting machines and laser cutting heads for material treatment.

Abstract

The invention relates to a method for the automated beam positioning of a laser beam in relation to a nozzle of s laser processing head, wherein the method comprises the following automated steps: directing an adjusting laser beam, oriented coaxially to the laser beam, onto an outlet opening of the nozzle mounted on the laser processing head; and determining whether the adjusting laser beam passes through the outlet opening; and if the adjusting laser beam passes through the outlet opening, receiving a two-dimensional image of the outlet opening and the adjusting laser beam passing through the outlet opening, as well as of a nozzle mouth surrounding the outlet opening; determining a position of the adjusting laser beam and a position of the outlet opening of the nozzle based on the captured image; determining whether a deviation of the determined position of the adjusting laser beam from a predefined position of the adjusting laser beam is greater than a predefined maximum deviation; if the deviation is greater than the predefined maximum deviation, adjusting the relative position of the adjusting laser beam and the outlet opening; and repeating the steps of receiving a two-dimensional image, determining the position of the adjusting laser beam and the outlet opening, determining the deviation and adjusting the relative position, until the deviation of the determined position of the adjusting laser beam from the predefined position of the adjusting laser beam is less than or equal to the predefined maximum deviation. The invention relates to a laser processing system for processing a workpiece using a laser beam.

IPC Classes  ?

• B23K 26/04 - Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
• B23K 26/035 - Aligning the laser beam
• B23K 26/70 - Auxiliary operations or equipment

Abstract

What is disclosed is a system for monitoring a laser machining process for machining a workpiece (2) using a laser beam, the system (1) comprising: a neuromorphic image sensor (13) that is designed to generate image data of the laser machining process, and a computing unit (11) that is designed to determine input data based on the image data, and to determine output data based on the input data by way of a transfer function, which output data contain information about the laser machining process. A laser machining system for machining a workpiece using a laser beam is also disclosed. A method for monitoring a laser machining process for machining a workpiece using a laser beam is furthermore disclosed.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/21 - Bonding by welding
• B23K 26/38 - Removing material by boring or cutting
• B23K 31/00 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups
• B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials

Abstract

An add-on module for intercoupling or interposing between a control device, in particular a system control, and a laser machining head of a laser machining system is provided, wherein said add-on module comprises: a first interface (401), wherein the add-on module (40) is connectable with the laser machining head (20) and/or with at least one sensor device (21) of the laser machining system (1) via the first interface (401) so as to exchange data; a second interface (402), wherein the add-on module (40) is connectable to the control device (10) via the second interface (402) so as to exchange data; and a processing unit (407) configured to process data and output the processed data via at least one of the first, second, and third interfaces (401, 402, 403). Furthermore, a laser machining device comprising such an add-on module is provided.

IPC Classes  ?

• B23K 26/70 - Auxiliary operations or equipment

Abstract

A method for monitoring a joining seam, in particular during joining by a laser beam, wherein in the processing direction before a processing point a joining site is measured in order to detect the position and geometry thereof, at least one position of a joining seam is determined from the position of the joining point, and in the processing direction after the processing point the joining seam is measured in order to detect the geometry thereof at the determined position. A device is also provided for carrying out said method and to a laser processing head equipped with such a device.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/24 - Seam welding
• B23K 26/70 - Auxiliary operations or equipment
• B23K 26/046 - Automatically focusing the laser beam
• B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
• B23K 26/08 - Devices involving relative movement between laser beam and workpiece
• B23K 31/00 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups

Abstract

The invention relates to a nozzle (10) for a laser machining device for machining a workpiece (11) using a laser beam, said nozzle (10) comprising: an inner nozzle part (12) having an inner channel (14) for conducting the laser beam and for forming a core flow (20) of a process gas, and having a core flow outlet opening (18) for the outlet of the laser beam and of the core flow (20) of the process gas; and an outer nozzle part (22), at least a first nozzle region (46) of which is located at a distance from the inner nozzle part (12) and which, together with the inner nozzle part (12), forms an annular channel (24) for forming an annular flow (30) of the process gas, said annular channel having an annular channel outlet opening (28) for the outlet of the annular flow (30), wherein the cross-sectional surface area of the annular channel (24) increases towards the annular flow outlet opening (28). The invention additionally relates to a laser machining device for machining a workpiece, said device comprising such a nozzle.

IPC Classes  ?

• B23K 26/14 - Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beamNozzles therefor
• B23K 26/38 - Removing material by boring or cutting

Abstract

An add-on module for intercoupling or interposing between a control device, in particular a system control, and a laser machining head of a laser machining system is provided. The add-on module includes: a first interface, and is connectable with the laser machining head and/or with at least one sensor device of the laser machining system via the first interface so as to exchange data; a second interface, wherein the add-on module is connectable to the control device via the second interface so as to exchange data; and a processing unit configured to process data and output the processed data via at least one of the first, second, and third interfaces. Furthermore, a laser machining device includes such an add-on module is provided.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/70 - Auxiliary operations or equipment
• B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
• B23K 26/14 - Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beamNozzles therefor

Abstract

The invention relates to a nozzle (10) for a laser machining device for machining a workpiece (26) by means of a laser beam, the nozzle comprising: a main body (12), having an inner volume (14) for conducting the laser beam and process gas (16) and having a nozzle mouth (22) with a discharge opening (20) for discharging the laser beam and a core flow (24) of the process gas (16); a movable sleeve (28) having a collar region (30), which can be displaced along a guide region (32) of the main body (12), and having an annular gap region (34), which is at a distance from the main body (12) and together with the main body (12) forms an annular gap (38) for discharging an annular flow (40) of the process gas (16), wherein the main body (12) has at least one connection channel (44), which connects the inner volume (14) of the main body (12) to a region (42) between the main body (12) and the sleeve (28) in order to conduct some of the process gas (16) into the annular gap (38). The invention further relates to a laser machining device having a nozzle (10) of this kind.

IPC Classes  ?

• B23K 26/14 - Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beamNozzles therefor
• B23K 26/38 - Removing material by boring or cutting
• B23K 26/40 - Removing material taking account of the properties of the material involved

Abstract

A method for monitoring a laser machining process for machining workpieces comprises the following steps: for a plurality of machining steps, detecting a measurement signal for at least one measurement variable during a machining step; in a setting phase, defining a limit value in each case for at least one monitoring parameter based on the measurement signals detected during the setting phase; and in a monitoring phase, determining a monitoring parameter value for each machining step based on the measurement signal of the machining step, comparing the monitoring parameter value determined with the limit value to identify a faulty machining step, and determining whether a process change condition is met based on the measurement signal of at least one machining step, wherein, after a predefined setting time interval or after a predefined number of machining steps carried out during the setting phase, the phase is switched from the setting phase to the monitoring phase, and the phase is switched back from the monitoring phase to the setting phase when the process change condition is met.

IPC Classes  ?

• B23K 26/70 - Auxiliary operations or equipment
• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials

Abstract

The invention relates to a laser working system for performing a working process on a workpiece by means of a laser beam. The laser working system comprises: a laser working head for radiating a laser beam into a working region on the workpiece; and a sensor unit for monitoring the working process, the sensor unit having at least one hyperspectral sensor. The sensor unit is designed to capture a hyperspectral image of a region of the workpiece, the hyperspectral image having N times M pixels. The hyperspectral image has two spatial dimensions x and y and a spectral dimension λ. N indicates the number of pixels in the first spatial dimension x, M indicates the number of pixels in the second spatial dimension y, and L indicates the number of spectral bands in the spectral dimension λ of the hyperspectral image. M, N and L are natural numbers. The invention further relates to a method for monitoring a working process on a workpiece by means of a laser beam.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece

Abstract

The application relates to an alignment unit (100) for coupling a sensor unit to a laser working device in order to monitor a laser working process, the alignment unit (100) comprising: a first coupling device (110), which has an optical input (111) for process radiation coupled out of the laser working device and a coupling element for coupling to the laser working device; a second coupling device (120), which has an optical output and a coupling element for coupling to the sensor unit; a first adjustment unit (140), which is arranged between the first coupling device (110) and the second coupling device (120) and is designed to tilt the first coupling device (110) and the second coupling device (120) relative to each other and/or to slide the first coupling device and the second coupling device relative to each other at least in one direction; and a focusing optical unit (130) between the optical input (111) and the optical output, which focusing optical unit is arranged so as to be slidable along the optical axis of the focusing optical unit (130). The invention further relates to a sensor module for a laser working system for monitoring a laser working process, the sensor module comprising said alignment unit (100). The invention further relates to a laser working system, the laser working system comprising the sensor module.

IPC Classes  ?

• B23K 26/03 - Observing, e.g. monitoring, the workpiece
• B23K 26/046 - Automatically focusing the laser beam
• B23K 26/14 - Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beamNozzles therefor

Abstract

A method and a device for detecting a focal position of a laser beam, particularly a machining laser beam in a laser machining head, includes an optical element which is arranged in the laser beam converging toward the focal point and which is designed to outcouple a reflection from the laser beam path, and a sensor arrangement which is designed to detect beam characteristics of said laser beam in the region of the focal point in the laser extension direction, and which measures the outcoupled reflection of the laser beam at at least two locations that are offset to one another in the extension direction, in order to determine the current focal position.

IPC Classes  ?

• G01J 1/42 - Photometry, e.g. photographic exposure meter using electric radiation detectors

Abstract

A device for determining a focus position of a laser beam in a laser machining system has a first optical element which is designed to reflect a portion of the laser beam in order to uncouple a first sub-beam of the laser beam, a second optical element which is designed to reflect another portion of the laser beam in order to uncouple a second sub-beam of the laser beam substantially coaxially to the first sub-beam, a spatially-resolving sensor to which the first sub-beam and the second sub-beam can be directed, and an evaluation unit which is designed to determine a focus position of the laser beam on the basis of the first and second sub-beams hitting the spatially-resolving sensor.

IPC Classes  ?

• B23K 26/046 - Automatically focusing the laser beam
• B23K 26/08 - Devices involving relative movement between laser beam and workpiece
• B23K 26/064 - Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
• B23K 26/34 - Laser welding for purposes other than joining