PR Hoffman Machine Products, Inc.

United States of America

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Date
2023 1
Before 2020 3
IPC Class
B24B 37/30 - Work carriers for single side lapping of plane surfaces 3
B24B 37/24 - Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials 2
B24B 37/27 - Work carriers 2
B24B 37/34 - Accessories 2
B24B 41/02 - FramesBedsCarriages 2
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Status
Pending 1
Registered / In Force 3
Found results for  patents

1.

Method of manufacturing wafer holder

      
Application Number 16718800
Grant Number 11759910
Status In Force
Filing Date 2019-12-18
First Publication Date 2023-09-19
Grant Date 2023-09-19
Owner P. R. HOFFMAN MACHINE PRODUCTS, INC. (USA)
Inventor
  • Hutton, David Melville
  • Wimmersberger, Gary William
  • Pagano, Mara Lindsay

Abstract

A method of manufacturing a wafer holder, the wafer holder having a frame having at least one cavity capable of receiving and supporting a wafer grown from an ingot to be polished in a polishing machine, the at least one cavity having a cross sectional footprint at least equal to a cross sectional footprint of the wafer, the wafer having a thickness to cross sectional area ratio of 0.001 per unit length or less, a polymer film pad being permanently affixed in the at least one cavity, including cutting a frame from a layer of a thermoset or thermoplastic material having a thickness tolerance and measuring a thickness of the frame at at least one location thereon. The method further includes forming a cavity in the frame having a predetermined depth, and permanently affixing a polymer film pad in the cavity.

IPC Classes  ?

  • B29C 65/48 - Joining of preformed partsApparatus therefor using adhesives
  • B24B 37/27 - Work carriers
  • B24B 37/30 - Work carriers for single side lapping of plane surfaces
  • B24B 41/02 - FramesBedsCarriages
  • B24B 37/24 - Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
  • B24B 37/34 - Accessories

2.

Polishing machine wafer holder

      
Application Number 15825365
Grant Number 10556317
Status In Force
Filing Date 2017-11-29
First Publication Date 2018-03-29
Grant Date 2020-02-11
Owner P.R. HOFFMAN MACHINE PRODUCTS INC. (USA)
Inventor
  • Hutton, David Melville
  • Wimmersberger, Gary William
  • Pagano, Mara Lindsay

Abstract

A wafer holder is provided for use in a polishing machine. The wafer holder has a frame composed of a thermoset material and/or a thermoplastic material. The frame has at least one cavity for receiving and supporting a wafer to be polished in the polishing machine. A polymer film pad is permanently affixed in the at least one cavity.

IPC Classes  ?

  • B24B 37/27 - Work carriers
  • B24B 37/30 - Work carriers for single side lapping of plane surfaces
  • B24B 41/02 - FramesBedsCarriages
  • B24B 37/24 - Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
  • B24B 37/34 - Accessories

3.

POLISHING MACHINE WORK PIECE HOLDER

      
Application Number 15447825
Status Pending
Filing Date 2017-03-02
First Publication Date 2017-09-07
Owner P.R. HOFFMAN MACHINE PRODUCTS INC. (USA)
Inventor
  • Hutton, David Melville
  • Wimmersberger, Gary William
  • Pagano, Mara Lindsay

Abstract

A work piece holder is provided for use in a polishing machine. The work piece holder has a frame composed of a thermoset material and/or a thermoplastic material. The frame has at least one cavity for receiving and supporting a work piece to be polished in the polishing machine. A polymer film is permanently affixed in the at least one cavity.

IPC Classes  ?

  • B24B 37/30 - Work carriers for single side lapping of plane surfaces

4.

RFID-containing carriers used for silicon wafer quality

      
Application Number 11935283
Grant Number 08388410
Status In Force
Filing Date 2007-11-05
First Publication Date 2009-05-07
Grant Date 2013-03-05
Owner P.R. Hoffman Machine Products, Inc. (USA)
Inventor Albright, Jr., John Wesley

Abstract

A carrier configured for use in a lapping machine includes a body having a first opening for carrying a work piece during operation of the lapping machine. A device is arranged and disposed in the body. The device is configured to retain information readable by a reading device for identifying the body.

IPC Classes  ?

  • B24B 49/00 - Measuring or gauging equipment for controlling the feed movement of the grinding tool or workArrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation