Abstract

A soldering tip for a soldering apparatus and a method of forming a soldering tip for a soldering apparatus, the tip comprising: a body formed of a first material; a proximal end for attaching the tip to the selective soldering apparatus; and a distal end, the distal end having an outer surface, at least a region of which is formed from a second material, different to the first, the second material exhibiting greater solder wettability characteristics than the first material. The first material is preferably titanium or a titanium alloy and the region is preferably formed on the first material by first using a physical vapour deposition (PVD) process to create a first coating on at least a first part of the first material, which first part underlies the region, and then coating at least a part of that first coating with the second material.

IPC Classes  ?

• B23K 3/02 - Soldering ironsBits
• B23K 3/06 - Solder feeding devicesSolder melting pans
• B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
• B23K 101/42 - Printed circuits

Abstract

A soldering tip for a soldering apparatus and a method of forming a soldering tip for a soldering apparatus, the tip comprising: a body formed of a first material; a proximal end for attaching the tip to the selective soldering apparatus; and a distal end, the distal end having an outer surface, at least a region of which is formed from a second material, different to the first, the second material exhibiting greater solder wettability characteristics than the first material. The first material is preferably titanium or a titanium alloy and the region is preferably formed on the first material by first using a physical vapour deposition (PVD) process to create a first coating on at least a first part of the first material, which first part underlies the region, and then coating at least a part of that first coating with the second material.

IPC Classes  ?

• B23K 3/02 - Soldering ironsBits
• B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
• B23K 3/06 - Solder feeding devicesSolder melting pans

Abstract

A method of assessing discrepancy between a target value and a measured value of a parameter of contact area produced between flow of solder ejected from a nozzle and a surface is defined in the present application. This method comprises the steps of: providing a surface of material through which contact area between solder ejected from a nozzle and a side of the surface can be visually detected, for example using a camera; flowing solder through a nozzle and then bringing the solder into contact with a side of the surface, thereby creating contact area between the solder and said side of the surface; detecting the contact area from the other side of the surface so that a value of a parameter of said contact area can then be measured; and assessing any discrepancy between the target value and the measured value so that any necessary compensation in order to achieve the target value can be programmed.

IPC Classes  ?

• B23K 1/00 - Soldering, e.g. brazing, or unsoldering
• B23K 1/08 - Soldering by means of dipping in molten solder
• B23K 1/20 - Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
• B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials
• G01N 13/02 - Investigating surface tension of liquids
• H05K 3/08 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by electric discharge, e.g. by spark erosion
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Abstract

The present invention provides an improved soldering nozzle (61, 81) for delivering molten solder to the underside of a PCB. The nozzle (61, 81) comprises a nozzle outlet, the nozzle having an inner bore through which a flow of molten solder can be pumped to overflow the nozzle outlet, the nozzle (61, 81) having an outer surface configured to collect a return flow of molten solder. The outer surface of the nozzle (61, 81) comprises a slotted or recessed feature located about at least a part of the nozzle outlet. This feature is for accommodating at least a part of the return flow of molten solder. The soldering nozzle (61, 81) of the present invention achieves an improved dewetting performance.

IPC Classes  ?

• B23K 1/08 - Soldering by means of dipping in molten solder
• B23K 3/06 - Solder feeding devicesSolder melting pans
• F23D 14/58 - Nozzles characterised by the shape or arrangement of the outlet or outlets from the nozzle, e.g. of annular configuration
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Abstract

In a modular soldering apparatus a pump assembly (4) comprising a pump (67, 71) conduit 66 and solder nozzle (92) is removable as a unit and push contacts (42, 52') which are broken by lifting the assembly are provided for the electrical, data and gas connections (80, 90). A solder bath (10) is also mounted on a support structure (16) and connected to data and power supplies (42) by push fit connections. The pump assembly and solder bath may be coupled together and removed as single unit.

IPC Classes  ?

• B23K 1/08 - Soldering by means of dipping in molten solder
• B23K 3/06 - Solder feeding devicesSolder melting pans

Abstract

A manually operable soldering apparatus comprising a solder bath having a nozzle (92) which is raised to solder a lead or PCB track positioned above the nozzle. A movable frame (28) carries the PCB (30) to be soldered and is mounted to be moved in a plane above the nozzle by manual operation of an operator. A reference board (36) is positioned above board (36) and laser beam (72a) is used to align the reference board, board (36) and nozzle (90) so that an operator works by positioning the board (36) under the beam (72a). A frame carrying the board is pivotable to a maintenance position and can also be held at an angle to the horizontal for a wave soldering operation.

IPC Classes  ?

• B23K 3/06 - Solder feeding devicesSolder melting pans
• B23K 1/08 - Soldering by means of dipping in molten solder
• B23K 3/08 - Auxiliary devices therefor
• H05K 13/04 - Mounting of components

Abstract

A fluxer comprises a spray head (15), a reservoir (3) for the flux (9) and a feed line (11) for feeding flux from the reservoir (3) to the spray head (15) by pressurising the reservoir with an air supply via a line (7). A return (12) line is provided from the spray head (15) so that cleaning fluid (9') can be fed from a reservoir (3') via line (11) and returned to a waste reservoir (19). A spray head has an electromagnetically operated piston (53) for spraying flux. The piston (53) is biased to a first position by a spring (49) to close a spray outlet aperture (63) and is moved against the force of the spring (49) by the electromagnet (71).

IPC Classes  ?

• B23K 1/20 - Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
• B23K 3/08 - Auxiliary devices therefor

Abstract

An impeller type pump (7) in a selective soldering apparatus (1) is positioned so that the surface (S) level of molten solder in the bath adjacent the impeller axle (31) is just below the upper edge (53) of the impeller blades (41). This can reduce the formation of solder dust.

IPC Classes  ?

• B23K 1/08 - Soldering by means of dipping in molten solder
• B23K 3/06 - Solder feeding devicesSolder melting pans

Abstract

A selective soldering apparatus comprises a bath (3) for molten solder (5), a solder nozzle (19) and a pump (9) for pumping molten solder (5) through the nozzle (19). The nozzle has a nozzle body (21) with an inner bore (22) through which solder is pumped to overflow a nozzle outlet (33). A jacket (23) provided around the nozzle body (21) to form an enclosed space (26) open at its upper end (28) to solder which has overflowed from the nozzle outlet (33) and the cover lower end being adjacent the surface (11) of molten solder in the bath, wherein a spiral pathway (25) is provided in the enclosed space (26) so that the overflowed solder runs down the pathway into the solder bath (3). A port (39) is provided at the lower end of the jacket for gas to flow into or out of the spiral pathway so that the pathway can be purged of air when solder is not flowing through the pathway.

IPC Classes  ?

• B23K 1/08 - Soldering by means of dipping in molten solder
• B23K 3/06 - Solder feeding devicesSolder melting pans
• H05K 13/04 - Mounting of components