A film-forming method for forming a film in a film-forming apparatus includes generating first gas molecular species and second gas molecular species by causing the first source gas and the second source gas accumulated in the accumulation mechanisms to pass through respective instantaneously-heating units, sharply raising partial pressure of the first gas molecular species and partial pressure of the second gas molecular species by projectingly supplying the first gas molecular species and the second gas molecular species to the reaction chamber in which the substrate has been placed, which has been depressurized, and which has a constant capacity; bringing the first gas molecular species or the second gas molecular species into reaction by alternately repeatedly guiding the first gas molecular species or the second gas molecular species to a surface of the substrate, and forming a compound film on the surface of the substrate.
C23C 16/455 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into the reaction chamber or for modifying gas flows in the reaction chamber
C23C 16/30 - Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
H01L 51/52 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED) - Details of devices
A solid gasification apparatus includes a reaction chamber thermally insulated by a heat insulating material, a heat beam fluid heat exchange apparatus that produces a first heated gas and a second heated gas, and a unit that includes a gas flow path. The unit sprays the first heated gas against a material solid in a reaction chamber to heat the material solid, and, simultaneously, makes the material solid react with the first heated gas to produce a produced gas containing the element of the material solid. The unit makes a second heated gas contact and react with the produced gas.
C10J 3/00 - Production of gases containing carbon monoxide and hydrogen, e.g. synthesis gas or town gas, from solid carbonaceous materials by partial oxidation processes involving oxygen or steam
C10J 3/22 - Arrangements or dispositions of valves or flues
C23C 16/448 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
C10J 3/80 - Other features with arrangements for preheating the blast or the water vapour
C23C 16/44 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
B01J 19/00 - Chemical, physical or physico-chemical processes in generalTheir relevant apparatus
B01J 19/02 - Apparatus characterised by being constructed of material selected for its chemically-resistant properties
B01J 19/24 - Stationary reactors without moving elements inside
A small-sized fluid heating/cooling apparatus for heating or cooling a large amount of gas or liquid at a low cost. Structures where a flow passage for a fluid is formed in a heated or cooled base formed in a plate shape or a column shape, and a fluid which has passed through the narrowed flow passage impinges on a wall of a side face of the base vertically to perform heat exchange are connected in series. Heat exchange is instantaneously performed in a small space and manufacture of a mechanism performing such an operation is easy. A material constituting the flow passage may be a metal or ceramics, and a small-sized fluid heat exchanging apparatus can be manufactured at a low cost.
In a small-sized fluid heat exchanging apparatus that heats or cools a huge amount of gas or liquid, a structure makes fluid having a high flow speed impinge perpendicularly against a wall. A flow passage is divided into a high-speed flow passage and a low-speed flow passage, and the high-speed flow passage and the low-speed flow passage are arranged so as to intersect perpendicularly with each other, according to guidelines for the shape of the flow passage. A flow passage designed according to the guidelines provides highly-efficient heat exchange.
F28D 7/02 - Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being helically coiled
F28F 3/12 - Elements constructed in the shape of a hollow panel, e.g. with channels
F28F 13/06 - Arrangements for modifying heat transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
F28F 21/02 - Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
F28F 21/04 - Constructions of heat-exchange apparatus characterised by the selection of particular materials of ceramicConstructions of heat-exchange apparatus characterised by the selection of particular materials of concreteConstructions of heat-exchange apparatus characterised by the selection of particular materials of natural stone
F28F 21/08 - Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
Provided is a fluid heating device that is small in size and capable of heating a large flow of gas or liquid at a low cost. A flow path in which no backwater is produced is provided by providing grooved flow paths of a fluid are provided over an outer side surface of a metallic circular cylinder such that a fluid passing through a narrowed one of the flow paths impinges perpendicularly against a wall of the next flow path. This allows instantaneous heat exchange within a small space, and makes manufacturing of such a structure simple.
F24H 1/10 - Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium
6.
HEATING DEVICE, FILM FORMING APPARATUS, FILM FORMING METHOD, AND DEVICE
Provided is a heating device capable of forming a film efficiently on a glass substrate. Also provided is a film forming apparatus having the heating device. The film forming apparatus comprises the heating device for blowing such a high-temperature gas vertically to the surface (25) of a glass substrate (24) placed on a supporting bed (26), as has a temperature higher than the softening point temperature of the glass substrate. The film forming apparatus blows such a depositing gas (43) simultaneously with a high-temperature gas to the surface of the glass substrate, as is thermally decomposed to form a film deposit.
H01L 21/205 - Deposition of semiconductor materials on a substrate, e.g. epitaxial growth using reduction or decomposition of a gaseous compound yielding a solid condensate, i.e. chemical deposition
C23C 16/452 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by activating reactive gas streams before introduction into the reaction chamber, e.g. by ionization or by addition of reactive species
H01L 21/31 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to form insulating layers thereon, e.g. for masking or by using photolithographic techniquesAfter-treatment of these layersSelection of materials for these layers
7.
BASE BODY, AND SYSTEM FOR CONFIRMING BASE BODY EXISTING POSITION AND FREQUENCY RESPONSE CHARACTERISTIC
Provided is a base body, which detects a change of resonance status of a tank circuit having a prescribed resonance frequency by combining the tank circuit and a modulated laser beam applied from the external, and reads a chip existing position and frequency response characteristic. A powder chip (base body) (11) is provided with a substrate (12); an inductance element formed on the substrate; a first upper electrode (16) arranged between the electrodes at the both ends of the inductance element; a second upper side electrode, which is composed of a first conductor film (17a) facing a first end section electrode of the inductance element through an insulating film and a second conductor film (17b) facing a second end section electrode of the inductance element through the insulating film, and has a gap between the first conductor film and the second conductor film; and a photoconductive film (20) formed on the upper surface of the second upper electrode to cover a region including the gap.
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
H01L 21/822 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
H01L 27/04 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
H04B 5/02 - Near-field transmission systems, e.g. inductive loop type using transceiver
A base sheet (12) has a structure which stably couples even a 1mm or smaller particle-like chip on paper with an antenna line only by arranging the chip close to the antenna line without bringing the chip into electrical contact with the antenna line. The base sheet (12) is configured by arranging a chip (11) having at least one turn of spiral coil (13) on the surface or inside close to the surface, and an antenna line (14) having a conductor portion (14A) which winds at the periphery of or directly above the coil (13A) to have magnetic field coupling with the coil (13A) of the chip (11). The base sheet has a structure that stably couples even a 1mm or smaller chip on paper and the like with an antenna line, not by bringing the chip into physical contact with the antenna line but only by arranging the base sheet and the antenna line close to each other.
H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
B42D 15/10 - Identity, credit, cheque or like information-bearing cards (record carriers, e.g. credit or identity cards, for use with machines and with at least a part designed to carry digital markings G06K 19/00)
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
H01Q 7/00 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
H01Q 9/28 - Conical, cylindrical, cage, strip, gauze or like elements having an extended radiating surface Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines
H01Q 9/30 - Resonant antennas with feed to end of elongated active element, e.g. unipole
H04B 5/02 - Near-field transmission systems, e.g. inductive loop type using transceiver
9.
METHOD FOR PROVIDING RF POWDER AND RF POWDER-CONTAINING LIQUID
This invention provides a method for providing an RF powder, which, in an embodiment, is used as powder (powdery state) rather than individual elements, is easy to handle, has a high level of applicability and extendability, is very low in production cost in terms of unit price of each particle, and has a very high level of practicality, and an RF powder-containing liquid. In the method for providing an RF powder, an RF powder comprising a number of RF powder particles (11a) is supplied to users in such a state that the RF powder is contained in a vessel (1). The RF powder, together with a medium for preventing adhesion among the number of RF powder particles (11a), is placed in the vessel (1). The medium is a liquid. The liquid has a specific color, and the specific color is determined according to the characteristic frequency of the RF powder.
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
An RF powder particle, an RF powder, and an RF power exciting method making it difficult to make a counterfeit note, having a tank circuit having a specific resonance frequency self-oscillates to generate a high-frequency electromagnetic field, and easily and reliably supplying oscillation power. In an RF powder particle (21), a coil (24) (inductance element) to serve as an antenna and formed on an insulating film of a substrate (22) and a capacitor (25) (capacitance element) connected to both ends of the coil are fabricated, a tank circuit (34) is constituted of the inductance element and the capacitance element, and a photoelectromotive force element (30) for supplying power to the tank circuit (34) is provided on the substrate (22).
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
G06K 19/10 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means at least one kind of marking being used for authentication, e.g. of credit or identity cards
B42D 15/10 - Identity, credit, cheque or like information-bearing cards (record carriers, e.g. credit or identity cards, for use with machines and with at least a part designed to carry digital markings G06K 19/00)
A magnetic coupler and reader in which a high-frequency electromagnetic field for responding and reading information is properly given to a small magnetic coupling circuit element contained or added to a sheet or plate object having a high property value such as money or securities so as to ensure adequate magnetic coupling and supply adequate electric power. A read probe (magnetic coupler) (100) has a loop antenna for generating a high-frequency electromagnetic field resonantly responding to a tank circuit in a small magnetic coupling circuit element. The loop antenna is composed of a dielectric substrate (101), a first loop antenna (102A) formed on the front surface of the dielectric substrate, a second loop antenna (102B) formed on the back surface of the dielectric substrate and in the same position as that of the first loop antenna and having the same diameter as that of the first loop antenna, and connection sections (through holes) (108, 110) for connecting the first and second loop antennas in series.
H01Q 7/00 - Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
B42D 15/10 - Identity, credit, cheque or like information-bearing cards (record carriers, e.g. credit or identity cards, for use with machines and with at least a part designed to carry digital markings G06K 19/00)
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G07D 7/00 - Testing specially adapted to determine the identity or genuineness of valuable papers or for segregating those which are unacceptable, e.g. banknotes that are alien to a currency
G07D 7/02 - Testing electrical properties of the materials thereof
G07D 7/04 - Testing magnetic properties of the materials thereof, e.g. by detection of magnetic imprint
H01Q 1/38 - Structural form of radiating elements, e.g. cone, spiral, umbrella formed by a conductive layer on an insulating support
H04B 5/02 - Near-field transmission systems, e.g. inductive loop type using transceiver
This invention provides a process for producing an RF powder having such a property that is usable as an RF powder (powdery material) comprising a large amount of particles and in a collective form, wherein a large number of RF powder particles can be reliably separated and taken out at a high yield from a wafer. The production process is a process for producing an RF powder comprising a large amount of particles, each particle (11a) comprising a substrate (12) and a magnetic field coupled circuit element (15). The production process comprises a step of producing a large amount of antenna circuit elements (39) on a wafer (40) (S11), a gas dicing step of forming a cutout groove at a position for separating the magnetic field coupled circuit element from the wafer (S13), a protective film forming step of covering the periphery of the magnetic field coupled circuit element with a protective film (S14), a reinforcing step of applying a reinforcing plate with the aid of a pressure-sensitive adhesive sheet (S15), a grinding step of grinding the backside of the wafer to the cutout groove (S16), and a separating step of removing the reinforcing plate to separate circuit elements (S17).
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/306 - Chemical or electrical treatment, e.g. electrolytic etching
Provided is a method for adding a RF powder to a base material sheet (10) by arranging the RF powder on the surface of the base material sheet. The RF powder includes a plurality of RF powder particles (11), each of which has a magnetic field coupling circuit element in a high frequency magnetic field of a specific frequency. The RF powder is arranged on the surface of the base material sheet by a printing method. The RF powder added base material sheet (10) is arranged on the surface of the base material sheet by including in a printed indication the RF powder, which includes the plurality of RF powder particles (11) having the magnetic field coupling element in the high frequency magnetic field of the prescribed frequency.
G06K 19/10 - Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code using markings of different kinds in the same record carrier, e.g. one marking being sensed by optical and the other by magnetic means at least one kind of marking being used for authentication, e.g. of credit or identity cards
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
H04B 5/02 - Near-field transmission systems, e.g. inductive loop type using transceiver
A base data management system for grasping specific data recorded in a plate or sheet object having a high property value of one of various cards, bank notes, securities, and so forth in real time and managing and tracing circulating bank notes and so forth. A base data management system (100) comprises a base data reader (201) having reading means (203) for reading specific data recorded in a base (10) through magnetic coupling with a resonance frequency and transmitting means (205) for transmitting the specific frequency data read by the reading means and device information and a host computer (101) having data receiving means (102) for receiving the specific frequency data and the device information transmitted through a network (300) from the base data reader, storage means (103) for storing the received the specific data and the device information, and output means (104) for processing the data stored in the storage means, checking the data with other data, and outputting the data.
G06K 17/00 - Methods or arrangements for effecting co-operative working between equipments covered by two or more of main groups , e.g. automatic card files incorporating conveying and reading operations
B42D 15/10 - Identity, credit, cheque or like information-bearing cards (record carriers, e.g. credit or identity cards, for use with machines and with at least a part designed to carry digital markings G06K 19/00)
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
15.
RF POWDER PARTICLE, RF POWDER, AND RF POWDER-CONTAINING BASE
An RF powder particle, an RF powder, and an RF powder-containing base all making it difficult to make a counterfeit document, a counterfeit bank note, or the like of a sheet object having a high property value such as a bank note, having a tank circuit having a predetermined resonance frequency, and capable of storing necessary information in each of multiple particles. RF powders constitute a coil (24) (inductance element) serving as a magnetic coupling element and provided on an insulating surface of a base (22) and a capacitor (25) (capacitance element) connected to both ends of the coil. The inductance element and the capacitance elementform a tank circuit (31). The tank circuit (31) acts as a resonating circuit or a nonresonating circuit depending on a condition in response to a high-frequency magnetic field given from outside.
G06K 19/077 - Constructional details, e.g. mounting of circuits in the carrier
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
This invention provides a method for manufacturing a semiconductor device, comprising the step of providing a resist mask having a pattern of 32 to 130 nm in pattern width and/or spacing between patterns formed by using an ArF exposure technique, and dry etching a thin film using a halogenated carbon compound gas, wherein the halogen is at least two of F, I, and Br, and 26% or less of the total amount of the halogen atom in terms of atomic composition ratio is accounted for by at least one of I and Br, to transfer a pattern onto the thin film. Etching can be carried out without damage to the resist mask for ArF exposure. A substrate material is dry etched using, as a mask, the thin film having a transferred pattern.
A process for producing a semiconductor device, including the step of carrying out a pattern transfer onto a thin film through dry etching of the thin film with the use of a resist mask having a pattern of 32 to 130 nm pattern width and/or inter-pattern spacing formed according to ArF exposure technique and with the use of a halogenated carbon compound gas (provided that the halogen is at least two members selected from among F, I and Br and that the atomic composition ratio of at least one member selected from among I and Br is 26% or below based on the total amount of halogen atoms). Etching can be performed without damaging of the resist mask for ArF exposure. Using the thin film with thus transferred pattern as mask, foundation materials are dry etched.
In the microfabrication of hole and trench through dry etching, in a plasma atmosphere, of an interlayer insulation film covered with a resist mask formed by ArF photolithography, as the etching gas, use is made of a halogen (F, I, Br) base gas consisting of a gas of fluorinated carbon compound wherein at least one of I and Br is contained in an amount, in terms of atomic composition ratio, of 26% or less based on the total amount of halogens and the rest consists of F. As a result, the occurrence of striation is suppressed and high etching processing accuracy can be attained.
patents
