- All sections
- H - Electricity
- H05K - Printed circuitscasings or constructional details of electric apparatusmanufacture of assemblages of electrical components
- H05K 5/06 - Hermetically-sealed casings
Patent holdings for IPC class H05K 5/06
Total number of patents in this class: 2548
10-year publication summary
|
180
|
200
|
219
|
256
|
253
|
208
|
182
|
191
|
170
|
158
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Samsung Electronics Co., Ltd. | 147983 |
189 |
| Robert Bosch GmbH | 42826 |
74 |
| Nitto Denko Corporation | 8344 |
54 |
| Hitachi Astemo, Ltd. | 6383 |
39 |
| Apple Inc. | 55640 |
37 |
| Kyocera Corporation | 13988 |
35 |
| Mitsubishi Electric Corporation | 46590 |
34 |
| Sumitomo Wiring Systems, Ltd. | 10494 |
28 |
| Huawei Technologies Co., Ltd. | 114320 |
27 |
| TouchTunes Music Company, LLC | 208 |
24 |
| Yazaki Corporation | 6735 |
23 |
| Medtronic, Inc. | 9815 |
22 |
| Hitachi Automotive Systems, Ltd. | 3955 |
21 |
| Siemens AG | 24353 |
20 |
| Continental Automotive GmbH | 4768 |
20 |
| TreeFrog Developments, Inc. | 95 |
20 |
| Denso Corporation | 24562 |
18 |
| Murata Manufacturing Co., Ltd. | 24829 |
18 |
| Mitsubishi Electric Mobility Corporation | 1081 |
17 |
| Sumitomo Electric Industries, Ltd. | 15659 |
16 |
| Other owners | 1812 |