- All sections
- H - Electricity
- H05K - Printed circuitscasings or constructional details of electric apparatusmanufacture of assemblages of electrical components
- H05K 5/06 - Hermetically-sealed casings
Patent holdings for IPC class H05K 5/06
Total number of patents in this class: 2700
10-year publication summary
|
208
|
225
|
267
|
257
|
214
|
184
|
198
|
175
|
200
|
136
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Samsung Electronics Co., Ltd. | 158605 |
213 |
| Robert Bosch GmbH | 44252 |
76 |
| Nitto Denko Corporation | 8565 |
55 |
| Apple Inc. | 59117 |
37 |
| Hitachi Astemo, Ltd. | 6422 |
37 |
| Mitsubishi Electric Corporation | 48236 |
36 |
| Kyocera Corporation | 14433 |
35 |
| Huawei Technologies Co., Ltd. | 124379 |
31 |
| Sumitomo Wiring Systems, Ltd. | 11139 |
30 |
| Yazaki Corporation | 7137 |
23 |
| TouchTunes Music Company, LLC | 209 |
23 |
| Medtronic, Inc. | 9801 |
22 |
| Hitachi Automotive Systems, Ltd. | 3954 |
21 |
| Denso Corporation | 25676 |
20 |
| TreeFrog Developments, Inc. | 95 |
20 |
| Siemens AG | 23983 |
19 |
| Sumitomo Electric Industries, Ltd. | 16331 |
18 |
| Murata Manufacturing Co., Ltd. | 25847 |
18 |
| Continental Automotive GmbH | 4471 |
18 |
| LG Electronics Inc. | 75910 |
17 |
| Other owners | 1931 |