- All sections
- H - Electricity
- H05K - Printed circuitscasings or constructional details of electric apparatusmanufacture of assemblages of electrical components
- H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
Patent holdings for IPC class H05K 3/38
Total number of patents in this class: 1462
10-year publication summary
|
103
|
124
|
109
|
134
|
113
|
119
|
116
|
91
|
92
|
31
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| JX Nippon Mining & Metals Corporation | 1499 |
54 |
| Sumitomo Electric Industries, Ltd. | 15377 |
42 |
| Mitsui Mining & Smelting Co., Ltd. | 1470 |
41 |
| Mitsubishi Materials Corporation | 2432 |
35 |
| Atotech Deutschland GmbH | 559 |
34 |
| Sumitomo Electric Printed Circuits, Inc. | 306 |
33 |
| Kyocera Corporation | 13706 |
32 |
| LG Innotek Co., Ltd. | 7552 |
28 |
| Murata Manufacturing Co., Ltd. | 24369 |
24 |
| DIC Corporation | 3759 |
24 |
| Toshiba Materials Co., Ltd. | 660 |
22 |
| Denka Company Limited | 2536 |
21 |
| Ibiden Co., Ltd. | 1734 |
20 |
| Shinko Electric Industries Co., Ltd. | 1207 |
18 |
| The Furukawa Electric Co., Ltd. | 3635 |
16 |
| MEC Company Ltd. | 81 |
16 |
| FUJIFILM Corporation | 29251 |
15 |
| Namics Corporation | 440 |
15 |
| Panasonic Intellectual Property Management Co., Ltd. | 31022 |
14 |
| NGK Insulators, Ltd. | 4929 |
14 |
| Other owners | 944 |