- All sections
- H - Electricity
- H05K - Printed circuitscasings or constructional details of electric apparatusmanufacture of assemblages of electrical components
- H05K 5/06 - Hermetically-sealed casings
Patent holdings for IPC class H05K 5/06
Total number of patents in this class: 2658
10-year publication summary
|
208
|
225
|
267
|
257
|
214
|
184
|
198
|
175
|
202
|
83
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Samsung Electronics Co., Ltd. | 155224 |
209 |
| Robert Bosch GmbH | 43788 |
75 |
| Nitto Denko Corporation | 8486 |
55 |
| Hitachi Astemo, Ltd. | 6412 |
38 |
| Apple Inc. | 58268 |
37 |
| Mitsubishi Electric Corporation | 47722 |
35 |
| Kyocera Corporation | 14278 |
35 |
| Huawei Technologies Co., Ltd. | 121192 |
29 |
| Sumitomo Wiring Systems, Ltd. | 10858 |
29 |
| Yazaki Corporation | 7000 |
23 |
| TouchTunes Music Company, LLC | 209 |
23 |
| Medtronic, Inc. | 9739 |
22 |
| Hitachi Automotive Systems, Ltd. | 3954 |
21 |
| TreeFrog Developments, Inc. | 95 |
20 |
| Siemens AG | 24132 |
19 |
| Denso Corporation | 25361 |
19 |
| Continental Automotive GmbH | 4588 |
19 |
| Sumitomo Electric Industries, Ltd. | 16191 |
18 |
| Murata Manufacturing Co., Ltd. | 25590 |
18 |
| Mitsubishi Electric Mobility Corporation | 1119 |
17 |
| Other owners | 1897 |