- All sections
- H - Electricity
- H05K - Printed circuitscasings or constructional details of electric apparatusmanufacture of assemblages of electrical components
- H05K 3/42 - Plated through-holes
Patent holdings for IPC class H05K 3/42
Total number of patents in this class: 1674
10-year publication summary
176
|
131
|
152
|
174
|
158
|
125
|
122
|
138
|
114
|
31
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Ibiden Co., Ltd. | 1734 |
75 |
Intel Corporation | 46302 |
49 |
International Business Machines Corporation | 60408 |
42 |
Shinko Electric Industries Co., Ltd. | 1203 |
39 |
Avary Holding (Shenzhen) Co., Limited. | 292 |
39 |
Samsung Electro-mechanics Co., Ltd. | 5302 |
35 |
Unimicron Technology Corp. | 454 |
34 |
HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. | 137 |
31 |
Sumitomo Electric Industries, Ltd. | 15122 |
28 |
at & S Austria Technologie & Systemtechnik Aktiengesellschaft | 473 |
26 |
Sumitomo Electric Printed Circuits, Inc. | 298 |
26 |
Murata Manufacturing Co., Ltd. | 23996 |
24 |
Kyocera Corporation | 13447 |
22 |
Sanmina Corporation | 190 |
20 |
Samsung Electronics Co., Ltd. | 140991 |
19 |
LG Innotek Co., Ltd. | 7348 |
18 |
Atotech Deutschland GmbH | 565 |
17 |
MacDermid Enthone Inc. | 235 |
17 |
Catlam LLC | 27 |
17 |
Huawei Technologies Co., Ltd. | 108306 |
16 |
Other owners | 1080 |