- All sections
- H - Electricity
- H01S - Devices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate lightdevices using stimulated emission of electromagnetic radiation in wave ranges other than optical
- H01S 5/02345 - Wire-bonding
Patent holdings for IPC class H01S 5/02345
Total number of patents in this class: 298
10-year publication summary
1
|
1
|
4
|
15
|
40
|
54
|
60
|
51
|
42
|
30
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Nichia Corporation | 3693 |
38 |
Kyocera Sld Laser, Inc. | 298 |
27 |
Ams-osram International GmbH | 969 |
14 |
Rohm Co., Ltd. | 6428 |
12 |
Hisense Laser Display Co., Ltd. | 385 |
11 |
Sony Semiconductor Solutions Corporation | 10390 |
10 |
Lumentum Operations LLC | 729 |
9 |
Mitsubishi Electric Corporation | 45962 |
8 |
OSRAM OLED GmbH | 1779 |
8 |
FUJIFILM Business Innovation Corp. | 7580 |
8 |
Kyocera Corporation | 13784 |
7 |
Hisense Broadband Multimedia Technologies Co., Ltd. | 449 |
5 |
Lumentum Japan, Inc. | 228 |
5 |
Apple Inc. | 54658 |
4 |
Sumitomo Electric Industries, Ltd. | 15428 |
4 |
OSRAM Opto Semiconductors GmbH | 3313 |
4 |
The Furukawa Electric Co., Ltd. | 3645 |
4 |
Excelitas Technologies Corp. | 295 |
4 |
Sumitomo Electric Device Innovations, Inc. | 447 |
4 |
STMicroelectronics Pte Ltd. | 80 |
3 |
Other owners | 109 |