- All sections
- H - Electricity
- H01R - Electrically-conductive connectionsstructural associations of a plurality of mutually-insulated electrical connecting elementscoupling devicescurrent collectors
- H01R 43/24 - Assembling by moulding on contact members
Patent holdings for IPC class H01R 43/24
Total number of patents in this class: 826
10-year publication summary
54
|
65
|
79
|
83
|
64
|
79
|
51
|
47
|
31
|
14
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Foxconn Interconnect Technology Limited | 1103 |
60 |
Sumitomo Wiring Systems, Ltd. | 10405 |
58 |
Yazaki Corporation | 6711 |
54 |
Amphenol Corporation | 758 |
31 |
Sumitomo Electric Industries, Ltd. | 15557 |
28 |
AutoNetworks Technologies, Ltd. | 6623 |
28 |
Dongguan Luxshare Technologies Co., Ltd. | 279 |
25 |
Foxconn (Kunshan) Computer Connector Co., Ltd. | 331 |
22 |
Robert Bosch GmbH | 42742 |
21 |
Hirose Electric Co., Ltd. | 364 |
17 |
Japan Aviation Electronics Industry, Limited | 1722 |
17 |
Apple Inc. | 55287 |
15 |
Molex, LLC | 1953 |
12 |
Phoenix Contact GmbH & Co. KG | 2290 |
9 |
TE Connectivity Solutions GmbH | 2819 |
9 |
TE Connectivity Germany GmbH | 650 |
8 |
Lotes Co., Ltd. | 352 |
7 |
Vicor Corporation | 126 |
7 |
Aptiv Technologies AG | 2366 |
6 |
Hon Hai Precision Industry Co., Ltd. | 4030 |
5 |
Other owners | 387 |