- All sections
- H - Electricity
- H01R - Electrically-conductive connectionsstructural associations of a plurality of mutually-insulated electrical connecting elementscoupling devicescurrent collectors
- H01R 4/2425 - Flat plates, e.g. multi-layered flat plates
Patent holdings for IPC class H01R 4/2425
Total number of patents in this class: 36
10-year publication summary
|
0
|
4
|
5
|
6
|
1
|
4
|
4
|
6
|
7
|
1
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Rockwell Automation Technologies, Inc. | 2811 |
4 |
| Tyco Electronics (shanghai) Co. Ltd. | 1073 |
4 |
| Leviton Manufacturing Co., Inc. | 809 |
3 |
| Omron Corporation | 7402 |
2 |
| Interplex Industries, Inc. | 59 |
2 |
| Japan Aviation Electronics Industry, Limited | 1865 |
2 |
| J.S.T. Corporation | 184 |
2 |
| SP & le Enterprises Pty Ltd | 3 |
2 |
| Koninklijke Philips N.V. | 25978 |
1 |
| Kyocera Corporation | 14433 |
1 |
| Sumitomo Wiring Systems, Ltd. | 11139 |
1 |
| Aesculap AG | 1454 |
1 |
| CommScope Technologies LLC | 3250 |
1 |
| Kinsun Industries Inc. | 5 |
1 |
| Mide Technology Corporation | 29 |
1 |
| TE Connectivity India Private Limited | 84 |
1 |
| TE Connectivity Nederland B.V. | 112 |
1 |
| TE Connectivity Solutions GmbH | 3065 |
1 |
| Weidmueller Interface GmbH & Co. KG | 153 |
1 |
| Young-Hwan Lee | 1 |
1 |
| Other owners | 3 |