- All sections
- H - Electricity
- H01R - Electrically-conductive connectionsstructural associations of a plurality of mutually-insulated electrical connecting elementscoupling devicescurrent collectors
- H01R 24/00 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
Patent holdings for IPC class H01R 24/00
Total number of patents in this class: 1612
10-year publication summary
|
136
|
132
|
99
|
71
|
62
|
59
|
58
|
56
|
56
|
33
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Hon Hai Precision Industry Co., Ltd. | 4024 |
81 |
| Foxconn Interconnect Technology Limited | 1109 |
78 |
| Molex, LLC | 1965 |
43 |
| Japan Aviation Electronics Industry, Limited | 1767 |
39 |
| CommScope, Inc. of North Carolina | 569 |
37 |
| Advanced Connectek Inc. | 343 |
36 |
| TE Connectivity Solutions GmbH | 2871 |
36 |
| Panduit Corp. | 1012 |
35 |
| CommScope Technologies LLC | 3255 |
33 |
| Sumitomo Wiring Systems, Ltd. | 10518 |
31 |
| Lotes Co., Ltd. | 353 |
22 |
| Yazaki Corporation | 6750 |
21 |
| Sumitomo Electric Industries, Ltd. | 15693 |
18 |
| AutoNetworks Technologies, Ltd. | 6706 |
18 |
| CommScope EMEA Limited | 321 |
18 |
| Molex Incorporated | 477 |
17 |
| Apple Inc. | 55916 |
16 |
| Huawei Technologies Co., Ltd. | 114984 |
16 |
| Tyco Electronics Japan G.K. | 160 |
13 |
| Leviton Manufacturing Co., Inc. | 806 |
13 |
| Other owners | 991 |