- All sections
- H - Electricity
- H01R - Electrically-conductive connectionsstructural associations of a plurality of mutually-insulated electrical connecting elementscoupling devicescurrent collectors
- H01R 13/74 - Means for mounting coupling parts to apparatus or structures, e.g. to a wall for mounting coupling parts in openings of a panel
Patent holdings for IPC class H01R 13/74
Total number of patents in this class: 1197
10-year publication summary
|
102
|
79
|
115
|
105
|
104
|
105
|
74
|
63
|
76
|
46
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Yazaki Corporation | 6713 |
109 |
| Sumitomo Wiring Systems, Ltd. | 10394 |
107 |
| Phoenix Contact GmbH & Co. KG | 2291 |
27 |
| TE Connectivity Solutions GmbH | 2818 |
25 |
| Sumitomo Electric Industries, Ltd. | 15535 |
23 |
| AutoNetworks Technologies, Ltd. | 6618 |
23 |
| Tyco Electronics (shanghai) Co. Ltd. | 896 |
18 |
| Japan Aviation Electronics Industry, Limited | 1721 |
16 |
| Apple Inc. | 55229 |
15 |
| HARTING Electric GmbH & Co. KG | 425 |
14 |
| Tyco Electronics Corporation | 750 |
13 |
| Hubbell Incorporated | 3283 |
13 |
| Molex, LLC | 1951 |
13 |
| Titan3 Technology LLC | 199 |
13 |
| Foxconn Interconnect Technology Limited | 1102 |
12 |
| Robert Bosch GmbH | 42721 |
11 |
| CommScope Technologies LLC | 3239 |
9 |
| HARTING Electric Stiftung & Co. KG | 222 |
9 |
| Samsung Electronics Co., Ltd. | 147003 |
8 |
| Microsoft Technology Licensing, LLC | 53805 |
8 |
| Other owners | 711 |