- All sections
- H - Electricity
- H01R - Electrically-conductive connectionsstructural associations of a plurality of mutually-insulated electrical connecting elementscoupling devicescurrent collectors
- H01R 13/504 - BasesCases composed of different pieces different pieces being moulded, cemented, welded, e.g. ultrasonic, or swaged together
Patent holdings for IPC class H01R 13/504
Total number of patents in this class: 672
10-year publication summary
|
33
|
52
|
64
|
87
|
54
|
80
|
57
|
37
|
37
|
8
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Foxconn Interconnect Technology Limited | 1088 |
55 |
| Sumitomo Wiring Systems, Ltd. | 10157 |
40 |
| Yazaki Corporation | 6567 |
28 |
| Molex, LLC | 1926 |
28 |
| Dongguan Luxshare Technologies Co., Ltd. | 270 |
25 |
| Sumitomo Electric Industries, Ltd. | 15202 |
24 |
| AutoNetworks Technologies, Ltd. | 6442 |
24 |
| Apple Inc. | 53955 |
20 |
| Robert Bosch GmbH | 42170 |
17 |
| Foxconn (Kunshan) Computer Connector Co., Ltd. | 318 |
15 |
| TE Connectivity Solutions GmbH | 2743 |
13 |
| Japan Aviation Electronics Industry, Limited | 1683 |
12 |
| Phoenix Contact GmbH & Co. KG | 2256 |
12 |
| Medtronic, Inc. | 9820 |
8 |
| Advanced Connectek Inc. | 338 |
8 |
| Guangdong Oppo Mobile Telecommunications Corp., Ltd. | 20476 |
8 |
| Tyco Electronics (shanghai) Co. Ltd. | 857 |
7 |
| TE Connectivity Germany GmbH | 652 |
6 |
| TE Connectivity Japan G.K. | 238 |
6 |
| Lotes Co., Ltd. | 348 |
5 |
| Other owners | 311 |