- All sections
- H - Electricity
- H01R - Electrically-conductive connectionsstructural associations of a plurality of mutually-insulated electrical connecting elementscoupling devicescurrent collectors
- H01R 12/83 - Coupling devices connected with low or zero insertion force connected with pivoting of printed circuits or like after insertion
Patent holdings for IPC class H01R 12/83
Total number of patents in this class: 38
10-year publication summary
2
|
1
|
5
|
9
|
3
|
2
|
2
|
0
|
1
|
2
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Foxconn Interconnect Technology Limited | 1092 |
4 |
Japan Aviation Electronics Industry, Limited | 1691 |
3 |
Kemitec Inc | 7 |
3 |
Intel Corporation | 46664 |
2 |
Hon Hai Precision Industry Co., Ltd. | 4035 |
2 |
Hosiden Corporation | 382 |
2 |
Samtec, Inc. | 504 |
2 |
TE Connectivity Solutions GmbH | 2757 |
2 |
TE Connectivity Corporation | 435 |
2 |
Panasonic Corporation | 20188 |
1 |
Denso Corporation | 24069 |
1 |
Samsung SDI Co., Ltd. | 7960 |
1 |
Yazaki Corporation | 6603 |
1 |
Lear Corporation | 1265 |
1 |
Boe Technology Group Co., Ltd. | 40474 |
1 |
Aces Electronics Co., Ltd. | 69 |
1 |
Hefei BOE Optoelectronics Technology Co., Ltd. | 1362 |
1 |
ROHDE & Schwarz GmbH & Co. KG | 1916 |
1 |
Rosenberger Hochfrequenztechnik GmbH & Co. KG | 681 |
1 |
Tyco Electronics Holdings (Bermuda) No. 7 Limited | 20 |
1 |
Other owners | 5 |