- All sections
- H - Electricity
- H01R - Electrically-conductive connectionsstructural associations of a plurality of mutually-insulated electrical connecting elementscoupling devicescurrent collectors
- H01R 12/79 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
Patent holdings for IPC class H01R 12/79
Total number of patents in this class: 708
10-year publication summary
53
|
60
|
71
|
90
|
81
|
69
|
60
|
43
|
57
|
24
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Japan Aviation Electronics Industry, Limited | 1688 |
36 |
Samsung Electronics Co., Ltd. | 142415 |
29 |
Kyocera Corporation | 13556 |
27 |
Molex, LLC | 1927 |
27 |
Yazaki Corporation | 6576 |
24 |
TE Connectivity Solutions GmbH | 2743 |
24 |
3m Innovative Properties Company | 17865 |
23 |
Intel Corporation | 46613 |
17 |
Foxconn Interconnect Technology Limited | 1089 |
16 |
Panasonic Intellectual Property Management Co., Ltd. | 30568 |
15 |
Hirose Electric Co., Ltd. | 360 |
15 |
Murata Manufacturing Co., Ltd. | 24144 |
14 |
Apple Inc. | 53995 |
12 |
Foxconn (Kunshan) Computer Connector Co., Ltd. | 318 |
12 |
Dai-Ichi Seiko Co., Ltd. | 266 |
11 |
Iriso Electronics Co., Ltd. | 188 |
11 |
Sumitomo Electric Industries, Ltd. | 15211 |
9 |
Samtec, Inc. | 500 |
9 |
Huawei Technologies Co., Ltd. | 109418 |
7 |
Dell Products L.P. | 13916 |
7 |
Other owners | 363 |