- All sections
- H - Electricity
- H01R - Electrically-conductive connectionsstructural associations of a plurality of mutually-insulated electrical connecting elementscoupling devicescurrent collectors
- H01R 12/75 - Coupling devices for rigid printing circuits or like structures connecting to cables except for flat or ribbon cables
Patent holdings for IPC class H01R 12/75
Total number of patents in this class: 645
10-year publication summary
|
47
|
38
|
34
|
53
|
67
|
49
|
53
|
62
|
57
|
64
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| TE Connectivity Solutions GmbH | 3065 |
36 |
| Molex, LLC | 2077 |
35 |
| Dongguan Luxshare Technologies Co., Ltd. | 379 |
33 |
| Foxconn Interconnect Technology Limited | 1184 |
28 |
| Samtec, Inc. | 563 |
20 |
| Japan Aviation Electronics Industry, Limited | 1865 |
19 |
| Foxconn (Kunshan) Computer Connector Co., Ltd. | 394 |
16 |
| I-pex Inc. | 220 |
14 |
| Tyco Electronics (shanghai) Co. Ltd. | 1073 |
12 |
| Phoenix Contact GmbH & Co. KG | 2293 |
12 |
| Sumitomo Wiring Systems, Ltd. | 11139 |
10 |
| Hirose Electric Co., Ltd. | 394 |
10 |
| Intel Corporation | 47162 |
9 |
| Huawei Technologies Co., Ltd. | 124379 |
9 |
| AutoNetworks Technologies, Ltd. | 7211 |
9 |
| Sumitomo Electric Industries, Ltd. | 16331 |
8 |
| Dai-Ichi Seiko Co., Ltd. | 248 |
8 |
| Hewlett Packard Enterprise Development LP | 11519 |
7 |
| Amphenol Corporation | 782 |
7 |
| Samsung Electronics Co., Ltd. | 158605 |
6 |
| Other owners | 337 |