- All sections
- H - Electricity
- H01R - Electrically-conductive connectionsstructural associations of a plurality of mutually-insulated electrical connecting elementscoupling devicescurrent collectors
- H01R 12/72 - Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
Patent holdings for IPC class H01R 12/72
Total number of patents in this class: 2942
10-year publication summary
|
250
|
307
|
337
|
260
|
231
|
183
|
183
|
177
|
159
|
41
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Foxconn Interconnect Technology Limited | 1137 |
218 |
| TE Connectivity Solutions GmbH | 2929 |
161 |
| Molex, LLC | 2012 |
118 |
| Sumitomo Wiring Systems, Ltd. | 10714 |
96 |
| Amphenol Corporation | 781 |
84 |
| Sumitomo Electric Industries, Ltd. | 16000 |
71 |
| AutoNetworks Technologies, Ltd. | 6883 |
67 |
| Dongguan Luxshare Technologies Co., Ltd. | 319 |
65 |
| Foxconn (Kunshan) Computer Connector Co., Ltd. | 360 |
60 |
| Intel Corporation | 46597 |
54 |
| Advanced Connectek Inc. | 354 |
50 |
| Amphenol Commercial Products (ChengDu) Co. LTD | 94 |
48 |
| FCI USA LLC | 227 |
46 |
| Japan Aviation Electronics Industry, Limited | 1811 |
46 |
| Lotes Co., Ltd. | 360 |
46 |
| Dell Products L.P. | 15976 |
41 |
| Robert Bosch GmbH | 43385 |
40 |
| Samsung Electronics Co., Ltd. | 152304 |
37 |
| Yazaki Corporation | 6904 |
36 |
| Tyco Electronics (shanghai) Co. Ltd. | 999 |
36 |
| Other owners | 1522 |